Packaging structure, forming method thereof and testing method of packaging structure

Abstract

The invention relates to a packaging structure, a forming method thereof and a testing method of the packaging structure. The forming method of the packaging structure comprises the following steps that an initial frame is formed, the initial frame comprises a plurality of frame units and supporting ribs located between the adjacent frame units, each frame unit comprises a base island and pins, the supporting ribs are connected with the pins in the two adjacent frame units, and the thickness of the supporting ribs is smaller than that of the pins; forming an initial packaging body located above the initial frame, wherein the initial packaging body comprises a plurality of packaging units in one-to-one correspondence with the plurality of frame units; supporting ribs in the initial frame are cut, and adjacent frame units are separated; cutting the initial packaging body, separating the adjacent packaging units, and forming the packaging structure comprising the frame units and the packaging units above the frame units. According to the invention, the step-shaped wettable side-climbing structure can be formed at the edge of the back surface of the pin, and electrical tests such as a strip OS test and the like can be carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit manufacturing, and in particular to a packaging structure and a forming method thereof, and a testing method of the packaging structure. Background Art

[0002] The semiconductor packaging technology of QFN (Quad Flat No-lead) with wettable flank is widely used in the field of automotive lamps with high reliability requirements. The wettable flank technology is to metallize the side of the QFN package structure so that the solder used for welding can spread along the side of the package structure (i.e., side creep). The wettable flank technology can be used to visually inspect and automatically inspect the welding quality of the package structure. Moreover, the wettable flank technology can also improve the resistance of the package structure to mechanical stress, thereby improving the mechanical strength of the package structure. However, although the wettable flank technology can inspect the welding quality of the QFN package structure, the current QFN package structure cannot accurately perform a strip OS (Open-Short) test. This is because, in the process of cutting a semiconductor structure with multiple package units, it cannot be ensured that the metal wires in the lead frame are fully cut, which leads to a reduction in the accuracy and reliability of the strip OS test results and is not conducive to improving the efficiency of the strip OS test.

[0003] Therefore, how to ensure that the packaging structure can undergo strip OS testing while improving the accuracy and reliability of the strip OS testing and shortening the cutting time between strip OS testing, thereby improving the processing efficiency of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present invention provides a packaging structure and a method for forming the same, and a method for testing the packaging structure, for ensuring that the packaging structure can undergo electrical tests such as strip OS testing, while improving the accuracy and reliability of the electrical testing, shortening the cutting time before the electrical testing, and thus improving the processing efficiency of the packaging structure.

[0005] According to some embodiments, the present invention provides a method for forming a package structure, comprising the following steps:

[0006] Forming an initial frame, the initial frame comprising a plurality of frame units and support ribs located between adjacent frame units, the frame unit comprising a base island and pins located at the periphery of the base island, the support ribs connecting the pins in two adjacent frame units, the thickness of the support ribs being less than the thickness of the pins;

[0007] forming an initial package body located above the initial frame, wherein the initial package body comprises a plurality of package units corresponding one-to-one to the plurality of frame units;

[0008] Cutting the support ribs in the initial frame to separate adjacent frame units;

[0009] The initial packaging body is cut to separate the adjacent packaging units, so as to form a packaging structure including the frame unit and the packaging units thereon.

[0010] In some embodiments, the specific steps of forming the initial framework include:

[0011] Provide carrier board;

[0012] forming a metal frame on the carrier, with the back side of the metal frame facing the carrier;

[0013] The metal frame is patterned to form the initial frame including a plurality of the frame units and grooves between adjacent frame units, and the remaining metal frame below the grooves serves as the supporting ribs.

[0014] In some embodiments, the thickness of the supporting rib is 1 / 5 to 1 / 2 of the thickness of the pin.

[0015] In some embodiments, the specific steps of forming the initial package body located above the initial frame include:

[0016] Mounting a chip on top of the base island in the frame unit;

[0017] Forming metal wires that electrically connect the chip to the front side of the pins;

[0018] A molding layer is formed to continuously mold the base islands in the plurality of frame units and fill the grooves, so as to form the initial package body including the molding layer and the chip.

[0019] In some embodiments, the specific steps of cutting the support ribs in the initial frame and separating adjacent frame units include:

[0020] removing the carrier plate;

[0021] The support ribs in the initial frame and part of the plastic packaging layer in the groove are cut from the back side of the initial frame to form a first cutting groove that penetrates the initial frame and extends into the groove, wherein the first cutting groove separates adjacent frame units.

[0022] In some embodiments, the width of the first cutting groove is greater than the width of the groove, the depth of the first cutting groove is less than the thickness of the pin, and the edge of the back side of the pin is stepped after cutting.

[0023] In some embodiments, a solder layer is formed on the back side of the lead and the back side of the base island, and the solder layer extends from the back side of the lead to the surface of the step structure.

[0024] In some embodiments, the specific steps of cutting the initial package body and separating adjacent package units include:

[0025] The initial package body is cut along the first cutting groove to form a second cutting groove penetrating the initial package body, wherein the second cutting groove separates adjacent package units.

[0026] In some embodiments, a width of the second cutting groove is greater than or equal to a width of the groove.

[0027] In some embodiments, a width of the second cutting groove is smaller than a width of the groove.

[0028] According to some other embodiments, the present invention further provides a packaging structure formed by the method for forming the packaging structure as described above, the packaging structure comprising:

[0029] Key Island;

[0030] A pin is located at the periphery of the base island, and the back edge of the pin has a step structure;

[0031] A chip, disposed on the base island and electrically connected to the pin;

[0032] A plastic sealing layer, covering the chip;

[0033] The solder layer is located on the back side of the pin, and the solder layer extends from the back side of the pin to the step structure.

[0034] In some embodiments, the sidewalls of the pins are exposed outside the plastic packaging layer, and the solder layer does not cover the sidewalls of the pins.

[0035] In some embodiments, the sidewalls of the pins are covered in the plastic packaging layer.

[0036] According to some further embodiments, the present invention further provides a method for testing a package structure, comprising the following steps:

[0037] Forming an initial frame, the initial frame comprising a plurality of frame units and support ribs located between adjacent frame units, the frame unit comprising a base island and pins located at the periphery of the base island, the support ribs connecting the pins in two adjacent frame units, the thickness of the support ribs being less than the thickness of the pins;

[0038] forming an initial package body located above the initial frame, wherein the initial package body comprises a plurality of package units corresponding one-to-one to the plurality of frame units;

[0039] Cutting the support ribs in the initial frame to separate adjacent frame units;

[0040] Conducting electrical performance tests on the frame unit and the packaging unit thereon;

[0041] The initial packaging body is cut to separate the adjacent packaging units, so as to form a packaging structure including the frame unit and the packaging units thereon.

[0042] In some embodiments, the electrical performance test is a strip OS test.

[0043] The packaging structure and its forming method, and the testing method of the packaging structure provided by the present invention form a plurality of frame units and support ribs located between adjacent frame units, wherein the support ribs connect the pins in two adjacent frame units, and by setting the thickness of the support ribs to be less than the thickness of the pins, during the formation of the packaging structure, during the first step of the cutting process of cutting the initial frame, it is ensured that the support ribs can be fully cut off, so that not only a step-shaped wettable side creeping structure can be formed at the edge of the back of the pin, but also the adjacent frame units are fully isolated, so that electrical tests such as strip OS tests can be performed, and the accuracy and reliability of electrical tests such as strip OS tests are improved. Since the thickness of the support ribs is small, the time for cutting the initial frame before performing electrical tests such as strip OS tests is shortened, thereby improving the processing efficiency of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 is a flow chart of a method for forming a packaging structure in a specific embodiment of the present invention;

[0045] Figure 2 is a schematic cross-sectional view of a specific embodiment of the present invention after an initial frame is formed;

[0046] Figure 3 is a schematic cross-sectional view of a specific embodiment of the present invention after an initial package body is formed;

[0047] Figure 4is a schematic diagram of a three-dimensional structure of a specific embodiment of the present invention after an initial package body is formed;

[0048] Figure 5 is a schematic cross-sectional view of a specific embodiment of the present invention after the carrier plate is removed;

[0049] Figure 6 is a schematic cross-sectional view of a specific embodiment of the present invention after cutting the initial frame;

[0050] Figure 7 is a cross-sectional schematic diagram of a specific embodiment of the present invention in which a solder layer is formed after cutting the initial frame;

[0051] Figure 8 is a schematic cross-sectional view of a specific embodiment of the present invention after the initial package body is cut;

[0052] Fig. 9 is a schematic diagram of a packaging structure formed by a specific embodiment of the present invention;

[0053] Fig.10 is a cross-sectional schematic diagram of another packaging structure formed by a specific embodiment of the present invention;

[0054] Fig.11 It is a flow chart of a testing method for a packaging structure in a specific implementation manner of the present invention. DETAILED DESCRIPTION

[0055] The specific implementation methods of the packaging structure and the forming method thereof, and the testing method of the packaging structure provided by the present invention are described in detail below with reference to the accompanying drawings.

[0056] This specific embodiment provides a method for forming a packaging structure. Figure 1 FIG. 1 is a flow chart of a method for forming a packaging structure in a specific embodiment of the present invention. Figure 1 As shown, the method for forming the packaging structure includes the following steps:

[0057] Step S11, forming an initial frame, wherein the initial frame includes a plurality of frame units and support ribs located between adjacent frame units, wherein the frame unit includes a base island and pins located at the periphery of the base island, wherein the support ribs connect the pins in two adjacent frame units, and the thickness of the support ribs is less than the thickness of the pins;

[0058] Step S12, forming an initial package body located above the initial frame, wherein the initial package body includes a plurality of package units corresponding one-to-one to the plurality of frame units;

[0059] Step S13, cutting the support ribs in the initial frame to separate adjacent frame units;

[0060] Step S14, cutting the initial packaging body to separate the adjacent packaging units to form a packaging structure including the frame unit and the packaging units thereon.

[0061] Figure 2 is a schematic cross-sectional view of a specific embodiment of the present invention after the initial frame is formed. Figure 2 As shown, the specific steps to form the initial framework include:

[0062] Providing a carrier board 20;

[0063] A metal frame is formed on the carrier board 20, with the back side of the metal frame facing the carrier board 20;

[0064] The metal frame is patterned to form the initial frame including a plurality of the frame units and grooves 213 between adjacent frame units, and the remaining metal frame below the grooves 213 serves as the supporting ribs 212 .

[0065] For example, if Figure 2 As shown, the metal frame is pasted onto the carrier 20 with the back side of the metal frame facing the carrier 20. The metal frame is etched to form the initial frame. The initial frame includes a front side 214 and a back side 215 that are relatively distributed, and the back side 215 of the initial frame faces the carrier 20. The initial frame includes a plurality of frame units, each of which includes the base island and a plurality of discrete pins 211 distributed around the periphery of the base island. The patterning process also forms the grooves 213 that do not penetrate the metal frame between adjacent frame units, and the remaining metal frame below the grooves 213 serves as the support ribs 212. In the initial frame, the pins 211 in adjacent frame units are connected by the support ribs 212 to support the pins 211 and improve the stability of the pins 211, so as to avoid the collapse or tilt of the pins 211 in subsequent processes such as mounting and plastic encapsulation. In this specific embodiment, the metal frame between adjacent frame units is partially etched to form the groove 213 between adjacent frame units, so that the thickness T2 of the support rib 212 is smaller than the thickness T1 of the pin 211, so as to facilitate sufficient cutting of the support rib 212 before subsequent electrical tests such as strip OS testing.

[0066] In some embodiments, the thickness of the support rib 212 is 1 / 5 to 1 / 2 of the thickness of the pin 211, so that the support rib 212 can be fully cut off during subsequent electrical tests such as strip OS testing, and the support rib 212 can stably support the pin 211.

[0067] Figure 3 is a schematic cross-sectional view of a specific embodiment of the present invention after an initial package body is formed, Figure 4 1 is a schematic diagram of a three-dimensional structure of a specific embodiment of the present invention after the initial package is formed. In order to clearly show the structure of the initial frame and the relative position relationship between the initial frame and the chip, Figure 4 The plastic encapsulation layer is not shown. In some embodiments, Figure 3 and Figure 4 As shown, the specific steps of forming the initial package body located above the initial frame include:

[0068] Mounting a chip 41 on top of the base island 40 in the frame unit;

[0069] Forming a metal wire electrically connecting the chip 41 and the front side of the lead 211;

[0070] A molding layer 30 is formed to continuously mold the base islands 41 in the plurality of frame units and fill the grooves 213 , so as to form the initial package body including the molding layer 30 and the chip 41 .

[0071] For example, if Figure 4 As shown, the initial framework includes a plurality of framework units ( Figure 4 Two of the frame units are shown in the figure), each of the frame units includes the base island 40, a plurality of the pins 211 distributed around the periphery of the base island 40, the pins 211 in two adjacent frame units are connected by the supporting ribs 212, and the base island 40 is connected to the supporting ribs 212 by connecting ribs 42. In one example, the thickness T1 of the pin 211 is equal to the thickness of the connecting rib 42. The chip 41 is mounted above the base island 40 in the frame unit to form a metal wire electrically connecting the chip 41 and the front of the pin 211, and the chip, the metal wire, the base island 41 and the pin 211 are continuously encapsulated with an epoxy resin or other encapsulating material and the encapsulating layer 30 fills the groove 213, as shown Figure 3 shown.

[0072] Figure 5 is a cross-sectional schematic diagram of a specific embodiment of the present invention after the carrier is removed, Figure 6 2 is a schematic cross-sectional view of a specific embodiment of the present invention after cutting the initial frame. In some embodiments, the specific steps of cutting the support ribs 212 in the initial frame and separating adjacent frame units include:

[0073] Remove the carrier plate 20, such as Figure 5 As shown;

[0074] The support ribs 212 in the initial frame and part of the plastic layer 30 in the groove 213 are cut from the back side 215 of the initial frame to form a first cutting groove 60 that penetrates the initial frame and extends into the groove 213. The first cutting groove 60 separates adjacent frame units. Figure 6 shown.

[0075] For example, after peeling off the carrier 20, the back side 215 of the initial frame is exposed, such as Figure 5 As shown. Next, the support ribs 212 are cut from the back side 215 of the initial frame to disconnect the connection between adjacent frame units. In one example, in order to ensure that the support ribs 212 are fully cut so that the connection between the pins 211 in adjacent frame units is disconnected while also disconnecting the connection between adjacent pins 211 in the same frame unit, the support ribs 212 in the initial frame and a portion of the plastic encapsulation layer 30 in the groove 213 are cut from the back side 215 of the initial frame, and the end of the back side of the pin 211 facing the support rib 212 is also cut to fully separate the adjacent pins 211, as shown. Figure 6 shown.

[0076] In the process of separating the adjacent frame units, the thickness of the support rib 212 is less than the thickness of the pin 211. Therefore, when the initial frame is cut from the back side 215 of the initial frame, the support rib 212 can be fully cut off, so that the adjacent frame units in the initial frame can be fully isolated, so that electrical performance tests such as strip OS test can be performed after the support rib 212 is cut. The independent frame unit obtained after cutting the initial frame is used as the lead frame of the package structure. Moreover, in the specific embodiment, the thickness of the support rib 212 is less than the thickness of the pin 211, and the cutting width of the support rib 212 and the part of the plastic layer 30 in the groove 213 in the initial frame is controlled to be greater than the width of the groove 213, and the cutting depth is less than the thickness of the pin 211, so that the edge of the back side of the pin 211 after cutting is stepped, so that a wettable side creeping structure can be formed later, so as to facilitate the subsequent visual inspection and automatic optical inspection of the welding quality of the package structure, and improve the overall mechanical strength of the package structure.

[0077] Figure 7 It is a cross-sectional schematic diagram of a specific embodiment of the present invention in which a solder layer is formed after cutting the initial frame. A solder layer 81 is formed on the back of the pin 211 and the back of the base island 40, and the solder layer 81 extends from the back of the pin to the surface of the step structure.

[0078] Figure 8 is a schematic diagram of the structure of a specific embodiment of the present invention after cutting the initial package body, Fig. 9 Schematic diagram of a packaging structure formed by a specific embodiment of the present invention. Figure 8 and Fig. 9 As shown, the specific steps of cutting the initial package body and separating adjacent package units include:

[0079] The initial package body is cut along the first cutting groove 60 to form a second cutting groove 70 penetrating the initial package body, wherein the second cutting groove 70 separates adjacent package units.

[0080] For example, the initial package body is cut downwards along the first cutting groove 60 to form a second cutting groove 70 that passes through the initial package body. The second cutting groove 70 separates the package units in the initial package body from each other, and the frame unit and the package units connected to the frame unit together constitute the package structure.

[0081] In one example, the width of the second cutting groove 70 is equal to the width of the groove 213, so that after the second cutting groove 70 is formed, the side wall 80 of the pin 211 is exposed (see Figure 8 , Fig. 9 In another example, the width of the second cutting groove 70 is smaller than the width of the groove 213, so that after the second cutting groove 70 is formed, the side wall 80 of the pin 211 is still wrapped by the plastic packaging layer 30 (see Fig.10 ), thereby protecting the side wall 80 of the pin 211 and preventing the pin 211 from being affected by the external environment (for example, preventing the side wall 80 of the pin 211 from being oxidized).

[0082] This specific embodiment also provides a packaging structure, using the packaging structure forming method as described above (see Figure 1-Figure 10 ) is formed. The schematic diagram of the packaging structure formed in this specific embodiment can be seen in Figure 8 , Fig. 9 and Fig.10 .like Figure 1-Figure 10 As shown, the packaging structure includes:

[0083] Key Island 40;

[0084] The pin 211 is located at the periphery of the base island 40, and the back edge of the pin 211 has a step structure;

[0085] A chip 41 is disposed on the base island 40 and electrically connected to the pin 211;

[0086] A plastic packaging layer 30, covering the surface of the chip and the pin 211;

[0087] The solder layer 81 is located on the back side of the pin 211 , and the solder layer 81 extends from the back side of the pin 211 to the surface of the step structure.

[0088] In some embodiments, the sidewalls 80 of the pins 211 are exposed outside the plastic packaging layer 20 , and the solder layer 81 does not cover the sidewalls 80 of the pins.

[0089] In some embodiments, the side wall 80 of the pin 211 is wrapped in the plastic packaging layer 30 to prevent the pin 211 from being affected by the external environment (for example, to prevent the side wall 80 of the pin 211 from being oxidized).

[0090] This specific embodiment also provides a packaging structure testing method, Fig.11 1 is a flow chart of a method for testing a packaging structure in a specific embodiment of the present invention. Fig.11 As shown, the testing method of the packaging structure comprises the following steps:

[0091] Step S91, forming an initial frame, wherein the initial frame includes a plurality of frame units and support ribs located between adjacent frame units, wherein the frame unit includes a base island and pins located at the periphery of the base island, wherein the support ribs connect the pins in two adjacent frame units, and the thickness of the support ribs is less than the thickness of the pins;

[0092] Step S92, forming an initial package body located above the initial frame, wherein the initial package body includes a plurality of package units corresponding one-to-one to the plurality of frame units;

[0093] Step S93, cutting the support ribs in the initial frame to separate adjacent frame units;

[0094] Step S94, performing an electrical performance test on the frame unit and the packaging unit thereon;

[0095] Step S95 , cutting the initial packaging body to separate the adjacent packaging units to form a packaging structure including the frame unit and the packaging units thereon.

[0096] In some embodiments, the electrical performance test is a strip OS test.

[0097] For example, since the thickness of the support rib 212 is less than the thickness of the pin 211, when the initial frame is cut from the back side 215 of the initial frame, it can be ensured that the support rib 212 is fully cut off, so that the adjacent frame units in the initial frame can be fully isolated, so that after the adjacent frame units are separated, the frame unit and the packaging unit above it can be subjected to electrical performance tests such as strip OS testing, which not only improves the accuracy and reliability of the electrical performance test, but also improves the processing efficiency of the packaging structure. After cutting the initial package body and forming a plurality of independent packaging structures, the edge of the back side of the pin is stepped, so that a wettable side creep structure can be formed later, so as to facilitate the subsequent visual inspection and automatic optical inspection of the welding quality of the packaging structure, and improve the overall mechanical strength of the packaging structure.

[0098] The packaging structure and its forming method, as well as the testing method of the packaging structure provided in this specific embodiment, form a plurality of frame units and support ribs located between adjacent frame units, wherein the support ribs connect the pins in two adjacent frame units, and by setting the thickness of the support ribs to be smaller than the thickness of the pins, during the formation of the packaging structure, during the first step of the cutting process of cutting the initial frame, it is ensured that the support ribs can be fully cut off, so that not only a step-shaped wettable side climbing structure can be formed at the edge of the back of the pin, but also the adjacent frame units are fully isolated, so that electrical tests such as strip OS tests can be performed, and the accuracy and reliability of electrical tests such as strip OS tests are improved. Since the thickness of the support ribs is relatively small, the time for cutting the initial frame before performing electrical tests such as strip OS tests is shortened, thereby improving the processing efficiency of the packaging structure.

[0099] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for forming a packaging structure, characterized in that: The steps include: Forming an initial frame, the initial frame comprising a plurality of frame units and support ribs located between adjacent frame units, the frame unit comprising a base island and pins located at the periphery of the base island, the support ribs connecting the pins in two adjacent frame units, the thickness of the support ribs being less than the thickness of the pins; forming an initial package body located above the initial frame, wherein the initial package body comprises a plurality of package units corresponding one-to-one to the plurality of frame units; Cutting the support ribs in the initial frame to separate adjacent frame units; The initial packaging body is cut to separate the adjacent packaging units, so as to form a packaging structure including the frame unit and the packaging units thereon.

2. The method for forming a packaging structure according to claim 1, characterized in that: The specific steps to form the initial framework include: Provide carrier board; forming a metal frame on the carrier, with the back side of the metal frame facing the carrier; The metal frame is patterned to form the initial frame including a plurality of the frame units and grooves between adjacent frame units, and the remaining metal frame below the grooves serves as the supporting ribs.

3. The method for forming a packaging structure according to claim 2, wherein: The thickness of the supporting rib is 1 / 5 to 1 / 2 of the thickness of the pin.

4. The method for forming a packaging structure according to claim 2, wherein: The specific steps of forming the initial package body located above the initial frame include: Mounting a chip on top of the base island in the frame unit; Forming metal wires that electrically connect the chip to the front side of the pins; A molding layer is formed to continuously mold the base islands in the plurality of frame units and fill the grooves, so as to form the initial package body including the molding layer and the chip.

5. The method for forming a packaging structure according to claim 4, characterized in that: The specific steps of cutting the support ribs in the initial frame and separating adjacent frame units include: removing the carrier plate; The support ribs in the initial frame and part of the plastic packaging layer in the groove are cut from the back side of the initial frame to form a first cutting groove that penetrates the initial frame and extends into the groove, wherein the first cutting groove separates adjacent frame units.

6. The method for forming a packaging structure according to claim 5, characterized in that: The width of the first cutting groove is greater than the width of the groove, the depth of the first cutting groove is less than the thickness of the pin, and the edge of the back side of the pin is stepped after cutting.

7. The method for forming a packaging structure according to claim 6, wherein: A solder layer is formed on the back side of the lead and the back side of the base island, and the solder layer extends from the back side of the lead to the surface of the step structure.

8. The method for forming a packaging structure according to claim 4, characterized in that: The specific steps of cutting the initial package body and separating adjacent package units include: The initial package body is cut along the first cutting groove to form a second cutting groove penetrating the initial package body, wherein the second cutting groove separates adjacent package units.

9. The method for forming a packaging structure according to claim 8, characterized in that: The width of the second cutting groove is greater than or equal to the width of the groove.

10. The method for forming a packaging structure according to claim 8, wherein: The width of the second cutting groove is smaller than the width of the groove.

11. A packaging structure formed by the method for forming a packaging structure according to any one of claims 1 to 10, characterized in that: The packaging structure comprises: Key Island; A pin is located at the periphery of the base island, and the back edge of the pin has a step structure; A chip, disposed on the base island and electrically connected to the pin; A plastic sealing layer, covering the chip; The solder layer is located on the back side of the pin, and the solder layer extends from the back side of the pin to the step structure.

12. The packaging structure according to claim 11, characterized in that: The side walls of the pins are covered in the plastic packaging layer.

13. A method for testing a packaging structure, characterized in that: The steps include: Forming an initial frame, the initial frame comprising a plurality of frame units and support ribs located between adjacent frame units, the frame unit comprising a base island and pins located at the periphery of the base island, the support ribs connecting the pins in two adjacent frame units, the thickness of the support ribs being less than the thickness of the pins; forming an initial package body located above the initial frame, wherein the initial package body comprises a plurality of package units corresponding one-to-one to the plurality of frame units; Cutting the support ribs in the initial frame to separate adjacent frame units; Conducting electrical performance tests on the frame unit and the packaging unit thereon; The initial packaging body is cut to separate the adjacent packaging units, so as to form a packaging structure including the frame unit and the packaging units thereon.

14. The method for testing a package structure according to claim 13, characterized in that: The electrical performance test is a strip OS test.

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