Diamond wire abnormal working condition monitoring device and monitoring method for slicer

Abstract

The present invention relates to the technical field of diamond wire abnormality monitoring, and proposes a diamond wire abnormal working condition monitoring device and monitoring method for a slicer, including: when the slicer has an abnormal working condition, collect diamond wire images, mark suspected diamond particle edges and suspected edge pixels; determine the circular significance of any two different suspected edge pixels, and determine the suspected detached edge; determine the diamond particle significance of the suspected detached edge, and determine the possibility of the pit edge of the suspected detached edge according to the difference between the gray values ​​of the pixels contained in the area divided by all the suspected detached edges, the diamond particle significance and the circular significance of the suspected detached edge, and determine the detached edge according to the pit edge possibility; monitor the abnormal working condition of the diamond wire of the slicer according to the number of detached edges and the number of suspected detached edges. The present invention improves the accuracy of monitoring the degree of wear of the diamond wire.

Description

Technical Field

[0001] The present invention relates to the technical field of diamond wire abnormality monitoring, and in particular to a diamond wire abnormal working condition monitoring device and a monitoring method for a slicer. Background Art

[0002] Diamond wire is a cutting tool in a slicer. Diamond particles are fixed on the surface of high-strength steel wire through a special process to form a diamond wire with a sharp cutting edge. When the diamond wire breaks, wears out, or has other abnormal conditions, the cutting efficiency of the diamond wire decreases, which directly affects the production efficiency and cutting quality of the slicer. In order to avoid abnormal conditions of the diamond wire that affect the use of the slicer, it is necessary to monitor the degree of wear of the diamond wire.

[0003] When monitoring the wear degree of diamond wire, the diamond particles on the surface of the diamond wire and the pits caused by the wear and fall of the diamond particles are generally identified, and then the wear degree monitoring result of the diamond wire is determined based on the number of identified diamond particles and the number of pits. However, when the diamond particles on the surface of the diamond wire are worn and fall off, the pits that appear at the original position of the diamond particles are easily misjudged as diamond particles, making the identified diamond particles inaccurate, affecting the accuracy of the monitoring of the wear degree of the diamond wire. Summary of the invention

[0004] The present invention provides a monitoring device and a monitoring method for abnormal working condition of diamond wire for a slicer, so as to solve the problem that the diamond particles are not accurately identified, resulting in insufficient accuracy in monitoring the degree of wear of the diamond wire. The technical scheme adopted is as follows:

[0005] In a first aspect, an embodiment of the present invention provides a method for monitoring abnormal working conditions of a diamond wire for a slicer, the method comprising the following steps:

[0006] When the slicer has an abnormal working condition, the diamond wire image is collected, and the suspected diamond particle edge and the suspected edge pixel points on the suspected diamond particle edge are marked according to the edge information in the diamond wire image;

[0007] Determine the adjacent angles of the suspected edge pixels according to the positional relationship between adjacent suspected edge pixels on the same suspected diamond particle edge, determine the circular significance of any two different suspected edge pixels on the same suspected diamond particle edge according to the positional relationship between the two adjacent suspected edge pixels and the difference of all the adjacent angles of the suspected edge pixels between the two different suspected edge pixels on the suspected diamond particle edge, and determine the suspected fall-off edge according to the circular significance;

[0008] According to the number and position distribution of the suspected edge pixels contained in the area divided by the suspected detached edge, the diamond particle significance of the suspected detached edge is determined, and any suspected detached edge is recorded as the target suspected detached edge. According to the difference between the grayscale values ​​of the pixel points contained in the area divided by the target suspected detached edge and all other suspected detached edges, the diamond particle significance and circular significance of the target suspected detached edge are determined, and the detached edge is determined according to the pit edge probability;

[0009] Based on the number of fallen edges and the number of suspected fallen edges, the abnormal working condition of the diamond wire of the slicer is monitored.

[0010] Furthermore, the specific method of determining the adjacent angles of the suspected edge pixels includes:

[0011] Any suspected edge pixel point on the edge of the suspected diamond particle is recorded as a target suspected edge pixel point;

[0012] In order from left to right and from top to bottom, the first pixel point on the edge of the suspected diamond particle adjacent to the target suspected edge pixel point is recorded as the adjacent pixel point of the target suspected edge pixel point;

[0013] The ray pointing from the target suspected edge pixel point to the adjacent pixel point of the target suspected edge pixel point is recorded as the vector direction ray of the target suspected edge pixel point, and the angle between the vector direction ray of the target suspected edge pixel point and the horizontal right direction is recorded as the adjacent angle of the target suspected edge pixel point.

[0014] Furthermore, the determining of the circular saliency of any two different suspected edge pixels includes the following specific method:

[0015] Any two different suspected edge pixel points on the same suspected diamond particle edge are recorded as a first suspected edge pixel point and a second suspected edge pixel point respectively;

[0016] The standard deviation of the adjacent angles of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the difference in the adjacent angles of the first suspected edge pixel and the second suspected edge pixel;

[0017] The number of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the number of intervals between the first suspected edge pixel and the second suspected edge pixel, and the product of the Euclidean distance between the first suspected edge pixel and the second suspected edge pixel and the number of intervals is recorded as the first product of the first suspected edge pixel and the second suspected edge pixel;

[0018] The circular saliency of the first suspected edge pixel point and the second suspected edge pixel point is determined according to the difference between adjacent angles of the first suspected edge pixel point and the second suspected edge pixel point and the first product.

[0019] Further, the circular saliency of the first suspected edge pixel and the second suspected edge pixel is determined according to the difference of adjacent angles between the first suspected edge pixel and the second suspected edge pixel and the first product, including the specific method of:

[0020] The normalized value of the ratio of the difference between the adjacent angles of the first suspected edge pixel and the second suspected edge pixel to the first product is recorded as the circular saliency of the first suspected edge pixel and the second suspected edge pixel.

[0021] Furthermore, the method of determining the suspected detached edge according to the circular prominence includes:

[0022] When the circular significance of two different suspected edge pixels on the same suspected diamond particle edge is greater than the circular screening threshold, the closed edge with the two different suspected edge pixels on the same suspected diamond particle edge as endpoints is marked as a suspected detached edge.

[0023] Furthermore, the method of determining the significance of diamond particles of the suspected detached edge according to the number and position distribution of the suspected edge pixels contained in the area divided by the suspected detached edge includes the following specific methods:

[0024] All suspected edge pixels except the suspected edge pixels contained in the suspected falling-off edge in the area divided by the suspected falling-off edge are recorded as internal suspected edge pixels of the suspected falling-off edge, and the area composed of the internal suspected edge pixels of the suspected falling-off edge is recorded as the internal suspected edge area of ​​the suspected falling-off edge;

[0025] The product of the cumulative sum of the numbers of all the internal suspected edge pixels contained in the internal suspected edge region of the suspected detached edge and the number of the internal suspected edge regions of the suspected detached edge is recorded as the diamond particle significance of the suspected detached edge.

[0026] Further, the possibility of a pit edge of the target suspected detached edge is determined according to the difference between the grayscale values ​​of the pixels contained in the area divided by the target suspected detached edge and all other suspected detached edges, the diamond particle prominence and the circular prominence of the target suspected detached edge, including the specific method of:

[0027] The mean grayscale value of all pixels contained in the suspected detached area divided by all suspected detached edges is recorded as the first mean value; the mean grayscale value of all pixels contained in the target suspected detached edge is recorded as the second mean value of the target suspected detached edge; the difference between the second mean value of the target suspected detached edge and the first mean value is recorded as the brightness difference of the target suspected detached edge;

[0028] The normalized value of the product of the brightness difference of the target suspected detached edge and the circular prominence and diamond particle prominence is recorded as the diamond particle characteristic prominence value of the target suspected detached edge; the difference between the number 1 and the diamond particle characteristic prominence value of the target suspected detached edge is recorded as the pit edge possibility of the target suspected detached edge.

[0029] Further, the specific method of determining the falling edge according to the possibility of the pit edge is as follows:

[0030] When the pit edge probability of the suspected detached edge is greater than the pit screening threshold, the suspected detached edge is recorded as a detached edge.

[0031] Further, the abnormal working condition of the diamond wire of the slicer is monitored according to the number of fallen edges and the number of suspected fallen edges, including the specific method of:

[0032] The ratio of the number of fallen edges to the number of suspected fallen edges is recorded as the degree of diamond wire wear;

[0033] When the wear degree of the diamond wire is greater than or equal to the wear threshold, it is determined that the diamond wire has an abnormal operating condition; when the wear degree of the diamond wire is less than the wear threshold, it is determined that the diamond wire has no abnormal operating condition.

[0034] In a second aspect, an embodiment of the present invention further provides a device for monitoring abnormal operating conditions of diamond wires for a slicer, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor implements the steps of any one of the above-mentioned methods when executing the computer program.

[0035] The beneficial effects of the present invention are:

[0036] The present application first determines the circular significance of any two different suspected edge pixels on the edge of the same suspected diamond particle based on the circular or nearly circular shape feature of diamond particles in both normal and damaged states, and divides the edge of the pit at the location where the diamond particle falls off in the diamond wire area and the edge of the diamond particle to obtain all suspected falling edges in the diamond wire image; then, based on the feature that the diamond particles in normal and damaged states contain obvious suspected edge pixels but the pit at the location where the diamond particle falls off does not contain suspected edge pixels, the number and position distribution of suspected edge pixels contained in the area divided by the suspected falling edge are analyzed. , continue to screen the locations where all diamond particles have fallen off from the suspected detached edges, obtain the prominence of the diamond particles at the suspected detached edges, and further combine the characteristics of diamond with high hardness and high refractive index, which will show a higher brightness in the image, to obtain the possibility of the pit edge of the target suspected detached edge, and determine the detached edge according to the possibility of the pit edge, accurately identify the pit position corresponding to the detached diamond particles, and improve the accuracy of diamond particle identification; finally, according to the number of detached edges and the number of suspected detached edges, monitor the abnormal working condition of the diamond wire of the slicer to solve the problem of inaccurate diamond particle identification and insufficient accuracy of diamond wire wear monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0038] Figure 1 A schematic flow chart of a method for monitoring abnormal working conditions of a diamond wire for a slicer provided by an embodiment of the present invention;

[0039] Figure 2 A schematic diagram of an edge in a diamond wire region provided by an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of an internal suspected edge region provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] See also Figure 1 , which shows a flow chart of a method for monitoring abnormal working condition of a diamond wire for a slicer provided by an embodiment of the present invention, the method comprising the following steps:

[0043] Step S001, when an abnormal working condition occurs in the slicer, a diamond wire image is collected, and suspected diamond particle edges and suspected edge pixel points on the suspected diamond particle edges are marked according to edge information in the diamond wire image.

[0044] When the slicer has an abnormal working condition, the slicer is stopped, and the image of the diamond wire is captured by a camera with a black background under good lighting conditions to obtain the image of the diamond wire.

[0045] The diamond wire image is denoised and the diamond wire area in the diamond wire image is divided out.

[0046] Preferably, in one embodiment of the present application, a median filtering denoising algorithm is used to denoise the diamond wire image, a maximum inter-class variance method is used to obtain a division threshold of the diamond wire image, and an area consisting of pixels in the diamond wire image that are greater than the division threshold is recorded as a diamond wire area, and the diamond wire area in the diamond wire image is divided. In actual application, as other implementation methods, the implementer can select a denoising algorithm such as wavelet denoising in an existing algorithm to denoise the diamond wire image according to actual conditions, and a method such as semantic segmentation technology in an existing algorithm can be used to divide the diamond wire in the diamond wire image, and this application does not impose any special restrictions.

[0047] Diamond particles are evenly distributed on the surface of the unworn diamond wire. The diamond particles will have corresponding edges in the diamond wire area in the diamond wire image. When the diamond particles fall off due to wear, a pit will appear at the original position of the diamond particle, and an obvious edge will appear in the diamond wire area at the position of the pit.

[0048] Perform edge detection on the diamond wire area in the diamond wire image to obtain all edges in the diamond wire area. The edge diagram in the diamond wire area is as follows: Figure 2 As shown in Figure 2, all pixels contained in the edge are recorded as edge pixels.

[0049] Preferably, in one embodiment of the present application, the canny edge detection algorithm is used to perform edge detection on the diamond wire area in the diamond wire image, wherein the lower threshold value of the canny edge detection algorithm is 0.1, the upper threshold value is 0.3, and the standard deviation of the Gaussian filter is 1.4. In the actual application process, as other implementation methods, the implementer can select the sobel edge detection algorithm and other edge detection algorithms in the existing algorithms according to the actual situation to obtain all the edges in the diamond wire area, and the present application does not impose any special restrictions.

[0050] It can be understood that all edges in the diamond wire area include the edges of the pits where the diamond particles fall off, the edges of the diamond particles that have not fallen off the surface of the diamond wire, and the edges of the diamond wire.

[0051] Record any image column in the diamond wire image as the target image column, select the edge pixel point at the top of the diamond wire image in the target image column, mark the edge where the selected edge pixel point is located as a suspected upper edge, select the edge pixel point at the bottom of the diamond wire image in the target image column, and mark the edge where the selected edge pixel point is located as a suspected lower edge.

[0052] The number of times each edge in the diamond line area is marked as a suspected upper edge and a suspected lower edge is counted, and the edge marked as the suspected upper edge the most times is recorded as the diamond line upper edge, and the edge marked as the suspected lower edge the most times is recorded as the diamond line lower edge.

[0053] The diamond wire upper edge and the diamond wire lower edge in the diamond wire area correspond to the outer edge of the diamond wire.

[0054] All edges in the diamond wire area except the upper edge of the diamond wire and the lower edge of the diamond wire are marked as suspected diamond particle edges.

[0055] All pixels contained in the edges of all suspected diamond particles are marked as suspected edge pixels.

[0056] At this point, all suspected diamond particle edges and suspected edge pixels in the diamond wire image are obtained.

[0057] Step S002, based on the positional relationship between adjacent suspected edge pixel points on the same suspected diamond particle edge, determine the adjacent angles of the suspected edge pixel points, based on the positional relationship between any two different suspected edge pixel points on the same suspected diamond particle edge, and based on the difference in adjacent angles of all suspected edge pixel points between the any two different suspected edge pixel points on the suspected diamond particle edge, determine the circular significance of the any two different suspected edge pixel points, and determine the suspected detached edge based on the circular significance.

[0058] The suspected edge pixel point may correspond to the edge of the pit where the diamond particles fall off, or may correspond to the edge of the diamond particles that have not fallen off on the surface of the diamond wire. Therefore, the interference of the edge of the pit where the diamond particles fall off needs to be eliminated.

[0059] Diamond particles in both normal and damaged states are round or nearly round in shape, and analysis is performed based on the shape characteristics of the diamond particles.

[0060] Any suspected edge pixel point on the edge of the suspected diamond particle is recorded as the target suspected edge pixel point. The adjacent angle of the target suspected edge pixel point is determined according to the position of the suspected edge pixel point adjacent to the target suspected edge pixel point on the edge of the suspected diamond particle.

[0061] In order from left to right and from top to bottom, the first pixel point on the edge of the suspected diamond particle adjacent to the target suspected edge pixel point is selected, and the selected pixel point is recorded as the adjacent pixel point of the target suspected edge pixel point, and the ray pointing from the target suspected edge pixel point to the adjacent pixel point of the target suspected edge pixel point is recorded as the vector direction ray of the target suspected edge pixel point, and the angle between the vector direction ray of the target suspected edge pixel point and the horizontal right direction is recorded as the adjacent angle of the target suspected edge pixel point.

[0062] The adjacent angles of any suspected edge pixel points on the edge of the suspected diamond particle can be obtained in the same way.

[0063] The circular saliency of any two different suspected edge pixel points is determined based on the positional relationship between any two different suspected edge pixel points on the same suspected diamond particle edge and the difference in adjacent angles of all suspected edge pixel points between the any two different suspected edge pixel points on the suspected diamond particle edge.

[0064] Select any two different suspected edge pixel points on the same suspected diamond particle edge, and record the selected two different suspected edge pixel points as the first suspected edge pixel point and the second suspected edge pixel point in order from left to right and from top to bottom.

[0065] The standard deviation of the adjacent angles of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the difference in adjacent angles between the first suspected edge pixel and the second suspected edge pixel; the number of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the number of intervals between the first suspected edge pixel and the second suspected edge pixel; the product of the Euclidean distance between the first suspected edge pixel and the second suspected edge pixel and the number of intervals is recorded as the first product of the first suspected edge pixel and the second suspected edge pixel; the normalized value of the ratio of the difference in adjacent angles between the first suspected edge pixel and the second suspected edge pixel to the first product is recorded as the circular saliency of the first suspected edge pixel and the second suspected edge pixel.

[0066] In the process of calculating the ratio of the adjacent angle difference and the first product, in order to avoid the situation where the denominator is zero, it is necessary to add a preset value to the denominator. An example of the preset value is 0.01, where the denominator is the first product of the first suspected edge pixel point and the second suspected edge pixel point.

[0067] It should be noted that this embodiment uses the Z-Score standard normalization method to calculate the normalized value. In actual application, the implementer may use other methods in the prior art such as the maximum and minimum value normalization method, the sigmoid function, etc. to calculate the normalized value, which is not limited here.

[0068] When the first suspected edge pixel point and the second suspected edge pixel point are at the two ends of a circular or nearly circular edge, the Euclidean distance between the first suspected edge pixel point and the second suspected edge pixel point is short, the difference between the adjacent angles of all suspected edge pixels between the first suspected edge pixel point and the second suspected edge pixel point is large, and the circular significance of the first suspected edge pixel point and the second suspected edge pixel point is large. At this time, the edge with the first suspected edge pixel point and the second suspected edge pixel point as endpoints corresponds to the edge of the diamond particle in a normal state and a damaged state.

[0069] The circular saliency of any two different suspected edge pixel points on the same suspected diamond particle edge can be obtained in the same manner.

[0070] Set the circle screening threshold. In this implementation, the circle screening threshold is set to 0.7.

[0071] When the circular significance of the first suspected edge pixel point and the second suspected edge pixel point is greater than the circular screening threshold, it is determined whether the edge with the first suspected edge pixel point and the second suspected edge pixel point as endpoints is a closed edge; when the edge with the first suspected edge pixel point and the second suspected edge pixel point as endpoints is a closed edge, the edge with the first suspected edge pixel point and the second suspected edge pixel point as endpoints is marked as a suspected falling-off edge.

[0072] The step of determining the closed edge is because the edge of the pit corresponding to the position where the diamond particles fall off should be a closed edge.

[0073] At this point, all suspected detached edges in the diamond wire image are obtained.

[0074] Step S003, determine the diamond particle significance of the suspected detached edge according to the number and position distribution of the suspected edge pixels contained in the area divided by the suspected detached edge, record any suspected detached edge as the target suspected detached edge, determine the possibility of the pit edge of the target suspected detached edge according to the difference between the grayscale values ​​of the pixel points contained in the area divided by the target suspected detached edge and all other suspected detached edges, the diamond particle significance and the circular significance of the target suspected detached edge, and determine the detached edge according to the pit edge possibility.

[0075] Furthermore, considering that the diamond particles in normal and damaged states contain obvious suspected edge pixels, but the pits at the locations where the diamond particles fall off do not contain the features of the suspected edge pixels, all locations where the diamond particles fall off are screened from the suspected falling edges.

[0076] The prominence of the diamond particles of the suspected detached edge is determined according to the number and position distribution of the suspected edge pixel points contained in the area divided by the suspected detached edge.

[0077] The area demarcated by the suspected detached edge is recorded as the suspected detached area, and all suspected edge pixels in the suspected detached area, except the suspected edge pixels contained in the suspected detached edge, are recorded as the internal suspected edge pixels of the suspected detached edge. Connected domain analysis is performed on the internal suspected edge pixels of the suspected detached edge to obtain the internal suspected edge area of ​​the suspected detached edge.

[0078] The schematic diagram of the suspected edge area inside is as follows Figure 3 As shown. Figure 3In the figure, A represents a suspected detached edge, which is a circular or nearly circular closed edge. The area divided by the suspected detached edge includes two parts, A and B, which are the suspected detached edge and all the areas inside the suspected detached edge; B represents the suspected detached area divided by the suspected detached edge, which is the inside of the area divided by the suspected detached edge, including Figure 3 The gray area in and C are two parts; C represents the suspected fall-off area, which is composed of all suspected edge pixels except the suspected edge pixels contained in the suspected fall-off edge, and C is the internal suspected edge area of ​​the suspected fall-off edge.

[0079] The product of the cumulative sum of the numbers of all the internal suspected edge pixels contained in the internal suspected edge region of the suspected detached edge and the number of the internal suspected edge regions of the suspected detached edge is recorded as the diamond particle significance of the suspected detached edge.

[0080] When the number of internal suspected edge pixels contained in the internal suspected edge area of ​​the suspected detached edge is more and the number of internal suspected edge areas of the suspected detached edge is more, the number of obvious suspected edge pixels contained in the area divided by the suspected detached edge is more, the feature of the diamond particles appearing in the suspected detached edge containing obvious suspected edge pixels is more obvious, the possibility of the suspected detached edge corresponding to the pit at the detachment position of the diamond particles is smaller, and at this time, the internal suspected edge area of ​​the suspected detached edge is larger.

[0081] Furthermore, diamond has the characteristics of high hardness and high refractive index, and will also appear higher in the image, so the diamond particles will also appear higher in the image.

[0082] The average grayscale value of all pixels contained in the suspected detachment area divided by all suspected detachment edges is recorded as the first average value.

[0083] Any suspected falling-off edge is recorded as a target suspected falling-off edge, and the mean of the grayscale values ​​of all pixels contained in the target suspected falling-off edge is recorded as a second mean of the target suspected falling-off edge.

[0084] The possibility of the pit edge of the target suspected detached edge is determined according to the difference between the second mean and the first mean of the target suspected detached edge, the diamond particle significance and the circular significance of the target suspected detached edge.

[0085] The difference between the second mean and the first mean of the target suspected detached edge is recorded as the brightness difference of the target suspected detached edge, the normalized value of the product of the brightness difference of the target suspected detached edge and the circular significance and the diamond particle significance is recorded as the diamond particle characteristic significance value of the target suspected detached edge, and the difference between the number 1 and the diamond particle characteristic significance value of the target suspected detached edge is recorded as the pit edge possibility of the target suspected detached edge.

[0086] It should be noted that this embodiment uses the Z-Score standard normalization method to calculate the normalized value. In actual application, the implementer may use other methods in the prior art such as the maximum and minimum value normalization method, the sigmoid function, etc. to calculate the normalized value, which is not limited here.

[0087] When the second mean of the target suspected detached edge is larger than the first mean, the diamond particle significance and circular significance of the suspected detached edge are larger, the features of the diamond particles appearing in the suspected detached edge containing obvious suspected edge pixels are more significant, and the possibility that the suspected detached edge corresponds to the pit at the diamond particle detachment position is smaller. At this time, the possibility of the pit edge of the target suspected detached edge is smaller.

[0088] The same method can be used to obtain the possibility of the pit edge of any suspected detached edge.

[0089] Set the pit screening threshold. In this implementation, the circle screening threshold is set to 0.5.

[0090] When the probability of the pit edge of the suspected falling-off edge is greater than the pit screening threshold, the suspected falling-off edge is recorded as the falling-off edge. The falling-off edge corresponds to the edge of the pit where the diamond particles fall off.

[0091] At this point, all the fallen edges in the diamond wire image are obtained.

[0092] Step S004, monitoring abnormal working conditions of the diamond wire of the slicer according to the number of fallen-off edges and the number of suspected fallen-off edges.

[0093] The ratio of the number of fallen edges to the number of suspected fallen edges is recorded as the degree of diamond wire wear.

[0094] When the wear degree of the diamond wire is greater than or equal to the wear threshold, it is determined that the diamond wire has an abnormal operating condition; when the wear degree of the diamond wire is less than the wear threshold, it is determined that the diamond wire has no abnormal operating condition.

[0095] Among them, the abnormal working condition is that the degree of wear of the diamond wire is too large, and the value of the wear threshold in this embodiment is 0.5%.

[0096] At this point, the abnormal working condition monitoring result of the diamond wire of the slicer is obtained.

[0097] Based on the same inventive concept as the above method, an embodiment of the present invention also provides a device for monitoring abnormal operating conditions of diamond wires for a slicer, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein when the processor executes the computer program, the steps of any one of the above methods for monitoring abnormal operating conditions of diamond wires for a slicer are implemented.

[0098] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for monitoring abnormal working condition of diamond wire for a slicer, characterized in that: The method comprises the following steps: When the slicer has an abnormal working condition, the diamond wire image is collected, and the suspected diamond particle edge and the suspected edge pixel points on the suspected diamond particle edge are marked according to the edge information in the diamond wire image; Determine the adjacent angles of the suspected edge pixels according to the positional relationship between adjacent suspected edge pixels on the same suspected diamond particle edge, determine the circular significance of any two different suspected edge pixels on the same suspected diamond particle edge according to the positional relationship between the two adjacent suspected edge pixels and the difference of all the adjacent angles of the suspected edge pixels between the two different suspected edge pixels on the suspected diamond particle edge, and determine the suspected fall-off edge according to the circular significance; According to the number and position distribution of the suspected edge pixels contained in the area divided by the suspected detached edge, the diamond particle significance of the suspected detached edge is determined, and any suspected detached edge is recorded as the target suspected detached edge. According to the difference between the grayscale values ​​of the pixel points contained in the area divided by the target suspected detached edge and all other suspected detached edges, the diamond particle significance and circular significance of the target suspected detached edge are determined, and the detached edge is determined according to the pit edge probability; Based on the number of fallen edges and the number of suspected fallen edges, the abnormal working condition of the diamond wire of the slicer is monitored.

2. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The specific method of determining the adjacent angles of suspected edge pixels includes: Any suspected edge pixel point on the edge of the suspected diamond particle is recorded as a target suspected edge pixel point; In order from left to right and from top to bottom, the first pixel point on the edge of the suspected diamond particle adjacent to the target suspected edge pixel point is recorded as the adjacent pixel point of the target suspected edge pixel point; The ray pointing from the target suspected edge pixel point to the adjacent pixel point of the target suspected edge pixel point is recorded as the vector direction ray of the target suspected edge pixel point, and the angle between the vector direction ray of the target suspected edge pixel point and the horizontal right direction is recorded as the adjacent angle of the target suspected edge pixel point.

3. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The specific method of determining the circular saliency of any two different suspected edge pixels includes: Any two different suspected edge pixel points on the same suspected diamond particle edge are recorded as a first suspected edge pixel point and a second suspected edge pixel point respectively; The standard deviation of the adjacent angles of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the difference in the adjacent angles of the first suspected edge pixel and the second suspected edge pixel; The number of all suspected edge pixels between the first suspected edge pixel and the second suspected edge pixel on the edge of the suspected diamond particle is recorded as the number of intervals between the first suspected edge pixel and the second suspected edge pixel, and the product of the Euclidean distance between the first suspected edge pixel and the second suspected edge pixel and the number of intervals is recorded as the first product of the first suspected edge pixel and the second suspected edge pixel; The circular saliency of the first suspected edge pixel point and the second suspected edge pixel point is determined according to the difference between adjacent angles of the first suspected edge pixel point and the second suspected edge pixel point and the first product.

4. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 3, characterized in that: The method of determining the circular saliency of the first suspected edge pixel point and the second suspected edge pixel point according to the difference of adjacent angles between the first suspected edge pixel point and the second suspected edge pixel point and the first product includes the following specific methods: The normalized value of the ratio of the difference between the adjacent angles of the first suspected edge pixel and the second suspected edge pixel to the first product is recorded as the circular saliency of the first suspected edge pixel and the second suspected edge pixel.

5. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The specific method of determining the suspected detached edge according to the circular prominence includes: When the circular significance of two different suspected edge pixels on the same suspected diamond particle edge is greater than the circular screening threshold, the closed edge with the two different suspected edge pixels on the same suspected diamond particle edge as endpoints is marked as a suspected detached edge.

6. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The specific method of determining the significance of the diamond particles of the suspected detached edge according to the number and position distribution of the suspected edge pixels contained in the area divided by the suspected detached edge is as follows: All suspected edge pixels except the suspected edge pixels contained in the suspected falling-off edge in the area divided by the suspected falling-off edge are recorded as internal suspected edge pixels of the suspected falling-off edge, and the area composed of the internal suspected edge pixels of the suspected falling-off edge is recorded as the internal suspected edge area of ​​the suspected falling-off edge; The product of the cumulative sum of the numbers of all the internal suspected edge pixels contained in the internal suspected edge region of the suspected detached edge and the number of the internal suspected edge regions of the suspected detached edge is recorded as the diamond particle significance of the suspected detached edge.

7. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The method of determining the possibility of the concave edge of the target suspected detached edge according to the difference between the grayscale values ​​of the pixels contained in the area divided by the target suspected detached edge and all other suspected detached edges, the diamond particle prominence and the circular prominence of the target suspected detached edge, includes the following specific methods: The mean grayscale value of all pixels contained in the suspected detached area divided by all suspected detached edges is recorded as the first mean value; the mean grayscale value of all pixels contained in the target suspected detached edge is recorded as the second mean value of the target suspected detached edge; the difference between the second mean value of the target suspected detached edge and the first mean value is recorded as the brightness difference of the target suspected detached edge; The normalized value of the product of the brightness difference of the target suspected detached edge and the circular saliency and diamond particle saliency is recorded as the diamond particle characteristic saliency value of the target suspected detached edge; The difference between the number 1 and the diamond particle characteristic significance value of the target suspected falling edge is recorded as the pit edge possibility of the target suspected falling edge.

8. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The specific method of determining the falling edge according to the possibility of the pit edge is as follows: When the pit edge probability of the suspected detached edge is greater than the pit screening threshold, the suspected detached edge is recorded as a detached edge.

9. The method for monitoring abnormal working condition of diamond wire for slicer according to claim 1, characterized in that: The method of monitoring the abnormal working condition of the diamond wire of the slicer according to the number of fallen edges and the number of suspected fallen edges includes: The ratio of the number of fallen edges to the number of suspected fallen edges is recorded as the degree of diamond wire wear; When the wear degree of the diamond wire is greater than or equal to the wear threshold, it is determined that the diamond wire has an abnormal operating condition; when the wear degree of the diamond wire is less than the wear threshold, it is determined that the diamond wire has no abnormal operating condition.

10. A device for monitoring abnormal working condition of diamond wire for a slicer, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 9 are implemented.

Images