Endoscope insertion part optimization method, device, equipment and medium

Abstract

The invention relates to an endoscope insertion part optimization method and device, equipment and a medium. The method comprises the following steps: acquiring a simulation model of a to-be-optimized endoscope insertion part; the simulation model is obtained by simulating a to-be-optimized endoscope insertion part; according to the multiple groups of temperature influence parameter values of the to-be-optimized endoscope insertion part and the simulation model, determining a mapping relation between the temperature influence parameters of the to-be-optimized endoscope insertion part and the surface temperature; based on the mapping relation and the target surface temperature, determining a target parameter value of a temperature influence parameter of the endoscope insertion part to be optimized; according to the target parameter value, generating a temperature optimization scheme of the insertion part of the endoscope to be optimized; the temperature optimization scheme is used for adjusting the insertion part of the endoscope to be optimized so as to adjust the temperature of the insertion part of the endoscope to be optimized. By adopting the method, the working reliability of the endoscope can be improved.

Description

Technical Field

[0001] The present application relates to the field of medical device technology, and in particular to a method, device, equipment and medium for optimizing the insertion portion of an endoscope. Background Art

[0002] With the continuous development of medical technology, there are more and more medical devices with various functions.

[0003] Take the endoscope as an example. The endoscope is an effective clinical diagnosis and treatment method, which is mainly composed of an insertion part, an operating part and a connection part. The insertion part of the endoscope is the carrier of human-computer interaction of the entire endoscope system, and its design safety and reliability are of vital importance.

[0004] However, since the insertion part integrates a number of heat-generating components such as camera lenses and lighting lenses, the heat generated is difficult to transfer away, resulting in not only the risk of overheating of the insertion part, but also the high internal temperature of the insertion part seriously affecting the working reliability of the endoscope. Summary of the invention

[0005] Based on this, it is necessary to provide an endoscope insertion part optimization method, device, equipment and medium to address the above-mentioned technical problems, which can improve the working reliability of the endoscope.

[0006] In a first aspect, the present application provides a method for optimizing an insertion portion of an endoscope, the method comprising:

[0007] Acquire a simulation model of the endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized;

[0008] Determine a mapping relationship between the temperature-influencing parameters of the endoscope insertion portion to be optimized and the surface temperature according to a plurality of sets of temperature-influencing parameter values ​​of the endoscope insertion portion to be optimized and a simulation model;

[0009] Determining a target parameter value of a temperature-influencing parameter of an insertion portion of an endoscope to be optimized based on the mapping relationship and the target surface temperature;

[0010] A temperature optimization scheme for the endoscope insertion portion to be optimized is generated according to the target parameter value; the temperature optimization scheme is used to adjust the endoscope insertion portion to be optimized so as to adjust the temperature of the endoscope insertion portion to be optimized.

[0011] In one embodiment, obtaining a simulation model of an endoscope insertion portion to be optimized includes:

[0012] Acquiring component types and size parameters of a plurality of components in an insertion portion of an endoscope to be optimized;

[0013] constructing a finite element model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized;

[0014] Thermal simulation is performed on the finite element model to obtain a simulation model of the endoscope insertion portion to be optimized.

[0015] In one embodiment, based on component types and size parameters of multiple components in the endoscope insertion part to be optimized, a finite element model of the endoscope insertion part to be optimized is constructed, including:

[0016] constructing a geometric model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized;

[0017] In the geometric model, material parameters and environmental condition parameters of multiple components in the endoscope insertion part to be optimized are set to obtain a finite element model; the environmental condition parameters include heat transfer environment temperature and convection heat.

[0018] In one embodiment, a finite element model is subjected to thermal simulation to obtain a simulation model of the endoscope insertion portion to be optimized, including:

[0019] Perform thermal simulation on the finite element model to obtain a temperature data set corresponding to each simulation component in the finite element model;

[0020] Verify the temperature data set;

[0021] If the temperature data set fails the verification, the finite element model is determined as the simulation model of the endoscope insertion portion to be optimized.

[0022] In one embodiment, the temperature data set includes a plurality of temperature values, and verifying the temperature data set includes:

[0023] If any temperature value in the temperature data set is greater than a preset limit temperature value, it is determined that the temperature data set has not passed the verification.

[0024] In one embodiment, determining a mapping relationship between the temperature influencing parameters of the endoscope insertion portion to be optimized and the surface temperature according to multiple sets of temperature influencing parameter values ​​and a simulation model of the endoscope insertion portion to be optimized includes:

[0025] Acquire multiple groups of temperature influence parameter values ​​corresponding to the temperature influence parameters of the insertion portion of the endoscope to be optimized;

[0026] Each set of temperature-affecting parameter values ​​is simulated by the simulation model to obtain a surface temperature data set of the insert portion corresponding to each set of temperature-affecting parameter values;

[0027] According to each surface temperature data set, a mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature is determined.

[0028] In one embodiment, determining a mapping relationship between a temperature influencing parameter of an endoscope insertion portion to be optimized and the surface temperature according to each surface temperature data set includes:

[0029] Get the highest temperature value in each set of surface temperature data;

[0030] Regression analysis is performed on each maximum temperature value and multiple groups of temperature influence parameter values ​​to obtain a mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature.

[0031] In one embodiment, based on the mapping relationship and the target surface temperature, determining a target parameter value of a temperature-affecting parameter of an insertion portion of an endoscope to be optimized comprises:

[0032] According to the mapping relationship, the temperature influence parameter value corresponding to the target surface temperature is obtained, and the temperature influence parameter value corresponding to the target surface temperature is determined as the target parameter value.

[0033] In one embodiment, the temperature optimization scheme includes a target parameter value, which is used to determine a parameter difference with a current parameter value, and the parameter difference is used to adjust the endoscope insertion portion to be optimized. The current parameter value is the parameter value of the temperature influencing parameter in the endoscope insertion portion to be optimized.

[0034] In one embodiment, the parameter difference includes a power difference and a thermal resistance difference. The power difference is used to adjust the heating power of the heating component in the endoscope insertion part to be optimized, and the thermal resistance difference is used to adjust the structural relationship between multiple components in the endoscope insertion part to be optimized.

[0035] In a second aspect, the present application also provides an endoscope insertion portion optimization device, the device comprising:

[0036] A first acquisition module is used to acquire a simulation model of the endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized;

[0037] a second acquisition module, for determining a mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature according to a plurality of sets of temperature influence parameter values ​​of the endoscope insertion portion to be optimized and a simulation model;

[0038] A determination module, used to determine a target parameter value of a temperature-influencing parameter of an insertion portion of an endoscope to be optimized based on the mapping relationship and the target surface temperature;

[0039] The optimization module is used to generate a temperature optimization scheme for the endoscope insertion part to be optimized according to the target parameter value; the temperature optimization scheme is used to adjust the endoscope insertion part to be optimized so as to adjust the temperature of the endoscope insertion part to be optimized.

[0040] In a third aspect, the present application further provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the content of any one of the embodiments of the endoscope insertion portion optimization method in the first aspect is implemented.

[0041] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the content of any one of the embodiments of the endoscope insertion portion optimization method in the first aspect.

[0042] In a fifth aspect, the present application further provides a computer program product, including a computer program, which, when executed by a processor, implements the content of any one of the embodiments of the endoscope insertion portion optimization method in the first aspect.

[0043] The beneficial effects of the second to fifth aspects mentioned above can be referred to the description of the beneficial effects of the first aspect mentioned above, and will not be repeated here.

[0044] The beneficial effects of the present application relative to the prior art are as follows: in the above-mentioned optimization method for the insertion part of an endoscope, the simulation model is obtained by simulating the insertion part of the endoscope to be optimized, and the simulation process of the simulation model can truly reflect the actual situation of the insertion part of the endoscope during the application process. Based on the simulation model and multiple sets of temperature influence parameter values, the mapping relationship between the temperature influence parameter and the surface temperature can be accurately obtained. Therefore, based on the mapping relationship and the target surface temperature, the target parameter value of the temperature influence parameter can be accurately obtained. A more targeted temperature optimization scheme can be generated through the target parameter value, and the temperature optimization scheme can be used to more accurately adjust the insertion part of the endoscope to be optimized, so as to adjust the temperature of the insertion part of the endoscope to be optimized, so that the surface temperature of the obtained insertion part of the endoscope is closer to the target surface temperature during actual use, thereby avoiding the risk of overheating of the insertion part. Therefore, the working reliability of the endoscope can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A diagram showing an application environment of an endoscope insertion portion optimization method according to an embodiment;

[0046] Figure 2 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0047] Figure 3A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0048] Figure 4 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0049] Figure 5 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0050] Figure 6 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0051] Figure 7 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0052] Figure 8 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0053] Fig. 9 A schematic diagram of a process for determining a simulation model in one embodiment;

[0054] Fig.10 A schematic diagram of a flow chart of an endoscope insertion portion optimization method in one embodiment;

[0055] Fig.11 It is a structural block diagram of an endoscope insertion portion optimization device in one embodiment. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0057] Before introducing the technical solution of the present application in detail, a brief introduction to the technical background of the present application is first given.

[0058] An endoscope is mainly composed of an insertion part, an operating part, and a connection part. During the use of the endoscope, the insertion part, as the carrier of human-computer interaction of the entire endoscope system, needs to be inserted into the human body to obtain images of the target part. However, since the insertion part integrates a number of heat-generating components such as camera lenses and lighting lenses, the heat generated by them is difficult to transfer out through the insertion part, so the insertion part has the risk of overheating. The excessively high internal temperature of the insertion part seriously affects the working reliability of the internal components and shortens the normal working time and product life of the endoscope. Therefore, the safety and reliability of the insertion part of the endoscope are of vital importance.

[0059] In response to the above-mentioned problems, the present application provides a method for optimizing the insertion part of an endoscope, which uses a simulation model of the insertion part of the endoscope to simulate the insertion part to obtain optimal values ​​of temperature influencing parameters, and optimizes the insertion part of the endoscope based on the optimal values ​​of the temperature influencing parameters, so that the temperature of the optimized insertion part of the endoscope is within the normal working range, avoiding the risk of overheating of the insertion part and improving the working reliability of the endoscope.

[0060] The endoscope insertion portion optimization method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown. For example, the computer device may be a server, a personal computer, a laptop, a smart phone, a tablet computer, a smart mobile phone, etc. The computer device may include a processor, a memory and a network interface connected by a system bus or wirelessly. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device may include a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data during the optimization process of the insertion portion of the endoscope. The network interface of the computer device is used to communicate with an external terminal through a network connection, and the computer program is executed by the processor to implement a method for optimizing the insertion portion of the endoscope. Among them, the computer device can be implemented by an independent computer device or a computer device cluster composed of multiple computer devices. The applicant wants to explain that the memory of the computer device is not limited to the above-mentioned memory, and may also include a high-speed random access memory, a volatile solid-state memory, etc. In addition, the composition architecture of the computer device is not limited to the above-mentioned situation, and some components may be added or omitted.

[0061] In one embodiment, Figure 2 As shown, a method for optimizing the insertion portion of an endoscope is provided, and the method is applied to Figure 1 Taking the computer device in as an example, the method includes the following steps: S201 to S204.

[0062] S201, obtaining a simulation model of an endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized.

[0063] The simulation model of the endoscope insertion part refers to a physical simulation model obtained by simulating the actual parameters of the endoscope insertion part.

[0064] In this embodiment, the computer device can obtain the actual parameters of the endoscope insertion part to be optimized, such as size parameters and material parameters, etc. Then, according to the actual parameters of the endoscope insertion part to be optimized, a simulation model corresponding to the endoscope insertion part to be optimized is established. The simulation model can realistically simulate the temperature change of the endoscope insertion part when it is working.

[0065] S202 : Determine a mapping relationship between the temperature influencing parameters of the endoscope insertion portion to be optimized and the surface temperature according to a plurality of sets of temperature influencing parameter values ​​of the endoscope insertion portion to be optimized and a simulation model.

[0066] The temperature influencing parameter refers to a parameter that affects the temperature of the insertion portion of the endoscope. For example, the temperature influencing parameter may include the heating power of the heating component in the insertion portion, the heat transfer resistance between the heating component in the insertion portion and other components, etc. The heating component includes a camera lens and an illumination lens.

[0067] In this embodiment, for any set of temperature influence parameter values, the computer device can input the temperature influence parameter values ​​into the simulation model. The simulation model is used to simulate the surface temperature of the endoscope insertion part under the temperature influence parameter values ​​to obtain each set of temperature influence parameter values ​​and the corresponding surface temperature of the endoscope insertion part. Each set of temperature influence parameter values ​​and the corresponding surface temperature of the endoscope insertion part are then analyzed to obtain a mapping relationship between the temperature influence parameter and the surface temperature of the endoscope insertion part to be optimized.

[0068] S203: Determine a target parameter value of a temperature influencing parameter of the endoscope insertion portion to be optimized based on the mapping relationship and the target surface temperature.

[0069] Among them, the target surface temperature is a suitable temperature value when the endoscope insertion part is working. It should be noted that the endoscope insertion part includes multiple components, and there may be differences in the temperature of each component, and there may also be differences in the temperature of different positions on each component, so the target surface temperature can also be a range. For example, the target surface temperature can be 37°-37.2°, which means that the surface temperature of each component in the endoscope insertion part cannot exceed 37.2°, otherwise there will be a risk of overheating. The target parameter value represents the value of the temperature influencing parameter when the temperature of the endoscope insertion part is at the target surface temperature.

[0070] In this embodiment, after the computer device obtains the mapping relationship between the temperature influencing parameter and the surface temperature of the endoscope insertion part to be optimized, given the target surface temperature of the endoscope insertion part, the mapping relationship is used to determine the parameter value corresponding to the target surface temperature of the endoscope insertion part, and the parameter value is determined as the target parameter value of the temperature influencing parameter.

[0071] S204, generating a temperature optimization scheme for the endoscope insertion portion to be optimized according to the target parameter value, wherein the temperature optimization scheme is used to adjust the endoscope insertion portion to be optimized so as to adjust the temperature of the endoscope insertion portion to be optimized.

[0072] In this embodiment, after the computer device obtains the target parameter value of the temperature influence parameter, the adjustment value of the temperature influence parameter of the endoscope insertion portion to be optimized can be determined by the target parameter value. For example, the adjustment value of the temperature influence parameter can be the adjustment value of the heating power, the adjustment value of the heat transfer resistance, etc. Then, according to the adjustment value of the temperature influence parameter, a temperature optimization scheme is generated. The temperature optimization scheme can be displayed in the form of a list, text or graphic.

[0073] In one embodiment, the temperature optimization scheme in step S204 is mainly introduced. The temperature optimization scheme includes target parameter values, that is, the temperature optimization scheme provides the optimization target of the temperature-affecting parameter. Based on the optimization target, the optimization standard of the endoscope insertion part can be provided.

[0074] In addition, the target parameter value is used to determine the parameter difference with the current parameter value, and the parameter difference is used to adjust the endoscope insertion part to be optimized. Among them, the current parameter value is the parameter value of the temperature-affecting parameter in the endoscope insertion part to be optimized. For example, the current parameter can be the current heating power of the camera lens, the current heating power of the camera lens, the current heat transfer resistance between the camera lens and other components in the insertion part, the current heat transfer resistance between the camera lens and other components, etc.

[0075] In the process of generating a temperature optimization scheme using the target parameter value, it is first necessary to obtain the current parameter value of the temperature influencing parameter in the endoscope insertion part to be optimized, which can be measured by a sensor. Then calculate the difference between the current parameter value and the target parameter value, and the difference is the adjustment value of the temperature influencing parameter. The endoscope insertion part to be optimized can be directly adjusted using the adjustment value of the temperature influencing parameter. It should be noted that the temperature optimization scheme may also include parameter differences of the temperature influencing parameters. Among them, the parameter difference may include a power difference and a thermal resistance difference, the power difference may be used to adjust the heating power of the heating component in the endoscope insertion part to be optimized, and the thermal resistance difference may be used to adjust the structural relationship between multiple components in the endoscope insertion part to be optimized.

[0076] After obtaining the temperature optimization scheme of the endoscope insertion part to be optimized, the technician can further optimize the endoscope insertion part to be optimized according to the content contained in the temperature optimization scheme. For example, when the temperature optimization scheme includes the optimization of heating power, the technician can optimize the heating components in the endoscope insertion part according to the adjustment value of the heating power. Or, when the temperature optimization scheme includes the optimization of heat transfer resistance, the technician can optimize the heat transfer resistance between the various components in the endoscope insertion part according to the adjustment value of the heat transfer resistance.

[0077] As an optional embodiment of the present application, the optimization process of heat transfer thermal resistance can be achieved by the following methods: (1) changing the materials of each component in the insertion part and using materials with better thermal conductivity to make each component in the endoscope; (2) increasing the contact area between the components in the insertion part and reducing the roughness and surface unevenness of the mating surface; (3) using an adhesive with better thermal conductivity to connect the components in the endoscope and minimize unfilled defects such as cavities.

[0078] In the above-mentioned optimization method for the endoscope insertion part, the simulation model is obtained by simulating the endoscope insertion part to be optimized, and the simulation process of the simulation model can truly reflect the actual situation of the endoscope insertion part during the application process. Based on the simulation model and multiple sets of temperature influence parameter values, the mapping relationship between the temperature influence parameter and the surface temperature can be accurately obtained. Therefore, based on the mapping relationship and the target surface temperature, the target parameter value of the temperature influence parameter can be accurately obtained. A more targeted temperature optimization scheme can be generated through the target parameter value, and the temperature optimization scheme can be used to more accurately adjust the endoscope insertion part to be optimized, so as to adjust the temperature of the endoscope insertion part to be optimized, so that the surface temperature of the obtained endoscope insertion part is closer to the target surface temperature during actual use, thereby avoiding the risk of overheating of the insertion part. Therefore, the working reliability of the endoscope can be improved.

[0079] Based on the above embodiments, this embodiment is to Figure 2 The relevant contents of step S201 "obtaining a simulation model of the endoscope insertion portion to be optimized" are introduced and explained. Figure 3 As shown, as a non-limiting example, the above step S201 may include the following contents: S301 to S303.

[0080] S301, obtaining component types and size parameters of a plurality of components in an insertion portion of an endoscope to be optimized.

[0081] The specific components included in the endoscope insertion part to be optimized can be determined according to the actual application. For example, in some embodiments, it can include components such as a head end seat, a head end cover, a snake bone, a camera lens, and a camera lens. The size parameter refers to the size of multiple components in the insertion part. For example, the size parameter may include the length, width, height, diameter, and aperture of the component.

[0082] In this embodiment, the computer device can obtain the parameter information of the endoscope to be optimized from the endoscope parameter information database, and filter out the parameter information corresponding to the insertion part from the parameter information of the endoscope to be optimized, so as to obtain the component types and size parameters of multiple components in the insertion part. Alternatively, the computer device can use a trained component recognition model to identify multiple components of the insertion part of the endoscope to be optimized to obtain the component type of each component. In addition, the computer device can send a measurement instruction to the sensor, measure the size parameters of multiple components in the insertion part of the endoscope to be optimized through the sensor, and the sensor sends the measured size parameters to the computer device. In this way, the computer device can obtain the component type and size parameters of each component.

[0083] S302: constructing a finite element model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized.

[0084] In this embodiment, after obtaining the component types and size parameters of multiple components in the endoscope insertion part to be optimized, the position and size of each component in the finite element model can be determined according to the component type and size parameters. After all components in the finite element model are determined, the obtained model is assigned material type parameters and meshed, and the relevant heat transfer initial conditions, boundary conditions and thermal loads are set to obtain the finite element model of the endoscope insertion part to be optimized.

[0085] S303, performing thermal simulation on the finite element model to obtain a simulation model of the endoscope insertion portion to be optimized.

[0086] In this embodiment, the computer device can use the constructed finite element model to simulate the working process of the endoscope insertion part, and compare the temperature distribution data simulated by the finite element model with the actual temperature distribution data. If the error between the two temperature distribution data is within the preset error range, the finite element model is determined as the simulation model of the endoscope insertion part to be optimized.

[0087] In the embodiment of the present application, the finite element model is constructed using the real size parameters of multiple components in the endoscope insertion part to be optimized, and the obtained finite element model is closer to the real endoscope insertion part. The thermal simulation using the finite element model can accurately simulate the actual working process of the endoscope insertion part, making the obtained simulation model of the endoscope insertion part to be optimized more accurate.

[0088] Based on the above embodiments, this embodiment is to Figure 3 The relevant contents of step S302 "building a finite element model of the endoscope insertion part to be optimized based on the component types and size parameters of the multiple components in the endoscope insertion part to be optimized" are introduced and explained. Figure 4 As shown, as a non-limiting example, the above step S302 may include the following contents: S401 to S402.

[0089] S401, constructing a geometric model of the endoscope insertion part to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion part to be optimized.

[0090] The three-dimensional grid structure represents the volume grid of the geometric shape of the endoscope insertion part to be optimized, and the three-dimensional grid structure is used for the subsequent simulation process.

[0091] In this embodiment, the computer device can use a segmentation method based on active contours to interactively segment the endoscope insertion part to be optimized to obtain an initial mesh. Since the initial mesh may contain irrelevant elements, it is necessary to continuously smooth and extract the initial mesh to improve the mesh quality while reducing the number of surface meshes, thereby improving the simulation efficiency. The smoothed and extracted mesh is used as the three-dimensional mesh structure of the endoscope insertion part to be optimized. The three-dimensional mesh structure of the endoscope insertion part to be optimized can also be obtained by other segmentation methods, which may be mapping method, grid method, node connection method and topological decomposition method. After obtaining the three-dimensional mesh structure, it is necessary to perform finite element simulation on the three-dimensional mesh structure.

[0092] S402, setting material parameters and environmental condition parameters of multiple components in the endoscope insertion part to be optimized in the geometric model to obtain a finite element model; the environmental condition parameters include heat transfer environment temperature and convection heat.

[0093] In this embodiment, after obtaining the geometric model of the endoscope insertion part to be optimized, the computer device can set the material parameters, heat transfer environment temperature and convection heat of each component in the endoscope insertion part to be optimized in the geometric model to obtain a finite element model. The heat transfer environment temperature is the environment temperature in the human body, for example, the environment temperature in the human body can be the environment temperature inside the stomach or the environment temperature inside the intestine.

[0094] In the embodiment of the present application, the component types, size parameters, material parameters and environmental conditions of the multiple components in the endoscope insertion part to be optimized are used to construct a finite element model of the endoscope insertion part to be optimized, and the obtained finite element model can better reflect the actual situation of the endoscope insertion part. Therefore, the actual working process of the endoscope insertion part can be simulated more accurately using the finite element model, and the simulation result obtained is more accurate.

[0095] Based on the above embodiments, this embodiment is to Figure 3 The relevant contents of step S303 "performing thermal simulation on the finite element model to obtain a simulation model of the endoscope insertion portion to be optimized" are introduced and explained. Figure 5 As shown, as a non-limiting example, the above step S303 may include the following contents: S501 to S503.

[0096] S501, performing thermal simulation on the finite element model to obtain a temperature data set corresponding to each simulation component in the finite element model.

[0097] In this embodiment, the computer device can set the solution step size, time and iteration number for the finite element model of the endoscope insertion part to be optimized, simulate the finite element model, and simulate the actual working condition of the endoscope insertion part to be optimized. The solution is performed through multiple iterations, and when convergence is completed, the temperature data set on each simulation component is obtained.

[0098] S502, verifying the temperature data set.

[0099] In this embodiment, the purpose of verifying the temperature data set is to determine whether there is an over-temperature situation. Each temperature data set includes multiple temperature data, and the computer device can verify each temperature data, and determine the verification result of the temperature data set based on the verification result of each temperature data. Alternatively, the computer device can also calculate the average value of all temperature data in the temperature data set, verify the average value, and determine the verification result of the average value as the verification result of the temperature data set. This embodiment does not limit the way to verify the temperature data set.

[0100] S503: If the temperature data set fails the verification, the finite element model is determined as the simulation model of the endoscope insertion portion to be optimized.

[0101] In this embodiment, when it is determined that the temperature data set has not been verified, it is determined that the simulation model can more accurately represent the actual situation of the endoscope insertion portion to be optimized. At this time, the computer device can determine the finite element model as the simulation model of the endoscope insertion portion to be optimized.

[0102] In the embodiment of the present application, by performing thermal simulation on the finite element model, the temperature data set of the endoscope insertion part can be accurately obtained. Then, by verifying the temperature data set, it can be accurately determined whether the temperature data set is over-temperature, so that the simulation model of the endoscope insertion part can be accurately obtained.

[0103] Based on the above embodiments, this embodiment is to Figure 5 As a non-limiting example, the above step S502 may include the following content: if any temperature value in the temperature data set is greater than a preset limit temperature value, it is determined that the temperature data set has not been verified.

[0104] In this embodiment, during the verification of the temperature data set, when any temperature data in the temperature data set exceeds the preset limit temperature value, it indicates that the position corresponding to the temperature data has an over-temperature risk. That is, as long as there is an over-temperature risk at one position, the finite element model can truly represent the endoscope insertion portion to be optimized. Therefore, the computer device can verify the temperature data set according to whether the temperature data in the temperature data set is greater than the preset limit temperature value, and determine whether the finite element model can truly reflect the endoscope insertion portion to be optimized according to the verification result.

[0105] It is understandable that the computer device can compare the temperature data with the preset limit temperature value in the order of the temperature data in the temperature data set. Once it is detected that a certain temperature data is greater than the preset limit temperature value, the comparison is stopped and it is determined that the temperature data set has not been verified. Alternatively, the computer device can search for the highest temperature data from the temperature data set and compare the highest temperature data with the preset limit temperature value. If the highest temperature data is greater than the preset limit temperature value, it is determined that the temperature data set has not been verified. This embodiment does not limit the method for determining that any temperature value in the temperature data set is greater than the preset limit temperature value.

[0106] In the embodiment of the present application, when it is determined that any temperature value in the temperature data set is greater than the preset limit temperature value, it can be determined that the endoscope to be optimized has an over-temperature risk. Thus, it can be accurately determined that the temperature data set has not been verified, so as to improve the accuracy of the verification process of the temperature data set.

[0107] Based on the above embodiments, this embodiment is to Figure 2 The relevant contents of step S202 of "determining the mapping relationship between the temperature influence parameter of the endoscope insertion part to be optimized and the surface temperature according to the multiple groups of temperature influence parameter values ​​of the endoscope insertion part to be optimized and the simulation model" are introduced and explained. Figure 6As shown, as a non-limiting example, the above step S202 may include the following contents: S601 to S603.

[0108] S601, obtaining a plurality of groups of temperature influence parameter values ​​corresponding to the temperature influence parameters of the insertion portion of the endoscope to be optimized.

[0109] In this embodiment, the computer device can analyze each parameter of the temperature influence parameter of the endoscope insertion part to be optimized, and take multiple parameter values ​​for each parameter, so as to obtain multiple groups of temperature influence parameter values ​​corresponding to each group of temperature influence parameters. Among them, the multiple groups of temperature influence parameter values ​​corresponding to the temperature influence parameters are shown in Table 1, 1-n represents the nth group of temperature influence parameter values, and ae represents the heating power of the camera lens, the heating power of the camera lens, the heat transfer resistance between the camera lens and the insertion part, the heat transfer resistance between the camera lens and the insertion part, and the heat transfer resistance between other components of the insertion part.

[0110] Table 1

[0111]

[0112] S602, simulating each set of temperature influencing parameter values ​​through a simulation model to obtain a surface temperature data set of the insert portion corresponding to each set of temperature influencing parameter values.

[0113] In this embodiment, after obtaining multiple sets of temperature influence parameter values ​​corresponding to the temperature influence parameters, for any set of temperature influence parameters, the computer device can input the set of temperature influence parameters into the simulation model. The simulation model is used to simulate each set of temperature influence parameter values ​​to obtain the surface temperature data set of the insert portion corresponding to the set of temperature influence parameters. The surface temperature data set of the insert portion corresponding to each set of temperature influence parameter values ​​can be represented by Table 2.

[0114] S603: Determine, based on each surface temperature data set, a mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature.

[0115] In this embodiment, after obtaining multiple sets of temperature-affecting parameter values ​​and corresponding surface temperature data sets, the computer device can use software analysis tools to perform statistical analysis on the multiple sets of temperature-affecting parameter values ​​and corresponding surface temperature data sets to obtain a mapping relationship between the temperature-affecting parameter of the endoscope insertion portion to be optimized and the surface temperature. The statistical analysis method includes but is not limited to regression analysis, variance analysis, or T-test.

[0116] Table 2

[0117] Insert surface temperature f 1 <![CDATA[f1]]> 2 <![CDATA[f2]]> 3 <![CDATA[f3]]> n <![CDATA[f n ]]>

[0118] In the embodiment of the present application, by simulating and analyzing each set of temperature-affecting parameter values ​​through a simulation model, the surface temperature data corresponding to each set of temperature-affecting parameter values ​​can be accurately obtained. Based on multiple sets of independent variable data and corresponding dependent variable data, the mapping relationship between the temperature-affecting parameter of the insertion portion of the endoscope to be optimized and the surface temperature can be accurately obtained.

[0119] Based on the above embodiments, this embodiment is to Figure 6 The relevant contents of step S603 "determining the mapping relationship between the temperature influence parameter and the surface temperature of the endoscope insertion portion to be optimized according to each surface temperature data set" are introduced and explained. Figure 7 As shown, as a non-limiting example, the above step S603 may include the following contents: S701 to S702.

[0120] S701, obtaining the highest temperature value in each set of surface temperature data.

[0121] In this embodiment, for any set of surface temperature data sets, the highest temperature value therein is determined. For example, the temperature data in the surface temperature data set can be arranged according to a preset rule, and the highest temperature value in the surface temperature data set is determined according to the arrangement order of the temperature data. Among them, the preset rule can be a rule from large to small, and the highest temperature value is the temperature data arranged first. Alternatively, the preset rule can also be a rule from small to large, and the highest temperature value is the temperature data arranged last. Alternatively, the preset rule can also be other types of rules, and this embodiment does not limit the preset rule. In the above manner, the computer device can obtain the highest temperature value in each set of surface temperature data sets.

[0122] S702, performing regression analysis on each maximum temperature value and multiple groups of temperature influencing parameter values ​​to obtain a mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature.

[0123] In this embodiment, in the process of analyzing each maximum temperature value and multiple groups of temperature influence parameter values ​​by regression analysis, multiple groups of temperature influence parameter values ​​and corresponding maximum surface temperature data sets are input into the software analysis tool. The temperature influence parameter is set as an independent variable, for example, the independent variable includes the heating power a of the camera lens, the heating power b of the camera lens, the heat transfer resistance c between the camera lens and the insertion part, the heat transfer resistance d between the camera lens and the insertion part, and the heat transfer resistance e between other parts of the insertion part. The maximum surface temperature f of the insertion part is set as the dependent variable, and the independent variable and the dependent variable are analyzed to determine the coefficient AF corresponding to each independent variable. The mapping relationship between the temperature influence parameter and the surface temperature of the insertion part of the endoscope to be optimized can be expressed as: f = A + Ba + Cb + Dc + Ed + Fe.

[0124] In the embodiment of the present application, the highest temperature value is found from each temperature data set, and the highest temperature value represents the highest surface temperature of the insertion part under the temperature influence parameter value of the group. By performing regression analysis on the highest surface temperature and multiple groups of temperature influence parameter values, the mapping relationship between the temperature influence parameter and the surface temperature of the insertion part of the endoscope to be optimized is more accurate and reasonable.

[0125] Based on the above embodiments, this embodiment is to Figure 2 The relevant contents of step S203 "determining the target parameter value of the temperature influence parameter of the endoscope insertion portion to be optimized based on the mapping relationship and the target surface temperature" are introduced and explained. As a non-limiting example, the above step S203 may include the following contents: according to the mapping relationship, obtaining the temperature influence parameter value corresponding to the target surface temperature, and determining the temperature influence parameter value corresponding to the target surface temperature as the target parameter value.

[0126] In this embodiment, after the mapping relationship is obtained, the target surface temperature can be determined according to the actual use process of the endoscope insertion part. The computer device can input the target surface temperature into the mapping relationship to obtain the temperature influence parameter value corresponding to the target surface temperature. The temperature influence parameter value corresponding to the target surface temperature is the target optimization parameter value of the endoscope insertion part.

[0127] In the embodiment of the present application, by analyzing the target surface temperature through a mapping relationship, the temperature influence parameter value corresponding to the target surface temperature can be accurately obtained, and the endoscope insertion portion to be optimized can be accurately optimized through the temperature influence parameter value.

[0128] As a specific embodiment of the present application, Figure 8 As shown, the endoscope insertion portion optimization method includes: S801 to S812.

[0129] S801, obtaining component types and size parameters of multiple components in the endoscope insertion portion to be optimized;

[0130] S802, constructing a geometric model of the endoscope insertion portion to be optimized based on component types and size parameters of multiple components in the endoscope insertion portion to be optimized;

[0131] S803, setting material parameters and environmental condition parameters of multiple components in the endoscope insertion portion to be optimized in the geometric model to obtain a finite element model;

[0132] S804, performing thermal simulation on the finite element model to obtain a temperature data set corresponding to each simulation component in the finite element model;

[0133] S805, if any temperature value in the temperature data set is greater than a preset limit temperature value, it is determined that the temperature data set has not passed the verification;

[0134] S806, determining the finite element model as a simulation model of the endoscope insertion portion to be optimized;

[0135] S807, obtaining multiple groups of temperature influence parameter values ​​corresponding to the temperature influence parameters of the insertion portion of the endoscope to be optimized;

[0136] S808, simulating each set of temperature influence parameter values ​​through the simulation model to obtain a surface temperature data set of the insert portion corresponding to each set of temperature influence parameter values;

[0137] S809, obtaining the highest temperature value in each set of surface temperature data sets;

[0138] S810, performing regression analysis on each maximum temperature value and multiple groups of temperature influence parameter values ​​to obtain a mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature;

[0139] S811, acquiring a temperature influence parameter value corresponding to the target surface temperature according to the mapping relationship, and determining the temperature influence parameter value corresponding to the target surface temperature as the target parameter value;

[0140] S812: Generate a temperature optimization plan for the endoscope insertion portion to be optimized according to the target parameter value.

[0141] The implementation principles, details and beneficial effects of the embodiments of the present application can all be referred to above. Figures 2 to 7 The relevant description of the illustrated embodiment is not repeated here.

[0142] Fig. 9 The present invention is a flow chart of determining a simulation model in an embodiment, and the process includes: S901: obtaining the component structure and size parameters of each component in the insertion part of the endoscope; S902: constructing a finite element model of the insertion part based on the component structure and size parameters of each component; S903: performing finite element thermal simulation on the finite element model; S904: obtaining the surface temperature field distribution of the insertion part, S905: judging whether the surface temperature is greater than the limit temperature; S906: if less than, re-designing and optimizing the finite element model; S907: if greater than, using the obtained finite element model as the simulation model of the insertion part of the endoscope to be optimized.

[0143] The implementation principles, details and beneficial effects of the embodiments of the present application can all be referred to above. Figures 2 to 7 The relevant description of the illustrated embodiment is not repeated here.

[0144] Fig.10The present invention is a flow chart of an optimization method for an endoscope insertion portion in an embodiment, the method comprising: S1001: simulating multiple groups of temperature influence parameter values ​​using a simulation model to obtain multiple groups of surface temperature data sets; S1002: searching for the highest temperature value from the multiple groups of surface temperature data sets; S1003: performing regression analysis on the multiple groups of temperature influence parameters and the corresponding highest temperature values ​​to obtain a mapping relationship between the two; S1004: determining a target parameter value of the temperature influence parameter based on the mapping relationship and the target surface temperature; S1005: optimizing the endoscope insertion portion based on the target parameter value.

[0145] The implementation principles, details and beneficial effects of the embodiments of the present application can all be referred to above. Figures 2 to 7 The relevant description of the illustrated embodiment is not repeated here.

[0146] It should be understood that, although the steps in the flowcharts involved in the above embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0147] Based on the same inventive concept, the embodiment of the present application also provides an endoscope insertion part optimization device for implementing the endoscope insertion part optimization method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more endoscope insertion part optimization device embodiments provided below can refer to the limitations of the endoscope insertion part optimization method above, and will not be repeated here.

[0148] In one embodiment, Fig.11 As shown, an endoscope insertion portion optimization device is provided, comprising: a first acquisition module 11, a second acquisition module 12, a determination module 13 and an optimization module 14, wherein:

[0149] A first acquisition module 11 is used to acquire a simulation model of the endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized;

[0150] A second acquisition module 12 is used to determine a mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature according to multiple groups of temperature influence parameter values ​​of the endoscope insertion portion to be optimized and the simulation model;

[0151] A determination module 13, used to determine a target parameter value of a temperature influencing parameter of an insertion portion of an endoscope to be optimized based on the mapping relationship and the target surface temperature;

[0152] The optimization module 14 is used to generate a temperature optimization scheme for the endoscope insertion portion to be optimized according to the target parameter value; the temperature optimization scheme is used to adjust the endoscope insertion portion to be optimized so as to adjust the temperature of the endoscope insertion portion to be optimized.

[0153] The temperature optimization scheme includes a target parameter value, which is used to determine the parameter difference between the target parameter value and the current parameter value, and the parameter difference is used to adjust the endoscope insertion part to be optimized, and the current parameter value is the parameter value of the temperature-affecting parameter in the endoscope insertion part to be optimized. The parameter difference includes a power difference and a thermal resistance difference, and the power difference is used to adjust the heating power of the heating component in the endoscope insertion part to be optimized, and the thermal resistance difference is used to adjust the structural relationship between multiple components in the endoscope insertion part to be optimized.

[0154] In one embodiment, the first acquisition module 11 includes: a first acquisition unit, a construction unit, and a second acquisition unit, wherein:

[0155] A first acquisition unit, configured to acquire component types and size parameters of a plurality of components in an insertion portion of an endoscope to be optimized;

[0156] A construction unit, configured to construct a finite element model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized;

[0157] The second acquisition unit is used to perform thermal simulation on the finite element model to acquire a simulation model of the endoscope insertion portion to be optimized.

[0158] In one embodiment, the above-mentioned construction unit is also used to construct a geometric model of the endoscope insertion part to be optimized based on the component types and size parameters of the multiple components in the endoscope insertion part to be optimized; the material parameters and environmental condition parameters of the multiple components in the endoscope insertion part to be optimized are set in the geometric model to obtain a finite element model; the environmental condition parameters include heat transfer ambient temperature and convection heat.

[0159] In one embodiment, the second acquisition unit is also used to perform thermal simulation on the finite element model to obtain a temperature data set corresponding to each simulation component in the finite element model; verify the temperature data set; if the temperature data set fails the verification, the finite element model is determined as a simulation model of the endoscope insertion part to be optimized.

[0160] In one embodiment, the second acquisition unit is further configured to determine that the temperature data set has not passed the verification if any temperature value in the temperature data set is greater than a preset limit temperature value.

[0161] In one embodiment, the second acquisition module includes: a third acquisition unit, a simulation unit and a first determination unit, wherein:

[0162] A third acquisition unit, used to acquire multiple groups of temperature influence parameter values ​​corresponding to the temperature influence parameters of the endoscope insertion portion to be optimized;

[0163] A simulation unit, used for simulating each set of temperature-affecting parameter values ​​through a simulation model to obtain a surface temperature data set of the insert portion corresponding to each set of temperature-affecting parameter values;

[0164] The first determination unit is used to determine the mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature according to each surface temperature data set.

[0165] In one embodiment, the first determination unit is also used to obtain the highest temperature value in each set of surface temperature data; perform regression analysis on each highest temperature value and multiple sets of temperature influencing parameter values ​​to obtain a mapping relationship between the temperature influencing parameters of the endoscope insertion part to be optimized and the surface temperature.

[0166] In one embodiment, the above-mentioned determination module includes a second determination unit, wherein:

[0167] The second determining unit is used to obtain the temperature influence parameter value corresponding to the target surface temperature according to the mapping relationship, and determine the temperature influence parameter value corresponding to the target surface temperature as the target parameter value.

[0168] Each module in the above-mentioned endoscope insertion part optimization device can be implemented in whole or in part by software, hardware and their combination. Each of the above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0169] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the content of any one embodiment of the above-mentioned endoscope insertion portion optimization method is implemented.

[0170] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the content of any one embodiment of the above-mentioned endoscope insertion portion optimization method is implemented.

[0171] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the content of any one of the embodiments of the above-mentioned endoscope insertion portion optimization method.

[0172] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0173] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0174] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0175] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for optimizing an insertion portion of an endoscope, characterized in that: The method comprises: Acquire a simulation model of the endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized; Determining a mapping relationship between the temperature-influencing parameters of the endoscope insertion portion to be optimized and the surface temperature according to the multiple groups of temperature-influencing parameter values ​​of the endoscope insertion portion to be optimized and the simulation model; Determining a target parameter value of the temperature-influencing parameter of the endoscope insertion portion to be optimized based on the mapping relationship and the target surface temperature; A temperature optimization scheme for the endoscope insertion portion to be optimized is generated according to the target parameter value; the temperature optimization scheme is used to adjust the endoscope insertion portion to be optimized so as to adjust the temperature of the endoscope insertion portion to be optimized.

2. The method according to claim 1, characterized in that The step of obtaining a simulation model of the endoscope insertion portion to be optimized comprises: Acquiring component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized; constructing a finite element model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized; A thermal simulation is performed on the finite element model to obtain a simulation model of the endoscope insertion portion to be optimized.

3. The method according to claim 2, characterized in that The step of constructing a finite element model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized comprises: constructing a geometric model of the endoscope insertion portion to be optimized based on component types and size parameters of a plurality of components in the endoscope insertion portion to be optimized; The material parameters and environmental condition parameters of the multiple components in the endoscope insertion part to be optimized are set in the geometric model to obtain the finite element model; the environmental condition parameters include heat transfer environment temperature and convection heat.

4. The method according to claim 2, characterized in that: The thermal simulation of the finite element model to obtain the simulation model of the endoscope insertion portion to be optimized includes: Performing thermal simulation on the finite element model to obtain a temperature data set corresponding to each simulation component in the finite element model; Verifying the temperature data set; If the temperature data set fails the verification, the finite element model is determined as the simulation model of the endoscope insertion portion to be optimized.

5. The method according to claim 4, characterized in that The temperature data set includes a plurality of temperature values, and the verifying the temperature data set includes: If any temperature value in the temperature data set is greater than a preset limit temperature value, it is determined that the temperature data set has not passed the verification.

6. The method according to any one of claims 1 to 5, characterized in that: Determining the mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature according to the multiple groups of temperature influence parameter values ​​of the endoscope insertion portion to be optimized and the simulation model includes: Acquire multiple groups of temperature influence parameter values ​​corresponding to the temperature influence parameters of the endoscope insertion portion to be optimized; Each set of temperature-affecting parameter values ​​is simulated by the simulation model to obtain a surface temperature data set of the insert portion corresponding to each set of temperature-affecting parameter values; According to each of the surface temperature data sets, a mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature is determined.

7. The method according to claim 6, characterized in that Determining the mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature according to each of the surface temperature data sets includes: Obtaining the highest temperature value in each set of surface temperature data sets; A regression analysis is performed on each of the maximum temperature values ​​and the multiple groups of temperature influencing parameter values ​​to obtain a mapping relationship between the temperature influencing parameter of the endoscope insertion portion to be optimized and the surface temperature.

8. The method according to any one of claims 1 to 5, characterized in that: The step of determining a target parameter value of the temperature-influencing parameter of the endoscope insertion portion to be optimized based on the mapping relationship and the target surface temperature comprises: According to the mapping relationship, the temperature influence parameter value corresponding to the target surface temperature is acquired, and the temperature influence parameter value corresponding to the target surface temperature is determined as the target parameter value.

9. The method according to any one of claims 1 to 5, characterized in that: The temperature optimization scheme includes the target parameter value, which is used to determine the parameter difference with the current parameter value, and the parameter difference is used to adjust the endoscope insertion part to be optimized. The current parameter value is the parameter value of the temperature influencing parameter in the endoscope insertion part to be optimized.

10. The method according to claim 9, characterized in that The parameter difference includes a power difference and a thermal resistance difference. The power difference is used to adjust the heating power of the heating component in the endoscope insertion part to be optimized, and the thermal resistance difference is used to adjust the structural relationship between multiple components in the endoscope insertion part to be optimized.

11. An endoscope insertion portion optimization device, characterized in that: The device comprises: A first acquisition module is used to acquire a simulation model of the endoscope insertion portion to be optimized; the simulation model is obtained by simulating the endoscope insertion portion to be optimized; a second acquisition module, configured to determine a mapping relationship between the temperature influence parameter of the endoscope insertion portion to be optimized and the surface temperature according to the multiple groups of temperature influence parameter values ​​of the endoscope insertion portion to be optimized and the simulation model; A determination module, configured to determine a target parameter value of the temperature influencing parameter of the endoscope insertion portion to be optimized based on the mapping relationship and the target surface temperature; The optimization module is used to generate a temperature optimization scheme for the endoscope insertion portion to be optimized according to the target parameter value; the temperature optimization scheme is used to adjust the endoscope insertion portion to be optimized so as to adjust the temperature of the endoscope insertion portion to be optimized.

12. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 10 are implemented.

13. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 10 are implemented.

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