High-precision chemical chip batch production equipment based on SPR and MIT technologies

By designing high-precision chemical chip mass production equipment based on SPR and MIT technology, automated mass production of chips is realized, solving the problem of difficult industrialization of chip mass production in the existing technology, and ensuring production quality.

CN119263204APending Publication Date: 2025-01-07QINGDAO ASCENT TECHNOLOGY DEVELOPMENT CO LTD
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Patent Information

Application Number
CN202411378648.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

The prior art fails to provide mass production equipment for chemical sensing chips, making it difficult to industrialize chip mass production.

Method used

A high-precision chemical chip mass production equipment based on SPR and MIT technology was designed, including optical production platform, vertical loading module, horizontal feeding module, production positioning mechanism, optical production detection and adjustment module, and ultraviolet feed module and controllers, realize mass production of chips through automated processes.

Benefits of technology

实现了芯片的自动化批量生产,确保了生产质量,解决了芯片批量生产难以产业化的问题。

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of chip production equipment, in particular to high-precision chemical chip batch production equipment based on SPR (Surface Plasmon Resonance) and MIT (Matrix Inhibitory Technology) technologies, which comprises an optical production platform, and a conveying mechanism which consists of a vertical feeding module and a horizontal feeding module and is used for conveying a chip base material is arranged on the optical production platform; the conveying mechanism is used for conveying a chip substrate, the production positioning mechanism is used for receiving the chip substrate conveyed by the conveying mechanism, the material receiving assembly is used for receiving the prepared chip, an optical production detection adjusting module and an ultraviolet feeding module are arranged on the two sides of the production positioning mechanism respectively, and the device further comprises a controller; the automatic batch production of the chips is realized, and the production quality is ensured while the problem that the batch production of the chips is difficult to industrialize is solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of chip production equipment, in particular to high-precision chemical chip batch production equipment based on SPR and MIT technologies. Background Art

[0002] Surface Plasmon Resonance (SPR) is a physical optical phenomenon. Its principle is that when light is irradiated from a dense medium to a sparse medium, when the incident angle is greater than a certain angle, total reflection will occur at the interface. If there is a metal film of a certain thickness between the two media interfaces, the evanescent wave generated during total reflection will interact with the free electrons in the metal film, stimulating a surface plasma wave (SPW) propagating along the surface of the metal film. When the wave vector component of the incident light along the interface direction is the same as the wave vector of the SPW, the surface plasmon resonance phenomenon can be stimulated; the energy of the incident light is absorbed by the SPW, causing the energy of the reflected electromagnetic wave to drop sharply, and an obvious absorption peak can be observed in the reflection spectrum. At this time, the angle of the incident light is called the resonance angle (SPR angle).

[0003] When a beam of P polarized light is incident on the end face of a prism within a certain angle range, a surface plasmon wave will be generated at the interface between the prism and the metal film (Au or Ag). When the propagation constant of the incident light wave matches the propagation constant of the surface plasmon wave, it causes the free electrons in the metal film to resonate, which is called surface plasmon resonance. During analysis, a layer of biomolecule recognition film is first fixed on the surface of the sensor chip, and then the sample to be tested flows over the surface of the chip. If there are molecules in the sample that can interact with the biomolecule recognition film on the surface of the chip, it will cause the refractive index of the gold film surface to change, and ultimately lead to a change in the SPR angle. By detecting the change in the SPR angle, information such as the concentration, affinity, kinetic constants and specificity of the analyte can be obtained.

[0004] Biomolecular interaction analysis is a new type of biosensor analysis technology based on the SPR principle. It does not require labeling or purification of various biological components. Under natural conditions, the sensor chip can measure the interaction between various biomolecules such as peptides, proteins, oligonucleotides, oligosaccharides, as well as viruses, bacteria, cells, and small molecules in real time, in situ, and dynamically. Surface plasmon resonance is one of the important enhancement mechanisms of surface enhanced Raman. Due to the size effect and quantum effect of noble metal nanoparticles, surface plasmon resonance can be caused by excitation light irradiation, thereby greatly enhancing the Raman scattering signal, which has achieved the purpose of trace detection.

[0005] Molecular Imprinting Technology (MIT) is a process of simulating the molecular recognition effects existing in nature, such as enzymes and substrates, antibodies and antigens, to prepare polymers with specific selectivity for a specific target molecule, namely molecularly imprinted polymers (MIPs). It is achieved by the following method: using a specific target molecule as a template, combining a functional monomer with structural complementarity with the template molecule through covalent bonds or non-covalent bonds, and using a cross-linking agent in a certain solution to polymerize the functional monomer, thereby forming a highly cross-linked high molecular polymer with a certain rigidity around the template molecule. After the reaction is completed, the template molecule is removed from the polymer, and a structure that completely matches the template molecule in terms of spatial position and binding site is formed inside the polymer. The pores left after the removal of the imprinted molecule have very good complementarity with the imprinted molecule in terms of spatial structure, size, charge, etc., so this polymer has the function of specifically recognizing the imprinted molecule. This technology is a method developed in recent years to synthesize polymers that are selective for a specific molecule (imprinted molecule). It has become an effective means of storing molecular information in high molecular polymers, which can enable polymers to identify specific substances at the molecular level (level). Molecularly imprinted polymer membranes are the best choice for the development of key sensor components. Molecularly imprinted polymer membranes have the characteristics of simple operation, low energy consumption, short reaction time, clean and pollution-free, high recognition performance, and good stability. Compared with biological membranes, they have the advantages of being resistant to harsh environments, high stability, and easy to handle and apply.

[0006] CN104360019A discloses a method for detecting sulfur dioxide by combining MIT and SPR technology, which belongs to the field of sulfur dioxide detection. A layer of metal film is plated on a substrate by vacuum evaporation method and then self-assembled; the self-assembled substrate is covered on the reaction pool of the SPR detection system, filled with reaction solution, polymerization is initiated, and a molecular imprinting film is formed on the metal film of the substrate; an eluent is introduced, and a SO2 molecular imprinting sensor chip is obtained after elution treatment; N2 is introduced, and resonance angle 1 is measured; SO2 is introduced, and resonance angle 2 is measured; according to the size of resonance angle 1 and resonance angle 2, it is judged whether the molecular imprinting sensor chip responds to SO2. The above method is simple to operate, can directly determine the sulfur dioxide content in the sample, and has high sensitivity, low detection cost, low energy consumption, short reaction time, clean and pollution-free, and easy to promote. However, the prior art reports a method for preparing a sensor chip by combining MIT and SPR technology, and does not provide a production equipment for preparing a chemical sensor chip, especially a production equipment for realizing mass production of chemical sensor chips to carry out industrialization, which is still a difficult technical problem to solve in the industry. Summary of the invention

[0007] In view of the shortcomings of the above-mentioned existing technologies, a high-precision chemical chip batch production equipment based on SPR and MIT technology is provided, which realizes the automated batch production of chips, solves the problem that chip batch production is difficult to industrialize, and ensures production quality.

[0008] In order to solve the above technical problems, the technical solution adopted by the present invention is: a high-precision chemical chip batch production equipment based on SPR and MIT technology, including an optical production platform, on which a conveying mechanism composed of a vertical loading module and a horizontal feeding module for conveying chip substrates is provided, a production positioning mechanism for receiving the chip substrates conveyed by the conveying mechanism, and a receiving assembly for receiving the prepared chips are provided, optical production detection and adjustment modules and ultraviolet feeding modules are respectively provided on both sides of the production positioning mechanism, and a controller is also included;

[0009] A carrier plate is provided on the vertical loading module, a plurality of guide station slots are horizontally provided on the carrier plate, a conveying plate slidably connected to the guide station slot is provided in each guide station slot, and a plurality of material clamps for clamping chip substrates are provided on the conveying plate;

[0010] The production positioning mechanism is composed of an upper plate body, a lower plate body and a fixing plate for connecting the two. The upper plate body and the lower plate body are provided with linear grooves on the opposite surfaces, and a receiving groove for receiving the conveying plate is formed between the two linear grooves.

[0011] The optical production detection and adjustment module includes an optical system for generating incident light that meets the requirements of surface plasmon resonance, a detector for real-time monitoring of changes in the thickness of the polymer film on the chip substrate and monitoring the synthesis process of the chip, and a control mechanism for continuously adjusting the relative positions of the optical system and the detector and the chip substrate so that the light beam is incident on the center of the chip substrate base;

[0012] The ultraviolet feeding module includes a plurality of reaction cells with liquid outlets and liquid inlets respectively disposed on the upper and lower surfaces, and a feeding mechanism for driving the reaction cells to be butted and sealed with the conveying plate, an ultraviolet light source is disposed on the feeding mechanism, and also includes a microfluidic pipeline system for pressing the sample prepolymer liquid and the solvent into the reaction cells;

[0013] The conveying plate is transported to the containing tank by the vertical loading module and the horizontal feeding module. After being processed by the optical production detection and adjustment module and the ultraviolet feeding module, the horizontal feeding module continues to push the conveying plate to the receiving assembly.

[0014] The above-mentioned high-precision chemical chip batch production equipment based on SPR and MIT technology, the vertical loading module includes a first bracket, a first drive motor and a first bearing are respectively provided at the top and bottom of the first bracket, a first screw rod for connecting the first drive motor and the first bearing is provided between the first drive motor and the first bearing, a first slide rail is provided along the height direction of the first bracket, a first slider is provided on the first slide rail, a first drive block with a first screw hole for cooperating with the first screw rod is provided on the first slider, a first drive plate is provided on the surface of the first slider, the bearing plate is provided on the first drive plate, and the first drive motor is connected to the controller signal.

[0015] The above-mentioned high-precision chemical chip mass production equipment based on SPR and MIT technology, the horizontal feeding mechanism includes two correspondingly arranged second brackets, and a connecting plate arranged on the top of the two second brackets for connecting the two, a second drive motor and a second bearing are respectively provided at both ends of the connecting plate, a second screw rod for connecting the two is provided between the second drive motor and the second bearing, a second slide rail is provided along the length direction of the connecting plate, a second slider is provided on the second slide rail, a second screw hole for cooperating with the second screw rod is provided on the second slider, a push block for pushing the conveying plate is provided on the second slider, a reciprocating electric cylinder is provided on the fixed plate, a blocking rod for blocking the conveying plate is provided on the reciprocating electric cylinder, and the second drive motor and the reciprocating electric cylinder are both connected to the controller signal.

[0016] The above-mentioned high-precision chemical chip mass production equipment based on SPR and MIT technology, the optical system includes an infrared laser generator, a polarization crystal, and a chopper.

[0017] The high-precision chemical chip batch production equipment based on SPR and MIT technology, the control mechanism includes a positioning plate arranged on the optical production platform, and a plurality of first screw stepper motors arranged on the positioning plate, a second drive plate is arranged on the first screw stepper motor, an optical axis for connecting the positioning plate with the connecting plate is arranged on one side of the second drive plate, a bearing seat for mounting the optical axis linear bearing connected to the second drive plate is arranged on the optical axis, a plurality of semicircular plate bodies are arranged on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide rail are arranged on the plate body, and a rotation axis running along the annular slide rail is arranged on the annular slide rail An upper slide and a lower slide, a detector mounting seat for mounting a detector and a photoelectric switch detection plate are provided on the upper slide, an infrared laser generator mounting seat for mounting an infrared laser generator and a polarization crystal mounting seat for mounting a polarization crystal are provided on the lower slide, a first driving rod with two ends rotatably connected to the upper slide and the second driving plate respectively is provided between the upper slide and the second driving plate, a second driving rod with two ends rotatably connected to the lower slide and the second driving plate respectively is provided between the lower slide and the second driving plate, a passage groove for allowing the second slider to pass is opened on the plate body, and the first screw stepper motor is connected to the controller signal.

[0018] The high-precision chemical chip mass production equipment based on SPR and MIT technology, wherein the detector includes a silicon photocell and an operational amplifier.

[0019] The above-mentioned high-precision chemical chip mass production equipment based on SPR and MIT technology, the feeding mechanism includes a support plate arranged on the optical production platform, a guide shaft for connecting the support plate and the production positioning mechanism is provided between the two, and a bracket for fixing the ultraviolet light source running along the guide shaft, a reaction pool carrying plate connected to the ultraviolet light source for carrying the reaction pool is provided in front of the bracket, a second screw stepper motor for driving the bracket to run along the guide shaft is provided on the support plate, a pressure sensor is provided on the second screw stepper motor, and the second screw stepper motor and the pressure sensor are both connected to the controller signal.

[0020] The above-mentioned high-precision chemical chip batch production equipment based on SPR and MIT technology, the microfluidic pipeline system includes a peristaltic pump, a delivery pipeline arranged on the peristaltic pump, and a pinch valve and a stop valve for controlling the liquid in the reaction pool are arranged on the delivery pipeline.

[0021] In the above-mentioned high-precision chemical chip mass production equipment based on SPR and MIT technology, the substrate is a JGS2 quartz glass lens, and the distance between the ultraviolet light source and the JGS2 quartz glass lens does not exceed 1 cm.

[0022] The above-mentioned high-precision chemical chip mass production equipment based on SPR and MIT technology is provided with a positioning groove for accommodating a material clamp on the conveying plate, and the material clamp includes a chip substrate carrier plate corresponding to the positioning groove, and a carrier groove adapted to the chip substrate is opened on the chip substrate carrier plate, and a fixed clamp and a telescopic clamp are respectively provided on both sides of the carrier groove, and the telescopic clamp includes a fixed base and a sliding clamp arranged on the fixed base, a compression spring for driving the sliding clamp is provided in the fixed base, a guide positioning pin is provided between the sliding clamp and the fixed base, and connecting screws for connecting the chip substrate carrier plate with the conveying plate are provided on both sides of the chip substrate carrier plate.

[0023] The beneficial effect of the high-precision chemical chip mass production equipment based on SPR and MIT technology of the present invention is that the sensor chip assembly is composed of an optical prism and a metal film, a self-assembled film and a molecular imprinting polymer film plated thereon arranged in sequence from bottom to top. The equipment uses ultraviolet polymerization to generate a molecular imprinting polymer film based on the native sensor chip film. Through the vertical loading module and the horizontal feeding module arranged on the optical production platform, multiple conveying plates are transported one by one to the production positioning mechanism. Since each conveying plate is provided with multiple material clamps for clamping the chip substrate, the automated mass production of the chip is realized, solving the technical problem that the mass production of the chip is difficult to industrialize.

[0024] By setting up a control mechanism, the first screw stepper motor mechanically rotates around the center point of the chip coating surface. During the angle scanning process, the first screw stepper motor is coordinated and controlled by a computer program to control the angle displacement, continuously adjust the relative position of the incident light and the silicon photocell detector and the chip substrate, and use the displacement angle measurement and feedback control system to allow the light beam to be incident on the center of the base of the chip substrate, thereby achieving accurate positioning to ensure production quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 It is a structural schematic diagram of arranging optical production detection modules and ultraviolet feeding modules on both sides of the production positioning mechanism;

[0027] Figure 3 is a structural schematic diagram of a load-bearing plate;

[0028] Figure 4 It is a structural schematic diagram of the annular slide rail;

[0029] Figure 5 for Figure 1 A partial enlarged view of part A;

[0030] Figure 6 for Figure 1A partial enlarged view of part B;

[0031] Figure 7 is a structural schematic diagram of a first bracket;

[0032] Figure 8 It is a structural schematic diagram of the push block;

[0033] Fig. 9 It is a structural schematic diagram of a reaction pool support plate;

[0034] Fig.10 Schematic diagram of the structure of the upper plate;

[0035] Fig.11 It is a structural schematic diagram of the lower plate;

[0036] Fig.12 It is a structural schematic diagram of a reciprocating electric cylinder arranged on a fixed plate;

[0037] Fig.13 It is a structural schematic diagram of the conveying plate;

[0038] Fig.14 It is a schematic diagram of the structure of the material clamp. DETAILED DESCRIPTION

[0039] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] like Figure 1-14 As shown, the high-precision chemical chip batch production equipment based on SPR and MIT technology includes an optical production platform 1, on which is provided a conveying mechanism composed of a vertical loading module and a horizontal feeding module for conveying chip substrates, a production positioning mechanism for receiving the chip substrates conveyed by the conveying mechanism, and a receiving component for receiving the prepared chips, optical production detection and adjustment modules and ultraviolet feeding modules are respectively provided on both sides of the production positioning mechanism, and also includes a controller; the controller is a PLC.

[0041] A carrier plate 2 is provided on the vertical loading module, a plurality of guide station grooves are horizontally provided on the carrier plate 2, a conveying plate 3 slidably connected to the guide station groove is provided in each guide station groove, and a plurality of material clamps for clamping chip substrates are provided on the conveying plate 3;

[0042] The production positioning mechanism is composed of an upper plate body 4, a lower plate body 28 and a fixing plate 29 for connecting the two. The upper plate body and the lower plate body are provided with linear grooves 30 on the opposite surfaces, and a receiving groove for receiving the conveying plate 3 is formed between the two linear grooves 30;

[0043] The optical production detection and adjustment module includes an optical system for generating incident light that meets the requirements of surface plasma resonance, a detector for real-time monitoring of changes in the thickness of the polymer film on the chip substrate and monitoring the synthesis process of the chip, and a control mechanism for continuously adjusting the relative positions of the optical system and the detector and the chip substrate to make the light beam incident on the center of the chip substrate base; the detector includes a silicon photocell and an operational amplifier. Filtering, amplification, and transmission. The optical system includes an infrared laser generator, a polarization crystal 27, and a chopper. The chopper is an electronic chopper.

[0044] The ultraviolet feeding module includes a plurality of reaction cells 5 with liquid outlets and liquid inlets respectively disposed on the upper and lower surfaces, and a feeding mechanism for driving the reaction cells to be sealed with a conveying plate, on which an ultraviolet light source 15 is disposed, and also includes a microfluidic piping system for pressing the sample prepolymer liquid and the solvent into the reaction cells; the microfluidic piping system includes a peristaltic pump 26, and a conveying pipe disposed on the peristaltic pump 26, on which a clamping valve 31 and a stop valve for closing the liquid in the circulation cell are disposed.

[0045] The conveying plate 3 is conveyed to the containing tank by the vertical loading module and the horizontal feeding module. After being processed by the optical production detection and adjustment module and the ultraviolet feeding module, the horizontal feeding module continues to push the conveying plate to the receiving assembly.

[0046] The vertical loading module includes a first bracket 6, a first drive motor 7 and a first bearing are respectively provided at the top and bottom of the first bracket 6, a first screw rod 8 for connecting the first drive motor 7 and the first bearing is provided between the first drive motor 7 and the first bearing, a first slide rail 9 is provided along the height direction of the first bracket 6, a first slider 10 is provided on the first slide rail 9, a first drive block with a first screw hole for cooperating with the first screw rod 8 is provided on the first slider 10, a first drive plate 11 is provided on the surface of the first slider, the supporting plate 2 is provided on the first drive plate 11, and the first drive motor 7 is connected to the controller signal.

[0047] The horizontal feeding mechanism includes two correspondingly arranged second brackets 12, and a connecting plate 13 arranged on the top of the two second brackets 12 for connecting the two, a second driving motor 14 and a second bearing are respectively arranged at both ends of the connecting plate 13, a second screw rod 8 for connecting the two is arranged between the second driving motor 14 and the second bearing, a second slide rail is arranged along the length direction of the connecting plate 13, a second slider is arranged on the second slide rail, a second screw hole for cooperating with the second screw rod is arranged on the second slider, a push block 18 for pushing the conveying plate is arranged on the second slider, a reciprocating electric cylinder 20 is arranged on the fixed plate, and a blocking rod 21 for blocking the material clamp is arranged on the reciprocating electric cylinder 20, so as to facilitate the rapid positioning of the conveying plate. The second driving motor 14 and the reciprocating electric cylinder 20 are both connected to the controller signal.

[0048] The control mechanism includes a positioning plate 16 arranged on the optical production platform 1, and a plurality of first screw stepper motors 17 arranged on the positioning plate 16, a second drive plate 32 is arranged on the first screw stepper motor 17, an optical axis 19 for connecting the positioning plate with the connecting plate 13 is arranged on one side of the second drive plate 32, a bearing seat for mounting the optical axis linear bearing connected to the second drive plate 32 is arranged on the optical axis 19, a plurality of semicircular plate bodies 33 are arranged on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide rail 43 are arranged on the plate body 33, an upper slide seat 34 and a lower slide seat 35 running along the annular slide rail 43 are arranged on the annular slide rail 43, and an upper slide seat 34 and a lower slide seat 35 running along the annular slide rail 43 are arranged on the upper slide seat 3 4 is provided with a detector mounting seat 36 for mounting a detector, and a photoelectric switch detection plate 38, an infrared laser generator mounting seat 37 for mounting an infrared laser generator, and a polarization crystal mounting seat for mounting a polarization crystal 27 are provided on the lower slide seat 35, a first driving rod 39 is provided between the upper slide seat 34 and the second driving plate 32, and two ends are respectively connected to the upper slide seat 34 and the second driving plate 32 for rotation, a second driving rod 40 is provided between the lower slide seat 35 and the second driving plate 32, and two ends are respectively connected to the lower slide seat 35 and the second driving plate 32 for rotation, a passage groove for allowing the second slider to pass is opened on the plate body 33, and the first screw stepping motor is connected to the controller signal.

[0049] The function of the detector is to detect the intensity of the reflected light and quantify the signal, and transmit it to the computer for further processing. The detected information is converted into the refractive index change of the sensitive film on the surface of the detected chip, and converted into the change of the resonance angle or resonance wavelength through optical coupling, and the position of the resonance absorption peak or resonance angle is recorded.

[0050] The specific operation steps of the detector are: placing the silicon photocell on the reflected light path, directly receiving the light signal, using AD to convert the analog signal into a digital signal, transmitting the digital signal to the software system, and according to the change trend of the signal, cooperating with the displacement angle measurement sensor, constantly adjusting the relative position of the incident light and the silicon photocell detector and the chip substrate, determining the change of the angle adjustment, making the light beam incident on the center of the base of the chip substrate, and then starting the ultraviolet light source and the peristaltic pump. Specifically, as the first screw stepper motor is driven, the digital signal changes. When it reaches a suitable value, the first screw stepper motor stops driving, locks the angle, starts the peristaltic pump and the ultraviolet light source for chemical reaction, and triggers the chip additive preparation; as the additive proceeds, the digital signal changes. When it reaches a predetermined value, the controller controls the peristaltic pump and the ultraviolet light source to stop. That is, data output and photoelectric signal conversion are performed, and the detection results are displayed in real time using the software. By observing the SPR curve of the sensor chip, the change of the thickness of the polymer film of the sensor chip is monitored in real time, that is, the synthesis process of the sensor chip is monitored.

[0051] The feeding mechanism includes a support plate 22 arranged on the optical production platform 1, a guide shaft 23 for connecting the support plate 22 and the production positioning mechanism is provided between the two, and a bracket 24 for fixing the ultraviolet light source running along the guide shaft, a reaction pool carrying plate 41 for carrying the reaction pool 5 connected to the ultraviolet light source 15 is provided in front of the bracket 24, a second screw stepper motor 25 for driving the bracket to run along the guide shaft is provided on the support plate 22, a pressure sensor 42 is provided on the second screw stepper motor, and the second screw stepper motor 25 and the pressure sensor 42 are both connected to the controller signal.

[0052] A positioning groove 51 for accommodating a material clamp is provided on the conveying plate 3, and the material clamp includes a chip substrate carrier plate 44 corresponding to the positioning groove, and a carrier groove adapted to the chip substrate is opened on the chip substrate carrier plate 44, and a fixed clamp plate 45 and a telescopic clamp plate are respectively provided on both sides of the carrier groove, and the telescopic clamp plate includes a fixed base 46 and a sliding clamp 47 provided on the fixed base 46, a compression spring for driving the sliding clamp 47 is provided in the fixed base 46, a guide positioning pin 49 is provided between the sliding clamp 47 and the fixed base 46, and connecting screws 50 for connecting the chip substrate carrier plate 44 with the conveying plate 3 are provided on both sides of the chip substrate carrier plate 44.

[0053] The working process of the high-precision chemical chip batch production equipment based on SPR and MIT technology of the present invention is as follows: the operator fixes multiple chip substrates to be assembled through the material clamps on the conveying plate, the vertical loading module drives the carrier plate to move vertically to the specified position, so that the conveying plate 3 on the carrier plate is aligned with the receiving slot, the horizontal feeding module pushes the conveying plate 3 into the receiving slot, so that each chip substrate on the conveying plate 3 is located in front of the reaction pool, with the side coated with the gold film facing the reaction pool, the reaction pool is horizontally fed through the ultraviolet feeding module, and is pressed by the clamping studs, and is sealed with the side of the chip substrate coated with the gold film to form a circulation pool. Since the conveying plate 3 is provided with a light-transmitting hole 48, the ultraviolet light is irradiated onto the metal film of the chip substrate through the glass substrate behind the reaction pool assembly, thus forming a complete production sensing system. In order to carry out UV polymerization, we use JGS2 quartz glass lens that can transmit ultraviolet light as the glass substrate at the bottom of the circulation cell. There are liquid outlets and liquid inlets on the upper and lower parts of the reaction cell respectively. During the production and preparation process, the peristaltic pump presses the sample prepolymer liquid and solvent into the circulation cell for membrane synthesis and real-time detection of SPR; a UV-LED point light source is installed on the back of the JGS2 quartz glass lens, and the distance between the ultraviolet light source and the GS2 quartz glass lens is about 1 cm; a pinch valve and a stop valve are installed on the delivery pipeline of the peristaltic pump to control the liquid in the circulation cell.

[0054] The infrared laser generator is used as a light source to generate incident light that meets the requirements of surface plasmon resonance. The light emitted by the infrared laser generator is converted into a beam of P-polarized incident light with a fixed frequency through a polarizer and incident on the chip substrate. The first screw stepper motor mechanically rotates around the center point of the chip substrate coating surface. The silicon photocell is placed on the reflected light path to directly receive the light signal. The analog signal is converted into a digital signal using AD, and the digital signal is transmitted to the software system. According to the change trend of the signal, it cooperates with the displacement angle measurement sensor to continuously adjust the relative position of the incident light and the silicon photocell detector and the chip substrate, determine the change in angle adjustment, and let the light beam be incident on the center of the base of the chip substrate, so as to achieve accurate positioning to ensure production quality, and then start the ultraviolet light source and peristaltic pump. Specifically, as the first screw stepper motor is driven, the digital signal changes. When it reaches a suitable value, the first screw stepper motor stops driving, locks the angle, starts the peristaltic pump and the ultraviolet light source for chemical reaction, and triggers chip additive preparation; as the additive process proceeds, the digital signal changes. When it reaches a predetermined value, the controller controls the peristaltic pump and the ultraviolet light source to stop. That is, data output and photoelectric signal conversion are performed, and the detection results are displayed in real time using software. By observing the SPR curve of the sensor chip, the change of the thickness of the polymer film of the sensor chip is monitored in real time, that is, the synthesis process of the sensor chip is monitored.

[0055] After the production preparation is completed, the horizontal feeding module continues to push the prepared chips horizontally to the receiving assembly. The receiving assembly is a discharge plate tilted on the optical production platform. The operator collects the successfully prepared chips and transfers them to the next step to complete the entire operation process. After the horizontal feeding module pushes the prepared chips horizontally to the receiving assembly, the horizontal feeding module is reset, and the vertical loading module drives the carrier plate to move vertically again, so that the next conveyor plate on the carrier plate is aligned with the receiving slot, and the horizontal feeding module runs again to realize the one-by-one conveying of the conveyor plates. Since each conveyor plate is provided with a plurality of material clamps for clamping the chip substrate, the automated mass production of chips is realized, solving the technical problem that the mass production of chips is difficult to industrialize.

[0056] Of course, the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention should also fall within the protection scope of the present invention.

Claims

1. High-precision chemical chip mass production equipment based on SPR and MIT technology, characterized by: The optical production platform comprises a conveying mechanism composed of a vertical loading module and a horizontal feeding module for conveying chip substrates, a production positioning mechanism for receiving the chip substrates conveyed by the conveying mechanism, and a receiving assembly for receiving the prepared chips, optical production detection and adjustment modules and ultraviolet feeding modules are respectively arranged on both sides of the production positioning mechanism, and a controller is also included; A carrier plate is provided on the vertical loading module, a plurality of guide station slots are horizontally provided on the carrier plate, a conveying plate slidably connected to the guide station slot is provided in each guide station slot, and a plurality of material clamps for clamping chip substrates are provided on the conveying plate; The production positioning mechanism is composed of an upper plate body, a lower plate body and a fixing plate for connecting the two. The upper plate body and the lower plate body are provided with linear grooves on the opposite surfaces, and a receiving groove for receiving the conveying plate is formed between the two linear grooves. The optical production detection and adjustment module includes an optical system for generating incident light that meets the requirements of surface plasmon resonance, a detector for real-time monitoring of changes in the thickness of the polymer film on the chip substrate and monitoring the synthesis process of the chip, and a control mechanism for continuously adjusting the relative positions of the optical system and the detector and the chip substrate so that the light beam is incident on the center of the chip substrate base; The ultraviolet feeding module includes a plurality of reaction cells with liquid outlets and liquid inlets respectively disposed on the upper and lower surfaces, and a feeding mechanism for driving the reaction cells to be butted and sealed with the conveying plate, an ultraviolet light source is disposed on the feeding mechanism, and also includes a microfluidic pipeline system for pressing the sample prepolymer liquid and the solvent into the reaction cells; The conveying plate is transported to the containing tank by the vertical loading module and the horizontal feeding module. After being processed by the optical production detection and adjustment module and the ultraviolet feeding module, the horizontal feeding module continues to push the conveying plate to the receiving assembly.

2. The high-precision chemical chip mass production equipment based on SPR and MIT technology according to claim 1 is characterized by: The vertical loading module includes a first bracket, a first driving motor and a first bearing are respectively provided at the top and bottom of the first bracket, a first screw rod for connecting the first driving motor and the first bearing is provided between the two, a first slide rail is provided along the height direction of the first bracket, a first slider is provided on the first slide rail, a first driving block with a first screw hole for cooperating with the first screw rod is provided on the first slider, a first driving plate is provided on the surface of the first slider, the bearing plate is provided on the first driving plate, and the first driving motor is connected to the controller signal.

3. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 2 is characterized by: The horizontal feeding mechanism includes two correspondingly arranged second brackets, and a connecting plate arranged on the top of the two second brackets for connecting the two, a second driving motor and a second bearing are respectively arranged at both ends of the connecting plate, a second screw rod for connecting the two is arranged between the second driving motor and the second bearing, a second slide rail is arranged along the length direction of the connecting plate, a second slider is arranged on the second slide rail, a second screw hole for cooperating with the second screw rod is arranged on the second slider, a push block for pushing the conveying plate is arranged on the second slider, a reciprocating electric cylinder is arranged on the fixed plate, a blocking rod for blocking the conveying plate is arranged on the reciprocating electric cylinder, and the second driving motor and the reciprocating electric cylinder are both connected to the controller signal.

4. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 3 is characterized by: The optical system includes an infrared laser generator, a polarization crystal, and a chopper.

5. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 4 is characterized in that: The control mechanism includes a positioning plate arranged on the optical production platform, and a plurality of first screw stepper motors arranged on the positioning plate, a second drive plate is arranged on the first screw stepper motor, an optical axis for connecting the positioning plate with the connecting plate is arranged on one side of the second drive plate, a bearing seat for installing the optical axis linear bearing connected to the second drive plate is arranged on the optical axis, a plurality of semicircular plate bodies are arranged on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide rail are arranged on the plate body, an upper slide seat and a lower slide seat running along the annular slide rail are arranged on the annular slide rail, and a A detector mounting seat for mounting the detector and a photoelectric switch detection plate are provided, an infrared laser generator mounting seat for mounting the infrared laser generator and a polarization crystal mounting seat for mounting the polarization crystal are provided on the lower slide seat, a first driving rod whose two ends are rotatably connected to the upper slide seat and the second driving plate respectively is provided between the upper slide seat and the second driving plate, a second driving rod whose two ends are rotatably connected to the lower slide seat and the second driving plate respectively is provided between the lower slide seat and the second driving plate, a passage groove for allowing the second slider to pass is provided on the plate body, and the first screw stepping motor is connected to the controller signal.

6. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 5 is characterized by: The detector includes a silicon photocell and an operational amplifier.

7. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 6 is characterized by: The feeding mechanism includes a support plate arranged on the optical production platform, a guide shaft for connecting the support plate and the production positioning mechanism is arranged between the two, and a bracket for fixing the ultraviolet light source running along the guide shaft, a reaction pool carrying plate connected to the ultraviolet light source for carrying the reaction pool is arranged in front of the bracket, a second screw stepper motor for driving the bracket to run along the guide shaft is arranged on the support plate, a pressure sensor is arranged on the second screw stepper motor, and the second screw stepper motor and the pressure sensor are both connected to the controller signal.

8. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 7 is characterized by: The microfluidic pipeline system comprises a peristaltic pump and a delivery pipeline arranged on the peristaltic pump. A pinch valve and a stop valve for controlling the liquid in the reaction pool are arranged on the delivery pipeline.

9. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 8 is characterized by: The substrate is a JGS2 quartz glass lens, and the distance between the ultraviolet light source and the JGS2 quartz glass lens does not exceed 1 cm.

10. The high-precision chemical chip batch production equipment based on SPR and MIT technology according to claim 9 is characterized in that: A positioning groove for accommodating a material clamp is provided on the conveying plate, and the material clamp includes a chip substrate carrier plate corresponding to the positioning groove, a carrier groove adapted to the chip substrate is opened on the chip substrate carrier plate, and a fixed clamp plate and a telescopic clamp plate are respectively provided on both sides of the carrier groove, and the telescopic clamp plate includes a fixed base and a sliding clamp provided on the fixed base, a compression spring for driving the sliding clamp is provided in the fixed base, a guide positioning pin is provided between the sliding clamp and the fixed base, and connecting screws for connecting the chip substrate carrier plate with the conveying plate are provided on both sides of the chip substrate carrier plate.

Citation Information

Patent Citations

  • MIT (Molecular Imprinting Technology) and SPR (Surface Plasmon Resonance) technology combined sulfur dioxide detecting method

    CN104360019A