Surface treatment device for electronic accessory machining

Abstract

The invention discloses a surface treatment device for electronic accessory processing, an electroplating cylinder mechanism is rotatably mounted between two groups of side surface frames, the electroplating cylinder mechanism comprises an electroplating cylinder rotatably mounted between the two side surface frames through a bearing, and a driving main shaft is rotatably mounted between the two side surface frames through a bearing; two groups of driving assemblies are mounted at the two ends of the driving main shaft, a dispersing mechanism is rotatably mounted in the electroplating roller, and a cleaning mechanism for cleaning the electroplating roller is mounted between the two groups of side surface frames. And the driving main shaft is further connected with the dispersing mechanism, and the rotating direction of the dispersing mechanism is opposite to that of the electroplating roller, so that the electronic accessories form turbulent flow in the electroplating roller, aggregation of the electronic accessories is reduced, and the electronic accessories are stirred more uniformly.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating treatment, and in particular to a surface treatment device for processing electronic parts. Background Art

[0002] ‌The surface of electronic parts is usually plated with gold, silver or nickel as needed. Gold plating is to improve the conductivity and corrosion resistance of electronic parts, as well as the heat dissipation effect of electronic parts. Silver plating is to improve the conductivity and reflectivity of electronic parts. It can also increase the radiation capacity and anti-interference ability of electronic parts, improve the stability and reliability of communication systems, and nickel plating can protect electronic parts from being overlooked and wear-resistant, and reduce damage and failures caused by friction. When a small batch of electronic parts are plated with gold, silver or nickel, a certain number of electronic parts will be placed in the electroplating drum, and the electroplating drum will be placed in the electroplating tank, so that the plating solution enters the interior through the filter holes on the surface of the electroplating drum and contacts the electronic parts, thereby electroplating them.

[0003] During the use of the electroplating drum, certain impurities will be generated in the plating solution. The impurities will interfere with the electroplating process, form undesirable deposits, and clog the drum, which will lead to a decrease in the exchange efficiency between the plating solution inside the electroplating drum and the plating solution outside. When multiple electronic components are stacked and placed inside the electroplating drum, the parts of the electronic components that are in contact with each other cannot contact enough plating solution, which makes it inconvenient for the plating solution to fully and comprehensively plate the electronic components, resulting in poor gold plating effect on the surface of the electronic components. In addition, the fluidity of the plating solution during the electroplating process is poor, which makes the contact between the plating solution and the electronic components insufficient, resulting in low electroplating efficiency on the surface of the electronic components. To this end, we designed a surface treatment device for processing electronic components. Summary of the invention

[0004] The present invention provides a surface treatment device for processing electronic parts, which solves the problem of low electroplating efficiency on the surface of electronic parts.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A surface treatment device for processing electronic parts, comprising an electroplating tank, two groups of side frames are symmetrically placed at both ends of the electroplating tank, an electroplating drum mechanism is rotatably installed between the two groups of side frames, the electroplating drum mechanism comprises an electroplating drum rotatably installed between the two side frames through a bearing, and a driving spindle is rotatably installed between the two side frames through a bearing, two groups of driving components are installed at both ends of the driving spindle, and the driving components are connected to the electroplating drum, a dispersion mechanism is rotatably installed inside the electroplating drum, and the dispersion mechanism is connected to the driving spindle; A cleaning mechanism for cleaning the electroplating drum is installed between the two groups of side frames. The cleaning mechanism is connected to the driving assembly. One end of the driving shaft extends outward and is placed outside one of the side frames. The driving shaft is connected to an external driving device to provide power.

[0006] Furthermore, the electroplating drum comprises a polygonal cylinder with a regular hexagonal structure, a material port for adding materials is provided on one side of the polygonal cylinder, and a cover plate is installed in the material port through a hinge and a door lock, and multiple evenly distributed liquid holes are provided on multiple sides of the polygonal cylinder and the cover plate; The polygonal cylinder is a regular polygonal structure, and the number of sides can be changed accordingly as needed. The present invention adopts a regular hexagonal structure, and the liquid hole is used for the plating solution in the electroplating tank to enter the inside of the electroplating cylinder and contact the electronic parts inside, so as to electroplate the surface thereof; A side plate is fixed on each of the two ends of the polygonal cylinder, and mounting sleeves are welded on the outward surfaces of the two side plates. The two mounting sleeves are rotatably mounted on the two side frames through bearings. The electroplating drum can rotate accordingly under the action of the driving component, so that the plating liquid can continuously and largely flush the surface of the electronic parts and fully exchange contact, and at the same time, the distribution of electric lines in the rotating electroplating tank is more uniform, so as to finally achieve uniform plating and good quality of the plated parts.

[0007] Furthermore, the driving assembly comprises two groups of intermittent wheels respectively fixed on the outer surfaces of the two side plates, and the intermittent wheels are connected to the mounting sleeve shaft, and the intermittent wheels are provided with a plurality of intermittent grooves arranged in a circumferential array; Two sets of driving wheels are symmetrically arranged at both ends of the driving main shaft, and the outer ring protruding part of the driving wheel is formed with a protruding part, and a driving column is installed on the side of the protruding part close to the side plate. The entire driving assembly is an intermittent mechanism, and the driving wheel rotates by the rotation of the driving main shaft, and then the intermittent wheel deflects a certain angle each time through the driving column, so that the electroplating drum rotates, wherein the number of intermittent grooves is the same as the number of sides of the polygonal drum; The front sides of the two groups of driving wheels are respectively provided with limiting wheels, and parts of the limiting wheels are cut off to form notches. The intermittent wheel is provided with a plurality of fan-shaped grooves in a ring shape, and the intermittent grooves and the fan-shaped grooves are alternately distributed. When the driving column and the intermittent groove slide, the intermittent wheel is pushed to rotate by the driving column. At this time, the intermittent wheel rotates along the arc groove on the driven wheel, and the limiting wheel and the fan-shaped groove rotate. At this time, the intermittent wheel is in a locked state and cannot rotate.

[0008] Furthermore, the cleaning mechanism comprises two sets of driving discs symmetrically mounted at both ends of the driving main shaft, the outer ring of the driving disc is widened to form a delayed arc portion and an advanced arc portion, and the advanced arc portion contacts the delayed arc portion, and the arc rates of the outer rings of the delayed arc portion and the advanced arc portion are consistent; The two side frames are provided with lifting members that slide up and down on the inner side, and the top of the lifting member is in sliding contact with the advance arc part and the delay arc part of the driving disk. A lifting plate is fixed between the two lifting members through a lifting guide plate, and a plurality of evenly distributed cleaning heads are provided above the lifting plate, and the plurality of cleaning heads correspond to the plurality of liquid holes one by one. The cleaning head can move up and down intermittently under the action of the lifting member, and when it is at the top, the top of the cleaning head is placed inside the electroplating drum through the liquid hole, so that the liquid holes on its surface can be cleared to prevent blockage and poor flow of internal and external plating liquids. It can also contact the internal electronic components and push them upward to prevent the electronic components from sticking to the surface of the electroplating drum. The top of the cleaning head is a hemispherical structure and is made of flexible material to prevent damage to the electronic components.

[0009] Further, the lifting member includes two vertically arranged lifting rods, the top ends of the two lifting rods are integrally provided with bifurcated rods, the top ends of the bifurcated rods are provided with abutment joints, the upper part of the abutment joints is cut off to form abutment arc surface, the abutment arc surface is used to contact with the inclined surface of the advance arc part, so that the entire lifting member moves downward, and then the abutment arc surface contacts with the outer surfaces of the advance arc part and the delay arc part, so that the entire lifting plate and the cleaning head move downward, and the cleaning head is separated from the electroplating drum without the two contacting; A fixed plate is provided on the inner side of the bottom of the side frame, and a return spring is sleeved on the lifting member. The upper and lower ends of the return spring are respectively in contact with the lifting guide plate and the fixed plate. There is a distance between the bottom end of the lifting member and the fixed plate so that the lifting member can move downward under the action of the driving disk.

[0010] Two sets of lifting rails are symmetrically arranged on the inner side of the side frame, and a lifting slider is installed on the lifting rod. The lifting slider is slidably connected to the lifting rail, and a limiting rubber block is arranged above the lifting rail to guide the up and down movement of the lifting member to make it more stable, and the limiting rubber block can limit the rising height of the lifting member and limit it.

[0011] Furthermore, the outer surfaces of the advance arc portion and the delay arc portion are both designed in an arc-shaped structure, wherein the axis of one side of the delay arc portion close to the advance arc portion coincides with the axis of the driving column, and the arc a of the delay arc portion is not less than π / 3rad; For different regular polygons, a is different, where a is 2π / Nrad (N is the number of sides of the polygonal cylinder). The driving plate rotates with the driving wheel. When the advance arc portion contacts the abutment head, the driving column has not yet moved into the intermittent groove, and the intermittent wheel will not drive the electroplating drum to move. When the delay arc contacts the abutment head, the driving column is just placed in the intermittent groove, and the cleaning head is away from the plating drum, so as not to interfere with the normal rotation of the plating drum; the curvature of the delay arc is determined according to actual needs, but it cannot be less than π / 3rad, which makes the entire lifting plate and the cleaning head away from the plating drum when the plating drum rotates. Only after it rotates once will the cleaning head move up and clean its liquid holes.

[0012] Furthermore, the mounting sleeve shaft is penetrated by mounting holes on the left and right sides, and the mounting holes are connected to the inner cavity of the electroplating drum; The dispersion mechanism includes a dispersion shaft rotatably mounted in two mounting sleeve shafts, the two ends of the dispersion shaft are connected to the two side frames through bearing seats, the dispersion shaft is placed in the inner cavity of the electroplating drum and is provided with three groups of dispersion members distributed in a circumferential array, the dispersion members are in sliding contact with the inner wall of the electroplating drum, and the dispersion leaves, under the action of the dispersion shaft, make the electronic parts form turbulence in the electroplating drum, reduce the aggregation of the electronic parts, so that the electronic parts are stirred more evenly, so as to improve the uniformity of the surface coating of the electronic parts and reduce the sticking of the products, and the dispersion leaves are in contact with the inner wall of the electroplating drum, so as to scrape and clean the sundries attached to it, and prevent the electronic parts from sticking to the inner wall; One end of the dispersion shaft passes through the side frame and is placed outside it, and a driven toothed belt pulley is installed on this end of the dispersion shaft, and a driving toothed belt pulley is installed on one end of the driving main shaft. The driven toothed belt pulley and the driving toothed belt pulley are connected by a toothed belt. When the driving main shaft causes the electroplating drum to rotate, it can cause the dispersion shaft to rotate accordingly, and the rotation direction of the dispersion shaft is opposite to that of the electroplating drum, thereby reducing the aggregation of electronic components and allowing the electronic components to be stirred more evenly.

[0013] The dispersing member comprises connecting parts fixed at both ends of the dispersing shaft, a telescopic part is arranged on the side of the connecting part away from the dispersing shaft, a telescopic cavity is formed by the opening design at the lower end of the telescopic part, a scraper plate is arranged in the telescopic cavity to slide up and down, a plurality of linearly distributed abutment springs are abutted between the top of the scraper plate and the top of the telescopic cavity, the scraper plate can scrape up and down in the telescopic cavity, and cooperates with the plurality of abutment springs to make it have a tendency to move outward, so that when it rotates, the scraper plate can always fit on the surface of the electroplating drum, so that the scraper plate can push the electronic accessories to move and make them roll up and down; The scraper plate is provided with a plurality of equally spaced limit grooves, and the telescopic part is threadedly connected with a plurality of equally spaced limit screws, and the limit screws extend into the limit grooves. When in use, the scraper plate is inserted into the telescopic cavity, and then the limit screws are driven into the telescopic part so that the limit screws are placed in the limit grooves. The scraper plate can be installed on the telescopic part without falling off.

[0014] The bottom end of the scraper plate is provided with an arc portion near the dispersion shaft, and the six edges of the inner wall of the electroplating drum are chamfered to form a moving arc surface. The curvature of the arc portion is consistent with the curvature of the moving arc surface. When the scraper plate moves to the moving arc surface, the arc portion contacts the moving arc surface, and the two slide in close contact without leaving a gap, which enables it to push the electronic accessories to move without causing jamming and other phenomena, thereby avoiding damage to the electronic accessories; The rest of the scraper plate is provided with a horizontal portion, and the plane portion is completely in contact with the inner wall of the electroplating drum. When the scraper plate contacts the inner wall of the electroplating drum, the horizontal portion can always contact the inner wall and can scrape off the attachments on the inner wall.

[0015] Beneficial effects of the present invention: 1. By arranging driving components at both ends of the electroplating drum, the driving components are connected to the external driving device through the driving main shaft, and cooperate with the dispersion mechanism arranged in the electroplating drum, and the driving main shaft is also connected to the dispersion mechanism, and the dispersion mechanism rotates in the opposite direction to the electroplating drum, so that the electronic parts form turbulence in the electroplating drum, reduce the aggregation of the electronic parts, and make the electronic parts be stirred more evenly, so as to improve the uniformity of the surface coating of the electronic parts and reduce the sticking of the products; 2. By arranging a lifting plate and multiple cleaning heads under the electroplating drum, the cleaning heads can slide up and down and be inserted into the electroplating drum, so as to dredge the liquid holes on its surface to prevent blockage and poor circulation of the internal and external plating liquids, and can contact and push the internal electronic parts upward to prevent the electronic parts from sticking to the surface of the electroplating drum; 3. The lifting plate is connected to the driving disk through the lifting member, and the driving disk is provided with an advance arc portion and a delay arc portion, and the driving disk is connected to the driving assembly. The lifting plate can move downward in advance when the electroplating drum rotates, and move up again after it stops, which can clean the electroplating drum without interfering with the normal rotation of the electroplating drum; 4. By setting a dispersion shaft and a dispersion member in the electroplating drum, which rotates in the opposite direction to the electroplating drum, the scraper plate in the dispersion member can always fit against the inner wall of the electroplating drum under the action of the abutment spring, and can push the electronic accessories to move and roll up and down, so that the electronic accessories form turbulence in the electroplating drum, reducing the aggregation of electronic accessories, so that the electronic accessories are dispersed more evenly, so as to improve the uniformity of the surface coating of the electronic accessories and reduce product sticking. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of a surface treatment device for processing electronic parts proposed by the present invention; Figure 2 for Figure 1 Structural schematic diagram of the middle and side frames, the electroplating barrel mechanism, the positioning mechanism and the cleaning mechanism; Figure 3 for Figure 2 The schematic diagram of the structure of the electric cylinder; Figure 4 for Figure 2 Structural diagram of the dispersion mechanism and the cleaning structure; Figure 5 for Figure 4 Schematic diagram of the structure of the middle drive assembly and the dispersion mechanism; Figure 6 for Figure 4 A schematic diagram of the structure of the cleaning mechanism and the driving assembly; Figure 7 It is a position relationship diagram of the driving wheel, the delayed arc portion, and the advanced arc portion in the present invention; Figure 8 It is a side view schematic diagram of the lifting member in the cleaning mechanism; Fig. 9 for Figure 2 Schematic cross-sectional view of ; Fig.10 for Fig. 9 A partial enlarged schematic diagram of the central disperser.

[0017] Numbers in the figure: 1, electroplating tank; 2, side frame; 3, electroplating cylinder mechanism; 31, electroplating cylinder; 311, polygonal cylinder; 312, side plate; 313, cover plate; 314, liquid hole; 315, mounting sleeve; 316, moving arc surface; 32, driving assembly; 321, driving wheel; 322, protrusion; 323, intermittent wheel; 324, intermittent groove; 325, driving column; 326, limiting plate; 4, cleaning mechanism; 41, driving plate; 411, delay arc; 412, advance arc; 42, lifting member; 421, lifting rod; 422, fork Rod; 423, abutment; 424, abutment arc surface; 43, reset spring; 44, lifting plate; 441, lifting guide plate; 45, cleaning head; 46, lifting track; 47, lifting slider; 48, limiting rubber block; 5, driving spindle; 6, dispersion mechanism; 61, dispersion shaft; 62, dispersing member; 621, connecting part; 622, telescopic part; 623, abutment spring; 624, scraper plate; 625, limiting screw; 626, limiting groove; 627, plane part; 628, arc part; 63, driven toothed belt pulley; 64, toothed belt; 65, driving toothed belt pulley. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] Reference Figure 1-10, a surface treatment device for processing electronic parts, comprising an electroplating tank 1, two sets of side frames 2 are symmetrically placed at both ends of the electroplating tank 1, a plating drum mechanism 3 is rotatably installed between the two sets of side frames 2, the plating drum mechanism 3 comprises an electroplating drum 31 rotatably installed between the two side frames 2 through a bearing, and a driving spindle 5 is rotatably installed between the two side frames 2 through a bearing, two sets of driving components 32 are installed at both ends of the driving spindle 5, and the driving component 32 is connected to the electroplating drum 31, a dispersing mechanism 6 is rotatably installed inside the electroplating drum 31, and the dispersing mechanism 6 is connected to the driving spindle 5; A cleaning mechanism 4 for cleaning the electroplating drum 31 is installed between the two sets of side frames 2. The cleaning mechanism 4 is connected to the driving assembly 32. One end of the driving shaft is extended outward and placed outside one of the side frames 2. The driving shaft is connected to an external driving device to provide power.

[0020] The electroplating drum 31 comprises a polygonal cylinder 311 of a regular hexagonal structure, a material port for adding materials is provided on one side of the polygonal cylinder 311, and a cover plate 313 is installed in the material port through a hinge and a door lock, and multiple evenly distributed liquid holes 314 are provided on multiple sides of the polygonal cylinder 311 and the cover plate 313; The polygonal cylinder 311 is a regular polygonal structure, and the number of sides can be changed accordingly as needed. In the present invention, a regular hexagonal structure is adopted. The liquid through hole 314 is used for the plating liquid in the electroplating tank 1 to enter the inside of the electroplating cylinder 31 and contact with the electronic parts inside, so as to perform electroplating treatment on the surface thereof. A side plate 312 is fixed to each end of the polygonal tube 311. A mounting sleeve 315 is welded to the outward surface of the two side plates 312. The two mounting sleeves 315 are rotatably mounted on the two side frames 2 through bearings. The electroplating drum 31 can rotate accordingly under the action of the driving component 32, so that the plating liquid can continuously and greatly flush the surface of the electronic parts and fully exchange contacts, and at the same time, the distribution of electric lines in the rotating electroplating tank 1 is more uniform, so as to finally achieve uniform plating and good quality of the plated parts.

[0021] The driving assembly 32 includes two groups of intermittent wheels 323 respectively fixed on the outer surfaces of the two side plates 312, and the intermittent wheels 323 are connected to the mounting sleeve shaft 315, and a plurality of intermittent grooves 324 arranged in a circumferential array are formed on the intermittent wheels 323; Two sets of driving wheels 321 are symmetrically arranged at both ends of the driving main shaft 5. The outer ring protrusion of the driving wheel 321 forms a protrusion 322. A driving column 325 is installed on the side of the protrusion 322 close to the side plate 312. The entire driving assembly 32 is an intermittent mechanism. The driving wheel 321 rotates by the rotation of the driving main shaft 5, and then the intermittent wheel 323 deflects a certain angle each time through the driving column 325, so that the electroplating drum 31 rotates. The number of intermittent grooves 324 is the same as the number of sides of the polygonal drum 311. A limiting wheel 326 is respectively provided on the front side of the two groups of driving wheels 321. A part of the limiting wheel 326 is cut off to form a notch. A plurality of fan-shaped grooves are opened in a ring shape on the intermittent wheel 323, and the intermittent grooves 324 and the fan-shaped grooves are alternately distributed. When the driving column 325 and the intermittent groove 324 slide, the driving column 325 pushes the intermittent wheel 323 to rotate. At this time, the intermittent wheel 323 rotates along the arc groove of the limiting wheel 326, and the limiting wheel 326 and the fan-shaped groove rotate. At this time, the intermittent wheel 323 is in a locked state and cannot rotate.

[0022] The cleaning mechanism 4 includes two sets of driving disks 41 symmetrically mounted at both ends of the driving main shaft 5. The outer ring of the driving disk 41 is widened to form a delay arc portion 411 and an advance arc portion 412. The advance arc portion 412 contacts the delay arc portion 411. The arc rates of the outer rings of the delay arc portion 411 and the advance arc portion 412 are consistent. The two side frames 2 are provided with lifting members 42 that slide up and down on the inner side, respectively. The top of the lifting member 42 is in sliding contact with the advance arc portion 412 and the delay arc portion 411 of the driving disk 41. A lifting plate 44 is fixed between the two lifting members 42 through a lifting guide plate 441. A plurality of evenly distributed cleaning heads 45 are provided above the lifting plate 44. The plurality of cleaning heads 45 correspond to the plurality of liquid holes 314 one by one. The cleaning head 45 can intermittently move up and down under the action of the lifting member 42, and when it is at the top, the top of the cleaning head 45 is placed inside the electroplating drum 31 through the liquid hole 314, so that the liquid hole 314 on its surface can be unblocked to prevent blockage that causes poor circulation of the plating liquid inside and outside, and can contact the internal electronic components and push them upward to prevent the electronic components from sticking to the surface of the electroplating drum 31. The top of the cleaning head 45 is a hemispherical structure and is made of flexible material to prevent damage to the electronic components.

[0023] The lifting member 42 includes two vertically arranged lifting rods 421, the top ends of the two lifting rods 421 are integrally provided with bifurcated rods 422, the top ends of the bifurcated rods 422 are provided with abutment joints 423, the upper part of the abutment joints 423 is cut off to form abutment arc surface 424, the abutment arc surface 424 is used to contact the inclined surface of the advance arc portion 412, so that the entire lifting member 42 moves downward, and then the abutment arc surface 424 contacts the outer surfaces of the advance arc portion 412 and the delay arc portion 411, so that the entire lifting plate 44 and the cleaning head 45 move downward, and the cleaning head 45 is separated from the electroplating drum 31 without the two contacting; A fixed plate is provided on the inner side of the bottom of the side frame 2, and a return spring 43 is sleeved on the lifting member 42. The upper and lower ends of the return spring 43 are respectively abutted against the lifting guide plate 441 and the fixed plate. There is a distance between the bottom end of the lifting member 42 and the fixed plate so that the lifting member 42 can move downward under the action of the driving disk 41.

[0024] Two sets of lifting rails 46 are symmetrically arranged on the inner side of the side frame 2, and a lifting slider 47 is installed on the lifting rod 421. The lifting slider 47 is slidably connected to the lifting rail 46, and a limiting rubber block 48 is arranged above the lifting rail 46 to guide the up and down movement of the lifting member 42 to make it more stable, and the limiting rubber block 48 can limit the rising height of the lifting member 42 and limit it.

[0025] The outer surfaces of the advance arc portion 412 and the delay arc portion 411 are both designed in an arc-shaped structure, wherein the axis of the delay arc portion 411 close to the advance arc portion 412 coincides with the axis of the driving column 325, and the arc a of the delay arc portion 411 is not less than π / 3rad; For different regular polygons, a is different, where a is 2π / Nrad (N is the number of sides of the polygonal cylinder 311). The driving plate 41 rotates together with the driving wheel 321. When the advance arc portion 412 contacts the abutment head 423, the driving column 325 has not yet moved into the intermittent groove 324, and the intermittent wheel 323 will not drive the electroplating cylinder 31 to move. When the time-delay arc portion 411 contacts the abutment portion 423 , the driving column 325 is just placed in the intermittent groove 324 , and the cleaning head 45 is away from the electroplating drum 31 , so as not to interfere with the normal rotation of the electroplating drum 31 ; The arc of the delay arc 411 is determined according to actual needs, but it cannot be less than π / 3rad, so that when the electroplating drum 31 rotates, the entire lifting plate 44 and the cleaning head 45 are away from the electroplating drum 31. After it rotates once, the cleaning head 45 will move up and clean its liquid hole 314; When the electroplating drum 31 stops, the delayed arc portion 411 will separate from the abutting head 423 , and at this time the lifting plate 44 can drive the cleaning head 45 to be plugged into the liquid through hole 314 .

[0026] The installation sleeve shaft 315 is formed with installation holes on the left and right sides, and the installation holes are connected to the inner cavity of the electroplating drum 31; The dispersion mechanism 6 includes a dispersion shaft 61 rotatably mounted in two mounting sleeve shafts 315. The two ends of the dispersion shaft 61 are connected to the two side frames 2 through bearing seats. The dispersion shaft 61 is placed in the inner cavity of the electroplating drum 31 and is provided with three groups of dispersion members 62 distributed in a circumferential array. The dispersion members 62 are in sliding contact with the inner wall of the electroplating drum 31. Under the action of the dispersion shaft 61, the dispersion leaves 62 cause the electronic parts to form turbulence in the electroplating drum 31, reduce the aggregation of the electronic parts, and thus make the electronic parts more evenly stirred, so as to improve the uniformity of the surface coating of the electronic parts and reduce the sticking of the products. The dispersion leaves 62 are in contact with the inner wall of the electroplating drum 31, so as to scrape and clean the debris attached thereto, and prevent the electronic parts from sticking to the inner wall. One end of the dispersion shaft 61 passes through the side frame 2 and is placed outside the side frame 2, and a driven toothed belt 64 wheel 63 is installed on the end of the dispersion shaft 61, and a driving toothed belt wheel 65 is installed on one end of the driving main shaft 5. The driven toothed belt 64 wheel 63 is connected to the driving toothed belt wheel 65 through a toothed belt 64. When the driving main shaft 33 rotates the electroplating drum 31, it can make the dispersion shaft 61 rotate accordingly, and the rotation direction of the dispersion shaft 61 is opposite to that of the electroplating drum 31, thereby reducing the aggregation of electronic components and making the electronic components more evenly dispersed.

[0027] The dispersing member 62 includes connecting parts 621 fixed at both ends of the dispersing shaft 61, and a telescopic part 622 is provided on the side of the connecting part 621 away from the dispersing shaft. The lower end opening of the telescopic part 622 is designed to form a telescopic cavity, and a scraper plate 624 is provided in the telescopic cavity to slide up and down. A plurality of linearly distributed abutment springs 623 abut between the top of the scraper plate 624 and the top of the telescopic cavity. The scraper plate 624 can scrape up and down in the telescopic cavity, and cooperate with the plurality of abutment springs 623 to make it have a tendency to move outward, so that when it rotates, the scraper plate 624 can always fit the surface of the electroplating drum 31, so that the scraper plate 624 can push the electronic accessories to move and make them roll up and down; The scraper plate 623 is provided with a plurality of equally spaced limit grooves 626, and the telescopic part 622 is threadedly connected with a plurality of equally spaced limit screws 625, and the limit screws 625 extend into the limit grooves 626. When in use, the scraper plate 624 is inserted into the telescopic cavity, and then the limit screws 625 are driven into the telescopic part so that the limit screws 625 are placed in the limit grooves 626. The scraper plate 624 can be installed on the telescopic part 622 without falling off.

[0028] The bottom end of the scraper plate 624 is provided with an arc portion 628 near the dispersion shaft 61. The six edges of the inner wall of the electroplating drum 31 are all chamfered to form a moving arc surface 316. The curvature of the arc portion 628 is consistent with the curvature of the moving arc surface 316. When the scraper plate 624 moves to the moving arc surface 316, the arc portion 628 is in contact with the moving arc surface 316, and the two slide in close contact without leaving a gap, which enables it to push the electronic accessories to move without causing jamming and other phenomena, thereby avoiding damage to the electronic accessories. The rest of the scraper plate 624 is provided with a horizontal portion 627, and the flat portion 627 is completely in contact with the inner wall of the electroplating drum 31. When the scraper plate 624 contacts the inner wall of the electroplating drum 31, the horizontal portion 627 can always contact the inner wall and scrape off the attachments on the inner wall. Working principle: In actual use, the electronic parts to be electroplated are placed in the electroplating drum 31, and the electroplating tank 1 is provided with a plating solution for electroplating, and the power supply of the electroplating tank 1 and the power supply of the driving device (the driving device is a power source such as a motor) are turned on; The driving device will drive the driving spindle 5 to rotate continuously, so that the driving wheel 321 installed on the driving spindle 5 rotates together, and every time the driving wheel 321 rotates one circle, the intermittent wheel 323 will rotate 60 degrees, so that the electroplating drum 31 rotates 60 degrees accordingly, so that the electroplating drum 31 can rotate continuously, and will pause for a period of time after rotating a certain angle, so that the external plating solution can enter the electroplating drum 31 through the liquid through hole 314, thereby improving the alternating effect of the internal and external plating solutions; When the driving main shaft 5 rotates the electroplating drum 31, it can make the dispersion shaft 61 rotate accordingly, and the rotation direction of the dispersion shaft 61 is opposite to that of the electroplating drum 31. The dispersion member 62 rotates accordingly under the action of the dispersion shaft 61, and the scraper plate 624 in the dispersion member 62 can always fit the inner wall of the electroplating drum 31 under the action of the abutment spring 623. In this way, the scraper plate 624 can push the electronic parts to move and roll up and down, so that the electronic parts form turbulence in the electroplating drum 31, reduce the aggregation of the electronic parts, and make the electronic parts dispersed more evenly, so as to improve the uniformity of the surface coating of the electronic parts and reduce the sticking of products; When the driving wheel 321 rotates, the driving disc 41 installed on the outside of the driving wheel 321 will also rotate accordingly, and when the driving disc 41 rotates, the advance arc portion 412 arranged on the driving disc 41 will first contact the abutting arc surface 424 of the abutting head 423 and make it move downward. After a period of time, the abutting arc surface 424 contacts the delayed arc portion 411. At this time, the driving column 325 on the driving wheel 321 is placed in the intermittent groove 324 and contacts it. Then the driving column 325 drives the intermittent wheel 323 to rotate 60 degrees, that is, the electroplating drum 31 rotates 60 degrees. In this process, the abutting arc surface 424 is always in contact with the delayed arc portion 411, and the lifting plate 44 and the cleaning head 45 are kept away from the electroplating drum 31. When the electroplating drum 31 rotates 60 degrees, the time-delay arc portion 411 does not contact the abutting arc surface 424. At this time, the lifting plate 44 and the cleaning head 45 move upward under the action of the reset spring 43, so that the cleaning head 45 rises and is inserted into the liquid through hole 314, so as to clean and prevent it from being blocked. After the electroplating drum 31 rotates 60 degrees, the cleaning head 45 rises once, and before the electroplating drum 31 rotates, the cleaning head 45 will move downward in advance. The overall process is: the cleaning head 45 moves downward--the electroplating drum 31 rotates--the electroplating drum 31 is positioned and stops rotating--the cleaning head 45 moves upward; Repeat the above operation to clean each side of the plating drum 31 (by extending the arc length of the delay arc 411, the rising time of the cleaning head 45 can be appropriately increased, so that the plating drum 31 will move upward to clear the blockage after rotating for a period of time. There is a certain time difference between the two, so that the plating solutions in the plating tank 1 and the plating drum 31 can be fully exchanged).

[0029] By arranging driving components 32 at both ends of the electroplating drum 31, the driving components 32 are connected to an external driving device through a driving main shaft 5, and cooperate with a dispersing mechanism 6 arranged in the electroplating drum 31, and the driving main shaft 5 is also connected to the dispersing mechanism 6, and the dispersing mechanism 6 rotates in the opposite direction to the electroplating drum 31, so that the electronic parts form turbulence in the electroplating drum 31, reducing the aggregation of the electronic parts, so that the electronic parts are stirred more evenly, so as to improve the uniformity of the surface coating of the electronic parts and reduce the sticking of the products; By arranging a lifting plate 44 and a plurality of cleaning heads 45 under the electroplating drum 31, the cleaning heads 45 can be slid up and down and inserted into the electroplating drum 31, so as to clear the liquid holes 314 on the surface thereof, prevent blockage resulting in poor flow of the plating solution inside and outside, and can contact and push the electronic components inside upwards, so as to prevent the electronic components from sticking to the surface of the electroplating drum 31; The lifting plate 44 is connected to the driving disk 41 through the lifting member 42, and the driving disk 41 is provided with an advance arc portion 412 and a delay arc portion 411, and the driving disk 41 is connected to the driving assembly 32. The lifting plate 44 can move downward in advance when the plating drum 31 rotates, and move up again after it stops, so that the plating drum 31 can be cleaned without interfering with the normal rotation of the plating drum 31.

[0030] By setting a dispersion shaft 61 and a dispersion member 62 in the electroplating drum 31, which rotate in the opposite direction to the electroplating drum 31, the scraper plate 624 in the dispersion member 62 can always fit against the inner wall of the electroplating drum 31 under the action of the abutment spring 623, and can push the electronic accessories to move and roll up and down, so that the electronic accessories form turbulence in the electroplating drum 31, reduce the aggregation of electronic accessories, and thus make the electronic accessories dispersed more evenly, so as to improve the uniformity of the surface coating of the electronic accessories and reduce product adhesion.

[0031] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface treatment device for electronic parts processing, characterized in that: The electroplating tank (1) comprises two sets of side frames (2) symmetrically placed at both ends of the electroplating tank (1), a plating drum mechanism (3) rotatably mounted between the two sets of side frames (2), the plating drum mechanism (3) comprising a plating drum (31) rotatably mounted between the two side frames (2) via a bearing, a driving spindle (5) rotatably mounted between the two side frames (2) via a bearing, two sets of driving components (32) are mounted at both ends of the driving spindle (5), and the driving components (32) are connected to the electroplating drum (31), a dispersing mechanism (6) is rotatably mounted inside the electroplating drum (31), and the dispersing mechanism (6) is connected to the driving spindle (5); A cleaning mechanism (4) for cleaning the electroplating drum (31) is installed between the two groups of side frames (2), and the cleaning mechanism (4) is connected to the driving assembly (32).

2. The surface treatment device for electronic parts processing according to claim 1, characterized in that: The electroplating drum (31) comprises a polygonal cylinder (311) of a regular hexagonal structure, a material port for adding material is provided on one side of the polygonal cylinder (311), a cover plate (313) is installed in the material port via a hinge and a door lock, and multiple side surfaces of the polygonal cylinder (311) and the cover plate (313) are provided with multiple evenly distributed liquid holes (314); A side plate (312) is fixed to each of the two ends of the polygonal tube (311); mounting sleeve shafts (315) are welded to the outward surfaces of the two side plates (312); and the two mounting sleeve shafts (315) are rotatably mounted on the two side frames (2) via bearings.

3. The surface treatment device for electronic parts processing according to claim 2, characterized in that: The driving assembly (32) comprises two groups of intermittent wheels (323) respectively fixed on the outer surfaces of the two side plates (312), and the intermittent wheels (323) are connected to the mounting sleeve shaft (315), and the intermittent wheels (323) are provided with a plurality of intermittent grooves (324) arranged in a circumferential array; Two sets of driving wheels (321) are symmetrically arranged at both ends of the driving main shaft (5); a protruding portion (322) is formed on the outer ring protruding portion of the driving wheel (321); and a driving column (325) is installed on a side of the protruding portion (322) close to the side plate (312); The front sides of the two groups of driving wheels (321) are respectively provided with limiting wheels (326), a portion of which is cut away to form a notch, and the intermittent wheel (323) is provided with a plurality of fan-shaped grooves in an annular shape, and the intermittent grooves (324) and the fan-shaped grooves are alternately distributed.

4. The surface treatment device for electronic parts processing according to claim 3, characterized in that: The cleaning mechanism (4) comprises two sets of drive discs (41) symmetrically mounted at two ends of the drive main shaft (5); the outer ring of the drive disc (41) is widened to form a delay arc portion (411) and an advance arc portion (412); the advance arc portion (412) is in contact with the delay arc portion (411); and the arc rates of the outer rings of the delay arc portion (411) and the advance arc portion (412) are consistent; The two side frames (2) are provided with lifting members (42) on the inner side thereof so as to slide up and down respectively. The top of the lifting member (42) is in sliding contact with the advance arc portion (412) and the delay arc portion (411) of the driving disk (41). A lifting plate (44) is fixed between the two lifting members (42) via a lifting guide plate (441). A plurality of evenly distributed cleaning heads (45) are provided above the lifting plate (44). The plurality of cleaning heads (45) correspond one-to-one to the plurality of liquid through holes (314), respectively.

5. The surface treatment device for electronic parts processing according to claim 4, characterized in that: The lifting member (42) comprises two vertically arranged lifting rods (421), the top ends of the two lifting rods (421) are integrally provided with bifurcated rods (422), the top ends of the bifurcated rods (422) are provided with abutment joints (423), and the upper portion of the abutment joints (423) is cut away to form abutment arc surfaces (424); A fixing plate is provided on the inner side of the bottom of the side frame (2); a return spring (43) is sleeved on the lifting member (42); upper and lower ends of the return spring (43) are respectively in contact with the lifting guide plate (441) and the fixing plate; Two sets of lifting rails (46) are symmetrically arranged front and back on the inner side of the side frame (2), and a lifting slider (47) is installed on the lifting rod (421). The lifting slider (47) is slidably connected to the lifting rail (46), and a limiting rubber block (48) is arranged above the lifting rail (46).

6. The surface treatment device for electronic parts processing according to claim 5, characterized in that: The outer surfaces of the advance arc portion (412) and the delay arc portion (411) are both designed to be arc-shaped structures, wherein the axis of one side of the delay arc portion (411) close to the advance arc portion (412) coincides with the axis of the drive column (325), and the arc a of the delay arc portion (411) is not less than π / 3rad.

7. The surface treatment device for electronic parts processing according to claim 2, characterized in that: The mounting sleeve shaft (315) is penetrated by mounting holes on the left and right sides, and the mounting holes are in communication with the inner cavity of the electroplating drum (31); The dispersion mechanism (6) comprises a dispersion shaft (61) rotatably mounted in two mounting sleeve shafts (315), the two ends of the dispersion shaft (61) being connected to two side frames (2) via bearing seats, the dispersion shaft (61) being placed in the inner cavity of the electroplating drum (31) and having three groups of dispersion members (62) distributed in a circumferential array, the dispersion members (62) being in sliding contact with the inner wall of the electroplating drum (31); One end of the dispersion shaft (61) passes through the side frame (2) and is placed outside the side frame (2), and one end of the dispersion shaft (61) is mounted with a driven toothed belt wheel (63), and one end of the driving main shaft (5) is mounted with a driving toothed belt wheel (65), and the driven toothed belt wheel (63) and the driving toothed belt wheel (65) are connected via a toothed belt (64).

8. The surface treatment device for electronic parts processing according to claim 7, characterized in that: The dispersing member (62) comprises connecting parts (621) fixed at both ends of the dispersing shaft (61), a telescopic part (622) is provided on the side of the connecting part (621) away from the dispersing shaft, a telescopic cavity is formed at the lower end opening of the telescopic part (622), a scraper plate (624) is provided in the telescopic cavity to slide up and down, and a plurality of linearly distributed abutment springs (623) are abutted between the top of the scraper plate (624) and the top of the telescopic cavity; The scraper plate (624) is provided with a plurality of equally spaced limiting grooves (626), the telescopic portion (622) is threadedly connected with a plurality of equally spaced limiting screws (625), and the limiting screws (625) extend into the limiting grooves (626).

9. The surface treatment device for electronic parts processing according to claim 8, characterized in that: The bottom end of the scraper plate (624) is provided with an arc (628) near the dispersion shaft (61); six edges of the inner wall of the electroplating drum (31) are chamfered to form a moving arc surface (316); the curvature of the arc portion (628) is consistent with the curvature of the moving arc surface (316); The remaining portion of the scraper plate (624) is provided with a horizontal portion (627), and the plane portion (627) is completely in contact with the inner wall of the electroplating drum (31).

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