Method of manufacturing electronic device

Abstract

The invention discloses a method for manufacturing an electronic device, which comprises the following steps of: providing a substrate structure, the substrate structure is provided with a plurality of grooves, each groove is provided with a first part and a second part, the second part is connected with the first part, and the area of the first part is larger than that of the second part; providing a plurality of electronic units to the plurality of recesses; detecting a position of at least one of the plurality of electronic units to confirm whether the at least one of the plurality of electronic units is disposed inside one of the second portions of the plurality of grooves; and when at least one of the plurality of electronic units is disposed at the abnormal position, disposing the at least one of the plurality of electronic units inside one of the second portions of the plurality of grooves.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic device, and in particular to a method for manufacturing an electronic device comprising the steps of setting an electronic unit and performing abnormality detection and repairing. Background Art

[0002] In current technology, electronic units can be transferred to a substrate in large quantities through mass transfer technologies such as fluid transfer processes, for example, by dripping a liquid containing electronic units onto a substrate to transfer the electronic units in large quantities. However, during fluid transfer, since the electronic units cannot be arranged in an orderly manner, the distribution or electrical connection of the electronic units may be abnormal, thereby affecting the product yield. Summary of the invention

[0003] One of the purposes of the present invention is to provide a method for manufacturing an electronic device to solve the problems encountered in the existing method for manufacturing an electronic device. The groove design of the substrate structure can facilitate the placement of electronic units. In addition, the position of the electronic unit can be detected and anomalies can be repaired during the manufacturing process, which can improve the product yield and / or reliability.

[0004] The present invention provides a method for manufacturing an electronic device, the method comprising: providing a substrate structure, the substrate structure having a plurality of grooves, wherein each groove has a first portion and a second portion, the second portion is connected to the first portion, and the area of ​​the first portion is larger than the area of ​​the second portion; providing a plurality of electronic units to the plurality of grooves; detecting the position of at least one of the plurality of electronic units to confirm whether at least one of the plurality of electronic units is set inside one of the second portions of the plurality of grooves; and when at least one of the plurality of electronic units is set at an abnormal position, setting at least one of the plurality of electronic units inside one of the second portions of the plurality of grooves. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 FIG. 4 is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0006] Figures 2 to 6 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0007] Figure 7 Schematic top views of some embodiments of the present invention in which the electronic unit is disposed inside a groove.

[0008] Figure 8 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0009] Fig. 9FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0010] Fig.10 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0011] Fig.11 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0012] Fig.12 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0013] Fig.13 FIG. 4 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0014] Explanation of reference numerals: 100-substrate structure; 100R-groove; 110-base layer; 120, 130, 500, 510-insulating layer; 200, 200a-electronic unit; 200S2-side surface; 300, 310-electronic unit wet supply module; 302, 312-drip unit; 400, 410-pressurization module; 400L, 410L, L1, L2-length; 410F-forward movement direction; 410P-contact point; 410R-rotation direction; 410V-tangential speed direction; 500M, 510M-material; 500S, 200S1, 510S, 130S-upper surface; 500S1-portion; BU-bump; D1, D2, D3 , D4-distance; DE-coating device; DP-position; DR-detection area; DT-detection device; ED-electronic device; FR-area; h1, h2-thickness; H1, H2, H3, H4-height; LQ-liquid; LS-laser; MA-mask; OP-opening; PL-virtual line; QD1, QD2-single drop volume; R1-first part; R2-second part; R3-third part; S100, S200, S300, S400-steps; ST-grabbing device; TL1, TL2, TL3, TL4-tangent; W1, W2, CW, 302W, W3, W4, 312W-width; X, Y, Z-direction; θ1, θ2, θ3, θ4-angle. DETAILED DESCRIPTION

[0015] The present invention is described in detail below in conjunction with specific embodiments and drawings. It should be noted that, in order to make it easier for readers to understand and the drawings are concise, the multiple drawings in the present invention only depict a portion of the device or structure, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the figure are only for illustration and are not intended to limit the scope of the present invention.

[0016] Certain words are used throughout the specification and claims of the present invention to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. It is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the words "containing" and "including" are open-ended words, so they should be interpreted as "containing but not limited to..." When the terms "including", "comprising" and / or "having" are used in the specification of the present invention, they specify the presence of the features, regions, steps, operations and / or elements, but do not exclude the presence or addition of one or more other features, regions, steps, operations, elements and / or combinations thereof.

[0017] When an element or film layer is referred to as being "on" or "connected to" another element or film layer, it may be directly on or directly connected to the other element or film layer, or there may be intervening elements or film layers between the two. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element or film layer, there may be no intervening elements or film layers between the two.

[0018] Directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", etc., are only used to refer to the directions of the accompanying drawings. Therefore, the directional terms used are used for explanation, not for limiting the present invention.

[0019] The terms "approximately," "equal," "equal," or "same," "substantially," or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0020] The ordinal numbers used in the specification and claims of the present invention, such as "first", "second", etc., are used to modify the elements. They do not imply or represent any previous ordinal numbers of the element (or elements), nor do they represent the order of one element and another element, or the order of the manufacturing method. The use of these ordinal numbers is only used to make the element with a certain name clearly distinguishable from another element with the same name. The same words may not be used in the claims and the specification. Accordingly, the first component in the specification may be the second component in the claims.

[0021] The dimensions of the components or film layers such as thickness, area, width, height, and the comparison between the dimensions described in the present invention can be measured and judged by an optical microscope (OM) or a scanning electron microscope (SEM), for example, the same image or more than one image can be used for measurement and judgment.

[0022] The electronic device described in the present invention can be applied to a display device, a light-emitting device, a backlight device, an antenna device, a sensing device or a splicing device, or a temporary storage substrate for assisting electronic units to be placed at a specific spacing, but is not limited thereto. The electronic device can be a bendable or flexible electronic device. The display device can be a non-self-luminous display device or a self-luminous display device. The antenna device can be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device can be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic device can include electronic components such as passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode can include a light-emitting diode or a photodiode. The light-emitting diode (LED) can include, for example, an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device can be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device can be any combination of the above arrangements, but is not limited thereto. In addition, the shape of the electronic device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes.

[0023] It should be understood that the features of several different embodiments may be replaced, reorganized, or mixed to implement other embodiments without departing from the spirit of the present invention.

[0024] Please refer to Figure 1 and Figures 2 to 6 . Figure 1 FIG. 4 is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 2 to 6 FIG. 1 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Figure 2 The left side of FIG. shows a top view of the process. Figure 2 The upper right of the figure shows a partially enlarged top view of the groove in the top view on the left. Figure 2 The lower right side of the figure shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view, Figure 3 , Figure 4 , Figure 6 The left side of the diagram shows a partial top view of the process. Figure 5 The left side of FIG. 1 shows a top view of the process, and Figures 3 to 6 The right side of the diagram shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view. Figure 1 and Figures 2 to 6 As shown, the manufacturing method of an electronic device according to an embodiment of the present invention may include step S100, step S200, step S300 and step S400, which are described in detail as follows. Figure 2 As shown, a substrate structure 100 is first provided. The substrate structure 100 has a plurality of grooves 100R, wherein each groove 100R has a first portion R1 and a second portion R2, wherein the second portion R2 is connected to the first portion R1, and the area of ​​the first portion R1 is greater than the area of ​​the second portion R2. Figure 2 As shown, the substrate structure 100 may be divided into a plurality of regions FR, one region FR may include a plurality of grooves 100R, wherein the substrate structure 100 may include, for example (but not limited to), 3*3 regions FR, a total of 9 regions FR, and Figure 3 , Figure 4 , Figure 6 The top view on the left in FIG. 1 shows one of the regions FR.

[0025] The substrate structure 100 may include a base layer 110, an insulating layer 120, and an insulating layer 130. The insulating layer 120 is disposed on the base layer 110. The insulating layer 130 is disposed on the insulating layer 120 and at least partially overlaps with the insulating layer 120 in the direction Z. A plurality of grooves 100R are formed in the insulating layer 130, wherein the grooves 100R may penetrate the insulating layer 130 to expose the insulating layer 120 (e.g., Figure 2 ) or does not penetrate the insulating layer 130 and forms a recess in the insulating layer 130 (as shown in Fig.10) without exposing the insulating layer 120. The direction Z described in the present invention may be a top-view direction of the electronic device, that is, a normal direction parallel to the substrate structure 100 or the base layer 110. The plurality of grooves 100R may be arranged in an array, that is, arranged in a plurality of horizontal rows extending along the direction X, and these horizontal rows are arranged side by side along the direction Y, wherein the directions X and Y may be perpendicular to each other and perpendicular to the direction Z at the same time, for example, the direction X may be parallel to the horizontal direction and the direction Y may be perpendicular to the direction X, but not limited thereto. The material of the base layer 110 may include a hard material or a flexible material, and the hard material may include, for example, glass, quartz, sapphire, ceramic, other suitable materials or a combination of the above materials, and the flexible material may include, for example, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other suitable materials or a combination of the above materials, but not limited thereto. The insulating layer 120 and the insulating layer 130 may include an organic material, an inorganic material or other suitable insulating material. The substrate structure 100 may further include a circuit layer (not shown) disposed on the base layer 110. The circuit layer may include, for example, circuits, wires, electronic components and / or bonding pads, but is not limited thereto. In some embodiments, the circuit layer may be disposed between the insulating layer 120 and the insulating layer 130, but is not limited thereto.

[0026] The first portion R1 and the second portion R2 of each groove 100R are distinguished by the shortest connecting line of two relatively obvious turning points of the groove profile (outer shape, such as the obvious inner edge or outer edge observed from a top view), for example, Figure 2 The enlarged partial view of the groove 100R shown in the upper right shows that the groove profile has two obvious turning points, namely point P and point P', and the shortest distance line segment between point P and point P' (represented by the virtual line PL) distinguishes the first portion R1 on the left and the second portion R2 on the right. Figure 2As shown, at the intersection of the contour of the first portion R1 and the contour of the second portion R2, the first portion R1 has a first slope, the second portion R2 has a second slope, and the first slope is different from the second slope, and the above intersection is the obvious turning point P and P'. For example, the tangent TL1 of the contour of the first portion R1 at point P is not parallel to the tangent TL2 of the contour of the second portion R2 at point P, that is, the slopes of the tangent TL1 and the tangent TL2 are different or there is an angle θ1 greater than 0 (for example, greater than 90 degrees) between the two; similarly, the tangent TL3 of the contour of the first portion R1 at point P' is not parallel to the tangent TL4 of the contour of the second portion R2 at point P', that is, the slopes of the tangent TL3 and the tangent TL4 are different or there is an angle θ2 greater than 0 (for example, greater than 90 degrees) between the two. In other words, when the contour tangents on the left and right sides of any point on the contour of the groove 100R have an angle, the any point can be regarded as an obvious turning point of the contour. Alternatively, when the contour of one of the left and right sides of any point on the contour of the groove 100R is located outside the tangent of the other side, then the any point is regarded as an obvious turning point of the contour. According to the present invention, the size of the first portion R1 in each groove 100R is larger than the size of the second portion R2. For example, the projection area of ​​the first portion R1 in the direction Z is larger than the projection area of ​​the second portion R2, or the bottom area of ​​the first portion R1 is larger than the bottom area of ​​the second portion R2, or the maximum width W1 of the first portion R1 in the direction Y is larger than the maximum width W2 of the second portion R2, or the maximum width (not indicated) of the first portion R1 in the direction X is larger than the maximum width (not indicated) of the second portion R2.

[0027] After step S100, step S200 may be performed. Figures 2 to 4 As shown, a plurality of electronic units 200 are provided to a plurality of grooves 100R. The electronic unit 200 may be a semiconductor unit, for example, including a chip, a light emitting diode, a micro light emitting diode, a transistor, a resistor, a capacitor, a varactor diode, etc. The shape of the electronic unit 200 may be a quadrilateral (for example, a square or a rectangle), a circle, or an ellipse. According to an embodiment of the present invention, since the first portion R1 of each groove 100R has a larger size, each electronic unit 200 can be easily entered into the first portion R1 of a groove 100R, that is, the electronic unit 200 can be distributed to a rough position first, and the electronic unit 200 can be allowed to move inside the first portion R1, and the second portion R2 of each groove 100R is used to effectively position or fix the electronic unit 200. The "interior" described in the present invention can be said to be the area, range or space corresponding to the structure. In some embodiments, the contour shape of the second portion R2 of the groove 100R may correspond to the shape of the electronic unit 200. For example, the electronic unit 200 may be circular, and the contour of the second portion R2 is a part of a circular pattern (such as Figure 7as shown in Example (I)), or the electronic unit 200 may be quadrilateral and the contour of the second part R2 is a part of a quadrilateral pattern (as Figure 8 shown in the top view), but not limited thereto. In some other embodiments, the contour shape of the second part R2 of the groove 100R may not correspond to the shape of the electronic unit 200. For example, the electronic unit 200 is quadrilateral and the second part R2 is a part of a circular pattern (as Figure 3 shown in the top view). Additionally, the first part R1 and the second part R2 may also be composed of different shapes. For example, the first part R1 is similar to a circle and the second part R2 is similar to a rectangle, but still the size of the first part R1 is greater than that of the second part R2.

[0028] Each electronic unit 200 may have a maximum distance D1 in its own size. For example, when the shape of the electronic unit 200 is quadrilateral, the maximum distance D1 may be the diagonal distance (as Figure 4 shown in the top view), when the shape of the electronic unit 200 is circular, the maximum distance D1 may be the diameter (as Figure 7 shown in Example (I)), and when the shape of the electronic unit 200 is oval, the maximum distance D1 may be the major axis distance (not shown in the figure). The size of the above-mentioned electronic unit 200 is taken as its top view area. For example, the projected area of the electronic unit 200 on the substrate structure 100 in the direction Z can be regarded as its size. According to the embodiments of the present invention, the maximum width W1 of the first part R1 of the groove 100R is greater than 1.5 times the maximum distance D1 of the electronic unit 200, so that the electronic unit 200 can be easily set inside the first part R1, and the maximum width W1 of the first part R1 is less than 2 times the maximum distance D1 of the electronic unit 200, so that only one electronic unit 200 can be accommodated in the first part R1, and there will be no situation where two or more electronic units 200 are set inside the first part R1, that is, D1*1.5 < W1 < D1*2. In addition, each groove 100R's second part R2 may have a maximum distance D2 in the direction X (as Figure 2 shown), and this maximum distance D2 is greater than one-third of the maximum distance D1 of the electronic unit 200, so that the electronic unit 200 can be accommodated inside the second part R2 in the direction X to a certain depth, and the maximum distance D2 of the second part R2 is less than the maximum distance D1 of the electronic unit 200 to limit the offset range of the electronic unit 200, that is, D1*1 / 3 < D2 < D1. According to the corresponding shape design of the second part R2, the electronic unit 200 can be more effectively positioned or fixed. For example, a rectangular electronic unit 200 can be positioned in the rectangular second part R2, or the second part R2 is in Figure 2The corresponding range shown in the lower right cross-sectional view may have a relatively sunken topography, or the above-mentioned maximum distance D2 may be designed to be smaller and greater than one sixth of the above-mentioned maximum distance D1 (i.e., D2>D1*1 / 6), so as to save more space and make the array spacing of the electronic units 200 smaller, so that the electronic device can achieve a higher resolution.

[0029] In some embodiments, multiple electronic units 200 can be provided to multiple grooves 100R at the same time by a fluid mass transfer process, such as (but not limited to) by printing inkjet method. In addition, magnetic fluid transfer is also an option. The following uses the printing inkjet method as an example. Figure 2 As shown, the step S200 of providing a plurality of electronic units 200 to a plurality of grooves 100R may be performed by an electronic unit wet supply module 300 (which may be referred to as a first electronic unit wet supply module), and the electronic unit wet supply module 300 may include a nozzle unit 302 for providing the liquid LQ containing the electronic units 200 to the substrate structure 100. The nozzle unit size of the nozzle unit 302 is, for example, the width 302W of the outlet of the nozzle unit 302 in the direction X or the area of ​​its outlet, and the droplet size of the liquid LQ dropped by the nozzle unit 302 at a single time may be referred to as a single droplet size QD1. In some embodiments, the nozzle unit size (e.g., width 302W) of the nozzle unit 302 and the single droplet size QD1 may correspond to a plurality of grooves 100R of the substrate structure 100, for example (but not limited to) corresponding to Figure 2 In other words, a single drop amount QD1 of the dripper unit 302 of the electronic unit wet supply module 300 can provide a plurality of electronic units 200 to a region FR of the substrate structure 100. By repeating the above steps or performing the above steps by a plurality of dripper units 302, a plurality of electronic units 200 can be provided to a plurality of regions FR of the substrate structure 100 in sequence or simultaneously.

[0030] In some embodiments, Figure 3 and Figure 4 As shown, the step of providing the plurality of electronic units 200 to the plurality of recesses 100R may also be performed by a pressurizing module 400 (which may be referred to as a second pressurizing module), wherein Figure 3 shows the state before the pressurizing module 400 moves, and Figure 4 4 shows the state after the pressurizing module 400 moves. Figure 3As shown in FIG. 1 , after the liquid LQ is dripped, the electronic unit 200 in the liquid LQ may enter the first portion R1 of the plurality of grooves 100R due to gravity, but some electronic units 200 may not enter the grooves 100R, so that there are no electronic units 200 in some grooves 100R. At this time, the position of the electronic unit 200 in the groove 100R is not fixed and the electronic unit 200 is movable. Then, as shown in FIG. Figure 3 and Figure 4 As shown, the pressurizing module 400 can be used to move and pressurize the electronic unit 200 along a direction parallel to the surface of the substrate structure 100, so as to move the electronic unit 200 and place it inside the second portion R2 of the groove 100R. For example, the pressurizing module 400 can move and pressurize the electronic unit 200 along the direction X, so as to move the electronic unit 200 located inside the first portion R1 of the groove 100R to the second portion R2 of the groove 100R along the direction X, and the pressurizing module 400 can also simultaneously remove the electronic unit 200 that is not located inside the groove 100R or the redundant electronic unit 200, or the pressurizing module 400 can also push the electronic unit 200 located outside the groove 100R into the vacant groove 100R, and further pressurize it to the inside of the second portion R2 of the groove 100R. Figure 3 As shown, the size of the pressurizing module 400 may correspond to a region FR of the substrate structure 100. For example, the length 400L of the pressurizing module 400 in the direction Y may be similar to or slightly greater than the length of the region FR, but is not limited thereto. In other embodiments, the size of the pressurizing module 400 may also correspond to the sum of the lengths of several regions FR or the entire substrate structure 100. In some embodiments, when the pressurizing module 400 moves, the surface of the pressurizing module 400 may have a mesh fiber design or a nano-microstructure, so that the pressurizing module 400 can also absorb the liquid LQ during the pushing process, or the liquid LQ can be evaporated by heating. The above two steps can also be implemented together to remove the liquid LQ on the substrate structure 100.

[0031] After step S200, step S300 may be performed. Figure 5As shown, the position of at least one of the multiple electronic units 200 is detected to confirm whether at least one of the multiple electronic units 200 is set inside one of the second parts R2 of the multiple grooves 100R. Specifically, the image of the position of at least one of the electronic units 200 or the image of at least one region FR can be captured by the detection device DT to confirm whether the electronic unit 200 in the image is set inside the second part R2 of the groove 100R, that is, whether it is set in the correct position. The detection device DT may, for example, include a camera, an automated optical inspection (AOI) system, a charge coupled device (CCD) or other suitable detection device. In some embodiments, each region FR can be detected by the detection device DT, and the positions of each obtained image can be compared one by one. In other embodiments, multiple regions FR can be detected by the detection device DT, and the obtained multiple images can be combined into a large image corresponding to the substrate structure 100, and coordinates can be set for each position on the image to perform overall position comparison, but it is not limited to this.

[0032] After step S300, step S400 may be performed. Figure 6 As shown, when at least one (i.e., one or more) of the plurality of electronic units 200 is set at an abnormal position, at least one (i.e., one or more) of the plurality of electronic units 200 is set inside one or more of the second parts R2 of the plurality of grooves 100R. That is, if it is found after detection that the electronic unit 200 is set at an abnormal position or is not set at a correct position, the electronic unit 200 can be set inside the second part R2 of the groove 100R, for example, by moving the electronic unit 200. The "correct position" and "abnormal position" in the present invention can refer to the following. Figure 7 The embodiment shown, Figure 7 Schematic top views of some embodiments of the present invention in which an electronic unit is disposed inside a groove, which may be images of the outline of the electronic unit 200 and the outline of the groove 100R captured by a detection device DT. Figure 7 Example (I) shows a situation where the electronic unit 200 is set in the correct position, that is, a certain proportion of the electronic unit 200 is set inside the second part R2 of the groove 100R, for example (but not limited to) a proportion range of one half to one third of the electronic unit 200 is set inside the second part R2, which can indicate that the electronic unit 200 is set in the correct position. Figure 7 Example (II), Example (III) and Example (IV) show the case where the electronic unit 200 is set in an abnormal position. Figure 7In the example (II), the electronic unit 200 does not enter the interior of the second portion R2 of the groove 100R at all, which means that the electronic unit 200 is set in an abnormal position. Figure 7 In example (III), the overlapping area between the electronic unit 200 and the second portion R2 of the groove 100R can be compared. When the overlapping area between the electronic unit 200 and the second portion R2 is less than half of the area of ​​the second portion R2, it indicates that the electronic unit 200 is set in an abnormal position. Figure 7 In example (IV), in direction X, a virtual line PL between the first portion R1 and the second portion R2 may have a maximum distance D3 from the outline of the second portion R2, and a minimum distance D4 may be provided between the outline of the electronic unit 200 and the outline of the second portion R2. The distance D3 and the distance D4 may be compared, and when the distance D4 is greater than the distance D3, it indicates that the electronic unit 200 is set in an abnormal position.

[0033] In some embodiments, Figure 6 As shown, the step S400 of setting at least one of the plurality of electronic units 200 can be performed by a pressurizing module 410 (which can be referred to as a first pressurizing module). Specifically, the pressurizing module 410 can move along the direction X and pressurize the electronic unit 200 set at the abnormal position to move the electronic unit 200 along the direction X to the second portion R2 of the groove 100R. The size of the pressurizing module 410 can correspond to the range of a groove 100R, for example, the length 410L of the pressurizing module 410 in the direction Y can be similar to or slightly larger than the length of a groove 100R, and / or the length 410L can be smaller than the width CW of the center line of the two grooves 100R, so the length 410L of the pressurizing module 410 can be smaller than the length 400L of the pressurizing module 400. In some embodiments, the pressurizing module 410 needs to remain non-rotating during the pushing process or the rotation direction 410R of the pressurizing module 410 is different from the forward moving direction 410F of the pressurizing module 410. For example, the forward movement direction 410F of the pressurizing module 410 may be the same as the direction X, and the rotation direction 410R of the pressurizing module 410 may be clockwise, so that the tangential velocity direction 410V of the contact point 410P between the pressurizing module 410 and the electronic unit 200 may be opposite to the direction X. That is, when the rotation direction 410R of the pressurizing module 410 is compared with the forward direction 410F in the same dimension (for example, in a direction parallel to the direction X), the rotation direction 410R is different from the forward direction 410F. In some embodiments, the step S400 of disposing at least one of the plurality of electronic units 200 may be performed by a pick-and-place process, that is, by Figure 8 The illustrated grasping device ST moves the electronic unit 200 disposed at the abnormal position to the inside of the second portion R2 of the groove 100R, but is not limited thereto.

[0034] After performing step S300 to detect the position of at least one of the plurality of electronic units 200, if it is found that there is no electronic unit 200 disposed inside any one or more grooves 100R on the substrate structure 100, step S500 may be performed: another one or more electronic units 200 may be disposed inside the second portion R2 of any one or more grooves 100R. In other words, another one or more electronic units 200 may be added to the grooves 100R lacking electronic units 200 to repair the abnormality. Please refer to Figure 8 , which is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Figure 8 The left side of FIG. 1 shows a partial top view of the process, which corresponds to one region FR of the substrate structure 100. Figure 8 The right side of the figure shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view. Figure 8 As shown, the step S500 of setting another electronic unit 200 inside the second portion R2 of one of the plurality of grooves 100R can be performed by a pick-and-place process, that is, another electronic unit 200 is supplementarily set inside the second portion R2 of the groove 100R by a gripping device ST. In this method, in order to make the repair more smooth, a smaller electronic unit 200 can be selected for repair. For example, the size of the repaired electronic unit can be 60% to 90% of the size of the original electronic unit. For example, the electronic unit 200 can be repaired by a detection device DT (such as Figure 5 The electronic unit 200 is confirmed to be in a position to be supplemented with the electronic unit 200, and then the electronic unit 200 is aligned with the second portion R2 of the groove 100R by the grasping device ST and is set inside the second portion R2. In some embodiments, when the grasping device ST is aligned with the second portion R2 to set the electronic unit 200, the grasping device ST may first approach the substrate structure 100, and then the electronic unit 200 on the grasping device ST may be separated and dropped into the second portion R2 by laser, but the present invention is not limited thereto. For example, the laser may be used to heat the adhesive or sacrificial layer between the grasping device ST and the electronic unit 200 so as to lose its viscosity, thereby separating the electronic unit 200.

[0035] In some embodiments, the step S500 of placing another electronic unit 200 in the second portion of one of the plurality of grooves 100R may include: first, providing another electronic unit 200 in another of the first portions R1 of the plurality of grooves 100R through a pick-and-place process, that is, by Figure 8 The grabbing device ST shown in the figure adds another electronic unit 200 to the interior of the first part R1. For example, the electronic unit 200 can be firstly detected by the detection device DT (such as Figure 5As shown in the figure, the position of the electronic unit 200 to be supplemented is confirmed, and then the electronic unit 200 is set inside the first part R1 of the groove 100R by the grasping device ST. In some embodiments, when the grasping device ST aligns the electronic unit 200 with the first part R1, the grasping device ST can first approach the substrate structure 100, and then use the laser to make the electronic unit 200 on the grasping device ST detach and fall into the first part R1, but it is not limited to this. After providing another electronic unit 200 to the inside of the first part R1, it can be set inside the first part R1 by the grasping device ST. Figure 6 The pressurizing module 410 shown is used to move the other electronic unit 200 from the first portion R1 to the inside of the second portion R2. The pressurizing module 410 can move along the direction X and pressurize the electronic unit 200 to move the electronic unit 200 located inside the first portion R1 of the groove 100R along the direction X to the inside of the second portion R2 of the groove 100R.

[0036] In some embodiments, Figure 8 As shown, the electronic unit 200 may be a quadrilateral and the contour of the second portion R2 of the groove 100R may be a portion of a quadrilateral pattern, but is not limited thereto. The side of the electronic unit 200 corresponding to the side entering the second portion R2 may have a length L1 in the direction Y, and the second portion R2 of the groove 100R may have a length L2 in the direction Y, and the length L2 may be greater than or approximately equal to the length L1. For example, when the electronic unit 200 is a square, the length L2 of the second portion R2 may be equal to the length L1 of the side corresponding to the side entering the second portion R2, and when the electronic unit 200 is a rectangle, the length L2 of the second portion R2 may be equal to the length L1 of the long side or short side corresponding to the side entering the second portion R2, so that the electronic unit 200 can enter the interior of the second portion R2 in a directionally manner.

[0037] Please refer to Fig. 9 , Fig. 9 FIG. 1 is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Fig. 9 The left side of FIG. 1 shows a partial top view of the process, which corresponds to one region FR of the substrate structure 100. Fig. 9 The right side of the figure shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view. Fig. 9 In the embodiment shown, after performing step S300, if it is detected that there is no electronic unit 200 disposed inside the recess 100R on the substrate structure 100, the position of the recess 100R without the electronic unit 200 can be obtained according to the detection result, and then another electronic unit 200 is supplemented and disposed inside the second portion R2 of the recess 100R through a pick-and-place process and a laser process in step S500 to repair the abnormality. Fig. 9As shown, the gripping device ST may include a bump BU for gripping the electronic unit 200, wherein the width W3 of the bump BU in the direction Y is smaller than the maximum width W2 of the second portion R2 of the groove 100R in the direction Y. When the gripping device ST grips the electronic unit 200, the bump BU may enable the electronic unit 200 to be closer to the substrate structure 100, so that the electronic unit 200 may be transferred to the substrate structure 100 more accurately, and the width limit of the bump BU may prevent the electronic unit 200 from touching the substrate structure during the transfer. The surface of the gripping device ST may also selectively include a mask MA, and according to the detection results, a plurality of openings OP may be formed on the side of the mask MA opposite to the substrate structure 100 corresponding to the position where the electronic unit 200 needs to be supplemented, wherein the width W4 of the opening OP in the direction Y is greater than the width W3 of the bump BU in the direction Y. For example, the opening OP may be formed by a process such as photoresist or micro-electromechanical, but is not limited thereto. The laser LS can cause the electronic unit 200 on the bump BU to detach through the opening OP and drop into the second portion R2, and the width of the opening OP can ensure that the laser LS can cause the electronic unit 200 on the bump BU to detach. In some embodiments, the laser process can be performed in a scanning manner, and only the electronic unit 200 on the bump BU corresponding to the opening OP will be detached by the laser LS, but the present invention is not limited thereto.

[0038] In some embodiments, the electronic units 200 on the grasping device ST may be arranged in an array. After performing step S300, if it is detected that there is a groove 100R on the substrate structure 100 where no electronic unit 200 is set, the position of the groove 100R where no electronic unit 200 is set may be mapped to the position of the electronic unit 200 on the grasping device ST based on the detection result, and then the laser may be used to simultaneously detach the electronic units 200 at the corresponding positions on the grasping device ST and drop them into the groove 100R to repair the abnormality on a large scale, but this is not limited to this.

[0039] In some embodiments, Fig. 9 As shown, the groove 100R may include a first portion R1, a second portion R2 and a third portion R3, but is not limited thereto. The first portion R1 and the third portion R3 are located on opposite sides of the second portion R2, and the size of the first portion R1 is greater than the size of the second portion R2, and the size of the second portion R2 is greater than the size of the third portion R3. The third portion R3 of the groove 100R is distinguished from the second portion R2 by two opposite obvious turning points on the contour of the groove 100R. The third portion R3 of the groove 100R can be used to accommodate impurities, such as the liquid LQ (such as Figure 2 Impurities in the third portion R3 may be guided into the interior of the third portion R3.

[0040] Please refer to Fig.10 , which is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Fig.10 The left side of FIG. 1 shows a top view of the process, which corresponds to one region FR of the substrate structure 100. Fig.10 The right side of the figure shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view. Fig.10 In the illustrated embodiment, step S500 of setting another electronic unit 200 can be performed by an electronic unit wet supply module (electronic unit wet supplymodule) 310 (which may be referred to as a second electronic unit wet supply module). The electronic unit wet supply module 310 may include a dripper unit 312 for providing the liquid LQ containing the electronic unit 200 to the substrate structure 100. The dripper unit size of the dripper unit 312 is, for example, the width 312W of the outlet of the dripper unit 312 in the direction X or the area of ​​its outlet, and the droplet size of the liquid LQ dripped out by the dripper unit 312 at a single time may be referred to as a single drop volume QD2. The dripper unit size (e.g., width 312W) of the dripper unit 312 and the single drop volume QD2 may correspond to a groove 100R of the substrate structure 100, so that the electronic unit wet supply module 310 will not affect the position of other good products around it when performing abnormal repairs. That is, the electronic unit wet supply module 300 (shown in Figure 2 ) is larger than the dripper unit size (e.g., width 302W) of the electronic unit wet supply module 310, or the single drop volume QD1 of the electronic unit wet supply module 300 is larger than the single drop volume QD2 of the electronic unit wet supply module 310. The single drop volume QD2 of the electronic unit wet supply module 310 and the volume of the electronic unit 200 contained therein may be smaller than the volume of one groove 100R to reduce the probability of the liquid LQ overflowing from the groove 100R. In some embodiments, another electronic unit 200 may be provided to the interior of the first portion R1 by the electronic unit wet supply module 310, and then the ... Figure 6 The pressurizing module 410 is shown to move the other electronic unit 200 from the first portion R1 to the inside of the second portion R2 , but the present invention is not limited thereto.

[0041] In some embodiments, Fig.10 As shown, the insulating layer 130 has a plurality of grooves 100R, and the grooves 100R may not penetrate the insulating layer 130 and form depressions in the insulating layer 130 without exposing the insulating layer 120 . The provided electronic unit 200 may be disposed on a portion of the insulating layer 130 , but is not limited thereto.

[0042] After the abnormality is repaired by the above-mentioned embodiment, the detection device DT can be used to perform another detection. For example, the entire surface of the substrate structure 100 can be detected, or only the repaired position can be detected, or a region centered on the repaired position can be detected. Fig.11 , which is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention. Fig.11 In the embodiment shown, the electronic unit 200a (indicated by the slashed bottom) corresponds to the position to be repaired by the above-mentioned embodiment. In order to ensure whether there are any surrounding conditions that affect the repair position during the repair process, the detection area DR centered on each electronic unit 200a can be detected by the detection device DT. One detection area DR may include the setting positions of several electronic units 200. When the electronic unit 200a is located at the edge of the substrate structure 100, the detection area DR will be circled inside the substrate structure 100, such as Fig.11 After testing each of the test areas DR, it may be found that there are abnormalities in the positions DP (indicated by a black background) that need to be repaired, and these positions DP may be repaired by any of the repair methods shown in step S400 or step S500 in the above embodiment to repair the abnormalities. By repeating the above actions, the yield of the entire surface of the electronic unit 200 set on the substrate structure 100 can reach a certain yield rate or above, for example, 99.99%.

[0043] Please refer to Fig.12 , which is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Fig.12 Flow (i) and flow (ii) are shown. The left side of flow (i) and flow (ii) respectively shows a partial top view of the process, which corresponds to one of the regions FR of the substrate structure 100. The right side of flow (i) and flow (ii) respectively shows a partial cross-sectional view of the process corresponding to the section line A-A' in the left top view. After completing the repair steps of the electronic unit 200 (e.g., step S400 and / or step S500), as shown in FIG. Fig.12 As shown in the process (i) of the present invention, an insulating layer 500 (which may be referred to as a first insulating layer) may be provided inside at least one of the first portions R1 of the plurality of grooves 100R. For example, the material 500M of the insulating layer 500 may be provided to the first portion R1 of the groove 100R by the coating device DE, so that the material 500M of the insulating layer 500 may flow to the second portion R2 by a flow manner, thereby reducing the impact of the yield rate caused by the coating on the pushing, so as to form the insulating layer 500. Fig.12In the embodiment shown in the process (i) of the embodiment, the insulating layer 500 is disposed inside the groove 100R, wherein the height of the portion of the upper surface 500S of the insulating layer 500 close to the electronic unit 200 may be smaller than the height of the portion thereof away from the electronic unit 200, and the insulating layer 500 does not cover the upper surface 200S1 of the electronic unit 200. Specifically, the height H1 of a portion 500S1 of the upper surface 500S of the insulating layer 500 may be smaller than the height H2 of the upper surface 200S1 of at least one of the plurality of electronic units 200, and the portion 500S1 of the upper surface 500S of the insulating layer 500 may contact the side surface 200S2 of the electronic unit 200. The height H1 and the height H2 may be measured from the same reference plane, for example, the height H1 may be measured from the upper surface of the insulating layer 120 along a direction opposite to the direction Z to the portion 500S1 of the upper surface 500S, and the height H2 may be measured from the upper surface of the insulating layer 120 along a direction opposite to the direction Z to the upper surface 200S1. Through the structural design of the insulating layer 500 , the electronic unit 200 can be maintained inside the second portion R2 , or the electronic unit 200 can be in contact with the side wall of the insulating layer 130 corresponding to the second portion R2 .

[0044] In some embodiments, Fig.12 As shown in the process (i) of the embodiment, the insulating layer 500 may be disposed only inside the first portion R1 of the groove 100R but not inside the second portion R2 of the groove 100R. In other embodiments, the insulating layer 500 may also be disposed inside the second portion R2 of the groove 100R but not cover the upper surface 200S1 of the electronic unit 200. The material 500M of the insulating layer 500 may include an organic material, such as perfluoroalkoxy alkanes (PFA), resin or other suitable materials. In some embodiments, the electronic unit 200 is a light emitting unit, such as (but not limited to) a light emitting diode (LED). For optical considerations, the material 500M of the insulating layer 500 may include a light shielding material to reduce the risk of light leakage. The light shielding material is, for example, an opaque material or a material with a light transmittance of less than 40%. In order to achieve a better contrast, the light shielding material may also be selected from a material whose light transmittance is less than 20% or less than 10% by adjusting the material concentration or increasing the material film thickness, and a material with a light transmittance of less than 5% may be selected. The light shielding material may include black resin, light absorbing nano metal, organic material mixed with chromium (Cr) or other suitable materials, but is not limited thereto. The optical quality can be improved by the design of the above material selection.

[0045] The "light transmittance of a material" described in the present invention can be obtained by selecting an area with a specific material and an area without the specific material, measuring the light transmittance of the two areas respectively, and then dividing the two. For example, the first area has an insulating layer 500, an insulating layer 120, and a base layer 110, and the light transmittance of the first area is measured to be 56%, and the second area has an insulating layer 120 and a base layer 110, and the light transmittance of the second area is measured to be 80%. Dividing the light transmittance of the first area by the light transmittance of the second area, the light transmittance of the insulating layer 500 is 70%, that is, 56 / 80=70%. The light transmittance can represent the percentage of the luminous flux after passing through an object or a film layer to its incident luminous flux. For example, the light source can be regarded as 100%, and the light transmittance represents the ratio obtained by attenuation after passing through an object or a film layer.

[0046] exist Fig.12 After process (i), Fig.12 As shown in the process (i) of FIG. 1 , an insulating layer 510 (which may be referred to as a second insulating layer) may be provided on the insulating layer 500 and the plurality of electronic units 200. For example, a material 510M of the insulating layer 510 may be coated on the insulating layer 500 by a coating device DE to form the insulating layer 510, thereby obtaining the manufactured electronic device. The completed insulating layer 510 may refer to FIG. Fig.13 The insulating layer 510 is shown. The insulating layer 510 may cover and overlap at least a portion of the insulating layer 500 and at least a portion of each electronic unit 200. For example, the height H3 of the upper surface 510S of the insulating layer 510 may be greater than the height H4 of the upper surface 130S of the insulating layer 130, and the insulating layer 510 may be a flat layer, but is not limited thereto. The height H3 and the height H4 may be measured from the same reference plane, for example, the height H3 may be measured from the upper surface of the insulating layer 120 along a direction opposite to the direction Z to the upper surface 510S, and the height H4 may be measured from the upper surface of the insulating layer 120 along a direction opposite to the direction Z to the upper surface 130S. The material of the insulating layer 510 may include a transparent material to reduce the impact on the actuation of the electronic unit 200, wherein the transparent material may include a resin, a polymer or other suitable material, but is not limited thereto. For example, the light transmittance of the transparent material is at least 50%. In order to achieve better light transmission efficiency, the transparent material can also be selected from materials with a light transmittance of more than 70%, and can even be selected from materials with a light transmittance of more than 80% by reducing the thickness of the film layer.

[0047] Please refer to Fig.13 , which is a partial process diagram of a method for manufacturing an electronic device according to an embodiment of the present invention, wherein Fig.13 The left side of FIG. 1 shows a partial top view of the process, which corresponds to one region FR of the substrate structure 100. Fig.13The right side of the figure shows a partial cross-sectional schematic diagram of the process corresponding to the section line AA' in the left top view. Fig.13 As shown, the step of providing the insulating layer 510 is completed (as shown in FIG. Fig.12 After the process (ii) is completed, the manufactured electronic device ED can be obtained, wherein the height H3 of the upper surface 510S of the formed insulating layer 510 can be greater than the height H4 of the upper surface 130S of the insulating layer 130, and the insulating layer 510 can be used as a flat layer. According to the desired structural design of the electronic device ED, other film layers, circuits, wires, electronic components and / or bonding pads and other component structures can also be formed on the insulating layer 510.

[0048] In some embodiments, Fig.13 As shown, the first portion R1 and the second portion R2 of the groove 100R may be respectively stamped by different molds and / or pressures, but the present invention is not limited thereto. For example, the position corresponding to the second portion R2 may be stamped using a larger pressure, and a more concave portion may be formed on the insulating layer 120. That is, in the direction Z, the portion of the insulating layer 120 corresponding to the first portion R1 of the groove 100R may have a thickness h1, and the portion of the insulating layer 120 corresponding to the second portion R1 of the groove 100R may have a thickness h2, and the thickness h2 may be less than the thickness h1, so that the electronic unit 200 may be more easily disposed inside the second portion R2.

[0049] In some embodiments, Fig.13 As shown, the sidewalls of the first portion R1 and the second portion R2 of the insulating layer 130 corresponding to the groove 100R may have an asymmetric angle design. For example, an angle θ3 may be provided between the sidewall of the insulating layer 130 corresponding to the first portion R1 and the upper surface of the insulating layer 120, and an angle θ4 may be provided between the sidewall of the insulating layer 130 corresponding to the second portion R2 and the upper surface of the insulating layer 120, and the angle θ3 may be smaller than the angle θ4. Since the electronic unit 200 can be moved from the sidewall of the insulating layer 130 corresponding to the first portion R1 to the inside of the groove 100R by the pressurizing module, by designing the angle θ3 to be smaller and the corresponding sidewall to have a gentler slope, the electronic unit 200 can be less susceptible to damage.

[0050] In summary, the method for manufacturing an electronic device according to the embodiment of the present invention can facilitate the placement of electronic units through the groove design of the substrate structure. In addition, the position of the electronic unit can be detected and anomalies can be repaired during the manufacturing process, which can improve product yield and / or reliability.

[0051] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing an electronic device, characterized in that: include: A substrate structure is provided, the substrate structure having a plurality of grooves, wherein each of the grooves has a first portion and a second portion, the second portion is connected to the first portion, and the area of ​​the first portion is larger than the area of ​​the second portion; providing a plurality of electronic units to the plurality of recesses; detecting a position of at least one of the plurality of electronic units to confirm whether the at least one of the plurality of electronic units is disposed inside one of the plurality of second portions of the plurality of grooves; as well as When the at least one of the plurality of electronic units is disposed at the abnormal position, the at least one of the plurality of electronic units is disposed inside the one of the plurality of second portions of the plurality of grooves.

2. The method according to claim 1, characterized in that The method also includes disposing another electronic unit inside another one of the second portions of the grooves.

3. The method according to claim 2, characterized in that The step of disposing the other electronic unit inside the other one of the second portions of the grooves is performed by a pick-and-place process.

4. The method according to claim 2, characterized in that The step of disposing the other electronic unit inside the other one of the second portions of the grooves comprises: Providing the other electronic unit to the interior of another one of the first portions of the plurality of recesses through a pick-and-place process; and The other electronic unit is moved from the other one of the first portions of the plurality of grooves to the inside of the other one of the second portions of the plurality of grooves by a pressurizing module.

5. The method according to claim 2, characterized in that The step of providing the multiple electronic units to the multiple grooves is performed through a first electronic unit wet supply module, and the step of setting the other electronic unit is performed through a second electronic unit wet supply module, and the dripper unit size of the first electronic unit wet supply module is larger than the dripper unit size of the second electronic unit wet supply module.

6. The method according to claim 2, characterized in that The step of providing the multiple electronic units to the multiple grooves is performed through a first electronic unit wet supply module, and the step of setting the other electronic unit is performed through a second electronic unit wet supply module, and the single drop volume of the first electronic unit wet supply module is greater than the single drop volume of the second electronic unit wet supply module.

7. The method according to claim 1, characterized in that The step of disposing the at least one of the plurality of electronic units is performed by a pick-and-place process.

8. The method according to claim 1, characterized in that The step of disposing at least one of the plurality of electronic units is performed by a first pressurizing module.

9. The method according to claim 8, characterized in that The step of providing the plurality of electronic units to the plurality of grooves is performed by a second pressurizing module, and the length of the first pressurizing module is smaller than the length of the second pressurizing module.

10. The method according to claim 8, characterized in that The rotation direction of the first pressurizing module is different from the forward movement direction of the first pressurizing module.

11. The method according to claim 1, characterized in that The method also includes providing a first insulating layer inside at least one of the plurality of first portions of the plurality of grooves.

12. The method according to claim 11, characterized in that A portion of an upper surface of the first insulating layer has a height smaller than a height of an upper surface of one of the plurality of electronic units, and the portion of the upper surface of the first insulating layer contacts the one of the plurality of electronic units.

13. The method according to claim 11, characterized in that The material of the first insulating layer includes a light shielding material.

14. The method according to claim 11, characterized in that The method also includes providing a second insulating layer on the first insulating layer and the plurality of electronic units.

15. The method according to claim 14, characterized in that The material of the second insulating layer includes a transparent material.

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