Server double-circulation channel thermal management system

Abstract

The invention relates to the field of heat dissipation of high-power devices, in particular to a server double-circulation-channel heat management system which comprises an evaporator, a condenser, an internal circulation loop and an external circulation loop, the bottom face of the evaporator is an evaporation section, the circumferential face of the evaporator is a condensation section, and fins are arranged on the condensation section and used for enhancing heat exchange efficiency. The evaporator and the condenser are arranged in a cooling medium environment; the evaporation section is in contact with the surface of the high-power device, and heat of the high-power device is transferred to the evaporator through circulation of a working medium in the evaporator; at the moment, the working medium in the inner cavity of the evaporator absorbs heat and then evaporates to form steam, the steam flows to a condensation section of the evaporator, is cooled into a liquid working medium by a cooling medium under the action of fins, and flows back to an evaporation section under the action of internal capillary action, so that internal circulation is completed. Through the design of the double circulation channels, heat generated by the high-power device can be conducted and dissipated more effectively, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of high-power devices, and in particular to a dual-circulation channel thermal management system for a server. Background Art

[0002] With the rapid development of information technology, especially the continuous progress in artificial intelligence, 5G, cloud computing and big data, data centers are moving towards high power, high density and ultra-large scale. This trend has led to the increasing application of high-power chips and integrated circuits in data centers, and the requirements for heat dissipation technology have also increased accordingly. Although traditional air cooling technology has met basic heat dissipation needs in the past period of time, it has become incapable of dealing with the huge heat generated by the current ultra-high computing power of data centers.

[0003] High-power chips and integrated circuits generate a lot of heat during operation. If they cannot be dissipated promptly and effectively, the temperature of the equipment will rise, which will affect its working reliability and stability, and may even cause equipment failure. In addition, excessive temperature will increase the power consumption of the equipment, reduce energy utilization efficiency, and thus increase the operating costs of the data center.

[0004] Therefore, developing a new thermal management technology to efficiently achieve heat dissipation of data center equipment has become an urgent issue to be solved. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of poor heat dissipation of high-power devices in the prior art, thereby providing a server dual-circulation channel thermal management system.

[0006] In order to solve the above technical problems, the present invention provides a server dual-circulation channel thermal management system, comprising:

[0007] An evaporator, wherein the bottom surface of the evaporator is an evaporation section, the peripheral surface of the evaporator is a condensation section, and the condensation section is provided with fins for enhancing heat exchange efficiency;

[0008] Condenser, the evaporator and the condenser are placed in a cooling medium environment;

[0009] In the internal circulation loop, the evaporation section contacts the surface of the high-power device, and the heat of the high-power device is transferred to the evaporator through the circulation of the working fluid inside the evaporator; at this time, the working fluid placed in the internal cavity of the evaporator absorbs heat and evaporates to form steam, and the steam flows to the condensation section of the evaporator, and is cooled into liquid working fluid by the cooling medium under the action of the fins, and flows back to the evaporation section under the action of the internal capillary action, completing the internal circulation;

[0010] The external circulation loop transfers the heat of the high-power device to the condensing section of the evaporator and contacts with the cooling medium. Under the strengthening effect of the fins, the heat of the high-power device is transferred to the cooling medium. The temperature of the cooling medium rises, and the heated cooling medium moves to the condenser, flows back to the surface of the evaporator after cooling, and completes the external circulation.

[0011] Furthermore, the evaporator structure is one of square, circular or inverted L-shaped.

[0012] Further, the evaporator comprises an upper cover and a lower cover, and the fins are equidistantly distributed on the outer surface of the upper cover;

[0013] The thickness of the fin is 0.1 mm to 10 mm, the spacing between the fins is 0.1 mm to 5 mm, and the depth of the fin is 0.5 mm to 15 mm.

[0014] Furthermore, a structural member is provided inside the upper cover, and a cavity is formed between the structural member and the inner wall of the upper cover;

[0015] A liquid wick is sintered on the inner wall surface of the cavity, and the liquid wick is a combination of one or more of sintered powder, metal mesh, foam metal, nano coating, and micro grooves;

[0016] A penetrating liquid injection port is arranged in the middle of the upper cover.

[0017] Furthermore, a step is provided inside the lower cover to match with the upper cover, and a liquid wick is sintered at the unmatched portion of the lower cover and the upper cover.

[0018] Furthermore, a boss is provided on the lower cover, and thermal grease is coated on the surface of the boss. The boss and the thermal grease form an evaporation section for contacting and cooperating with the surface of the high-power device.

[0019] Furthermore, the working fluid in the internal circulation loop is one of deionized water, methanol, acetone or ethanol liquid.

[0020] Furthermore, the cooling medium includes but is not limited to wind, hydrocarbon oil, fluorinated liquid, water and other media.

[0021] Furthermore, the condenser is a fin condenser or a microchannel condenser, and the circulating medium in the channel exchanges heat with external equipment.

[0022] Furthermore, the circulating working fluid inside the condenser is provided by an external water cooler to achieve cooling of the circulating working fluid.

[0023] By means of the above technical solution, the present invention provides a server dual-circulation channel thermal management system, which has at least the following beneficial effects:

[0024] 1. Through the dual-circulation channel design, the system can more effectively conduct and dissipate the heat generated by high-power devices, which not only increases the heat dissipation area, but also optimizes the heat dissipation path, so that the heat can be absorbed and carried away by the coolant more quickly, thereby significantly improving the heat dissipation efficiency.

[0025] 2. Traditional heat dissipation methods often rely on a large number of fans or air-conditioning equipment, the operation of which consumes a lot of electrical energy. The dual-circulation channel thermal management system of the present invention reduces the dependence on external cooling equipment by optimizing the heat dissipation process, thereby reducing overall energy consumption. In addition, due to the improvement in heat dissipation efficiency, the surface temperature of high-power devices can be better controlled, further reducing the additional energy consumption caused by overheating.

[0026] 3. The system can ensure that high-power devices maintain a low temperature when running at high load, thereby avoiding failure or performance degradation of high-power devices due to overheating. This not only improves the stability of high-power devices, but also extends the service life of high-power devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the working principle of the coordination between the internal circulation loop and the external circulation loop of the present invention;

[0029] Figure 2 This is a schematic diagram of the structure of a square evaporator in the present invention;

[0030] Figure 3 It is a schematic diagram of the structure of the inverted L-shaped evaporator in the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of a circular evaporator in the present invention;

[0032] Figure 5 An exploded diagram of an evaporator structure in the present invention;

[0033] Figure 6 A bottom view of an upper cover structure of an evaporator in the present invention;

[0034] Figure 7 A three-dimensional diagram of the upper cover structure of an evaporator in the present invention;

[0035] Figure 8This is a schematic diagram of the lower cover structure of an evaporator in the present invention;

[0036] Fig. 9 This is a schematic diagram of the structure of an evaporator upper cover with a smooth surface in the present invention;

[0037] Fig.10 This is a schematic diagram of the structure of a condenser in the present invention.

[0038] In the attached figure:

[0039] 100, evaporator; 101, evaporation section; 102, condensation section; 103, upper cover; 104, lower cover; 105, structural parts; 106, cavity; 107, liquid injection port; 108, thermal grease; 200, condenser; 300, high-power device. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figure 1 As shown, a dual-circulation channel thermal management system for a server includes: an evaporator 100, a condenser 200, an internal circulation loop and an external circulation loop. The bottom surface of the evaporator 100 is an evaporation section 101, and the peripheral surface of the evaporator 100 is a condensation section 102. Fins are provided on the condensation section 102. The fins not only increase the heat exchange area, but also enhance the heat exchange effect by disrupting the flow path of the cooling medium. This design enables the steam to be cooled into a liquid working medium more quickly in the condensation section, thereby enhancing the heat exchange efficiency. The evaporator 100 and the condenser 200 are placed in a cooling medium environment.

[0042] In the internal circulation loop, the evaporation section 101 contacts the surface of the high-power device 300, and the heat of the high-power device 300 is transferred to the evaporator 100 through the circulation of the working medium inside the evaporator 100; at this time, the working medium placed in the internal cavity 106 of the evaporator 100 absorbs heat and evaporates to form steam, and the steam flows to the condensation section 102 of the evaporator 100, and is cooled into liquid working medium by the cooling medium under the action of the fins, and flows back to the evaporation section 101 under the action of the internal capillary action, completing the internal circulation;

[0043] The internal circulation loop transfers the heat of the high-power device 300 to the condensing section 102 of the evaporator 100, and contacts the cooling medium. Under the strengthening effect of the fins, the heat of the high-power device 300 is transferred to the cooling medium, the temperature of the cooling medium rises, and the heated cooling medium moves to the condenser 200, flows back to the surface of the evaporator 100 after cooling, and completes the external circulation. Through the dual-circulation channel design, the system can more effectively conduct and dissipate the heat generated by the high-power device, which not only increases the heat dissipation area, but also optimizes the heat dissipation path, so that the heat can be absorbed and taken away by the coolant more quickly, thereby significantly improving the heat dissipation efficiency.

[0044] like Figure 2 As shown, the evaporator 100 is a square structure, which can make more effective use of space, especially in limited spaces such as server cabinets or data centers. The square evaporator can maximize the use of available area, and the square structure usually has standardized dimensions and interfaces, which makes the installation and maintenance of the evaporator more convenient. The fin structure can increase the heat exchange area, thereby improving the heat exchange efficiency. The fins are provided on the surface of the square evaporator 100, which can further improve the heat dissipation performance. The fins disrupt the fluid flow path, so that the cooling medium is more fully in contact with the surface of the evaporator 100, further optimizing the heat transfer path.

[0045] like Figure 3 As shown, the evaporator 100 is an inverted L-shaped structure, which can adapt to the complex layout inside the server, especially when it is necessary to bypass other components or use the corners of the space. The inverted L-shaped evaporator has higher flexibility, and the inverted L-shaped setting can be optimized according to the heat distribution of the server to ensure that heat can be more effectively transferred from the high-power device 300 to the cooling medium. The surface of the inverted L-shaped evaporator 100 is provided with fins, which can increase the heat dissipation area and improve the heat exchange efficiency.

[0046] like Figure 4 As shown, the evaporator 100 is a circular structure, which is more uniform in mechanics and can reduce stress concentration, thereby improving the durability and reliability of the evaporator 100. The surface of the circular evaporator 100 is provided with fins, and the heat dissipation area can be maximized and the heat exchange efficiency can be improved through the provision of fins.

[0047] like Fig. 9 As shown, the surface of the evaporator 100 is smooth, and the smooth surface can reduce the resistance of the cooling medium during the flow process. The evaporator 100 with a smooth surface is not easy to accumulate dust and dirt, and is convenient for cleaning and maintenance.

[0048] like Figure 4As shown, the evaporator 100 includes an upper cover 103 and a lower cover 104, and the fins are equidistantly distributed on the outer surface of the upper cover 103; the thickness of the fins is 0.1mm to 10mm, and such a thickness setting can not only ensure the strength of the fins, but also effectively increase the heat exchange area, while avoiding the increase in weight and cost caused by excessive thickness, and the spacing of the fins is 0.1mm to 5mm, and such a spacing setting can ensure that the cooling medium can flow smoothly through the fin gap and improve the heat exchange efficiency. The depth of the fins is 0.5mm to 15mm, which can more effectively increase the heat exchange area.

[0049] like Figure 6 As shown, a structural member 105 is provided inside the upper cover 103, and a cavity 106 is formed between the structural member 105 and the inner wall of the upper cover 103, so that the working medium can be distributed in the cavity 106, thereby improving the heat exchange efficiency; a liquid wick is sintered on the inner wall surface of the cavity 106, and the liquid wick is a combination of one or more of sintered powder, metal mesh, foam metal, nano coating, and micro grooves, which can further improve the capillary force and thermal conductivity of the liquid wick, thereby enhancing the heat dissipation effect of the evaporator 100.

[0050] When the evaporator 100 is a square structure or a circular structure, the structural member 105 is arranged in a cross shape. Such an arrangement can optimize the flow path of the working medium and make the working medium evenly distributed.

[0051] like Figure 6 and Figure 7 As shown, a liquid injection port 107 is provided in the middle of the upper cover 103 to facilitate the injection or replenishment of the working fluid into the evaporator 100. The upper surface of the liquid injection port 107 is arranged flush with the upper surface of the upper cover 103. The height of the liquid injection port 107 is less than the height of the structural member 105 to ensure that the working fluid can smoothly enter the cavity 106.

[0052] In some embodiments, the liquid injection tube may be first inserted into the liquid injection port 107 , and then evacuated and cut off, and finally cut off to be flush with the upper surface of the upper cover 103 .

[0053] like Figure 8As shown, the lower cover 104 is provided with a step inside to match the upper cover 103, which can ensure the close fit between the upper cover 103 and the lower cover 104 and weld them firmly through brazing to prevent leakage of the working fluid. At the same time, the step can also provide additional support and positioning functions to facilitate the installation and fixation between the lower cover 104 and the upper cover 103. The sintered liquid wick is formed in the unmatched part of the lower cover 104 and the upper cover 103, which can ensure that the working fluid can also be effectively circulated and dissipated in the unmatched part. A boss is provided on the lower cover 104, and the surface of the boss is coated with thermal conductive silicone grease 108. The boss and the thermal conductive silicone grease 108 form an evaporation section 101, which is used to contact and match with the surface of the high-power device 300. The thermal conductive silicone grease 108 is a highly thermally conductive insulating organic silicon material, also known as heat dissipation paste or thermal conductive paste. The thermal conductive silicone grease 108 has good thermal conductivity, which can further reduce thermal resistance and improve the heat dissipation effect. The setting of the boss can also provide support and positioning functions.

[0054] In some embodiments, the working fluid in the internal circulation loop is deionized water. Deionized water has a high thermal conductivity and can transfer heat quickly. As a naturally occurring substance, deionized water is harmless to the environment and is easy to handle and discharge. Compared with other working fluids, deionized water has a lower cost and is easier to obtain.

[0055] In some embodiments, the working fluid in the internal circulation loop is methanol liquid. Methanol has a low boiling point and is easy to evaporate and condense, making it suitable for situations requiring rapid heat exchange. Methanol can also dissolve a variety of substances, helping to remove impurities and dirt from the system.

[0056] In some embodiments, the working fluid in the internal circulation loop is acetone liquid. Acetone has high volatility and can evaporate quickly and take away heat. Compared with other organic solvents, acetone is less toxic and less harmful to the human body. Acetone is not easy to decompose at high temperatures and can maintain stable heat exchange performance.

[0057] In some embodiments, the working fluid in the internal circulation loop is ethanol liquid. Ethanol is a renewable biofuel that can dissolve a variety of organic and inorganic substances and help clean the system. Ethanol has a high flash point and is not easy to cause fire or explosion.

[0058] The working fluid in the internal circulation loop includes but is not limited to deionized water, methanol liquid, acetone liquid or ethanol liquid.

[0059] In some embodiments, the cooling medium is wind. Wind is a naturally existing medium and will not pollute the environment when used as a cooling medium.

[0060] In some embodiments, the cooling medium is hydrocarbon oil, which has a high heat capacity and can store and transfer a large amount of heat.

[0061] In some embodiments, the cooling medium is a fluorinated liquid, which has a low boiling point and is easy to evaporate and condense, and is suitable for occasions requiring rapid heat exchange.

[0062] In some embodiments, the cooling medium is water. Water has a high thermal conductivity and can quickly transfer heat. Moreover, as a naturally occurring substance, water is harmless to the environment.

[0063] The cooling medium includes but is not limited to wind, hydrocarbon oil, fluorinated liquid, water and other media.

[0064] In some embodiments, Fig.10 As shown, the condenser 200 is a finned condenser, and the circulating medium in its channel exchanges heat with external equipment, which can significantly increase the heat exchange area and improve the heat transfer efficiency.

[0065] In some embodiments, the condenser 200 is a microchannel condenser, and the circulating medium in its channel exchanges heat with external equipment. The internal channels of the microchannel condenser are smaller, so that the working fluid is in closer contact with the surface of the condenser 200, thereby improving the heat transfer efficiency.

[0066] The circulating working fluid inside the condenser 200 is provided by an external water cooler, which is used to cool the circulating working fluid and ensure that the temperature of the circulating working fluid inside the condenser 200 is maintained at a low level. By cooling the circulating working fluid with an external water cooler, the heat exchange efficiency of the condenser 200 can be further improved.

[0067] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A server dual-circulation channel thermal management system, characterized in that: include: An evaporator, wherein the bottom surface of the evaporator is an evaporation section, the peripheral surface of the evaporator is a condensation section, and the condensation section is provided with fins for enhancing heat exchange efficiency; Condenser, the evaporator and the condenser are placed in a cooling medium environment; In the internal circulation loop, the evaporation section contacts the surface of the high-power device, and the heat of the high-power device is transferred to the evaporator through the circulation of the working fluid inside the evaporator; at this time, the working fluid placed in the internal cavity of the evaporator absorbs heat and evaporates to form steam, and the steam flows to the condensation section of the evaporator, and is cooled into liquid working fluid by the cooling medium under the action of the fins, and flows back to the evaporation section under the action of the internal capillary action, completing the internal circulation; The external circulation loop transfers the heat of the high-power device to the condensing section of the evaporator and contacts with the cooling medium. Under the strengthening effect of the fins, the heat of the high-power device is transferred to the cooling medium. The temperature of the cooling medium rises, and the heated cooling medium moves to the condenser, flows back to the surface of the evaporator after cooling, and completes the external circulation.

2. The server dual-circulation channel thermal management system according to claim 1 is characterized by: The evaporator structure is one of square, circular or inverted L-shaped.

3. The server dual-circulation channel thermal management system according to claim 1 is characterized by: The evaporator comprises an upper cover and a lower cover, and the fins are equidistantly distributed on the outer surface of the upper cover; The thickness of the fin is 0.1 mm to 10 mm, the spacing between the fins is 0.1 mm to 5 mm, and the depth of the fin is 0.5 mm to 15 mm.

4. The server dual-circulation channel thermal management system according to claim 3 is characterized by: A structural member is provided inside the upper cover, and a cavity is formed between the structural member and the inner wall of the upper cover; A liquid wick is sintered on the inner wall surface of the cavity, and the liquid wick is a combination of one or more of sintered powder, metal mesh, foam metal, nano coating, and micro grooves; A penetrating liquid injection port is arranged in the middle of the upper cover.

5. The server dual-circulation channel thermal management system according to claim 4 is characterized by: The lower cover is provided with a step matched with the upper cover inside, and the liquid absorbing core is sintered at the unmatched part of the lower cover and the upper cover.

6. The server dual-circulation channel thermal management system according to claim 5, characterized in that: The lower cover is provided with a boss, the surface of the boss is coated with thermal conductive silicone grease, and the boss and the thermal conductive silicone grease form an evaporation section for contacting and cooperating with the surface of the high-power device.

7. The server dual-circulation channel thermal management system according to claim 1, characterized in that: The working fluid in the internal circulation loop is one of deionized water, methanol, acetone or ethanol liquid.

8. The server dual-circulation channel thermal management system according to claim 1, characterized in that: The cooling medium includes but is not limited to wind, hydrocarbon oil, fluorinated liquid, water and other media.

9. The server dual-circulation channel thermal management system according to claim 1, characterized in that: The condenser is a fin condenser or a microchannel condenser, and the circulating medium in the channel exchanges heat with external equipment.

10. The server dual-circulation channel thermal management system according to claim 1, characterized in that: The circulating working fluid inside the condenser is provided by an external water cooler to achieve cooling of the circulating working fluid.

Images