Microflow cold liquid temperature control cooling system, method and device

Abstract

The invention belongs to the technical field of industrial cooling, and particularly relates to a microflow cold liquid temperature control cooling system, method and device, and the system comprises a main control board which is internally provided with a main control module; the micro liquid pump is in signal connection with the main control module; and the cold liquid pipelines are arranged at two ends of the micro liquid pump. According to the system, method and device, liquid is driven to flow through the micro pump, at the moment, the liquid can absorb and dissipate heat more efficiently due to the characteristics of high heat capacity and heat conductivity, heat can be conducted and dissipated from a heating source quickly and effectively through effective cooperation of the metal heat conduction block, the heat conduction copper pipe, the heat dissipation fins and other components, and the heat dissipation efficiency is improved. Intelligent control over the system is achieved through the main control module, the flow speed of cooling liquid can be automatically adjusted according to actual temperature changes so that the optimal heat dissipation effect can be achieved, and the system state can be monitored in real time and stable operation can be ensured by adding assemblies such as a miniature temperature sensor, a pressure sensor and a flow sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial cooling, and in particular to a micro-flow cooling liquid temperature control and cooling system, method and device. Background Art

[0002] With the development of electronic technology, especially the progress of microelectronics and integrated circuit technology, electronic devices are becoming more and more miniaturized, thinner and more high-performance. However, along with these development trends, the heat generated by the components inside electronic devices is also increasing, which puts higher requirements on the heat dissipation of electronic devices.

[0003] However, in actual use, traditional heat dissipation processes mostly use natural cooling or forced air cooling. However, in actual use, as the integration of electronic devices continues to increase, the heat generated by a single chip also increases. Traditional air cooling methods often cannot meet the heat dissipation needs. For portable electronic devices, the heat dissipation system occupies a large space and weight, affecting the overall design. Therefore, it has the defects of poor overall heat dissipation efficiency, reliability, and practical feasibility of cooling for micro-sized devices.

[0004] Therefore, it is necessary to design a new solution to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a micro-flow cooling liquid temperature control and cooling system, method and device, aiming to solve the technical problems in the prior art that the cooling and temperature control effect of micro and portable devices is poor and it is difficult to cool down the high heat brought about by performance development.

[0006] To achieve the above-mentioned purpose, an embodiment of the present invention provides a micro-flow cold liquid temperature control and cooling system, comprising: a main control board, a main control module is provided inside the main control board; a micro liquid pump, the micro liquid pump is signal-connected to the main control module; cold liquid pipelines are provided at both ends of the micro liquid pump, and the two ends of the micro liquid pump are respectively connected to a heat exchanger and a heat sink through the cold liquid pipeline.

[0007] Furthermore, the micro liquid pump has a variety of different specifications according to usage requirements, including: a micro flow pump with a flow rate of 0 to 3 ml / min, a small flow pump with a flow rate of 0 to 16.5 ml / min, a medium flow pump with a flow rate of 1 to 13 ml / min, a large flow pump with a flow rate of 1 to 22 ml / min, and an ultra-large flow pump with a flow rate of 5 to 292 ml / min.

[0008] Furthermore, micro temperature sensors are provided inside the heat exchange element and the heat sink, and the micro temperature sensors are signal-connected to the main control module.

[0009] Furthermore, a micro pressure sensor is provided inside the cooling liquid pipeline between the heat exchanger and the micro liquid pump, and a micro flow sensor is provided inside the cooling liquid pipeline between the heat sink and the micro liquid pump, and both the micro pressure sensor and the micro flow sensor are connected to the main control module signal.

[0010] Furthermore, a plurality of heat-conducting strips are provided on the inner wall of the cooling liquid pipeline, and the plurality of heat-conducting strips are equidistantly distributed.

[0011] A microfluidic cooling liquid temperature control and cooling method comprises the following steps:

[0012] Step S1: Select a suitable micro liquid pump according to the cooling requirement, and connect the micro liquid pump, the main control board, the heat exchanger and the heat sink through a cold liquid pipeline;

[0013] Step S2: attaching the heat exchange component to one side of the heat-generating workpiece;

[0014] Step S3: applying power through a micro liquid pump to allow the heat transfer liquid to flow through the cold liquid pipeline and continuously exchange heat through the heat exchange element and the heat dissipation element.

[0015] Furthermore, the step S3: applying power through a micro liquid pump to make the heat transfer liquid flow through the cold liquid pipeline and continuously exchange heat through the heat exchange element and the heat dissipation element, also includes:

[0016] Step S31: using a micro temperature sensor to continuously detect the temperature of one side of the heat exchange element and the heat sink;

[0017] Step S32: When the temperature difference between the two sides is large, the water flow rate and heat dissipation efficiency are increased by increasing the power of the micro liquid pump;

[0018] Step S33: when the temperature difference between the two sides is small, the water flow rate is slowed down by reducing the power of the micro liquid pump to reduce power consumption;

[0019] Step S34: During the continuous cooling process, the water pressure and flow rate of the micro liquid pump are monitored by the micro pressure sensor and the micro flow sensor, and the auxiliary main control module determines whether the cooling rate meets the standard.

[0020] A micro-fluidic cooling liquid temperature control and cooling device is used for cooling portable equipment. The device also includes: a flexible cooling liquid pipe, which serves as a cooling liquid pipeline in the system to provide conductivity; a water-cooled back cover, which serves as a heat exchanger in the system; a heat-conducting shell, which serves as a heat dissipation component in the system; and an isolation layer, which is made of an aerogel material and is located between the water-cooled back cover and the heat-conducting shell.

[0021] Furthermore, it can also be applied to cooling of microelectronics industry or chips, and the device also includes: heat sink fins, which serve as heat sinks in the system to provide heat dissipation; thermal copper pipes, which serve as cold liquid pipelines in the system to drain; and metal thermal blocks, which serve as heat exchangers in the system to exchange heat.

[0022] Furthermore, the heat sink fins are divided into a connecting portion and a heat sink portion, wherein the connecting portion is a block structure cast from copper material, and the heat sink portion is a plurality of copper plates arranged at equal distances, with gaps between the plurality of copper plates.

[0023] The above one or more technical solutions in the microfluidic cooling liquid temperature control and cooling system, method and device provided by the embodiments of the present invention have at least one of the following technical effects:

[0024] First, a micro pump is used to drive the flow of liquid. At this time, the high heat capacity and thermal conductivity of the liquid can absorb and dissipate heat more efficiently. By effectively coordinating components such as metal heat conductive blocks, heat conductive copper tubes and heat sink fins, heat can be quickly and effectively conducted and dissipated from the heat source.

[0025] Secondly, the system is intelligently controlled through the main control module, which can automatically adjust the flow rate of the coolant according to the actual temperature changes to achieve the best heat dissipation effect. The addition of components such as micro temperature sensors, pressure sensors and flow sensors can monitor the system status in real time to ensure stable operation.

[0026] Furthermore, by providing micro liquid pumps of different specifications, the most suitable pump can be selected according to the specific application scenario and needs, thereby improving the flexibility of the system and being applicable to different types of electronic devices, whether large servers or portable devices.

[0027] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 A schematic diagram of the overall structure of a cooling system provided in Embodiment 1 of the present invention;

[0030] Figure 2 A schematic diagram of the structure of the heat-conducting strip of the cooling system provided in the first embodiment of the present invention;

[0031] Figure 3A schematic diagram of the three-dimensional structure of a micro-flow cooling liquid temperature control and cooling device for cooling a portable device provided in the second embodiment of the present invention;

[0032] Figure 4 A schematic diagram of the three-dimensional structure of a microfluidic cooling liquid temperature control and cooling device for use in microelectronics industry or chips provided in the third embodiment of the present invention;

[0033] Figure 5 A specification table of the micro liquid pump provided in the first embodiment of the present invention;

[0034] Among them, the reference numerals in the figure are: 1-main control board; 101-main control module; 101a-micro pressure sensor; 101b-micro flow sensor; 101c-micro temperature sensor; 2-cold liquid pipeline; 201-thermal conductive strip; 202-flexible cold liquid pipe; 203-thermal conductive copper pipe; 3-heat exchange component; 301-water-cooled back cover; 301a-isolation layer; 302-metal thermal block; 4-heat sink; 401-heat sink fins; 402-thermal conductive shell; 5-micro liquid pump; 501-micro flow pump; 502-small flow pump; 503-medium flow pump; 504-large flow pump; 505-ultra-large flow pump. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0036] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0039] like Figure 1-5 As shown, Example 1:

[0040] A micro-fluidic cold liquid temperature control and cooling system comprises: a main control board 1, wherein a main control module 101 is arranged inside the main control board 1; a micro liquid pump 5, wherein the micro liquid pump 5 is connected to the main control module 101 by signal; and cold liquid pipelines 2 are arranged at both ends of the micro liquid pump 5, wherein the two ends of the micro liquid pump 5 are respectively connected to a heat exchange component 3 and a heat sink 4 through the cold liquid pipelines 2.

[0041] During the working process, the main control module 101 is responsible for the control logic of the entire system, realizes the intelligent control of the system, and ensures the stable operation and efficient operation of the system, while the micro liquid pump 5 and the cold liquid pipeline 2 realize the flow of liquid in the system to drive the coolant circulation. During the flow of the cold liquid, the heat exchanger 3 contacts the heat source to absorb heat, effectively reduce the temperature of the heat source, and protect the electronic equipment from damage. At the same time, the heat from the heat exchanger 3 can be dissipated through the heat sink 4, thereby improving the heat dissipation efficiency and keeping the system temperature within a safe range.

[0042] Further, such as Figure 5 As shown in the figure, the micro liquid pump 5 has a variety of different specifications according to the use requirements, including: a micro flow pump 501 with a flow rate of 0 to 3 ml / min, a small flow pump 502 with a flow rate of 0 to 16.5 ml / min, a medium flow pump 503 with a flow rate of 1 to 13 ml / min, a large flow pump 504 with a flow rate of 1 to 22 ml / min, and an ultra-large flow pump 505 with a flow rate of 5 to 292 ml / min.

[0043] The use of micro liquid pumps 5 of various specifications can provide an effective and replaceable power source when dealing with different working scenarios, thereby improving the flexibility and applicability of the entire system.

[0044] Furthermore, micro temperature sensors 101 c are provided inside the heat exchange element 3 and the heat sink 4 , and the micro temperature sensors 101 c are signal-connected to the main control module 101 .

[0045] During use, real-time monitoring of temperature changes ensures that the system operates in the best condition. The temperature sensor can accurately measure the temperature of key parts and help the control system make corresponding adjustments based on the actual temperature conditions.

[0046] Furthermore, a micro pressure sensor 101a is provided inside the cooling liquid pipeline 2 between the heat exchanger 3 and the micro liquid pump 5, and a micro flow sensor 101b is provided inside the cooling liquid pipeline 2 between the heat sink 4 and the micro liquid pump 5, and both the micro pressure sensor 101a and the micro flow sensor 101b are connected to the main control module 101 signal.

[0047] During use, the system's working status can be accurately monitored and the pump's working parameters can be adjusted in time to optimize the cooling effect. By real-time monitoring of pressure and flow rate, the system can be ensured to operate under safe and stable conditions, and the pump's power can be dynamically adjusted as needed.

[0048] Furthermore, a plurality of heat-conducting strips 201 are provided on the inner wall of the cooling liquid pipeline 2, and the plurality of heat-conducting strips 201 are arranged equidistantly. During use, the plurality of heat-conducting strips 201 can increase the contact area between the cooling liquid and the pipeline wall, thereby improving the heat exchange efficiency. The heat-conducting strips can improve the distribution of the cooling liquid in the pipeline, thereby improving the heat exchange efficiency.

[0049] A microfluidic cooling liquid temperature control and cooling method comprises the following steps:

[0050] Step S1: Select a suitable micro liquid pump 5 according to the cooling demand, and connect the micro liquid pump 5, the main control board 1, the heat exchanger 3 and the heat sink 4 through the cold liquid pipeline 2. Select a suitable micro liquid pump 5 according to the actual cooling demand, and connect it with the main control board 1, the heat exchanger 3 and the heat sink 4 through the cold liquid pipeline 2; in Example 2, the flexible cold liquid pipe 202 is used to connect the various components to ensure that the liquid can flow smoothly; in Example 3, the heat conductive copper tube 203 is used as the cold liquid pipeline 2, which is responsible for the transmission of the liquid;

[0051] Step S2: attach the heat exchanger 3 to one side of the heat-generating workpiece. Attach the heat exchanger 3 to one side of the heat-generating workpiece closely to ensure good thermal contact. In Example 2, the water-cooled rear cover 301 is used as the heat exchanger 3 and is directly attached to the heat-generating workpiece. In Example 3, the metal heat-conducting block 302 is in close contact with the heat source to achieve effective heat transfer.

[0052] Step S3: applying power through the micro liquid pump 5 to make the heat transfer liquid flow through the cold liquid pipeline 2 and continuously exchange heat through the heat exchange element 3 and the heat dissipation element 4.

[0053] Furthermore, step S3 also includes:

[0054] Step S31: using the micro temperature sensor 101c to continuously detect the temperature of one side of the heat exchange element 3 and the heat sink 4;

[0055] Step S32: When the temperature difference between the two sides is large, the water flow rate and heat dissipation efficiency are increased by increasing the power of the micro liquid pump 5;

[0056] Step S33: when the temperature difference between the two sides is small, the water flow rate is slowed down by reducing the power of the micro liquid pump 5 to reduce power consumption;

[0057] Step S34: During the continuous cooling process, the water pressure and flow rate of the micro liquid pump 5 are monitored by the micro pressure sensor 101a and the micro flow sensor 101b, so as to assist the main control module 101 in determining whether the cooling rate can meet the standard.

[0058] like Figure 3 As shown, Example 2:

[0059] A micro-fluidic cold liquid temperature control and cooling device is used for cooling portable equipment. The device also includes: a flexible cold liquid pipe 202, which serves as a cold liquid pipeline 2 in the system to provide conductivity; a water-cooled back cover 301, which serves as a heat exchanger 3 in the system; a heat-conducting shell 402, which serves as a heat sink 4 in the system; and an isolation layer 301a, which is made of aerogel material and is located between the water-cooled back cover 301 and the heat-conducting shell 402.

[0060] During use, the user can select a suitable micro liquid pump 5, and connect the micro liquid pump 5, the main control board 1, the water-cooled back cover 301 and the heat-conducting shell 402 through the flexible cold liquid pipe 202, and then fit the water-cooled back cover 301 tightly to one side of the heating workpiece. Then the main control board 1 controls the micro liquid pump 5 to start working, so that the coolant circulates in the flexible cold liquid pipe 202.

[0061] In the process of continuous circulation, the temperature of the water-cooled rear cover 301 is continuously monitored by the micro temperature sensor 101c. When a large temperature difference is detected between the water-cooled rear cover 301 and the heat-conducting housing 402, the main control board 1 increases the power of the micro liquid pump 5 to speed up the flow rate of the coolant, thereby improving the heat dissipation efficiency. When the temperature difference is small, the main control board 1 will reduce the power of the micro liquid pump 5 accordingly, slow down the flow rate of the coolant, and reduce power consumption, thereby effectively achieving continuous temperature control and cooling.

[0062] The isolation layer 301a made of aerogel can effectively absorb moisture and dehumidify. When the cold liquid transports heat, it can prevent external moisture from condensing into water droplets on the surface of the flexible cold liquid pipe 202. At the same time, the flexible cold liquid pipe 202 can cooperate with aerogel to provide stretchability and flexibility, so that the device can improve the practicality of the device.

[0063] like Figure 4 As shown, Example 3:

[0064] A microfluidic cold liquid temperature control and cooling device is used for cooling the microelectronics industry or chips. The device also includes: a heat sink 401, which serves as a heat sink 4 in the system to provide heat dissipation; a heat-conducting copper tube 203, which serves as a cold liquid pipeline 2 in the system for drainage; and a metal heat-conducting block 302, which serves as a heat exchanger 3 in the system for heat exchange.

[0065] During use, microelectronic components or chips will generate heat when working. The metal heat conductive block 302 is in close contact with these heating components and quickly absorbs the generated heat. The metal heat conductive block 302 that has absorbed the heat transfers the heat to the connected heat conductive copper tube 203, and uses the cold liquid to circulate and transfer the heat. At this time, the heat can be quickly conducted along the pipeline. The heat carried by the coolant is dissipated to the surrounding environment through the heat dissipation fins 401. At the same time, the heat dissipation fins 401 are used to increase the contact area with the air, thereby improving the heat dissipation efficiency. By using the above-mentioned process cycle, the chip and other workpieces can be efficiently cooled and controlled. Compared with Example 2, this Example 3 has a more efficient heat dissipation efficiency. For example, the cold liquid pipeline 2 made of copper and the heat dissipation fins 401 are used to dissipate heat, which can effectively reduce the heat of the workpiece.

[0066] Among them, the heat sink fin 401 is divided into a connecting part and a heat dissipation part, wherein the connecting part is a block structure cast from copper material, and the heat dissipation part is a plurality of copper plates arranged at equal distances, and there are gaps between the plurality of copper plates. During use, the block structure cast from copper material can quickly conduct and absorb the heat of the heat-conducting copper tube 203. At the same time, the plurality of copper plates arranged at equal distances can allow the airflow in the environment to pass through the copper plates and take away the heat, thereby allowing the heat to dissipate faster and improving the cooling efficiency.

[0067] From the above three embodiments, it can be found that the present invention provides a cooling system that is applied in the field of tiny workpieces and has a more active effect than traditional passive cooling, and can cooperate with multiple micro liquid pumps 5 to provide a compact and more stable and effective cooling and temperature control system.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro-flow cooling liquid temperature control and cooling system, characterized in that: include: A main control board (1), wherein a main control module (101) is provided inside the main control board (1); A micro liquid pump (5), the micro liquid pump (5) being signal-connected to the main control module (101); Cold liquid pipelines (2) are provided at both ends of the micro liquid pump (5), and the two ends of the micro liquid pump (5) are respectively connected to a heat exchange component (3) and a heat dissipation component (4) through the cold liquid pipelines (2).

2. The micro-fluidic cooling liquid temperature control and cooling system according to claim 1 is characterized in that: The micro liquid pump (5) has a variety of different specifications according to usage requirements, including: a micro flow pump (501) with a flow rate of 0 to 3 ml / min, a small flow pump (502) with a flow rate of 0 to 16.5 ml / min, a medium flow pump (503) with a flow rate of 1 to 13 ml / min, a large flow pump (504) with a flow rate of 1 to 22 ml / min, and an ultra-large flow pump (505) with a flow rate of 5 to 292 ml / min.

3. The micro-flow cooling liquid temperature control and cooling system according to claim 1, characterized in that: The heat exchange element (3) and the heat sink (4) are both provided with micro temperature sensors (101c), and the micro temperature sensors (101c) are connected to the main control module (101) by signal.

4. The micro-fluid cooling liquid temperature control and cooling system according to claim 1, characterized in that: A micro pressure sensor (101a) is provided inside the cooling liquid pipeline (2) between the heat exchange element (3) and the micro liquid pump (5), and a micro flow sensor (101b) is provided inside the cooling liquid pipeline (2) between the heat dissipation element (4) and the micro liquid pump (5), and both the micro pressure sensor (101a) and the micro flow sensor (101b) are connected to the main control module (101) by signal.

5. The micro-fluidic cooling liquid temperature control and cooling system according to claim 1, characterized in that: A plurality of heat-conducting strips (201) are provided on the inner wall of the cold liquid pipeline (2), and the plurality of heat-conducting strips (201) are equidistantly distributed.

6. A microfluidic cooling liquid temperature control and cooling method, characterized in that: The steps include: Step S1: selecting a suitable micro liquid pump (5) according to the cooling requirement, and connecting the micro liquid pump (5), the main control board (1), the heat exchange element (3) and the heat sink (4) through a cooling liquid pipeline (2); Step S2: attaching the heat exchange component (3) to one side of the heat-generating workpiece; Step S3: applying power through the micro liquid pump (5) so that the heat transfer liquid flows through the cold liquid pipeline (2) and continuously exchanges heat through the heat exchange element (3) and the heat dissipation element (4).

7. The microfluidic cooling liquid temperature control and cooling method according to claim 6, characterized in that: The step S3: applying power through a micro liquid pump to make the heat transfer liquid flow through the cold liquid pipeline and continuously exchange heat through the heat exchange element and the heat dissipation element also includes the following steps: Step S31, using a micro temperature sensor (101c) to continuously detect the temperature of one side of the heat exchange element (3) and the heat sink (4); Step S32, when the temperature difference between the two sides is large, the water flow rate and heat dissipation efficiency are increased by increasing the power of the micro liquid pump (5); Step S33, when the temperature difference between the two sides is small, the water flow rate is slowed down by reducing the power of the micro liquid pump (5) to reduce power consumption; Step S34: During the continuous cooling process, the water pressure and flow rate of the micro liquid pump (5) are monitored by the micro pressure sensor (101a) and the micro flow sensor (101b), and the auxiliary main control module (101) determines whether the cooling rate meets the standard.

8. A micro-fluid cooling liquid temperature control and cooling device, characterized in that: Applied to cooling of portable equipment, the device also includes: A flexible cold liquid pipe (202), the flexible cold liquid pipe (202) serves as a cold liquid pipeline (2) in the system to provide conductivity; A water-cooled rear cover (301), the water-cooled rear cover (301) serving as a heat exchange element (3) in the system; A heat-conducting housing (402), the heat-conducting housing (402) serving as a heat sink (4) in the system; An isolation layer (301a), wherein the isolation layer (301a) is made of an aerogel material, and the isolation layer (301a) is located between the water-cooled rear cover (301) and the heat-conducting outer shell (402).

9. The micro-fluid cooling liquid temperature control and cooling device according to claim 8, characterized in that: It can also be applied to the microelectronics industry or the cooling of chips. The device also includes: A heat dissipation fin (401), the heat dissipation fin (401) serving as a heat dissipation element (4) in the system to provide heat dissipation; A heat-conducting copper tube (203), the heat-conducting copper tube (203) serving as a drainage channel for a cold liquid pipeline (2) in the system; A metal heat-conducting block (302), wherein the metal heat-conducting block (302) is used as a heat exchange component (3) in the system to perform heat exchange.

10. The micro-fluidic cooling liquid temperature control and cooling device according to claim 9, characterized in that: The heat dissipation fin (401) is divided into a connecting portion and a heat dissipation portion, wherein the connecting portion is a block structure cast from a copper material, and the heat dissipation portion is a plurality of copper plates arranged at equal intervals, with gaps being provided between the plurality of copper plates.

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