Protective structure cleaning device, cleaning method and semiconductor process equipment

Abstract

The invention provides a protective structure cleaning device, a cleaning method and semiconductor process equipment. The semiconductor process equipment comprises a semiconductor process chamber, and a base, a protection structure and a cleaning device which are arranged in the semiconductor process chamber, the protection structure is arranged around the base; the cleaning device comprises a spraying structure, a conveying pipeline and a swing adjusting structure. The spraying structure is mounted in the base; a spraying main body of the spraying structure sprays a cleaning agent through a nozzle to clean the protection structure; the spraying main body is mounted on a magnet of the spraying structure; the magnet is mounted on the base in a swinging manner; the conveying pipeline is connected with the spraying main body so as to convey the cleaning agent to the spraying main body; one part of the conveying pipeline is arranged inside the base, and the other part of the conveying pipeline is arranged outside the base; an electromagnet of the swing adjusting structure is independent of the base; the electromagnet drives the magnet to swing, so that the spraying main body swings along with the swing of the magnet; therefore, the cleaning effect and the cleaning efficiency of the protection structure are ensured.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor manufacturing, and specifically relates to a protective structure cleaning device and a cleaning method, and semiconductor process equipment. Background Art

[0002] At present, wet processing of substrates in the semiconductor industry involves the cleaning of protective structures (i.e. cup-shaped parts, CUP). The traditional cleaning method is to spray liquid on the upper surface of the base used to carry the substrate, and then through the high-speed rotation of the base, the liquid is thrown onto the protective structure for cleaning. The main problem with this cleaning method is that the cleaning angle is limited and uncontrollable, and the protective structure cannot be fully cleaned. The cleaning effect is poor and the cleaning efficiency is low, which in turn affects product quality. It is also easy to increase the frequency of machine maintenance and reduce the machine operation efficiency.

[0003] It should be noted that the information disclosed in the background technology section of the present invention is only intended to deepen the understanding of the general background technology of the present invention, and should not be regarded as admitting or suggesting in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0004] The purpose of the present invention is to provide a protective structure cleaning device and cleaning method, and semiconductor process equipment, aiming to solve the problems of poor cleaning effect and low cleaning efficiency existing in traditional protective structure cleaning methods.

[0005] To achieve the above object, according to a first aspect of the present invention, there is provided a protective structure cleaning device, which comprises: a spray structure, a delivery pipeline and a swing adjustment structure;

[0006] The injection structure is installed inside a base for carrying a substrate in a semiconductor process chamber;

[0007] The spray structure includes a spray body and a magnet; the spray body is used to spray a cleaning agent through its nozzle to clean the protective structure arranged on the periphery of the base; the spray body is mounted on the magnet; the magnet is swingably mounted on the base;

[0008] The delivery pipeline is connected to the spray body to deliver the cleaning agent to the spray body; a part of the delivery pipeline is arranged inside the base, and another part is arranged outside the base;

[0009] The swing adjustment structure includes an electromagnet, which is independently arranged from the base; after being energized, the electromagnet is used to drive the magnet to swing, thereby causing the injection body to swing along with the swing of the magnet.

[0010] Optionally, there are multiple injection structures, and the multiple injection structures are spaced apart and evenly distributed along the circumference of the base.

[0011] Optionally, the delivery pipeline includes a main pipe and multiple branch pipes; the injection body also includes a nozzle pipe, one end of which is connected to the nozzle; the other end of the nozzle pipe in each injection body is connected to one of the branch pipes; all the branch pipes are connected to the main pipe, and the main pipe and the branch pipes can be selectively combined and separated.

[0012] Optionally, the injection structure is installed in a receiving space on the side of the base;

[0013] The injection structure further comprises a sealed box body, in which the injection body and the magnet are both arranged;

[0014] A movable window is provided on the sealed box body, and the nozzle is accommodated in the window; the nozzle is sealedly connected to the inner wall of the window; and at least a part of the structure of the nozzle extends to the outside of the window.

[0015] Optionally, the nozzle is detachably sealed to the inner wall of the window.

[0016] Optionally, the protective structure cleaning device also has at least one of the following features:

[0017] The protective structure cleaning device further comprises a valve disposed on the delivery pipeline, wherein the valve is used to adjust the flow rate and / or pressure;

[0018] The magnet is mounted on the base through a bracket, the bracket is mounted inside the base, and the magnet and the bracket are rotatably connected;

[0019] The electromagnet is installed between the base and a driving device that drives the base to rotate.

[0020] In addition, according to the second aspect of the present invention, a semiconductor process equipment is also provided, which includes: a semiconductor process chamber, a base, a protective structure and any one of the protective structure cleaning devices described above; the base, the protective structure and the protective structure cleaning device are all installed in the semiconductor process chamber; the protective structure is arranged on the periphery of the base and is arranged around the base.

[0021] Optionally, the semiconductor process equipment further includes: a control component connected to the electromagnet, the control component being used to supply power to the electromagnet and control a state of the electromagnet.

[0022] In addition, according to a third aspect of the present invention, a protective structure cleaning method is further provided. The protective structure cleaning method is performed based on any one of the protective structure cleaning devices described above, and the protective structure cleaning method includes:

[0023] The base is driven to rotate, and the cleaning agent is delivered to the spray body through the delivery pipeline, so that the spray body sprays the cleaning agent toward the protective structure through its nozzle; and the electromagnet is energized and the direction of the energized current of the electromagnet is controlled to drive the magnet to swing, thereby driving the spray body to swing.

[0024] Optionally, there are multiple injection structures, and the multiple injection structures are distributed at intervals along the circumference of the base;

[0025] The protective structure cleaning method also includes:

[0026] Delivering the cleaning agent to all the spraying bodies through the same set of delivery pipelines, so that all the spraying bodies simultaneously spray the cleaning agent toward the protective structure through their nozzles;

[0027] All the magnets are driven to swing by one electromagnet, thereby driving all the injection bodies to swing;

[0028] And / or, the protective structure cleaning method further comprises:

[0029] The cleaning flow rate and / or cleaning pressure are adjusted by using a valve arranged on the delivery pipeline.

[0030] The protective structure cleaning device and cleaning method, and semiconductor process equipment provided by the present invention have at least the following beneficial effects:

[0031] On the one hand, the nozzle structure is arranged inside the base for carrying the substrate, which not only makes the base beautiful, but also does not increase the size of the base and is easy to install and use. On the other hand, the electromagnet can change the magnetic pole by changing the direction of its own current, and then act on the magnet, so that the magnet swings with the change of the magnetic field of the electromagnet, and synchronously drives the spray body of the nozzle structure to swing. Based on the swing of the spray body, the cleaning device can perform comprehensive and in-depth cleaning of the protective structure, and the cleaning angle and cleaning intensity are controllable. Therefore, the cleaning effect is good, the cleaning efficiency is high, and the maintenance frequency of the machine can be reduced, and the operation efficiency of the machine can be increased. In addition, the electromagnet is independently arranged from the base to avoid the influence of the base rotation on the cable. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Those skilled in the art will appreciate that the accompanying drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0033] Figure 1 It is a schematic diagram of the structure of the semiconductor process equipment of an embodiment of the present invention; the arrow on the delivery pipeline indicates the delivery direction of the cleaning agent, the other two bidirectional arrows indicate the placement direction of the nozzle, and the dotted line indicates the spraying mode of the nozzle at the current position.

[0034] [Description of reference numerals is as follows]:

[0035] 1-substrate; 10-base; 11-pin; 20-protective structure; 30-protective structure cleaning device; 110-injection structure; 111-injection body; 112-nozzle; 113-magnet; 114-nozzle tube; 115-sealing box; 116-bracket; 120-delivery pipeline; 121-main pipe; 122-branch pipe; 123-quick plug connector; 124-flow regulating valve; 125-pressure valve; 130-swing adjustment structure; 131-electromagnet. DETAILED DESCRIPTION

[0036] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the figure instead of being drawn according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0037] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0038] As used in this specification, the singular forms "one", "an", and "the" include plural objects, the plural form "a plurality" includes two or more objects, and unless the content clearly indicates otherwise, "several" is used to indicate an indefinite quantity. As used in this specification, the term "or" is usually used to include the meaning of "and / or", unless the content clearly indicates otherwise, and the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] The core idea of ​​the present invention is to provide a protective structure cleaning device and cleaning method, and semiconductor process equipment, aiming to solve the problems of poor cleaning effect and low cleaning efficiency in traditional protective structure cleaning methods.

[0040] like Figure 1 As shown, an embodiment of the present invention relates to a semiconductor process equipment, which includes: a semiconductor process chamber, a base 10, a protective structure 20 and a protective structure cleaning device 30. The base 10, the protective structure 20 and the protective structure cleaning device 30 are all installed in the semiconductor process chamber. This application does not limit the process performed in the semiconductor process chamber.

[0041] The base 10 is used to carry the substrate 1, and the type of the substrate 1 is not limited. In addition, the base 10 can fix the substrate 1 by a suitable method, such as clamping, vacuum adsorption, electrostatic adsorption, etc. In an exemplary embodiment, the base 10 clamps and fixes the substrate 1 by three bayonet pins 11. Specifically, three bayonet pins 11 are arranged along the circumference of the upper part of the base 10, and the bayonet pins 11 are evenly distributed along the circumference of the edge of the base 10. The three bayonet pins 11 support the substrate 1 through the support surface at the top, and the support surface of the bayonet pins 11 only contacts the edge of the substrate 1 to avoid wear or contamination on the front or back of the substrate 1.

[0042] The base 10 can be driven by a driving device to rotate around its own axial center line. In addition, the base 10 can be fixed or can be raised and lowered. The shape of the base 10 can match the shape of the substrate 1. For example, the substrate 1 is more commonly circular in shape, and the base 10 is also circular accordingly.

[0043] The protective structure 20 is arranged on the periphery of the base 10 and surrounds the base 10. The protective structure 20 is mostly a cup-shaped component (CUP, or cup ring) with a variable diameter, that is, the top is a frustum and the bottom is a cylinder. The base 10 and the protective structure cleaning device 30 are both located inside the protective structure 20.

[0044] When the substrate 1 is placed on the base 10 and undergoes a process, the protective structure 20 can prevent the liquid sprayed onto the substrate 1 from splashing outside the protective structure 20, thereby preventing chemicals from splashing outside the device. The protective structure 20 can also be used to collect waste liquid and to separate gas and liquid.

[0045] In practice, one or more protective structures 20 may be provided. When there are multiple protective structures 20, the multiple protective structures 20 are concentrically arranged from the inside to the outside. Regardless of the number of protective structures 20, they need to be concentric with the installation position of the base 10, that is, the axial centerline of the protective structure 20 coincides with the axial centerline of the base 10. In this article, the axial direction is the height direction, that is, the vertical direction of the device.

[0046] In addition, the protective structure 20 can be fixed or raised and lowered. Furthermore, when there are multiple protective structures 20, all protective structures 20 can be cleaned in sequence. The cleaning of the protective structure 20 is completed by the protective structure cleaning device 30.

[0047] Continue to refer Figure 1 The protective structure cleaning device 30 provided in the embodiment of the present application includes: a spraying structure 110 , a delivery pipeline 120 and a swing adjustment structure 130 .

[0048] The spray structure 110 is installed inside the base 10. The spray structure 110 includes a spray body 111 and a magnet 113. The spray body 111 is used to spray a cleaning agent through its nozzle 112 to clean the protective structure 20. The spray body 111 is installed on the magnet 113, and the magnet 113 is swingably installed on the base 10. In addition, the delivery pipeline 120 is connected to the spray body 111 to deliver the cleaning agent to the spray body 111, specifically: a part of the delivery pipeline 120 is arranged inside the base 10, and the other part is arranged outside the base 10. In addition, the swing adjustment structure 130 includes an electromagnet 131, which is independently arranged from the base 10, and the electromagnet 131 is used to drive the magnet 113 to swing after being energized, so that the spray body 111 swings with the swing of the magnet 113.

[0049] Thus, when the protective structure 20 needs to be cleaned, the cleaning method is as follows:

[0050] (1) driving the base 10 to rotate;

[0051] (2) delivering the cleaning agent to the spraying body 111 through the delivery pipeline 120, so that the spraying body 111 sprays the cleaning agent toward the protective structure 20 through its nozzle 112;

[0052] (3) The electromagnet 131 is energized and the direction of the current flowing through the electromagnet 131 is controlled to drive the magnet 113 to swing, thereby driving the ejection body 111 to swing.

[0053] It should be understood that the electromagnet 131 can change the magnetic pole by changing the direction of the current flowing through itself, thereby acting on the magnet 113, causing the magnet 113 to swing with the change of the magnetic field of the electromagnet 131, and synchronously driving the spray body 111 to swing. Based on the swing of the spray body 111, the protective structure cleaning device 30 can perform a comprehensive and in-depth cleaning of the protective structure 20. Specifically, based on the swing of the spray body 111, the cleaning agent can be sprayed to various positions of the protective structure 20, so that various positions of the protective structure 20 can be cleaned, and the cleaning angle and cleaning force can be controlled. Therefore, the cleaning effect is good and the cleaning efficiency is high, which can reduce the maintenance frequency of the machine and increase the operation efficiency of the machine.

[0054] In addition, since the electromagnet 131 is independently arranged from the base 10, the cable on the electromagnet 131 can be prevented from being affected by the rotation of the base 10. Here, the independent arrangement means that the electromagnet 131 is not arranged on the base 10, but is arranged separately from the base 10. In practice, the electromagnet 131 can be arranged at any other position except the base 10, and the specific installation position is not limited. Preferably, the electromagnet 131 is arranged between the driving device and the base 10.

[0055] It should be understood that the driving device is arranged below the base 10 to drive the base 10 to rotate. Those skilled in the art should know that the driving device may include components such as a motor, a bearing, and an output shaft, wherein the motor is connected to the base 10 via the output shaft, and the bearing is used to support the output shaft. Furthermore, the electromagnet 131 may be arranged on a fixed component of the driving device, such as a housing of the driving device.

[0056] Furthermore, the present invention does not limit the type of the cleaning agent. For example, the cleaning agent is deionized water (DIW) or other suitable cleaning materials.

[0057] Further, in this embodiment, the spray body 111 includes not only the nozzle 112 but also a nozzle tube 114, one end of the nozzle tube 114 is connected to the nozzle 112, and the other end is connected to the delivery pipeline 120. Specifically in this embodiment, the other end of the nozzle tube 114 is connected to a corresponding branch pipe 122. Preferably, the nozzle tube 114 is a hose, which is convenient for installation and angle adjustment.

[0058] Preferably, the semiconductor process equipment further comprises a control component connected to the electromagnet 131, which can supply power to the electromagnet 131 and can also control the state of the electromagnet 131, such as controlling the current magnitude, current direction, power-on duration, and power-off duration of the electromagnet 131. Such a configuration makes the cleaning efficiency of the protective structure 20 higher, and the entire cleaning process more convenient and accurate.

[0059] Furthermore, the injection structure 110 may be one or more. A plurality of injection structures 110 are distributed at intervals along the circumference of the base 10. When a plurality of injection structures 110 are provided, the cleaning effect is better and the cleaning efficiency is higher. Preferably, the plurality of injection structures 110 are evenly distributed along the circumference of the base 10. The even distribution here mainly refers to that the injection structures 110 are installed at symmetrical positions along the circumference inside the base 10, which is beneficial to the dynamic and static balance of the base 10 and ensures the stability of the base 10. Considering that too many injection structures 110 will affect the stability of the base 10, preferably, the number of injection structures 110 is 2 to 4, and optionally, 2, 3 or 4, etc.

[0060] Specifically, when there is one spray structure 110 and one delivery pipeline 120 , one end of the delivery pipeline 120 is connected to the nozzle tube 114 of the spray body 111 , and the other end of the delivery pipeline 120 is connected to the liquid source for outputting the cleaning agent to the delivery pipeline 120 .

[0061] In addition, when there are multiple spray structures 110, each spray body 111 can be provided with a separate delivery pipeline 120 instead of sharing. In this embodiment, the cleaning agent is delivered to all spray bodies 111 simultaneously through the same delivery pipeline 120, thereby reducing the number of pipelines, simplifying the structure, and reducing the difficulty of installation.

[0062] In an exemplary embodiment, the delivery pipeline 120 includes a main pipe 121 and a plurality of branch pipes 122, the other end of the nozzle pipe 114 in each spray body 111 is connected to a branch pipe 122, and all the branch pipes 122 are connected to the main pipe 121. In this way, one main pipe 121 can simultaneously deliver cleaning agent to a plurality of branch pipes 122. Both the main pipe 121 and the branch pipes 122 are preferably hard pipes. Compared with hard pipes, soft pipes are softer and more elastic, while hard pipes are more solid in structure and are convenient for stable transmission.

[0063] Preferably, the main pipe 121 and the branch pipe 122 can be selectively connected and separated. Optionally, the main pipe 121 and the branch pipe 122 are connected by a quick-connect connector 123, which allows the main pipe 121 and the branch pipe 122 to be selectively connected and separated. Because of this, after cleaning is completed, the main pipe 121 and the branch pipe 122 can also be separated, which facilitates the high-speed rotation of the base 10 to perform a process on the substrate 1, and the main pipe 121 and the branch pipe 122 can also be connected again when cleaning is needed.

[0064] Based on this, in some preferred embodiments, when cleaning the protective structure 20, a plurality of spray bodies 111 spray cleaning agents to the protective structure 20 through their nozzles 112 at the same time, which results in higher cleaning efficiency and better cleaning effect.

[0065] When there are multiple injection structures 110 , preferably, all the injection bodies 111 can be driven to swing by one electromagnet 131 .

[0066] Preferably, the injection structure 110 is installed in the accommodation space of the circumferential side of the base 10. In this way, the injection structure 110 is hidden inside the base 10, which not only makes the base 10 beautiful, but also does not increase the volume of the base 10 and is easy to install and use.

[0067] For example, in some cases, the base 10 has a cavity inside, in which some mechanical components for controlling the latch 11 are arranged, and the latch 11 releases or clamps the substrate 1 under the control of the mechanical components. Furthermore, the accommodation space is shared with or separately arranged with the cavity of the base 10 itself. Regardless of how the accommodation space is arranged, it needs to be sealed to prevent external gas or liquid, especially acidic gas, from entering the interior of the base 10.

[0068] To this end, the injection structure 110 preferably further includes a sealing box body 115, and the injection body 111 and the magnet 113 are both disposed in the sealing box body 115. The sealing box body 115 is directly disposed in the accommodation space and can seal the base 10 to ensure the sealing performance of the base 10. Here, when the delivery pipeline 120 is arranged, the delivery pipeline 120 passes through the sealing box body 115 to be connected to the nozzle tube 114, and the delivery pipeline 120 and the sealing box body 115 need to be sealed.

[0069] Preferably, a movable window is provided on the sealing box body 115, and the nozzle 112 is accommodated in the window. In addition, the nozzle 112 is always sealed to the inner wall of the window to ensure the sealing performance. In other words, the window can move synchronously with the swing of the nozzle 112, and the sealing between the window and the nozzle 112 can be ensured during the movement. At the same time, at least part of the structure of the nozzle 112 needs to extend to the outside of the window to facilitate the spraying of the cleaning agent at different positions of the protective structure 20. The length of the nozzle 112 extending out of the window is, for example, about 1 mm.

[0070] Preferably, the nozzle 112 and the inner wall of the window are detachably sealed and connected. This arrangement facilitates the disassembly of the sealed box body 115 and the cleaning of the sealed box body 115.

[0071] Furthermore, the magnet 113 can swing in one or more directions relative to the base 10. Preferably, the magnet 113 swings up and down around the horizontal axis, thereby driving the nozzle 112 to swing up and down in the vertical plane, thereby comprehensively cleaning the protective structure 20.

[0072] The swing angle of the nozzle 112 can be set according to actual conditions and requirements. For example, in some cases, the swing angle of the nozzle 112 can reach 0° to 180°. For example, the initial position is a horizontal position, and the nozzle 112 can swing upward 90° or downward 90° from the initial position. Of course, the initial position is not limited to the horizontal position, and can also be set at other positions.

[0073] Optionally, the magnet 113 is mounted on the base 10 via a bracket 116, the bracket 116 is mounted inside the base 10, and the bracket 116 and the magnet 113 are rotatably connected, that is, the magnet 113 can rotate relative to the bracket 116. The bracket 116 can be completely disposed in the sealed box body 115, and can also be partially disposed in the sealed box body 115.

[0074] In an exemplary embodiment, a portion of the bracket 116 is disposed inside the sealed box body 115, and another portion is disposed outside the sealed box body 115, so that the bracket 116 needs to pass through the sealed box body 115 and connect to the magnet 113, and therefore, the bracket 116 and the sealed box body 115 need to be sealed. Optionally, the bracket 116 is a linear rod with a simple structure.

[0075] Furthermore, when cleaning the protective structure 20 , the cleaning flow rate and / or cleaning pressure may be adjusted by using a valve disposed on the delivery pipeline 120 .

[0076] In an exemplary embodiment, the valve includes at least one of a flow regulating valve 124 and a pressure valve 125. The flow regulating valve 124 can automatically adjust the cleaning flow, and the pressure valve 125 is used to adjust the cleaning pressure. Optionally, the pressure valve 125 is a manual valve. However, it should be understood that in other embodiments, the adjustment of flow and pressure can also be completed by one valve, and the present invention is not limited to this.

[0077] Therefore, the present application can adjust the flow rate, pressure and cleaning angle according to actual conditions and needs, while ensuring the cleaning efficiency, ensuring the cleaning effect of the protective structure 20, so that the protective structure 20 can be cleaned thoroughly.

[0078] In this embodiment, the flow rate of the cleaning agent can be selected to be 500 ml / min to 2000 ml / min, and the cleaning pressure can be selected to be 0.1 MPa to 0.35 MPa.

[0079] Preferably, the valve is in communication with a control component, and the control component is used to automatically control the valve to adjust flow and / or pressure.

[0080] In addition, when cleaning the protective structure 20, the rotation speed of the base 10 can be adjusted, for example, the rotation speed of the base 10 is 2 rpm to 5 rpm. In addition, the current change frequency of the electromagnet 131 can be adjusted according to actual conditions, for example, the direction of the current of the electromagnet 131 is changed every time the base 10 rotates one circle. Of course, the actual situation is not limited to this.

[0081] In summary, the present invention provides a protective structure cleaning device 30, which can use the electromagnet 131 to drive the magnet 113 to swing, thereby driving the spray body 111 of the nozzle structure 110 to swing. Based on the swing of the spray body 111, the cleaning device 30 can perform comprehensive and in-depth cleaning on the protective structure 20, and the cleaning angle and cleaning force are controllable. Therefore, the cleaning effect is good, the cleaning efficiency is high, and the machine maintenance frequency is reduced, and the machine operation efficiency is increased.

[0082] Finally, it should be noted that the protective structure cleaning method described in the present invention can be used to realize all the functions that can be realized by the protective structure cleaning device 30 described above, and achieve corresponding or similar effects.

[0083] Since the protective structure cleaning method provided by the embodiment of the present invention and the protective structure cleaning device provided by the embodiment of the present invention belong to the same inventive concept, the protective structure cleaning method provided by the embodiment of the present invention at least has all the beneficial effects of the protective structure cleaning device provided by the present invention. For details, please refer to the above description of the beneficial effects of the protective structure cleaning device provided by the present invention. Therefore, the beneficial effects of the protective structure cleaning method provided by the present invention will not be described one by one here.

[0084] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the present invention, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other at will.

Claims

1. A protective structure cleaning device, characterized in that: include: Injection structure, delivery pipeline and swing adjustment structure; The injection structure is installed inside a base for carrying a substrate in a semiconductor process chamber; The spray structure includes a spray body and a magnet; the spray body is used to spray a cleaning agent through its nozzle to clean the protective structure arranged on the periphery of the base; the spray body is mounted on the magnet; the magnet is swingably mounted on the base; The delivery pipeline is connected to the spray body to deliver the cleaning agent to the spray body; a part of the delivery pipeline is arranged inside the base, and another part is arranged outside the base; The swing adjustment structure includes an electromagnet, which is independently arranged from the base; after being energized, the electromagnet is used to drive the magnet to swing, thereby causing the injection body to swing along with the swing of the magnet.

2. The protective structure cleaning device according to claim 1, characterized in that: There are a plurality of injection structures, and the plurality of injection structures are spaced apart and evenly distributed along the circumference of the base.

3. The protective structure cleaning device according to claim 2, characterized in that: The delivery pipeline includes a main pipe and multiple branch pipes; the injection body also includes a nozzle pipe, one end of which is connected to the nozzle; the other end of the nozzle pipe in each injection body is connected to one of the branch pipes; all the branch pipes are connected to the main pipe, and the main pipe and the branch pipes can be selectively combined and separated.

4. The protective structure cleaning device according to claim 1 or 2, characterized in that: The injection structure is installed in the accommodation space on the side of the base; The injection structure further comprises a sealed box body, in which the injection body and the magnet are both arranged; A movable window is provided on the sealed box body, and the nozzle is accommodated in the window; the nozzle is sealedly connected to the inner wall of the window; and at least a part of the structure of the nozzle extends to the outside of the window.

5. The protective structure cleaning device according to claim 4, characterized in that: The nozzle is detachably sealed to the inner wall of the window.

6. The protective structure cleaning device according to claim 1 or 2, characterized in that: The protective structure cleaning device also has at least one of the following features: The protective structure cleaning device further comprises a valve disposed on the delivery pipeline, wherein the valve is used to adjust the flow rate and / or pressure; The magnet is mounted on the base through a bracket, the bracket is mounted inside the base, and the magnet and the bracket are rotatably connected; The electromagnet is installed between the base and a driving device that drives the base to rotate.

7. A semiconductor process equipment, characterized in that: include: A semiconductor process chamber, a base, a protective structure, and a protective structure cleaning device as claimed in any one of claims 1 to 6; The base, the protective structure and the protective structure cleaning device are all installed in the semiconductor process chamber; the protective structure is arranged on the periphery of the base and surrounds the base.

8. The semiconductor process equipment according to claim 7, characterized in that: Also includes: A control component connected to the electromagnet, the control component is used to supply power to the electromagnet and control the state of the electromagnet.

9. A method for cleaning a protective structure, characterized in that: The protective structure cleaning method is performed based on the protective structure cleaning device according to any one of claims 1 to 6, and the protective structure cleaning method includes: The base is driven to rotate, and the cleaning agent is delivered to the spray body through the delivery pipeline, so that the spray body sprays the cleaning agent toward the protective structure through its nozzle; and the electromagnet is energized and the direction of the energized current of the electromagnet is controlled to drive the magnet to swing, thereby driving the spray body to swing.

10. The protective structure cleaning method according to claim 9, characterized in that: There are a plurality of injection structures, and the plurality of injection structures are distributed at intervals along the circumference of the base; The protective structure cleaning method also includes: Delivering the cleaning agent to all the spraying bodies through the same set of delivery pipelines, so that all the spraying bodies simultaneously spray the cleaning agent toward the protective structure through their nozzles; All the magnets are driven to swing by one electromagnet, thereby driving all the injection bodies to swing; And / or, the protective structure cleaning method further comprises: The cleaning flow rate and / or cleaning pressure are adjusted by using a valve arranged on the delivery pipeline.

Images