Recycled polishing solution filtering device based on polishing machine and control method thereof

Abstract

The invention relates to a recycled polishing solution filtering device based on a polishing machine and a control method of the recycled polishing solution filtering device, and belongs to the technical field of polishing solution recycling and filtering equipment.The recycled polishing solution filtering device comprises a filtering box body, a waste solution recycling pipe communicated with the filtering box body is arranged on the upper portion of the filtering box body, and a slag discharging notch is formed in the middle of the filtering box body; a residue collecting box communicated with the residue discharging notch is arranged on the outer side of the filtering box body, an inclined filter screen I is arranged between the lower end of the waste liquid recycling pipe and the residue discharging notch, a recycling pump is arranged on the lower portion of the filtering box body, and a recycling pipe communicated with the recycling pump through a pipeline is arranged on the outer side of the filtering box body. And a pump suction filter element is arranged at the front end of the recovery pump. The device has the characteristics of compact structure, good filtering effect and good operation stability. The problem that solid particles exist in waste liquid is solved. And the polishing solution is recycled after being filtered, and meanwhile, the filtered silicon slag is automatically discharged.

Description

Technical Field

[0001] The invention relates to the technical field of polishing liquid recovery and filtering equipment, and in particular to a polishing liquid recovery and filtering device based on a polishing machine and a control method thereof. Background Art

[0002] Chemical mechanical polishing (CMP) includes mechanical polishing with abrasives and chemical action of polishing liquid. It requires the use of chemical polishing liquid to produce a chemical reaction on the wafer and perform wafer flattening processing through a grinding process.

[0003] Polishing liquid is a water-soluble polishing agent that does not contain any sulfur, phosphorus, or chlorine additives. It has good degreasing, rust-proof, cleaning, and gloss-enhancing properties, and can make metal products show a true metallic luster. It has the advantages of stable performance, non-toxicity, and no pollution to the environment. In the process of preparing the polishing liquid, waste liquid will be generated, and at this time, a recovery device is needed to recycle it. Summary of the invention

[0004] The present invention mainly solves the deficiencies in the prior art and provides a polishing liquid recovery filtering device based on a polishing machine and a control method thereof, which has the characteristics of compact structure, good filtering effect and good operation stability. The problem of solid particles in the waste liquid is solved. The polishing liquid is reused after filtering, and the filtered silicon slag realizes an automatic slag discharge process.

[0005] The above technical problems of the present invention are mainly solved by the following technical solutions: A polishing liquid recovery filtering device based on a polishing machine comprises a filter box, a waste liquid recovery pipe connected to the filter box is provided on the upper part of the filter box, a slag discharge slot is provided in the middle part of the filter box, a slag collection box connected to the slag discharge slot is provided on the outside of the filter box, an inclined filter screen I is provided between the lower end of the waste liquid recovery pipe and the slag discharge slot, a recovery pump is provided at the lower part of the filter box, a return pipe connected to the recovery pump is provided on the outside of the filter box, and a pump suction filter element is provided at the front end of the recovery pump.

[0006] Preferably, a sewage pipe is provided at the lower end of the filter box, and a pneumatic ball valve is provided on the sewage pipe.

[0007] Preferably, a telescopic rod is provided below the recovery pump, a telescopic cylinder is provided on the outside of the filter box and is piston-slidably connected to the telescopic rod, and a bracket is provided between the lower end of the telescopic cylinder and the filter box.

[0008] Preferably, a linear bearing nested with the telescopic rod is provided between the telescopic rod and the filter box, and a sealing ring nested with the telescopic rod and the filter box is provided at the rear end of the linear bearing.

[0009] Preferably, a filter screen II is provided at the lower end of the slag collecting box and the lower part of the filter box body.

[0010] A control method for recovering a polishing liquid filter device comprises the following steps: Step 1: The polishing waste liquid after silicon wafer grinding is transported to the filter box through the waste liquid recovery pipe.

[0011] Step 2: Under the action of the inclined filter mesh I, the polishing liquid is filtered and remains in the filter box, and the silicon slag is discharged from the slag discharge slot into the slag collection box under the flushing of the liquid.

[0012] Step 3: The polishing liquid in the filter box is driven by a recovery pump with a pump suction filter element and transported from the recycling pipe to the polishing machine for recycling.

[0013] Preferably, the sediment particles at the bottom of the filter box are discharged from the sewage pipe by driving the scraper brush at the front end of the telescopic rod through the telescopic cylinder.

[0014] Preferably, the waste liquid in the slag collecting box passes through the filter screen II, is filtered again and then flows back into the filter box.

[0015] The present invention can achieve the following effects: The present invention provides a polishing liquid recovery filtering device based on a polishing machine and a control method thereof, which has the characteristics of compact structure, good filtering effect and good operation stability compared with the prior art. The problem of solid particles in the waste liquid is solved. The polishing liquid is reused after filtering, and the filtered silicon slag realizes an automatic slag discharge process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure in which the filter box body and the slag collecting box are not connected to each other.

[0017] Figure 2 It is a structural schematic diagram of the present invention in which the filter box body is connected to the slag collecting box.

[0018] In the figure: waste liquid recovery pipe 1, filter box 2, filter screen I 3, recovery pump 4, pump suction filter element 5, return pipe 6, slag discharge notch 7, scraper brush 8, slag collection box 9, sewage pipe 10, pneumatic ball valve 11, telescopic rod 12, linear bearing 13, bracket 14, telescopic cylinder 15, sealing ring 16, filter screen II 17. DETAILED DESCRIPTION

[0019] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0020] Example: Figure 1As shown, a polishing liquid recovery filtering device based on a polishing machine includes a filter box 2, a sewage pipe 10 is provided at the lower end of the filter box 2, and a pneumatic ball valve 11 is provided on the sewage pipe 10. A waste liquid recovery pipe 1 connected to the filter box 2 is provided at the upper part of the filter box 2, a slag discharge notch 7 is provided in the middle of the filter box 2, a slag collection box 9 connected to the slag discharge notch 7 is provided on the outside of the filter box 2, an inclined filter screen Ⅰ3 is provided between the lower end of the waste liquid recovery pipe 1 and the slag discharge notch 7, a recovery pump 4 is provided at the lower part of the filter box 2, a return pipe 6 connected to the recovery pump 4 by pipeline is provided on the outside of the filter box 2, and a pump suction filter element 5 is provided at the front end of the recovery pump 4. A telescopic rod 12 is provided below the recovery pump 4, a telescopic cylinder 15 connected to the telescopic rod 12 by piston sliding is provided on the outside of the filter box 2, and a bracket 14 is provided between the lower end of the telescopic cylinder 15 and the filter box 2. A linear bearing 13 nested with the telescopic rod 12 is provided between the telescopic rod 12 and the filter housing 2 , and a sealing ring 16 nested with the telescopic rod 12 and the filter housing 2 is provided at the rear end of the linear bearing 13 .

[0021] A control method for recovering a polishing liquid filter device comprises the following steps: Step 1: The polishing waste liquid after silicon wafer grinding is transported to the filter box 2 through the waste liquid recovery pipe 1.

[0022] Step 2: Under the action of the inclined filter screen Ⅰ3, the polishing liquid is filtered and remains in the filter box 2, and the silicon slag is discharged from the slag discharge slot 7 to the slag collection box 9 under the flushing of the liquid.

[0023] Step 3: The polishing liquid in the filter box 2 is driven by a recovery pump 4 with a pump suction filter element 5 and transported from a recycling pipe 6 to the polishing machine for recycling.

[0024] The sediment particles at the bottom of the filter box 2 are driven by the telescopic cylinder 15 to be discharged from the sewage pipe 10 through the scraper brush 8 at the front end of the telescopic rod 12.

[0025] Example: Figure 2As shown, a polishing liquid recovery filtering device based on a polishing machine includes a filter box 2, a sewage pipe 10 is provided at the lower end of the filter box 2, and a pneumatic ball valve 11 is provided on the sewage pipe 10. A waste liquid recovery pipe 1 connected to the filter box 2 is provided at the upper part of the filter box 2, a slag discharge notch 7 is provided in the middle of the filter box 2, a slag collection box 9 connected to the slag discharge notch 7 is provided on the outside of the filter box 2, a filter screen II 17 is provided at the lower end of the slag collection box 9 and the lower part of the filter box 2, and the lower part of the slag collection box 9 is connected to the filter box 2. An inclined filter screen I 3 is provided between the lower end of the waste liquid recovery pipe 1 and the slag discharge notch 7, a recovery pump 4 is provided at the lower part of the filter box 2, a recycle pipe 6 connected to the recovery pump 4 is provided on the outside of the filter box 2, and a pump suction filter element 5 is provided at the front end of the recovery pump 4. A telescopic rod 12 is provided below the recovery pump 4, a telescopic cylinder 15 is provided on the outside of the filter box 2 and is piston-slidably connected to the telescopic rod 12, and a bracket 14 is provided between the lower end of the telescopic cylinder 15 and the filter box 2. A linear bearing 13 nested with the telescopic rod 12 is provided between the telescopic rod 12 and the filter box 2, and a sealing ring 16 is provided at the rear end of the linear bearing 13 and is sealed and nested with the telescopic rod 12 and the filter box 2.

[0026] A control method for recovering a polishing liquid filter device comprises the following steps: Step 1: The polishing waste liquid after silicon wafer grinding is transported to the filter box 2 through the waste liquid recovery pipe 1.

[0027] Step 2: Under the action of the inclined filter screen Ⅰ3, the polishing liquid is filtered and remains in the filter box 2, and the silicon slag is flushed by the liquid and discharged from the slag discharge slot 7 to the slag collection box 9. The waste liquid in the slag collection box 9 passes through the filter screen Ⅱ17, is filtered again, and flows back to the filter box 2.

[0028] Step 3: The polishing liquid in the filter box 2 is driven by a recovery pump 4 with a pump suction filter element 5 and transported from a recycling pipe 6 to the polishing machine for recycling.

[0029] The sediment particles at the bottom of the filter box 2 are driven by the telescopic cylinder 15 to be discharged from the sewage pipe 10 through the scraper brush 8 at the front end of the telescopic rod 12.

[0030] In summary, the polishing liquid recovery filtering device based on the polishing machine and the control method thereof have the characteristics of compact structure, good filtering effect and good operation stability. The problem of solid particles in the waste liquid is solved. The polishing liquid is reused after filtering, and the filtered silicon slag realizes the automatic slag discharge process.

[0031] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A polishing liquid recovery filtering device based on a polishing machine, characterized in that: The invention comprises a filter box (2), wherein the upper part of the filter box (2) is provided with a waste liquid recovery pipe (1) connected to the filter box (2), the middle part of the filter box (2) is provided with a slag discharge slot (7), the outer side of the filter box (2) is provided with a slag collection box (9) connected to the slag discharge slot (7), an inclined filter screen I (3) is provided between the lower end of the waste liquid recovery pipe (1) and the slag discharge slot (7), the lower part of the filter box (2) is provided with a recovery pump (4), the outer side of the filter box (2) is provided with a return pipe (6) connected to the recovery pump (4) by pipeline, and the front end of the recovery pump (4) is provided with a pump suction filter element (5).

2. The polishing liquid recovery filtering device based on the polishing machine according to claim 1 is characterized in that: A sewage discharge pipe (10) is provided at the lower end of the filter box (2), and a pneumatic ball valve (11) is provided on the sewage discharge pipe (10).

3. The polishing liquid recovery filtering device based on the polishing machine according to claim 2 is characterized in that: A telescopic rod (12) is provided below the recovery pump (4), a telescopic cylinder (15) is provided on the outside of the filter box (2) and is piston-slidably connected to the telescopic rod (12), and a bracket (14) is provided between the lower end of the telescopic cylinder (15) and the filter box (2).

4. The polishing liquid recovery filtering device based on the polishing machine according to claim 3 is characterized in that: A linear bearing (13) nested with the telescopic rod (12) is provided between the telescopic rod (12) and the filter box (2), and a sealing ring (16) nested with the telescopic rod (12) and the filter box (2) is provided at the rear end of the linear bearing (13).

5. The polishing liquid recovery filtering device based on the polishing machine according to claim 1 or 4, characterized in that: A filter screen II (17) is provided at the lower end of the slag collecting box (9) and the lower part of the filter box body (2).

6. A control method for the polishing liquid recovery filtering device according to claim 5, characterized in that The steps are as follows: Step 1: The polishing waste liquid after the silicon wafer is ground is transported to the filter box (2) through the waste liquid recovery pipe (1); Step 2: Under the action of the inclined filter screen I (3), the polishing liquid is filtered and remains in the filter box (2), and the silicon slag is discharged from the slag discharge slot (7) into the slag collection box (9) under the flushing of the liquid; Step 3: The polishing liquid in the filter box (2) is driven by a recovery pump (4) with a pump filter element (5) and transported from a recycling pipe (6) to the polishing machine for recycling.

7. The control method of the polishing liquid recovery filtering device according to claim 6, characterized in that: The sediment particles at the bottom of the filter box (2) are discharged from the sewage pipe (10) by driving the scraper brush (8) at the front end of the telescopic rod (12) through the telescopic cylinder (15).

8. The control method of the polishing liquid recovery filtering device according to claim 6, characterized in that: The waste liquid in the slag collecting box (9) passes through the filter screen II (17), is filtered again, and then flows back into the filter box (2).

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