Coil electronic component

Abstract

The invention provides a coil electronic component. The coil electronic component includes: a first coil; a second coil spaced apart from the first coil; an intermediate layer provided to extend from a first region between a first core (hollow space) of the first coil and a second core of the second coil to a second region between the first coil and the second coil; and a magnetic body surrounding the first coil, the second coil, and the intermediate layer, in which the intermediate layer has a magnetic permeability smaller than a magnetic permeability of the magnetic body.

Description

Technical Field

[0001] The present disclosure relates to a coil electronic assembly. Background Art

[0002] Recently, as the functions of mobile devices are diversified, power consumption is increasing. Therefore, in order to increase the available time of the battery in the mobile device, coil electronic components with low loss and excellent efficiency are adopted around the power management integrated circuit (PMIC).

[0003] In the case where a coil electronic component has a coupled inductor structure in which a first coil and a second coil are arranged one above the other, a method of easily adjusting a coupling coefficient (K) while ensuring high inductance is required.

[0004] Additionally, it may be desirable to keep the spacing between the first coil and the second coil constant by preventing or minimizing the first coil and the second coil from tilting relative to each other. Summary of the invention

[0005] The present disclosure is directed to providing a coil electronic component having a coupled inductor structure, which is capable of easily adjusting a coupling coefficient while ensuring high inductance.

[0006] In another aspect, the present disclosure is directed to providing a coil electronic component having a coupled inductor structure, which is capable of preventing coils arranged up and down from tilting relative to each other and maintaining a constant interval between the coils.

[0007] However, the problems to be solved by the present disclosure are not limited to the above-mentioned problems, and can be expanded in various ways within the scope of the technical ideas included in the present disclosure.

[0008] One aspect of the present disclosure provides a coil electronic component, which includes: a first coil including a first core; a second coil spaced apart from the first coil, the second coil including a second core; an intermediate layer configured to extend from a first area between the first core and the second core to a second area between the first coil and the second coil; and a magnetic body surrounding the first coil, the second coil and the intermediate layer, wherein the intermediate layer has a magnetic permeability smaller than the magnetic permeability of the magnetic body.

[0009] The intermediate layer may be in contact with the first coil and may be in contact with the second coil.

[0010] The intermediate layer may be spaced apart from an outer edge of the second region.

[0011] A thickness of the intermediate layer at the first region may be the same as a thickness of the intermediate layer at the second region.

[0012] The intermediate layer may extend from the first region to a portion of the first core.

[0013] The intermediate layer may extend from the first region to a portion of the second core.

[0014] The intermediate layer may extend from the first region to a portion of the first core, and the intermediate layer may extend from the first region to a portion of the second core.

[0015] The second region may include an inner region, a portion of the intermediate layer is disposed in the inner region, and an outer region contacting the inner region, a portion of the magnetic body is disposed in the outer region.

[0016] The coil electronic component may further include a support member disposed in the second region and in contact with the first coil and the second coil.

[0017] The support member may be spaced apart from the intermediate layer.

[0018] The support member may be in contact with the intermediate layer.

[0019] The support member may include a magnetic material, epoxy resin, or a non-magnetic material other than epoxy resin.

[0020] The first coil may further include a first lead-out portion and a second lead-out portion, and the second coil may further include a third lead-out portion and a fourth lead-out portion. The coil electronic component may further include: a first external electrode disposed outside the magnetic body and connected to the first lead-out portion; a second external electrode disposed outside the magnetic body and connected to the second lead-out portion; a third external electrode disposed outside the magnetic body and connected to the third lead-out portion; and a fourth external electrode disposed outside the magnetic body and connected to the fourth lead-out portion.

[0021] The first coil may further include a first winding portion, and the second coil may further include a second winding portion.

[0022] The first coil may also include: a first supporting member having a first surface and a second surface opposite to each other; a first coil pattern arranged on the first surface of the first supporting member; a second coil pattern arranged on the second surface of the first supporting member; and a first via hole passing through the first supporting member to connect the first coil pattern and the second coil pattern, and the second coil may include: a second supporting member having a third surface and a fourth surface opposite to each other; a third coil pattern arranged on the third surface of the second supporting member; a fourth coil pattern arranged on the fourth surface of the second supporting member; and a second via hole passing through the second supporting member to connect the third coil pattern and the fourth coil pattern.

[0023] The intermediate layer may be configured to extend to a portion of the second region.

[0024] The coil electronic component may further include an insulating film, and the insulating film may be provided on a surface of the first coil and a surface of the second coil.

[0025] Another aspect of the present disclosure provides a coil electronic component, which includes: a first coil including a first core; a second coil spaced apart from the first coil, the second coil including a second core; an intermediate layer disposed in a first region between the first core and the second core and extending into a second region between the first coil and the second coil; and a magnetic body surrounding the first coil, the second coil and the intermediate layer, the magnetic body including a first part, the first part being disposed in the second region and opposite to the intermediate layer in a direction perpendicular to the winding direction of the first coil, wherein the intermediate layer has a magnetic permeability smaller than that of the magnetic body.

[0026] The intermediate layer may be spaced apart from an outer edge of the second region.

[0027] The intermediate layer may extend from the first region to a portion of the first core, and the intermediate layer may extend from the first region to a portion of the second core.

[0028] The coil electronics component may further include a support member disposed in the second region and disposed between the first portion of the magnetic body and the intermediate layer.

[0029] The support member may be spaced apart from the intermediate layer.

[0030] The support member may be in contact with the intermediate layer.

[0031] A coil electronic component according to an aspect of the present disclosure can easily adjust a coupling coefficient while ensuring high inductance.

[0032] A coil electronic component according to another aspect of the present disclosure can prevent coils arranged up and down from being tilted relative to each other and can keep an interval between the coils constant. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic perspective view showing a coil electronic component according to the embodiment.

[0034] Figure 2 It is shown Figure 1 Schematic plan view of the coil electronics assembly.

[0035] Figure 3 It is shown Figure 1 Schematic bottom perspective view of the coil electronic assembly.

[0036] Figure 4 is along Figure 1 Schematic cross-sectional view taken along line IV-IV'.

[0037] Figure 5 is a schematic perspective view showing a coil electronic component according to another embodiment.

[0038] Figure 6 is a schematic perspective view showing a coil electronic component according to another embodiment.

[0039] Figure 7 is a schematic cross-sectional view showing a coil electronic component according to another embodiment.

[0040] Figure 8 is a schematic perspective view showing a coil electronic component according to another embodiment.

[0041] Fig. 9 It is along Figure 8 A cross-sectional view taken along line IX-IX'. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that a person of ordinary skill in the art to which the present disclosure belongs can easily perform the embodiments of the present disclosure. In order to clearly describe the present disclosure, parts irrelevant to the description are omitted in the accompanying drawings, and the same or similar components will be represented by the same reference numerals throughout the specification. In the accompanying drawings, some components are exaggerated, omitted or schematically shown, and the size of each component does not fully reflect the actual size.

[0043] The drawings are provided only to help easily understand the embodiments disclosed in this specification, and it should be understood that the technical spirit disclosed in this specification is not limited by the drawings, and the present disclosure includes all modifications, equivalents, and replacements that fall within the spirit and technical scope of the present disclosure.

[0044] Terms including ordinal numbers such as "first", "second" may be used to describe various components, but the components are not limited by these terms. These terms are used only for the purpose of distinguishing one component from another.

[0045] Furthermore, when a component such as a layer, film, region, or plate is referred to as being "on" another component, it may be "directly on" the other component, or there may be intervening components therebetween. In contrast, when a component is referred to as being "directly on" another component, there are no intervening components therebetween. Furthermore, when a component is referred to as being "on" a reference component, it is located above or below the reference component, and does not necessarily mean that it is "on" the reference component in a direction opposite to the direction of gravity.

[0046] It should be understood that the terms "including", "having" and the like used throughout the specification indicate the presence of the features, numbers, steps, operations, components, parts or combinations thereof mentioned in the specification, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof. Therefore, when a component is referred to as "including" a component, unless explicitly stated otherwise, it means the presence of other components, rather than excluding the presence of other components.

[0047] In addition, throughout the specification, the phrase "in a plan view" refers to a state where a target component is viewed from above, and the phrase "in a cross-sectional view" refers to a state where a cross section in which a target component is vertically cut is viewed from the side.

[0048] Furthermore, throughout the specification, the expression “connected” may mean not only that two or more components are connected to each other in a direct manner but also that two or more components are connected to each other in an indirect manner via another component, may mean not only that two or more components are physically connected to each other but also that two or more components are electrically connected to each other, or may mean that although two or more components are represented by different terms based on their positions and functions, two or more components are integrally formed.

[0049] Figure 1 is a schematic perspective view showing a coil electronic component according to the embodiment. Figure 2 It is shown Figure 1 Schematic plan view of the coil electronics assembly. Figure 3 It is shown Figure 1Schematic bottom perspective view of the coil electronic assembly. Figure 4 is along Figure 1 Schematic cross-sectional view taken along line IV-IV'.

[0050] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 , the coil electronic component 1000 according to the embodiment includes a magnetic body 100 , a first coil 200 , a second coil 300 , an intermediate layer 400 , a first external electrode 500 , a second external electrode 600 , a third external electrode 700 , and a fourth external electrode 800 .

[0051] The magnetic body 100 may be in a substantially rectangular parallelepiped shape, but the present embodiment is not limited thereto. Due to the shrinkage of the magnetic powder, etc. during sintering, the magnetic body 100 may have a substantially rectangular parallelepiped shape, rather than a completely rectangular parallelepiped shape. For example, the magnetic body 100 may have a substantially rectangular parallelepiped shape, but may also have rounded corners or rounded vertices.

[0052] In this embodiment, for the sake of convenience of explanation, the two surfaces opposite to each other in the length direction (L-axis direction) are respectively defined as the first surface S1 and the second surface S2, the two surfaces opposite to each other in the width direction (W-axis direction) are respectively defined as the third surface S3 and the fourth surface S4, and the two surfaces opposite to each other in the thickness direction (T-axis direction) are respectively defined as the fifth surface S5 and the sixth surface S6.

[0053] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length (L axis)-thickness (T axis) direction at the center of the width direction (W axis direction) of the coil electronic component 1000, the length of the coil electronic component 1000 may refer to the maximum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Optionally, the length of the coil electronic component 1000 may refer to the minimum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Optionally, the length of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments among a plurality of line segments, each of the plurality of line segments connecting two outermost boundary lines of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph that are opposite to each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction).

[0054] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length (L axis)-thickness (T axis) direction at the center of the width direction (W axis direction) of the coil electronic component 1000, the thickness of the coil electronic component 1000 may refer to the maximum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Optionally, the thickness of the coil electronic component 1000 may refer to the minimum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Optionally, the thickness of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two of a plurality of line segments, each of the plurality of line segments connecting two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the thickness direction (T-axis direction) and are parallel to the thickness direction (T-axis direction).

[0055] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length (L axis)-width (W axis) direction at the center of the coil electronic component 1000 in the thickness direction (T axis direction), the width of the coil electronic component 1000 may refer to the maximum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Optionally, the width of the coil electronic component 1000 may refer to the minimum value of the lengths of multiple line segments, each of which connects the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Optionally, the width of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two of a plurality of line segments, each of the plurality of line segments connecting two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction).

[0056] In addition, each of the length, width, and thickness of the coil electronic component 1000 can be measured using a micrometer measurement method. In the micrometer measurement method, a zero point is set with a micrometer that provides metrological repeatability and reproducibility (Gage R&R), the coil electronic component 1000 of the present embodiment is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated for measurement. In addition, in the case of measuring the length of the coil electronic component 1000 using the micrometer measurement method, the length of the coil electronic component 1000 may refer to a value measured once, or may refer to an arithmetic mean of multiple measured values. This can also be applied to the measurement of the width and thickness of the coil electronic component 1000.

[0057] The magnetic body 100 constitutes the outside of the coil electronic component 1000 and has a space for forming a magnetic circuit, which is a path through which the magnetic flux induced by the first coil 200 and the magnetic flux induced by the second coil 300 pass when current is applied to the first coil 200 through the first external electrode 500 and the second external electrode 600 and current is applied to the second coil 300 through the third external electrode 700 and the fourth external electrode 800.

[0058] The magnetic body 100 surrounds and encloses the first coil 200, the second coil 300, and the intermediate layer 400, and includes a magnetic material. The magnetic body 100 includes magnetic particles, and an insulating material may be interposed between the magnetic particles.

[0059] The magnetic material may include a first metal magnetic powder, a second metal magnetic powder having a larger particle size than the first metal magnetic powder, and a third metal magnetic powder having a larger particle size than the second metal magnetic powder. 50 The average particle size D of the second metal magnetic powder may be greater than or equal to 0.1 μm and less than or equal to 0.2 μm. 50 The average particle size D of the third metal magnetic powder may be greater than or equal to 1 μm and less than or equal to 2 μm. 50 It may be greater than or equal to 25 μm and less than or equal to 30 μm.

[0060] The magnetic particles may be ferrite particles or metal magnetic particles exhibiting magnetic properties.

[0061] The ferrite particles may include, for example, at least one of spinel ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0062] The metal magnetic particles may include two or more types of powder particles having different compositions, and may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles may include one or more of pure iron, Fe-Si-based alloys, Fe-Si-Al-based alloys, Fe-Ni-based alloys, Fe-Ni-Mo-based alloys, Fe-Ni-Mo-Cu-based alloys, Fe-Co-based alloys, Fe-Ni-Co-based alloys, Fe-Cr-based alloys, Fe-Cr-Si-based alloys, Fe-Si-Cu-Nb-based alloys, Fe-Ni-Cr-based alloys, and Fe-Cr-Al-based alloys. Here, different compositions of the metal magnetic particles may mean different contents.

[0063] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloy, but the present embodiment is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to about 30 μm, but is not limited thereto. In this specification, the average particle size may be referred to as D 90 , D 50 The particle size distribution is well known to those skilled in the art and is an indicator of the proportion of particles of a certain size (particle diameter) contained in the particle group to be measured. 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0064] The metal magnetic particles may be two or more types of different metal magnetic particles. Here, different types of metal magnetic particles means that the metal magnetic particles are different from each other in at least one of average particle size, composition, component ratio, crystallinity and shape.

[0065] The insulating material may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0066] There is no particular limitation on the method of forming the magnetic body 100. For example, the magnetic body 100 may be formed by placing sheets of magnetic material on the upper and lower portions of the first and second coils 200 and 300 and then pressing and curing the sheets.

[0067] The first coil 200 and the second coil 300 are disposed inside the magnetic body 100, and exhibit the characteristics of a coil electronic component. For example, when the coil electronic component 1000 according to the present embodiment is used as a power inductor, when current is applied to the first coil 200 and the second coil 300, the coil electronic component can be used to stabilize the power supply of the electronic device by storing energy in the form of a magnetic field and maintaining an output voltage.

[0068] The first coil 200 and the second coil 300 may be magnetically coupled to each other, thereby including a coupled inductor structure.

[0069] The first coil 200 and the second coil 300 may be in the form of a spirally wound metal (e.g., copper (Cu) or silver (Ag)) wire whose surface is coated with an insulating material. That is, the first coil 200 and the second coil 300 may be a wound coil. Each of the first coil 200 and the second coil 300 is not limited to a single wire, but may include a twisted pair or two or more wires.

[0070] The first coil 200 and the second coil 300 may be circular coils, but are not limited thereto. For example, the first coil 200 and the second coil 300 may be various known coils (such as rectangular coils).

[0071] A cross section of a single line of each of the first coil 200 and the second coil 300 may have various known shapes such as a rectangular shape, a circular shape, and an elliptical shape.

[0072] The first coil 200 and the second coil 300 may have a plurality of turns and may be edge-wound coils.

[0073] For example, the first coil 200 may have an outermost coil C1 and an innermost coil C2 in sequence in a direction from the fifth surface S5 to the sixth surface S6 of the magnetic body 100. In addition, although not shown, at least one intermediate coil may be provided between the outermost coil C1 and the innermost coil C2.

[0074] Similarly, the second coil 300 may have an outermost coil C1' and an innermost coil C2' in sequence in a direction from the sixth surface S6 to the fifth surface S5 of the magnetic body 100. In addition, although not shown, at least one intermediate coil may be provided between the outermost coil C1' and the innermost coil C2'.

[0075] The insulating film IF may be provided along the corresponding surfaces of the plurality of turns of the first coil 200 and the second coil 300. The insulating film IF is used to protect and insulate the plurality of turns of the first coil 200 and the second coil 300, and the insulating film IF may include a known insulating material (such as polyparaxylene). The insulating film IF may include any insulating material, and the insulating material of the insulating film IF is not particularly limited. For example, the insulating film IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film IF may be formed by an evaporation method or the like, but is not limited thereto.

[0076] In addition, the shapes of the first coil 200 and the second coil 300 are not limited to the above shapes, and may have various well-known shapes. For example, the first coil 200 may have an outermost coil, one or more intermediate coils, and an innermost coil in sequence in the direction from the outer surface of the magnetic body 100 to the inside. Similarly, the second coil 300 may have an outermost coil, one or more intermediate coils, and an innermost coil in sequence in the direction from the outer surface of the magnetic body 100 to the inside.

[0077] The first coil 200 may include a winding portion 210 and a lead-out portion 220 .

[0078] The winding portion 210 is a portion of the metal wire including at least one turn.

[0079] The lead-out portions 220 extend from both ends of the winding portion 210, respectively, and each of the lead-out portions 220 is exposed to the sixth surface S6 of the magnetic body 100. The lead-out portion 220 includes a first lead-out portion 223 and a second lead-out portion 225. The first lead-out portion 223 extends from one end of the winding portion 210 and is exposed to the sixth surface S6 of the magnetic body 100, and the second lead-out portion 225 extends from the other end of the winding portion 210 and is exposed to the sixth surface S6 of the magnetic body 100. The positions at which the first lead-out portion 223 and the second lead-out portion 225 are exposed to the sixth surface S6 of the magnetic body 100 may be spaced apart from each other in the length direction (L-axis direction), but are not limited thereto.

[0080] The second coil 300 may include a winding portion 310 and a lead-out portion 320 .

[0081] The winding portion 310 is a portion of the metal wire including at least one turn.

[0082] The lead-out portions 320 extend from both ends of the winding portion 310, respectively, and each of the lead-out portions 320 is exposed to the sixth surface S6 of the magnetic body 100. The lead-out portion 320 includes a third lead-out portion 323 and a fourth lead-out portion 325. The third lead-out portion 323 extends from one end of the winding portion 310 and is exposed to the sixth surface S6 of the magnetic body 100, and the fourth lead-out portion 325 extends from the other end of the winding portion 310 and is exposed to the sixth surface S6 of the magnetic body 100. The positions at which the third lead-out portion 323 and the fourth lead-out portion 325 are exposed to the sixth surface S6 of the magnetic body 100 may be spaced apart from each other in the length direction (L-axis direction), but are not limited thereto.

[0083] Although the case where the lead-out portion 220 of the first coil 200 and the lead-out portion 320 of the second coil 300 are both exposed to the sixth surface S6 of the magnetic body 100 has been described above, the present embodiment is not limited thereto. For example, the lead-out portion 220 of the first coil 200 may be exposed to the third surface S3 of the magnetic body 100, and the lead-out portion 320 of the second coil 300 may be exposed to the fourth surface S4 of the magnetic body 100.

[0084] The intermediate layer 400 is disposed between the first coil 200 and the second coil 300. For example, the intermediate layer 400 may be in contact with the first coil 200 and may be in contact with the second coil 300.

[0085] When viewed in the thickness direction (T-axis direction), the intermediate layer 400 may have a rectangular shape, but is not limited thereto. For example, the intermediate layer 400 may have a shape similar to the winding portion 210 of the first coil 200 or the winding portion 310 of the second coil 300 .

[0086] The intermediate layer 400 may be disposed to extend from a first region R1 between the first core 230 of the first coil 200 and the second core 330 of the second coil 300 to a portion of a second region R2 between the first coil 200 and the second coil 300 .

[0087] The first core 230 may be a region in which the first hollow space of the first coil 200 is at least partially filled with the magnetic body 100, and the second core 330 may be a region in which the second hollow space of the second coil 300 is at least partially filled with the magnetic body 100. That is, a portion of the magnetic body 100 that fills the first hollow space of the first coil 200 may constitute a first core around which the first coil 200 is wound, and a portion of the magnetic body 100 that fills the second hollow space of the second coil 300 may constitute a second core around which the second coil 300 is wound.

[0088] The thickness of the intermediate layer 400 at the first region R1 may be the same as the thickness of the intermediate layer 400 at the second region R2.

[0089] The thickness of the intermediate layer 400 is measured based on an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length (L axis)-thickness (T axis) direction at the center in the width direction (W axis direction) of the coil electronic component 1000. The thickness of the intermediate layer 400 may be the arithmetic mean of the thickness of the intermediate layer 400 at 5 equally spaced points of the intermediate layer 400 of the coil electronic component 1000 shown in the above cross-sectional photograph. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0090] The thickness of the intermediate layer 400 at the first region R1 may be different from the thickness of the intermediate layer 400 at the second region R2. For example, the intermediate layer 400 may extend from the first region R1 to a portion of the first core 230, or the intermediate layer 400 may extend from the first region R1 to a portion of the second core 330. On the other hand, the intermediate layer 400 may extend from the first region R1 to a portion of the first core 230 and a portion of the second core 330.

[0091] In the case where the intermediate layer 400 extends from the first region R1 to a portion of the first core 230, the portion of the first core 230 may be filled with the intermediate layer 400, and the remaining portion of the first core 230 may be filled with the magnetic body 100. In addition, in the case where the intermediate layer 400 extends from the first region R1 to a portion of the second core 330, the portion of the second core 330 may be filled with the intermediate layer 400, and the remaining portion of the second core 330 may be filled with the magnetic body 100. In this case, the portion of the magnetic body 100 and the intermediate layer 400 filling the first hollow space of the first coil 200 may constitute the first core 230 around which the first coil 200 is wound, and the portion of the magnetic body 100 and the intermediate layer 400 filling the second hollow space of the second coil 300 may constitute the second core 330 around which the second coil 300 is wound.

[0092] Since the intermediate layer 400 may be disposed to extend from the first region R1 to a portion of the second region R2 , the intermediate layer 400 may not be disposed in the entire second region R2 .

[0093] For example, the second region R2 may have an outer edge close to the outer surface of the coil electronic component 1000 and an inner edge close to the inner side of the coil electronic component 1000. In other words, the second region R2 may have an inner edge close to the first core 230 and the second core 330 and an outer edge away from the first core 230 and the second core 330. The intermediate layer 400 extends from the inner edge of the second region R2 toward the outer edge of the second region R2, but may be spaced apart from the outer edge of the second region R2.

[0094] The intermediate layer 400 may fill a portion of the second region R2 and contact the innermost coil C2 of the first coil 200 and the innermost coil C2' of the second coil 300 at the second region R2. The remaining portion of the second region R2 not filled with the intermediate layer 400 may be filled with the magnetic body 100. That is, the magnetic body 100 may be provided to extend from the outer edge of the second region R2 to the intermediate layer 400.

[0095] In addition, the intermediate layer 400 may include a magnetic material and affect magnetic coupling characteristics of the first coil 200 and the second coil 300. The intermediate layer 400 may include magnetic particles, and an insulating material may be interposed between the magnetic particles.

[0096] The magnetic material may include a first metal magnetic powder, a second metal magnetic powder having a larger particle size than the first metal magnetic powder, and a third metal magnetic powder having a larger particle size than the second metal magnetic powder. 50 The average particle size D of the second metal magnetic powder may be greater than or equal to 0.1 μm and less than or equal to 0.2 μm. 50 The average particle size D of the third metal magnetic powder may be greater than or equal to 1 μm and less than or equal to 2 μm. 50 It may be greater than or equal to 25 μm and less than or equal to 30 μm.

[0097] The magnetic particles may be ferrite particles or metal magnetic particles exhibiting magnetic properties.

[0098] The ferrite particles may include, for example, at least one of spinel ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites and Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites and Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0099] The metal magnetic particles may include two or more types of powder particles having different compositions, and may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles may include one or more of pure iron, Fe-Si-based alloys, Fe-Si-Al-based alloys, Fe-Ni-based alloys, Fe-Ni-Mo-based alloys, Fe-Ni-Mo-Cu-based alloys, Fe-Co-based alloys, Fe-Ni-Co-based alloys, Fe-Cr-based alloys, Fe-Cr-Si-based alloys, Fe-Si-Cu-Nb-based alloys, Fe-Ni-Cr-based alloys, and Fe-Cr-Al-based alloys. Here, different compositions of the metal magnetic particles may mean different contents.

[0100] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloy, but the present embodiment is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to about 30 μm, but is not limited thereto. In this specification, the average particle size may be referred to as D 90 , D 50The particle size distribution is well known to those skilled in the art and is an indicator of the proportion of particles of a certain size (particle diameter) contained in the particle group to be measured. 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0101] The metal magnetic particles may be two or more types of different metal magnetic particles. Here, different types of metal magnetic particles means that the metal magnetic particles are different from each other in at least one of average particle size, composition, component ratio, crystallinity and shape.

[0102] The insulating material may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0103] The intermediate layer 400 includes the above-mentioned materials, but the intermediate layer 400 may have a magnetic permeability smaller than that of the magnetic body 100. In addition, the magnetic permeability of the magnetic body 100 and the magnetic permeability of the intermediate layer 400 may be appropriately set to adjust the coupling coefficient (K) between the first coil 200 and the second coil 300. As used herein, the term "magnetic permeability" refers to the amount of magnetization generated in a material in response to an applied magnetic field. The magnetic permeability may be measured by the Gouy method. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0104] For example, as a method of adjusting the magnetic permeability of the magnetic body 100 and the magnetic permeability of the intermediate layer 400, the volume fraction of the first magnetic particles included in the magnetic body 100 and the volume fraction of the second magnetic particles included in the intermediate layer 400 may be set to be different. Here, the volume fraction of the magnetic particles refers to the ratio of the volume of the first magnetic particles to the volume of the magnetic body 100 and / or the ratio of the volume of the second magnetic particles to the volume of the intermediate layer 400. In order to adjust the relative magnetic permeability of the magnetic body 100 and the intermediate layer 400 based on the volume fraction of the first magnetic particles and the second magnetic particles, the first magnetic particles and the second magnetic particles may be implemented as the same material (e.g., a metal alloy of the same composition). In addition, as a method of adjusting the magnetic permeability of the magnetic body 100 and the magnetic permeability of the intermediate layer 400, when confirmed in a cross section, the area fraction of the first magnetic particles included in the magnetic body 100 and the area fraction of the second magnetic particles included in the intermediate layer 400 may be set to be different. Here, the area fraction of the magnetic particles refers to the ratio of the cross-sectional area of ​​the first magnetic particles to the cross-sectional area of ​​the magnetic body 100 and / or the ratio of the cross-sectional area of ​​the second magnetic particles to the cross-sectional area of ​​the intermediate layer 400 .

[0105] When the magnetic permeability of the intermediate layer 400 is smaller than the magnetic permeability of the magnetic body 100, the volume fraction of the second magnetic particles included in the intermediate layer 400 may be smaller than the volume fraction of the first magnetic particles included in the magnetic body 100. If the magnetic permeability of the intermediate layer 400 is smaller than the magnetic permeability of the magnetic body 100, the coupling coefficient between the first coil 200 and the second coil 300 may be relatively increased. Here, the relative increase in the coupling coefficient means that the coupling coefficient becomes larger compared to the case where the magnetic permeability of the intermediate layer 400 and the magnetic permeability of the magnetic body 100 are the same. When the magnetic permeability of the intermediate layer 400 is relatively small, the magnetic flux flowing through the intermediate layer 400 is relatively small, and the mutual inductance caused by the magnetic flux shared by the first coil 200 and the second coil 300 becomes larger. Here, the magnetic flux flowing through the intermediate layer 400 can be understood as the magnetic flux flowing through the intermediate layer 400. Figure 4 The magnetic flux flowing through the intermediate layer 400 in the length direction (L-axis direction) of the intermediate layer 400.

[0106] As a result, the mutual inductance between the first coil 200 and the second coil 300 becomes larger, and the leakage inductance formed only in the first coil 200 or the second coil 300 becomes smaller, so the coupling coefficient between the first coil 200 and the second coil 300 becomes larger.

[0107] The first and second external electrodes 500 and 600 are disposed outside the magnetic body 100 and are electrically connected to the first coil 200 .

[0108] The first external electrode 500 is disposed on the sixth surface S6 of the magnetic body 100 , and the first lead-out portion 223 of the first coil 200 is exposed from the sixth surface S6 of the magnetic body 100 and connected to the first external electrode 500 .

[0109] The second external electrode 600 is disposed on the sixth surface S6 of the magnetic body 100 , and the second lead-out portion 225 of the first coil 200 is exposed from the sixth surface S6 of the magnetic body 100 and connected to the second external electrode 600 .

[0110] The first and second external electrodes 500 and 600 may each be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or an alloy thereof, but are not limited thereto.

[0111] The first and second external electrodes 500 and 600 may include a plurality of metal layers formed by plating a conductive metal.

[0112] Reference Figure 1 As shown in the right circle of , the first external electrode 500 may include a first metal layer 501 , a second metal layer 502 and a third metal layer 503 .

[0113] The first metal layer 501 is a plating layer in contact with the first lead-out portion 223 of the first coil 200 and the outer surface of the magnetic body 100, and the first metal layer 501 may include copper (Cu). The second metal layer 502 is a plating layer covering the first metal layer 501, and the second metal layer 502 may include nickel (Ni). The third metal layer 503 is a plating layer covering the second metal layer 502, and the third metal layer 503 may include tin (Sn). However, the present embodiment is not limited to such a three-layer structure, and may also be a two-layer structure in which only one plating layer is provided on the first metal layer 501.

[0114] Reference Figure 1 As shown in the left circle of , the second external electrode 600 may include a first metal layer 601 , a second metal layer 602 and a third metal layer 603 .

[0115] The first metal layer 601 is a plating layer in contact with the second lead-out portion 225 of the first coil 200 and the outer surface of the magnetic body 100, and the first metal layer 601 may include copper (Cu). The second metal layer 602 is a plating layer covering the first metal layer 601, and the second metal layer 602 may include nickel (Ni). The third metal layer 603 is a plating layer covering the second metal layer 602, and the third metal layer 603 may include tin (Sn). However, the present embodiment is not limited to such a three-layer structure, and may also be a two-layer structure in which only one plating layer is provided on the first metal layer 601.

[0116] In this manner, the first external electrode 500 and the second external electrode 600 may each include nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof, and the first external electrode 500 and the second external electrode 600 may include a plurality of plating layers. For example, the first external electrode 500 and the second external electrode 600 may each be made of one selected from a nickel (Ni) layer, a copper (Cu) layer, a nickel / copper (Ni / Cu) layer, a palladium / nickel (Pd / Ni) layer, a palladium / nickel / copper (Pd / Ni / Cu) layer, and a copper / nickel / copper (Cu / Ni / Cu) layer.

[0117] In some cases, the outermost layer may be made of tin (Sn). Since the tin plating layer has a relatively low melting point, the first and second external electrodes 500 and 600 may be easily mounted on the substrate through the tin plating layer.

[0118] Generally, the tin plated layer may be bonded to the electrode pad on the substrate through a solder containing a tin (Sn)-copper (Cu)-silver (Ag) alloy paste. That is, the tin plated layer may be melted and bonded to the solder during a heat treatment (reflow) process.

[0119] The third and fourth external electrodes 700 and 800 are disposed outside the magnetic body 100 and are electrically connected to the second coil 300 .

[0120] The third external electrode 700 is disposed on the sixth surface S6 of the magnetic body 100 , and the third lead-out portion 323 of the second coil 300 is exposed from the sixth surface S6 of the magnetic body 100 and connected to the third external electrode 700 .

[0121] The fourth external electrode 800 is disposed on the sixth surface S6 of the magnetic body 100 , and the fourth lead-out portion 325 of the second coil 300 is exposed from the sixth surface S6 of the magnetic body 100 and connected to the fourth external electrode 800 .

[0122] Since the structures and components of the third and fourth external electrodes 700 and 800 are the same as those of the above-described first and second external electrodes 500 and 600 , redundant descriptions thereof will be omitted.

[0123] In addition, the insulating layer 900 may be provided on the magnetic body 100 of the coil electronic component 1000 according to the present embodiment (except for the region where the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 are provided). Different from this, the insulating layer may exist between the exposed portion of the first lead-out portion 223 of the first coil 200, the exposed portion of the second lead-out portion 225 of the first coil 200, the exposed portion of the third lead-out portion 323 of the second coil 300, and the exposed portion of the fourth lead-out portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100. In this case, the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 may cover a portion of the insulating layer, respectively.

[0124] As described above, the insulating layer 900 may be disposed on at least a portion of the first, second, third, fourth, fifth, and sixth surfaces S1, S2, S3, S4, S5, and S6 of the magnetic body 100 to prevent electrical short circuits between other electronic components and the external electrodes 500, 600, 700, and 800.

[0125] When the external electrodes 500 , 600 , 700 , and 800 are formed by electroplating, the insulating layer 900 may be used as a resist, but is not limited thereto.

[0126] Figure 5 is a schematic perspective view showing a coil electronic component according to another embodiment.

[0127] Reference Figure 5, the first external electrode 2500 of the coil electronic component 2000 according to another embodiment may be connected to the first lead-out portion 223 of the first coil 200 on the sixth surface S6 of the magnetic body 100, and may extend to the second surface S2 of the magnetic body 100. In addition, the second external electrode 2600 may be connected to the second lead-out portion 225 of the first coil 200 on the sixth surface S6 of the magnetic body 100, and may extend to the first surface S1 of the magnetic body 100.

[0128] The third external electrode 2700 may be connected to the third lead-out portion 323 of the second coil 300 on the sixth surface S6 of the magnetic body 100 and extend to the first surface S1 of the magnetic body 100. In addition, the fourth external electrode 2800 may be connected to the fourth lead-out portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100 and extend to the second surface S2 of the magnetic body 100.

[0129] Since the components other than the above components are Figure 1 The components of the coil electronic components shown in FIG. 1 are the same, so a redundant description thereof will be omitted.

[0130] Figure 6 is a schematic perspective view showing a coil electronic component according to another embodiment.

[0131] Reference Figure 6 , the first external electrode 3500 of the coil electronic component 3000 according to another embodiment may be connected to the first lead-out portion 223 of the first coil 200 on the sixth surface S6 of the magnetic body 100, and may extend to the second surface S2 and the fifth surface S5 of the magnetic body 100. In addition, the second external electrode 3600 may be connected to the second lead-out portion 225 of the first coil 200 on the sixth surface S6 of the magnetic body 100, and may extend to the first surface S1 and the fifth surface S5 of the magnetic body 100.

[0132] The third external electrode 3700 may be connected to the third lead-out portion 323 of the second coil 300 on the sixth surface S6 of the magnetic body 100, and may extend to the first surface S1 and the fifth surface S5 of the magnetic body 100. In addition, the fourth external electrode 3800 may be connected to the fourth lead-out portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100, and may extend to the second surface S2 and the fifth surface S5 of the magnetic body 100.

[0133] Since components other than the above components are Figure 1 The components of the coil electronic components shown in FIG. 1 are the same, so a redundant description thereof will be omitted.

[0134] Figure 7is a schematic cross-sectional view showing a coil electronic component according to another embodiment.

[0135] Reference Figure 7 , a coil electronic component 4000 according to another embodiment may include a magnetic body 100 , a first coil 200 , a second coil 300 , an intermediate layer 400 , and a support member 4100 .

[0136] The intermediate layer 400 is disposed between the first coil 200 and the second coil 300. For example, the intermediate layer 400 may be in contact with the first coil 200 and the second coil 300.

[0137] The intermediate layer 400 may extend from a first region R1 between the first core 230 of the first coil 200 and the second core 330 of the second coil 300 to a portion of a second region R2 between the first coil 200 and the second coil 300 .

[0138] The second region R2 may include an inner region R21 and an outer region R22 .

[0139] The inner region R21 is a region where the intermediate layer 400 is provided, and the inner region R21 is a region close to the first core 230 and the second core 330 .

[0140] The outer region R22 is a region that is in contact with the inner region R21 and in which the magnetic body 100 is disposed, and is a region that is away from the first core 230 and the second core 330 .

[0141] The support member 4100 may be disposed in the second region R2 and in contact with the first coil 200 and the second coil 300. Since the support member 4100 is in contact with both the first coil 200 and the second coil 300, the support member 4100 may prevent the first coil 200 and the second coil 300 from tilting relative to each other. That is, the interval between the first coil 200 and the second coil 300 may be kept constant by the support member 4100.

[0142] In addition, the support member 4100 may be spaced apart from the intermediate layer 400 or may be in contact with the intermediate layer 400 .

[0143] The support member 4100 may be made of, for example, a magnetic material, epoxy resin, or a non-magnetic material other than epoxy resin, or the support member 4100 may include, for example, a magnetic material, epoxy resin, or a non-magnetic material other than epoxy resin. In the case where the support member 4100 is made of a magnetic material, the magnetic permeability of the support member 4100 may be greater than the magnetic permeability of the intermediate layer 400 and less than or equal to the magnetic permeability of the magnetic body 100.

[0144] Since components other than the above components are Figure 1The components of the coil electronic components shown in FIG. 1 are the same, so their redundant description will be omitted.

[0145] Figure 8 is a schematic perspective view showing a coil electronic component according to another embodiment. Fig. 9 It is along Figure 8 A cross-sectional view taken along line IX-IX'.

[0146] Reference Figure 8 and Fig. 9 According to another embodiment, a coil electronic component 5000 may include a magnetic body 100, a first coil 5200, a second coil 5300, an intermediate layer 5400, a first external electrode 500, a second external electrode 600, a third external electrode 700, a fourth external electrode 800 and a support member 5500.

[0147] The first coil 5200 may include a first support member 5210 , a first coil pattern 5220 , a second coil pattern 5230 , and a first via 5240 .

[0148] The first supporting member 5210 may have a first surface 5213 and a second surface 5215 opposite to each other, and may be made of an insulating material.

[0149] The first coil pattern 5220 may be disposed on the first surface 5213 of the first support member 5210, and the second coil pattern 5230 may be disposed on the second surface 5215 of the first support member 5210. The first coil pattern 5220 and the second coil pattern 5230 may be formed using a plating process used in the art, such as pattern plating, anisotropic plating, or isotropic plating, and may also be formed into a multilayer structure using a plurality of these processes.

[0150] The first via hole 5240 may pass through the first supporting member 5210 to connect the first coil pattern 5220 and the second coil pattern 5230 .

[0151] The second coil 5300 may include a second support member 5310 , a third coil pattern 5320 , a fourth coil pattern 5330 , and a second via 5340 .

[0152] The second supporting member 5310 may have a third surface 5313 and a fourth surface 5315 opposite to each other, and may be made of an insulating material.

[0153] The third coil pattern 5320 may be disposed on the third surface 5313 of the second support member 5310, and the fourth coil pattern 5330 may be disposed on the fourth surface 5315 of the second support member 5310. The third coil pattern 5320 and the fourth coil pattern 5330 may be formed using a plating process used in the art, such as a pattern plating method (e.g., anisotropic plating and / or isotropic plating), etc., and may also be formed into a multilayer structure using a plurality of these processes.

[0154] The second via hole 5340 may pass through the second supporting member 5310 to connect the third coil pattern 5320 and the fourth coil pattern 5330 .

[0155] The intermediate layer 5400 is disposed between the first coil 5200 and the second coil 5300 .

[0156] The intermediate layer 5400 may extend from a first region R1 between the first core 5227 of the first coil 5200 and the second core 5327 of the second coil 5300 to a portion of a second region R2 between the first coil 5200 and the second coil 5300 .

[0157] The second region R2 may include an inner region R21 and an outer region R22 .

[0158] The inner region R21 is a region where the intermediate layer 5400 is provided, and the inner region R21 is a region close to the first core 5227 and the second core 5327 .

[0159] The outer region R22 is a region that is in contact with the inner region R21 and in which the magnetic body 100 is disposed, and is a region that is away from the first core 5227 and the second core 5327 .

[0160] The support member 5500 may be disposed in the second region R2 and in contact with the first coil 5200 and the second coil 5300. Since the support member 5500 is in contact with both the first coil 5200 and the second coil 5300, the support member 5500 may prevent the first coil 5200 and the second coil 5300 from tilting relative to each other. That is, the interval between the first coil 5200 and the second coil 5300 may be kept constant by the support member 5500.

[0161] In addition, the intermediate layer 5400 may include a magnetic material and affect magnetic coupling characteristics of the first coil 5200 and the second coil 5300. The intermediate layer 400 may include magnetic particles, and an insulating material may be interposed between the magnetic particles.

[0162] The intermediate layer 5400 may have a magnetic permeability smaller than that of the magnetic body 100. In addition, the magnetic permeability of the magnetic body 100 and the magnetic permeability of the intermediate layer 5400 may be appropriately set to adjust a coupling coefficient (K) between the first coil 5200 and the second coil 5300.

[0163] The first and second external electrodes 500 and 600 are disposed outside the magnetic body 100 and are electrically connected to the first coil 5200 .

[0164] The first lead-out portion 5223 of the first coil 5200 is exposed from the fourth surface S4 of the magnetic body 100 and connected to the first external electrode 500. The first external electrode 500 may extend from the fourth surface S4 of the magnetic body to the fifth surface S5 and the sixth surface S6. In addition, the second lead-out portion 5225 of the first coil 5200 is exposed from the third surface S3 of the magnetic body 100 and connected to the second external electrode 600. The second external electrode 600 may extend from the third surface S3 of the magnetic body to the fifth surface S5 and the sixth surface S6.

[0165] The third and fourth external electrodes 700 and 800 are disposed outside the magnetic body 100 and are electrically connected to the second coil 5300 .

[0166] The first lead-out portion 5323 of the second coil 5300 is exposed from the fourth surface S4 of the magnetic body 100 and connected to the third external electrode 700. The third external electrode 700 may extend from the fourth surface S4 of the magnetic body to the fifth surface S5 and the sixth surface S6. In addition, the second lead-out portion 5325 of the second coil 5300 is exposed from the third surface S3 of the magnetic body 100 and connected to the fourth external electrode 800. The fourth external electrode 800 may extend from the third surface S3 of the magnetic body to the fifth surface S5 and the sixth surface S6.

[0167] Since components other than the above components are Figure 1 The components of the coil electronic components shown in FIG. 1 are the same, so a redundant description thereof will be omitted.

[0168] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited thereto, and various modifications may be made within the scope of the claims, the specification, and the drawings, and these modifications also fall within the scope of the present disclosure.

Claims

1. A coil electronic assembly, comprising: A first coil including a first core; a second coil spaced apart from the first coil, the second coil comprising a second core; An intermediate layer is arranged to extend from a first region between the first core and the second core to a second region between the first coil and the second coil; as well as a magnetic body surrounding the first coil, the second coil and the intermediate layer, The intermediate layer has a magnetic permeability smaller than that of the magnetic body.

2. The coil electronic component according to claim 1, wherein: The intermediate layer is in contact with the first coil and in contact with the second coil.

3. The coil electronic component according to claim 2, wherein: The intermediate layer is spaced apart from an outer edge of the second region.

4. The coil electronic component according to claim 1, wherein: The thickness of the intermediate layer in the first region is the same as the thickness of the intermediate layer in the second region.

5. The coil electronic component according to claim 1, wherein: The intermediate layer extends from the first region to a portion of the first core.

6. The coil electronic component according to claim 1, wherein: The intermediate layer extends from the first region to a portion of the second core.

7. The coil electronic component according to claim 1, wherein: The intermediate layer extends from the first region to a portion of the first core, and The intermediate layer extends from the first region to a portion of the second core.

8. The coil electronic component according to claim 1, wherein: The second region includes an inner region and an outer region in contact with the inner region, A portion of the intermediate layer is disposed in the inner region, and A portion of the magnetic body is disposed in the outer region.

9. The coil electronic assembly according to claim 1, further comprising: A support member is disposed in the second region and contacts the first coil and the second coil.

10. The coil electronic component according to claim 9, wherein: The support member is spaced apart from the intermediate layer.

11. The coil electronic component according to claim 9, wherein: The support member is in contact with the intermediate layer.

12. The coil electronic component according to claim 9, wherein: The support member includes magnetic material, epoxy resin or non-magnetic material except epoxy resin.

13. The coil electronic component according to claim 1, wherein: The first coil further includes a first lead-out portion and a second lead-out portion, the second coil further includes a third lead-out portion and a fourth lead-out portion, and the coil electronic component further includes: a first external electrode, disposed outside the magnetic body and connected to the first lead-out portion; a second external electrode, disposed outside the magnetic body and connected to the second lead-out portion; a third external electrode disposed outside the magnetic body and connected to the third lead-out portion; and A fourth external electrode is disposed outside the magnetic body and connected to the fourth lead-out portion.

14. The coil electronic component according to claim 1, wherein: The first coil further includes a first winding portion, and The second coil also includes a second winding portion.

15. The coil electronic component according to claim 1, wherein: The first coil further comprises: a first support member having a first surface and a second surface opposite to each other; a first coil pattern disposed on the first surface of the first supporting member; a second coil pattern disposed on the second surface of the first supporting member; and a first via hole passing through the first supporting member to connect the first coil pattern and the second coil pattern, and The second coil comprises: a second supporting member having a third surface and a fourth surface opposite to each other; a third coil pattern disposed on the third surface of the second supporting member; a fourth coil pattern disposed on the fourth surface of the second supporting member; and A second via hole passes through the second supporting member to connect the third coil pattern and the fourth coil pattern.

16. The coil electronic component according to claim 1, wherein: The intermediate layer is configured to extend to a portion of the second region.

17. The coil electronics assembly according to claim 1, further comprising: An insulating film is provided on a surface of the first coil and a surface of the second coil.

18. A coil electronic assembly comprising: A first coil including a first core; a second coil spaced apart from the first coil, the second coil comprising a second core; an intermediate layer disposed in a first region between the first core and the second core and extending into a second region between the first coil and the second coil; as well as a magnetic body surrounding the first coil, the second coil and the intermediate layer, the magnetic body including a first portion, the first portion being disposed in the second region and opposite to the intermediate layer in a direction perpendicular to a winding direction of the first coil, The intermediate layer has a magnetic permeability smaller than that of the magnetic body.

19. The coil electronic component according to claim 18, wherein: The intermediate layer is spaced apart from an outer edge of the second region.

20. The coil electronics assembly according to claim 19, wherein: The intermediate layer extends from the first region to a portion of the first core, and The intermediate layer extends from the first region to a portion of the second core.

21. The coil electronics assembly according to claim 20, further comprising: A support member is disposed in the second region and between the first portion of the magnetic body and the intermediate layer.

22. The coil electronics assembly according to claim 21, wherein: The support member is spaced apart from the intermediate layer.

23. The coil electronics assembly according to claim 21, wherein: The support member is in contact with the intermediate layer.

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