Semiconductor chip packaging mechanism and process

Abstract

The invention discloses a semiconductor chip packaging mechanism and process, and particularly relates to the technical field of semiconductor chips, the semiconductor chip packaging mechanism comprises a mechanism base, a material guiding mechanism is fixedly mounted at the top end of the mechanism base, a transmission mechanism is arranged at the tail end of the material guiding mechanism, and a curing mechanism is arranged on the side, close to the transmission mechanism, of the material guiding mechanism; a top sealing device is arranged on the side, close to the curing mechanism, of the material guiding mechanism. The material guiding mechanism comprises two sets of material guiding side frames which are symmetrically distributed, and the material guiding side frames are fixedly installed at the top end of the mechanism base. The material guiding mechanism is arranged and used in cooperation with the top sealing device, a plurality of semiconductor chips can be automatically conveyed, and therefore automatic packaging processing can be conveniently conducted on the semiconductor chips, and the packaging efficiency is improved while packaging is conducted. According to the invention, the pins of the semiconductor chip substrate are subjected to synchronous shaping processing, and subsequent shaping of the pins is not needed, so that the overall processing efficiency of the semiconductor chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and in particular to a semiconductor chip packaging mechanism and process. Background Art

[0002] Semiconductor chips are small electronic devices made of semiconductor materials that can perform various electronic functions. They are the core components of modern electronic devices and are widely used in many fields such as computers, smart phones, home appliances, automobiles, and communication equipment. Semiconductor chips need to be packaged during production so that they can be used in electronic devices. The package not only provides physical protection, but also has functions such as electrical connection, thermal management, and heat dissipation. The traditional semiconductor chip packaging process is to place the welded chip in a mold and fill it with packaging material by injection molding, followed by curing or heat treatment. Afterwards, the pins need to be shaped. The process is relatively complicated, which affects the overall packaging efficiency of the semiconductor chip. To this end, we propose a semiconductor chip packaging mechanism and process to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor chip packaging mechanism and process to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a semiconductor chip packaging mechanism, comprising a mechanism base, a material guide mechanism is fixedly installed on the top of the mechanism base, a transmission mechanism is provided at the end of the material guide mechanism, a curing mechanism is provided on the side of the material guide mechanism close to the transmission mechanism, and a top sealing device is provided on the side of the material guide mechanism close to the curing mechanism; The material guiding mechanism comprises two groups of symmetrically distributed material guiding side frames, the material guiding side frames are fixedly mounted on the top of the mechanism base, the tops of the material guiding side frames are rotatably mounted with transmission belt wheels, the outer movable sleeves of the two transmission belt wheels on each group of the material guiding side frames are provided with material guiding belts, a plurality of evenly distributed mounting frames are fixedly mounted between the two material guiding belts, a plurality of evenly distributed bottom sealing mechanisms are provided on the mounting frames, the bottom sealing mechanisms and the top sealing devices cooperate with each other, two connecting rods are fixedly mounted between the two groups of the material guiding side frames, and a support platform corresponding to the bottom sealing mechanism is fixedly mounted between the two connecting rods; The top sealing device includes two symmetrically distributed first frames, which are fixedly installed on the top of the mechanism base, and the tops of the two first frames are fixedly installed with connecting top frames, the bottom ends of the connecting top frames are fixedly installed with first lifting cylinders, and the driving ends of the first lifting cylinders are fixedly installed with mounting top frames, and the bottom ends of the mounting top frames are provided with multiple top sealing mechanisms corresponding to the bottom sealing mechanisms.

[0005] As a preferred technical solution of the present invention, the bottom sealing mechanism includes a bottom sealing card frame, and the bottom sealing mechanism is fixedly installed on the mounting frame through the bottom sealing card frame, the lower surface of the bottom sealing card frame is in contact with the upper surface of the support platform, and the side ends of the bottom sealing card frame are fixedly installed with a shaping bottom frame, and the top of the bottom sealing card frame is provided with a placing groove for placing semiconductor chips, and the top of the bottom sealing card frame is provided with a pin bottom groove corresponding to the pin of the semiconductor chip, and the upper surface of the shaping bottom frame is provided with a shaping bottom groove for shaping the pin of the semiconductor chip.

[0006] As a preferred technical solution of the present invention, the top sealing mechanism includes an injection molding top frame, a molding top frame corresponding to the molding bottom frame is fixedly installed on the side end of the injection molding top frame, a molding top groove corresponding to the molding bottom groove is opened at the bottom end of the molding top frame, a sealing frame is fixedly installed on the inner side of the bottom end of the injection molding top frame, a sealing groove corresponding to the sealing frame is opened at the top edge position of the material placing groove, a second frame is fixedly installed on the top end of the injection molding top frame, the second frame is fixedly installed on the bottom end of the installation top frame, a plurality of injection molding through grooves are evenly distributed in the middle of the top end of the injection molding top frame, and the top side of the injection molding top frame is fixedly installed on the top end of the injection molding top frame. A plurality of evenly distributed exhaust grooves are provided on the top of the injection molding top frame, a symmetrically distributed top through grooves are provided on the top of the injection molding top frame, an injection molding insert is movably inserted between the plurality of the injection molding inserts, an exhaust clamp is fixedly provided between the plurality of the exhaust grooves, a ejector rod is movably inserted in the top through groove, the top of the ejector rod movably passes through the mounting top frame and is fixedly installed on the bottom end of the connecting top frame, a third frame is fixedly installed on the middle part of the top end of the injection molding top frame, a second lifting cylinder is fixedly installed on the third frame, a mounting sleeve is fixedly installed on the driving end of the second lifting cylinder, and the mounting sleeve is fixedly installed on the injection molding insert.

[0007] As a preferred technical solution of the present invention, an injection molding groove is provided in the middle of the bottom end of the injection molding top frame, a pin top groove corresponding to the pin bottom groove is provided at the bottom end of the injection molding top frame, a cooling cavity is provided in the injection molding top frame, a liquid inlet pipe is fixedly installed on one side of the outer wall of the injection molding top frame, and a liquid outlet pipe is fixedly installed on the side of the outer wall of the injection molding top frame away from the liquid inlet pipe.

[0008] As a preferred technical solution of the present invention, a limiting ring is fixedly installed on the injection molding insert, and a buffer pad is provided on the lower surface of the limiting ring. A plastic guide hose is fixedly installed on the end of the injection molding insert in multiple top sealing mechanisms, an exhaust hose is fixedly installed on the end of the exhaust clamp tube in multiple top sealing mechanisms, a liquid inlet hose is fixedly installed on the end of the liquid inlet pipe in multiple top sealing mechanisms, and a liquid outlet hose is fixedly installed on the end of the liquid outlet pipe in multiple top sealing mechanisms.

[0009] As a preferred technical solution of the present invention, the transmission mechanism includes two groups of symmetrically distributed transmission side frames, which are fixedly installed on the top of the mechanism base. Transmission rollers are rotatably installed on the top of the transmission side frames, and transmission belts are provided on the outer movable sleeves of the two transmission rollers.

[0010] As a preferred technical solution of the present invention, the curing mechanism includes two groups of symmetrically distributed curing base frames, the curing base frames are fixedly installed on the top of the mechanism base, the top of the curing base frames is fixedly installed with a curing top frame, the bottom of the curing top frame is fixedly installed with a curing bottom plate, the inner top of the curing top frame is fixedly installed with a side sealing plate, and the inner top of the curing top frame is fixedly installed with a plurality of evenly distributed curing lamp bodies.

[0011] As a preferred technical solution of the present invention, a male drive shaft is provided at one end of the two groups of material guide side frames, and the two ends of the male drive shaft are respectively fixedly installed on the middle part of the corresponding transmission pulley. A driving motor is fixedly installed on the top of one of the material guide side frames, and the driving end of the driving motor is fixedly installed on the shaft end of the corresponding transmission pulley.

[0012] As a preferred technical solution of the present invention, a sprocket transmission group is provided between the end of one of the transmission rollers and the end of one of the transmission pulleys, and the sprocket transmission group includes two sprockets and a transmission chain movably connected to the outside of the two sprockets, and the two sprockets are fixedly mounted on the ends of the transmission roller and the transmission pulley respectively.

[0013] A process for semiconductor chip packaging mechanism comprises the following steps: Step 1: Connect the end of the plastic guide hose to the output end of the encapsulation injection molding machine, connect the end of the exhaust hose to the port of the air pump, and install the end of the liquid inlet hose and the end of the liquid outlet hose to the output port and input port of the coolant circulation system respectively; Step 2: Weld the chip and the packaging substrate to form a semiconductor chip bottom piece, and insert the semiconductor chip bottom piece into the material placement groove. At the same time, insert the pins of the semiconductor chip bottom piece into the pin bottom groove. At this time, the pins of the semiconductor chip bottom piece and the shaping bottom groove are vertically corresponding; Control the start-up of the driving motor to drive the corresponding transmission belt wheel to rotate, cooperate with the connection of the male drive shaft, drive the guide belts on both sides to transmit, and then control multiple mounting racks and corresponding multiple bottom sealing mechanisms to automatically transmit, and stably support the bottom sealing card frame through the support platform, thereby driving multiple semiconductor chip bottom parts to be automatically transmitted; When the transmission belt wheel rotates, it cooperates with the transmission of the sprocket transmission group to drive one of the transmission rollers to rotate synchronously, thereby controlling the transmission belt to transmit synchronously; Step 3, when a group of bottom sealing mechanisms carry the semiconductor chip bottom parts to the position of the top sealing mechanism, control the opening of the first lifting cylinder to drive the multiple top sealing mechanisms to descend, the ejector rod remains fixed, and moves in the injection molding groove, so that the bottom end of the ejector rod is flush with the inner upper wall of the injection molding groove, until the sealing frame in the top sealing mechanism is movably connected to the sealing groove in the corresponding bottom sealing mechanism, and the corresponding bottom sealing mechanism and top sealing mechanism are sealed to prevent leakage during subsequent injection molding and packaging. At the same time, the molding top frame descends, and the pins of the semiconductor chip bottom parts are stuck in the molding top groove, and cooperate with the molding effect of the molding bottom groove in the bottom sealing mechanism, so that the pins of the semiconductor chip bottom parts are movably stuck in the molding top frame, the molding top groove in the molding bottom frame, and the molding bottom groove for synchronous molding processing, without the need to shape the pins later; Step 4: Turn on the second lifting cylinder to drive the mounting sleeve and the injection molding insert to descend, so that the injection molding insert extends to the bottom of the injection molding groove. Then, turn on the packaging injection molding machine and the air pump to evacuate air, form a negative pressure in the injection molding groove, and quantitatively introduce the packaging plastic into the injection molding groove. At the same time, slowly move the injection molding insert upward until the semiconductor chip bottom is plastic-sealed; Subsequently, the coolant circulation system is controlled to be turned on, and the coolant is introduced into the cooling cavity through the liquid inlet pipe and introduced into the coolant circulation system through the liquid outlet pipe, so that the coolant in the cooling cavity is circulated, thereby assisting in cooling and shaping the packaging plastic in the injection molding tank; After cooling to a certain extent, the first lifting cylinder is controlled to start driving the multiple top sealing mechanisms to move upward, and the top sealing mechanisms are separated from the corresponding bottom sealing mechanisms. At the same time, the ejector rod is fixed to always support the semiconductor chip after cooling and shaping, so that the semiconductor chip automatically separates from the top sealing mechanism to prevent adhesion; Step 5: After the semiconductor chip package is cooled and finalized, the multiple semiconductor chips are transferred to the curing top frame, and multiple curing lamps are turned on to automatically cure the multiple semiconductor chips in the curing top frame to ensure the strength and stability of the packaging material; Step 6: After the curing process, continue to transfer multiple semiconductor chips, so that the multiple semiconductor chips are transferred to the end and automatically fall on the transmission belt for automatic unloading after the semiconductor chips are packaged.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting up a material guiding mechanism and using a top sealing device, multiple semiconductor chips can be automatically transferred, thereby facilitating automatic packaging of multiple semiconductor chips. At the same time of packaging, the pins of the semiconductor chip bottom are synchronously shaped, and there is no need to shape the pins later, thereby improving the overall processing efficiency of the semiconductor chip.

[0015] 2. By setting up a material guiding mechanism and using a curing mechanism in combination, multiple semiconductor chips after package cooling and finalization can be automatically cured to ensure the strength and stability of the packaging material.

[0016] 3. By setting up a material guide mechanism and using a transmission mechanism in combination, multiple semiconductor chips can be transmitted to the end and automatically fall on the transmission belt for automatic unloading after semiconductor chip packaging, thereby further improving the processing efficiency of semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the structure of the present invention.

[0019] Figure 2 It is a structural schematic diagram of the material guiding mechanism in the present invention.

[0020] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle.

[0021] Figure 4 It is a schematic structural diagram of the top sealing device in the present invention.

[0022] Figure 5 For the present invention Figure 4 Enlarged view of point B in the middle.

[0023] Figure 6 It is a schematic structural diagram of the top sealing device in the present invention from another angle.

[0024] Figure 7 For the present invention Figure 6 Enlarged view of point C in the middle.

[0025] Figure 8 It is a schematic structural diagram of the bottom sealing mechanism and the top sealing mechanism in the present invention.

[0026] Fig. 9 For the present invention Figure 8 Enlarged view of point D in the middle.

[0027] Fig.10 It is a structural schematic diagram of the top sealing mechanism in the present invention.

[0028] Fig.11 For the present invention Fig.10 Enlarged view of point E in the middle.

[0029] Fig.12 For the present invention Fig.10 Enlarged view of point F in the middle.

[0030] Fig.13 It is a structural schematic diagram of the top sealing mechanism in the present invention from another angle.

[0031] Fig.14 It is a structural schematic diagram of the transmission mechanism in the present invention.

[0032] Fig.15 It is a structural schematic diagram of the curing mechanism in the present invention.

[0033] In the figure: 1, mechanism base; 2, material guide mechanism; 3, curing mechanism; 4, top sealing device; 5, transmission mechanism; 6, bottom sealing mechanism; 7, top sealing mechanism; 8, sprocket transmission group; 21, material guide side frame; 22, transmission pulley; 221, driving motor; 23, material guide belt; 24, mounting frame; 25, connecting rod; 26, supporting platform; 27, male drive shaft; 41, first frame; 411, connecting top frame; 412, first lifting cylinder; 413, installing top frame; 61, bottom sealing card frame; 611, material placement groove; 612, pin bottom groove; 613, shaping bottom groove; 614, sealing groove; 62, shaping bottom frame; 71, injection molding top frame; 72, shaping top frame; 721, shaping top groove; 73, sealing frame; 74 , the second frame; 75, injection molding insert; 751, plastic guide hose; 752, limit ring; 7521, buffer pad; 76, exhaust clamp tube; 761, exhaust hose; 77, ejector rod; 78, third frame; 781, second lifting cylinder; 782, mounting sleeve; 701, injection molding groove; 702, exhaust groove; 703, ejector groove; 711, pin top groove; 712, cooling chamber; 713, injection molding groove; 7121, liquid inlet pipe; 7122, liquid outlet pipe; 7123, liquid inlet hose; 7124, liquid outlet hose; 51, transmission side frame; 52, transmission roller; 53, transmission belt; 31, curing base frame; 32, curing top frame; 33, curing bottom plate; 34, side sealing plate; 35, curing lamp body. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example: Figure 1-15As shown, the present invention provides a semiconductor chip packaging mechanism, including a mechanism base 1, a material guiding mechanism 2 is fixedly installed on the top of the mechanism base 1, a transmission mechanism 5 is provided at the end of the material guiding mechanism 2, a curing mechanism 3 is provided on the side of the material guiding mechanism 2 close to the transmission mechanism 5, and a top sealing device 4 is provided on the side of the material guiding mechanism 2 close to the curing mechanism 3; The material guiding mechanism 2 comprises two symmetrically distributed groups of material guiding side frames 21, which are fixedly mounted on the top of the mechanism base 1, and the tops of the material guiding side frames 21 are rotatably mounted with transmission pulleys 22, and the outer movable sleeves of the two transmission pulleys 22 on each group of material guiding side frames 21 are provided with material guiding belts 23, and multiple evenly distributed mounting frames 24 are fixedly mounted between the two material guiding belts 23, and multiple evenly distributed bottom sealing mechanisms 6 are provided on the mounting frames 24, and the bottom sealing mechanisms 6 and the top sealing devices 4 are used in conjunction with each other; one end of the two groups of material guiding side frames 21 is provided with a male drive shaft 27, and the male drive shaft 27 is provided with a male drive shaft 27. The two ends of the driving shaft 27 are respectively fixedly installed on the middle part of the corresponding transmission pulley 22. A driving motor 221 is fixedly installed on the top of one of the guide side frames 21. The driving end of the driving motor 221 is fixedly installed on the shaft end of the corresponding transmission pulley 22. When in use, the driving motor 221 is controlled to drive the corresponding transmission pulley 22 to rotate, and cooperate with the connection of the male driving shaft 27 to drive the guide belts 23 on both sides for transmission, thereby controlling multiple mounting frames 24 and corresponding multiple bottom sealing mechanisms 6 for automatic transmission, which is convenient for subsequent packaging and processing of multiple semiconductor chips.

[0036] Two connecting rods 25 are fixedly installed between the two groups of material guiding side frames 21, and a supporting platform 26 corresponding to the bottom sealing mechanism 6 is fixedly installed between the two connecting rods 25; The top sealing device 4 includes two symmetrically distributed first frames 41, the first frames 41 are fixedly installed on the top of the mechanism base 1, the tops of the two first frames 41 are fixedly installed with connecting top frames 411, the bottom ends of the connecting top frames 411 are fixedly installed with first lifting cylinders 412, the driving ends of the first lifting cylinders 412 are fixedly installed with installing top frames 413, and the bottom ends of the installing top frames 413 are provided with multiple top sealing mechanisms 7 corresponding to the bottom sealing mechanisms 6, and the first lifting cylinders 412 are controlled to open to drive the installing top frames 413 to drive the multiple top sealing mechanisms 7 to descend.

[0037] The bottom sealing mechanism 6 includes a bottom sealing card frame 61, and the bottom sealing mechanism 6 is fixedly installed on the mounting frame 24 through the bottom sealing card frame 61. The lower surface of the bottom sealing card frame 61 contacts the upper surface of the support platform 26, and the bottom sealing card frame 61 is supported by the support platform 26, thereby improving the stability of the transmission of the bottom sealing card frame 61. The side ends of the bottom sealing card frame 61 are fixedly installed with a shaping bottom frame 62. The top of the bottom sealing card frame 61 is provided with a placing groove 611 for placing semiconductor chips, and the top of the bottom sealing card frame 61 is provided with a pin bottom groove 612 corresponding to the pin of the semiconductor chip. The upper surface of the shaping bottom frame 62 is provided with a shaping bottom groove 613 for shaping the pin of the semiconductor chip. When in use, the chip is welded to the packaging substrate to prepare a semiconductor chip bottom component, and the semiconductor chip bottom component is movably inserted into the placing groove 611. At the same time, the pins of the semiconductor chip bottom component are inserted into the pin bottom groove 612. At this time, the pins of the semiconductor chip bottom component and the shaping bottom groove 613 vertically correspond.

[0038] The top sealing mechanism 7 includes an injection molding top frame 71, a molding top frame 72 corresponding to the molding bottom frame 62 is fixedly installed on the side end of the injection molding top frame 71, a molding top groove 721 corresponding to the molding bottom groove 613 is opened at the bottom end of the molding top frame 72, a sealing frame 73 is fixedly installed on the inner side of the bottom end of the injection molding top frame 71, a sealing groove 614 corresponding to the sealing frame 73 is opened at the top edge position of the material placing groove 611, a second frame 74 is fixedly installed on the top of the injection molding top frame 71, and the second frame 74 is fixedly installed on the bottom end of the mounting top frame 413, a plurality of injection molding through grooves 701 are evenly distributed in the middle of the top end of the injection molding top frame 71, a plurality of exhaust through grooves 702 are evenly distributed on the top side of the injection molding top frame 71, a symmetrically distributed top through grooves 703 are opened on the top of the injection molding top frame 71, an injection molding insert 75 is movably inserted between the plurality of injection molding through grooves 701, and an exhaust clamp pipe is fixedly opened between the plurality of exhaust through grooves 702 76, a push rod 77 is movably inserted in the top-penetrating groove 703, and the top of the push rod 77 movably penetrates the mounting top frame 413 and is fixedly mounted on the bottom end of the connecting top frame 411, wherein the bottom end of the push rod 77 is flush with the inner upper wall of the injection molding groove 713, and a third frame 78 is fixedly mounted on the middle of the top of the injection molding top frame 71, and a second lifting cylinder 781 is fixedly mounted on the third frame 78, and a mounting sleeve 7 is fixedly mounted on the driving end of the second lifting cylinder 781 82, the mounting sleeve 782 is fixedly mounted on the injection molding insert 75; an injection molding groove 713 is provided in the middle of the bottom end of the injection molding top frame 71, a pin top groove 711 corresponding to the pin bottom groove 612 is provided at the bottom end of the injection molding top frame 71, a cooling cavity 712 is provided in the injection molding top frame 71, a liquid inlet pipe 7121 is fixedly mounted on one side of the outer wall of the injection molding top frame 71, and a liquid outlet pipe 7122 is fixedly mounted on the side of the outer wall of the injection molding top frame 71 away from the liquid inlet pipe 7121.

[0039] A limiting ring 752 is fixedly installed on the injection molding insert 75, and a buffer pad 7521 is provided on the lower surface of the limiting ring 752. A plastic guide hose 751 is fixedly installed on the end of the injection molding insert 75 in multiple top sealing mechanisms 7, an exhaust hose 761 is fixedly installed on the end of the exhaust clamp tube 76 in multiple top sealing mechanisms 7, a liquid inlet hose 7123 is fixedly installed on the end of the liquid inlet pipe 7121 in multiple top sealing mechanisms 7, and a liquid outlet hose 7124 is fixedly installed on the end of the liquid outlet pipe 7122 in multiple top sealing mechanisms 7. When in use, the end of the plastic guide hose 751 is connected to the output end of the injection molding machine for packaging, the end of the exhaust hose 761 is connected to the port of the air pump, and the ends of the liquid inlet hose 7123 and the ends of the liquid outlet hose 7124 are respectively installed with the output port and the input port of the coolant circulation system. When a group of bottom sealing mechanisms 6 carry the semiconductor chip bottom parts to the top sealing mechanism 7, When the molding is in place, the first lifting cylinder 412 is controlled to be opened to drive the multiple top sealing mechanisms 7 to descend, and the ejector rod 77 remains fixed and moves in the injection molding groove 713, so that the bottom end of the ejector rod 77 is flush with the inner upper wall of the injection molding groove 713, until the sealing frame 73 in the top sealing mechanism 7 is movably connected to the sealing groove 614 in the corresponding bottom sealing mechanism 6, and the corresponding bottom sealing mechanism 6 and the top sealing mechanism 7 are sealed to prevent leakage during subsequent injection molding packaging. At the same time, the molding top frame 72 descends, and the pins of the semiconductor chip bottom part are stuck in the molding top groove 721, and cooperate with the molding bottom groove 613 in the bottom sealing mechanism 6 to make the pins of the semiconductor chip bottom part movably inserted into the molding top groove 721 and the molding bottom groove 613 in the molding bottom frame 62 for synchronous molding processing, without the need to shape the pins later, thereby improving the overall processing efficiency of the semiconductor chip; Subsequently, the second lifting cylinder 781 is turned on to drive the mounting sleeve 782 and the injection molding insert 75 to descend, so that the injection molding insert 75 extends to the bottom of the injection molding groove 713. Subsequently, the packaging injection molding machine and the air pump are turned on to evacuate air, so as to form a negative pressure in the injection molding groove 713, and the packaging plastic is quantitatively introduced into the injection molding groove 713. At the same time, the injection molding insert 75 is slowly moved upward until the semiconductor chip bottom is completely plastic-sealed. Subsequently, the cooling liquid circulation system is controlled to be turned on, and the cooling liquid is introduced into the cooling chamber 712 through the liquid inlet pipe 7121, and is introduced into the cooling liquid circulation system through the liquid outlet pipe 7122, so that the cooling liquid in the cooling chamber 712 circulates, thereby assisting in cooling and shaping the packaging plastic in the injection molding groove 713, thereby accelerating the packaging efficiency of the semiconductor chip; After cooling to a certain extent, the first lifting cylinder 412 is controlled to open to drive multiple top sealing mechanisms 7 to move upward, and the top sealing mechanisms 7 are separated from the corresponding bottom sealing mechanisms 6. At the same time, the ejector rod 77 is fixed to always support the semiconductor chip after cooling and shaping, so that the semiconductor chip automatically separates from the top sealing mechanism 7 to prevent adhesion, thereby further improving the packaging effect of the semiconductor chip.

[0040] The curing mechanism 3 includes two groups of symmetrically distributed curing frames 31, the curing frames 31 are fixedly installed on the top of the mechanism base 1, a curing top frame 32 is fixedly installed on the top of the curing frame 31, a curing bottom plate 33 is fixedly installed on the bottom of the curing top frame 32, a side sealing plate 34 is fixedly installed on the inner top of the curing top frame 32, and a plurality of uniformly distributed curing lamp bodies 35 are fixedly installed on the inner top of the curing top frame 32. After the semiconductor chip package is cooled and finalized, it continues to be transferred to transfer the plurality of semiconductor chips to the curing top frame 32, and turn on the plurality of curing lamp bodies 35 to automatically cure the plurality of semiconductor chips in the curing top frame 32 to ensure the strength and stability of the packaging material.

[0041] The transmission mechanism 5 includes two groups of symmetrically distributed transmission side frames 51, which are fixedly installed on the top of the mechanism base 1. A transmission roller 52 is rotatably installed on the top of the transmission side frame 51, and a transmission belt 53 is movably sleeved on the outer sides of the two transmission rollers 52; a sprocket transmission group 8 is provided between the end of one of the transmission rollers 52 and the end of one of the transmission pulleys 22, and the sprocket transmission group 8 includes two sprockets and a transmission chain movably sleeved on the outer sides of the two sprockets. The two sprockets are fixedly installed on the ends of the transmission roller 52 and the transmission pulley 22 respectively. When the transmission pulley 22 rotates, it cooperates with the transmission of the sprocket transmission group 8 to drive one of the transmission rollers 52 to rotate synchronously, thereby controlling the transmission belt 53 to perform synchronous transmission. After the curing process, multiple semiconductor chips continue to be transmitted, so that multiple semiconductor chips are transmitted to the end and automatically fall on the transmission belt 53 for automatic unloading after semiconductor chip packaging, thereby further improving the processing efficiency of semiconductor chips.

[0042] A process for semiconductor chip packaging mechanism comprises the following steps: Step 1: Connect the end of the plastic guide hose 751 to the output end of the encapsulation injection molding machine, connect the end of the exhaust hose 761 to the port of the air pump, and install the end of the liquid inlet hose 7123 and the end of the liquid outlet hose 7124 to the output port and input port of the coolant circulation system respectively; Step 2: Weld the chip and the package substrate to form a semiconductor chip bottom piece, and insert the semiconductor chip bottom piece into the material placement groove 611. At the same time, insert the pins of the semiconductor chip bottom piece into the pin bottom groove 612. At this time, the pins of the semiconductor chip bottom piece and the shaping bottom groove 613 are vertically aligned. The driving motor 221 is controlled to drive the corresponding transmission pulley 22 to rotate, and the male drive shaft 27 is connected to drive the guide belts 23 on both sides to transmit, thereby controlling the multiple mounting racks 24 and the corresponding multiple bottom sealing mechanisms 6 to automatically transmit, and the bottom sealing card frame 61 is stably supported by the support platform 26, thereby driving the multiple semiconductor chip bottom parts to be automatically transmitted; When the transmission pulley 22 rotates, it cooperates with the transmission of the sprocket transmission group 8 to drive one of the transmission rollers 52 to rotate synchronously, thereby controlling the transmission belt 53 to perform synchronous transmission; Step 3, when a group of bottom sealing mechanisms 6 carry the semiconductor chip bottom parts to the position of the top sealing mechanism 7, the first lifting cylinder 412 is controlled to open and drive the multiple top sealing mechanisms 7 to descend, and the ejector rod 77 remains fixed and moves in the injection molding groove 713, so that the bottom end of the ejector rod 77 is flush with the inner upper wall of the injection molding groove 713, until the sealing frame 73 in the top sealing mechanism 7 is movably connected to the sealing groove 614 in the corresponding bottom sealing mechanism 6, and the corresponding bottom sealing mechanism 6 and the top sealing mechanism 7 are sealed to prevent leakage during subsequent injection molding packaging. At the same time, the molding top frame 72 descends, and the pins of the semiconductor chip bottom parts are stuck in the molding top groove 721, and cooperate with the molding bottom groove 613 in the bottom sealing mechanism 6 to shape the pins of the semiconductor chip bottom parts. The molding top groove 721 and the molding bottom groove 613 in the molding top frame 72 are movably connected to the molding bottom frame 62 for synchronous molding processing, and there is no need to shape the pins later; Step 4: Turn on the second lifting cylinder 781 to drive the mounting sleeve 782 and the injection molding insert 75 to descend, so that the injection molding insert 75 extends to the bottom of the injection molding groove 713. Then, turn on the packaging injection molding machine and the air pump to evacuate air, so as to form a negative pressure in the injection molding groove 713, and quantitatively introduce the packaging plastic into the injection molding groove 713. At the same time, slowly move the injection molding insert 75 upward until the semiconductor chip bottom is completely plastic-sealed. Subsequently, the cooling liquid circulation system is controlled to be turned on, and the cooling liquid is introduced into the cooling cavity 712 through the liquid inlet pipe 7121, and is introduced into the cooling liquid circulation system through the liquid outlet pipe 7122, so that the cooling liquid in the cooling cavity 712 circulates, thereby assisting in cooling and shaping the packaging plastic in the injection molding groove 713; After cooling to a certain extent, the first lifting cylinder 412 is controlled to start driving the multiple top sealing mechanisms 7 to move upward, and the top sealing mechanisms 7 are separated from the corresponding bottom sealing mechanisms 6. At the same time, the ejector rod 77 is fixed to always support the semiconductor chip after cooling and shaping, so that the semiconductor chip automatically separates from the top sealing mechanism 7 to prevent adhesion; Step 5: After the semiconductor chip package is cooled and finalized, the multiple semiconductor chips are transferred to the curing top frame 32, and multiple curing lamp bodies 35 are turned on to automatically cure the multiple semiconductor chips in the curing top frame 32 to ensure the strength and stability of the packaging material; Step 6: After the curing process, the plurality of semiconductor chips are continuously transferred to the end and automatically fall on the transfer belt 53 for automatic unloading after the semiconductor chips are packaged.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging mechanism, comprising a mechanism base (1), characterized in that: A material guiding mechanism (2) is fixedly mounted on the top of the mechanism base (1); a transmission mechanism (5) is provided at the end of the material guiding mechanism (2); a curing mechanism (3) is provided on the side of the material guiding mechanism (2) close to the transmission mechanism (5); and a top sealing device (4) is provided on the side of the material guiding mechanism (2) close to the curing mechanism (3); The material guiding mechanism (2) comprises two groups of symmetrically distributed material guiding side frames (21), the material guiding side frames (21) are fixedly mounted on the top of the mechanism base (1), and the top of each of the material guiding side frames (21) is rotatably mounted with a transmission pulley (22), and a material guiding belt (23) is provided on the outer movable sleeve of the two transmission pulleys (22) on each group of the material guiding side frames (21), and a plurality of evenly distributed mounting frames (24) are fixedly mounted between the two material guiding belts (23), and a plurality of evenly distributed bottom sealing mechanisms (6) are provided on the mounting frames (24), and the bottom sealing mechanisms (6) and the top sealing devices (4) are used in coordination with each other, and two connecting rods (25) are fixedly mounted between the two groups of the material guiding side frames (21), and a support platform (26) corresponding to the bottom sealing mechanism (6) is fixedly mounted between the two connecting rods (25); The top sealing device (4) comprises two symmetrically distributed first frames (41), wherein the first frames (41) are fixedly mounted on the top of the mechanism base (1), a connecting top frame (411) is fixedly mounted on the top of the two first frames (41), a first lifting cylinder (412) is fixedly mounted on the bottom of the connecting top frame (411), a mounting top frame (413) is fixedly mounted on the driving end of the first lifting cylinder (412), and a plurality of top sealing mechanisms (7) corresponding to the bottom sealing mechanisms (6) are provided at the bottom of the mounting top frame (413).

2. A semiconductor chip packaging structure according to claim 1, characterized in that: The bottom sealing mechanism (6) comprises a bottom sealing card frame (61), the bottom sealing mechanism (6) is fixedly mounted on the mounting frame (24) via the bottom sealing card frame (61), the lower surface of the bottom sealing card frame (61) is in contact with the upper surface of the support platform (26), the side ends of the bottom sealing card frame (61) are fixedly mounted with a shaping bottom frame (62), the top end of the bottom sealing card frame (61) is provided with a material placement groove (611) capable of placing a semiconductor chip, the top end of the bottom sealing card frame (61) is provided with a pin bottom groove (612) corresponding to the pin of the semiconductor chip, and the upper surface of the shaping bottom frame (62) is provided with a shaping bottom groove (613) for shaping the pin of the semiconductor chip.

3. A semiconductor chip packaging structure according to claim 2, characterized in that: The top sealing mechanism (7) comprises an injection molding top frame (71), a molding top frame (72) corresponding to the molding bottom frame (62) is fixedly mounted on the side end of the injection molding top frame (71), a molding top groove (721) corresponding to the molding bottom groove (613) is provided at the bottom end of the molding top frame (72), a sealing frame (73) is fixedly mounted on the inner side of the bottom end of the injection molding top frame (71), a sealing groove (614) corresponding to the sealing frame (73) is provided at the top edge position of the material placement groove (611), a second frame (74) is fixedly mounted on the top end of the injection molding top frame (71), the second frame (74) is fixedly mounted on the bottom end of the mounting top frame (413), a plurality of injection molding through grooves (701) evenly distributed are provided in the middle of the top end of the injection molding top frame (71), and a plurality of injection molding through grooves (701) evenly distributed are provided on the side of the top end of the injection molding top frame (71). An exhaust through-groove (702), a top of the injection molding top frame (71) is provided with symmetrically distributed top-through grooves (703), an injection molding insert (75) is movably inserted between the plurality of the injection molding through-grooves (701), an exhaust clamp tube (76) is fixedly provided between the plurality of the exhaust through-grooves (702), a ejector rod (77) is movably inserted in the top-through groove (703), the top of the ejector rod (77) movably passes through the mounting top frame (413) and is fixedly mounted on the bottom end of the connecting top frame (411), a third frame (78) is fixedly mounted in the middle of the top of the injection molding top frame (71), a second lifting cylinder (781) is fixedly mounted on the third frame (78), a mounting sleeve (782) is fixedly mounted on the driving end of the second lifting cylinder (781), and the mounting sleeve (782) is fixedly mounted on the injection molding insert (75).

4. A semiconductor chip packaging structure according to claim 3, characterized in that: An injection molding groove (713) is provided at the middle of the bottom end of the injection molding top frame (71), a pin top groove (711) corresponding to the pin bottom groove (612) is provided at the bottom end of the injection molding top frame (71), a cooling cavity (712) is provided in the injection molding top frame (71), a liquid inlet pipe (7121) is fixedly mounted on one side of the outer wall of the injection molding top frame (71), and a liquid outlet pipe (7122) is fixedly mounted on the side of the outer wall of the injection molding top frame (71) away from the liquid inlet pipe (7121).

5. The semiconductor chip packaging structure according to claim 4, characterized in that: A limiting ring (752) is fixedly mounted on the injection molding insert (75), and a buffer pad (7521) is provided on the lower surface of the limiting ring (752). A plastic guide hose (751) is fixedly mounted on the end of the injection molding insert (75) in the plurality of top sealing mechanisms (7). An exhaust hose (761) is fixedly mounted on the end of the exhaust clamp tube (76) in the plurality of top sealing mechanisms (7). A liquid inlet hose (7123) is fixedly mounted on the end of the liquid inlet pipe (7121) in the plurality of top sealing mechanisms (7). A liquid outlet hose (7124) is fixedly mounted on the end of the liquid outlet pipe (7122) in the plurality of top sealing mechanisms (7).

6. The semiconductor chip packaging structure according to claim 1, characterized in that: The transmission mechanism (5) comprises two groups of transmission side frames (51) which are symmetrically distributed. The transmission side frames (51) are fixedly mounted on the top of the mechanism base (1). A transmission roller (52) is rotatably mounted on the top of the transmission side frame (51). Transmission belts (53) are movable sleeves on the outer sides of the two transmission rollers (52).

7. The semiconductor chip packaging structure according to claim 1, characterized in that: The curing mechanism (3) comprises two groups of symmetrically distributed curing base frames (31), the curing base frames (31) being fixedly mounted on the top of the mechanism base (1), a curing top frame (32) being fixedly mounted on the top of the curing base frame (31), a curing bottom plate (33) being fixedly mounted on the bottom of the curing top frame (32), a side sealing plate (34) being fixedly mounted on the inner top of the curing top frame (32), and a plurality of uniformly distributed curing lamp bodies (35) being fixedly mounted on the inner top of the curing top frame (32).

8. The semiconductor chip packaging structure according to claim 1, characterized in that: A male drive shaft (27) is provided at one end of the two groups of material guide side frames (21), and both ends of the male drive shaft (27) are respectively fixedly mounted to the middle of the corresponding transmission pulley (22), and a drive motor (221) is fixedly mounted on the top of one of the material guide side frames (21), and the drive end of the drive motor (221) is fixedly mounted to the shaft end of the corresponding transmission pulley (22).

9. The semiconductor chip packaging structure according to claim 6, characterized in that: A sprocket drive group (8) is provided between the end of one of the transmission rollers (52) and the end of one of the transmission belt pulleys (22). The sprocket drive group (8) comprises two sprockets and a transmission chain movably sleeved on the outsides of the two sprockets. The two sprockets are fixedly mounted on the ends of the transmission roller (52) and the transmission belt pulley (22), respectively.

10. A process using the semiconductor chip packaging structure according to any one of claims 1 to 9, characterized in that: The steps include: Step 1, connect the end of the plastic guide hose (751) to the output end of the packaging injection molding machine, connect the end of the exhaust hose (761) to the port of the air pump, and install the end of the liquid inlet hose (7123) and the end of the liquid outlet hose (7124) to the output port and input port of the coolant circulation system respectively; Step 2: welding the chip and the packaging substrate to prepare a semiconductor chip bottom piece, movably inserting the semiconductor chip bottom piece into the material placement groove (611), and at the same time, inserting the pins of the semiconductor chip bottom piece into the pin bottom groove (612), at this time, the pins of the semiconductor chip bottom piece and the shaping bottom groove (613) are vertically corresponding; Controlling the start of a drive motor (221) to drive the corresponding transmission pulley (22) to rotate, cooperating with the connection of the male drive shaft (27) to drive the guide belts (23) on both sides to transmit, thereby controlling the multiple mounting racks (24) and the corresponding multiple bottom sealing mechanisms (6) to automatically transmit, and stably supporting the bottom sealing card frame (61) through the support platform (26), thereby driving the multiple semiconductor chip bottom parts to be automatically transmitted; When the transmission pulley (22) rotates, it cooperates with the transmission of the sprocket transmission group (8) to drive one of the transmission rollers (52) to rotate synchronously, thereby controlling the transmission belt (53) to perform synchronous transmission; Step 3: When a group of bottom sealing mechanisms (6) carrying the semiconductor chip bottom parts are transferred to the position of the top sealing mechanism (7), the first lifting cylinder (412) is controlled to be turned on to drive the multiple top sealing mechanisms (7) to descend, and the ejector rod (77) remains fixed and moves in the injection molding groove (713) so that the bottom end of the ejector rod (77) is flush with the inner upper wall of the injection molding groove (713) until the sealing frame (73) in the top sealing mechanism (7) is movably engaged in the sealing groove (614) in the corresponding bottom sealing mechanism (6), and the corresponding bottom sealing mechanism is performed. The top sealing mechanism (6) and the top sealing mechanism (7) are sealed to prevent leakage during subsequent injection molding packaging. At the same time, the top molding frame (72) descends, and the pins of the semiconductor chip bottom piece are stuck in the top molding grooves (721). In cooperation with the shaping action of the bottom molding grooves (613) in the bottom sealing mechanism (6), the pins of the semiconductor chip bottom piece are movably stuck in the top molding grooves (721) and the bottom molding grooves (613) in the top molding frame (72), and synchronous shaping processing is performed, without the need for subsequent shaping of the pins. Step 4: Start the second lifting cylinder (781) to drive the mounting sleeve (782) and the injection molding insert (75) to descend, so that the injection molding insert (75) extends to the bottom of the injection molding groove (713); then, start the encapsulation injection molding machine and the air pump to evacuate air, so as to form a negative pressure in the injection molding groove (713), and quantitatively introduce the encapsulation plastic into the injection molding groove (713); at the same time, slowly move the injection molding insert (75) upward until the semiconductor chip bottom is completely encapsulated; Subsequently, the cooling liquid circulation system is controlled to be turned on, and the cooling liquid is introduced into the cooling cavity (712) through the liquid inlet pipe (7121), and is introduced into the cooling liquid circulation system through the liquid outlet pipe (7122), so that the cooling liquid in the cooling cavity (712) circulates, thereby assisting in cooling and shaping the packaging plastic in the injection molding groove (713); After cooling to a certain degree, the first lifting cylinder (412) is controlled to start and drive the plurality of top sealing mechanisms (7) to move upward, so that the top sealing mechanisms (7) are separated from the corresponding bottom sealing mechanisms (6). At the same time, the ejector rod (77) is fixed to always support the semiconductor chip after cooling and shaping, so that the semiconductor chip is automatically separated from the top sealing mechanism (7) to prevent adhesion; Step 5: After the semiconductor chip package is cooled and finalized, the plurality of semiconductor chips are continuously transferred to the curing top frame (32), and the plurality of curing lamp bodies (35) are turned on to automatically cure the plurality of semiconductor chips in the curing top frame (32) to ensure the strength and stability of the packaging material; Step 6: After the curing process, the plurality of semiconductor chips are continuously transferred, so that the plurality of semiconductor chips are transferred to the end and automatically fall on the transfer belt (53) for automatic unloading after the semiconductor chips are packaged.

Images