Transparent green paint protective film as well as manufacturing method and using method thereof

Abstract

The invention discloses a transparent green paint protective film as well as a manufacturing method and a using method thereof. The transparent green paint protective film comprises a first film layer, a second film layer and a release film material. And the first film layer is a polyester-based film layer. The second film layer is formed on the surface of one side of the first film layer, and the second film layer is a pressure sensing adhesive film layer. The release film material comprises a release base film and a release coating. The release coating is arranged between the release base film and the second film layer, and the release coating is directly attached to the second film layer. And the release base film is a polyester release film. The release coating includes a silicone resin material and a plurality of inorganic particles. The inorganic particles enable the surface of the release coating to present an uneven appearance. After the release coating is separated from the second film layer, a concave-convex microstructure is formed on the surface of the second film layer. Therefore, the appearance of the solder mask green paint on the circuit carrier board is effectively regulated and controlled, the reliability and quality of the circuit carrier board are effectively improved, the adhesion between the solder mask green paint and packaging glue is further effectively improved, and the problem of board explosion is effectively avoided.

Description

Technical Field

[0001] The invention relates to a protective film, in particular to a transparent green paint protective film, a manufacturing method thereof, and a use method thereof. Background Art

[0002] In the prior art, since the line width and line spacing of the circuit layout on the integrated circuit (IC) substrate are extremely fine and the line resolution is high, when the IC substrate is used in high-frequency products, the product has extremely high requirements for reliability, and the quality of the packaging process greatly determines the value of the product.

[0003] The solder mask green paint formed on the circuit board is in contact with the packaging glue. The adhesion between the green paint and the packaging glue will affect the reliability and quality of the IC substrate.

[0004] By adjusting the appearance of the solder mask surface, the adhesion between the solder mask and the packaging glue can be maintained better, thus ensuring the performance of the IC carrier. However, the shape of the solder mask surface during its processing mainly depends on the transparent green paint protective film attached to the solder mask surface during exposure. The transparent green paint protective film of the prior art cannot accurately control the appearance of the solder mask surface, thus resulting in poor reliability and poor quality of the IC carrier (such as poor adhesion or easy board explosion).

[0005] Therefore, the inventors felt that the above defects could be improved, so they devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a transparent green paint protective film for IC substrate, a manufacturing method thereof, and a use method thereof in view of the deficiencies of the prior art.

[0007] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a transparent green paint protective film, which includes: a first film layer, the first film layer is a polyester base film layer; a second film layer, which is formed on one side surface of the first film layer, and the second film layer is a pressure-sensitive adhesive film layer; a release film material, which is formed on the side surface of the second film layer away from the first film layer, and the release film material includes a release base film and a release coating, the release coating is arranged between the release base film and the second film layer, and the release coating is directly in contact with the release base film. The second film layer is bonded to the surface away from the first film layer; wherein the release base film is a polyester release film; the release coating layer comprises a silicone resin material and a plurality of inorganic particles dispersed in the silicone resin material; the plurality of inorganic particles make the surface of the release coating layer away from the release base film present an uneven appearance, which can be transferred to the surface of the second film layer bonded to the release coating layer; after the release film material is separated from the second film layer by the release coating layer, a concave-convex microstructure is formed on the surface of the second film layer away from the first film layer.

[0008] Preferably, the first film layer has a first thickness between 5 microns and 20 microns, the second film layer has a second thickness between 3 microns and 18 microns, the release base film has a third thickness between 15 microns and 35 microns, and the release coating has a fourth thickness between 0.1 microns and 1.0 microns.

[0009] Preferably, the plurality of inorganic particles have an average particle size between 0.001 micrometer and 1.0 micrometer.

[0010] Preferably, a ratio of the fourth thickness of the release coating to the average particle size of the inorganic particles is between 5 and 20.

[0011] Preferably, the plurality of inorganic particles are at least partially exposed on the surface of the release coating layer away from the release base film, so that the surface of the release coating layer away from the release base film presents the uneven appearance.

[0012] Preferably, the silicone resin material is selected from at least one of the material group consisting of: methyl silicone resin, methylphenyl silicone resin, vinyl silicone resin, methylvinyl silicone resin, amino silicone resin, epoxy-modified silicone resin, and derivatives of the above materials; wherein the inorganic particles can be, for example, selected from at least one of the material group consisting of: silicon dioxide, calcium carbonate, calcium phosphate, barium sulfate, kaolin, talc, glass powder and derivatives of the above materials.

[0013] Preferably, the release coating is formed by applying a release coating on the release base film and drying the solvent in the coating; wherein the release coating comprises the silicone resin material, the inorganic particles, an additive, and the solvent; wherein the silicone resin material, the inorganic particles, and the additive are solid components in the release coating; in the release coating, the total weight of the silicone resin material and the inorganic particles accounts for at least 80% of the weight of the solid components; wherein the weight ratio between the silicone resin material and the inorganic particles is between 0.3 and 1.1.

[0014] Preferably, the glass transition temperature of the second film layer is between -50°C and 50°C.

[0015] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a transparent green paint protective film, comprising: providing a first film layer and a second film layer formed on a surface of one side of the first film layer; wherein the first film layer is a polyester-based film layer, and the second film layer is a pressure-sensitive adhesive film layer; providing a release film material, which comprises a release base film and a release coating formed on a surface of one side of the release base film; wherein the release coating faces the second film layer; wherein the release base film is a polyester release film, and the release coating is a silicone resin coating, and comprises a plurality of inorganic particles dispersed therein; wherein the plurality of inorganic particles make the surface of the release coating away from the release base film present an uneven appearance; and laminating the release coating of the release film material to a surface of the second film layer away from the first film layer to complete the preparation of the transparent green paint protective film, wherein, after the release film material is separated from the second film layer by the release coating, a concave-convex microstructure is formed on the surface of the second film layer away from the first film layer.

[0016] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a method for using a transparent green paint protective film, which includes: providing the transparent green paint protective film as described above; separating the release film material from the second film layer through the release coating to form the concave-convex microstructure on the surface of the second film layer away from the first film layer; providing a circuit carrier, which includes a circuit board body and a solder resist green paint formed on the circuit board body; tightly fitting the concave-convex microstructure on the surface of the second film layer with the solder resist green paint to transfer the concave-convex microstructure to a side surface of the solder resist green paint away from the circuit board body; wherein the material hardness of the second film layer is greater than that of the solder resist green paint; and removing the first film layer and the second film layer from the solder resist green paint of the circuit carrier to form a transferred rough surface on the side surface of the solder resist green paint away from the circuit board body, which has an arithmetic average roughness (Ra) between 0.01 and 0.5 nanometers.

[0017] The beneficial effect of the present invention is that the transparent green paint protective film provided by the present invention can effectively control the appearance of the surface of the solder mask green paint on the circuit substrate through the material design of the release coating and the pressure-sensitive adhesive film layer, thereby effectively improving the reliability and quality of the circuit substrate, thereby effectively improving the adhesion between the solder mask green paint and the packaging glue, and effectively avoiding the problem of board explosion.

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the laminated structure of the transparent green paint protective film according to an embodiment of the present invention.

[0020] Figure 2A This is step S110 of the method for manufacturing the transparent green paint protective film according to an embodiment of the present invention.

[0021] Figure 2B This is step S120 of the method for manufacturing the transparent green paint protective film according to an embodiment of the present invention.

[0022] Figure 3A This is step S210 of the method for using the transparent green paint protective film according to an embodiment of the present invention.

[0023] Figure 3B This is step S220 of the method for using the transparent green paint protective film according to an embodiment of the present invention.

[0024] Figure 3C This is step S230 of the method for using the transparent green paint protective film according to an embodiment of the present invention.

[0025] Figure 3D This is step S240 of the method for using the transparent green paint protective film according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the embodiments disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification.

[0027] The present invention may be implemented or applied through other different specific embodiments, and the details in this specification may be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention.

[0028] In addition, the drawings of the present invention are only for simple illustration and are not depicted according to actual size. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

[0029] It should be understood that although the terms "first", "second", "third", etc. may be used in this article to describe various materials or parameters, these materials or parameters should not be limited by these terms. These terms are mainly used to distinguish one material from another material, or one parameter from another parameter.

[0030] In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.

[0031] [Transparent green paint protective film]

[0032] See also Figure 1 As shown, an embodiment of the present invention provides a transparent green paint protective film 100. The transparent green paint protective film 100 may be, for example, a transparent green paint protective film used in an integrated circuit (IC) substrate manufacturing process.

[0033] For example, after the solder mask is applied to the circuit board, a transparent green paint (solder mask) protective film can be further attached to the solder mask. The transparent green paint protective film attached to the solder mask does not need to be torn off, that is, the exposure operation can be directly performed. The transparent green paint protective film is removed before the solder mask is developed, thereby effectively shortening the process time and achieving the anti-oxidation of the green paint. However, the use of the transparent green paint protective film 100 of the present invention is not limited to this.

[0034] It is worth mentioning that the transparent green paint protective film provided by the embodiment of the present invention can effectively control the appearance of the surface of the solder mask green paint, thereby effectively improving the reliability and quality of the circuit board.

[0035] The transparent green paint protection 100 includes a first film layer 1 , a second film layer 2 , and a release film material 3 stacked in sequence from top to bottom.

[0036] The first film layer 1 is a polyester-based film layer. Preferably, the first film layer 1 is a polyester-based film layer formed of polyethylene terephthalate (PET).

[0037] The first film layer 1 has a first thickness T1, which is between 5 micrometers and 20 micrometers, and preferably between 10 micrometers and 15 micrometers. For example, the first thickness T1 of the first film layer 1 can be, for example, 10 micrometers, 12 micrometers, or 14 micrometers, but the present invention is not limited thereto.

[0038] The second film layer 2 is formed on one side surface of the first film layer 1. The second film layer 2 is a pressure-sensitive adhesive film layer (or optical adhesive film layer). The second film layer 2 is preferably a pressure-sensitive adhesive film layer formed by OCA pressure-sensitive adhesive (optical clear adhesive). In an embodiment of the present invention, the OCA pressure-sensitive adhesive can be, for example, acrylic pressure-sensitive adhesive (or acrylate pressure-sensitive adhesive).

[0039] The second film layer 2 has a second thickness T2, which is between 3 micrometers and 18 micrometers, and preferably between 8 micrometers and 13 micrometers, and can be, for example, 8 micrometers or 10 micrometers, but is not limited thereto.

[0040] The release film material 3 is formed on a side surface of the second film layer 2 away from the first film layer 1. The release film material 3 includes a release base film 31 and a release coating 32 formed on a side surface of the release base film 31. The release coating 32 is disposed between the release base film 31 and the second film layer 2, and the release coating 32 is directly attached to a side surface of the second film layer 2 away from the first film layer 1.

[0041] The release base film 31 is a polyester release film. Preferably, the release base film 31 is a polyester release film formed of polyethylene terephthalate (PET).

[0042] The release film 31 has a third thickness T3, which is between 15 micrometers and 35 micrometers, and preferably between 20 micrometers and 30 micrometers. For example, the third thickness T3 of the release film 31 can be, for example, 21 micrometers, 25 micrometers, or 29 micrometers, but the present invention is not limited thereto.

[0043] Furthermore, the release coating layer 32 is preferably formed on the side surface of the release base film 31 by wet coating.

[0044] The release coating 32 is a silicone coating and includes a plurality of inorganic particles 321 dispersed therein. Specifically, the release coating 32 includes a silicone material and a plurality of inorganic particles 321 dispersed in the silicone material.

[0045] The plurality of inorganic particles 321 are arranged so that the surface of the release coating 32 away from the release base film 31 presents an uneven appearance, and the uneven appearance can be transferred to the surface of the second film layer 2 that is in contact with the release coating 32. Figure 3A ), the second film layer 2 is formed with a transferred concave-convex microstructure 21 (such as Figure 3B ).

[0046] In an embodiment of the present invention, the plurality of inorganic particles 321 are at least partially exposed on the surface of the release coating 32 away from the release base film 31 , so that the surface of the release coating 32 away from the release base film 31 presents the uneven appearance.

[0047] The release coating 32 has a fourth thickness T4, which is between 0.1 micrometer and 1.0 micrometer, and preferably between 0.3 micrometer and 0.8 micrometer, and may be, for example, 0.3 micrometer or 0.5 micrometer, but is not limited thereto.

[0048] Furthermore, the inorganic particles 321 have an average particle size D ranging from 0.001 μm to 1.0 μm, preferably ranging from 0.03 μm to 0.1 μm, and particularly preferably ranging from 0.03 μm to 0.07 μm, and may be, for example, 0.03 μm, 0.04 μm, or 0.05 μm, but is not limited thereto.

[0049] It should be noted that the average particle size D of the inorganic particles 321 in the embodiment of the present invention is defined by D50. That is, the particle size corresponding to when the cumulative particle size distribution percentage of the plurality of inorganic particles reaches 50%. The physical meaning of D50 is that particles with a particle size greater than this average particle size value account for 50%, and particles with a particle size less than this average particle size value also account for 50%.

[0050] It is worth mentioning that in some embodiments of the present invention, the ratio between the fourth thickness T4 of the release coating 32 and the average particle size D of the inorganic particles 321 is preferably between 5 and 20, and particularly preferably between 8 and 18. For example, the ratio may be 10, 12.5, or 16.6, but the present invention is not limited thereto.

[0051] In terms of material type, the silicone material may be, for example, polysiloxane. More specifically, the silicone material is at least one selected from the group consisting of methyl silicone, methylphenyl silicone, vinyl silicone, methylvinyl silicone, amino silicone, epoxy-modified silicone, and derivatives thereof.

[0052] In an embodiment of the present invention, the silicone material may be, for example, polydimethylsiloxane (PDMS), but the present invention is not limited thereto.

[0053] Furthermore, the inorganic particles may be selected from, for example, silicon dioxide (SiO2), calcium carbonate (CaCO3), calcium phosphate (Ca3(PO4)2), barium sulfate (BaSO4), kaolin (Al2Si2O5(OH)4), talc (Mg3Si4O 10 (OH)2), glass powder, and derivatives of the above materials, at least one of the material group. In the embodiment of the present invention, the inorganic particles can be, for example, silicon dioxide, but the present invention is not limited thereto.

[0054] The material hardness of the inorganic particles 321 is greater than the material hardness of the silicone resin material, and is also greater than the material hardness of the second film layer 2 (pressure-sensitive adhesive film layer).

[0055] Accordingly, the uneven appearance formed by the inorganic particles 321 on the surface of the release coating 32 can be transferred to the surface of the second film layer 2 (pressure-sensitive adhesive film layer) away from the first film layer 1 (polyester-based film layer).

[0056] As described above, the release coating 32 is preferably formed on the side surface of the release base film 31 by wet coating. In this embodiment, the release coating 32 is formed by coating the release coating on the release base film 31 and drying the solvent in the coating. That is, the release coating is in a flowable state, and the release coating 32 is formed after the solvent is dried.

[0057] More specifically, the release coating comprises: the silicone resin material, the inorganic particles, an additive, and a solvent.

[0058] In terms of content range, based on the total weight of the release coating being 100 parts by weight, the amount of the silicone resin material is between 1 part by weight and 15 parts by weight, preferably between 3 parts by weight and 8 parts by weight, and particularly preferably between 4.5 parts by weight and 6.5 parts by weight. The amount of the inorganic particles is between 1 part by weight and 15 parts by weight, preferably between 5 parts by weight and 11 parts by weight, and particularly preferably between 7 parts by weight and 9 parts by weight.

[0059] The amount of the additive is between 0.5 and 5 parts by weight, preferably between 1 and 5 parts by weight, and particularly preferably between 1 and 3 parts by weight. Furthermore, the amount of the solvent is between 65 and 97.5 parts by weight, preferably between 75 and 95 parts by weight, and particularly preferably between 80 and 90 parts by weight.

[0060] The silicone resin material, inorganic particles, and additives are solid components in the release coating, and the solvent is a liquid component in the release coating. After the release coating is dried, most of the solvent is removed, and the solid components are mainly retained to form the release coating 32.

[0061] From another perspective, in the release coating 32 , the total weight of the silicone resin material and the inorganic particles accounts for at least 80% by weight and preferably at least 88% by weight of all solid components.

[0062] In addition, the weight ratio between the silicone material and the inorganic particles may be, for example, between 0.3 and 1.1, preferably between 0.4 and 1.0, and particularly preferably between 0.5 and 0.95.

[0063] In addition, the material types of the silicone resin material and the inorganic particles have been described above and will not be repeated here. The additive may be, for example, a metal catalyst, such as a bismuth catalyst, a platinum catalyst or a tin catalyst. Alternatively, the additive may be a modified siloxane. The solvent may be, for example, at least one of the material group consisting of toluene, xylene, acetone, methyl ethyl ketone and isopropanol.

[0064] It is worth mentioning that the second film layer 2 (pressure-sensitive adhesive film layer) is formed of acrylic resin. The second film layer 2 is completely in contact with the release coating 32. The hardness of the second film layer 2 will directly affect the appearance of the transfer on its surface.

[0065] In some embodiments of the present invention, the glass transition temperature (Tg) of the second film layer 2 (pressure-sensitive adhesive film layer) is between -50°C and 50°C, preferably between -5°C and 20°C, and particularly preferably between 0°C and 10°C, so that the second film layer 2 can have appropriate hardness and softness to achieve a better transfer effect.

[0066] It is also worth mentioning that the most important parameters affecting the appearance of the solder mask green paint on the subsequent IC circuit substrate in the transparent green paint protective film 100 of the embodiment of the present invention are the silicone resin release coating and the pressure-sensitive adhesive film layer. Among them, the average particle size of the inorganic particles, the amount of addition, the ratio between the coating thickness and the average particle size, and the hardness of the pressure-sensitive adhesive film layer are the main parameters affecting the appearance of the above-mentioned solder mask green paint.

[0067] The present invention can adjust the appearance of the solder mask green paint surface on the IC circuit substrate through the transparent green paint protective film 100, so that the adhesion between the solder mask green paint and the packaging glue ensures the performance of the IC substrate, and the morphology of the solder mask green paint surface mainly depends on the transparent green paint protective film 100.

[0068] The present invention also controls the appearance of the silicone release coating by wet coating method, and the silicone release coating is then laminated with the pressure-sensitive adhesive film layer, so that the pattern transferred by the pressure-sensitive adhesive film layer can also obtain consistency.

[0069] According to the above configuration, the transparent green paint protective film provided by the embodiment of the present invention can effectively regulate the appearance morphology of the surface of the solder mask green paint, thereby effectively improving the reliability and quality of the circuit board, effectively improving the adhesion between the solder mask green paint and the packaging glue, and effectively avoiding the problem of board explosion.

[0070] [Method for producing transparent green paint protective film]

[0071] The above is a description of the structural features and material features of the transparent green paint protective film according to the embodiment of the present invention, and the following will describe a method for manufacturing the transparent green paint protective film according to the embodiment of the present invention.

[0072] See also Figure 2A and Figure 2B The embodiment of the present invention also provides a method for manufacturing a transparent green paint protective film, which includes step S110 and step S120. It must be noted that the order and actual operation method of each step in this embodiment can be adjusted according to needs and are not limited to the embodiment. Furthermore, the transparent green paint protective film in the embodiment of the present invention can be completed by the manufacturing method, but is not limited thereto.

[0073] like Figure 2A As shown, the step S110 includes: providing a first film layer 1 and a second film layer 2 formed on one side surface (eg, lower surface) of the first film layer 1. The first film layer 1 is a polyester-based film layer, and the second film layer 2 is a pressure-sensitive adhesive film layer.

[0074] The step S110 further includes: providing a release film material 3, wherein the release film material 3 includes a release base film 31 and a release coating 32 formed on one surface (eg, upper surface) of the release base film 31. The release coating 32 faces the second film layer 2 (pressure-sensitive adhesive film layer).

[0075] The release base film 31 is a polyester release film. The release coating 32 is formed on the side surface of the release base film 31 by wet coating. The release coating 32 is a silicone resin coating and contains a plurality of inorganic particles 321 dispersed therein. The plurality of inorganic particles 321 are arranged so that the release coating 32 is away from the surface of the release base film 31 and presents an uneven appearance.

[0076] like Figure 2B As shown, the step S120 includes: bonding the release coating 32 (silicone resin coating) of the release film material 3 to the surface of the second film layer 2 (pressure-sensitive adhesive film layer) on the side away from the first film layer 1 (polyester-based film layer), thereby completing the preparation of the transparent green paint protective film, and allowing the uneven appearance on the surface of the release coating 32 to be transferred to the surface of the second film layer 2 that is bonded to the release coating 32.

[0077] After the release coating 32 is separated from the second film layer 2 (eg Figure 3A ), the surface of the second film layer 2 away from the first film layer 1 is formed with a transferred concave-convex microstructure 21 (such as Figure 3B ).

[0078] [How to use the transparent green paint protective film]

[0079] See also FIG. 3A to FIG. 3D , the embodiment of the present invention also provides a method for using a transparent green paint protection film, which includes steps S210 to S240. It must be noted that the order and actual operation methods of the steps in this embodiment can be adjusted according to needs and are not limited to those in this embodiment. Furthermore, the transparent green paint protection film of the embodiment of the present invention can be used by the method, but is not limited thereto.

[0080] like Figure 3A As shown, the step S210 includes: providing the above-mentioned transparent green paint protective film 100, which includes the first film layer 1 (polyester base film layer), the second film layer 2 (pressure-sensitive adhesive film layer), and the release film material 3 (including a polyester release film 31 and a release coating 32) stacked in sequence from top to bottom; and separating the release film material 3 from the second film layer 2 through the release coating 32, so that the surface of the second film layer 2 away from the first film layer 1 is formed with a transferred concave-convex microstructure 21.

[0081] like Figure 3BAs shown, the step S220 includes: providing a circuit carrier B, which includes a circuit board body B1 and a solder resist green paint B2 formed on a side surface (e.g., upper surface) of the circuit board body B1; and facing the concavo-convex microstructure 21 on the surface of the second film layer 2 toward the solder resist green paint B2. The circuit board body B1 can be, for example, a copper layer circuit board body, and the solder resist green paint B2 can be, for example, formed on the side surface of the circuit board body B1 by coating.

[0082] like Figure 3C As shown, the step S230 includes: closely fitting the concavo-convex microstructure 21 on the surface of the second film layer 2 with the solder resist green paint B2, so as to transfer the concavo-convex microstructure 21 to the surface of the solder resist green paint B2 on the side away from the circuit board body B1. The material hardness of the second film layer is greater than that of the solder resist green paint. The step S230 also includes: without removing the first film layer 1 (polyester base film layer) and the second film layer 2 (pressure-sensitive adhesive film layer), exposing the solder resist green paint B2.

[0083] like Figure 3D As shown, the step S240 includes: after completing the exposure operation, removing the first film layer 1 and the second film layer 2 from the solder mask B2 of the circuit carrier B, so that a transferred rough surface Ra is formed on the surface of the solder mask B2 away from the circuit board body B1, which has an arithmetic mean roughness (Ra) between 0.01 and 0.5 nanometers, and preferably 0.05 to 0.1 nanometers.

[0084] [Experimental data and test results]

[0085] Hereinafter, the content of the present invention is described in detail with reference to Examples 1 to 3 and Comparative Examples 1 to 2. However, the following examples are only used to help understand the present invention, and the scope of the present invention is not limited to these examples. Among them, Examples 1 to 3 are groups that can prove the technical effects of the present invention, while Comparative Examples 1 to 2 are groups with poor technical effects.

[0086] Example 1: A transparent green paint protective film is prepared according to the conditions in Table 1 below, which includes a first film layer (PET base film layer), a second film layer (OCA adhesive film layer), and a release film material (silicone resin release coating and PET release base film) stacked in sequence. The thickness conditions of each layer are listed in Table 1. The OCA glass transition temperature of the second film layer is 0°C. The silicone resin release coating is applied to the PET release base film by wet coating. The formula of the release coating is shown in Table 1, which includes: 6.5 parts by weight of silicone resin (polydimethylsiloxane), 7 parts by weight of inorganic particles (silicon dioxide), 1.5 parts by weight of additives (fluorine-modified siloxane), and 85 parts by weight of solvent (toluene / methyl ethyl ketone, volume ratio of 1:1). The particle size of the inorganic particles is 0.03 microns. The weight ratio of silicone resin / inorganic particles is 6.5 / 7.0=0.93. The ratio of coating thickness to inorganic particle size is 0.5 / 0.03=16.6.

[0087] Then, the solvent component of the release coating is removed to form the silicone release coating. The silicone release coating is directly attached to the second film layer (OCA film layer). Next, the release film material of the transparent green paint protective film is separated from the second film layer by the silicone release coating so that the second film layer (OCA film layer) is formed with a concave-convex microstructure. Next, according to the method of use in the above embodiment, a rough surface after the concave-convex microstructure transfer is formed on the surface of the solder mask green paint of the circuit carrier. Finally, the physical properties of the solder mask green paint are tested, including the surface gloss (GU) of the green paint, the surface roughness (nanometer) of the green paint, and whether the green paint has a surface granularity.

[0088] The preparation methods of Examples 2-3 and Comparative Examples 1-2 are the same as that of Example 1, except for the OCA glass transition temperature, silicone release coating thickness, and / or silicone coating formulation. The detailed parameter differences are shown in Table 1 and are not described here.

[0089] [Table 1]

[0090]

[0091]

[0092] The test method for the surface gloss (GU) of the green paint is to measure the gloss of the solder resist green paint at 60 degrees according to the ASTM D523 standard analysis method using a gloss meter (brand: BYK, model: mirco-TRI-gloss), and record three sets of readings under a measurement area of ​​75mm*150mm, take the average value, and record the results in Table 1, the unit is gloss unit (GU).

[0093] The test method for the surface roughness (nanometer) of the green paint is to use a surface roughness meter to obtain the arithmetic average roughness (Ra) of the green paint surface according to the JIS-B-0601 (2001) standard analysis method.

[0094] According to the test results in Table 1, the surface glossiness of the green paint of Examples 1 to 3 is at least greater than 75GU, and specifically between 78 and 82GU. In addition, the surface roughness (Ra) of the green paint of Examples 1 to 3 falls within the range of 0.05 to 0.1 nanometers and specifically between 0.07 and 0.09 nanometers, and has a surface roughness within an appropriate numerical range. That is, the transparent green paint protective film of Examples 1 to 3 can effectively regulate the appearance of the surface of the solder mask green paint, effectively improve the reliability and quality of the circuit board, and effectively improve the adhesion between the solder mask green paint and the packaging glue in the subsequent packaging process, and effectively avoid the problem of board explosion.

[0095] Comparative Example 1 uses a thinner silicone release coating (thickness of only 0.1 micrometers), and the ratio of coating thickness to inorganic particle size is 3.33, which is smaller than the ideal ratio range (5 to 20).

[0096] Comparative Example 2 used inorganic particles with a coarser particle size (particle size of 0.12 micrometers), and the coating thickness / inorganic particle size ratio was 4.16, which was smaller than the ideal ratio range (5 to 20).

[0097] The surface glossiness of the green paint of Comparative Examples 1 and 2 is less than 75GU, and specifically 70GU. In addition, the surface roughness of the green paint of Comparative Examples 1 and 2 is greater than 0.05 to 0.1 nanometers, and specifically between 0.12 and 0.15. The test results of the surface properties of the green paint of Comparative Examples 1 and 2 are slightly poor, and there may be some reliability and quality issues when they are used in subsequent packaging processes.

[0098] [Beneficial Effects of Embodiments]

[0099] The beneficial effect of the present invention is that the transparent green paint protective film provided by the present invention can effectively control the appearance of the surface of the solder mask green paint, thereby improving the reliability and quality of the circuit board, and effectively improving the adhesion between the solder mask green paint and the packaging glue, and can effectively avoid the problem of board explosion.

[0100] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the present invention.

Claims

1. A transparent green paint protective film, characterized in that: The transparent green paint protective film comprises: A first film layer, wherein the first film layer is a polyester-based film layer; A second film layer is formed on one side surface of the first film layer, and the second film layer is a pressure-sensitive adhesive film layer; A release film material is formed on a surface of the second film layer that is away from the first film layer, and the release film material comprises a release base film and a release coating layer, wherein the release coating layer is disposed between the release base film and the second film layer, and the release coating layer is directly attached to a surface of the second film layer that is away from the first film layer; Among them, the release base film is a polyester release film; the release coating contains a silicone resin material and a plurality of inorganic particles dispersed in the silicone resin material; the plurality of inorganic particles make the surface of the release coating away from the release base film present an uneven appearance, which can be transferred to the surface of the second film layer in contact with the release coating; after the release film material is separated from the second film layer by the release coating, a concave-convex microstructure is formed on the surface of the second film layer away from the first film layer.

2. The transparent green paint protective film according to claim 1, characterized in that: The first film layer has a first thickness between 5 microns and 20 microns, the second film layer has a second thickness between 3 microns and 18 microns, the release base film has a third thickness between 15 microns and 35 microns, and the release coating has a fourth thickness between 0.1 microns and 1.0 microns.

3. The transparent green paint protective film according to claim 2, characterized in that: The inorganic particles have an average particle size ranging from 0.001 micrometer to 1.0 micrometer.

4. The transparent green paint protective film according to claim 3, characterized in that: A ratio of the fourth thickness of the release coating to the average particle size of the inorganic particles is between 5 and 20.

5. The transparent green paint protective film according to claim 4, characterized in that: The plurality of inorganic particles are at least partially exposed on the surface of the release coating layer away from the release base film, so that the surface of the release coating layer away from the release base film presents the uneven appearance.

6. The transparent green paint protective film according to claim 1, characterized in that: The silicone resin material is selected from at least one of the material group consisting of: methyl silicone resin, methylphenyl silicone resin, vinyl silicone resin, methylvinyl silicone resin, amino silicone resin, epoxy-modified silicone resin, and derivatives of the above materials; wherein the inorganic particles can be, for example, selected from at least one of the material group consisting of: silicon dioxide, calcium carbonate, calcium phosphate, barium sulfate, kaolin, talc, glass powder and derivatives of the above materials.

7. The transparent green paint protective film according to claim 1, characterized in that: The release coating is formed by applying a release coating on the release base film and drying the solvent in the coating; wherein the release coating comprises the silicone resin material, the inorganic particles, an additive, and the solvent; wherein the silicone resin material, the inorganic particles, and the additive are solid components in the release coating; in the release coating, the total weight of the silicone resin material and the inorganic particles accounts for at least 80% of the weight of the solid components; wherein the weight ratio between the silicone resin material and the inorganic particles is between 0.3 and 1.

1.

8. The transparent green paint protective film according to claim 1, characterized in that: The glass transition temperature of the second film layer is between -50°C and 50°C.

9. A method for manufacturing a transparent green paint protective film, characterized in that: The method for manufacturing the transparent green paint protective film comprises: Providing a first film layer and a second film layer formed on one side surface of the first film layer; wherein the first film layer is a polyester-based film layer, and the second film layer is a pressure-sensitive adhesive film layer; A release film material is provided, comprising a release base film and a release coating formed on one surface of the release base film; wherein the release coating faces the second film layer; wherein the release base film is a polyester release film, and the release coating is a silicone resin coating and comprises a plurality of inorganic particles dispersed therein; wherein the plurality of inorganic particles cause the surface of the release coating away from the release base film to have an uneven appearance; and The release coating of the release film material is laminated to a surface of the second film layer on a side away from the first film layer to complete the preparation of the transparent green paint protective film. Wherein, after the release film material is separated from the second film layer by the release coating, a concave-convex microstructure is formed on the surface of the second film layer away from the first film layer.

10. A method for using a transparent green paint protective film, characterized in that: The method for using the transparent green paint protective film comprises: Providing the transparent green paint protective film according to claim 1; Separating the release film material from the second film layer through the release coating layer to form the concave-convex microstructure on the surface of the second film layer away from the first film layer; Providing a circuit carrier, which includes a circuit board body and a solder resist green paint formed on the circuit board body; The concavo-convex microstructure on the surface of the second film layer is closely attached to the solder resist green paint, so as to transfer the concavo-convex microstructure to the surface of the solder resist green paint away from the circuit board body; wherein the material hardness of the second film layer is greater than that of the solder resist green paint; and The first film layer and the second film layer are removed from the solder mask of the circuit board, so that a rough surface having an arithmetic average roughness of 0.01 to 0.5 nanometers is formed on the side surface of the solder mask away from the circuit board.

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