Anti-deflection surface mounting equipment for electronic component manufacturing

Abstract

The invention discloses an anti-deflection surface mounting device for electronic component manufacturing, and relates to the technical field of electronic component production. The device comprises a placing plate, the bottom of the placing plate is fixedly connected with the top of a driving assembly, the side, away from the placing plate, of the driving assembly is slidably connected with the inner side face of a bottom plate, the side, close to the bottom plate, of a transmission assembly is fixedly connected with the top of a stand column, and the end, away from the transmission assembly, of the stand column is fixedly connected with the top of the bottom plate; the side, away from the bottom plate, of the adsorption assembly is slidably connected with the bottom of the transmission assembly, the transmission assembly drives the adsorption assembly to move, the driving assembly drives the placement plate to move, the adsorption assembly can make contact with all positions of the circuit board substrate and conduct surface mounting on all the positions of the circuit board substrate, and the adsorption assembly can adsorb and put down electronic elements. And the transmission assembly is perpendicular to the driving direction of the driving assembly, and is used for attaching each position of the circuit board substrate, so that the surface mounting of various circuit sub-elements is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component production, and in particular to an anti-bias patch device for manufacturing electronic components. Background Art

[0002] In the processing of circuit boards, a placement machine is needed. As an important part of the production line, the placement device can automatically correct the position of the components after the nozzle in the placement head picks up the components under the control of the correction system, and accurately place the components on the circuit board in the specified position. Since electronic components are of different sizes, when fixing them, they need to be mounted on the surface of the circuit board substrate and then glued or welded. Since electronic components need to be mounted at various positions on the substrate, the substrate or electronic components need to be driven to move. When moving, the electronic components and the circuit board substrate are prone to deviation, so we proposed an anti-deflection mounting device for the manufacture of electronic components. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides an anti-deflection patch device for manufacturing electronic components, comprising: A base plate, and support legs disposed at the bottom of the base plate; A patch mechanism, the patch mechanism having an adsorption structure for adsorbing electronic components; The bottom of the bottom plate is fixedly connected to the top of the supporting leg, and the bottom of the patch mechanism is fixedly connected to the side of the bottom plate away from the supporting leg. Wherein, the patch mechanism comprises: A placement plate, the placement plate is arranged on the top of the bottom plate, and a drive assembly is arranged on the bottom of the placement plate; A transmission assembly, which is arranged just above the placement plate, and a column arranged at the bottom of the transmission assembly; A suction component, the suction component has a pneumatic structure and is used for vacuum suction of electronic components; The bottom of the placement plate is fixedly connected to the top of the driving component, and the side of the driving component away from the placement plate is slidably connected to the inner side of the bottom plate, the side of the transmission component close to the bottom plate is fixedly connected to the top of the column, and one end of the column away from the transmission component is fixedly connected to the top of the bottom plate, and the side of the adsorption component away from the bottom plate is slidably connected to the bottom of the transmission component. The substrate of the circuit board is placed on the top of the placement plate, and the electronic components are adsorbed on the bottom of the adsorption component. The transmission component drives the adsorption component to move, and the driving component drives the placement plate to move, so that the adsorption component can contact various positions of the circuit board substrate, so as to perform patching on various positions of the circuit board substrate, and glue or weld it after the patching is completed, so as to avoid deviation after the patching. The adsorption component can adsorb and put down the electronic components, and the transmission component is perpendicular to the driving direction of the driving component, and can be attached to various positions of the circuit board substrate to ensure the patching of various circuit components.

[0004] Furthermore, several supporting legs are arranged on the side of the bottom plate away from the placement plate, and several columns are arranged on the side of the bottom plate away from the supporting legs. The several columns can evenly support the transmission assembly to prevent the transmission assembly from shaking.

[0005] Furthermore, the transmission assembly includes a frame, which is arranged on a side of the column away from the base plate, and a plurality of the sides of the columns away from the base plate are fixedly connected to a side of the frame close to the base plate, the inner side surface of the frame is fixedly connected with a first CNC slide, and the first CNC slide is arranged in an L-shape, four first CNC slides are arranged inside the frame, a slider is slidably connected inside the first CNC slide, and the first CNC slide drives the slider to slide inside the first CNC slide, and the side of the slider away from the first CNC slide is fixedly connected to a side of the adsorption assembly away from the base plate, the first CNC slide drives the slider to move, driving the adsorption assembly to move, and since the first CNC slide is arranged in an L-shape, it can drive the slider to move in an L-shaped trajectory, and the movement trajectories of the four first CNC slides can roughly cover the top of the entire placement plate, so that various positions of the circuit board substrate can be patched, and in conjunction with the driving assembly, the top of the entire placement plate can be covered to ensure the patching of the entire circuit board substrate, thereby ensuring the patching of various electronic components.

[0006] Furthermore, the adsorption assembly includes a telescopic rotating rod, which is fixedly connected to a side of the slider away from the first CNC slide, and a cylinder is provided on the side of the telescopic rotating rod away from the slider, and the inner wall of the cylinder is fixedly connected to the surface of the telescopic rotating rod, and a tube body is fixedly connected to the surface of the tube body, and the tube body is provided with several tube bodies along the circumference of the tube body, and one end of the tube body away from the telescopic rotating rod is fixedly connected to a suction cup, so that the electronic component is adsorbed to the bottom of the suction cup, and the rotation of the telescopic rotating rod is started, and the telescopic rotating rod is extended and retracted, driving the cylinder body, the tube body, and the suction cup to move, thereby driving the motor element to contact the top of the circuit board substrate, thereby completing the attachment, and the telescopic rotating rod rotates, driving several tube bodies, cylinder bodies, tube bodies, and suction cups to rotate, thereby changing different electronic components for adsorption, so that the telescopic rotating rod does not need to be extended and retracted again to complete another patch, thereby avoiding large vibrations caused by multiple extensions and retractions, thereby avoiding the displacement of the circuit board substrate and electronic components due to vibration.

[0007] Furthermore, a branch pipe is fixedly connected to a side of the tube body close to the cylinder body, an end of the branch pipe away from the tube body extends to the inside of the cylinder body, and the surface of the branch pipe is fixedly connected to the inner side surface of the cylinder body, an end of the branch pipe located inside the cylinder body is fixedly connected to a guide pipe 8, an end of the guide pipe 8 is fixedly connected to the top of the inner side surface of the cylinder body, an end of the guide pipe 8 close to the placement plate is fixedly connected to a vacuum pump, and a side of the vacuum pump away from the guide pipe 8 is fixedly connected to an air pipe 7, the vacuum pump is started, air enters the tube body from the inside of the suction cup, and then enters the branch pipe, and then passes through the guide pipe 8, the vacuum pump, and the air pipe 7 in sequence, and then air is ejected from the air pipe 7, the air pressure inside the suction cup is reduced, so that the electronic components are adsorbed, and then the vacuum pump is turned off. At the same time, the air ejected from the air pipe 7 can blow on the top of the circuit board substrate, so as to blow off the dust on its surface. During fine patch placement, dust is prevented from affecting the patch, and dust cleaning can be completed while adsorbing electronic components.

[0008] Furthermore, there are several suction cups, and the center positions of the several suction cups are the same, and the closer the suction cup is to the tube body, the shorter the distance between the suction cup and the tube body, that is, the inner suction cup is located inside the outer suction cup, so that the suction cup can adsorb electronic components of different sizes.

[0009] Furthermore, a column 9 is provided inside the innermost suction cup, and a connecting rod is fixedly connected to the surface of the column 9, and the end of the connecting rod away from the column 9 passes through several suction cups in sequence, and the end of the connecting rod away from the column 9 is fixedly connected to the inner side of the outermost suction cup, and a protrusion is fixedly connected to the side of the column 9 away from the tube body, and the protrusion does not coincide with the axis of the column 9. When the electronic component contacts the circuit board substrate, the suction cup is squeezed and deformed. When the electronic component contacts the protrusion, the column 9 is deflected, the connecting rod is deflected, and all the suction cups are deformed, thereby generating a gap between the electronic component and the electronic component, and the negative pressure is eliminated. The patch can be completed when the electronic component contacts the circuit board substrate, avoiding adhesion between the suction cup and the electronic component, and avoiding displacement after the patch. Then the vacuum pump is started again for the next adsorption.

[0010] Furthermore, a rubber pad is fixedly connected to one side of the placement plate away from the bottom plate, and the rubber pads are arranged in several groups along the circumference of the placement plate, and the number of the rubber pads in each group is set to be several. The circuit board substrate contacts the rubber pads and the rubber pads are deformed. The rubber pads can increase the friction between the rubber pads and the circuit board substrate, thereby preventing the circuit board substrate from shaking when the driving component drives the placement plate to move, and preventing the circuit board substrate from offset.

[0011] Furthermore, the driving assembly includes a second CNC slide, the top of the second CNC slide is slidably connected to the side of the placement plate away from the rubber pad, the output end of the second CNC slide is fixedly connected to the side of the placement plate away from the rubber pad, the second CNC slide drives the placement plate to reciprocate in one direction, thereby cooperating with the first CNC slide to perform patching on the entire circuit board substrate, connecting plates are symmetrically arranged on both sides of the second CNC slide, the surface of the connecting plate is fixedly connected to the side of the placement plate away from the rubber pad, a sliding rod is arranged on the side of the connecting plate away from the second CNC slide, the inner side surface of the connecting plate is slidably connected to the surface of the second CNC slide, and the two sides of the connecting plate are fixedly connected with a first spring, and one end of the first spring away from the connecting plate is fixedly connected to the surface of the sliding rod. The placement plate moves, driving the connecting plate to slide on the surface of the sliding rod and driving the first spring to deform, and the sliding rod cooperates with the connecting plate to limit the placement plate to prevent the placement plate from shaking, thereby ensuring the smooth movement of the placement plate, and the first spring is expanded and contracted to buffer the placement plate, thereby further preventing shaking and preventing the circuit board substrate at the top of the placement plate from offsetting.

[0012] Furthermore, the second CNC slide is fixedly connected to a plate body on one side away from the placement plate, and the plate body is fixedly connected to a limiting column 7 on one side away from the second CNC slide, and a plurality of limiting columns 7 are provided, and one end of the plurality of limiting columns 7 away from the plate body passes through the bottom plate and is slidably connected to the inner side surface of the bottom plate, and a second spring 8 is sleeved on the outside of the limiting column 7 located at the center of the plate body, and the second spring 8 is fixedly connected to the side of the bottom plate away from the plate body, and one end of the second spring 8 away from the bottom plate is fixedly connected to the limiting plate 9. The surface of the limit plate 9 is fixedly connected to the end of the limit column 7 away from the plate body. The electronic component contacts the circuit board substrate. The substrate moves, driving the placement plate to move, driving the second CNC slide, the plate body, the limit column 7, and the limit plate 9 to move. The limit column 7 slides inside the bottom plate to stretch the second spring 8, thereby generating a buffer during patch placement to prevent the circuit board substrate from being damaged by excessive squeezing. At the same time, several limit columns 7 limit the plate body to prevent the plate body, the second CNC slide, and the placement plate from shaking, and to prevent the circuit board substrate from deviating.

[0013] The present invention has the beneficial effects: The present invention sets a patch mechanism, a transmission component drives the adsorption component to move, and a driving component drives the placement plate to move, so that the adsorption component can contact various positions of the circuit board substrate, so as to perform patching on various positions of the circuit board substrate, and after the patching is completed, it is glued or welded to avoid deviation after the patching, the adsorption component can adsorb and put down the electronic components, the transmission component is perpendicular to the driving direction of the driving component, and can attach to various positions of the circuit board substrate, thereby ensuring the patching of various circuit sub-components.

[0014] The present invention sets a transmission component. Since the first CNC slide is set in an L shape, it can drive the slider to move in an L-shaped trajectory. The movement trajectory of the four first CNC slides can roughly cover the top of the entire placement plate, so that various positions of the circuit board substrate can be patched. In conjunction with the driving component, the top of the entire placement plate can be covered, ensuring the patching of the top of the entire circuit board substrate, thereby ensuring the patching of various electronic components.

[0015] The present invention arranges an adsorption component to drive the motor element to contact the top of the circuit board substrate, thereby completing the attachment. The telescopic rotating rod rotates to drive a plurality of tube bodies, cylinder bodies, tube bodies, and suction cups to rotate, thereby replacing different electronic components for adsorption, so that the telescopic rotating rod does not need to be retracted again to complete another patch, thereby avoiding large vibrations caused by multiple extensions and retractions, thereby avoiding the circuit board substrate and electronic components from being offset due to vibration.

[0016] The present invention arranges a suction cup to reduce the air pressure inside the suction cup, thereby adsorbing the electronic component, and then turns off the vacuum pump. At the same time, the air ejected from the air pipe 7 can blow the top of the circuit board substrate, thereby blowing off the dust on the surface thereof. During fine patch placement, the dust is prevented from affecting the patch, and the dust can be cleaned while adsorbing the electronic component. The inner suction cup is located inside the outer suction cup, so that the suction cup can adsorb electronic components of different sizes. The connecting rod deflects, driving all the suction cups to deform, thereby generating a gap between the suction cups and the electronic component, eliminating the negative pressure, and completing the patch placement when the electronic component contacts the circuit board substrate, thereby preventing the suction cup from sticking to the electronic component and preventing the patch from shifting after placement.

[0017] The present invention sets a driving component, and the sliding rod cooperates with the connecting plate to limit the placement plate to avoid shaking of the placement plate, thereby ensuring smooth movement of the placement plate. The first spring is expanded and contracted to buffer the placement plate, thereby further avoiding shaking and preventing the circuit board substrate on the top of the placement plate from shifting. The limiting column 7 slides inside the bottom plate to stretch the second spring 8, thereby generating a buffer during patch placement and preventing the circuit board substrate from being damaged by excessive squeezing. At the same time, a number of limiting columns 7 limit the plate body to avoid shaking of the plate body, the second CNC slide, and the placement plate, and preventing the circuit board substrate from shifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of an anti-bias patch device for manufacturing electronic components of the present invention; Figure 2 It is a schematic diagram of the structure of the patch mechanism of the present invention; Figure 3 It is a schematic diagram of the structure of the transmission assembly of the present invention; Figure 4 This is a schematic diagram of the structure of the adsorption component of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of the cylinder of the present invention; Figure 6 This is a schematic diagram of the suction cup structure of the present invention; Figure 7 It is a schematic diagram of the gasket structure of the present invention; Figure 8 It is a schematic diagram of the structure of the driving component of the present invention.

[0019] In the figure: 1. bottom plate; 2. supporting leg; 3. patch mechanism; 31. placement plate; 32. transmission assembly; 321. frame; 322. first CNC slide; 323. slider; 33. column; 34. adsorption assembly; 341. telescopic rotating rod; 342. cylinder; 343. branch pipe; 344. tube body; 345. suction cup; 346. vacuum pump; 347. air pipe; 348. guide pipe; 349. column; 3410. connecting rod; 3411. bump; 35. rubber pad; 36. driving assembly; 362. second CNC slide; 363. slider; 364. connecting plate; 365. first spring; 366. plate body; 367. limit column; 368. second spring; 369. limit plate. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0021] Example 1, please refer to Figure 1-Figure 6 The present invention is an anti-bias patch device for manufacturing electronic components, comprising: A base plate 1, and a supporting leg 2 arranged at the bottom of the base plate 1; The patch mechanism 3 has an adsorption structure for adsorbing electronic components; The bottom of the bottom plate 1 is fixedly connected to the top of the support leg 2, and the bottom of the patch mechanism 3 is fixedly connected to the side of the bottom plate 1 away from the support leg 2. Among them, the patch mechanism 3 includes: A placement plate 31, which is disposed on the top of the bottom plate 1, and a driving assembly 36 disposed at the bottom of the placement plate 31; A transmission assembly 32, which is disposed directly above the placement plate 31, and a column 33 disposed at the bottom of the transmission assembly 32; A suction component 34, the suction component 34 has a pneumatic structure and is used for vacuum suction of electronic components; The bottom of the placement plate 31 is fixedly connected to the top of the driving component 36, and the side of the driving component 36 away from the placement plate 31 is slidably connected to the inner side of the bottom plate 1. The side of the transmission component 32 close to the bottom plate 1 is fixedly connected to the top of the column 33, and one end of the column 33 away from the transmission component 32 is fixedly connected to the top of the bottom plate 1. The side of the adsorption component 34 away from the bottom plate 1 is slidably connected to the bottom of the transmission component 32. The substrate of the circuit board is placed on the top of the placement plate 31, and the electronic components are adsorbed on the bottom of the adsorption component 34. The transmission component 32 drives the adsorption component 34 to move, and the driving component 36 drives the placement plate 31 to move, so that the adsorption component 34 can contact various positions of the circuit board substrate, so as to perform patching on various positions of the circuit board substrate, and after the patching is completed, it is glued or welded to avoid offset after the patching. The adsorption component 34 can adsorb and put down the electronic components. The transmission component 32 is perpendicular to the driving direction of the driving component 36, and can be attached to various positions of the circuit board substrate to ensure the patching of various circuit sub-components.

[0022] Several support legs 2 are arranged on the side of the base plate 1 away from the placement plate 31, and several columns 33 are arranged on the side of the base plate 1 away from the support legs 2. The several columns 33 can evenly support the transmission assembly 32 to prevent the transmission assembly 32 from shaking.

[0023] The transmission assembly 32 includes a frame 321, which is arranged on a side of the column 33 away from the bottom plate 1, and the side of the plurality of columns 33 away from the bottom plate 1 is fixedly connected to the side of the frame 321 close to the bottom plate 1, and the inner side of the frame 321 is fixedly connected with a first CNC slide 322, and the first CNC slide 322 is arranged in an L shape, and four first CNC slides 322 are arranged inside the frame 321, and the first CNC slide 322 is slidably connected with a slider 323 inside, and the first CNC slide 322 drives the slider 323 to slide inside the first CNC slide 322, and the slider 323 is away from the first CNC slide One side of the platform 322 is fixedly connected to the side of the adsorption component 34 away from the bottom plate 1. The first CNC slide 322 drives the slider 323 to move, thereby driving the adsorption component 34 to move. Since the first CNC slide 322 is set to be L-shaped, it can drive the slider 323 to move in an L-shaped trajectory. The movement trajectory of the four first CNC slides 322 can roughly cover the top of the entire placement plate 31, so that various positions of the circuit board substrate can be patched. In conjunction with the driving component 36, the top of the entire placement plate 31 can be covered to ensure the patching of the top of the entire circuit board substrate, thereby ensuring the patching of various electronic components.

[0024] The adsorption assembly 34 includes a telescopic rotating rod 341, which is fixedly connected to the side of the slider 323 away from the first CNC slide 322. A cylinder 342 is provided on the side of the telescopic rotating rod 341 away from the slider 323. The inner wall of the cylinder 342 is fixedly connected to the surface of the telescopic rotating rod 341. A tube 344 is fixedly connected to the surface of the cylinder 342, and a plurality of tubes 344 are provided along the circumference of the cylinder 342. A suction cup 345 is fixedly connected to one end of the tube 344 away from the telescopic rotating rod 341, and the electronic component is adsorbed to the bottom of the suction cup 345 to start The telescopic rotating rod 341 is rotated and extended, driving the cylinder 342, the tube 344, and the suction cup 345 to move, thereby driving the motor element to contact the top of the circuit board substrate, thereby completing the attachment. The telescopic rotating rod 341 rotates, driving several tubes 344, the cylinder 342, the tube 344, and the suction cup 345 to rotate, thereby replacing different electronic components for adsorption, so that the telescopic rotating rod 341 does not need to be extended and retracted again to complete another patch, thereby avoiding large vibrations caused by multiple extensions and retractions, thereby avoiding the circuit board substrate and electronic components from being offset due to vibration.

[0025] A branch pipe 343 is fixedly connected to one side of the tube body 344 close to the cylinder body 342, and one end of the branch pipe 343 away from the tube body 344 extends to the inside of the cylinder body 342, and the surface of the branch pipe 343 is fixedly connected to the inner side of the cylinder body 342, and one end of the branch pipe 343 located inside the cylinder body 342 is fixedly connected to a guide pipe 348, and the end of the guide pipe 348 is fixedly connected to the top of the inner side of the cylinder body 342, and the end of the guide pipe 348 close to the placement plate 31 is fixedly connected to a vacuum pump 346, and the side of the vacuum pump 346 away from the guide pipe 348 is fixedly connected to an air pipe 347, The vacuum pump 346 is activated, and air enters the tube body 344 from the inside of the suction cup 345, and then enters the branch pipe 343, and then passes through the guide pipe 348, the vacuum pump 346, and the air pipe 347 in sequence, and then the air is ejected from the air pipe 347. The air pressure inside the suction cup 345 is reduced, so that the electronic components are adsorbed, and then the vacuum pump 346 is turned off. At the same time, the air ejected from the air pipe 347 can blow on the top of the circuit board substrate, so as to blow off the dust on its surface. This can prevent dust from affecting the patch during fine patch placement, and can complete dust cleaning while adsorbing electronic components.

[0026] There are several suction cups 345, and the center positions of the several suction cups 345 are the same, and the closer the suction cup 345 is to the tube body 344, the shorter the distance between the tube body 344, that is, the inner suction cup 345 is located inside the outer suction cup 345, so that the suction cup 345 can adsorb electronic components of different sizes.

[0027] A column 349 is provided inside the innermost suction cup 345, and a connecting rod 3410 is fixedly connected to the surface of the column 349, and the end of the connecting rod 3410 away from the column 349 passes through several suction cups 345 in sequence, and the end of the connecting rod 3410 away from the column 349 is fixedly connected to the inner side of the outermost suction cup 345, and a protrusion 3411 is fixedly connected to the side of the column 349 away from the tube body 344, and the protrusion 3411 does not coincide with the axis of the column 349. When the electronic component contacts the circuit board substrate, the suction cup 345 is squeezed and deformed. When the electronic component contacts the protrusion 3411, the column 349 is deflected, the connecting rod 3410 is deflected, and all the suction cups 345 are deformed, thereby generating a gap between the electronic component and the electronic component, and the negative pressure is eliminated. The patch can be completed when the electronic component contacts the circuit board substrate, avoiding adhesion between the suction cup 345 and the electronic component, and avoiding displacement after the patch. Then the vacuum pump 346 is started again for the next adsorption.

[0028] Example 2, please refer to Figure 1-Figure 8 A rubber pad 35 is fixedly connected to one side of the placement plate 31 away from the bottom plate 1. Several groups of rubber pads 35 are arranged along the circumference of the placement plate 31, and the number of rubber pads 35 in each group is set to a certain number. The circuit board substrate contacts the rubber pad 35, and the rubber pad 35 is deformed. The rubber pad 35 can increase the friction between the rubber pad 35 and the circuit board substrate, thereby preventing the circuit board substrate from shaking when the driving component 36 drives the placement plate 31 to move, and preventing the circuit board substrate from offset.

[0029] The driving assembly 36 includes a second CNC slide 362, the top of the second CNC slide 362 is slidably connected to the side of the placement plate 31 away from the rubber pad 35, the output end of the second CNC slide 362 is fixedly connected to the side of the placement plate 31 away from the rubber pad 35, the second CNC slide 362 drives the placement plate 31 to reciprocate in one direction, so as to cooperate with the first CNC slide 322 to mount the entire circuit board substrate, and the second CNC slide 362 is symmetrically provided with connecting plates 364 on both sides, the surface of the connecting plate 364 is fixedly connected to the side of the placement plate 31 away from the rubber pad 35, and the side of the connecting plate 364 away from the second CNC slide 362 is provided with a sliding rod 363, and the inner The side surface is slidably connected to the surface of the second CNC slide 362, and the first spring 365 is fixedly connected to both sides of the connecting plate 364. The end of the first spring 365 away from the connecting plate 364 is fixedly connected to the surface of the slide bar 363. The placement plate 31 moves, driving the connecting plate 364 to slide on the surface of the slide bar 363, and driving the first spring 365 to deform. The slide bar 363 cooperates with the connecting plate 364 to limit the placement plate 31 to prevent the placement plate 31 from shaking, thereby ensuring the smooth movement of the placement plate 31. The first spring 365 is retracted and can buffer the placement plate 31, thereby further avoiding shaking and preventing the circuit board substrate on the top of the placement plate 31 from offset.

[0030] A plate body 366 is fixedly connected to the side of the second numerical control slide 362 away from the placement plate 31, and a limiting column 367 is fixedly connected to the side of the plate body 366 away from the second numerical control slide 362, and a plurality of limiting columns 367 are provided, and one end of the plurality of limiting columns 367 away from the plate body 366 passes through the bottom plate 1 and is slidably connected to the inner side surface of the bottom plate 1, and a second spring 368 is sleeved on the outside of the limiting column 367 located at the center of the plate body 366, and the second spring 368 is fixedly connected to the side of the bottom plate 1 away from the plate body 366, and the end of the second spring 368 away from the bottom plate 1 is fixedly connected to the limiting plate 369, and the limiting plate 36 The surface of 9 is fixedly connected to the end of the limit column 367 away from the plate body 366, the electronic component contacts the circuit board substrate, the substrate moves, driving the placement plate 31 to move, driving the second CNC slide 362, the plate body 366, the limit column 367, and the limit plate 369 to move, the limit column 367 slides inside the bottom plate 1, stretches the second spring 368, thereby generating a buffer during patch placement to prevent the circuit board substrate from being damaged by excessive squeezing. At the same time, several limit columns 367 limit the plate body 366 to prevent the plate body 366, the second CNC slide 362, and the placement plate 31 from shaking, and the circuit board substrate from deflecting.

[0031] When in use, the substrate of the circuit board is placed on the top of the placement plate 31, the substrate of the circuit board contacts the rubber pad 35, the rubber pad 35 is deformed, the vacuum pump 346 is started, and air enters the tube body 344 from the inside of the suction cup 345, and then enters the branch pipe 343, and then passes through the guide pipe 348, the vacuum pump 346, and the air pipe 347 in sequence, and then the air is ejected from the air pipe 347, the air pressure inside the suction cup 345 is reduced, so that the electronic component is adsorbed, and the rotation of the telescopic rotating rod 341 is started, and the telescopic rotating rod 341 is extended and retracted, driving the cylinder body 342, the tube body 344, and the suction cup 345 to move, thereby driving the motor element to contact the top of the circuit board substrate, so as to complete the attachment, and the telescopic rotating rod 341 rotates, bringing Drive several tube bodies 344, cylinder bodies 342, tube bodies 344, and suction cups 345 to rotate, and then turn off the vacuum pump 346. The first CNC slide 322 drives the slider 323 to move, driving the adsorption component 34 to move, and the second CNC slide 362 drives the placement plate 31 to move back and forth in one direction, thereby driving the electronic components and the circuit board substrate to move respectively, so as to complete the patch at each position. The electronic components contact the circuit board substrate, and the substrate moves, driving the placement plate 31 to move, driving the second CNC slide 362, plate body 366, limit column 367, and limit plate 369 to move. The limit column 367 slides inside the bottom plate 1 to stretch the second spring 368, thereby generating a buffer during the patch.

[0032] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An anti-bias patch device for manufacturing electronic components, characterized in that: include: A base plate (1), and supporting legs (2) arranged at the bottom of the base plate (1); A patch mechanism (3), the patch mechanism (3) having an adsorption structure for adsorbing electronic components; The bottom of the base plate (1) is fixedly connected to the top of the support leg (2), and the bottom of the patch mechanism (3) is fixedly connected to a side of the base plate (1) away from the support leg (2). Wherein, the patch mechanism (3) comprises: A placement plate (31), the placement plate (31) being arranged on the top of the bottom plate (1), and a drive assembly (36) being arranged on the bottom of the placement plate (31); A transmission assembly (32), the transmission assembly (32) being arranged directly above the placement plate (31), and a column (33) being arranged at the bottom of the transmission assembly (32); A suction component (34), the suction component (34) having a pneumatic structure and used for vacuum suction of electronic components; The bottom of the placement plate (31) is fixedly connected to the top of the driving assembly (36); the side of the driving assembly (36) away from the placement plate (31) is slidably connected to the inner side surface of the bottom plate (1); the side of the transmission assembly (32) close to the bottom plate (1) is fixedly connected to the top of the column (33); the end of the column (33) away from the transmission assembly (32) is fixedly connected to the top of the bottom plate (1); and the side of the adsorption assembly (34) away from the bottom plate (1) is slidably connected to the bottom of the transmission assembly (32).

2. The anti-deflection patch device for manufacturing electronic components according to claim 1, characterized in that: A plurality of the supporting legs (2) are arranged on a side of the bottom plate (1) away from the placement plate (31), and a plurality of the upright posts (33) are arranged on a side of the bottom plate (1) away from the supporting legs (2).

3. The anti-deflection patch device for manufacturing electronic components according to claim 2, characterized in that: The transmission assembly (32) includes a frame (321), wherein the frame (321) is arranged on a side of the column (33) away from the base plate (1), and the sides of several of the columns (33) away from the base plate (1) are fixedly connected to the side of the frame (321) close to the base plate (1), and the inner side surface of the frame (321) is fixedly connected to a first CNC slide (322), and the first CNC slide (322) is arranged in an L shape. Four first CNC slides (322) are arranged inside the frame (321), and the first CNC slide (322) is slidably connected to a slider (323) inside the first CNC slide (322), and the first CNC slide (322) drives the slider (323) to slide inside the first CNC slide (322), and the side of the slider (323) away from the first CNC slide (322) is fixedly connected to the side of the adsorption assembly (34) away from the base plate (1).

4. The anti-deflection patch device for manufacturing electronic components according to claim 3, characterized in that: The adsorption assembly (34) includes a telescopic rotating rod (341), the telescopic rotating rod (341) is fixedly connected to the side of the slider (323) away from the first CNC slide (322), a cylinder (342) is provided on the side of the telescopic rotating rod (341) away from the slider (323), the inner wall of the cylinder (342) is fixedly connected to the surface of the telescopic rotating rod (341), the surface of the cylinder (342) is fixedly connected to a tube (344), and a plurality of tubes (344) are provided along the circumference of the cylinder (342), and one end of the tube (344) away from the telescopic rotating rod (341) is fixedly connected to a suction cup (345).

5. The anti-deflection patch device for manufacturing electronic components according to claim 4, characterized in that: A branch pipe (343) is fixedly connected to a side of the tube body (344) close to the cylinder body (342); an end of the branch pipe (343) away from the tube body (344) extends into the interior of the cylinder body (342); a surface of the branch pipe (343) is fixedly connected to an inner side surface of the cylinder body (342); an end of the branch pipe (343) located inside the cylinder body (342) is fixedly connected to a flow guide pipe (348); an end of the flow guide pipe (348) is fixedly connected to the top of the inner side surface of the cylinder body (342); an end of the flow guide pipe (348) close to the placement plate (31) is fixedly connected to a vacuum pump (346); and a side of the vacuum pump (346) away from the flow guide pipe (348) is fixedly connected to an air pipe (347).

6. The anti-deflection patch device for manufacturing electronic components according to claim 5, characterized in that: A plurality of suction cups (345) are provided, and the center positions of the plurality of suction cups (345) are the same, and the closer the suction cup (345) is to the tube body (344), the shorter the distance between the tube body (344) and the suction cup (345).

7. The anti-deflection patch device for manufacturing electronic components according to claim 6, characterized in that: A column (349) is arranged inside the innermost suction cup (345), and a connecting rod (3410) is fixedly connected to the surface of the column (349), and an end of the connecting rod (3410) away from the column (349) passes through a plurality of suction cups (345) in sequence, and an end of the connecting rod (3410) away from the column (349) is fixedly connected to the inner side surface of the outermost suction cup (345), and a protrusion (3411) is fixedly connected to the side of the column (349) away from the tube body (344), and the axis of the protrusion (3411) does not coincide with the axis of the column (349).

8. The anti-deflection patch device for manufacturing electronic components according to claim 7, characterized in that: A rubber pad (35) is fixedly connected to one side of the placement plate (31) away from the bottom plate (1), and a plurality of groups of the rubber pads (35) are arranged along the circumference of the placement plate (31), and a plurality of rubber pads (35) are arranged in each group.

9. The anti-deflection patch device for manufacturing electronic components according to claim 8, characterized in that: The driving assembly (36) comprises a second numerical control slide (362), the top of the second numerical control slide (362) being slidably connected to a side of the placement plate (31) away from the rubber pad (35), the output end of the second numerical control slide (362) being fixedly connected to a side of the placement plate (31) away from the rubber pad (35), connecting plates (364) being symmetrically arranged on both sides of the second numerical control slide (362), the surface of the connecting plate (364) being fixedly connected to a side of the placement plate (31) away from the rubber pad (35), a sliding rod (363) being arranged on a side of the connecting plate (364) away from the second numerical control slide (362), the inner side surface of the connecting plate (364) being slidably connected to the surface of the second numerical control slide (362), and first springs (365) being fixedly connected to both sides of the connecting plate (364), and one end of the first spring (365) away from the connecting plate (364) being fixedly connected to the surface of the sliding rod (363).

10. The anti-deflection patch device for manufacturing electronic components according to claim 9, characterized in that: A side of the second numerical control slide (362) away from the placement plate (31) is fixedly connected to a plate body (366), and a side of the plate body (366) away from the second numerical control slide (362) is fixedly connected to a limiting column (367), and a plurality of limiting columns (367) are provided, and one end of the plurality of limiting columns (367) away from the plate body (366) passes through the bottom plate (1) and is slidably connected to the inner side surface of the bottom plate (1), and a second spring (368) is sleeved on the outside of the limiting column (367) located at the center of the plate body (366), and the second spring (368) is fixedly connected to a side of the bottom plate (1) away from the plate body (366), and one end of the second spring (368) away from the bottom plate (1) is fixedly connected to a limiting plate (369), and a surface of the limiting plate (369) is fixedly connected to one end of the limiting column (367) away from the plate body (366).

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