Forming process for improving forming quality of rigid-flex circuit board

Abstract

The invention discloses a forming process for improving the forming quality of a rigid-flex circuit board, and relates to the technical field of rigid-flex circuit board production and forming, which comprises the following steps of: S1, taking out a printed board (1) from a charging basket by a worker, fixing a horizontal tool of the printed board on a table top of a tool table of a saw blade cutting machine, and cutting the printed board (1) by a saw blade; a plurality of spigots (4) are cut on the top surfaces of the left end part and the right end part of the printed board (1) through a saw blade cutting machine; s2, after a plurality of spigots (4) are cut and processed on the top surfaces of the left end part and the right end part of the printed board (1), a plurality of grooves (5) are cut on the top surface of the printed board (1) and between the spigots (4) on the left side and the right side through a saw blade cutting machine; and S5, a hot pressing head presses the top surface of the FPC board (3), so that a first rigid-flex circuit board is formed through hot pressing. The method has the beneficial effects that the forming quality of the rigid-flex circuit board is greatly improved, and the service life of the rigid-flex circuit board is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of production and molding of a soft-hard combined circuit board, and in particular to a molding process for improving the molding quality of a soft-hard combined circuit board. Background Art

[0002] As consumer electronic products develop towards thinness, integration, and multifunctionality, the requirements for the manufacturing process of rigid-flex boards are getting higher and higher. Rigid-flex boards have the characteristics of good electrical performance and fast transmission performance. They are widely used in consumer electronic products, industrial and medical electronic products, and military equipment. Rigid-flex boards are highly favored by these industries. In addition, compared with ordinary circuit boards, rigid-flex boards also have faster transmission characteristics.

[0003] The structure of the hard-and-soft circuit board produced in a workshop is as follows: Figure 1 As shown, it includes a printed circuit board 1, a layer of cured sheet 2 is hot pressed in the middle of the printed circuit board 1, and a layer of FPC board 3 is hot pressed on the top surface of the cured sheet 2. The method of producing such a soft-hard combination circuit board in the workshop is: S1. A worker takes out a printed circuit board 1 and places it flat on the hot pressing table of a hot pressing machine; S2. The worker places a cured sheet 2 on the top surface of the printed board 1. Figure 2 As shown, ensure that the four outer edges of the cured sheet 2 are flush with the four outer edges of the printed board 1, and then place an FPC board 3 on the top surface of the cured sheet 2, ensuring that the four outer edges of the FPC board 3 are flush with the four outer edges of the cured sheet 2; S3, control the hot pressing head of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board 3. At this time, the heat on the hot pressing head is transferred to the FPC board 3, and the FPC board 3 then transfers the heat to the curing sheet 2. When the curing sheet 2 is heated, the curing sheet 2 fixes the FPC board 3 and the printed circuit board 1 together, thereby forming the first rigid-flexible circuit board by hot pressing. S4. The worker repeats the operations of steps S1 to S3 to continuously produce multiple rigid-flexible circuit boards.

[0004] However, although the method used in the workshop can produce a batch of rigid-flex circuit boards, the following technical defects are still reflected in the actual production: I. When the hot pressing head 7 of the hot pressing machine is pressed onto the top surface of the FPC board 3, the material on the outer edge of the curing sheet 2 overflows to the outside of the printed board 1, and the overflow direction is as follows: Figure 3As shown by the middle arrow, it is attached to the four outer end surfaces of the printed circuit board 1 [the process requires that the four outer end surfaces of the printed circuit board 1 produced by the soft and hard combination circuit board should not be attached with overflowing cured sheet 2]. Therefore, the molding method in the workshop undoubtedly reduces the molding quality of the soft and hard combination circuit board.

[0005] II. After this kind of rigid-flexible circuit board has been used for a period of time, the curing sheet 2 in the rigid-flexible circuit board is easy to age and fall off from the printed circuit board 1, causing the FPC board 3 to fall off together with the curing sheet 2 [the process requires that the curing sheet 2 should not fall off from the printed circuit board 1 after the rigid-flexible circuit board has been used for a long time]. Therefore, the molding method in the workshop undoubtedly further reduces the molding quality of the rigid-flexible circuit board and further shortens the service life of the entire rigid-flexible circuit board.

[0006] Therefore, there is an urgent need for a molding process that can greatly improve the molding quality of the rigid-flexible circuit board and increase the service life of the rigid-flexible circuit board. Summary of the invention

[0007] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a molding process for improving the molding quality of a hard-soft combined circuit board, which greatly improves the molding quality of the hard-soft combined circuit board and increases the service life of the hard-soft combined circuit board.

[0008] The purpose of the present invention is achieved through the following technical solution: a molding process for improving the molding quality of a rigid-flexible circuit board, which comprises the following steps: S1. The worker takes out a printed circuit board from the material basket, fixes the horizontal tooling on the table of the saw blade cutting machine, and uses the saw blade cutting machine to cut multiple stoppers on the top surface of the left and right ends of the printed circuit board, while ensuring that each stopper is distributed horizontally; S2. After cutting and processing a plurality of stoppers on the top surface of the left and right ends of the printed circuit board, a plurality of grooves are cut on the top surface of the printed circuit board and between the stoppers on the left and right sides by a saw blade cutting machine, and at the same time, it is ensured that the plurality of grooves are distributed longitudinally; S3. After cutting and processing a plurality of grooves on the top surface of the printed circuit board, the worker grinds away the burrs on the top edge of each stop by the grinding wheel of the grinder, and then grinds away the burrs on the top surface of each groove by the grinding wheel of the grinding equipment; S4. The worker takes out a hollow rectangular frame, places the frame on the hot pressing table of the hot press, and then puts the printed circuit board in the frame, and then puts a curing sheet in the frame, making sure that the curing sheet covers the top surface of the printed circuit board, and then puts an FPC board in the frame, making sure that the FPC board covers the top surface of the curing sheet; S5, control the hot pressing head of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board, and the heat on the hot pressing head is transferred to the FPC board, and the FPC board then transfers the heat to the curing sheet. When the curing sheet is heated, the materials at the left and right edges of the curing sheet flow into each stop to form a first pulling portion, and at the same time, the middle material of the curing sheet flows into each groove to form a second pulling portion, thereby forming the first rigid-flexible circuit board through hot pressing. After hot pressing, the formed rigid-flexible circuit board is taken out of the enclosure; S6. The worker repeats the operations of steps S1 to S5 to continuously produce multiple rigid-flexible circuit boards.

[0009] In step S1, the longitudinal distances between each two adjacent stoppers are equal.

[0010] In step S2, the horizontal distances between every two adjacent grooves are equal.

[0011] The size of the cured sheet is equal to that of the printed board.

[0012] The hollow rectangular cavity of the surrounding frame matches the outer contour of the printed circuit board.

[0013] The present invention has the following advantages: greatly improving the molding quality of the soft-hard combination circuit board and increasing the service life of the soft-hard combination circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural diagram of a rigid-flexible circuit board produced in a workshop; Figure 2 A schematic diagram of placing a curing sheet on the top surface of a printed board; Figure 3 It is a schematic diagram of the material on the outer edge of the cured sheet overflowing to the outside of the printed board; Figure 4 The figure is a schematic diagram showing that a plurality of stoppers are cut on the top surface of the left and right ends of the printed circuit board; Figure 5 for Figure 4 A top view of Figure 6 A schematic diagram of cutting a plurality of grooves on the top surface of a printed circuit board and between the stoppers on the left and right sides; Figure 7 for Figure 6 A top view of Figure 8 is a schematic diagram of the structure of the enclosure; Fig. 9 for Figure 8 The main cross-sectional diagram of Fig.10 A schematic diagram for placing a printed circuit board in a frame; Fig.11 It is a schematic diagram of the FPC board covering the top surface of the cured sheet; Fig.12 A schematic diagram showing the thermal press head being pressed onto the top surface of the FPC board; Fig.13 It is a schematic diagram of the structure of the formed rigid-flexible circuit board; In the figure: 1-printed circuit board, 2-curing sheet, 3-FPC board, 4-stopper, 5-groove, 6-surrounding frame, 7-hot pressing head, 8-first pulling part, 9-second pulling part. DETAILED DESCRIPTION

[0015] The present invention is further described below in conjunction with the accompanying drawings, and the protection scope of the present invention is not limited to the following: A molding process for improving the molding quality of a rigid-flexible circuit board comprises the following steps: S1. A worker takes out a printed circuit board 1 from the material basket, fixes the horizontal tooling on the table of the saw blade cutting machine, and uses the saw blade cutting machine to cut multiple stoppers 4 on the top surface of the left and right ends of the printed circuit board 1. Figure 4~Figure 5 As shown, at the same time, ensure that each stopper 4 is horizontally distributed; the longitudinal spacing between each two adjacent stoppers 4 is equal; S2. After a plurality of stoppers 4 are cut on the top surface of the left and right ends of the printed circuit board 1, a plurality of grooves 5 are cut on the top surface of the printed circuit board 1 and between the stoppers 4 on the left and right sides by a saw blade cutting machine. Figure 6~Figure 7 As shown, at the same time, ensure that the plurality of grooves 5 are longitudinally distributed; the horizontal spacing between each two adjacent grooves 5 is equal; S3. After cutting and processing a plurality of grooves 5 on the top surface of the printed circuit board 1, the worker grinds away the burrs on the top edge of each stop 4 with the grinding wheel of the grinder, and then grinds away the burrs on the top surface of each groove 5 with the grinding wheel of the grinding equipment; S4, the worker takes out a hollow rectangular frame 6, the structure of the frame 6 is as follows Figure 8~Figure 9 As shown, the hollow rectangular cavity of the frame 6 matches the outer contour of the printed circuit board 1, the frame 6 is placed on the hot pressing table of the hot press, and then the printed circuit board 1 is placed in the frame 6, as shown in FIG. Fig.10 As shown, a cured sheet 2 is then placed in the frame 6, the size of the cured sheet 2 being equal to the size of the printed board 1, ensuring that the cured sheet 2 covers the top surface of the printed board 1, and then an FPC board 3 is placed in the frame 6, ensuring that the FPC board 3 covers the top surface of the cured sheet 2, as shown. Fig.11 As shown; S5, control the hot pressing head 7 of the hot pressing machine to move downward, and the hot pressing head is pressed onto the top surface of the FPC board 3, such as Fig.12As shown, the heat on the hot pressing head 7 is transferred to the FPC board 3, and the FPC board 3 then transfers the heat to the curing sheet 2. When the curing sheet 2 is heated, the materials at the left and right edges of the curing sheet 2 flow into each stop 4 to form a first pulling portion 8. At the same time, the middle material of the curing sheet 2 flows into each groove 5 to form a second pulling portion 9, thereby hot pressing and forming a first soft and hard combination circuit board. After hot pressing, the formed soft and hard combination circuit board is taken out of the frame. The structure of the formed soft and hard combination circuit board is shown in FIG. Fig.13 As shown; S6. The worker repeats the operations of steps S1 to S5 to continuously produce multiple rigid-flexible circuit boards.

[0016] Since the left and right materials of the cured sheet 2 flow into the stoppers 4 located on the left and right sides of the printed board 1 to form the first pulling portions 8 located on the left and right sides of the printed board 1, the first pulling portions 8 located on the left and right sides of the printed board 1 pull the left and right ends of the cured sheet 2, thereby preventing the cured sheet 2 from falling off the printed board 1; in addition, since the middle material of the cured sheet 2 flows into each groove 5 to form the second pulling portion 9, the second pulling portion 9 pulls the middle part of the cured sheet 2, thereby further preventing the cured sheet 2 from falling off the printed board 1.

[0017] It can be seen that after the rigid-flexible circuit board is used for a long time, the curing sheet 2 will not fall off the printed circuit board 1. Compared with the molding method in the workshop, the molding quality of the rigid-flexible circuit board is greatly improved, and at the same time, the service life of the rigid-flexible circuit board is extended.

[0018] In addition, it can be seen from step S4 that when the hot pressing head is hot pressed on the FPC board 3, the frame 6 surrounds the printed board 1, the curing sheet 2 and the FPC board 3, thereby effectively preventing the curing sheet 2 from overflowing onto the four outer end surfaces of the printed board 1. Compared with the molding method in the workshop, the molding quality of the soft-hard combination circuit board is further greatly improved.

[0019] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A molding process for improving the molding quality of a rigid-flexible circuit board, characterized in that: It includes the following steps: S1. A worker takes out a printed circuit board (1) from a material basket, fixes the horizontal tooling on the table of a saw blade cutting machine, and uses the saw blade cutting machine to cut a plurality of stoppers (4) on the top surface of the left and right ends of the printed circuit board (1), while ensuring that each stopper (4) is horizontally distributed; S2. After a plurality of stoppers (4) are cut on the top surface of the left and right ends of the printed circuit board (1), a plurality of grooves (5) are cut on the top surface of the printed circuit board (1) and between the stoppers (4) on the left and right sides by a saw blade cutting machine, and at the same time, it is ensured that the plurality of grooves (5) are all distributed longitudinally; S3. After cutting and processing a plurality of grooves (5) on the top surface of the printed circuit board (1), the worker grinds away the burrs on the top edge of each stop (4) with the grinding wheel of the grinder, and then grinds away the burrs on the top surface of each groove (5) with the grinding wheel of the grinding equipment; S4. The worker takes out a hollow rectangular frame (6), places the frame (6) on the hot pressing table of the hot pressing machine, and then puts the printed circuit board (1) into the frame (6), and then puts a curing sheet (2) into the frame (6), ensuring that the curing sheet (2) covers the top surface of the printed circuit board (1), and then puts an FPC board (3) into the frame (6), ensuring that the FPC board (3) covers the top surface of the curing sheet (2); S5, controlling the hot pressing head (7) of the hot pressing machine to move downward, the hot pressing head is pressed onto the top surface of the FPC board (3), the heat on the hot pressing head (7) is transferred to the FPC board (3), and the FPC board (3) then transfers the heat to the curing sheet (2), when the curing sheet (2) is heated, the material at the left and right edges of the curing sheet (2) flows into each stop (4) to form a first pulling portion (8), and at the same time, the material in the middle of the curing sheet (2) flows into each groove (5) to form a second pulling portion (9), thereby forming a first rigid-flexible circuit board by hot pressing, and after hot pressing, the formed rigid-flexible circuit board is removed from the enclosure; S6. The worker repeats the operations of steps S1 to S5 to continuously produce multiple rigid-flexible circuit boards.

2. A molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: In step S1, the longitudinal spacing between each two adjacent stoppers (4) is equal.

3. A molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: In step S2, the horizontal spacing between each two adjacent grooves (5) is equal.

4. A molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: The size of the cured sheet (2) is equal to the size of the printed board (1).

5. A molding process for improving the molding quality of a rigid-flexible circuit board according to claim 1, characterized in that: The hollow rectangular cavity of the surrounding frame (6) matches the outer contour of the printed circuit board (1).

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