Calibration method of wire welding machine for semiconductor element production

Abstract

The invention relates to the field of semiconductor elements, and discloses a calibration method of a wire welding machine for semiconductor element production, comprising a positioning mechanism, the top of the positioning mechanism is fixedly connected with a wire welding mechanism, the top of the positioning mechanism is fixedly connected with a protection mechanism, and the bottom of the positioning mechanism is fixedly connected with a lifting mechanism. The bottom of the lifting mechanism is fixedly connected with movable wheels, and the top of the lifting mechanism is fixedly connected with a traction mechanism. According to the calibration method of the wire welding machine for semiconductor element production, through the arranged positioning mechanism, the welding machine can be used more conveniently, the position of the semiconductor element can be adjusted, a worker does not need to manually adjust a welding point of the semiconductor element, and therefore the working content of the worker is reduced, and the working efficiency is improved. The working complexity of workers is reduced, the working time of the workers is shortened, the speed of the wire welding machine is increased, and long-term use of the wire welding machine is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor components, and in particular to a calibration method for a wire bonding machine used in the production of semiconductor components. Background Art

[0002] Semiconductor components are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. In order to weld the circuits on semiconductor components, a wire bonding machine is required.

[0003] However, the wire bonding machines currently available on the market are not very convenient to use and cannot adjust the position of semiconductor components. Workers are required to manually adjust the wire bonding points of semiconductor components, thereby increasing the work content and complexity of the work of the workers, increasing the working hours of the workers, and reducing the wire bonding speed of the wire bonding machine, which is not conducive to the long-term use of the wire bonding machine. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a calibration method for a wire bonding machine for semiconductor component production, which has the function of automatically adjusting the wire bonding points of semiconductor components and solves the problems in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A calibration method for a wire bonding machine for semiconductor component production, comprising a positioning mechanism, the top of the positioning mechanism is fixedly connected to a wire bonding mechanism, the top of the positioning mechanism is fixedly connected to a protective mechanism, the bottom of the positioning mechanism is fixedly connected to a lifting mechanism, the bottom of the lifting mechanism is fixedly connected to a movable wheel, and the top of the lifting mechanism is fixedly connected to a traction mechanism.

[0006] The positioning mechanism comprises:

[0007] A workbench, the top of the workbench is fixedly connected with a derivative plate, one side of the derivative plate is fixedly connected with a telescopic sleeve plate, the top of the telescopic sleeve plate is fixedly connected with an epitaxial plate, the bottom of the epitaxial plate is fixedly connected with a motor, the output shaft of the motor is fixedly connected with a clamping frame through a coupling, the inner side of the clamping frame is fixedly connected with a telescopic short column, the top of the telescopic short column is fixedly connected with a clamping plate, which can make the welding machine more convenient to use and can adjust the position of the semiconductor component. The staff does not need to manually adjust the welding point of the semiconductor component, thereby reducing the work content of the staff, reducing the complexity of the staff's work, reducing the working time of the staff, and improving the speed of the wire welding machine, which is conducive to the long-term use of the wire welding machine.

[0008] Furthermore, a vertical plate is fixedly connected to the top of the workbench, a horizontal plate is fixedly connected to the top of the vertical plate, and the length of the horizontal plate is smaller than the length of the workbench, thereby providing support for the connecting components.

[0009] Furthermore, a lifting top column is fixedly connected to the bottom of the horizontal plate, a welding device is fixedly connected to the bottom end of the lifting top column, and a welding head is fixedly connected to the bottom of the welding device, so that semiconductor components can be quickly welded, thereby improving the overall welding speed of the wire bonding machine, increasing the overall welding efficiency of the wire bonding machine, facilitating the rapid progress of subsequent work, and facilitating the long-term use of the wire bonding machine.

[0010] Furthermore, a liquid storage tank is fixedly connected to the top of the workbench, a liquid extraction pipe is fixedly connected to the top of the liquid storage tank, one end of the liquid extraction pipe is fixedly connected to a liquid extraction device, a water outlet of the liquid extraction device is fixedly connected to a liquid outlet pipe, and one end of the liquid outlet pipe is fixedly connected to a nozzle, which provides fire protection, improves the overall safety of the wire welding machine, reduces the occurrence of safety accidents during work, and is conducive to the long-term use of the wire welding machine.

[0011] Furthermore, a liquid inlet pipe is fixedly connected to the top of the liquid storage tank, and a pipe cover is movably connected to the top of the liquid inlet pipe, so as to facilitate adding fire-fighting liquid into the liquid storage tank.

[0012] Furthermore, a lifting bottom column is fixedly connected to the bottom of the workbench, and a bottom end of the lifting bottom column is fixedly connected to a bottom plate, so that the wire welding machine can reach an appropriate working height, which facilitates the wire welding machine to be suitable for different workers, improves the working environment that the wire welding machine can adapt to, and improves the utilization rate of the wire welding machine.

[0013] Furthermore, the movable wheels are fixedly connected to the bottom of the lifting mechanism, and there are four movable wheels, so that the wire bonding machine can be moved.

[0014] Furthermore, a traction column is fixedly connected to the top of the base plate, and a traction bolt is movably connected to the top of the traction column, thereby improving the moving speed of the wire bonding machine.

[0015] Furthermore, the following steps are included:

[0016] S1. The telescopic short column is extended to fix the semiconductor element, the telescopic sleeve is extended, the motor starts to work, and the output shaft of the motor rotates so that the welding point of the semiconductor element reaches the appropriate position;

[0017] S2, the welding equipment starts to work, the welding head can reach the welding state, the lifting column descends, so that the welding head can weld the semiconductor component;

[0018] S3. Open the pipe cover and inject the liquid used for fire fighting into the liquid storage tank through the liquid inlet pipe;

[0019] S4. If fire protection is required for the welding point, the liquid pumping equipment starts to work. The liquid pumping equipment pumps out the liquid in the liquid storage tank through the liquid pumping pipe, and then sprays the liquid to the welding point through the liquid outlet pipe and the nozzle.

[0020] The present invention provides a calibration method for a wire bonding machine for semiconductor component production, which has the following beneficial effects:

[0021] 1. The calibration method of the wire bonding machine for semiconductor component production is to place the semiconductor component to be welded between two clamping plates through the positioning mechanism, and the telescopic short column starts to work. The telescopic short column is extended so that the clamping plate can fix the semiconductor component. At this time, the telescopic sleeve is extended, and the motor also starts to work. The output shaft of the motor rotates to drive the clamping frame to start rotating, so that the welding point of the semiconductor component can be located at the appropriate welding position. The welding machine can be made more convenient to use, and the position of the semiconductor component can be adjusted. The staff does not need to manually adjust the welding point of the semiconductor component, thereby reducing the work content of the staff, reducing the complexity of the staff's work, reducing the staff's working time, and improving the welding speed of the wire bonding machine, which is conducive to the long-term use of the wire bonding machine.

[0022] 2. The calibration method of the wire bonding machine for semiconductor component production is that through the wire bonding mechanism, when the semiconductor component needs to be bonded, the welding equipment starts to work, and the operation of the welding equipment enables the welding head to bond other components. At this time, the lifting column starts to descend, and the descent of the lifting column enables the welding head to bond the semiconductor component. The semiconductor component can be bonded quickly, which improves the overall bonding speed of the wire bonding machine, increases the overall bonding efficiency of the wire bonding machine, and is conducive to the rapid progress of subsequent work.

[0023] 3. The calibration method of the wire bonding machine for semiconductor component production is to first add water into the liquid storage tank through the liquid inlet pipe through the set protection mechanism. If an accident occurs at the welding point at this time, the lifting top column will rise immediately, and the liquid pumping equipment will start working. The liquid pumping equipment will pump out the water through the liquid pumping pipe, and then spray the water to the accident site of the semiconductor component through the liquid outlet pipe and the nozzle, thereby extinguishing the fire source, improving the overall safety of the wire bonding machine, and reducing the occurrence of safety accidents at work.

[0024] 4. The calibration method of the wire bonding machine for semiconductor component production uses a lifting mechanism. When the overall height of the wire bonding machine needs to be adjusted, the lifting base column begins to rise, so that the wire bonding machine can reach an appropriate working height, making it convenient for the wire bonding machine to be suitable for different workers, improving the working environment that the wire bonding machine can adapt to, and improving the utilization rate of the wire bonding machine.

[0025] 5. The calibration method of the wire bonding machine for semiconductor component production can move the wire bonding machine as a whole through the movable wheels, thereby improving the overall mobility of the wire bonding machine and facilitating the conversion of the wire bonding machine between different work locations.

[0026] 6. The calibration method of the wire bonding machine for semiconductor component production uses a traction mechanism. When the wire bonding machine needs to be moved over a long distance, the traction column is connected to other traction equipment through a traction bolt. At that time, the wire bonding machine can be moved to the working position through the traction equipment, which improves the moving speed of the wire bonding machine and speeds up the progress of subsequent work. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional diagram of the structure of the present invention;

[0028] Figure 2 It is a three-dimensional diagram of the connection structure between the movable wheel and the bottom plate of the present invention;

[0029] Figure 3 It is a front view of the structure of the present invention;

[0030] Figure 4 It is a top view of the structure of the present invention;

[0031] Figure 5 It is a diagram showing the structure of the present invention;

[0032] Figure 6 It is a diagram showing the structural mechanism of the present invention.

[0033] In the figure: 1. positioning mechanism; 101. workbench; 102. derivative plate; 103. telescopic sleeve plate; 104. epitaxial plate; 105. motor; 106. clamping frame; 107. telescopic short column; 108. clamping plate; 2. welding wire mechanism; 201. vertical plate; 202. horizontal plate; 203. lifting top column; 204. welding equipment; 205. welding head; 3. protection mechanism; 301. liquid storage tank; 302. liquid extraction pipe; 303. liquid extraction equipment; 304. liquid outlet pipe; 305. nozzle; 306. liquid inlet pipe; 307. pipe cover; 4. lifting mechanism; 401. lifting bottom column; 402. bottom plate; 5. movable wheel; 6. traction mechanism; 601. traction column; 602. traction bolt. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Embodiment 1, the preferred embodiment of the calibration method of the wire bonding machine for semiconductor device production provided by the present invention is as follows: Figures 1 to 6 As shown: A calibration method for a wire bonding machine for semiconductor component production includes a positioning mechanism 1, a wire bonding mechanism 2 is fixedly connected to the top of the positioning mechanism 1, a protection mechanism 3 is fixedly connected to the top of the positioning mechanism 1, a lifting mechanism 4 is fixedly connected to the bottom of the positioning mechanism 1, a movable wheel 5 is fixedly connected to the bottom of the lifting mechanism 4, and a traction mechanism 6 is fixedly connected to the top of the lifting mechanism 4.

[0036] The positioning mechanism 1 comprises:

[0037] A workbench 101, the top of the workbench 101 is fixedly connected with a derivative plate 102, one side of the derivative plate 102 is fixedly connected with a telescopic sleeve plate 103, the top of the telescopic sleeve plate 103 is fixedly connected with an epitaxial plate 104, the bottom of the epitaxial plate 104 is fixedly connected with a motor 105, the output shaft of the motor 105 is fixedly connected with a clamping frame 106 through a coupling, the inner side of the clamping frame 106 is fixedly connected with a telescopic short column 107, and the top of the telescopic short column 107 is fixedly connected with a clamping plate 108, which can make the welding machine more convenient to use and can adjust the position of the semiconductor component. The staff does not need to manually adjust the welding point of the semiconductor component, thereby reducing the work content of the staff, reducing the complexity of the staff's work, reducing the working time of the staff, and improving the speed of the wire welding machine, which is conducive to the long-term use of the wire welding machine.

[0038] Furthermore, a vertical plate 201 is fixedly connected to the top of the workbench 101, and a horizontal plate 202 is fixedly connected to the top of the vertical plate 201. The length of the horizontal plate 202 is smaller than the length of the workbench 101, thereby providing support for the connecting components.

[0039] Furthermore, the bottom of the horizontal plate 202 is fixedly connected to a lifting top column 203, the bottom end of the lifting top column 203 is fixedly connected to a welding device 204, and the bottom of the welding device 204 is fixedly connected to a welding head 205, which can quickly perform wire bonding on semiconductor components, thereby improving the overall wire bonding speed of the wire bonding machine, increasing the overall wire bonding efficiency of the wire bonding machine, facilitating the rapid progress of subsequent work, and facilitating the long-term use of the wire bonding machine.

[0040] Furthermore, a liquid storage tank 301 is fixedly connected to the top of the workbench 101, a liquid extraction pipe 302 is fixedly connected to the top of the liquid storage tank 301, one end of the liquid extraction pipe 302 is fixedly connected to a liquid extraction device 303, a water outlet of the liquid extraction device 303 is fixedly connected to a liquid outlet pipe 304, one end of the liquid outlet pipe 304 is fixedly connected to a nozzle 305, which provides fire protection, improves the overall safety of the wire welding machine, reduces the occurrence of safety accidents during work, and is conducive to the long-term use of the wire welding machine.

[0041] Furthermore, a liquid inlet pipe 306 is fixedly connected to the top of the liquid storage tank 301 , and a pipe cover 307 is movably connected to the top of the liquid inlet pipe 306 , so as to facilitate adding fire-fighting liquid into the liquid storage tank 301 .

[0042] Furthermore, a lifting base column 401 is fixedly connected to the bottom of the workbench 101, and a bottom plate 402 is fixedly connected to the bottom end of the lifting base column 401, so that the wire bonding machine can reach an appropriate working height, which facilitates the wire bonding machine to be suitable for different workers, improves the working environment that the wire bonding machine can adapt to, and improves the utilization rate of the wire bonding machine.

[0043] Furthermore, the movable wheel 5 is fixedly connected to the bottom of the lifting mechanism 4, and there are four movable wheels 5, so that the wire bonding machine can be moved.

[0044] Furthermore, a traction column 601 is fixedly connected to the top of the bottom plate 402, and a traction bolt 602 is movably connected to the top of the traction column 601, thereby improving the moving speed of the wire bonding machine.

[0045] Furthermore, the following steps are included:

[0046] S1, the telescopic short column 107 is extended to fix the semiconductor element, the telescopic sleeve 103 is extended, the motor 105 starts to work, and the output shaft of the motor 105 rotates so that the welding point of the semiconductor element reaches the appropriate position;

[0047] S2, the welding device 204 starts to work, and the welding head 205 can reach the welding state by the operation of the welding device 204, and the lifting column 203 descends, so that the welding head 205 can weld the semiconductor element;

[0048] S3, open the pipe cover 307, and inject the liquid used for fire fighting into the liquid storage tank 301 through the liquid inlet pipe 306;

[0049] S4. If fire protection is required for the welding point, the liquid pumping device 303 starts to work. The liquid pumping device 303 pumps out the liquid in the liquid storage tank 301 through the liquid pumping pipe 302, and then sprays the liquid to the welding point through the liquid outlet pipe 304 and the nozzle 305.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for calibrating a wire bonding machine for semiconductor device production, comprising a positioning mechanism (1), characterized in that: The top of the positioning mechanism (1) is fixedly connected to a welding wire mechanism (2), the top of the positioning mechanism (1) is fixedly connected to a protection mechanism (3), the bottom of the positioning mechanism (1) is fixedly connected to a lifting mechanism (4), the bottom of the lifting mechanism (4) is fixedly connected to a movable wheel (5), and the top of the lifting mechanism (4) is fixedly connected to a traction mechanism (6); The positioning mechanism (1) comprises: A workbench (101), wherein a derivative plate (102) is fixedly connected to the top of the workbench (101), a telescopic sleeve plate (103) is fixedly connected to one side of the derivative plate (102), the top of the telescopic sleeve plate (103) is fixedly connected to an extension plate (104), the bottom of the extension plate (104) is fixedly connected to a motor (105), the output shaft of the motor (105) is fixedly connected to a clamping frame (106) via a coupling, a telescopic short column (107) is fixedly connected to the inner side of the clamping frame (106), and the top of the telescopic short column (107) is fixedly connected to a clamping plate (108).

2. A wire bonding machine for semiconductor device production according to claim 1, characterized in that: The top of the workbench (101) is fixedly connected to a vertical plate (201), the top of the vertical plate (201) is fixedly connected to a horizontal plate (202), and the length of the horizontal plate (202) is smaller than the length of the workbench (101).

3. A wire bonding machine for semiconductor device production according to claim 2, characterized in that: The bottom of the transverse plate (202) is fixedly connected to a lifting top column (203), the bottom end of the lifting top column (203) is fixedly connected to a welding device (204), and the bottom of the welding device (204) is fixedly connected to a welding head (205).

4. A wire bonding machine for semiconductor device production according to claim 1, characterized in that: The top of the workbench (101) is fixedly connected to a liquid storage tank (301), the top of the liquid storage tank (301) is fixedly connected to a liquid extraction pipe (302), one end of the liquid extraction pipe (302) is fixedly connected to a liquid extraction device (303), the water outlet of the liquid extraction device (303) is fixedly connected to a liquid outlet pipe (304), and one end of the liquid outlet pipe (304) is fixedly connected to a nozzle (305).

5. A wire bonding machine for semiconductor device production according to claim 4, characterized in that: The top of the liquid storage box (301) is fixedly connected to a liquid inlet pipe (306), and the top of the liquid inlet pipe (306) is movably connected to a pipe cover (307).

6. A wire bonding machine for semiconductor device production according to claim 1, characterized in that: The bottom of the workbench (101) is fixedly connected to a lifting bottom column (401), and the bottom end of the lifting bottom column (401) is fixedly connected to a bottom plate (402).

7. A wire bonding machine for semiconductor device production according to claim 6, characterized in that: The movable wheels (5) are fixedly connected to the bottom of the lifting mechanism (4), and the number of the movable wheels (5) is four.

8. A wire bonding machine for semiconductor device production according to claim 6, characterized in that: A traction column (601) is fixedly connected to the top of the bottom plate (402), and a traction bolt (602) is movably connected to the top of the traction column (601).

9. A method for calibrating a wire bonding machine for semiconductor device production, characterized in that: The following steps are involved: S1, the telescopic short column (107) is extended to fix the semiconductor element, the telescopic sleeve (103) is extended, the motor (105) starts to work, and the output shaft of the motor (105) rotates so that the welding point of the semiconductor element reaches an appropriate position; S2, the welding device (204) starts to work, and the operation of the welding device (204) enables the welding head (205) to reach a welding state, and the lifting top column (203) descends, so that the welding head (205) can weld the semiconductor element; S3, open the pipe cover (307), and inject the liquid used for fire fighting into the liquid storage tank (301) through the liquid inlet pipe (306); S4. If fire protection is required for the welding point, the liquid pumping device (303) starts to work. The liquid pumping device (303) pumps out the liquid in the liquid storage tank (301) through the liquid pumping pipe (302), and then sprays the liquid to the welding point through the liquid outlet pipe (304) and the nozzle (305).

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