Anti-cracking MLCC capacitor and preparation method thereof

Abstract

The invention provides an anti-cracking MLCC capacitor which comprises a plurality of ceramic dielectric layers, a plurality of inner electrodes arranged in a staggered mode are arranged in the ceramic dielectric layers, at least one ceramic dielectric layer is arranged between the inner electrodes, the two ends of the inner electrodes arranged in the staggered mode are electrically connected with end electrodes through outer electrodes respectively, thickening layers are arranged at the bottoms of the ceramic dielectric layers, and the inner electrodes are arranged in the thickening layers. And the thickness of the thickening layer is greater than that of the ceramic dielectric layer between the inner electrodes. The thickening layer is a thickened ceramic dielectric layer; or the thickening layer is formed by stacking at least two ceramic dielectric layers, and an isolating layer is arranged between the ceramic dielectric layers of the thickening layer; and the isolating layer is a carbonized layer or a flexible resin layer. By adopting the scheme, the thermal shock resistance and the mechanical shock resistance of the MLCC capacitor can be greatly improved, the cracking condition of the MLCC capacitor is obviously improved, or even if the MLCC capacitor is cracked, the normal use of the MLCC capacitor is not influenced.

Description

Technical Field

[0001] The present invention relates to the field of MLCC capacitor preparation, and in particular to an anti-cracking MLCC capacitor and a preparation method thereof. Background Art

[0002] MLCC (Multi-layer Ceramic Chip Capacitors) is also called monolithic capacitor. The current market demand is mainly in digital products and automotive electronics applications. In automotive electronics, computers and other products, the temperature changes greatly and there are mechanical shocks, which requires a high mechanical strength for MLCC. Figure 7 , Figure 8 As shown in , in application scenarios with large temperature changes and mechanical shocks, MLCCs are prone to cracking at the welding position. The cracking structure may cause the external electrode or the internal electrode to break, misalign or short-circuit, resulting in reduced MLCC capacitance, MLCC failure, or even MLCC short-circuit, posing risks to electronic products such as automotive circuits or computers that use the MLCC.

[0003] CN205692699U records a chip-type multilayer ceramic capacitor with a support structure. This solution provides an elastic conductive bracket at the pin welding position to prevent the body from being easily broken and fractured. However, when this solution is actually used, the solder will wrap the bottom of the conductive bracket, causing the pin of the conductive bracket to lose its elasticity. Since the size of MLCC is usually small, this solution requires the provision of a triangular anti-slip block on the conductive bracket. This structure is difficult to obtain in large quantities and at low cost, and is difficult to produce in tiny MLCCs, such as those with a length of less than 1 mm. CN203013529U records a multilayer chip ceramic capacitor, which improves the strength of the MLCC by providing a cover plate with a high-strength aluminum oxide layer or zirconium oxide layer, but this solution leads to a significant increase in cost. CN115775648A records a conductive resin composition, a preparation method and an application thereof, which improves the toughness of the MLCC by using a conductive resin composition in the terminal electrode, thereby solving the problem of easy fracture. However, the inventors have found from some test results, such as Figure 8 As shown in , it is still found that there are cases of breakage. That is, relying solely on the replacement of components is not enough to solve the problem of easy breakage. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide an anti-cracking MLCC capacitor and a preparation method, which can greatly improve the MLCC's resistance to thermal deformation and mechanical impact, and can avoid the problem of MLCC cracking, or even if a break occurs, it will not affect continued use.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: an anti-cracking MLCC capacitor, comprising a multi-layer ceramic dielectric layer, a multi-layer staggered internal electrode is arranged in the multi-layer ceramic dielectric layer, at least one ceramic dielectric layer is arranged between the internal electrodes, the two ends of the staggered internal electrodes are electrically connected to the end electrodes through external electrodes respectively, and a thickening layer is provided at the bottom of the ceramic dielectric layer, and the thickness of the thickening layer is greater than the thickness of the ceramic dielectric layer between the internal electrodes.

[0006] In a preferred embodiment, the thickness of the thickened layer is greater than 1 / 6 of the length of the opening; The opening length refers to the minimum overhead length between the end electrodes at both ends after welding.

[0007] In a preferred embodiment, the thickened layer is a thickened ceramic dielectric layer; Alternatively, the thickening layer is formed by stacking at least two ceramic dielectric layers, and an isolation layer is provided between the ceramic dielectric layers of the thickening layer; The isolation layer is a carbonized layer or a flexible resin layer.

[0008] In a preferred embodiment, the thickening layer is a resin layer, and the resin layer is a thermosetting resin; Thermosetting resins include one or more combinations of polyimide resins, polyamide resins, polyurethane resins, acrylic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, polyamideimide resins, phenolic resins, cresol resins, melamine resins, alkyd resins, amino resins or polylactic acid resins.

[0009] In a preferred solution, a terminal electrode liner is provided between the external electrode and the terminal electrode, the coverage of the terminal electrode liner is the same as the coverage of the terminal electrode, and the terminal electrode liner is made of conductive resin.

[0010] In a preferred solution, the end electrode liner is provided with a thickened structure near the bottom.

[0011] In a preferred solution, conductive bent supports are respectively provided at the bottom of the end electrodes at both ends, the top of the bent supports is electrically connected to the end electrodes, and the bottom of the bent supports is provided with a bent structure.

[0012] In a preferred embodiment, the top of the bending support is bent upward to contact the side wall of the end electrode, the middle of the bending support is bent toward the thickening layer to contact the bottom wall of the end electrode, and the bottom of the bending support is provided with at least one vertical bending section, and a horizontal straight bending section or an arc-shaped bending section is provided at the bottom of the vertical bending section, wherein the arc-shaped bending section constitutes a welding groove.

[0013] A method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S1, preparing a ceramic dielectric layer without an electrode layer by tape casting for standby use; S2, in the lamination step, stacking at least one ceramic dielectric layer without an electrode layer at the bottom; Through the above steps, an MLCC capacitor with a thickened layer is obtained.

[0014] In a preferred embodiment, in step S2, during lamination, a resin layer is provided between the ceramic dielectric layers of the thickening layer, and in the debinding step, the resin layer is carbonized to form a carbonized layer; Through the above steps, the thickened layer obtains a ceramic dielectric layer that can be relatively displaced after being disconnected.

[0015] In a preferred solution, the ceramic dielectric layer at the bottom of the thickened layer is provided with a fracture, so that the ceramic dielectric layer at the bottom is disconnected at a preset position.

[0016] A method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S01, after the sintering step, providing a resin layer at the bottom of the blank; S02, sealing and burning the ends with a conductive resin to form an end electrode lining; S03, electroplating at least two metal layers outside the terminal electrode lining to form a terminal electrode; The conductive resin comprises, by mass percentage, 65% to 72% of conductive metal powder, 5% to 10% of thermosetting resin, 10% to 20% of additives, and 5% to 10% of organic solvent; The conductive metal powder includes more than 60% of flake or filament structures; Through the above steps, an anti-cracking MLCC capacitor is obtained.

[0017] In a preferred embodiment, the metal powder is made of one or more of silver, nickel or copper; The resin layer adopts thermosetting resin; Thermosetting resins include one or more combinations of polyimide resins, polyamide resins, polyurethane resins, acrylic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, polyamideimide resins, phenolic resins, cresol resins, melamine resins, alkyd resins, amino resins or polylactic acid resins; The additive is a combination of one or more of polyvinyl butyral, ethyl cellulose and polyvinyl alcohol; The organic solvent is anhydrous ethanol; The burning end temperature is 200℃~290℃; The inner metal layer of the electroplating is a nickel-plated layer, and the outer metal layer is a tin-plated layer.

[0018] A method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S11, in the end-sealing step, prefabricating a "C"-shaped end-sealing shell, wherein the height of the "C"-shaped end-sealing shell is higher than the height of the blank; S12, filling metallurgical powder in the "C"-shaped end-sealing shell, placing both ends of the blank in the "C"-shaped end-sealing shell, wherein the filling thickness of the metallurgical powder at the bottom of the "C"-shaped end-sealing shell is higher than the filling thickness at the top; The metallurgical powder is a conductive metal powder, wherein by mass percentage, 80% to 95% of the conductive metal powder and 5% to 20% of the additive; The conductive metal powder is a combination of one or more of silver, copper and nickel, and the additive is a combination of one or more of polyvinyl butyral, ethyl cellulose or polyvinyl alcohol; Through the above steps, an anti-cracking MLCC capacitor is obtained.

[0019] A method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S21, preparing a long strip of bent support strip by extrusion; S22, arranging two bending support bars opposite to each other, with the spacing between the bending support bars being equal to the length of the blank, applying end-sealing paste at the position connected to the blank, placing the end-sealed blank between the two bending supports, and performing end-burning operation after the end-sealing paste is dried; S23, cutting and separating the bent supports of each MLCC capacitor along the length direction; The anti-cracking MLCC capacitor is obtained through the above steps.

[0020] The present invention provides an anti-cracking MLCC capacitor and a preparation method. By adopting the above scheme, the ability of the MLCC capacitor to resist thermal shock and mechanical shock can be greatly improved, and the cracking of the MLCC capacitor can be significantly improved. Preferably, even if cracking occurs, it will not affect the normal use of the MLCC capacitor. According to different application scenarios, the present invention can reduce or avoid the cracking of the MLCC capacitor with different processes or costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 It is a structural schematic diagram of the present invention.

[0022] Figure 2 It is a structural schematic diagram of another preferred embodiment of the present invention.

[0023] Figure 3 It is a structural schematic diagram of another preferred embodiment of the present invention.

[0024] Figure 4It is a structural schematic diagram of another preferred embodiment of the present invention.

[0025] Figure 5 It is a structural schematic diagram of another preferred embodiment of the present invention.

[0026] Figure 6 It is a structural schematic diagram of another preferred embodiment of the present invention.

[0027] Figure 7 This is a schematic diagram of the structure of an MLCC capacitor after the pin is broken in the prior art.

[0028] Figure 8 This is a schematic diagram of the structure of an MLCC capacitor after the pin is broken in the prior art.

[0029] In the figure: end electrode 1, ceramic dielectric layer 2, inner electrode 3, bottom plate thickness 4, opening length 5, resin layer 6, end electrode lining 7, outer electrode length 8, thickening layer 9, bending support 10, welding groove 11, outer electrode 12. DETAILED DESCRIPTION

[0030] The MLCC capacitor processing technology in the prior art includes the following steps: Preparation of ceramic slurry for ceramic dielectric layer, usually BaTiO3 → ceramic slurry is cast and spread, dried → electrode layer is printed on the surface of ceramic dielectric layer → lamination, ceramic dielectric layers with electrode layers are stacked, electrode layers are staggered → the stacked capacitor semi-finished product is compacted → cutting, single capacitor semi-finished product is made → debonding, glue is evaporated and discharged at 600℃, about 3h~5h, preferably 4h → sintering, ceramic dielectric layer in capacitor is sintered, sintering temperature is usually 1000℃~1250℃ → chamfering, chamfering the edge of sintered capacitor → sealing, electrode slurry is coated on both ends of capacitor respectively, usually a combination of one or more of silver, copper and nickel, and electrically connected to external electrode → sintering end, electrode slurry is solidified into terminal electrode 1, usually sintering temperature is 800℃ → electroplating, nickel layer and tin layer are plated on terminal electrode 1 respectively.

[0031] For ease of description: In this example, the semi-finished capacitor product without terminal electrodes after stacking is called a blank.

[0032] The overlapping portion of the electrode layers is called the internal electrode 3, and the interlaced and un-overlapped portion is called the external electrode 12.

[0033] The electrodes wrapped around the two ends of the capacitor are called terminal electrodes 1.

[0034] The technical solution of the present invention is described in detail below. Parts not specifically described are all within the prior art.

[0035] Embodiment 1: like Figures 1 to 6 In the invention, an anti-cracking MLCC capacitor includes a multi-layer ceramic dielectric layer 2, a multi-layer staggered internal electrode 3 is arranged in the multi-layer ceramic dielectric layer 2, at least one layer of ceramic dielectric layer 2 is arranged between the internal electrodes 3, both ends of the staggered internal electrodes 3 are electrically connected to the terminal electrode 1 through the external electrode, and a thickening layer 9 is arranged at the bottom of the ceramic dielectric layer 2, and the thickness of the thickening layer 9 is greater than the thickness of the ceramic dielectric layer 2 between the internal electrodes 3. With this structure, the tensile strength at the bottom position is enhanced, and even if a fracture occurs, the fracture position is located within the range of the thickening layer 9, which will not affect the performance of the capacitor.

[0036] The preferred solution is Figure 1 In the embodiment, the thickness of the thickened layer 9 is greater than 1 / 6 of the opening length 5, and the opening length 5 refers to the minimum overhead length between the end electrodes 1 at both ends after welding.

[0037] The preferred solution is Figure 1 In the embodiment, the thickened layer 9 is a thickened ceramic dielectric layer 2 .

[0038] A further preferred solution is Figure 2 In the embodiment, the thickening layer 9 is formed by stacking at least two ceramic dielectric layers 2, and an isolation layer is provided between the ceramic dielectric layers 2 of the thickening layer 9; The isolation layer is a carbonized layer or a flexible resin layer. With this structure, in addition to enhancing the tensile strength, when a fracture occurs, the fracture is more likely to develop along the isolation layer, thereby avoiding the influence of the crack on the electrode.

[0039] Embodiment 2: Based on Example 1, a method for preparing the above-mentioned anti-cracking MLCC capacitor includes the following steps: S1, preparing a ceramic dielectric layer 2 without an electrode layer by tape casting for standby use; S2, in the lamination step, stacking at least one ceramic dielectric layer 2 without an electrode layer at the bottom; Through the above steps, an MLCC capacitor having a thickened layer 9 is obtained.

[0040] The preferred solution is Figure 2 In step S2, during lamination, a resin layer is provided between the ceramic dielectric layer 2 of the thickening layer 9, and in the debinding step, the resin layer is carbonized to form a carbonized layer; Through the above steps, the thickened layer 9 obtains a ceramic dielectric layer 2 that can be relatively displaced after being disconnected. Under this structure, when the ceramic dielectric layer located at the bottom layer breaks, the subsequent crack development reaches the position of the carbonized layer. The carbonized layer constitutes a weak structure, so that the crack develops along the carbonized layer, thereby not affecting the external electrode 12 and the internal electrode 3.

[0041] In a preferred embodiment, the ceramic dielectric layer 2 at the bottom of the thickened layer 9 is provided with a fracture, so that the ceramic dielectric layer 2 at the bottom is disconnected at a preset position. The fracture described in this example includes a structure that is completely disconnected or partially disconnected in depth, so that possible cracks develop along the preset fracture and avoid the position of the electrode.

[0042] Embodiment 3: Based on Example 1, the preferred solution is as follows Figure 2 In the embodiment, the thickening layer 9 is a resin layer 6, and the resin layer 6 is a thermosetting resin.

[0043] The preferred solution is Figure 3 In the embodiment, a terminal electrode liner 7 is provided between the external electrode and the terminal electrode 1, and the coverage of the terminal electrode liner 7 is the same as that of the terminal electrode 1, and the terminal electrode liner 7 is made of conductive resin.

[0044] In a preferred solution, the terminal electrode liner 7 is provided with a thickened structure near the bottom.

[0045] Embodiment 4: On the basis of Example 3, Figure 3 As shown in , a method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S01, after the sintering step, a resin layer 6 is provided at the bottom of the blank; S02, sealing and sintering the ends with a conductive resin to form an end electrode liner 7; S03, electroplating at least two metal layers outside the terminal electrode lining 7 to form a terminal electrode 1; The conductive resin comprises, by mass percentage, 65% to 72% of conductive metal powder, 5% to 10% of thermosetting resin, 10% to 20% of additives, and 5% to 10% of organic solvent; The conductive metal powder includes more than 60% of flake or filament structures; Through the above steps, an anti-cracking MLCC capacitor is obtained.

[0046] In a preferred embodiment, the metal powder is made of one or more of silver, nickel or copper; The resin layer 6 is made of thermosetting resin; Thermosetting resins include one or more combinations of polyimide resins, polyamide resins, polyurethane resins, acrylic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, polyamideimide resins, phenolic resins, cresol resins, melamine resins, alkyd resins, amino resins or polylactic acid resins; The additive is a combination of one or more of polyvinyl butyral, ethyl cellulose and polyvinyl alcohol; The organic solvent is anhydrous ethanol; The firing temperature is 200° C. to 290° C.; this method adopts a low-temperature firing process of the conductive resin, so as not to affect the performance of the resin layer 6 .

[0047] The inner metal layer of the electroplating is a nickel-plated layer, and the outer metal layer is a tin-plated layer.

[0048] By the above method, the thickened structure of the terminal electrode liner 7 can provide sufficient elastic deformation, so as to cope with the deformation caused by thermal expansion and contraction due to thermal shock and mechanical stress.

[0049] Embodiment 5: On the basis of Example 3, Figure 3 As shown in , a method for preparing the above-mentioned anti-cracking MLCC capacitor includes the following steps: S11, in the end-sealing step, prefabricating a "C"-shaped end-sealing shell, the height of the "C"-shaped end-sealing shell being higher than the height of the blank; S12, filling metallurgical powder in the "C"-shaped end-sealing shell, placing both ends of the blank in the "C"-shaped end-sealing shell, wherein the filling thickness of the metallurgical powder at the bottom of the "C"-shaped end-sealing shell is higher than the filling thickness at the top; The metallurgical powder is a conductive metal powder, wherein by mass percentage, 80% to 95% of the conductive metal powder and 5% to 20% of the additive; The conductive metal powder is a combination of one or more of silver, copper, and nickel, and the additive is a combination of one or more of polyvinyl butyral, ethyl cellulose, and polyvinyl alcohol; through the above steps, an anti-cracking MLCC capacitor is obtained. According to the above method, the sintered metallurgical powder constitutes the terminal electrode lining 7, and the thickened structure of the terminal electrode lining 7 can provide sufficient elastic deformation, so as to cope with the deformation caused by thermal expansion and contraction caused by thermal shock and mechanical stress. A "C"-shaped end-sealing shell is first made, and then the end-sealing shell is connected to the blank by powder casting, so that the process can be suitable for traditional production processes, that is, the end-sintering process at a high temperature of 800°C. The present invention can be put into production after simply modifying the existing process route, reducing the investment in technical transformation.

[0050] Embodiment 6: Based on Example 1, the preferred solution is as follows Figure 5 , 6In the embodiment, conductive bending supports 10 are respectively provided at the bottom of the terminal electrodes 1 at both ends, the top of the bending supports 10 is electrically connected to the terminal electrodes 1, and a bending structure is provided at the bottom of the bending supports 10. With this structure, the bottom of the bending supports 10 is in contact with the solder, and the bending supports 10 can use the elastic deformation of the bending structure in the middle of itself to offset the thermal shock or mechanical stress deformation of the MLCC capacitor.

[0051] The preferred solution is Figure 6 In the embodiment, the top of the bending support 10 is bent upward to contact the side wall of the end electrode 1, and the middle part of the bending support 10 is bent toward the thickening layer 9 to contact the bottom wall of the end electrode 1. The bottom of the bending support 10 is provided with at least one vertical bending section, and a horizontal straight bending section or an arc-shaped bending section is provided at the bottom of the vertical bending section, wherein the arc-shaped bending section constitutes a solder containing groove 11. Due to this structure, the solder is attracted into the solder containing groove 11 at the bottom of the bending support 10, thereby preventing the solder from entering the elastic deformation section in the middle part of the bending support 10, thereby affecting the elastic deformation ability of the bending support 10.

[0052] Embodiment 7: Based on Example 6, the optional solution is as follows Figure 6 A method for preparing the above-mentioned anti-cracking MLCC capacitor comprises the following steps: S21, preparing a long strip of bent support strip by extrusion; S22, arranging two bending support bars opposite to each other, with the spacing between the bending support bars being equal to the length of the blank, applying end-sealing paste at the position connected to the blank, placing the end-sealed blank between the two bending supports 10, and performing end-burning operation after the end-sealing paste is dried; S23, cutting and separating the bent supports 10 of each MLCC capacitor along the length direction; The anti-cracking MLCC capacitor is obtained through the above steps. By this method, the present invention can conveniently prepare an MLCC capacitor with a bending support, and the elastic deformation of the bending support is sufficient to cope with the deformation caused by thermal expansion and contraction caused by thermal shock and mechanical stress, fundamentally solving the problem of MLCC capacitor cracking, and is suitable for applications with high stability requirements.

[0053] The above-mentioned embodiments are only preferred technical solutions of the present invention and should not be regarded as limitations of the present invention. The embodiments and features in the embodiments of the present application can be arbitrarily combined with each other without conflict. The protection scope of the present invention shall be the technical solutions recorded in the claims, including the equivalent replacement solutions of the technical features in the technical solutions recorded in the claims. That is, equivalent replacement improvements within this scope are also within the protection scope of the present invention.

Claims

1. An anti-cracking MLCC capacitor, comprising a plurality of ceramic dielectric layers (2), a plurality of staggered internal electrodes (3) being arranged in the plurality of ceramic dielectric layers (2), at least one ceramic dielectric layer (2) being arranged between the internal electrodes (3), the two ends of the staggered internal electrodes (3) being electrically connected to the terminal electrodes (1) via external electrodes (12), wherein: A thickening layer (9) is provided at the bottom of the ceramic dielectric layer (2), and the thickness of the thickening layer (9) is greater than the thickness of the ceramic dielectric layer (2) between the internal electrodes (3).

2. The anti-cracking MLCC capacitor according to claim 1, characterized in that: The thickness of the thickened layer (9) is greater than 1 / 6 of the opening length (5); The opening length (5) refers to the minimum overhead length between the end electrodes (1) at both ends after welding.

3. The anti-cracking MLCC capacitor according to claim 1, characterized in that: The thickened layer (9) is a thickened ceramic dielectric layer (2); Alternatively, the thickened layer (9) is formed by stacking at least two ceramic dielectric layers (2), and an isolation layer is provided between the ceramic dielectric layers (2) of the thickened layer (9); The isolation layer is a carbonized layer or a flexible resin layer.

4. The anti-cracking MLCC capacitor according to claim 1, characterized in that: The thickening layer (9) is a resin layer (6), and the resin layer (6) is a thermosetting resin; Thermosetting resins include one or more combinations of polyimide resins, polyamide resins, polyurethane resins, acrylic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, polyamideimide resins, phenolic resins, cresol resins, melamine resins, alkyd resins, amino resins or polylactic acid resins.

5. The anti-cracking MLCC capacitor according to claim 1, characterized in that: An end electrode liner (7) is provided between the external electrode and the end electrode (1); the coverage of the end electrode liner (7) is the same as the coverage of the end electrode (1); and the end electrode liner (7) is made of conductive resin.

6. The anti-cracking MLCC capacitor according to claim 5, characterized in that: The end electrode liner (7) is provided with a thickened structure at a position close to the bottom.

7. The anti-cracking MLCC capacitor according to claim 1, characterized in that: Conductive bent supports (10) are respectively provided at the bottom of the end electrodes (1) at both ends; the top of the bent support (10) is electrically connected to the end electrode (1); and the bottom of the bent support (10) is provided with a bent structure.

8. The anti-cracking MLCC capacitor according to claim 1, characterized in that: The top of the bending support (10) is bent upward to contact the side wall of the end electrode (1), the middle of the bending support (10) is bent in the direction of the thickened layer (9) to contact the bottom wall of the end electrode (1), and the bottom of the bending support (10) is provided with at least one vertical bending section, and a horizontal straight bending section or an arc-shaped bending section is provided at the bottom of the vertical bending section, wherein the arc-shaped bending section constitutes a welding groove (11).

9. A method for preparing the anti-cracking MLCC capacitor according to any one of claims 1 to 8, characterized in that The following steps are involved: S1, preparing a ceramic dielectric layer (2) without an electrode layer by tape casting for use; S2, in the lamination step, stacking at least one ceramic dielectric layer (2) without an electrode layer at the bottom; Through the above steps, an MLCC capacitor having a thickened layer (9) is obtained.

10. The method for preparing the anti-cracking MLCC capacitor according to claim 9, characterized in that: In step S2, during lamination, a resin layer is provided between the ceramic dielectric layer (2) of the thickened layer (9), and in the debonding step, the resin layer is carbonized to form a carbonized layer; Through the above steps, the thickened layer (9) obtains a ceramic dielectric layer (2) that can be relatively displaced after being disconnected.

11. The method for preparing the anti-cracking MLCC capacitor according to claim 10, characterized in that: The ceramic dielectric layer (2) located at the bottom of the thickened layer (9) is provided with a fracture, so that the ceramic dielectric layer (2) located at the bottom is disconnected at a preset position.

12. A method for preparing the anti-cracking MLCC capacitor according to claim 4, characterized in that The following steps are involved: S01, after the sintering step, providing a resin layer (6) at the bottom of the blank; S02, sealing and sintering the ends with a conductive resin to form an end electrode lining (7); S03, electroplating at least two metal layers outside the terminal electrode lining (7) to form a terminal electrode (1); The conductive resin comprises, by mass percentage, 65% to 72% of conductive metal powder, 5% to 10% of thermosetting resin, 10% to 20% of additives, and 5% to 10% of organic solvent; The conductive metal powder includes more than 60% of flake or filament structures; Through the above steps, an anti-cracking MLCC capacitor is obtained.

13. The method for preparing the anti-cracking MLCC capacitor according to claim 12, characterized in that: The metal powder is made of one or more of silver, nickel or copper; The resin layer (6) is made of thermosetting resin; Thermosetting resins include one or more combinations of polyimide resins, polyamide resins, polyurethane resins, acrylic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, polyamideimide resins, phenolic resins, cresol resins, melamine resins, alkyd resins, amino resins or polylactic acid resins; The additive is a combination of one or more of polyvinyl butyral, ethyl cellulose and polyvinyl alcohol; The organic solvent is anhydrous ethanol; The burning end temperature is 200℃~290℃; The inner metal layer of the electroplating is a nickel-plated layer, and the outer metal layer is a tin-plated layer.

14. A method for preparing the anti-cracking MLCC capacitor according to claim 6, characterized in that The following steps are involved: S11, in the end-sealing step, prefabricate a "C"-shaped end-sealing shell, wherein the height of the "C"-shaped end-sealing shell is higher than the height of the blank; S12, filling metallurgical powder in a "C"-shaped end-sealing shell, placing both ends of the blank in the "C"-shaped end-sealing shell, wherein the filling thickness of the metallurgical powder at the bottom of the "C"-shaped end-sealing shell is higher than the filling thickness at the top; The metallurgical powder is a conductive metal powder, wherein by mass percentage, 80% to 95% of the conductive metal powder and 5% to 20% of the additive; The conductive metal powder is a combination of one or more of silver, copper and nickel, and the additive is a combination of one or more of polyvinyl butyral, ethyl cellulose or polyvinyl alcohol; Through the above steps, an anti-cracking MLCC capacitor is obtained.

15. A method for preparing the anti-cracking MLCC capacitor according to any one of claims 7 to 8, characterized in that The following steps are involved: S21, preparing a long strip of bent support strip by extrusion; S22, arranging two bending support bars opposite to each other, with the spacing between the bending support bars being equal to the length of the blank, applying end-sealing paste at the position connected to the blank, placing the end-sealed blank between the two bending supports (10), and performing an end-burning operation after the end-sealing paste is dried; S23, cutting and separating the bent supports (10) of each MLCC capacitor along the length direction; The anti-cracking MLCC capacitor is obtained through the above steps.

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