Equipment for testing and packaging IGBT (Insulated Gate Bipolar Translator) at high temperature and normal temperature

Abstract

The invention discloses equipment for testing and packaging an IGBT (Insulated Gate Bipolar Translator) at high temperature and normal temperature. Comprising a machine table, and a feeding device, a carrying device, a visual detection device, a discharging device, a positioning device, an insulation and voltage resistance testing device, a heating device, a testing device, a cooling device, a turnover device, a turntable device, a laser marking device, a 3D detection device, a receiving and carrying device and a receiving device which are arranged beside the machine table. The equipment for testing and packaging the IGBT at the high temperature and the normal temperature has the beneficial effects that the equipment has multiple feeding and discharging modes, can meet full-automatic testing operation of IGBT products with different specifications, models and types, is high in speed, high in efficiency, high in testing accuracy, few in error and wide in application range compared with manual testing, and effectively replaces manual testing.

Description

Technical Field

[0001] The present invention relates to the field of IGBT, and in particular to a device for high-temperature and normal-temperature testing and packaging of IGBT. Background Art

[0002] IGBT products need to undergo a series of tests after packaging. Only IGBT products that pass the tests can be packaged, shipped off the production line, and put on the market.

[0003] Currently, the testing work for IGBT products relies on manual labor to move the packaged IGBT products to the testing equipment for high and low temperature, dynamic and static testing. The testing process requires heavy manual participation, which limits the improvement of testing efficiency.

[0004] Although there are some test lines on the market that can realize fully automatic testing operations of IGBT products, such test lines have a small application range and are generally only suitable for testing one or two IGBT products. If an enterprise develops a large number of IGBT products, it will cost a huge amount of money to configure multiple test lines, and the area occupied is also large. Therefore, in reality, manual testing of various IGBT products is still widely used. Summary of the invention

[0005] The main purpose of the invention is to provide a device for high-temperature and normal-temperature testing and packaging of IGBTs, aiming to solve the problems of small application range, insufficient practicality, slow manual testing speed and low efficiency of existing IGBT product testing lines.

[0006] In order to solve the above problems, the present invention proposes an equipment for high temperature and normal temperature testing and packaging of IGBT, including a machine and a loading device, a conveying device, a visual inspection device, a unloading device, a positioning device, an insulation withstand voltage testing device, a heating device, a testing device, a cooling device, a turning device, a turntable device, a laser marking device, a 3D inspection device, a receiving and conveying device, and a receiving device arranged beside the machine;

[0007] The feeding device includes a feeding tube feeding device, a vibrating plate feeding device and a tray feeding device;

[0008] The visual inspection device comprises a visual inspection device 1 and a visual inspection device 2;

[0009] The test device includes test device 1, test device 2, test device 3 and test device 4;

[0010] The flipping device comprises a flipping device 1 and a flipping device 2;

[0011] The material receiving device includes a tape packaging device and a material tube receiving device;

[0012] The feeding device is used to supply IGBT product materials to be tested, and the visual inspection device 1 is used to perform visual inspection on the IGBT product materials supplied by the feeding device. The IGBT product materials that pass the inspection are sent to the positioning device by the conveying device for positioning, and the IGBT product materials that fail the inspection are sent to the unloading device by the conveying device. The IGBT product materials that have been positioned are sent to the insulation withstand voltage testing device by the conveying device for insulation withstand voltage testing, and the IGBT product materials that pass the insulation withstand voltage test are sent to the heating device by the conveying device for heating, and the IGBT product materials that fail the insulation withstand voltage test are sent to the unloading device by the conveying device. The IGBT product materials that have been heated are sent to the positioning device by the conveying device for positioning, and the IGBT product materials that have been positioned are sent to the testing device 1 for high-temperature dynamic testing, and the IGBT product materials that pass the high-temperature dynamic testing are sent to the testing device 2 for high-temperature static testing by the conveying device, and the IGBT product materials that fail the high-temperature dynamic testing are sent to the unloading device by the conveying device, and the IGBT product materials that pass the high-temperature static testing are sent to the cooling device by the conveying device. The IGBT product materials that fail the high-temperature static test are sent to the unloading device by the conveying device, the IGBT product materials that have been cooled are sent to the positioning device by the conveying device for positioning, the IGBT product materials that have been positioned are sent to the testing device three by the conveying device for normal temperature dynamic test, the IGBT product materials that have passed the normal temperature dynamic test are sent to the testing device four for normal temperature static test, the IGBT product materials that fail the normal temperature dynamic test are sent to the unloading device by the conveying device, the IGBT product materials that have passed the normal temperature static test are sent to the flipping device one by the conveying device, the flipping device one flips the IGBT product materials 180 degrees and places them on the turntable device, the IGBT product materials that fail the normal temperature static test are sent to the unloading device by the conveying device, the turntable device drives the IGBT product materials to rotate around the vertical axis, and sequentially undergo laser marking by the laser marking device, visual inspection by the visual inspection device two, and three-dimensional laser line scanning inspection by the 3D inspection device, and finally are taken away by the flipping device two, and the IGBT product materials are flipped 180 degrees and then taken away by the receiving and conveying device and placed on the receiving device.

[0013] In one embodiment, the material pipe feeding device comprises:

[0014] A mounting frame 1 is provided with a material tube rack 1 and a translation device 2, the translation device 2 is connected to a translation plate 1, and the translation plate 1 is driven to move horizontally by the translation device 2, the translation plate 1 is horizontally arranged, a plurality of material tubes 1 are stacked and placed on the upper surface of the translation plate 1, and the plurality of material tubes 1 are slidably installed in the material tube rack 1 up and down, the material tube rack 1 is fixedly connected to the mounting frame 1, a material trough 1 is provided on the upper surface of the translation plate 1, the translation device 2 drives the translation plate 1 to move horizontally so that the material tube 1 at the bottom layer falls into the material trough 1 and is separated from the material tube rack 1, and the material tube 1 falling into the material trough 1 is driven by the translation device 2 to move synchronously with the translation plate 1 and is separated from the material tube 1 on the material tube rack 1;

[0015] Motor 1 is fixedly connected to mounting frame 1, a tube seat is rotatably mounted on the mounting frame 1, the tube seat is transmission-connected to motor 1, a pressing device is arranged on the tube seat, and the translation device 2 drives one end of the material tube 1 falling into the material trough 1 to translate between the tube seat and the pressing device, and the pressing device can press and fix one end of the material tube 1 on the tube seat;

[0016] The discharge pipe is tilted and arranged on the mounting frame 1. The motor 1 drives the pipe seat to rotate so that one end of the material pipe 1 is connected with the high end of the discharge pipe, and the IGBT product material in the tilted material pipe 1 slides down into the discharge pipe;

[0017] The stopper is arranged at the lower end of the discharge pipe and is used to prevent the IGBT product material from continuously sliding out of the discharge pipe.

[0018] In one embodiment, the tray loading device comprises:

[0019] A mounting plate four is fixedly connected to the machine platform, and a slide and a basket are arranged on the mounting plate four. A plurality of trays are slidably inserted in the basket, and the plurality of trays are stacked, and a plurality of IGBT product materials are placed in each tray;

[0020] A translation device 1 is arranged on the mounting plate 4, the translation device 1 is connected to the automatic gripper, and the translation device 1 drives the automatic gripper to move horizontally to the basket to grip the pallet, and pulls the pallet onto the slide, and the pallet is slidably connected to the slide;

[0021] The lifting device six is ​​fixedly connected to the mounting plate four and is used for lifting the basket so that each layer of the pallet is flush with the automatic gripper and the slide.

[0022] In one embodiment, the visual inspection device 1 comprises:

[0023] Visual camera 1, fixedly connected to the machine platform;

[0024] A reflector is fixedly connected to the machine platform;

[0025] The detection cylinder is fixedly connected to the machine platform;

[0026] The visual camera 1 is arranged horizontally, and the shooting light emitted by the visual camera 1 is reflected by the reflector and then passes through the detection tube vertically upward to irradiate the IGBT product material;

[0027] The IGBT product material on the tray loading device is taken away by the handling device and placed on the upper end of the detection cylinder, or the detection cylinder is arranged below the IGBT product material at the discharge end of the material tube loading device or the vibration plate loading device.

[0028] In one embodiment, the transport device comprises:

[0029] Mounting frame 2, fixedly connected to the machine platform;

[0030] A translation device four is fixedly connected to the mounting frame two;

[0031] The lifting device 1 is connected to the translation device 4, and the translation device 4 drives the lifting device 1 to move horizontally;

[0032] The suction head 1 is connected to the lifting device 1, and the suction head 1 is driven to rise and fall by the lifting device 1. The suction head 1 is used to suck and transfer IGBT product materials.

[0033] In one embodiment, the transport devices are multiple and are arranged in a straight line along the translation direction of the translation device 4. A ferry device is provided between two adjacent transport devices, and the ferry device includes:

[0034] A translation device three is fixedly connected to the machine platform;

[0035] The carrier one is connected to the translation device three, and the translation device three drives the carrier one to move horizontally, and the moving direction is parallel to the translation direction of the translation device four. The carrier one is provided with an electric heating device one for heating the IGBT product material placed on the carrier one;

[0036] One of the transport devices places the IGBT product material on carrier one, and the translation device three drives carrier one to move to the bottom of another transport device, and the other transport device takes away the IGBT product material on carrier one.

[0037] In one embodiment, the material unloading device includes a material box unloading device and a material tube unloading device;

[0038] The material box unloading device comprises:

[0039] A translation device 5, fixedly connected to the machine platform;

[0040] The NG material box is connected to the translation device 5, and the translation device 5 drives the NG material box to move horizontally;

[0041] The unqualified IGBT product materials after being inspected by the visual inspection device 1 are taken away by the handling device and placed in the NG material box;

[0042] The material pipe unloading device comprises:

[0043] The second material pipe rack is fixedly connected to the machine platform, and the NG material pipe is detachably and fixedly mounted on the second material pipe rack;

[0044] The translation device seven is fixedly connected to the material tube rack two. The IGBT product materials that fail the insulation withstand voltage test, the IGBT product materials that fail the high temperature dynamic test, the IGBT product materials that fail the high temperature static test, the IGBT product materials that fail the low temperature dynamic test, and the IGBT product materials that fail the low temperature static test are all taken away by the conveying device and placed on the material tube rack two at one end of the NG material tube, and then the translation device seven pushes the unqualified IGBT product materials into the NG material tube.

[0045] In one embodiment, the positioning device comprises:

[0046] Mounting plate 1, fixedly connected to the machine platform;

[0047] A translation device six is ​​fixedly connected to the mounting plate one, and a movable end of the translation device six is ​​connected to a movable positioning block;

[0048] The fixed positioning block is fixedly connected to the mounting plate one, and the translation device six pushes the movable positioning block to move horizontally toward the fixed positioning block. The IGBT product material is placed on the mounting plate one between the movable positioning block and the fixed positioning block, and the IGBT product material is clamped and positioned by the movable positioning block and the fixed positioning block.

[0049] In one embodiment, the insulation withstand voltage testing device comprises:

[0050] Sliding column 1, vertically fixed on the machine platform;

[0051] A second mounting plate is fixedly connected to the first sliding column, and a second lifting device is fixedly installed on the second mounting plate;

[0052] The mounting plate 3 is located at the lower end of the mounting plate 2 and is connected to the sliding column 1 for sliding up and down movement. The movable end of the lifting device 2 is connected to the mounting plate 3, and the mounting plate 3 is driven to rise and fall by the lifting device 2. The lower surface of the mounting plate 3 is fixedly installed with a test probe row;

[0053] Motor 2 is fixedly connected to the machine platform, and a carrier plate 1 is installed on the motor 2, and the carrier plate 1 is driven to rotate around the vertical axis by the motor 2;

[0054] The positioned IGBT product material is placed at one end of carrier plate 1 by the handling device, and the motor 2 drives one end of carrier plate 1 to rotate to just below the test probe row, and the lifting device 2 drives the test probe row down to contact the IGBT product material for insulation withstand voltage test.

[0055] In one embodiment, the heating device comprises:

[0056] A mounting frame 3, on which a translation device 8 and a slide rail are horizontally fixedly mounted, a mounting frame 4 is slidably mounted on the slide rail, the mounting frame 4 is connected to the translation device 8, and the translation device 8 drives the mounting frame 4 to slide horizontally along the slide rail;

[0057] The second carrier plate is fixedly mounted on the upper end of the mounting frame 4, and the upper surface of the second carrier plate is provided with a plurality of placement holes for placing IGBT product materials;

[0058] The electric heating device 2 is fixedly connected to the mounting frame 4 and is used for heating the loading plate 2;

[0059] A temperature measuring device, fixedly connected to the mounting frame 4, for detecting the heating temperature of the electric heating device 2;

[0060] The machine cover is arranged outside the translation device 8, the slide rail, the mounting frame 4, the loading plate 2, the electric heating device 2, and the temperature measuring device, and is fixedly connected to the mounting frame 3. The upper surface of the machine cover is provided with a material taking and discharging port. The IGBT product materials that have passed the insulation withstand voltage test are driven down by the handling device and passed through the material taking and discharging port and placed in the placement hole.

[0061] Beneficial effects: The device for high-temperature and normal-temperature testing and packaging of IGBTs in the present application has multiple loading and unloading methods, and can meet the full-automatic testing operations of IGBT products of various specifications and models and different types. Compared with manual testing, it has fast speed, high efficiency, high test accuracy, few errors, wide application range, and effectively replaces manual testing;

[0062] In addition, the device used for high-temperature and normal-temperature testing and packaging of IGBTs in the present application can perform various characteristic tests of IGBT products and various quality inspections after testing. The testing functions are rich and comprehensive, the test results are accurate and efficient, and the test speed, accuracy and efficiency are greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0064] Figure 1 It is a structural schematic diagram of a device for high-temperature and normal-temperature testing and packaging of IGBTs according to the present invention;

[0065] Figure 2 It is a top view of a device for high-temperature and normal-temperature testing and packaging of IGBTs according to the present invention;

[0066] Figure 3 yes Figure 1 A magnified view of part A in FIG.

[0067] Figure 4 It is a structural schematic diagram of the material tube feeding device of the present invention;

[0068] Figure 5 It is a structural schematic diagram of the vibrating plate feeding device of the present invention;

[0069] Figure 6 It is a structural schematic diagram of the tray loading device of the present invention;

[0070] Figure 7 It is a structural schematic diagram of the material box unloading device of the present invention;

[0071] Figure 8 It is a schematic diagram of the structure of the positioning device of the present invention;

[0072] Fig. 9 It is a structural schematic diagram of the material pipe unloading device of the present invention;

[0073] Fig.10 It is a structural schematic diagram of the insulation withstand voltage test device of the present invention;

[0074] Fig.11 It is a structural schematic diagram of the heating device of the present invention;

[0075] Fig.12 It is the internal structure diagram of the heating device of the present invention;

[0076] Fig.13 It is a schematic structural diagram of the handling device of the present invention;

[0077] Fig.14 It is a structural schematic diagram of the testing device of the present invention;

[0078] Fig.15 It is a structural schematic diagram of the ferry device of the present invention;

[0079] Fig.16 is an internal structural diagram of the cooling device of the present invention;

[0080] Fig.17 It is a schematic diagram of the structure of the turning device of the present invention;

[0081] Fig.18 It is a schematic structural diagram of the turntable device of the present invention;

[0082] Fig.19 It is a schematic structural diagram of the laser marking device of the present invention;

[0083] Fig. 20 It is a structural schematic diagram of the second visual inspection device of the present invention;

[0084] Fig.21 It is a schematic diagram of the structure of the 3D detection device of the present invention;

[0085] Fig. 22 It is a structural schematic diagram of the material receiving and handling device of the present invention;

[0086] Fig.23 It is a structural schematic diagram of the tape packaging device of the present invention;

[0087] Fig.24 It is a structural schematic diagram of the material tube receiving device of the present invention.

[0088] The following are the descriptions of the reference numerals:

[0089] 1. Material tube feeding device; 100. Stopper; 101. Mounting frame 1; 102. Material tube frame 1; 103. Material tube 1; 104. Translation device 2; 105. Translation plate 1; 106. Motor 1; 107. Tube seat; 108. Pressing device; 109. Discharging tube;

[0090] 2. Ferry device 1; 201. Translation device 3; 202. Carrier 1; 203. Electric heating device 1;

[0091] 3. Visual inspection device 1; 301. Visual camera 1; 302. Reflector; 303. Inspection tube;

[0092] 4. Carrying device; 41. Mounting frame 2; 42. Translation device 4; 43. Lifting device 1; 44. Suction head 1;

[0093] 5. Material box unloading device; 51. Translation device 5; 52. NG material box;

[0094] 6. Positioning device 1; 61. Mounting plate 1; 62. Translation device 6; 63. Movable positioning block; 64. Fixed positioning block;

[0095] 7. Insulation withstand voltage test device; 71. Mounting plate 2; 72. Sliding column 1; 73. Mounting plate 3; 74. Test probe row; 75. Lifting device 2; 76. Motor 2; 77. Carrying plate 1;

[0096] 8. Material tube unloading device 1; 81. Material tube rack 2; 82. NG material tube; 83. Translation device 7;

[0097] 9. Heating device; 90. Material loading and unloading port; 91. Mounting frame 3; 92. Translation device 8; 93. Slide rail; 94. Mounting frame 4; 95. Temperature measuring device; 96. Electric heating device 2; 97. Loading plate 2; 98. Placement hole; 99. Machine cover;

[0098] 10. Machine platform; 11. Positioning device 2;

[0099] 12. Test device 1; 121. Test machine body; 122. Test module; 123. Motor 3; 124. Carrier 3; 125. Slider 2; 126. Spring; 127. Carrier 2; 128. Lifting device 3;

[0100] 13. Material tube unloading device 2; 14. Testing device 2; 15. Material tube unloading device 3;

[0101] 16. Cooling device; 161. Cooling water pipe;

[0102] 17. Ferry device 2; 18. Positioning device 3; 19. Testing device 3; 20. Material tube unloading device 4; 21. Testing device 4; 22. Material tube unloading device 5;

[0103] 23. Flipping device 1; 231. Lifting device 4; 232. Rotating device 1; 233. Suction head 2;

[0104] 24. Turntable device; 241. Rotating device 2; 242. Turntable;

[0105] 25. Laser marking device;

[0106] 26. Visual inspection device 2; 261. Mounting frame 5; 262. Visual camera 2; 263. Light source;

[0107] 27. 3D detection device; 271. Translation device nine; 272. 3D laser line scanner;

[0108] 28. Flipping device 2;

[0109] 29. Material receiving and handling device; 291. Three-axis translation device; 292. Motor 4; 293. Suction head 3;

[0110] 30. Tape and roll packaging device;

[0111] 31. Material tube receiving device; 311. Mounting frame 6; 312. Lifting device 5; 313. Transverse moving device; 314. Translation plate 2; 315. Material trough 2; 316. Material tube 2; 317. Material tube rack 3; 318. Feeding tube; 319. Translation device 10;

[0112] 32. Material tube unloading device 6;

[0113] 33. Vibrating plate feeding device;

[0114] 34. Pallet loading device; 341. Mounting plate four; 342. Translation device one; 343. Automatic gripper; 344. Lifting device six; 345. Basket; 346. Pallet; 347. Slide;

[0115] 35. IGBT product materials. DETAILED DESCRIPTION

[0116] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0117] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0118] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0119] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0120] The present invention proposes a device for high-temperature and normal-temperature testing and packaging of IGBTs. The device for high-temperature and normal-temperature testing and packaging of IGBTs has a variety of loading and unloading methods, and can meet the full-automatic testing operations of IGBT products of various specifications, models and types. Compared with manual testing, it has fast speed, high efficiency, high test accuracy, few errors, wide application range, and can effectively replace manual testing.

[0121] In addition, the device used for high-temperature and normal-temperature testing and packaging of IGBTs in the present application can perform various characteristic tests of IGBT products and various quality inspections after testing. The testing functions are rich and comprehensive, the test results are accurate and efficient, and the test speed, accuracy and efficiency are greatly improved.

[0122] Specifically, in one embodiment of the invention, Figure 1 and Figure 2 As shown, the equipment for high-temperature and normal-temperature testing and packaging of IGBT includes a machine 10 and a loading device, a conveying device 4, a visual inspection device, a unloading device, a positioning device, an insulation withstand voltage test device 7, a heating device 9, a testing device, a cooling device 16, a turning device, a turntable device 24, a laser marking device 25, a 3D inspection device 27, a material receiving and conveying device 294, and a material receiving device arranged beside the machine 10;

[0123] like Figure 1 and Figure 2 As shown, the feeding device is used for feeding IGBT product materials 35, and the feeding device includes a material tube feeding device 1, a vibration plate feeding device 33 and a tray feeding device 34. The three feeding methods can meet the feeding operation of most types of IGBT product materials 35. Compared with the single feeding method of conventional testing equipment, it has a wide range of applications and can effectively meet the full-automatic testing operation of various specifications and types of IGBT products;

[0124] like Figure 1 and Figure 2 As shown, the transport device 4 is used to drive the IGBT product material 35 to move between the loading device, the visual inspection device, the unloading device, the positioning device, the insulation withstand voltage test device 7, the heating device 9, the test device, the cooling device 16, and the flipping device;

[0125] The visual inspection device includes a visual inspection device 1 3 and a visual inspection device 2 26. Figure 1-Figure 3 As shown, the visual inspection device 1 3 is used to perform preliminary visual inspection on the IGBT product material 35 supplied by the feeding device to screen out unqualified IGBT product materials 35 with damaged surfaces; the visual inspection device 2 26 is used for character inspection after laser marking;

[0126] The unloading device is used for unloading unqualified NG products after visual inspection, insulation withstand voltage test, high temperature dynamic and static test, and normal temperature dynamic and static test. The NG products are unqualified IGBT product materials 35. Specifically, the unloading device includes a material box unloading device 5 and a material tube unloading device. The two unloading methods can meet the unloading operations of most types of IGBT product materials 35. Compared with the single unloading method of conventional testing equipment, it has a wide range of applications and can effectively meet the needs of various specifications and models and different types of IGBTs. The product is fully automatically tested. The unqualified NG products detected by the visual inspection device 3 are transferred by the conveying device 4 to the material box unloading device 5 for unloading. The material tube unloading device includes a material tube unloading device 1 8, a material tube unloading device 2 13, a material tube unloading device 3, a material tube unloading device 4, a material tube unloading device 5, and a material tube unloading device 6 32. The structures of the material tube unloading device 1 8, the material tube unloading device 2 13, the material tube unloading device 3, the material tube unloading device 4, the material tube unloading device 5, and the material tube unloading device 6 32 are exactly the same. The difference is that Figure 1 and Figure 2 As shown, unqualified NG products after the insulation withstand voltage test are transferred by the conveying device 4 to the material tube unloading device 1 8 for unloading, unqualified NG products after the high-temperature dynamic test are transferred by the conveying device 4 to the material tube unloading device 2 13 for unloading, unqualified NG products after the high-temperature static test are transferred by the conveying device 4 to the material tube unloading device 3 for unloading, unqualified NG products after the normal temperature dynamic test are transferred by the conveying device 4 to the material tube unloading device 4 for unloading, unqualified NG products after the normal temperature static test are transferred by the conveying device 4 to the material tube unloading device 5 for unloading, and unqualified NG products after the inspection by the visual inspection device 2 26 and the 3D inspection device 27 are transferred by the receiving and conveying device 294 to the material tube unloading device 6 32 for unloading;

[0127] The positioning device is used for secondary positioning of the IGBT product material 35 before the insulation withstand voltage test, high temperature dynamic and static test, and normal temperature dynamic and static test, so as to ensure the accuracy of subsequent tests, avoid test errors or test failures caused by inaccurate placement of the IGBT product material 35, and ensure that the test operation proceeds smoothly and normally; specifically, the positioning device includes a positioning device 1 6, a positioning device 2 11, and a positioning device 3 18. The structures of the positioning device 1 6, the positioning device 2 11, and the positioning device 3 18 are exactly the same, except that Figure 1 and Figure 2 As shown, the positioning device 1 6 is used for secondary positioning before the insulation withstand voltage test of the IGBT product material 35, the positioning device 2 11 is used for secondary positioning before high temperature dynamic and static tests, and the positioning device 3 18 is used for secondary positioning before normal temperature dynamic and static tests;

[0128] The insulation withstand voltage test device 7 is used for the insulation withstand voltage test of the IGBT product material 35;

[0129] The heating device 9 is used for preheating the IGBT product material 35 before high temperature dynamic testing;

[0130] The test device includes a test device 12, a test device 2 14, a test device 3 19, and a test device 4 21. The test device 12, the test device 2 14, the test device 3 19, and the test device 4 21 have the same structure, and the difference lies in that the test programs running during the working process are different. Specifically, Figure 1 and Figure 2 As shown, the test device 1 12 is used for high temperature dynamic testing of the IGBT product material 35, the test device 2 14 is used for high temperature static testing of the IGBT product material 35, the test device 3 19 is used for normal temperature dynamic testing of the IGBT product material 35, and the test device 4 21 is used for normal temperature static testing of the IGBT product material 35;

[0131] The cooling device 16 is used to cool down the IGBT product material 35 before the normal temperature dynamic test, because the temperature of the IGBT product material 35 is relatively high after the high temperature static test, and needs to be cooled to normal temperature before the normal temperature dynamic test can be performed;

[0132] The flipping device is used to drive the IGBT product material 35 to flip 180 degrees to facilitate laser marking and material collection. Specifically, the flipping device includes a flipping device 23 and a flipping device 28. The flipping device 23 and the flipping device 28 have the same structure. The difference is that Figure 1 and Figure 2 As shown, the flipping device 1 23 is used to pick up the qualified IGBT product material 35 after the normal temperature static test sent by the conveying device 4, and flip the IGBT product material 35 180 degrees and place it on the turntable device 24. After the IGBT product material 35 on the turntable device 24 is laser marked and tested, the flipping device 28 picks up the IGBT product material 35 and flips the IGBT product material 35 180 degrees to be taken away by the material receiving and conveying device 294 for collection;

[0133] The turntable device 24 is used to drive the IGBT product material 35 to pass through the laser marking device 25, the visual inspection device 26, the 3D inspection device 27, the flip device 28, and the material receiving and handling device 294 in sequence, and successfully complete the laser marking, inspection and material receiving of the IGBT product material 35;

[0134] The laser marking device 25 is used for laser marking of the IGBT product material 35 to give the IGBT product material 35 identity information;

[0135] The 3D inspection device 27 is used to inspect the external dimensions of the IGBT product material 35 and determine whether the IGBT product material 35 is intact after a series of tests, handling, and flipping;

[0136] The material receiving and transporting device 294 is used to pick up the IGBT product material 35 and send it to the material receiving device for receiving;

[0137] The material receiving device is used for packaging IGBT product materials 35, specifically, Figure 1 and Figure 2 As shown, the material receiving device includes a tape packaging device 30 and a material tube receiving device 31. The two material receiving methods can meet the material receiving operations of most types of IGBT product materials 35. Compared with the single material receiving method of conventional testing equipment, it has a wide range of applications and can effectively meet the full-automatic testing operations of various specifications and models and different types of IGBT products.

[0138] The working process of an apparatus for high-temperature and normal-temperature testing and packaging of IGBTs in this embodiment is as follows: the feeding device is used to supply IGBT product materials 35 to be tested, the visual inspection device 3 is used to perform visual inspection on the IGBT product materials 35 supplied by the feeding device, the IGBT product materials 35 that pass the inspection are sent by the conveying device 4 to the positioning device 6 for positioning, the IGBT product materials 35 that fail the inspection are sent by the conveying device 4 to the material box unloading device 5, the IGBT product materials 35 that have been positioned by the positioning device 6 are sent by the conveying device 4 to the insulation withstand voltage testing device 7 for insulation withstand voltage testing, the IGBT product materials 35 that pass the insulation withstand voltage testing are sent by the conveying device 4 to the heating device 9 for heating, and the insulation withstand voltage testing is completed. The IGBT product material 35 that fails the high-pressure test is sent by the conveying device 4 to the material tube unloading device 18, the IGBT product material 35 that has been heated is sent by the conveying device 4 to the positioning device 2 11 for positioning, the IGBT product material 35 that has been positioned is sent by the conveying device 4 to the testing device 12 for high-temperature dynamic testing, the IGBT product material 35 that passes the high-temperature dynamic test is sent by the conveying device 4 to the testing device 2 14 for high-temperature static testing, the IGBT product material 35 that fails the high-temperature dynamic test is sent by the conveying device 4 to the material tube unloading device 2 13, the IGBT product material 35 that passes the high-temperature static test is sent by the conveying device 4 to the cooling device 16 for cooling, and the IGBT product material 35 that fails the high-temperature static test is The conveying device 4 is sent to the material tube unloading device three, the IGBT product material 35 that has been cooled is sent to the positioning device three by the conveying device 4 for positioning, the IGBT product material 35 that has been positioned is sent to the testing device three 19 by the conveying device 4 for a normal temperature dynamic test, the IGBT product material 35 that has passed the normal temperature dynamic test is sent to the testing device four 21 by the conveying device 4 for a normal temperature static test, the IGBT product material 35 that has failed the normal temperature dynamic test is sent to the material tube unloading device four by the conveying device 4, the IGBT product material 35 that has passed the normal temperature static test is sent to the flipping device one 23 by the conveying device one 23, the flipping device one 23 flips the IGBT product material 35 180 degrees and places it on the turntable device 24, the IGBT product material 35 that has failed the normal temperature static test is sent to the turning device one 23 by the conveying device one 23, the turning device one 23 flips the IGBT product material 35 180 degrees and places it on the turntable device 24, The IGBT product material 35 is sent to the material tube unloading device five by the conveying device 4, and the turntable device 24 drives the IGBT product material 35 to rotate around the vertical axis, and sequentially undergoes laser marking by the laser marking device 25, visual inspection by the visual inspection device 26, and three-dimensional laser line scanning inspection by the 3D inspection device 27, and is finally taken away by the flipping device 28, and the IGBT product material 35 is flipped 180 degrees and then taken away by the material receiving and conveying device 294. The material receiving and conveying device 294 places the IGBT product material 35 that has passed the inspection by the visual inspection device 26 and the 3D inspection device 27 on the material receiving device for material receiving and packaging. For the IGBT product material 35 that has failed the inspection, the material receiving and conveying device 294 sends it to the material tube unloading device six 32.

[0139] It can be seen that the equipment for high-temperature and normal-temperature testing and packaging of IGBT in the present embodiment has a variety of loading and unloading methods, which can meet the full-automatic testing operations of IGBT products of various specifications and models and different types. Compared with manual testing, it has fast speed, high efficiency, high test accuracy, few errors, wide application range, and effectively replaces manual testing; in addition, the equipment for high-temperature and normal-temperature testing and packaging of IGBT in the present embodiment can perform various characteristic tests of IGBT products (such as insulation withstand voltage test, high-temperature dynamic and static test, normal temperature dynamic and static test) and various quality inspections after testing (such as visual inspection of visual inspection device 26, three-dimensional laser line scanning inspection of 3D inspection device 27), the test functions are rich and comprehensive, the test results are accurate and efficient, and the test speed, accuracy and efficiency are greatly improved.

[0140] Specifically, Figure 4As shown, the material tube feeding device 1 includes: a mounting frame 101, a motor 106, a discharge pipe 109, and a stopper 100. A material tube rack 102 and a second translation device 104 are fixedly installed on the mounting frame 101. The second translation device 104 is connected to a translation plate 105, and the translation plate 105 is driven to move horizontally by the second translation device 104. The translation plate 105 is horizontally arranged, and a plurality of material tubes 103 are stacked on the upper surface of the translation plate 105. Each material tube 103 is filled with IGBT product materials 35. A plurality of material tubes 103 are slidably installed in the material tube rack 102 up and down. The material tube rack 102 is fixedly connected to the mounting frame 101. The translation plate 105 is horizontally arranged. 5 is provided with a material trough 1, the translation device 2 104 drives the translation plate 105 to move horizontally so that the material tube 103 at the bottom layer falls into the material trough 1 and is separated from the material tube rack 102. The material tube 103 falling into the material trough 1 follows the translation plate 105 to translate synchronously and separates from the material tube 103 on the material tube rack 102 under the drive of the translation device 2 104, and the remaining material tube 103 on the material tube rack 102 descends and is slidably connected to the upper surface of the translation plate 105 again. The motor 106 is fixedly connected to the mounting frame 101, and a tube seat 107 is rotatably installed on the mounting frame 101. The tube seat 107 is transmission-connected to the motor 106, and a downward pressing device is provided on the tube seat 107. 108, the translation device 104 drives one end of the material tube 103 that falls into the material trough 1 to translate between the tube seat 107 and the pressing device 108, and the action of the pressing device 108 can press and fix one end of the material tube 103 on the tube seat 107; the discharge pipe 109 is tilted on the mounting frame 101, and the motor 106 drives the tube seat 107 and the material tube 103 to rotate so that the tilted downward end of the material tube 103 is connected with the high end of the discharge pipe 109, and the IGBT product material 35 in the tilted material tube 103 slides out of the material tube 103 and into the discharge pipe 109 under the action of its own weight. After all the IGBT product material 35 in the material tube 103 slides out, the motor 106 is controlled to 6 drives the tube seat 107 and the material tube 103 to rotate in the opposite direction to reset, and releases the pressing device 108 to take away the material tube 103, and then controls the translation device 104 to drive the translation plate 105 to move horizontally so that the lowest material tube 103 on the material tube rack 102 falls into the material trough 1 and is separated from the material tube rack 102, and then the material tube 103 falling into the material trough 1 is driven by the translation device 104 to follow the translation plate 105 to translate synchronously and separate from the material tube 103 on the material tube rack 102, until one end of the material tube 103 is translated again to between the tube seat 107 and the pressing device 108, so that the IGBT product material 35 in each material tube 103 can be delivered to the discharge pipe 109.

[0141] In this embodiment, if Figure 4As shown, the stopper 100 is arranged at the lower end of the discharge pipe 109, and is used to prevent the IGBT product material 35 from continuously sliding out of the discharge pipe 109, ensuring that only one IGBT product material 35 slides out of the lower end of the discharge pipe 109 at any time. After the conveying device 4 takes away the IGBT product material 35, another IGBT product material 35 slides out of the lower end of the discharge pipe 109.

[0142] Specifically, Figure 5 As shown, the structure of the vibration plate feeding device 33 is common knowledge in the industry, so it will not be described in detail herein.

[0143] Specifically, Figure 6 As shown, the tray loading device 34 includes: a mounting plate 4 341, a translation device 1 342, and a lifting device 6 344. The mounting plate 4 341 is fixedly connected to the machine 10. A slide 347 and a basket 345 are arranged on the mounting plate 4 341. The slide 347 is fixedly connected to the mounting plate 4 341. A plurality of trays 346 are slidably inserted in the basket 345. The plurality of trays 346 are stacked, and a plurality of IGBT product materials 35 are placed in each tray 346. The translation device 1 342 is fixed on the mounting plate 4 341. The translation device 1 342 is connected to an automatic gripper 343. The automatic gripper 343 includes an electric gripper, a hydraulic gripper, or a pneumatic gripper. The automatic gripper 343 is driven by the translation device 1 342 to move horizontally to the basket 345 to grip the tray 346. And pull the pallet 346 onto the slide 347, and the pallet 346 is horizontally slidably connected to the upper end of the slide 347; the lifting device six 344 is fixedly connected to the mounting plate four 341, and is used to lift the basket 345, so that each layer of pallet 346 is flush with the automatic gripper 343 and the slide 347, so that the automatic gripper 343 can clamp the pallet 346 and pull the pallet 346 onto the slide 347, and the transport device 4 goes to the pallet 346 on the slide 347 to take away the IGBT product material 35. After the IGBT product material 35 on the pallet 346 is taken away, the automatic gripper 343 pushes the pallet 346 back into the basket 345, and then the basket 345 rises or falls, and the automatic gripper 343 clamps other pallets 346 fully loaded with IGBT product materials 35 and pulls the pallet 346 onto the slide 347.

[0144] Specifically, Figure 3As shown, the visual inspection device 3 includes: a visual camera 301, a reflector 302, and a detection tube 303. The visual camera 301 is fixedly connected to the machine 10; the reflector 302 is fixedly connected to the machine 10; the detection tube 303 is fixedly connected to the machine 10; the visual camera 301 is horizontally arranged, and the shooting light emitted by the visual camera 301 is reflected by the reflector 302 and then vertically upwards passes through the detection tube 303 to illuminate the IGBT product material 35 to perform visual inspection on the IGBT product material 35.

[0145] Specifically, when the loading device is a tray loading device 34, the IGBT product material 35 in the tray 346 is taken away by the conveying device 4 and placed on the upper end of the detection cylinder 303 for detection. When the loading device is a material tube loading device 1 or a vibration disk loading device 33, the detection cylinder 303 is installed below the IGBT product material 35 at the discharge end of the material tube loading device 1 or the vibration disk loading device 33, and the IGBT product material 35 is directly detected after the discharge end discharges the material.

[0146] Specifically, Figure 7 As shown, the material box unloading device 5 includes: a translation device 51 and an NG material box 52, the translation device 51 is fixedly connected to the machine table 10; the NG material box 52 is connected to the translation device 51, and the translation device 51 drives the NG material box 52 to move horizontally; the unqualified IGBT product material 35 after inspection by the visual inspection device 3 is taken away by the conveying device 4 and placed in the NG material box 52, and after the NG material box 52 is filled with NG material, the translation device 51 is controlled to drive the NG material box 52 to move horizontally to the unloading position, and the NG material box 52 is taken away manually or by a robot, and replaced with a new NG material box 52, and then the translation device 51 drives the NG material box 52 to reset, and continue to hold the NG material sent by the conveying device 4.

[0147] Specifically, Figure 8 As shown, the positioning device includes: a mounting plate 61, a translation device 62, and a fixed positioning block 64, the mounting plate 61 is fixedly connected to the machine 10; the translation device 62 is fixedly connected to the mounting plate 61, and the movable end of the translation device 62 is connected to the movable positioning block 63; the fixed positioning block 64 is fixedly connected to the mounting plate 61, and the translation device 62 pushes the movable positioning block 63 to move horizontally toward the fixed positioning block 64; for the positioning device 6, the qualified IGBT product material 35 after inspection by the visual inspection device 3 is taken away by the conveying device 4 and placed on the mounting plate 61 between the movable positioning block 63 and the fixed positioning block 64, and then the translation device 62 is controlled to push the movable positioning block 63 to move horizontally toward the fixed positioning block 64, and the IGBT product material 35 is clamped and positioned by the movable positioning block 63 and the fixed positioning block 64.

[0148] Specifically, Fig. 9 As shown, the material tube unloading device includes: a material tube rack 81 and a translation device 83. The material tube rack 81 is fixedly connected to the machine 10, and an NG material tube 82 is detachably fixedly installed on the material tube rack 81; the translation device 83 is fixedly connected to the material tube rack 81; for the material tube unloading device 8, the IGBT product material 35 that fails the insulation withstand voltage test is taken away by the conveying device 4 and placed on the material tube rack 81 at one end of the NG material tube 82, and then the translation device 83 pushes the unqualified IGBT product material 35 into the NG material tube 82. After the NG material tube 82 is full of NG material, the NG material tube 82 can be replaced manually.

[0149] Specifically, Fig.10 As shown, the insulation withstand voltage test device 7 includes: a slide column 1 72, a mounting plate 2 71, a mounting plate 3 73, and a motor 2 76. The slide column 1 72 is vertically fixedly installed on the machine 10; the mounting plate 2 71 is fixedly connected to the slide column 1 72, and a lifting device 2 75 is fixedly installed on the mounting plate 2 71; the mounting plate 3 73 is located at the lower end of the mounting plate 2 71, and is connected to the slide column 1 72 for sliding up and down, and the movable end of the lifting device 2 75 is connected to the mounting plate 3 73, and the mounting plate 3 73 is driven to rise and fall by the lifting device 2 75, and a test probe row 74 is fixedly installed on the lower surface of the mounting plate 3 73; the motor 2 76 is fixedly connected to the machine 10, and a carrier plate 1 77 is installed on the motor 2 76, and the carrier plate 1 77 is driven to return around the vertical axis by the motor 2 76 The IGBT product material 35 positioned by the positioning device 6 is placed by the conveying device 4 on one end of the carrier plate 77, and the motor 2 76 drives one end of the carrier plate 77 to rotate 180 degrees to directly under the test probe row 74, and the lifting device 2 75 drives the test probe row 74 to descend and contact the IGBT product material 35 for insulation withstand voltage test. After the test, the motor 2 76 drives the carrier plate 77 to rotate 180 degrees and leave from directly under the test probe row 74, and then the conveying device 4 takes away the IGBT product material 35 that has been inspected on the carrier plate 77, and places the next IGBT product material 35 to be tested. At the same time, the IGBT product material 35 at the other end of the carrier plate 77 rotates to directly under the test probe row 74 for insulation withstand voltage test.

[0150] Specifically, Fig.11 and Fig.12As shown, the heating device 9 includes: a mounting frame 3 91, a carrier plate 2 97, an electric heating device 92, a temperature measuring device 95, and a hood 99. A translation device 8 92 and a slide rail 93 are horizontally fixedly installed on the mounting frame 3 91, and a mounting frame 4 94 is slidably installed on the slide rail 93. The mounting frame 4 94 is connected to the translation device 8 92, and the mounting frame 4 94 is driven to slide horizontally along the slide rail 93 by the translation device 8 92; the carrier plate 2 97 is fixedly installed on the upper end of the mounting frame 4 94, and a plurality of placement holes 98 for placing IGBT product materials 35 are provided on the upper surface of the carrier plate 2 97; the electric heating device 92 is fixedly connected to the mounting frame 4 94, and is used to heat the carrier plate 2 97, and then heat the IGBT product material 35 in the placement hole 98; the temperature measuring device 95 is connected to the mounting frame 4 94 is fixedly connected to detect the heating temperature of the electric heating device 92; the hood 99 is arranged outside the translation device 8 92, the slide rail 93, the mounting frame 4 94, the loading plate 2 97, the electric heating device 92, and the temperature measuring device 95, and is fixedly connected to the mounting frame 3 91. With this design, the hood 99 can not only protect the normal operation of the heating device 9, but also can be made of thermal insulation materials to make the hood 99 thermally insulated and reduce the energy consumption of the heating device 9. The upper surface of the hood 99 is provided with a material taking and discharging port 90. The IGBT product material 35 that has passed the insulation withstand voltage test is transferred by the conveying device 4 to the top of the material taking and discharging port 90 of the heating device 9, and then the conveying device 4 drives the IGBT product material 35 to descend through the material taking and discharging port 90 to place the IGBT product material 35 in the placement hole 98.

[0151] Specifically, Fig.16 As shown, the structure of the cooling device 16 is different from that of the heating device 9 in that the electric heating device 9 is replaced by a cooling water pipe 161 , and the IGBT product material 35 in the placement hole 98 is cooled by circulating cooling water in the cooling water pipe 161 .

[0152] Specifically, Fig.13 As shown, the transport device 4 includes: a mounting frame 41, a translation device 42, a lifting device 43 and a suction head 44. The mounting frame 41 is fixedly connected to the machine 10; the translation device 42 is fixedly connected to the mounting frame 41; the lifting device 43 is connected to the translation device 42, and the lifting device 43 is driven to move horizontally by the translation device 42; the suction head 44 is connected to the lifting device 43, and the suction head 44 is driven to move up and down by the lifting device 43. The suction head 44 is used to suck and transfer the IGBT product material 35.

[0153] Further, such as Figure 1 and Figure 2As shown, the transport devices 4 are multiple and are arranged in a straight line along the translation direction of the translation device 42. A ferry device is provided between two adjacent transport devices 4. The ferry device is used to connect two adjacent transport devices 4 so that the two adjacent transport devices 4 can smoothly undertake the transfer work of the IGBT product material 35. Specifically, Figure 1 and Figure 2 As shown, the ferry device includes a ferry device 1 2 and a ferry device 2 17. The structures of the ferry device 1 2 and the ferry device 2 17 are exactly the same, and the difference lies in the different settings.

[0154] Specifically, Fig.15 As shown, the ferry device includes: a translation device 3 201 and a carrier 1 202, wherein the translation device 3 201 is fixedly connected to the machine 10; the carrier 1 202 is connected to the translation device 3 201, and the carrier 1 202 is driven to move horizontally by the translation device 3 201, and the moving direction is parallel to the translation direction of the translation device 4 42, and the carrier 1 202 is provided with an electric heating device 9-203, which is used to heat the IGBT product material 35 placed on the carrier 1 202, so as to keep the IGBT product material 35 warm and avoid the temperature drop of the IGBT product material 35 before the high-temperature dynamic test, which does not meet the test requirements. For the ferry device 1 2, Figure 1-Figure 2 The first transport device 4 from left to right places the IGBT product material 35 on the carrier 1 202 of the ferry device 1 2, and the translation device 3 201 drives the carrier 1 202 to move right to the bottom of the second transport device 4 from left to right, and the second transport device 4 from left to right takes away the IGBT product material 35 on the carrier 1 202, thereby completing the transfer of the IGBT product material 35 by the two adjacent transport devices 4 smoothly.

[0155] Specifically, Fig.14 As shown, the test device includes an IGBT module power tester, a motor three 123, a carrier plate three 124, a slide column two 125, a spring 126, a carrier two 127, and a lifting device three 128. The IGBT module power tester includes a test machine body 121 and a test module 122. The test machine body 121 and the test module 122 are signal-connected and are used to perform high-temperature dynamic testing, high-temperature static testing, normal temperature dynamic testing, and normal temperature static testing on the IGBT product material 35. Since the IGBT module power tester is common knowledge in the industry, this article will not introduce its working principle in detail.

[0156] In this embodiment, if Fig.14As shown, the motor three 123 is fixedly connected to the machine 10, and a carrier plate three 124 is installed on the motor three 123. The carrier plate three 124 is driven to rotate around the vertical axis by the motor three 123. A slide column two 125 is vertically slidably installed on the carrier plate three 124. The lower end of the slide column two 125 is connected to a spring 126, and the upper end of the slide column two 125 is connected to a carrier two 127. The structure of the carrier two 127 is the same as that of the carrier one 202. A lifting device three 128 is arranged directly below the test module 122, and the lifting device three 128 is not connected to the carrier two 127. The handling device 4 places the IGBT product material 35 on the carrier two 127 at one end of the carrier plate three 124, and the motor three 123 drives the carrier plate three 124 to rotate 180 degrees. , so that the carrier 2 127 at one end of the carrier plate 3 124 moves to the right below the test module 122, and then the lifting device 3 128 lifts the carrier 2 127 to contact the test module 122 for testing. After the test, the lifting device 3 128 is reset, and the carrier 2 127 automatically drops and resets after separating from the lifting device 3 128. The motor 3 123 drives the carrier plate 3 124 to rotate 180 degrees so that the carrier 2 127 at one end of the carrier plate 3 124 leaves from the right below the test module 122. Then the transport device 4 takes away the IGBT product material 35 that has been tested, and then places the next IGBT product material 35 to be tested. At the same time, the carrier 2 127 at the other end of the carrier plate 3 124 moves to the right below the test module 122 to continue testing. Fig.14 As shown, for the test device 12 , the unqualified IGBT product material 35 after the test is completed is placed by the conveying device 4 onto the material tube unloading device 2 13 .

[0157] Specifically, Fig.17 As shown, the flipping device includes a lifting device 231, a rotating device 232 and a suction head 233. The lifting device 231 is fixedly connected to the machine 10, and the rotating device 232 is connected to the lifting device 231. The lifting device 231 drives the rotating device 232 to rise and fall. The suction head 233 is connected to the rotating device 232. The rotating device 232 drives the suction head 233 to rotate around the horizontal axis. For the flipping device 23, as shown in FIG. Figure 1 and Figure 2 As shown, after the IGBT product material 35 is transferred to the right end of the transport device 4, the rotating device 232 drives Fig.17The suction head 233 in the middle rotates 180 degrees so that the suction head 233 faces upward, and then the lifting device 4 231 drives the suction head 233 to rise and contact the IGBT product material 35 under the suction head 1 44, thereby sucking the IGBT product material 35, and then the rotating device 1 232 drives the suction head 233 to rotate 180 degrees, and then the lifting device 4 231 drives the suction head 233 to descend and place the IGBT product material 35 on the turntable 242, and then the turntable 242 drives the IGBT product material 35 to move to the flipping device 28, and the flipping device 28 sucks the IGBT product material 35, and then drives the IGBT product material 35 to rotate 180 degrees so that the suction head 233 faces upward, waiting for the material receiving and conveying device 294 to go to the suction head 233 of the flipping device 28 to take away the IGBT product material 35.

[0158] Specifically, Fig.18 As shown, the turntable device 24 includes a second rotating device 241 and a turntable 242. The turntable 242 is located above the second rotating device 241. The second rotating device 241 is fixedly connected to the machine 10. The turntable 242 is driven to rotate around the vertical axis by the second rotating device 241. The turntable 242 is horizontally arranged. Figure 1 and Figure 2 As shown, a flipping device 23, a laser marking device 25, a visual inspection device 26, a 3D inspection device 27, and a flipping device 28 are arranged around a turntable 242. The turntable 242 rotates to drive the IGBT product material 35 thereon to pass through the laser marking device 25, the visual inspection device 26, the 3D inspection device 27, and the flipping device 28 in sequence.

[0159] Specifically, Fig.19 The laser marking device 25 shown is common knowledge, and its structure is not described in detail herein.

[0160] Specifically, Fig. 20 As shown, the second visual inspection device 26 includes a fifth mounting frame 261, a second visual camera 262 and a light source 263. The second visual camera 262 and the light source 263 are both fixedly connected to the fifth mounting frame 261, and the fifth mounting frame 261 is fixedly connected to the machine 10.

[0161] Specifically, Fig.21 As shown, the 3D detection device 27 includes a translation device 271 and a three-dimensional laser line scanner 272. The translation device 271 is fixedly connected to the machine 10, and the three-dimensional laser line scanner 272 is connected to the translation device 271. The translation device 271 drives the three-dimensional laser line scanner 272 to move horizontally to perform a comprehensive line scan of the IGBT product material 35.

[0162] In this embodiment, the rotation of the turntable 242 drives the IGBT product material 35 thereon to pass under the laser marking device 25, the visual inspection device 26, the 3D inspection device 27, and the flipping device 28 in sequence, thereby performing laser marking, visual inspection, 3D line scanning, and the suction head 233 to remove the IGBT product material 35 in sequence.

[0163] Specifically, Fig. 22 As shown, the material receiving and transporting device 294 includes a three-axis translation device 291, a motor 292 and a suction head 293. The three-axis translation device 291 is fixedly connected to the machine table 10, and the motor 292 is connected to the three-axis translation device 291. The motor 292 is driven by the three-axis translation device 291 to move along the XYZ three axes. The suction head 293 is connected to the motor 292, and the motor 292 drives the suction head 293 to rotate around the vertical axis. The flip device 28 picks up the rotating The IGBT product material 35 on the tray 242 is flipped 180 degrees, and then the three-axis translation device 291 drives the suction head three 293 to move to the top of the suction head two 233, and then the suction head three 293 descends to suck up the IGBT product material 35, and then the three-axis translation device 291 cooperates with the motor four 292 to place the IGBT product material 35 sucked by the suction head three 293 into the roll packaging device 30 or the material tube receiving device 31 or the material tube unloading device six 32.

[0164] Specifically, Fig.23 The tape packaging device 30 shown is common knowledge, and its working principle will not be described in detail herein.

[0165] Specifically, Fig.24As shown, the material tube receiving device 31 includes a mounting frame 6 311, a lifting device 5 312, a transverse device 313, a translation plate 2 314, a material tube 2 316, a material tube frame 317, a feed tube 318, and a translation device 10 319. The mounting frame 6 311 is fixedly connected to the machine 10. The lifting device 5 312, the transverse device 313, the material tube frame 317, and the feed tube 318 are all fixedly connected to the mounting frame 6 311. The translation plate 2 314 is located above the transverse device 313 and is connected to the transverse device 313. The transverse device 313 drives the translation plate 2 314 to move horizontally. The upper surface of the translation plate 2 314 is stacked There are multiple material pipes 316 stacked, the structure of the material pipe 316 is the same as that of the material pipe 103, and is used to hold the IGBT product material 35. The multiple material pipes 316 are vertically slidably installed on the material pipe rack 317. The upper surface of the translation plate 314 is provided with a material trough 315. The transverse device 313 drives the translation plate 314 to move horizontally, so that the material pipe 316 at the bottom of the multiple material pipes 316 stacked can fall into the material trough 315 and separate from the material pipe rack 317. Then the transverse device 313 drives the material pipe 316 in the material trough 315 to move horizontally synchronously with the translation plate 314 to first separate from the multiple material pipes on the material pipe rack 317. The first and second feed pipes 316 are separated, and finally one end of the second feed pipe 316 in the second feed trough 315 is aligned with and connected to the end of the feed pipe 318 which is tilted downward. The material receiving and transporting device 294 places the IGBT product material 35 on the end of the feed pipe 318 which is tilted upward. A translation device 10 319 is fixedly installed on the end of the feed pipe 318 which is tilted upward. The IGBT product material 35 is pushed into the feed pipe 318 by the translation device 10 319. The IGBT product material 35 slides down the feed pipe 318 into the second feed pipe 316. When the second feed pipe 316 is filled with the IGBT product material 35, the lifting device 5 312 lifts the second feed pipe 316 to slide into another feed pipe. The tube rack three 317 is separated from the material trough two 315, and then the transverse movement device 313 drives the translation plate two 314 to move horizontally to the material tube rack three 317 to take another material tube two 316 and continue loading. When one end of the material tube two 316 in the next material trough two 315 is aligned with and connected with the downward inclined end of the feed pipe 318, the lifting device five 312 is reset, and the previous material tube two 316 filled with IGBT product material 35 slides down along the material tube rack three 317 and is pressed onto the material tube two 316 in the material trough two 315, and this cycle is repeated to achieve stacking of multiple material tubes two 316 filled with IGBT product material 35 in another material tube rack three 317.

[0166] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A device for high temperature and normal temperature testing and packaging of IGBT, characterized in that: It includes a machine and a loading device, a handling device, a visual inspection device, a unloading device, a positioning device, an insulation withstand voltage test device, a heating device, a testing device, a cooling device, a turning device, a turntable device, a laser marking device, a 3D inspection device, a receiving and handling device, and a receiving device arranged beside the machine; The feeding device includes a feeding tube feeding device, a vibrating plate feeding device and a tray feeding device; The visual inspection device comprises a visual inspection device 1 and a visual inspection device 2; The test device includes test device 1, test device 2, test device 3 and test device 4; The flipping device comprises a flipping device 1 and a flipping device 2; The material receiving device includes a tape packaging device and a material tube receiving device; The feeding device is used to supply IGBT product materials to be tested, and the visual inspection device 1 is used to perform visual inspection on the IGBT product materials supplied by the feeding device. The IGBT product materials that pass the inspection are sent to the positioning device by the conveying device for positioning, and the IGBT product materials that fail the inspection are sent to the unloading device by the conveying device. The IGBT product materials that have been positioned are sent to the insulation withstand voltage testing device by the conveying device for insulation withstand voltage testing, and the IGBT product materials that pass the insulation withstand voltage test are sent to the heating device by the conveying device for heating, and the IGBT product materials that fail the insulation withstand voltage test are sent to the unloading device by the conveying device. The IGBT product materials that have been heated are sent to the positioning device by the conveying device for positioning, and the IGBT product materials that have been positioned are sent to the testing device 1 for high-temperature dynamic testing, and the IGBT product materials that pass the high-temperature dynamic testing are sent to the testing device 2 for high-temperature static testing by the conveying device, and the IGBT product materials that fail the high-temperature dynamic testing are sent to the unloading device by the conveying device, and the IGBT product materials that pass the high-temperature static testing are sent to the cooling device by the conveying device. The IGBT product materials that fail the high-temperature static test are sent to the unloading device by the conveying device, the IGBT product materials that have been cooled are sent to the positioning device by the conveying device for positioning, the IGBT product materials that have been positioned are sent to the testing device three by the conveying device for normal temperature dynamic test, the IGBT product materials that have passed the normal temperature dynamic test are sent to the testing device four for normal temperature static test, the IGBT product materials that fail the normal temperature dynamic test are sent to the unloading device by the conveying device, the IGBT product materials that have passed the normal temperature static test are sent to the flipping device one by the conveying device, the flipping device one flips the IGBT product materials 180 degrees and places them on the turntable device, the IGBT product materials that fail the normal temperature static test are sent to the unloading device by the conveying device, the turntable device drives the IGBT product materials to rotate around the vertical axis, and sequentially undergo laser marking by the laser marking device, visual inspection by the visual inspection device two, and three-dimensional laser line scanning inspection by the 3D inspection device, and finally are taken away by the flipping device two, and the IGBT product materials are flipped 180 degrees and then taken away by the receiving and conveying device and placed on the receiving device.

2. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The material pipe feeding device comprises: A mounting frame 1 is provided with a material tube rack 1 and a translation device 2, the translation device 2 is connected to a translation plate 1, and the translation plate 1 is driven to move horizontally by the translation device 2, the translation plate 1 is horizontally arranged, a plurality of material tubes 1 are stacked and placed on the upper surface of the translation plate 1, and the plurality of material tubes 1 are slidably installed in the material tube rack 1 up and down, the material tube rack 1 is fixedly connected to the mounting frame 1, a material trough 1 is provided on the upper surface of the translation plate 1, the translation device 2 drives the translation plate 1 to move horizontally so that the material tube 1 at the bottom layer falls into the material trough 1 and is separated from the material tube rack 1, and the material tube 1 falling into the material trough 1 is driven by the translation device 2 to move synchronously with the translation plate 1 and is separated from the material tube 1 on the material tube rack 1; Motor 1 is fixedly connected to mounting frame 1, a tube seat is rotatably mounted on the mounting frame 1, the tube seat is transmission-connected to motor 1, a pressing device is arranged on the tube seat, and the translation device 2 drives one end of the material tube 1 falling into the material trough 1 to translate between the tube seat and the pressing device, and the pressing device can press and fix one end of the material tube 1 on the tube seat; The discharge pipe is tilted and arranged on the mounting frame 1. The motor 1 drives the pipe seat to rotate so that one end of the material pipe 1 is connected with the high end of the discharge pipe, and the IGBT product material in the tilted material pipe 1 slides down into the discharge pipe; The stopper is arranged at the lower end of the discharge pipe and is used to prevent the IGBT product material from continuously sliding out of the discharge pipe.

3. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The tray loading device comprises: A mounting plate four is fixedly connected to the machine platform, and a slide and a basket are arranged on the mounting plate four. A plurality of trays are slidably inserted in the basket, and the plurality of trays are stacked, and a plurality of IGBT product materials are placed in each tray; A translation device 1 is arranged on the mounting plate 4, the translation device 1 is connected to the automatic gripper, and the translation device 1 drives the automatic gripper to move horizontally to the basket to grip the pallet, and pulls the pallet onto the slide, and the pallet is slidably connected to the slide; The lifting device six is ​​fixedly connected to the mounting plate four and is used for lifting the basket so that each layer of the pallet is flush with the automatic gripper and the slide.

4. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The visual inspection device 1 comprises: Visual camera 1, fixedly connected to the machine platform; A reflector is fixedly connected to the machine platform; The detection cylinder is fixedly connected to the machine platform; The visual camera 1 is arranged horizontally, and the shooting light emitted by the visual camera 1 is reflected by the reflector and then passes through the detection tube vertically upward to irradiate the IGBT product material; The IGBT product material on the tray loading device is taken away by the handling device and placed on the upper end of the detection cylinder, or the detection cylinder is arranged below the IGBT product material at the discharge end of the material tube loading device or the vibration plate loading device.

5. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The transport device comprises: Mounting frame 2, fixedly connected to the machine platform; A translation device four is fixedly connected to the mounting frame two; The lifting device 1 is connected to the translation device 4, and the translation device 4 drives the lifting device 1 to move horizontally; The suction head 1 is connected to the lifting device 1, and the suction head 1 is driven to rise and fall by the lifting device 1. The suction head 1 is used to suck and transfer IGBT product materials.

6. The device for high-temperature and normal-temperature testing and packaging of IGBT as claimed in claim 5, characterized in that: There are multiple transport devices, which are arranged in a straight line along the translation direction of the translation device 4. A ferry device is provided between two adjacent transport devices, and the ferry device includes: A translation device three is fixedly connected to the machine platform; The carrier one is connected to the translation device three, and the translation device three drives the carrier one to move horizontally, and the moving direction is parallel to the translation direction of the translation device four. The carrier one is provided with an electric heating device one for heating the IGBT product material placed on the carrier one; One of the transport devices places the IGBT product material on carrier one, and the translation device three drives carrier one to move to the bottom of another transport device, and the other transport device takes away the IGBT product material on carrier one.

7. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The material unloading device includes a material box unloading device and a material pipe unloading device; The material box unloading device comprises: A translation device 5, fixedly connected to the machine platform; The NG material box is connected to the translation device 5, and the translation device 5 drives the NG material box to move horizontally; The unqualified IGBT product materials after being inspected by the visual inspection device 1 are taken away by the handling device and placed in the NG material box; The material pipe unloading device comprises: The second material pipe rack is fixedly connected to the machine platform, and the NG material pipe is detachably fixedly mounted on the second material pipe rack; The translation device seven is fixedly connected to the material tube rack two. The IGBT product materials that fail the insulation withstand voltage test, the IGBT product materials that fail the high temperature dynamic test, the IGBT product materials that fail the high temperature static test, the IGBT product materials that fail the low temperature dynamic test, and the IGBT product materials that fail the low temperature static test are all taken away by the conveying device and placed on the material tube rack two at one end of the NG material tube, and then the translation device seven pushes the unqualified IGBT product materials into the NG material tube.

8. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The positioning device comprises: Mounting plate 1, fixedly connected to the machine platform; A translation device six is ​​fixedly connected to the mounting plate one, and a movable end of the translation device six is ​​connected to a movable positioning block; The fixed positioning block is fixedly connected to the mounting plate one, and the translation device six pushes the movable positioning block to move horizontally toward the fixed positioning block. The IGBT product material is placed on the mounting plate one between the movable positioning block and the fixed positioning block, and the IGBT product material is clamped and positioned by the movable positioning block and the fixed positioning block.

9. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The insulation withstand voltage testing device comprises: Sliding column 1, vertically fixed on the machine platform; A second mounting plate is fixedly connected to the first sliding column, and a second lifting device is fixedly installed on the second mounting plate; The mounting plate 3 is located at the lower end of the mounting plate 2 and is connected to the sliding column 1 for sliding up and down movement. The movable end of the lifting device 2 is connected to the mounting plate 3, and the mounting plate 3 is driven to rise and fall by the lifting device 2. The lower surface of the mounting plate 3 is fixedly installed with a test probe row; Motor 2 is fixedly connected to the machine platform, and a carrier plate 1 is installed on the motor 2, and the carrier plate 1 is driven to rotate around the vertical axis by the motor 2; The positioned IGBT product material is placed at one end of carrier plate 1 by the handling device, and the motor 2 drives one end of carrier plate 1 to rotate to just below the test probe row, and the lifting device 2 drives the test probe row down to contact the IGBT product material for insulation withstand voltage test.

10. The device for high temperature and normal temperature testing and packaging of IGBT according to claim 1, characterized in that: The heating device comprises: A mounting frame 3, on which a translation device 8 and a slide rail are horizontally fixedly mounted, a mounting frame 4 is slidably mounted on the slide rail, the mounting frame 4 is connected to the translation device 8, and the translation device 8 drives the mounting frame 4 to slide horizontally along the slide rail; The second carrier plate is fixedly mounted on the upper end of the mounting frame 4, and the upper surface of the second carrier plate is provided with a plurality of placement holes for placing IGBT product materials; The electric heating device 2 is fixedly connected to the mounting frame 4 and is used for heating the loading plate 2; A temperature measuring device, fixedly connected to the mounting frame 4, for detecting the heating temperature of the electric heating device 2; The machine cover is arranged outside the translation device 8, the slide rail, the mounting frame 4, the loading plate 2, the electric heating device 2, and the temperature measuring device, and is fixedly connected to the mounting frame 3. The upper surface of the machine cover is provided with a material taking and discharging port. The IGBT product materials that have passed the insulation withstand voltage test are driven down by the handling device and passed through the material taking and discharging port and placed in the placement hole.

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