Chip purchasing mode determination method, device and equipment and readable storage medium
By comparing the cost difference under the chip procurement model, product manufacturing companies can help select reasonable procurement models, solve the problem of difficult to reduce chip procurement costs in the existing technology, and achieve the reduction of chip procurement costs.
Patent Information
- Application Number
- CN202411445865.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-01-07
AI Technical Summary
The existing chip procurement model is single, making it difficult for product manufacturers to reduce chip procurement costs through quantity-price relationships.
By determining the target type of chips, comparing the cost difference between the decentralized procurement model and the centralized procurement model, helping product manufacturing companies choose reasonable procurement models and reduce chip procurement costs.
The reduction of chip procurement costs has been achieved. By calculating the cost difference in each procurement model, the centralized procurement model is recommended to reduce the total price.
Smart Images
Figure CN119273381A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of procurement management, and in particular to a chip procurement mode determination method, device, equipment and readable storage medium. Background Art
[0002] In today's digital and information age, the importance of chips as core components of modern electronic devices is self-evident. Chips are widely used in many fields such as computers, smart phones, automotive electronics, industrial control, etc. Usually, product manufacturers purchase the controllers required for products from first-tier suppliers, and first-tier suppliers purchase the chips required for controllers from second-tier suppliers. After the controllers are manufactured, the first-tier suppliers supply the finished controllers to product manufacturers. However, this single procurement model is not conducive to product manufacturers reducing chip procurement costs by exchanging quantity for price. Summary of the invention
[0003] The present application provides a chip procurement mode determination method, device, equipment and readable storage medium, which can help product manufacturers reasonably select chip procurement modes, thereby reducing chip procurement costs.
[0004] In a first aspect, an embodiment of the present application provides a method for determining a chip procurement mode, the method comprising:
[0005] Determine a target category from the chip categories according to the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers;
[0006] Determine a first estimated cost of the target type of chips under a decentralized procurement mode and a second estimated cost under a centralized procurement mode, wherein the decentralized procurement mode means that multiple first-tier suppliers purchase the target type of chips from second-tier suppliers respectively, and the centralized procurement cost means that the product manufacturing enterprise purchases the target type of chips from second-tier suppliers uniformly;
[0007] The difference between the first estimated cost and the second estimated cost is determined as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement model of the target type of chip according to the cost reduction benefit.
[0008] Further, in one embodiment, the step of determining a first estimated cost of the target type of chips in a decentralized procurement mode and a second estimated cost in a centralized procurement mode comprises:
[0009] Determine the first purchase quantity of each first-tier supplier for the target type of chips, and determine the sum of all first purchase quantities as the second purchase quantity of the product manufacturing enterprise for the target type of chips;
[0010] Determine a first unit price of the target type chip at each first purchase quantity and a second unit price at a second purchase quantity based on a purchase quantity-purchase unit price coefficient curve and a reference unit price of the target type chip at a reference purchase quantity;
[0011] determining the sum of the products of all first purchase quantities and their corresponding first unit prices as the first estimated cost;
[0012] The product of the second purchase quantity and the second unit price is determined as the second estimated cost.
[0013] Further, in one embodiment, the same type of controllers are provided by the same first-tier supplier;
[0014] The calculation formula for the first purchase quantity is:
[0015]
[0016] Among them, S u,i represents the first purchase quantity of the target type chip i by the first-tier supplier u, P x,y M represents the unit usage of controller y provided by first-tier supplier u in product x. x represents the planned production quantity of product x by the product manufacturing company, Q i,y Represents the unit usage of target type chip i in controller y.
[0017] Furthermore, in one embodiment, before the step of determining the first unit price of the target type chip at each first purchase quantity and the second unit price at the second purchase quantity based on the purchase quantity-purchase unit price coefficient curve and the reference unit price of the target type chip at the reference purchase quantity, the step further includes:
[0018] Obtain unit prices of target chips at different purchase quantities from public channels;
[0019] The lowest unit price is determined as the reference unit price, and the purchase quantity corresponding to the lowest unit price is determined as the reference purchase quantity.
[0020] Furthermore, in one embodiment, the chip type is defined by chip model, brand and packaging type.
[0021] Furthermore, in one embodiment, after the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip so that the product manufacturing enterprise can determine the procurement mode of the target type of chip according to the cost reduction benefit, the method further includes:
[0022] The cost reduction benefits of all target types of chips are arranged in descending order, and a recommendation prompt for a centralized procurement model is output for target type chips that are in the first preset quantity.
[0023] Furthermore, in one embodiment, after the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip so that the product manufacturing enterprise can determine the procurement mode of the target type of chip according to the cost reduction benefit, the method further includes:
[0024] For target chip types whose cost reduction benefits are greater than or equal to a preset threshold, a recommendation prompt for a centralized procurement model is output.
[0025] In a second aspect, an embodiment of the present application further provides a chip procurement mode determination device, the chip procurement mode determination device comprising:
[0026] A target screening module, used to determine a target category from chip categories according to the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers;
[0027] a cost calculation module, used to determine a first estimated cost of a target type of chip in a decentralized procurement mode and a second estimated cost in a centralized procurement mode, wherein the decentralized procurement mode means that a plurality of first-tier suppliers separately purchase the target type of chips from second-tier suppliers, and the centralized procurement cost means that the product manufacturing enterprise uniformly purchases the target type of chips from second-tier suppliers;
[0028] The benefit calculation module is used to determine the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement model of the target type of chip according to the cost reduction benefit.
[0029] In a third aspect, an embodiment of the present application further provides a chip procurement mode determination device, the chip procurement mode determination device comprising a processor, a memory, and a chip procurement mode determination program stored on the memory and executable by the processor, wherein when the chip procurement mode determination program is executed by the processor, the steps of the above-mentioned chip procurement mode determination method are implemented.
[0030] In a fourth aspect, an embodiment of the present application further provides a readable storage medium, on which a chip procurement mode determination program is stored, wherein when the chip procurement mode determination program is executed by a processor, the steps of the above-mentioned chip procurement mode determination method are implemented.
[0031] In this application, according to the types of products that the product manufacturing enterprise plans to produce, the types of controllers used by each product, and the types of chips used by each controller, the target type is determined from the chip types, wherein the target type chip is applied to a variety of controllers, and these controllers are provided by multiple first-tier suppliers; the first estimated cost of the target type chip under the decentralized procurement mode and the second estimated cost under the centralized procurement mode are determined, wherein the decentralized procurement mode means that multiple first-tier suppliers purchase the target type chip from the second-tier supplier respectively, and the centralized procurement cost means that the product manufacturing enterprise uniformly purchases the target type chip from the second-tier supplier; the difference between the first estimated cost and the second estimated cost is determined as the cost reduction benefit of the target type chip, so that the product manufacturing enterprise can determine the procurement mode of the target type chip according to the cost reduction benefit. Through this application, it can help product manufacturing enterprises to reasonably choose the procurement mode of chips, thereby reducing the cost of chip procurement. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 This is a flow chart of a method for determining a chip procurement mode in an embodiment of the present application;
[0033] Figure 2 This is a schematic diagram of chip-related data management in one embodiment of the present application;
[0034] Figure 3 This is a schematic diagram of a purchase quantity-purchase unit price coefficient curve in one embodiment of the present application;
[0035] Figure 4 A schematic diagram of a visualization interface in an embodiment of the present application;
[0036] Figure 5 This is a schematic diagram of the functional modules of a device for determining a chip procurement mode in an embodiment of the present application;
[0037] Figure 6 A schematic diagram of the hardware structure of a chip procurement mode determination device involved in an embodiment of the present application. DETAILED DESCRIPTION
[0038] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0039] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.
[0040] In a first aspect, an embodiment of the present application provides a method for determining a chip procurement mode.
[0041] Figure 1 A schematic diagram of a process for determining a chip procurement mode in an embodiment of the present application is shown.
[0042] Reference Figure 1 In one embodiment, the chip procurement mode determination method includes the following steps:
[0043] S1. Determine a target category from the chip categories based on the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers.
[0044] Specifically, in the production plan, a product may use one or more controllers, and the types of controllers used by different types of products may overlap. A first supplier may provide one or more controllers. A controller may use one or more chips, and the types of chips used by different types of controllers may overlap.
[0045] For example, chip A is applied to controller B1 and controller B2, chip B is applied to controller B1, controller B3 and controller B4, controller B1 and controller B2 are both provided by the first supplier C1, controller B3 is provided by the first supplier C2, and controller B4 is provided by the first supplier C3, then chip A does not belong to the target category, and chip B belongs to the target category.
[0046] Optionally, in the procurement plan, it can be stipulated that the same type of controller is provided by the same first-tier supplier, and the same type of chip is provided by the same second-tier supplier, so that the procurement cost estimated in the early stage is as close as possible to the actual procurement cost in the later stage.
[0047] Furthermore, in one embodiment, the chip type is defined by chip model, brand and packaging type.
[0048] Through this embodiment, a chip classification criterion is provided, which can ensure that the same type of chips are provided by the same second supplier, so that the procurement cost estimated in the early stage is as close as possible to the actual procurement cost in the later stage.
[0049] In large-scale product manufacturing companies, such as vehicle manufacturers, all sub-units and sub-projects of the company have carried out information construction, but there are often information barriers to data related to products, controllers, and chips, which is not conducive to overall management at the group level.
[0050] Figure 2 A schematic diagram of chip-related data management in an embodiment of the present application is shown.
[0051] Reference Figure 2 In one embodiment, massive data from R&D, production, industry and other fields are gathered, and the product production plans, product BOM data, and chip price data of each sub-unit and sub-project of the enterprise are entered into the enterprise big data platform for centralized management. The chip model + brand + packaging type is used as the unique identifier (primary key) to achieve internal and external data interconnection and interoperability of the enterprise, solve the difficulty of chip data islands, ensure the consistency, accuracy and high availability of stored data, and support chip data analysis and application.
[0052] S2. Determine the first estimated cost of the target type chip under the decentralized procurement mode and the second estimated cost under the centralized procurement mode, wherein the decentralized procurement mode means that multiple first-tier suppliers purchase the target type chips from second-tier suppliers respectively, and the centralized procurement cost means that the product manufacturing enterprise uniformly purchases the target type chips from second-tier suppliers.
[0053] In this embodiment, since the target type of chip is used in multiple controllers and these controllers are provided by multiple first-tier suppliers, the target type of chip can adopt either a decentralized procurement model or a centralized procurement model. Generally, the larger the purchase volume, the lower the purchase unit price. Therefore, the total chip price under the centralized procurement model will be lower than the total chip price under the decentralized procurement model.
[0054] It should be noted that the first estimated cost and the second estimated cost in this embodiment include at least the total price of the chip, and may also selectively include other expenses, such as labor costs and logistics costs borne by product manufacturers under the centralized procurement model.
[0055] S3. Determine the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement model of the target type of chip according to the cost reduction benefit.
[0056] Specifically, the greater the cost reduction benefits, the more inclined to adopt a centralized purchasing model.
[0057] Correspondingly, controllers for other types of chip applications are provided by the same first supplier. The first-tier supplier and product manufacturers purchase in equal quantities from the second-tier supplier, and product manufacturers also need to bear additional labor costs, logistics costs, etc. Purchasing these chips by the first supplier will help reduce procurement costs.
[0058] Therefore, in this embodiment, according to the types of products that the product manufacturing enterprise plans to produce, the types of controllers used by each product, and the types of chips used by each controller, the target type is determined from the chip types, wherein the target type chip is applied to a variety of controllers, and these controllers are provided by multiple first-tier suppliers; the first estimated cost of the target type chip under the decentralized procurement mode and the second estimated cost under the centralized procurement mode are determined, wherein the decentralized procurement mode means that multiple first-tier suppliers purchase the target type chip from the second-tier supplier respectively, and the centralized procurement cost means that the product manufacturing enterprise uniformly purchases the target type chip from the second-tier supplier; the difference between the first estimated cost and the second estimated cost is determined as the cost reduction benefit of the target type chip, so that the product manufacturing enterprise can determine the procurement mode of the target type chip according to the cost reduction benefit. Through this embodiment, it can help product manufacturing enterprises to reasonably choose the procurement mode of chips, thereby reducing the chip procurement cost.
[0059] Further, in one embodiment, the step of determining a first estimated cost of the target type of chips in a decentralized procurement mode and a second estimated cost in a centralized procurement mode comprises:
[0060] Determine the first purchase quantity of each first-tier supplier for the target type of chips, and determine the sum of all first purchase quantities as the second purchase quantity of the product manufacturing enterprise for the target type of chips;
[0061] Determine a first unit price of the target type chip at each first purchase quantity and a second unit price at a second purchase quantity based on a purchase quantity-purchase unit price coefficient curve and a reference unit price of the target type chip at a reference purchase quantity;
[0062] determining the sum of the products of all first purchase quantities and their corresponding first unit prices as the first estimated cost;
[0063] The product of the second purchase quantity and the second unit price is determined as the second estimated cost.
[0064] In this embodiment, the first estimated cost and the second estimated cost only include the total price of the chip, and the first unit price and the second unit price are determined based on a unified standard, so that the cost estimation can be completed quickly and accurately.
[0065] Figure 3 A schematic diagram of a purchase quantity-purchase unit price coefficient curve in an embodiment of the present application is shown.
[0066] For example, a target type chip is used in three controllers and is provided by three first-tier suppliers. The first purchase quantity is 50k, 50k and 100k respectively, and the second purchase quantity is 200k. The reference unit price of the target type chip under the reference purchase quantity = sample = 3 yuan. Figure 3As shown in the purchase quantity-purchase unit price coefficient curve, when purchase quantity = 50k, unit price = 3×1.35 / 2 = 2.025 yuan, when purchase quantity = 100k, unit price = 3×1.25 / 2 = 1.875 yuan, when purchase quantity = 200k, unit price = 3×1.14 / 2 = 1.71 yuan, then the first estimated cost = 50k×2.025×2+100k×1.875=390,000 yuan, the second estimated cost = 200k×1.71=342,000 yuan.
[0067] Further, in one embodiment, the same type of controllers are provided by the same first-tier supplier;
[0068] The calculation formula for the first purchase quantity is:
[0069]
[0070] Among them, S u,i represents the first purchase quantity of the target type chip i by the first-tier supplier u, P x,y M represents the unit usage of controller y provided by first-tier supplier u in product x. x represents the planned production quantity of product x by the product manufacturing company, Q i,y Represents the unit usage of target type chip i in controller y.
[0071] For example, first-tier supplier u is responsible for providing controller B1 and controller B2 for product A1, controller B2 for product A2, and controller B3 for product A3. The unit usage of controller B1 in product A1 is 4, the unit usage of controller B2 in product A1 is 2, the unit usage of controller B2 in product A2 is 6, and the unit usage of controller B3 in product A3 is 10. The product manufacturing company plans to produce 100k, 100k, and 200k products A1, A2, and A3, respectively. The target type chip i is applied to controller B2 and controller B3, with unit usage of 10 and 15, respectively.
[0072] Therefore, S u,i =[((2×100k)+(6×100k))×10]+10×200k×15=38kk.
[0073] Furthermore, in one embodiment, before the step of determining the first unit price of the target type chip at each first purchase quantity and the second unit price at the second purchase quantity based on the purchase quantity-purchase unit price coefficient curve and the reference unit price of the target type chip at the reference purchase quantity, the step further includes:
[0074] Obtain unit prices of target chips at different purchase quantities from public channels;
[0075] The lowest unit price is determined as the reference unit price, and the purchase quantity corresponding to the lowest unit price is determined as the reference purchase quantity.
[0076] In this embodiment, considering that the actual transaction price is corporate confidential information and is not easy to obtain, the price of the target type of chip is obtained from public channels. Since the actual transaction price is usually lower than the price of the public channel after negotiation, the lowest unit price and the corresponding purchase quantity are selected as the reference unit price and reference purchase quantity to make the estimated purchase cost in the early stage as close as possible to the actual purchase cost in the later stage.
[0077] Furthermore, in one embodiment, after the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip so that the product manufacturing enterprise can determine the procurement mode of the target type of chip according to the cost reduction benefit, the method further includes:
[0078] The cost reduction benefits of all target types of chips are arranged in descending order, and a recommendation prompt for a centralized procurement model is output for target type chips that are in the first preset quantity.
[0079] In this embodiment, a centralized purchasing model is recommended for target types of chips based on the ranking of cost reduction benefits, which helps product manufacturers to quickly determine the types of chips suitable for the centralized purchasing model.
[0080] Furthermore, in one embodiment, after the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip so that the product manufacturing enterprise can determine the procurement mode of the target type of chip according to the cost reduction benefit, the method further includes:
[0081] For target chip types whose cost reduction benefits are greater than or equal to a preset threshold, a recommendation prompt for a centralized procurement model is output.
[0082] In this embodiment, a centralized purchasing model is recommended for target type chips based on the relationship between cost reduction benefits and a preset threshold, which helps product manufacturers quickly determine the types of chips suitable for the centralized purchasing model.
[0083] Figure 4 A schematic diagram of a visualization interface in an embodiment of the present application is shown.
[0084] Furthermore, in one embodiment, a visual interface is provided to the user. The chip procurement information window is used to display the demand, price and cost reduction benefits of different types of chips. The cost reduction benefits are reflected by the area. The larger the area, the greater the cost reduction benefits. The chip cost reduction benefit sorting window is used to display the top 10 chip types and their specific cost reduction benefits. The chip association information window is used to display the type of controller corresponding to the selected chip, the name of the first-tier supplier providing the controller, the product type of the controller, the enterprise sub-unit that produces the product, etc.
[0085] In a second aspect, an embodiment of the present application also provides a chip procurement mode determination device.
[0086] Figure 5 A schematic diagram of the functional modules of a chip procurement mode determination device in an embodiment of the present application is shown.
[0087] Reference Figure 5 In one embodiment, the chip procurement mode determination device includes:
[0088] A target screening module 10 is used to determine a target category from chip categories according to the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers;
[0089] A cost calculation module 20 is used to determine a first estimated cost of a target type of chip in a decentralized purchasing mode and a second estimated cost in a centralized purchasing mode, wherein the decentralized purchasing mode means that a plurality of first-tier suppliers purchase the target type of chips from second-tier suppliers respectively, and the centralized purchasing cost means that the product manufacturing enterprise uniformly purchases the target type of chips from second-tier suppliers;
[0090] The benefit calculation module 30 is used to determine the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement mode of the target type of chip according to the cost reduction benefit.
[0091] Furthermore, in one embodiment, the cost calculation module 20 is used to:
[0092] Determine the first purchase quantity of each first-tier supplier for the target type of chips, and determine the sum of all first purchase quantities as the second purchase quantity of the product manufacturing enterprise for the target type of chips;
[0093] Determine a first unit price of the target type chip at each first purchase quantity and a second unit price at a second purchase quantity based on a purchase quantity-purchase unit price coefficient curve and a reference unit price of the target type chip at a reference purchase quantity;
[0094] determining the sum of the products of all first purchase quantities and their corresponding first unit prices as the first estimated cost;
[0095] The product of the second purchase quantity and the second unit price is determined as the second estimated cost.
[0096] Further, in one embodiment, the same type of controllers are provided by the same first-tier supplier;
[0097] The calculation formula for the first purchase quantity is:
[0098]
[0099] Among them, S u,i represents the first purchase quantity of the target type chip i by the first-tier supplier u, P x,y M represents the unit usage of controller y provided by first-tier supplier u in product x. x represents the planned production quantity of product x by the product manufacturing company, Q i,y Represents the unit usage of target type chip i in controller y.
[0100] Furthermore, in one embodiment, the cost calculation module 20 is also used for:
[0101] Obtain unit prices of target chips at different purchase quantities from public channels;
[0102] The lowest unit price is determined as the reference unit price, and the purchase quantity corresponding to the lowest unit price is determined as the reference purchase quantity.
[0103] Furthermore, in one embodiment, the chip type is defined by chip model, brand and packaging type.
[0104] Furthermore, in one embodiment, the chip procurement mode determination device further includes a recommendation prompt module, which is used to:
[0105] The cost reduction benefits of all target types of chips are arranged in descending order, and a recommendation prompt for a centralized procurement model is output for target type chips that are in the first preset quantity.
[0106] Furthermore, in one embodiment, the chip procurement mode determination device further includes a recommendation prompt module, which is used to:
[0107] For target chip types whose cost reduction benefits are greater than or equal to a preset threshold, a recommendation prompt for a centralized procurement model is output.
[0108] Among them, the functional implementation of each module in the above-mentioned chip procurement mode determination device corresponds to the various steps in the above-mentioned chip procurement mode determination method embodiment, and its functions and implementation processes will not be repeated here one by one.
[0109] In a third aspect, an embodiment of the present application provides a chip procurement mode determination device, which may be a personal computer (PC), a laptop computer, a server, or other device with data processing capabilities.
[0110] Figure 6 A schematic diagram of the hardware structure of a chip procurement mode determination device involved in an embodiment of the present application is shown.
[0111] Reference Figure 6In an embodiment of the present application, a chip procurement mode determination device may include a processor, a memory, a communication interface, and a communication bus.
[0112] The communication bus may be of any type and is used to interconnect the processor, the memory, and the communication interface.
[0113] The communication interface includes an input / output (I / O) interface, a physical interface, and a logical interface, which are used to interconnect the devices inside the chip procurement mode determination device, and an interface used to interconnect the chip procurement mode determination device with other devices (such as other computing devices or user devices). The physical interface can be an Ethernet interface, an optical fiber interface, an ATM interface, etc.; the user device can be a display, a keyboard, etc.
[0114] The memory can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), flash memory, optical storage, hard disk, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), etc.
[0115] The processor may be a general-purpose processor, and the general-purpose processor may call the chip procurement mode determination program stored in the memory and execute the chip procurement mode determination method provided in the embodiment of the present application. For example, the general-purpose processor may be a central processing unit (CPU). The method executed when the chip procurement mode determination program is called may refer to the various embodiments of the chip procurement mode determination method of the present application, and will not be repeated here.
[0116] Those skilled in the art will understand that Figure 6 The hardware structure shown in the figure does not constitute a limitation on the present application, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.
[0117] In a fourth aspect, an embodiment of the present application also provides a readable storage medium.
[0118] A chip procurement mode determination program is stored on a readable storage medium of the present application, wherein when the chip procurement mode determination program is executed by a processor, the steps of the chip procurement mode determination method as described above are implemented.
[0119] Among them, the method implemented when the chip procurement mode determination program is executed can refer to the various embodiments of the chip procurement mode determination method of the present application, and will not be repeated here.
[0120] It should be noted that the serial numbers of the above-mentioned embodiments of the present application are only for description and do not represent the advantages or disadvantages of the embodiments.
[0121] The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices. The terms "first", "second" and "third" are used to distinguish different objects, etc., and do not represent a sequence, nor do they limit "first", "second" and "third" to different types.
[0122] In the description of the embodiments of the present application, "exemplary", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary", "for example" or "for example" is intended to present related concepts in a specific way.
[0123] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; the “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two.
[0124] In some processes described in the embodiments of the present application, multiple operations or steps that appear in a specific order are included, but it should be understood that these operations or steps may not be executed in the order in which they appear in the embodiments of the present application or in parallel, and the sequence number of the operation is only used to distinguish the different operations, and the sequence number itself does not represent any execution order. In addition, these processes may include more or fewer operations, and these operations or steps may be executed in sequence or in parallel, and these operations or steps may be combined.
[0125] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, disk, CD) as described above, and includes a number of instructions for a terminal device to execute the methods described in each embodiment of the present application.
[0126] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A method for determining a chip procurement mode, characterized in that: The chip procurement mode determination method comprises: Determine a target category from the chip categories according to the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers; Determine a first estimated cost of the target type of chips under a decentralized procurement mode and a second estimated cost under a centralized procurement mode, wherein the decentralized procurement mode means that multiple first-tier suppliers purchase the target type of chips from second-tier suppliers respectively, and the centralized procurement cost means that the product manufacturing enterprise purchases the target type of chips from second-tier suppliers uniformly; The difference between the first estimated cost and the second estimated cost is determined as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement model of the target type of chip according to the cost reduction benefit.
2. The chip procurement mode determination method according to claim 1, characterized in that: The step of determining a first estimated cost of target type chips in a decentralized procurement mode and a second estimated cost in a centralized procurement mode comprises: Determine the first purchase quantity of each first-tier supplier for the target type of chips, and determine the sum of all first purchase quantities as the second purchase quantity of the product manufacturing enterprise for the target type of chips; Determine a first unit price of the target type chip at each first purchase quantity and a second unit price at a second purchase quantity based on a purchase quantity-purchase unit price coefficient curve and a reference unit price of the target type chip at a reference purchase quantity; determining the sum of the products of all first purchase quantities and their corresponding first unit prices as the first estimated cost; The product of the second purchase quantity and the second unit price is determined as the second estimated cost.
3. The chip procurement mode determination method according to claim 2, characterized in that: The same controller is provided by the same first-tier supplier; The calculation formula for the first purchase quantity is: Among them, S u,i represents the first purchase quantity of the target type chip i by the first-tier supplier u, P x,y M represents the unit usage of controller y provided by first-tier supplier u in product x. x represents the planned production quantity of product x by the product manufacturing company, Q i,y Represents the unit usage of target type chip i in controller y.
4. The chip procurement mode determination method according to claim 2, characterized in that: Before the step of determining the first unit price of the target type chip at each first purchase quantity and the second unit price at the second purchase quantity based on the purchase quantity-purchase unit price coefficient curve and the reference unit price of the target type chip at the reference purchase quantity, the step further includes: Obtain unit prices of target chips at different purchase quantities from public channels; The lowest unit price is determined as the reference unit price, and the purchase quantity corresponding to the lowest unit price is determined as the reference purchase quantity.
5. The chip procurement mode determination method according to claim 1, characterized in that: Chip types are defined by chip model, brand and packaging type.
6. The chip procurement mode determination method according to any one of claims 1 to 5, characterized in that: After the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chips so that the product manufacturing enterprise can determine the procurement mode of the target type of chips according to the cost reduction benefit, the method further includes: The cost reduction benefits of all target types of chips are arranged in descending order, and a recommendation prompt for a centralized procurement model is output for target type chips that are in the first preset quantity.
7. The chip procurement mode determination method according to claim 6, characterized in that: After the step of determining the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chips so that the product manufacturing enterprise can determine the procurement mode of the target type of chips according to the cost reduction benefit, the method further includes: For target chip types whose cost reduction benefits are greater than or equal to a preset threshold, a recommendation prompt for a centralized procurement model is output.
8. A device for determining a chip procurement mode, characterized in that: The chip procurement mode determination device comprises: A target screening module, used to determine a target category from chip categories according to the product categories that the product manufacturing enterprise plans to produce, the controller categories used by each product, and the chip categories used by each controller, wherein the target category chip is applied to multiple controllers, and these controllers are provided by multiple first-tier suppliers; a cost calculation module, used to determine a first estimated cost of a target type of chip in a decentralized procurement mode and a second estimated cost in a centralized procurement mode, wherein the decentralized procurement mode means that a plurality of first-tier suppliers separately purchase the target type of chips from second-tier suppliers, and the centralized procurement cost means that the product manufacturing enterprise uniformly purchases the target type of chips from second-tier suppliers; The benefit calculation module is used to determine the difference between the first estimated cost and the second estimated cost as the cost reduction benefit of the target type of chip, so that the product manufacturing enterprise can determine the procurement model of the target type of chip according to the cost reduction benefit.
9. A chip procurement mode determination device, characterized in that: The chip procurement mode determination device includes a processor, a memory, and a chip procurement mode determination program stored in the memory and executable by the processor, wherein when the chip procurement mode determination program is executed by the processor, the steps of the chip procurement mode determination method according to any one of claims 1 to 7 are implemented.
10. A readable storage medium, characterized in that: The readable storage medium stores a chip procurement mode determination program, wherein when the chip procurement mode determination program is executed by a processor, the steps of the chip procurement mode determination method according to any one of claims 1 to 7 are implemented.