Silicon wafer screening and conveying device

Abstract

The invention provides a silicon wafer screening and conveying device, which belongs to silicon wafer production and manufacturing, and comprises a fragment detection module, a thickness detection module, a different material removing module, a material receiving box and an air blowing module which are arranged along a sectional transmission line, the transmission speeds of all sections of the sectional transmission line are the same or different, and when the transmission speeds are different, the transmission speeds from the upstream to the downstream are gradually increased. The silicon wafer screening and conveying device integrates the functions of blowing, flaw detection, thickness detection, material removing and screening and the like, the yield of subsequent insertion wafers is guaranteed, the conveying flow line design adopts a sectional type, the conveying rate can be flexibly controlled, the process rhythm is guaranteed, the working efficiency is improved, and the production cost is reduced. And popularization and application in the fields of silicon wafer detection, production and processing and the like are facilitated.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer production and manufacturing, and specifically relates to a silicon wafer screening and conveying device. Background Art

[0002] In the manufacturing process of photovoltaic silicon wafers, the silicon wafers need to be cleaned and inserted after being sliced, and the slices need to be transported before being inserted. In this process, water droplets, transportation collisions, etc. may cause uncontrollable fragments. In addition, in the stacking inspection, the current commonly used method is only optical inspection, which is not effective and often causes missed inspections. Therefore, it is necessary to improve the existing silicon wafer transmission to avoid problems such as multi-layer stacking and water accumulation. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a silicon wafer screening and conveying device, which can solve the above-mentioned problems.

[0004] A silicon wafer screening and conveying device comprises a debris detection module, a thickness detection module, a foreign material rejection module, a material receiving box and an air blowing module arranged along a segmented transmission line; the debris detection module and the thickness detection module are arranged upstream of the foreign material rejection module, and the material receiving box is arranged downstream of the foreign material rejection module; the air blowing module is arranged upstream and / or downstream of the foreign material rejection module.

[0005] Furthermore, the transmission speeds of the various sections of the segmented transmission line are the same or different. When the transmission speeds are different, the transmission speed increases step by step from upstream to downstream.

[0006] Furthermore, the debris detection module includes a camera frame, a camera mounting plate group, a camera, a light source mounting plate group, a detection light source, a light source adjustment component, a light source baffle assembly, a light source baffle adjustment component and a reflector assembly; the camera is mounted on the top of the camera frame through the camera mounting plate group; the detection light source is mounted below the camera through the light source mounting plate group; the light source adjustment component is arranged at the light source mounting plate group and the detection light source, and is used to adjust the height and projection angle of the detection light source; the light source baffle assembly is installed to the outside below the detection light source through the light source baffle adjustment assembly, and is designed with an adjustable front and rear distance under the adjustment of the light source baffle adjustment assembly; the reflector assembly is installed below the light source baffle assembly, and a detection feed port is formed between the upper end surface of the reflector assembly and the lower end surface of the light source baffle assembly.

[0007] Furthermore, the thickness detection module is arranged along the segmented transmission line to detect the thickness of the silicon wafers transported on the segmented transmission line.

[0008] Furthermore, the foreign material rejection module adopts a mechanical swing type or a top suction material selection type structure. When the mechanical swing type structure is adopted, the material receiving box is arranged below the end of the swing material removal flow line to receive the material; when the top suction material selection structure is adopted, a top suction flow line is arranged above the material removal station, and the material receiving box is arranged below the end of the top suction flow line.

[0009] Furthermore, the blowing module is transversely arranged on the segmented transmission line, and comprises a blowing adapter and a transverse blowing assembly, and the transverse blowing assembly is installed to the top and / or bottom of the segmented transmission line through the blowing adapter.

[0010] Furthermore, a slicing module is provided at the upstream end of the segmented transmission line, and the slicing module slices the silicon wafers after debonding and cleaning from the silicon wafer basket and transmits the silicon wafers to the segmented transmission line individually.

[0011] Furthermore, a water collecting trough is arranged at the periphery of the segmented transmission line to receive water droplets blown off the silicon wafer.

[0012] Furthermore, a wafer inserting module is provided at the downstream end of the segmented transmission line for inserting defect-free horizontally transmitted silicon wafers into the silicon wafer basket one by one.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the silicon wafer screening and conveying device of the present application integrates functions such as blowing, defect detection, thickness detection, and material removal and screening, thereby ensuring the yield rate of subsequent wafer insertions; secondly, the transport flow line design adopts a segmented type, which can flexibly control the conveying rate, ensure the process rhythm, improve work efficiency, and facilitate promotion and application in fields such as silicon wafer detection and production and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 and Figure 2 Schematic diagrams of the silicon wafer screening and conveying device of the present invention from different viewing angles;

[0015] Figure 3 is a schematic diagram of a debris detection module;

[0016] Figure 4 It is a schematic diagram of two lateral blowing components arranged opposite to each other;

[0017] Figure 5 A schematic diagram of a silicon wafer screening and conveying device including a wafer separation module;

[0018] Figure 6 Schematic diagram of a silicon wafer screening and conveying device including a water collection trough and a wafer insertion module.

[0019] In the figure,

[0020] 100. Segmented transmission line;

[0021] 200, debris detection module; 210, camera frame; 220, camera mounting plate group; 230, camera; 240, light source mounting plate group; 250, detection light source; 260, light source adjustment assembly; 261, light source height adjustment slider unit; 262, light source angle rotation adjustment unit; 270, light source baffle assembly; 280, light source baffle adjustment assembly; 290, reflection plate assembly;

[0022] 300. Thickness detection module;

[0023] 400. Foreign material rejection module;

[0024] 500, receiving box;

[0025] 600, air blowing module; 610, air blowing adapter; 620, lateral air blowing assembly;

[0026] 700, sharding module;

[0027] 800, water collection tank;

[0028] 900. Insert module. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] A silicon wafer screening and conveying device, see Figure 1-Figure 6 , including a debris detection module 200, a thickness detection module 300, a foreign material rejection module 400, a material receiving box 500 and an air blowing module 600 arranged along the segmented transmission line 100.

[0031] Layout relationship: the fragment detection module 200 and the thickness detection module 300 are arranged upstream of the foreign material removal module 400, and are used to remove stacked sheets, fragments, and defective sheets; the material receiving box 500 is arranged downstream of the foreign material removal module 400, and is used to receive foreign materials removed by the foreign material removal module 400; the blowing module 600 is arranged upstream and / or downstream of the foreign material removal module 400, and is used to blow away water droplets on the surface of the silicon wafer.

[0032] The transmission speeds of the various sections of the segmented transmission line 100 are the same or different. When the transmission speeds are different, the transmission speed increases step by step from upstream to downstream.

[0033] The purpose of this design is to lengthen the spacing between the subsequent silicon wafers to ensure the effective insertion of subsequent wafers and prevent collision and breakage between silicon wafers due to insufficient process time.

[0034] Among them, the debris detection module 200 includes a camera frame 210, a camera mounting plate group 220, a camera 230, a light source mounting plate group 240, a detection light source 250, a light source adjustment assembly 260, a light source baffle assembly 270, a light source baffle adjustment assembly 280 and a reflective plate assembly 290.

[0035] Specifically, the camera 230 is installed on the top of the camera frame 210 through the camera mounting plate group 220; the detection light source 250 is installed below the camera 230 through the light source mounting plate group 240; the light source adjustment assembly 260 is arranged at the light source mounting plate group 240 and the detection light source 250, and is used to adjust the height and projection angle of the detection light source 250; the light source baffle assembly 270 is installed to the outside below the detection light source 250 through the light source baffle adjustment assembly 280, and is designed with an adjustable front and rear distance under the adjustment of the light source baffle adjustment assembly 280; the reflective plate assembly 290 is installed below the light source baffle assembly 270, and a detection feed port is formed between the upper end surface of the reflective plate assembly 290 and the lower end surface of the light source baffle assembly 270.

[0036] The light source adjustment component 260 includes a light source height adjustment slider unit 261 and a light source angle rotation adjustment unit 262. The light source baffle adjustment component 280 uses a front-rear adjustment slider unit.

[0037] The thickness detection module 300 is disposed along the segmented transmission line 100 to detect the thickness of the silicon wafers transported on the segmented transmission line 100, so as to determine whether there is any overlap.

[0038] It is preferably arranged at the longitudinal center line of the transmission line downstream of the debris detection module 200. Of course, it can also be arranged upstream of the debris detection module 200.

[0039] The thickness gauge of the thickness detection module 300 can be any conventional one in the field. The detected thickness data is compared with the standard thickness pre-stored in the controller to determine whether there are two, three or more sheets stacked. If stacking is determined to occur, the material is removed in the subsequent foreign material removal module 400. If stacking occurs continuously, the machine is shut down for inspection.

[0040] Among them, the foreign material rejection module 400 adopts a mechanical swing type or a top suction material selection type structure. When the mechanical swing type structure is adopted, the material receiving box 500 is arranged below the end of the swing material removal flow line to receive the material; when the top suction material selection type structure is adopted, a top suction flow line is arranged above the material removal station, and the material receiving box 500 is arranged below the end of the top suction flow line. The mechanical swing type structure is such as the structure disclosed in our patent CN213558494U, and the top suction material selection structure is such as the structure disclosed in our patent CN114733795A.

[0041] The blowing module 600 is laterally arranged on the segmented transmission line 100, and includes a blowing adapter 610 and a lateral blowing assembly 620. The lateral blowing assembly 620 is installed on the top and / or bottom of the segmented transmission line 100 through the blowing adapter 610. Figure 4 , which is an example of two lateral blowing assemblies 620 being arranged symmetrically in the upper and lower directions relative to each other.

[0042] In a specific example, a blowing module 600 is provided in the thickness detection module 300 and the foreign material rejection module 400, and a blowing module 600 is also provided downstream of the foreign material rejection module 400 near the discharge flow line. The blowing module 600 is arranged along the conveying flow line, and blows vertically to the silicon wafer or obliquely to the surface of the silicon wafer. A transverse blowing assembly 620 is symmetrically provided above and below the silicon wafer conveying flow line, preferably a wind knife structure.

[0043] For further information, see Figure 5 A slicing module 700 is provided at the upstream end of the segmented transmission line 100 , and the slicing module 700 slices the silicon wafers after debonding and cleaning from the silicon wafer basket and transmits the silicon wafers to the segmented transmission line 100 individually.

[0044] For further information, see Figure 6 A water collecting trough 800 is provided on the periphery of the segmented transmission line 100 to receive water droplets blown off the silicon wafers. Furthermore, a wafer inserting module 900 is provided at the downstream end of the segmented transmission line 100 to insert defect-free horizontally transmitted silicon wafers into the silicon wafer basket one by one.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A silicon wafer screening and conveying device, characterized in that: It comprises a debris detection module (200), a thickness detection module (300), a foreign material rejection module (400), a material receiving box (500) and an air blowing module (600) arranged along a segmented transmission line (100); The fragment detection module (200) and the thickness detection module (300) are arranged upstream of the foreign material rejection module (400), and the material receiving box (500) is arranged downstream of the foreign material rejection module (400); The air blowing module (600) is arranged upstream and / or downstream of the foreign material rejecting module (400).

2. The silicon wafer screening and conveying device according to claim 1, characterized in that: The transmission speeds of the various sections of the segmented transmission line (100) are the same or different. When the transmission speeds are different, the transmission speed increases step by step from upstream to downstream.

3. The silicon wafer screening and conveying device according to claim 1, characterized in that: The debris detection module (200) comprises a camera frame (210), a camera (230) and a detection light source (250); the camera (230) is installed on the top of the camera frame (210) through a camera mounting plate group (220); the detection light source (250) is installed below the camera (230) through a light source mounting plate group (240), and the height and projection angle of the detection light source (250) are adjustable; a light source baffle assembly (270) is installed to the outside below the detection light source (250), a reflection plate assembly (290) is installed below the light source baffle assembly (270), and a detection feed port is formed between the upper end surface of the reflection plate assembly (290) and the lower end surface of the light source baffle assembly (270).

4. The silicon wafer screening and conveying device according to claim 1, characterized in that: The thickness detection module (300) is arranged along the segmented transmission line (100) and is used to detect the thickness of the silicon wafer transported on the segmented transmission line (100).

5. The silicon wafer screening and conveying device according to claim 1, characterized in that: The foreign material rejection module (400) adopts a mechanical swing type or a top suction material selection type structure. When the mechanical swing type structure is adopted, the material receiving box (500) is arranged below the end of the swing material removal flow line to receive the material; when the top suction material selection type structure is adopted, a top suction flow line is arranged above the material removal station, and the material receiving box (500) is arranged below the end of the top suction flow line.

6. The silicon wafer screening and conveying device according to claim 1, characterized in that: The blowing module (600) is laterally arranged across the segmented transmission line (100), and comprises a blowing adapter (610) and a lateral blowing assembly (620); the lateral blowing assembly (620) is installed to the top and / or bottom of the segmented transmission line (100) via the blowing adapter (610).

7. The silicon wafer screening and conveying device according to claim 1, characterized in that: A slicing module (700) is arranged at the upstream end of the segmented transmission line (100), and the slicing module (700) slices the silicon wafers after debonding and cleaning from the silicon wafer basket and transmits the silicon wafers to the segmented transmission line (100) individually.

8. The silicon wafer screening and conveying device according to claim 1, characterized in that: A water collecting trough (800) is arranged on the outer periphery of the segmented transmission line (100) for receiving water droplets blown off the silicon wafer.

9. The silicon wafer screening and conveying device according to claim 1, characterized in that: A wafer inserting module (900) is arranged at the downstream end of the segmented transmission line (100) for inserting defect-free horizontally transmitted silicon wafers into the silicon wafer basket piece by piece.

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