Temperature control method for variable-temperature metal in temperature control device

Abstract

The invention discloses a temperature control method for variable-temperature metal in a temperature control device, and the method comprises the steps: setting a plurality of temperature compensation points, and obtaining the compensation power value of each hot well at different temperature compensation points for reaching the temperature within the set threshold range of the corresponding temperature compensation point, thereby achieving the temperature control of the variable-temperature metal in the actual use. Two temperature compensation points adjacent to the set temperature of the variable-temperature metal are inquired, and the power compensation value of each hot well at the current set temperature of the variable-temperature metal is calculated by utilizing the power compensation values of the two adjacent temperature compensation points of each hot well, so that the power compensation value of each hot well at the current set temperature of the variable-temperature metal can be calculated after the variable-temperature metal reaches the set temperature. And the power compensation value obtained through calculation is used for conducting temperature compensation on each hot well through an auxiliary heating piece in the temperature compensation auxiliary heating film, so that the temperature of each hot well reaches the threshold value range of the set temperature, and the temperature uniformity between the hot wells is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of in vitro diagnosis, and specifically relates to a method for controlling the temperature of a variable-temperature metal in a temperature control device. Background Art

[0002] During the PCR process, the temperature uniformity between the variable temperature metal hot wells directly affects the accuracy of the measurement. In the prior art, there are mainly the following ways to improve the temperature uniformity between the hot wells.

[0003] The first method is to use edge insulation to isolate the heat well from the surrounding air through insulation cotton. Although it can reduce the heat consumption of the edge heat well, it still cannot completely isolate the heat exchange between the edge heat well and the surrounding air, resulting in a temperature difference between the edge heat well and the middle heat well.

[0004] The second method is to connect the heat wells with ribs, and use the ribs to conduct heat between the heat wells to improve temperature uniformity. However, since the variable temperature metal and the surrounding air produce heat convection, the heat at the edge of the metal is lost, which still causes the temperature of the edge of the variable temperature metal to be low.

[0005] The third method is to install a temperature compensation heating film around the side or bottom of the variable temperature metal, and use the temperature compensation heating film to heat to compensate for the heat loss around the variable temperature metal. Although it can improve the temperature uniformity of each hot well to a certain extent, the heat dissipated by each hot well of the variable temperature metal is uneven, and the temperature difference between each hot well and the outside world at different temperature points is different, the amount of heat required to compensate is also different. The existing method of using a heating film to compensate for heat loss can only achieve rough temperature compensation, and cannot perform precise temperature compensation for each hot well.

[0006] In addition, the temperature uniformity between hot wells is also affected by many factors, such as:

[0007] (1) The temperature compensation heating film generally uses a semiconductor refrigerator. The cooling or heating power on the surface of the semiconductor refrigerator has a certain degree of unevenness. In addition, the fixed structure and insulation cotton around the semiconductor refrigerator will also absorb the heat at the edge of the heat well.

[0008] (2) The temperature difference between different areas of the radiator will also cause uneven temperature of the variable temperature metal.

[0009] In existing PCR fluorescence quantitative analyzers, the problem of temperature uniformity between variable temperature metal hot wells has not been effectively solved. Summary of the invention

[0010] In view of this, an object of the present invention is to provide a temperature control method for variable temperature metal in a temperature control device, which can perform temperature compensation on each hot well respectively to improve the temperature uniformity between the hot wells.

[0011] In order to achieve the above object, the present invention provides the following technical solutions:

[0012] A temperature control method for a variable temperature metal in a temperature control device, the temperature control device comprising a bottom plate, the variable temperature metal being mounted above the bottom plate, a temperature raising and lowering component for controlling the temperature raising or lowering of the variable temperature metal being arranged between the bottom plate and the variable temperature metal, a heat dissipation component for discharging heat being arranged below the bottom plate; a heat well being arranged on the variable temperature metal, and a temperature compensation component for performing temperature compensation on each of the heat wells being arranged on the bottom plate;

[0013] The temperature compensation component includes a temperature compensation auxiliary heating film, and the temperature compensation auxiliary heating film includes a wiring body, and auxiliary heating sheets are arranged at intervals on one side or two opposite sides of the wiring body, and a heating circuit is arranged on the auxiliary heating sheet, and a power supply circuit is arranged on the wiring body in a one-to-one correspondence with the heating circuit on each of the auxiliary heating sheets, and the auxiliary heating sheets are arranged in a one-to-one correspondence with the heat wells, and the auxiliary heating sheets are attached to the outer wall of the corresponding heat wells;

[0014] The variable temperature metal temperature control method comprises the following steps:

[0015] Step 1: Set M temperature compensation points T in order from low to high j , j = 1, 2, 3 ... M;

[0016] Step 2: Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T j , and keep the set temperature for the time;

[0017] Step 3: Use a thermometer to detect the temperature of each hot well and determine the temperature T of each hot well. ji and temperature compensation point T j Is the difference between the values ​​of θ and θ within the set threshold range? If so, no temperature compensation is performed. If not, the corresponding hot well is temperature compensated using the auxiliary heat sheet so that the temperature of the corresponding hot well is within the set time and the temperature compensation point T j The difference between them is within the set threshold range;

[0018] Record the temperature compensation point T of the heating circuit corresponding to each hot well. j Temperature compensation power value P_T at ji ;

[0019] Step 4: Determine whether the number of iterations j is equal to M: If so, stop the iteration, obtain the temperature compensation power value of the heating circuit corresponding to each hot well at each temperature compensation point, and execute step 5; if not, j=j+1, and execute step 2;

[0020] Step 5: Set the temperature T of the variable temperature metal and obtain two temperature compensation points T adjacent to the temperature T. k and T k+1 , and satisfy T k <T≤T k+1 ; Get the heating circuit corresponding to each hot well at the temperature compensation point T k and T k+1 Temperature compensation power value P_T ki and P_T (k+1)i ; After the variable temperature metal reaches temperature T using the temperature rise and fall components, the temperature compensation power value of the heating circuit corresponding to each hot well is:

[0021]

[0022] Among them, m k 、n k and p k are coefficients, and:

[0023] m1=T k+1 -T k

[0024]

[0025]

[0026] Where, 1≤k<M, M≥2; 1≤i≤N, N is the number of hot wells;

[0027] Step 6: The temperature compensation power value P_T of the heating circuit corresponding to each hot well calculated in step 5 i Temperature compensation is performed for each thermal well.

[0028] Furthermore, the difference between two adjacent temperature compensation values ​​is 20-60°C.

[0029] Furthermore, in step 4, when the number of iterations j is equal to M, temperature compensation verification is performed, and the method for temperature compensation verification includes the following steps:

[0030] 41) Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T m ;

[0031] 42) According to the temperature compensation power value P_T mi Temperature compensation for each thermal well;

[0032] 43) Determine the temperature value T′ of each hot well within the set time range after temperature compensation mi The corresponding temperature compensation point T m Is the difference between the two values ​​within the set threshold range?

[0033] If yes, determine whether m is equal to M: If yes, determine whether the current temperature compensation verification times r is equal to the set maximum temperature compensation verification times R: If yes, the temperature compensation verification is completed, and step 5 is executed; if no, step 41 is executed, r=r+1;

[0034] If not, go to step 2.

[0035] Furthermore, the auxiliary heat sheet is perpendicular to the wiring body, and a fitting plane is provided on the outer wall of the heat well, and the auxiliary heat sheet is attached to the fitting plane.

[0036] Furthermore, the wiring body is provided with positioning plates respectively located on both sides of the auxiliary heat plate, and a positioning area for positioning the heat well is formed between two adjacent positioning plates.

[0037] Furthermore, the temperature raising and lowering component includes a temperature control element installed between the base plate and the temperature-changing metal, a first heat-conducting layer is provided between the temperature control element and the base plate, and a second heat-conducting layer is provided between the temperature control element and the temperature-changing metal.

[0038] Furthermore, the heat dissipation assembly includes a heat dissipation cover arranged below the base plate, a heat dissipation channel is formed between the heat dissipation cover and the base plate, a heat dissipation fan is installed on the heat dissipation cover, and a heat sink located in the heat dissipation channel is provided on the bottom surface of the base plate.

[0039] Furthermore, the temperature compensation component also includes a temperature compensation control board. A power supply interface is provided on the wiring body. The temperature compensation control board is connected to the temperature compensation auxiliary thermal film through the power supply interface and controls the temperature compensation power of each power supply circuit respectively.

[0040] Furthermore, the heat wells are arranged into at least one group, each group includes one or two rows of the heat wells arranged in a linear array, and the temperature compensation auxiliary thermal film is arranged in a one-to-one correspondence with each group of the heat wells.

[0041] Furthermore, the temperature-variable metal is arranged in one-to-one correspondence with each group of the hot wells, and the hot wells belonging to the same group are arranged on a corresponding piece of the temperature-variable metal.

[0042] The beneficial effects of the present invention are:

[0043] The temperature control method for variable temperature metal in the temperature control device of the present invention sets multiple temperature compensation points and obtains the compensation power value required for each hot well to reach the temperature within the set threshold range of the corresponding temperature compensation point at different temperature compensation points. Therefore, in actual use, two temperature compensation points adjacent to the set temperature of the variable temperature metal can be queried, and the power compensation value of each hot well at the two adjacent temperature compensation points can be used to calculate the power compensation value of each hot well at the current set temperature of the variable temperature metal. Therefore, after the variable temperature metal reaches the set temperature, the calculated power compensation value can be used to perform temperature compensation on each hot well, so that the temperature of each hot well reaches the threshold range of the set temperature, thereby improving the temperature uniformity between the hot wells.

[0044] After obtaining the compensated power value of each hot well at different temperature compensation points, the obtained compensated power value is tested using temperature compensation verification to verify the reliability of the compensated power value of each hot well at different temperature compensation points to improve the reliability of power compensation. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration:

[0046] Figure 1 It is a structural schematic diagram of an embodiment of a PCR fluorescence quantitative analyzer;

[0047] Figure 2 This is a schematic diagram of the structure of the PCR fluorescence quantitative analyzer after the shell is hidden;

[0048] Figure 3 It is a schematic diagram of the structure when the hot cover device is in an open state;

[0049] Figure 4 It is a structural schematic diagram when the hot cover device is in a closed state;

[0050] Figure 5 This is an exploded view of the thermal cover module;

[0051] Figure 6 It is a structural schematic diagram of a thermal cover assembly and a thermal cover bracket;

[0052] Figure 7 This is an exploded view of the sports frame;

[0053] Figure 8 is a structural schematic diagram of the upper motion plate;

[0054] Fig. 9 is a schematic diagram of the structure of the lower motion plate;

[0055] Fig.10 is a structural schematic diagram of a cover plate assembly;

[0056] Fig.11 It is a structural schematic diagram of a temperature control device;

[0057] Fig.12 This is an exploded view of the temperature control device;

[0058] Fig.13 It is a schematic diagram of the structure of the temperature compensation auxiliary heating film;

[0059] Fig.14 It is a schematic diagram of the structure after the temperature-changing metal and the temperature compensation auxiliary heating film are assembled;

[0060] Fig.15 A schematic diagram of the coordination relationship between one set of thermal wells and the temperature compensation auxiliary thermal film;

[0061] Fig.16 It is a schematic diagram of the structure of the photovoltaic module;

[0062] Fig.17 It is a flow chart of the temperature compensation auxiliary heating film processing method;

[0063] Fig.18 The figure is a flow chart of an embodiment of a method for controlling the temperature of a variable-temperature metal in a temperature control device of the present invention.

[0064] 10-housing; 11-top hole; 12-heat cover device; 13-temperature control device; 14-photoelectric module; 15-control module; 16-power module;

[0065] 20-top cover assembly; 21-top cover; 22-raised area; 23-top cover guide shaft;

[0066] 30-heat cover assembly; 31-moving frame; 32-cover assembly; 33-upper moving plate; 34-lower moving plate; 35-moving track; 36-moving slider; 37-reset tension spring; 38-upper tension spring connecting rod; 39-lower tension spring connecting rod; 40-top cover guide sliding hole; 41-driving guide sliding hole; 42-top cover guide sliding groove; 43-movement limit block; 44-spring; 45-cover; 46-insulating rubber; 47-cover heating film; 48-cover insulation board; 49-over-temperature protection switch;

[0067] 50-heat cover bracket; 51-bracket bottom plate; 52-guide plate; 53-top cover track; 531-top cover lower track section; 532-top cover upper track section; 533-top cover connecting track section; 54-heat cover track; 541-heat cover upper track section; 542-heat cover lower track section; 543-heat cover connecting track section; 55-top cover guide shaft; 56-top cover guide roller; 57-heat cover guide shaft; 58-heat cover guide roller; 59-heat well cover plate; 61-heat cover drive track; 62-heat cover drive slider; 63-synchronous pulley; 64-synchronous belt; 65-drive motor; 66-optical coupling sensor; 67-heat cover drive guide rod; 68-limiting groove; 69-motion limit block; 70-heat well through hole;

[0068] 71-bottom plate; 72-variable temperature metal; 73-heat well; 74-temperature compensation component; 75-temperature control element; 76-first heat-conducting layer; 77-second heat-conducting layer; 78-heat dissipation cover; 79-heat dissipation channel; 80-heat dissipation fan; 81-heat sink; 82-temperature compensation auxiliary heating film; 83-wiring body; 84-auxiliary heating sheet; 85-power supply interface; 86-positioning sheet; 87-positioning area; 88-fitting plane; 89-connection port; 90-optical fiber; 91-positioning plate; 92-temperature compensation control board. DETAILED DESCRIPTION

[0069] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0070] like Figure 1-2 As shown, the PCR fluorescence quantitative analyzer of this embodiment includes a housing 1, and a top hole 11 is provided on the top surface of the housing 1. A heat cover device 12, a temperature control device 13, a photoelectric module 14, a control module 15 and a power module 16 are provided in the housing 1. The heat cover device includes a heat cover module and a heat cover bracket 50, and the heat cover bracket 50 includes a bracket bottom plate 51, and a heat well cover plate 59 is provided on the bracket bottom plate 51. The temperature control device 13 is arranged below the heat well cover plate 59. A heat well through hole 70 is provided on the heat well cover plate 59, and a heat well 73 is provided on the temperature control device 13 corresponding to the heat well through hole 70, and the reagent tube 2 is placed in the heat well 73 through the heat well through hole 70. In this embodiment, the photoelectric module 14 and the control module 15 are both located on the same side of the temperature control device 13, and the photoelectric module 14 and the control module 15 are installed in the space below the bracket bottom plate 51 that is not occupied by the temperature control device 13. The power module 16 is installed at both ends of the bracket bottom plate 51.

[0071] like Figure 3-4 As shown, the thermal cover device 12 of this embodiment includes a thermal cover module and a thermal cover bracket 50. Figure 5As shown, the thermal cover module of this embodiment includes a top cover assembly 20 and a thermal cover assembly 30. The top cover assembly 20 includes a top cover 21, and a convex area 22 protruding upward and cooperating with the top hole 11 is provided on the top surface of the top cover 21, and a top cover guide shaft 23 is provided on the bottom surface of the top cover 21. The thermal cover assembly 30 includes a moving frame 31 and a cover assembly 32 installed on the moving frame 31. Figure 6 As shown, the heat cover bracket 50 of this embodiment includes a bracket bottom plate 51, and guide plates 52 are respectively provided on both sides of the bracket bottom plate 51, and a top cover track 53 and a heat cover track 54 are respectively provided on the guide plate 52 corresponding to the top cover assembly 20 and the heat cover assembly 30. In this embodiment, for the convenience of description, the direction parallel to the bracket bottom plate 51 and the guide plate 52 is made into a first direction, and the direction perpendicular to the bracket bottom plate 51 is made into a second direction. A top cover guide mechanism is provided between the top cover 21 and the moving frame 31, and the top cover guide mechanism enables the top cover 21 and the moving frame 31 to move relative to each other in the second direction and to move synchronously in the first direction.

[0072] Specifically, Figure 6 As shown, the top cover track 53 of this embodiment is set to at least one, and each top cover track 53 includes a top cover lower track segment 531 and a top cover upper track segment 532 parallel to the first direction, the distance between the top cover lower track segment 531 and the bracket bottom plate 51 is less than the distance between the top cover upper track segment 532 and the bracket bottom plate 51, and a top cover connecting track segment 533 is provided between the top cover lower track segment 531 and the top cover upper track segment 532. A top cover guide shaft 55 is provided on the top cover 21 corresponding to each top cover track 53. When the top cover track 53 is set to at least two, the spacing between any two top cover guide shafts 55 in the first direction is equal to the spacing between the two top cover tracks 53 corresponding to the two top cover guide shafts 55 in the first direction, and the spacing between any two top cover guide shafts 55 in the second direction is equal to the spacing between the two top cover tracks 53 corresponding to the two top cover guide shafts in the second direction. Specifically, the distance between the two top cover rails 53 in the first direction is the distance between the same structural positions corresponding to the two top cover rails 53 in the first direction, such as the distance between the connecting positions where the top cover lower rail segments 531 and the top cover connecting rail segments 533 of the two top cover rails 53 are connected in the first direction. Similarly, the distance between the two top cover rails 53 in the second direction is the distance between the top cover lower rail segments 531 of the two top cover rails 53 or the distance between the top cover upper rail segments 532 of the two top cover rails 53. Figure 5As shown, in this embodiment, there are two top cover rails 53, and correspondingly, there are two top cover guide shafts 55. In order to reduce the resistance of the top cover guide shaft 55 when it moves in the top cover rails 53, the top cover guide shaft of this embodiment is provided with a top cover guide roller 56. Of course, in other embodiments, the number of top cover rails 53 can be set to 1, 3 or more than 3 as needed, which will not be repeated. The distance between the lower track section 531 of the top cover of the two top cover tracks 53 of the present embodiment and the bracket bottom plate 51 is equal, and similarly, the distance between the upper track section 532 of the top cover of the two top cover tracks 53 and the bracket bottom plate 51 is equal; in some other embodiments, the distance between the lower track section 531 of the top cover of the two top cover tracks 53 and the bracket bottom plate 51 may be unequal, and similarly, the distance between the upper track section 532 of the top cover of the two top cover tracks 53 and the bracket bottom plate 51 is also unequal; regardless of the positional relationship of each top cover track 53, it is necessary to set the position of the top cover guide shaft 55 that cooperates with each top cover track 53 accordingly, so that the top cover 21 always maintains a set angle position relative to the bracket bottom plate 51 (in the present embodiment, the bottom surface of the top cover 21 is parallel to the bracket bottom plate 51). The two top cover tracks 53 of the present embodiment are connected, that is, the upper track section 532 of the top cover of one of the top cover tracks 53 is connected to the lower track section 531 of the top cover of the other top cover track 53. Of course, in some other embodiments, the two top cover rails 53 may be disconnected from each other.

[0073] like Figure 6As shown, the heat cover track 54 of this embodiment includes a heat cover upper track segment 541 and a heat cover lower track segment 542 parallel to the first direction, the distance between the heat cover upper track segment 541 and the bracket bottom plate 51 is greater than the distance between the heat cover lower track segment 542 and the bracket bottom plate 51, and a heat cover connecting track segment 543 is provided between the heat cover upper track segment 541 and the heat cover lower track segment 542. Correspondingly, a heat cover guide shaft 57 that is slidably matched with the heat cover track 54 is provided on the motion frame 31 of this embodiment, and when the heat cover guide shaft 57 is located at the heat cover lower track segment 542, the top cover guide shaft 55 is located at the corresponding top cover upper track segment 532 of the heat cover track 54; when the heat cover guide shaft 57 is located at the heat cover upper track segment 541, the top cover guide shaft 55 is located at the corresponding top cover lower track segment 531 of the heat cover track 54. That is, when the top cover 21 and the moving frame 31 move synchronously in the first direction, the top cover 21 covers the top hole 11 upwards under the guidance of the top cover track 53, and the moving frame 31 moves downwards under the guidance of the heat cover track 54 to make the cover assembly 32 cover the heat well cover 59; similarly, when the top cover 21 opens the top hole 11 downwards under the guidance of the top cover track 53, the moving frame 31 moves upwards under the guidance of the heat cover track 54 to make the cover assembly 32 move away from the heat well cover 59. That is, in this embodiment, the support bottom plate 51 is provided with a heat well cover 59, and the heat well cover 59 is arranged in the area between the heat cover lower track sections 542 on both sides of the support bottom plate 51. When the heat cover guide shaft 57 is located in the heat cover lower track section 542, the cover assembly 32 covers the heat well cover 59, and when the heat cover guide shaft 57 is located in the heat cover upper track section 541, the cover assembly 32 moves away from the area where the heat well cover 59 is located. The top hole 11 of this embodiment is arranged in the area between the top cover upper track sections 532 on both sides of the housing 10; when the top cover guide shaft 55 is located in the top cover upper track section 532, the raised area 22 is located in the top hole 11 to cover the top hole 11; when the top cover guide shaft 55 is located in the top cover lower track section 531, the top cover 21 moves out of the area where the top hole 11 is located to open the top hole 11. In the preferred embodiment of this embodiment, in order to reduce the resistance of the heat cover guide shaft 57 during the movement along the heat cover track 54, a heat cover guide roller 58 is provided on the heat cover guide shaft 57. In addition, the top cover rail 53 and the heat cover rail 54 of this embodiment are both rail groove structures arranged on the rail plate 52. In some other embodiments, the top cover rail 53 and the heat cover rail 54 can also be implemented in various other existing ways, which will not be repeated.

[0074] Of course, if Figure 6As shown, the heat cover support 50 of this embodiment is provided with a heat cover driving mechanism for driving the motion frame 31 to move along the first direction. The heat cover driving mechanism of this embodiment includes two heat cover driving rails 61 parallel to the first direction, and the two heat cover driving rails 61 are provided with heat cover driving sliders 62 that slide and cooperate with them, and the heat cover driving sliders 62 are provided with heat cover driving guide rods 67 located in the second direction. The heat cover support 50 of this embodiment is also provided with a power mechanism for driving the heat cover driving slider 62 to move along the heat cover driving rails 61, and the power mechanism can be implemented in various existing ways, such as a belt transmission mechanism, a chain transmission mechanism, a threaded screw mechanism, and a gear rack mechanism. The power mechanism of this embodiment includes synchronous pulleys 63 respectively located at both ends of the heat cover driving rails 61 and a synchronous belt 64 sleeved on the two synchronous pulleys 63, and the heat cover support 50 is equipped with a driving motor 65 that drives one of the synchronous pulleys 63 to rotate. In a preferred solution of this embodiment, an optical coupling sensor 66 for detecting the two end positions of the heat cover driving slider 62 moving along the heat cover driving track 61 is provided on the bracket bottom plate 51 or the guide plate 52. The optical coupling sensor 66 of this embodiment is arranged on the bracket bottom plate 51.

[0075] like Figure 7-9 As shown, the motion frame 31 of this embodiment includes an upper motion plate 33 and a lower motion plate 34, and a motion track 35 parallel to the first direction and a motion slider 36 slidingly matched with the motion track 35 are provided between the upper motion plate 33 and the lower motion plate 34. Specifically, in this embodiment, the motion track 35 is installed on the bottom surface of the upper motion plate 33, and the motion slider 36 is installed on the top surface of the lower motion plate 33; of course, in some other embodiments, the motion slider 36 can also be installed on the bottom surface of the upper motion plate 33, and the motion track 35 is installed on the top surface of the lower motion plate 33, which will not be repeated. The lower motion plate 34 of this embodiment is located between the upper motion plate 33 and the bracket bottom plate 51, and the cover plate assembly 32 is installed on the lower motion plate 34 and is located on the side of the lower motion plate 32 facing the bracket bottom plate 51. A reset tension spring 37 is provided between the upper motion plate 33 and the lower motion plate 34 of this embodiment. Specifically, an upper tension spring connecting rod 38 and a lower tension spring connecting rod 39 for installing the tension spring are provided on the upper motion plate 33 and the lower motion plate 34, respectively. By providing the reset spring 37 , the upper moving plate 33 and the lower moving plate 34 can be relatively displaced along the moving track 35 under the action of an external force, and then be reset by the reset spring 37 after the external force disappears.

[0076] like Figure 8As shown, the upper moving plate 33 of the present embodiment is provided with a top cover guide sliding hole 40 that is slidably matched with the top cover guide shaft 23, that is, the top cover guide mechanism of the present embodiment includes the top cover guide shaft 23 fixedly mounted on the bottom surface of the top cover 21 and the top cover guide sliding hole 40 that is arranged on the upper moving plate 33 and is matched with the top cover guide shaft 23. In addition, the upper moving plate 33 of the present embodiment is provided with a driving guide sliding hole 41 that is slidably matched with the heat cover driving guide rod 67, and the driving guide sliding hole 41 is located in the second direction, so that under the action of the heat cover driving guide rod 67, the heat cover driving slider 62 can drive the upper moving plate 33 to move synchronously along the first direction, and the upper moving plate 33 can also move relative to the heat cover driving slider 62 in the second direction.

[0077] like Fig. 9 As shown, in order not to interfere with the upper moving plate 33 moving relative to the lower moving plate 34 along the moving track 35 in the first direction, the present embodiment is provided with a top cover guide slot 42 on the lower moving plate 34 that cooperates with the top cover guide shaft 23, and the length direction of the top cover guide slot 42 is parallel to the first direction. In the preferred scheme of the present embodiment, at least one side of the lower moving plate 34 is provided with a motion limit block 43 for limiting the movement of its end along the first direction. The present embodiment is provided with motion limit blocks 43 on both sides of the lower moving plate 34, and correspondingly, a limit structure that cooperates with the motion limit block 43 is provided on the guide plate 52. The limit structure of the present embodiment is a limit groove 68 provided on the guide plate 52, and the two side walls of the limit groove 68 cooperate with the motion limit block 43 to limit the two end positions of the lower moving plate 34 moving along the first direction. In this embodiment, the clearance groove and the limit groove 68 for letting the hot cover driving slider 62 are provided on the guide plate 52 and are integrated. Of course, in some other embodiments, the clearance groove and the limit groove 68 can also be provided separately, which will not be repeated. In order to better cooperate with the motion limit block 43, the present embodiment also provides a motion limit block 69 on the guide plate 52, which will not be repeated.

[0078] Furthermore, a cover plate guide shaft is provided between the lower moving plate 34 and the cover plate assembly 32, and the lower moving plate 34 and the cover plate assembly 32 can move in the second direction along the cover plate guide shaft, and a spring 44 is sleeved on the cover plate guide shaft and is located between the lower moving plate and the cover plate assembly. Fig.10 As shown, the cover assembly 32 of this embodiment includes a cover 45, and the edges of the cover 45 are provided with a heat-insulating rubber 46 surrounding the cover, and the top surface of the cover 45 is provided with a cover heating film 47, and the cover heat insulation board 48 is provided above the cover heating film 47. The heat cover assembly of this embodiment also includes a temperature sensor for measuring the temperature of the cover heating film 47, and an over-temperature protection switch 49 is provided on the power supply circuit of the cover heating film 48.

[0079] The working process of the heat cover device 12 of this embodiment is as follows: in the open state, the top cover guide shaft 55 is located at the end of the top cover lower track section 531, and the heat cover guide shaft 57 is located at the end of the heat cover upper track section 541. At this time, the top cover 21 is completely offset from the top hole 11, so that the top hole 11 is fully opened; the cover plate assembly 32 is completely offset from the heat well cover plate 59, and the sample tube can be placed into the heat well cover plate 59 or taken out from the heat well cover plate 59 through the top hole 11. Figure 3 The drive motor 65 is started to drive the synchronous pulley 63 to rotate, and the synchronous belt 64 is used to drive the heat cover drive slider 62 along the heat cover drive track 61 to Figure 1 As shown in the right side movement, under the action of the heat cover driving guide rod 67, the moving frame 31 and the heat cover driving slider 62 are driven to move synchronously along the first direction, and under the action of the top cover guide shaft 23, the moving frame 31 drives the top cover 21 to move along the first direction; when the heat cover guide shaft 57 moves to the heat cover connecting track section 543, under the guidance of the heat cover connecting track section 543, the heat cover guide shaft 57 moves obliquely downward. In this process, the cover plate assembly 32 follows the moving frame 31 to move obliquely downward and covers the heat well cover plate 59. At this time, the covering force between the cover plate 45 and the heat well cover plate 59 is small; continue to drive the upper moving plate 33 along the heat cover connecting track Segment 543 moves obliquely downward, and under the limiting action of the motion limit block 43, the lower motion plate 34 no longer moves along the first direction with the upper motion plate 33, that is, at this time, the upper motion plate 33 and the lower motion plate 34 produce relative movement in the first direction along the motion track 35, and the reset tension spring 37 is lengthened, and at the same time, driven by the upper motion plate 33, the lower motion plate 34 moves downward along the second direction and compresses the spring 44, thereby enhancing the covering force between the cover plate assembly 32 and the heat well cover plate 59; when the heat cover guide shaft 57 moves to the heat cover lower track segment 542, the spring 44 is compressed to the shortest state, and the cover plate 45 covers the heat well cover plate 59 tightly. In the process of the moving frame 31 driving the top cover 21 to move along the first direction, when the top cover guide shaft 55 moves to the top cover connecting track section 533, the top cover 21 is located below the top hole 11 at this time, and the top cover guide shaft 55 moves obliquely upward along the top cover connecting track section 533. Under the action of the top cover guide shaft 23, the top cover 21 moves synchronously with the moving frame 31 along the first direction and produces relative movement in the second direction. When the top cover guide shaft 55 moves to the top cover upper track section 532, the top cover 21 reaches the uppermost position, and the raised area 22 is embedded in the top hole 11 to cover the top hole 11. When the top cover guide shaft 55 moves to the top cover upper track section 532 and the heat cover guide shaft 57 moves to the heat cover lower track section 542, the heat cover device 12 is in a closed state, such as Figure 4 shown.

[0080] Specifically, the movement process of the heat cover device 12 from the closed state to the open state is opposite to the movement process of the heat cover device 12 from the open state to the closed state. The only difference is that when the heat cover guide shaft 57 moves into the heat cover upper track section 541, under the tension of the reset spring 37, the upper moving plate 33 and the lower moving plate 34 are automatically reset to the initial state, which will not be repeated.

[0081] The temperature control device 13 is arranged below the heat well cover plate 59. Figure 11-12 As shown, the temperature control device 13 of this embodiment includes a bottom plate 71, a positioning plate 91 is installed above the bottom plate 71, a variable temperature metal 72 is installed on the positioning plate 91, a temperature raising and lowering component for controlling the temperature raising or lowering of the variable temperature metal 72 is provided between the bottom plate 71 and the variable temperature metal 72, and a heat dissipation component for discharging heat is provided below the bottom plate 71. A hot well 73 is provided on the variable temperature metal 72, and a hot well through hole 70 is provided on the hot well cover plate 59 in a one-to-one correspondence with the hot well 73, so that the reagent tube can be placed into the corresponding hot well 73 through the hot well through hole 70. In this embodiment, the temperature raising and lowering component includes a temperature control element 75 installed between the bottom plate 71 and the variable temperature metal 72, a first heat conducting layer 76 is provided between the temperature control element 75 and the bottom plate 71, and a second heat conducting layer 77 is provided between the temperature control element 75 and the variable temperature metal 72. Specifically, in this embodiment, the temperature control element 75 adopts TEC, and the use of TEC can achieve the technical purpose of rapidly raising or lowering the temperature of the variable temperature metal 72. The first heat conducting layer 76 and the second heat conducting layer 77 are made of graphene, which can effectively improve the heat conduction efficiency. In this embodiment, the heat dissipation assembly includes a heat dissipation cover 78 disposed below the bottom plate 71, a heat dissipation channel 79 is formed between the heat dissipation cover 78 and the bottom plate 71, a heat dissipation fan 80 is installed on the heat dissipation cover 78, and a heat dissipation fin 81 located in the heat dissipation channel 79 is provided on the bottom surface of the bottom plate 71. Starting the heat dissipation fan 80 can speed up the air flow speed in the heat dissipation channel 79, and use the heat dissipation fin 81 to quickly achieve heat dissipation.

[0082] The temperature control device of this embodiment further includes a temperature compensation component 74 for performing temperature compensation on each thermal well 73. The temperature compensation component 74 of this embodiment includes a temperature compensation auxiliary thermal film 82. Fig.13As shown, the temperature compensation auxiliary heating film 82 includes a wiring body 83, and auxiliary heating sheets 84 are arranged at intervals on one side or two opposite sides of the wiring body 83. A heating circuit (not shown in the figure) is arranged on the auxiliary heating sheet 84, and a power supply circuit (not shown in the figure) is arranged on the wiring body 83 in a one-to-one correspondence with the heating circuit on each auxiliary heating sheet 84. The wiring body 83 of this embodiment is provided with a power supply interface 85. The auxiliary heating sheet 84 is arranged in a one-to-one correspondence with the heat well 73, and the auxiliary heating sheet 84 is attached to the outer wall of the corresponding heat well 73. The two sides of the auxiliary heating sheet 84 of this embodiment are respectively provided with positioning sheets 86 arranged on the wiring body 83, and a positioning area 87 for positioning the heat well 73 is formed between two adjacent positioning sheets 86, so that the auxiliary heating sheet 84 and the corresponding heat well 73 can be conveniently positioned. In the preferred implementation of this embodiment, the auxiliary heating sheet 84 is perpendicular to the wiring body 83, and a fitting plane 88 is provided on the outer wall of the heat well 73, and the auxiliary heating sheet 84 is attached to the fitting plane 88. Specifically, the temperature compensation component 74 further includes a temperature compensation control board 92. A power supply interface 85 is provided on the wiring body 83. The temperature compensation control board 92 is connected to the temperature compensation auxiliary thermal film 82 through the power supply interface 85 and controls the temperature compensation power of each power supply circuit respectively. Specifically, the temperature compensation control board 92 of this embodiment is installed on the side wall of the heat dissipation channel 79.

[0083] The heat wells 73 are provided as at least one group, each group includes one or two rows of the heat wells 73 arranged in a linear array, and the temperature compensation auxiliary heat film 82 is provided in a one-to-one correspondence with each group of heat wells 73. Specifically, as Fig.14 As shown, in this embodiment, the heat wells 73 are set to 6 groups, and the variable temperature metal can also be set in a one-to-one correspondence with each group of heat wells 73, that is, the variable temperature metal 72 is set to 6 pieces, and the heat wells 73 belonging to the same group are set on a corresponding piece of variable temperature metal 72. Fig.15 As shown, each group of heat wells 73 includes two rows of heat wells 73 arranged in a linear array. When the temperature compensation auxiliary heat film 82 is installed, the wiring body 83 is arranged between the two rows of heat wells 73, and auxiliary heat sheets 84 are respectively arranged on both sides of the wiring body 83, and the auxiliary heat sheets 84 are attached to the corresponding heat wells 73. Of course, in some other embodiments, the variable temperature metal 73 can also be set as one piece, and all the heat wells 73 are set on one piece of variable temperature metal 73; of course, the variable temperature metal 72 can also be set as two or more pieces, and each piece of variable temperature metal 72 is provided with at least one group of heat wells 73, which will not be repeated.

[0084] In this embodiment, each hot well is provided with two connection ports 89, and two optical fibers 90 are connected to the two connection ports 89 respectively. Specifically, an excitation optical fiber interface and a receiving optical fiber interface are provided on the optoelectronic module 14 corresponding to each hot well 73, and the two optical fibers are connected to the corresponding excitation optical fiber interface and the receiving optical fiber interface respectively. Specifically, the structure of the optoelectronic module is as follows: Fig.16 shown.

[0085] The specific implementation of the method for processing the temperature compensation auxiliary heating film in this embodiment is described in detail below.

[0086] like Fig.17 As shown, a temperature compensation auxiliary heating film processing method of this embodiment includes the following steps:

[0087] Step 1: Processing the polyimide film into a set shape having a wiring body 83, an auxiliary heat sheet 84 and a positioning sheet 86;

[0088] Step 2: coating a layer of curing film on the polyimide film for pasting the conductive metal foil;

[0089] Step 3: Lay the conductive metal foil on the wiring body 83 and one of the auxiliary heating sheets 84 without a heating circuit. In this embodiment, the conductive metal foil is laid on the wiring body 83 and the auxiliary heating sheet 84 by calendering.

[0090] Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heat sheet 84 and a power supply circuit on the wiring body 83;

[0091] Step 5: coating a layer of curing film on the etched conductive metal foil;

[0092] Step 6: Determine whether all auxiliary heating plates 84 are processed with heating circuits: if yes, go to step 7; if not, go to step 2;

[0093] Step 7: After the polyimide films with heating circuits processed on all auxiliary heating sheets 84 are heated to a set temperature range, the auxiliary heating sheets 84 are bent so that the auxiliary heating sheets 84 are perpendicular to the wiring body 83 .

[0094] In this embodiment, the conductive metal foil is copper foil, silver foil or gold foil; and the heating circuit is a ring circuit.

[0095] The specific implementation of the variable temperature metal temperature control method in the temperature control device after adopting the temperature compensation auxiliary heating film 82 is described in detail below.

[0096] like Fig.18 As shown, the variable temperature metal temperature control method in the temperature control device of this embodiment includes the following steps:

[0097] Step 1: Set M temperature compensation points in order from low to high, j = 1; the difference between two adjacent temperature compensation values ​​is 20-60° C. In this embodiment, the difference between two adjacent temperature compensation values ​​is 30° C.

[0098] Step 2: Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T j , and maintain the set temperature for a constant time.

[0099] Step 3: Use a thermometer to detect the temperature of each hot well and determine the temperature T of each hot well 73. ji and temperature compensation point T j If the difference between the values ​​is within the set threshold range, no temperature compensation is performed; if not, the auxiliary heat sheet 84 is used to perform temperature compensation on the corresponding hot well 73, so that the temperature of the corresponding hot well 73 is within the set time and the temperature compensation point T j The difference between them is within the set threshold range.

[0100] Record the temperature compensation point T of the heating circuit corresponding to each hot well 73. j Temperature compensation power value P_T at ji .

[0101] Step 4: Determine whether the number of iterations j is equal to M: If so, stop the iteration and obtain the temperature compensation power value of each hot well 73 at each temperature compensation point; if not, j=j+1 and execute step 2 in a loop.

[0102] Specifically, in this embodiment, in order to verify that each hot well 73 is at the temperature compensation point T j Temperature compensation power value P_T at ji When the number of iterations j is equal to M, temperature compensation verification is performed. The method for temperature compensation verification includes the following steps:

[0103] 41) Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T m , m = 1;

[0104] 42) According to the temperature compensation power value P_T mi Temperature compensation for each thermal well;

[0105] 42) Determine the temperature value T′ of each hot well 73 within the set time range after temperature compensation. mi The corresponding temperature compensation point T m Is the difference between the two values ​​within the set threshold range?

[0106] If yes, determine whether m is equal to M: If yes, determine whether the current temperature compensation verification times r is equal to the set maximum temperature compensation verification times R: If yes, the temperature compensation verification is completed, and step 5 is executed; if no, step 41 is executed, r=r+1;

[0107] If not, go to step 2.

[0108] That is, in the continuous R temperature compensation verification, if the temperature of each hot well 73 at each temperature compensation point can be within the set threshold range, it means that each hot well is obtained at the temperature compensation point Tj Temperature compensation power value P_T at ji The reliability is higher, and then proceed to step five.

[0109] Step 5: Set the temperature T of the variable temperature metal and obtain two temperature compensation points T adjacent to the temperature T. k and T k+1 , and satisfy T k <T≤T k+1 ; Get the heating circuit corresponding to each hot well 73 at the temperature compensation point T k and T k+1 Temperature compensation power value P_T ki and P_T (k+1)i After the variable temperature metal reaches the temperature T by using the temperature rise and fall component, the temperature compensation power value of each hot well 73 is:

[0110]

[0111] Among them, m k 、n k and p k are coefficients, and:

[0112] m1=T k+1 -T k

[0113]

[0114]

[0115] Where, 1≤k<M, M≥2; 1≤i≤N, N is the number of hot wells;

[0116] Step 6: The temperature compensation power value P_T of the heating circuit corresponding to each hot well 73 calculated in step 5 i Temperature compensation is performed for each thermal well.

[0117] The temperature compensation method for variable temperature metal of the present embodiment sets a plurality of temperature compensation points, and obtains the compensation power value required for each hot well to reach the temperature within the set threshold range of the corresponding temperature compensation point at different temperature compensation points. Thus, in actual use, two temperature compensation points adjacent to the set temperature of the variable temperature metal can be queried, and the power compensation value of each hot well at the two adjacent temperature compensation points can be used to calculate the power compensation value of each hot well at the current set temperature of the variable temperature metal. Thus, after the variable temperature metal reaches the set temperature, each hot well can be temperature compensated using the calculated power compensation value, so that the temperature of each hot well reaches the threshold range of the set temperature, thereby improving the temperature uniformity between the hot wells.

[0118] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A method for controlling the temperature of a variable temperature metal in a temperature control device, characterized in that: The temperature control device comprises a bottom plate, the variable temperature metal is installed above the bottom plate, a temperature raising and lowering component for controlling the temperature raising or lowering of the variable temperature metal is provided between the bottom plate and the variable temperature metal, and a heat dissipation component for discharging heat is provided below the bottom plate; a heat well is provided on the variable temperature metal, and a temperature compensation component for temperature compensation of each of the heat wells is also provided on the bottom plate; The temperature compensation component includes a temperature compensation auxiliary heating film, and the temperature compensation auxiliary heating film includes a wiring body, and auxiliary heating sheets are arranged at intervals on one side or two opposite sides of the wiring body, and a heating circuit is arranged on the auxiliary heating sheet, and a power supply circuit is arranged on the wiring body in a one-to-one correspondence with the heating circuit on each of the auxiliary heating sheets, and the auxiliary heating sheets are arranged in a one-to-one correspondence with the heat wells, and the auxiliary heating sheets are attached to the outer wall of the corresponding heat wells; The variable temperature metal temperature control method comprises the following steps: Step 1: Set M temperature compensation points T in order from low to high j , j = 1, 2, 3, ... M; Step 2: Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T j , and keep the set temperature for the time; Step 3: Use a thermometer to detect the temperature of each hot well and determine the temperature T of each hot well. ji and temperature compensation point T j Is the difference between the values ​​of θ and θ within the set threshold range? If so, no temperature compensation is performed. If not, the corresponding hot well is temperature compensated using the auxiliary heat sheet so that the temperature of the corresponding hot well is within the set time and the temperature compensation point T j The difference between them is within the set threshold range; Record the temperature compensation point T of the heating circuit corresponding to each hot well. j Temperature compensation power value P_T at ji ; Step 4: Determine whether the number of iterations j is equal to M: If so, stop the iteration, obtain the temperature compensation power value of the heating circuit corresponding to each hot well at each temperature compensation point, and execute step 5; if not, j=j+1, and execute step 2; Step 5: Set the temperature T of the variable temperature metal and obtain two temperature compensation points T adjacent to the temperature T. k and T k+1 , and satisfy T k <T≤T k+1 ; Get the heating circuit corresponding to each hot well at the temperature compensation point T k and T k+1 Temperature compensation power value P_T ki and P_T (k+1)i ; After the variable temperature metal reaches temperature T using the temperature rise and fall components, the temperature compensation power value of the heating circuit corresponding to each hot well is: Among them, m k 、n k and p k are coefficients, and: m1=T k+1 -T k Where, 1≤k<M, M≥2; 1≤i≤N, N is the number of hot wells; Step 6: The temperature compensation power value P_T of the heating circuit corresponding to each hot well calculated in step 5 i Temperature compensation is performed for each thermal well.

2. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The difference between two adjacent temperature compensation values ​​is 20-60℃.

3. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: In step 4, when the number of iterations j is equal to M, temperature compensation verification is performed, and the method for temperature compensation verification includes the following steps: 1) Use the temperature rise and fall components to control the temperature rise of the variable temperature metal to the temperature compensation point T m ; 2) According to the temperature compensation power value P_T mi Temperature compensation for each thermal well; 3) Determine the temperature value T′ of each hot well within the set time range after temperature compensation mi The corresponding temperature compensation point T m Is the difference between the two values ​​within the set threshold range? If yes, determine whether m is equal to M: If yes, determine whether the current temperature compensation verification times r is equal to the set maximum temperature compensation verification times R: If yes, the temperature compensation verification is completed, and step 5 is executed; if no, step 41 is executed, r=r+1; If not, go to step 2.

4. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The auxiliary heat sheet is perpendicular to the wiring body, and a bonding plane is provided on the outer wall of the heat well, and the auxiliary heat sheet is attached to the bonding plane.

5. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The wiring body is also provided with positioning pieces respectively located on both sides of the auxiliary heat piece, and a positioning area for positioning the heat well is formed between two adjacent positioning pieces.

6. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The temperature raising and lowering component comprises a temperature control element installed between the bottom plate and the temperature-changing metal, a first heat-conducting layer is arranged between the temperature control element and the bottom plate, and a second heat-conducting layer is arranged between the temperature control element and the temperature-changing metal.

7. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation cover arranged below the base plate, a heat dissipation channel is formed between the heat dissipation cover and the base plate, a heat dissipation fan is installed on the heat dissipation cover, and a heat sink located in the heat dissipation channel is arranged on the bottom surface of the base plate.

8. The method for controlling the temperature of variable metal in a temperature control device according to claim 1, characterized in that: The temperature compensation component also includes a temperature compensation control board. A power supply interface is provided on the wiring body. The temperature compensation control board is connected to the temperature compensation auxiliary heating film through the power supply interface and controls the temperature compensation power of each power supply circuit respectively.

9. The method for controlling the temperature of a variable temperature metal in a temperature control device according to any one of claims 1 to 8, characterized in that: The heat wells are arranged in at least one group, each group includes one or two rows of the heat wells arranged in a linear array, and the temperature compensation auxiliary thermal film is arranged in a one-to-one correspondence with each group of the heat wells.

10. The method for controlling the temperature of variable metal in a temperature control device according to claim 9, characterized in that: The temperature-variable metal is arranged in one-to-one correspondence with each group of the hot wells, and the hot wells belonging to the same group are arranged on a corresponding piece of the temperature-variable metal.

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