Three-dimensional heat transfer device
By designing a liquid-tight chamber and an extended thermal structure in a three-dimensional heat transfer device, cooling fluid flows into the heat pipe along the gap of the extended thermal structure to dissipate heat, solving the problem of insufficient heat dissipation efficiency of the existing device and achieving more efficient heat transfer and heat dissipation effects .
Patent Information
- Application Number
- CN202310819850.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-05
- Publication Date
- 2025-01-07
AI Technical Summary
The existing three-dimensional heat transfer device has insufficient heat dissipation efficiency and has not fully exerted the heat dissipation effect.
A three-dimensional heat transfer device is designed, including a liquid-tight chamber formed by the first and second heat-conducting shells, equipped with an extended thermal structure and a heat pipe, and the cooling fluid flows into the heat pipe through the extended thermal structure gap to dissipate heat, and passes through the capillary structure. Reflow improves heat absorption and heat dissipation efficiency.
By optimizing the flow path and heat transfer method of the cooling fluid, the heat dissipation efficiency is significantly improved, the vaporization and condensation speed of the cooling fluid is enhanced, and the overall heat dissipation performance is improved.
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Figure CN119268421A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a heat transfer device, in particular to a three-dimensional heat transfer device. Background Art
[0002] The technical principle of the heat spreader is similar to that of the heat pipe, but there is a difference in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat spreader is conducted on a two-dimensional surface, so it is more efficient. Specifically, the heat spreader mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone and vaporizes and rapidly expands to the entire cavity. Heat is released in the condensation zone and condenses into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure to form a cooling cycle.
[0003] Generally speaking, most of the temperature spreaders and heat pipes operate independently, resulting in only planar or linear heat transfer for each temperature spreader or heat pipe, rather than integrated three-dimensional heat transfer, so that the heat dissipation effect has not been fully exerted. At present, some manufacturers have integrated temperature spreaders and heat pipes to produce heat transfer devices that can transfer heat in three dimensions. However, the heat transfer efficiency of current three-dimensional heat transfer devices is still insufficient, making the heat dissipation efficiency not meet the needs of users. Therefore, how to further improve the heat dissipation efficiency of three-dimensional heat transfer devices is one of the problems that R&D personnel should solve. Summary of the invention
[0004] The present invention provides a three-dimensional heat transfer device to further improve the heat dissipation efficiency of the three-dimensional heat transfer device.
[0005] An embodiment of the present invention discloses a three-dimensional heat transfer device, which includes:
[0006] a first heat-conducting shell;
[0007] a second heat-conducting shell, mounted on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber, the second heat-conducting shell comprises a bottom plate and a heat-conducting convex structure, the heat-conducting convex structure protrudes from the bottom plate in a direction away from the first heat-conducting shell, the bottom plate has a first inner surface, the heat-conducting convex structure has a second inner surface, the first inner surface and the second inner surface face the first heat-conducting shell;
[0008] At least one extended heat-conducting structure is located in the liquid-tight chamber and is disposed on the heat-conducting convex structure, and the at least one extended heat-conducting structure has a top surface, and the top surface faces the first heat-conducting shell; and
[0009] At least one first heat pipe and at least one second heat pipe are arranged in the first heat-conducting shell, the at least one first heat pipe is against the first inner surface, and the at least one second heat pipe is against the second inner surface. One end of the at least one first heat pipe and one end of the at least one second heat pipe each have an opening and at least one notch, the opening is connected to the liquid-tight chamber, the at least one notch is located at the opening, and the at least one notch is connected to the opening, the at least one notch faces the at least one extended heat-conducting structure and is connected to the gap between the at least one extended heat-conducting structure, so that after the cooling fluid is vaporized, it can flow along the gap between the at least one extended heat-conducting structure to the at least one notch, and then flow into the at least one first heat pipe and the at least one second heat pipe through the at least one notch to dissipate heat.
[0010] The above-mentioned three-dimensional heat transfer device, wherein the at least one notch of the at least one first heat pipe and the at least one notch of the at least one second heat pipe each have a notch surface, the two notch surfaces face the first inner surface and the second inner surface respectively, and the distance from the two notch surfaces to the second inner surface is greater than the distance from the top surface to the second inner surface.
[0011] The above-mentioned three-dimensional heat transfer device, wherein the distance from the notch surface of the at least one notch of the at least one first heat pipe to the second inner surface of the heat-conducting convex structure is equal to the distance from the notch surface of the at least one notch of the at least one second heat pipe to the second inner surface of the heat-conducting convex structure.
[0012] In the above three-dimensional heat transfer device, the first heat-conducting shell has an upper surface, the upper surface faces away from the liquid-tight chamber, and the two notch surfaces are flush with the upper surface, higher than the upper surface, or lower than the upper surface.
[0013] The above-mentioned three-dimensional heat transfer device, wherein the first heat-conducting shell includes a plurality of reinforcement structures, and the first heat-conducting shell has a plurality of through holes, the reinforcement structures and the through holes are located on the upper surface of the first heat-conducting shell, and the reinforcement structures surround the through holes, and the at least one first heat pipe and the at least one second heat pipe respectively pass through the reinforcement structures and are penetrated in the through holes.
[0014] In the above-mentioned three-dimensional heat transfer device, the at least one extended heat-conducting structure includes a metal body portion and a first capillary structure. The first capillary structure is stacked on the metal body portion, and the top surface is located on the first capillary structure.
[0015] In the above-mentioned three-dimensional heat transfer device, the second heat-conducting shell includes an annular side plate, and the annular side plate is connected to the periphery of the bottom plate.
[0016] The above-mentioned three-dimensional heat transfer device further includes multiple first support structures and multiple second support structures. The first heat-conducting shell has a lower surface, and the lower surface is opposite to the upper surface of the first heat-conducting shell. The first support structures protrude from the first inner surface of the bottom plate and abut against the lower surface. The second support structures protrude from the second inner surface of the heat-conducting convex structure and abut against the lower surface, and the at least one extended heat-conducting structure connects to the second support structures.
[0017] The above-mentioned three-dimensional heat transfer device further includes a second capillary structure, a third capillary structure and a plurality of fourth capillary structures, the annular side plate has a third inner surface, the at least one first heat pipe has a first heat pipe inner surface, the at least one second heat pipe has a second heat pipe inner surface, the second capillary structure is stacked on the first inner surface of the bottom plate, the second inner surface of the heat-conducting convex structure, the third inner surface of the annular side plate, the lower surface of the first heat-conducting shell, and the first supporting structures, the third capillary structure is stacked on the second supporting structures, and the fourth capillary structures are respectively stacked on the first heat pipe inner surface of the at least one first heat pipe and the second heat pipe inner surface of the at least one second heat pipe.
[0018] In the above-mentioned three-dimensional heat transfer device, the lengths of the fourth capillary structures are greater than half of the length of the at least one first heat pipe and half of the length of the at least one second heat pipe.
[0019] The above-mentioned three-dimensional heat transfer device further includes a plurality of fifth capillary structures, which are stacked on the second capillary structure and respectively located at the opening of the at least one first heat pipe and the opening of the at least one second heat pipe, and the fourth capillary structure is connected to the second capillary structures through the fifth capillary structures.
[0020] In the above three-dimensional heat transfer device, the second capillary structure and the fourth capillary structures are connected to the fifth capillary structures by metal bonding.
[0021] In the above-mentioned three-dimensional heat transfer device, the first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structures and the fifth capillary structures are selected from the group consisting of metal mesh, fiber and powder sintered body.
[0022] The above-mentioned three-dimensional heat transfer device further comprises a plurality of sixth capillary structures, wherein the sixth capillary structures are located on the first inner surface of the bottom plate and are stacked on the second capillary structure.
[0023] In the above-mentioned three-dimensional heat transfer device, the sixth capillary structures are selected from the group consisting of metal mesh, fiber and powder sintered body.
[0024] In the above-mentioned three-dimensional heat transfer device, the at least one extended heat-conducting structure is in plurality, and the extended heat-conducting structures are parallel to each other.
[0025] According to the three-dimensional heat transfer device of the above embodiment, since the distance from each notch surface of these first heat pipes to the second inner surface of the heat-conducting convex structure and the distance from each notch surface of these second heat pipes to the second inner surface of the heat-conducting convex structure are both greater than the distance from the top surface of these extended heat-conducting structures to the second inner surface of the heat-conducting convex structure, the speed at which the cooling fluid that absorbs the heat from the heat source and evaporates flows from these notches into these first heat pipes and these second heat pipes can be accelerated, thereby improving the heat dissipation efficiency.
[0026] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 FIG. 4 is a schematic three-dimensional diagram of a three-dimensional heat transfer device according to a first embodiment of the present invention.
[0028] Figure 2 for Figure 1 Schematic diagram of the exploded view of the three-dimensional heat transfer device.
[0029] Figure 3 for Figure 1 A three-dimensional cross-sectional schematic diagram of a three-dimensional heat transfer device.
[0030] Figure 4 for Figure 1 A partially enlarged cross-sectional schematic diagram of a three-dimensional heat transfer device.
[0031] Figure 5 for Figure 1 Another partially enlarged cross-sectional schematic diagram of the three-dimensional heat transfer device.
[0032] Figure 6 for Figure 1 A schematic cross-sectional view of a heat pipe of a three-dimensional heat transfer device.
[0033] Figure 7 for Figure 1 A cross-sectional schematic diagram of a three-dimensional heat transfer device.
[0034] Figure 8 FIG. 4 is a schematic three-dimensional diagram of a three-dimensional heat transfer device according to a second embodiment of the present invention.
[0035] Wherein, the reference numerals are:
[0036] 10,10A: Three-dimensional heat transfer device
[0037] 11: First heat-conducting shell
[0038] 111: Upper surface
[0039] 112: Lower surface
[0040] 113:Piercing
[0041] 12: Second heat-conducting shell
[0042] 121: Bottom plate
[0043] 1211: first inner surface
[0044] 122: Ring side panel
[0045] 1221: third inner surface
[0046] 123: Thermally conductive convex structure
[0047] 1231: Second inner surface
[0048] 1232: Heat exchange surface
[0049] 13: Extended thermal conductivity structure
[0050] 131: Metal body part
[0051] 132: First capillary structure
[0052] 133: Top
[0053] 14: First heat pipe
[0054] 141: Inner surface of the first heat pipe
[0055] 15: Second heat pipe
[0056] 151: Inner surface of the second heat pipe
[0057] 161: First support structure
[0058] 162: Second support structure
[0059] 171: Second capillary structure
[0060] 172: The third capillary structure
[0061] 173: Fourth capillary structure
[0062] 174: Fifth capillary structure
[0063] 18: Reinforcement structure
[0064] 19: Sixth capillary structure
[0065] D1~D3: Distance
[0066] L1~L4: Length
[0067] N1, N2: Gap
[0068] N11, N21: Notched surface
[0069] O1, O2: Open
[0070] S: Liquid-tight chamber DETAILED DESCRIPTION
[0071] See also Figures 1 to 3 . Figure 1 FIG. 4 is a schematic three-dimensional diagram of a three-dimensional heat transfer device according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the exploded view of the three-dimensional heat transfer device. Figure 3 for Figure 1 A three-dimensional cross-sectional schematic diagram of a three-dimensional heat transfer device.
[0072] The three-dimensional heat transfer device 10 of this embodiment includes a first heat-conducting shell 11, a second heat-conducting shell 12, a plurality of extended heat-conducting structures 13, a plurality of first heat pipes 14, a plurality of second heat pipes 15, a plurality of first supporting structures 161, a plurality of second supporting structures 162, a first capillary structure 171, a plurality of second capillary structures 172 and a plurality of third capillary structures 173.
[0073] The second heat-conducting shell 12 is installed on the first heat-conducting shell 11 so that the first heat-conducting shell 11 and the second heat-conducting shell 12 together form a liquid-tight chamber S. The liquid-tight chamber S is used to accommodate a cooling fluid (not shown). The cooling fluid is, for example, water or a refrigerant. The second heat-conducting shell 12 includes a bottom plate 121, an annular side plate 122, and a heat-conducting convex structure 123.
[0074] Please refer to Figure 7 . Figure 7 for Figure 1 A cross-sectional schematic diagram of a three-dimensional heat transfer device. The annular side plate 122 is connected to the periphery of the bottom plate 121. The heat-conducting convex structure 123 protrudes from the bottom plate 121 in a direction away from the first heat-conducting shell 11. The bottom plate 121 has a first inner surface 1211. The heat-conducting convex structure 123 has a second inner surface 1231 and a heat exchange surface 1232. The first inner surface 1211 and the second inner surface 1231 face the first heat-conducting shell 11. The heat exchange surface 1232 faces away from the second inner surface 1231 and is used for thermal coupling to a heat source (not shown), so that the cooling fluid located in the liquid-tight chamber S can absorb the heat transferred from the heat source to the heat-conducting convex structure 123 through the heat exchange surface 1232. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media.
[0075] Please also read Figure 4 . Figure 4 for Figure 1 A partially enlarged cross-sectional schematic diagram of a three-dimensional heat transfer device. These extended heat-conducting structures 13 are located in the liquid-tight chamber S and are arranged on the heat-conducting convex structure 123, and these extended heat-conducting structures 13 are parallel to each other. These extended heat-conducting structures 13 can provide the required vapor pressure drop in the liquid-tight chamber S and reduce the high liquid pressure drop caused by the capillary action of the powder sintered capillary structure to improve the heat dissipation efficiency. Each extended heat-conducting structure 13 includes a metal body portion 131 and a first capillary structure 132, and each extended heat-conducting structure 13 has a top surface 133. The first capillary structure 132 is stacked on the metal body portion 131. The top surface 133 is located on the first capillary structure 132, and the top surface 133 faces the first heat-conducting shell 11. By providing the first capillary structure 132, the cooling fluid can absorb the heat from the heat source and evaporate and then flow back through the first capillary structure 132.
[0076] The first heat-conducting shell 11 has an upper surface 111 and a plurality of through holes 113. The upper surface 111 faces away from the liquid-tight chamber S. The through holes 113 are located on the upper surface 111. The first heat pipes 14 and the second heat pipes 15 are disposed through the through holes 113. The first heat pipes 14 abut against the first inner surface 1211 of the bottom plate 121. The second heat pipes 15 abut against the second inner surface 1231 of the heat-conducting convex structure 123.
[0077] Each of the first heat pipes 14 has an opening O1 and two notches N1 at one end, and each of the second heat pipes 15 has an opening O2 and two notches N2 at one end. The openings O1 and O2 are connected to the liquid-tight chamber S. The notches N1 and N2 are located at the openings O1 and O2, respectively, and the notches N1 and N2 are connected to the openings O1 and O2, respectively.
[0078] The notches N1 and N2 are used for cooling fluid to flow into the first heat pipes 14 and the second heat pipes 15. Each notch N1 of the first heat pipes 14 has a notch surface N11, and each notch N2 of the second heat pipes 15 has a notch surface N21. The notch surfaces N11 and N21 face the first inner surface 1211 and the second inner surface 1231, respectively, and the distances D1 and D2 from each notch surface N11 and N21 to the second inner surface 1231 are both greater than the distance D3 from the top surface 131 to the second inner surface 1231.
[0079] In detail, the distance D1 from each notch surface N11 of the notches N1 of the first heat pipes 14 to the second inner surface 1231 is equal to the distance D2 from each notch surface N21 of the notches N2 of the second heat pipes 15 to the second inner surface 1231. In addition, the notch surfaces N11 and N21 are, for example, higher than the upper surface 111 of the first heat-conducting shell 11. In this way, the speed at which the cooling fluid flows into the first heat pipes 14 and the second heat pipes 15 can be accelerated, thereby improving the heat dissipation efficiency.
[0080] See also Figures 3 to 5 . Figure 4 for Figure 1 A partially enlarged cross-sectional schematic diagram of a three-dimensional heat transfer device. Figure 5 for Figure 1 Another partially enlarged cross-sectional schematic diagram of the three-dimensional heat transfer device.
[0081] In this embodiment, since these notches N1 and N2 face these extended heat-conducting structures 13 and are connected to the gaps between these extended heat-conducting structures 13, the cooling fluid can absorb the heat from the heat source and evaporate, and then flow along the gaps between these extended heat-conducting structures 13 to these notches N1 and N2, and then flow into these first heat pipes 14 and these second heat pipes 15 through these notches N1 and N2 to dissipate heat.
[0082] See also Figure 6 and Figure 7 . Figure 6 for Figure 1 The first heat-conducting shell 11 has a lower surface 112. The lower surface 112 faces away from the upper surface 111. The first support structures 161 protrude from the first inner surface 1211 of the bottom plate 121 and abut against the lower surface 112. The second support structures 162 protrude from the second inner surface 1231 of the heat-conducting convex structure 123 and abut against the lower surface 112, and the extended heat-conducting structures 13 are connected to the parts of the second support structures 162.
[0083] The annular side plate 122 has a third inner surface 1221. The first heat pipes 14 each have a first heat pipe inner surface 141. The second heat pipes 15 each have a second heat pipe inner surface 151. The second capillary structure 171 is stacked on the first inner surface 1211 of the bottom plate 121, the second inner surface 1231 of the heat-conducting convex structure 123, the third inner surface 1221 of the annular side plate 122, the lower surface 112 of the first heat-conducting shell 11, and the first support structures 161. The third capillary structure 172 is stacked on the second support structures 162. The fourth capillary structures 173 are respectively stacked on the first heat pipe inner surfaces 141 of the first heat pipes 14 and the second heat pipe inner surfaces 151 of the second heat pipes 15. The fifth capillary structures 174 are stacked on the second capillary structure 171 and are respectively located at the openings O1 of the first heat pipes 14 and the openings O2 of the second heat pipes 15. By providing these capillary structures 171 - 174 , the cooling fluid can absorb the heat of the heat source and evaporate, and then flow back through these capillary structures 171 - 174 .
[0084] In this embodiment, the first capillary structure 132 , the second capillary structure 171 , the third capillary structure 172 , the fourth capillary structures 173 and the fifth capillary structures 174 are selected from the group consisting of metal mesh, fiber and powder sintered body.
[0085] In this embodiment, the second capillary structure 171 and the fourth capillary structures 173 are connected by metal bonding, for example, through the fifth capillary structures 174. The so-called metal bonding means that the two capillary structures are connected by sintering, for example, to increase the speed of the two capillary structures transferring the fluid, thereby improving the heat dissipation efficiency of the three-dimensional heat transfer device 10.
[0086] In this embodiment, the lengths L1 and L2 of the fourth capillary structures 173 are respectively, for example, greater than half of the length L3 of the first heat pipes 14 and half of the length L4 of the second heat pipes 15 .
[0087] In this embodiment, the three-dimensional heat transfer device 10 may further include a plurality of reinforcement structures 18. These reinforcement structures 18 are integrally formed with the first heat-conducting shell 11 by, for example, stamping, computer numerical control (CNC) or forging, and are located on the upper surface 111 of the first heat-conducting shell 11, and these reinforcement structures 18 surround the through holes 113 of the first heat-conducting shell 11. The first heat pipes 14 and the second heat pipes 15 pass through the reinforcement structures 18 and are respectively arranged in the through holes 113. In this way, the first heat pipes 14 and the second heat pipes 15 can be more firmly arranged in the first heat-conducting shell 11 through the reinforcement structures 18. Correspondingly, in the embodiment in which the three-dimensional heat transfer device 10 includes a plurality of reinforcement structures 18, the notch surfaces N11 and N21 can also be, for example, flush with the upper surfaces of the reinforcement structures 18.
[0088] In this embodiment, the distance D1 from each notch surface N11 of the first heat pipes 14 to the second inner surface 1231 of the heat-conducting convex hull structure 123 is equal to the distance D2 from each notch surface N21 of the second heat pipes 15 to the second inner surface 1231 of the heat-conducting convex hull structure 123, but the present invention is not limited thereto. In other embodiments, the distance from each notch surface of the first heat pipes to the second inner surface of the heat-conducting convex hull structure is different from the distance from each notch surface of the second heat pipes to the second inner surface of the heat-conducting convex hull structure.
[0089] In this embodiment, the notch surfaces N11 and N21 are higher than the upper surface 111 of the first heat-conducting shell 11 and flush with the upper surfaces of the reinforcing structures 18, but the present invention is not limited thereto. In other embodiments, the notch surfaces may also be flush with the upper surface of the first heat-conducting shell, or lower than the upper surface of the first heat-conducting shell and flush with the lower surface of the first heat-conducting shell.
[0090] In this embodiment, the first support structures 161, the second support structures 162 and the extended heat-conducting structure 13 are integrally formed with the second heat-conducting shell 12 by, for example, stamping, computer milling, etc., but the present invention is not limited thereto. In other embodiments, the first support structures, the second support structures and the extended heat-conducting structure can also be connected to the second heat-conducting shell by, for example, welding, diffusion bonding, thermal pressing, soldering, brazing, adhesives and other bonding methods.
[0091] In this embodiment, the number of the extended heat-conducting structures 13 is multiple, and these extended heat-conducting structures 13 are located in the liquid-tight chamber S and are disposed on the heat-conducting convex hull structure 123, but the present invention is not limited thereto. In other embodiments, the number of the extended heat-conducting structures may be only one, and the extended heat-conducting structures are located in the liquid-tight chamber and are disposed on the heat-conducting convex hull structure.
[0092] In this embodiment, the extended heat-conducting structures 13 are disposed in parallel to the heat-conducting convex structure 123, but the present invention is not limited thereto. In other embodiments, the extended heat-conducting structures 13 can also be disposed in radial arrangement on the heat-conducting convex structure.
[0093] In this embodiment, the extended heat-conducting structures 13 are, for example, rectangular with different lengths, but the present invention is not limited thereto. In other embodiments, the extended heat-conducting structures may also be non-rectangular, as long as the extended heat-conducting structures can provide the required vapor pressure drop in the liquid-tight chamber and reduce the high liquid pressure drop caused by the capillary action of the powder sintered capillary structure.
[0094] In this embodiment, the number of the first heat pipes 14 and the number of the second heat pipes 15 are multiple, and the first heat pipes 14 and the second heat pipes 15 pass through the reinforcement structures 18 and are disposed in the through holes 113, but the present invention is not limited thereto. In other embodiments, the number of the first heat pipe and the second heat pipe may be only one, and the first heat pipe and the second heat pipe pass through the reinforcement structures and are disposed in the through holes.
[0095] In this embodiment, the lengths L1 and L2 of the fourth capillary structures 173 are respectively greater than half of the length L3 of the first heat pipes 14 and half of the length L4 of the second heat pipes 15, but the present invention is not limited thereto. In other embodiments, the lengths of the fourth capillary structures may also be less than or equal to half of the lengths of the first heat pipes and half of the lengths of the second heat pipes.
[0096] In this embodiment, the second capillary structure 171 and the fourth capillary structures 173 are connected by metal bonding through the fifth capillary structures 174, but the present invention is not limited thereto. In other embodiments, the three-dimensional heat transfer device may not be provided with the fifth capillary structures, and the fourth capillary structure abuts against the second capillary structures.
[0097] Please also read Figure 8 . Figure 83D schematic diagram of a three-dimensional heat transfer device according to a second embodiment of the present invention. The three-dimensional heat transfer device 10A of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10A may also include a plurality of sixth capillary structures 19. These sixth capillary structures 19 are located on the first inner surface 1211 of the bottom plate 121 and are stacked on the second capillary structure 171, and these sixth capillary structures 19 are selected from a group consisting of a metal mesh, a fiber, and a powder sintered body. By providing these capillary structures 171-174 and these sixth capillary structures 19, the cooling fluid can be further made to absorb the heat of the heat source and evaporate and then flow back through these capillary structures 171-174 and these sixth capillary structures 19.
[0098] According to the three-dimensional heat transfer device of the above embodiment, since the distance from each notch surface of these first heat pipes to the second inner surface of the heat-conducting convex structure and the distance from each notch surface of these second heat pipes to the second inner surface of the heat-conducting convex structure are both greater than the distance from the top surface of these extended heat-conducting structures to the second inner surface of the heat-conducting convex structure, the speed at which the cooling fluid that absorbs the heat from the heat source and evaporates flows from these notches into these first heat pipes and these second heat pipes can be accelerated, thereby improving the heat dissipation efficiency.
[0099] In addition, since the distance from each notch surface of these first heat pipes to the second inner surface of the heat-conducting convex structure is equal to the distance from each notch surface of these second heat pipes to the second inner surface of the heat-conducting convex structure, and these notch surfaces are flush with the upper surface of the first heat-conducting shell, the speed at which the cooling fluid that absorbs the heat from the heat source and evaporates flows from these notches into these first heat pipes and these second heat pipes can be further accelerated, thereby further improving the heat dissipation efficiency.
[0100] Furthermore, compared to two capillary structures that simply abut against each other, these capillary structures bonded by metal bonds can increase the speed of transferring the cooling fluid, thereby further improving the heat dissipation efficiency of the three-dimensional heat transfer device.
[0101] Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the protection scope of the claims attached to the present invention.
Claims
1. A three-dimensional heat transfer device, characterized in that: Include: a first heat-conducting shell; a second heat-conducting shell, mounted on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber, the second heat-conducting shell comprises a bottom plate and a heat-conducting convex structure, the heat-conducting convex structure protrudes from the bottom plate in a direction away from the first heat-conducting shell, the bottom plate has a first inner surface, the heat-conducting convex structure has a second inner surface, the first inner surface and the second inner surface face the first heat-conducting shell; At least one extended heat-conducting structure is located in the liquid-tight chamber and is disposed on the heat-conducting convex structure, and the at least one extended heat-conducting structure has a top surface, and the top surface faces the first heat-conducting shell; as well as At least one first heat pipe and at least one second heat pipe are arranged in the first heat-conducting shell, the at least one first heat pipe is against the first inner surface, and the at least one second heat pipe is against the second inner surface. One end of the at least one first heat pipe and one end of the at least one second heat pipe each have an opening and at least one notch, the opening is connected to the liquid-tight chamber, the at least one notch is located at the opening, and the at least one notch is connected to the opening, the at least one notch faces the at least one extended heat-conducting structure and is connected to the gap between the at least one extended heat-conducting structure, so that after the cooling fluid is vaporized, it can flow along the gap between the at least one extended heat-conducting structure to the at least one notch, and then flow into the at least one first heat pipe and the at least one second heat pipe through the at least one notch to dissipate heat.
2. The three-dimensional heat transfer device according to claim 1, characterized in that: The at least one notch of the at least one first heat pipe and the at least one notch of the at least one second heat pipe each have a notch surface, the two notch surfaces face the first inner surface and the second inner surface respectively, and the distance from the two notch surfaces to the second inner surface is greater than the distance from the top surface to the second inner surface.
3. The three-dimensional heat transfer device according to claim 2, characterized in that: The distance from the notch surface of the at least one notch of the at least one first heat pipe to the second inner surface of the thermally conductive convex structure is equal to the distance from the notch surface of the at least one notch of the at least one second heat pipe to the second inner surface of the thermally conductive convex structure.
4. The three-dimensional heat transfer device according to claim 2, characterized in that: The first heat-conducting shell has an upper surface, the upper surface faces away from the liquid-tight chamber, and the two notch surfaces are flush with the upper surface, higher than the upper surface, or lower than the upper surface.
5. The three-dimensional heat transfer device according to claim 4, characterized in that: The first heat-conducting shell includes a plurality of reinforcement structures, and the first heat-conducting shell has a plurality of through holes. The reinforcement structures and the through holes are located on the upper surface of the first heat-conducting shell, and the reinforcement structures surround the through holes. The at least one first heat pipe and the at least one second heat pipe respectively pass through the reinforcement structures and are arranged in the through holes.
6. The three-dimensional heat transfer device according to claim 1, characterized in that: The at least one extended heat-conducting structure includes a metal body portion and a first capillary structure. The first capillary structure is stacked on the metal body portion, and the top surface is located on the first capillary structure.
7. The three-dimensional heat transfer device according to claim 6, characterized in that: The second heat-conducting shell includes an annular side plate, and the annular side plate is connected to the periphery of the bottom plate.
8. The three-dimensional heat transfer device according to claim 7, characterized in that: It further includes a plurality of first supporting structures and a plurality of second supporting structures, the first heat-conducting shell having a lower surface, the lower surface facing away from the upper surface of the first heat-conducting shell, the first supporting structures protruding from the first inner surface of the base plate and abutting against the lower surface, the second supporting structures protruding from the second inner surface of the heat-conducting convex structure and abutting against the lower surface, and the at least one extended heat-conducting structure connecting portions of the second supporting structures.
9. The three-dimensional heat transfer device according to claim 8, characterized in that: It further includes a second capillary structure, a third capillary structure and a plurality of fourth capillary structures, the annular side plate has a third inner surface, the at least one first heat pipe has a first heat pipe inner surface, the at least one second heat pipe has a second heat pipe inner surface, the second capillary structure is stacked on the first inner surface of the bottom plate, the second inner surface of the heat-conducting convex structure, the third inner surface of the annular side plate, the lower surface of the first heat-conducting shell, and the first supporting structures, the third capillary structure is stacked on the second supporting structures, and the fourth capillary structures are respectively stacked on the first heat pipe inner surface of the at least one first heat pipe and the second heat pipe inner surface of the at least one second heat pipe.
10. The three-dimensional heat transfer device according to claim 9, characterized in that: The lengths of the fourth capillary structures are greater than half of the length of the at least one first heat pipe and half of the length of the at least one second heat pipe.
11. The three-dimensional heat transfer device according to claim 10, characterized in that: It further comprises a plurality of fifth capillary structures, which are stacked on the second capillary structures and respectively located at the opening of the at least one first heat pipe and the opening of the at least one second heat pipe, and the fourth capillary structure is connected to the second capillary structures through the fifth capillary structures.
12. The three-dimensional heat transfer device according to claim 11, characterized in that: The second capillary structure and the fourth capillary structures are connected to the fifth capillary structures by metal bonding.
13. The three-dimensional heat transfer device according to claim 11, characterized in that: The first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structures and the fifth capillary structures are selected from the group consisting of metal mesh, fiber and powder sintered body.
14. The three-dimensional heat transfer device according to claim 9, characterized in that: It further comprises a plurality of sixth capillary structures, which are located on the first inner surface of the bottom plate and are stacked on the second capillary structure.
15. The three-dimensional heat transfer device according to claim 14, characterized in that: The sixth capillary structures are selected from the group consisting of metal mesh, fiber and powder sintered body.
16. The three-dimensional heat transfer device according to claim 1, characterized in that: The at least one extended heat-conducting structure is in plural number, and the extended heat-conducting structures are parallel to each other.