Cleaning device for semiconductor wafer

Abstract

The invention relates to the technical field of semiconductor wafer cleaning, in particular to a semiconductor wafer cleaning device which comprises an ultrasonic cleaning machine, a retention support installed on the side face of the ultrasonic cleaning machine, a transmission mechanism horizontally installed on the retention support and a bottom face flat plate obliquely arranged on the retention support. The ultrasonic cleaning device comprises a bottom surface flat plate, a baffle hinged to the lower end of the bottom surface flat plate, a plurality of smooth strips connected to the upper end of the bottom surface flat plate at equal intervals, a linear moving mechanism arranged behind the ultrasonic cleaning machine, a plurality of supporting columns installed on the linear moving mechanism in an array mode, and clamping and brushing cleaning parts installed on the supporting columns. According to the semiconductor wafer cleaning device, mutual influence among semiconductor wafers under the condition of batch cleaning can be prevented, interference of foreign objects on the semiconductor wafers with small sizes during cleaning can be completely eradicated, and the cleaning efficiency and the cleaning effect are powerfully guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer cleaning, and in particular to a cleaning device for semiconductor wafers. Background Art

[0002] Semiconductor chips are an indispensable core component of modern electronic devices. Semiconductor chips are microelectronic devices made of semiconductor materials, usually made of materials such as silicon, germanium or gallium arsenide. These materials have electrical conductivity between conductors and insulators at room temperature, so they are called "semiconductors". Semiconductor chips are widely used in electronic products such as computers, mobile phones, and digital recorders.

[0003] The manufacturing of semiconductor wafers is a complex and delicate process, covering multiple steps from raw material preparation to final packaging. The first step in semiconductor wafer manufacturing is to make a single crystal column, usually using silicon or gallium arsenide materials. After the single crystal column is made, it is cut into thin slices with a diamond saw, and then the wafer is processed in sequence by grinding, polishing, cleaning, etc. During the manufacturing process, the wafer will be contaminated. For example, after grinding, grinding mortar, silicon chips, and even iron chips on the grinding plate will remain on both surfaces of the wafer. Therefore, pollutants from multiple sources such as air, human body, production equipment or chemicals may cause the wafer to be contaminated.

[0004] In order to keep the surface of the chip clean at a microscopic scale, ensure that its surface reaches a very high degree of cleanliness, and prevent contaminants from affecting the performance and reliability of electronic equipment, it is essential to clean the chip. Cleaning can remove dirt and chemical impurities on the chip, prevent the chip surface from being corroded, remove thermal stress, etc. However, there are some problems in the process of cleaning the chip:

[0005] 1. When ultrasonic cleaning is used, due to the small size of the wafers, placing semiconductor wafers in batches into the ultrasonic cleaning tank will cause trouble in placing and taking out, resulting in low efficiency, and batches of semiconductor wafers are very likely to stick together in the cleaning tank, resulting in incomplete cleaning, or the semiconductor wafers are first inserted into the cleaning basket of the ultrasonic cleaning machine and then cleaned. Although this improves the cleaning efficiency, the cleaning basket is very likely to interfere with the smaller semiconductor wafers, resulting in poor cleaning effect;

[0006] 2. When placing a single wafer on a conveyor belt and cleaning it with a cleaning device installed above the conveyor belt, only the upper surface of the wafer can be cleaned at a time, and the lower surface of the wafer in contact with the conveyor belt cannot be cleaned synchronously and can only be turned over and cleaned again, which seriously affects the cleaning efficiency;

[0007] 3. The drying operation after cleaning needs to be carried out separately, the connection of the production line is poor, the production efficiency is affected, and there is a greater risk of secondary contamination of the chips. Summary of the invention

[0008] The object of the present invention is to provide a cleaning device for semiconductor wafers to solve the above problems.

[0009] In order to achieve the above-mentioned object, the present invention provides a cleaning device for semiconductor wafers, comprising: an ultrasonic cleaning machine, a retaining bracket installed on the side of the ultrasonic cleaning machine, a transmission mechanism installed horizontally on the retaining bracket, a bottom plate obliquely arranged on the retaining bracket, a baffle hinged at the lower end of the bottom plate, a plurality of parallel bars connected to the upper end of the bottom plate at equal intervals, a linear moving mechanism arranged at the rear of the ultrasonic cleaning machine, a plurality of pillars installed in an array on the linear moving mechanism, a clamping and brushing part installed on a plurality of the pillars, a lowering mechanism arranged on the clamping and brushing part, and a hot drying part arranged on the linear moving mechanism and the clamping and brushing part;

[0010] A plurality of said ...

[0011] The clamping and brushing part is slidably mounted in the lowering mechanism, wherein:

[0012] The transport mechanism is suitable for transporting the peripheral semiconductor wafers to the bottom plate through the plurality of rows and columns, so that the peripheral semiconductor wafers are arranged in batches in multiple columns on the bottom plate;

[0013] The clamping and brushing part is driven to clamp all the peripheral semiconductor wafers on the bottom plate;

[0014] The clamping and brushing part is suitable for subjecting the peripheral semiconductor wafer to a brushing action to complete the preliminary cleaning of the peripheral semiconductor wafer;

[0015] The linear moving mechanism and the lowering mechanism are adapted to respectively drive the clamping and brushing part to perform lateral movement and sinking action, so that the peripheral semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine for cleaning;

[0016] Driving the heat baking part can generate a flowing hot air flow and discharge it bidirectionally toward the external semiconductor wafer, so that the external semiconductor wafer is in a dry heat environment.

[0017] Further, the clamping and brushing part includes a plurality of clamping bars arranged in the same direction as the bottom flat plate, and the plurality of clamping bars are arranged facing each other in pairs. A plurality of first hanging blocks and a plurality of second hanging blocks are respectively installed at the upper ends of the plurality of clamping bars, and the plurality of first hanging blocks and the plurality of second hanging blocks are arranged at intervals. A base bar block is arranged above the plurality of first hanging blocks and the plurality of second hanging blocks in the same direction. A first rectangular groove and a second rectangular groove are opened in the lower half of the base bar block along the long side direction of the base bar block, and the second rectangular groove is located behind the first rectangular groove. Two through grooves are opened in the upper half of the base bar block and are respectively connected to the second rectangular groove and the first rectangular groove. A plurality of first connecting plates and a plurality of second connecting plates are respectively slidably installed in the two through grooves. Two connecting bars are respectively installed on the plurality of first connecting plates and the plurality of second connecting plates. And two first electric push rods are mirror-symmetrically arranged at both ends of the base bar block, and the output shafts of the two first electric push rods are respectively connected to the two connecting bars;

[0018] The plurality of clamping bars are attached to the surface of the bottom flat plate, and the lower ends of the plurality of clamping bars are all in contact with the baffle;

[0019] The plurality of first hanging blocks are slidably installed in the first rectangular groove, and the plurality of first connecting plates are respectively connected to the plurality of first hanging blocks;

[0020] The plurality of second hanging blocks are slidably installed in the second rectangular groove, and the plurality of second connecting plates are respectively connected to the plurality of second hanging blocks.

[0021] Further, the clamping and brushing part further includes a U-shaped plate arranged in the same direction as the bottom flat plate and installed on the plurality of support columns, and the left open end of the U-shaped plate faces the bottom flat plate. Two groups of a plurality of cleaning brushes are oppositely installed inside the U-shaped plate. A groove member is horizontally placed at the top end of the U-shaped plate. A tension member is slidably installed at one end in the groove member. An extension panel is connected to the side of the groove member away from the tension member. And a second electric push rod is installed on the extension panel, and the output shaft of the second electric push rod is connected to the tension member;

[0022] The other end of the tension member is integrally connected to the base bar block;

[0023] The plurality of clamping bars are aligned with the gap between the two groups of a plurality of cleaning brushes;

[0024] The base bar block is higher than the top surface of the U-shaped plate.

[0025] Further, the lowering mechanism includes a plurality of sinking grooves opened on the surface of the U-shaped plate and perpendicular to the groove member, a mounting plate member installed at the lower end of the U-shaped plate, and a cylinder arranged on the mounting plate member;

[0026] The output end of the cylinder is connected to the middle part of the groove member;

[0027] The bottom of the groove member is slidably mounted in a plurality of the sunken grooves.

[0028] Furthermore, the hot air drying part includes a hot air blower arranged on the linear moving mechanism, two transfer air boxes installed on the side surface of the C-shaped plate, two external blowing channels respectively connected to the two transfer air boxes, an accumulation chamber installed at the air outlet of the hot air blower, and two conveying pipes with one end connected to the accumulation chamber and the other end respectively connected to the two transfer air boxes;

[0029] The two external blowing channels are inclined and arranged facing each other;

[0030] The movement tracks of a plurality of the clamping strips are between the two external blowing channels.

[0031] Furthermore, the transmission mechanism includes a reference table horizontally installed on the retaining bracket, and a plurality of conveyor belts linearly arranged on the reference table;

[0032] A plurality of the conveyor belts are respectively aligned with the gaps between a plurality of the clamping strips arranged in pairs facing each other;

[0033] A plurality of the along strips are respectively close to a plurality of the conveyor belts.

[0034] Furthermore, rubber strips are installed on the facing sides of a plurality of the clamping strips.

[0035] Furthermore, a plurality of groups of guiding eaves are installed on the top of the bottom surface flat plate, and a plurality of groups of the guiding eaves are close to a plurality of the second hanging blocks;

[0036] A plurality of groups of the guiding eaves correspond to a plurality of the conveyor belts one by one.

[0037] Furthermore, a receiving dish is detachably installed on the bottom of the lower surface of the C-shaped plate.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] 1. With the cooperation of the transmission mechanism and the clamping and brushing part, the cleaning device for semiconductor wafers can automatically arrange the semiconductor wafers to be cleaned as required, and can stably clamp all the arranged semiconductor wafers. In addition, under the combined action of the linear moving mechanism and the lowering mechanism, all the clamped wafers can be smoothly sent into the cleaning tank of the ultrasonic cleaning machine for cleaning, taking into account the rapid and convenient loading and unloading of semiconductor wafers while ensuring batch cleaning, thus effectively ensuring the overall high-efficiency cleaning;

[0040] 2. The cleaning device for semiconductor wafers uses the clamping brush cleaning part as a carrier to support the semiconductor wafers in the cleaning tank of the ultrasonic cleaning machine to receive cleaning, so that all semiconductor wafers can be spread out in one layer, so that both the front and back sides are fully exposed in the cleaning tank and fully cleaned, which can not only prevent the semiconductor wafers from affecting each other in the case of batch cleaning, but also completely prevent foreign objects from interfering with the semiconductor wafers with smaller volumes during cleaning, and effectively ensure the cleaning efficiency and cleaning effect;

[0041] 3. The cleaning device for semiconductor wafers can finely brush both the front and back sides of all semiconductor wafers before sending the semiconductor wafers into the cleaning tank of the ultrasonic cleaning machine for cleaning through the clamping brush cleaning part, so as to remove part of the pollutants on the semiconductor wafers, thereby improving the cleaning effect of the semiconductor wafers, ensuring the thorough cleaning of the pollutants, and forming a pretreatment process, preventing the semiconductor wafers with too much pollutants from being directly put into the cleaning tank for cleaning, causing the cleaning liquid to be contaminated too quickly, extending the single service life of the ultrasonic cleaning machine cleaning liquid, and avoiding the need for frequent replacement, which causes cumbersome operations and economic losses;

[0042] 4. The cleaning device for semiconductor wafers can continuously blow dry hot air toward the front and back sides of the semiconductor wafers through the hot drying part after the semiconductor wafers are cleaned, so that the semiconductor wafers are continuously wrapped in the dry hot air flow, and the drying operation of the semiconductor wafers is realized, thereby greatly improving the connectivity of the production line. There is no need to transfer the semiconductor wafers to other locations for drying, which not only ensures the production efficiency but also effectively avoids the risk of secondary contamination of the cleaned semiconductor wafers in the process of transferring them to the drying location, thereby ensuring the effectiveness of cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0044] Figure 1 A perspective view of the present invention is shown;

[0045] Figure 2 Shows a front view of the present invention;

[0046] Figure 3 A first partial perspective view of the present invention is shown;

[0047] Figure 4 A second partial perspective view of the present invention is shown;

[0048] Figure 5 A third partial perspective view of the present invention is shown;

[0049] Figure 6Shows a fourth partial perspective view of the present invention;

[0050] Figure 7 Shows a fifth partial perspective view of the present invention;

[0051] Figure 8 Shows a partial bottom perspective view of the present invention;

[0052] Fig. 9 Shows a schematic diagram when a semiconductor wafer is fed into the cleaning tank of an ultrasonic cleaning machine;

[0053] Fig.10 Shows a partial right view of the present invention from another angle;

[0054] Fig.11 Shows the present invention Figure 5 An enlarged view of part A;

[0055] Fig.12 Shows the present invention Figure 7 An enlarged view of part B;

[0056] Fig.13 Shows the present invention Fig.10 An enlarged view of part C.

[0057] In the figure, the same reference numerals denote the same structural elements, where:

[0058] 1. Ultrasonic cleaning machine; 2. Retaining bracket; 3. Transmission mechanism; 31. Reference table; 32. Conveyor belt; 4. Bottom flat plate; 5. Baffle; 6. Along the strip; 7. Linear moving mechanism; 8. Pillar; 9. Clamping and brushing part; 91. Clamping strip; 92. First hanging block; 93. Second hanging block; 94. Matrix strip; 95. First rectangular groove; 96. Second rectangular groove; 97. First connecting plate; 98. Second connecting plate; 99. Connecting strip; 991. First electric push rod; 992. C-shaped plate; 993. Cleaning brush; 994. Groove part; 995. Tension part; 996. Extension panel; 997. Second electric push rod; 10. Lowering mechanism; 101. Sinking groove; 102. Mounting plate part; 103. Cylinder; 11. Heat drying part; 12. Hot air blower; 13. Intermediate air box; 14. Outer blowing channel; 15. Accumulation chamber; 16. Delivery pipe; 17. Rubber strip; 18. Guiding edge; 19. Receiving dish. Detailed Description of the Invention

[0059] Now, the present invention will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention.

[0060] As Figure 1-13As shown, a cleaning device for semiconductor wafers comprises: an ultrasonic cleaning machine 1, a retaining bracket 2 installed on the side of the ultrasonic cleaning machine 1, a transmission mechanism 3 installed horizontally on the retaining bracket 2, a bottom plate 4 obliquely arranged on the retaining bracket 2, a baffle 5 hinged at the lower end of the bottom plate 4, a plurality of longitudinal strips 6 connected to the upper end of the bottom plate 4 at equal intervals, a linear moving mechanism 7 arranged at the rear of the ultrasonic cleaning machine 1, a plurality of pillars 8 arranged in an array on the linear moving mechanism 7, and a clamping brush installed on the plurality of pillars 8. Part 9, a lowering mechanism 10 arranged on the clamping and brushing part 9, and a hot baking part 11 arranged on the linear moving mechanism 7 and the clamping and brushing part 9, the baffle 5 can ensure that the semiconductor wafer will not leak out when the transmission mechanism 3 sends the semiconductor wafer to the bottom plate 4, and at the same time, the hinged baffle 5 can be pushed away when the clamping and brushing part 9 completes the clamping of the semiconductor wafer and moves to the cleaning tank of the ultrasonic cleaning machine 1, so as not to hinder the clamping and brushing part 9, and when the clamping and brushing part 9 needs to be re-attached to the bottom plate 4, the baffle 5 is bent downward to make way for the clamping and brushing part 9 to move;

[0061] A plurality of said along-line 6 are close to said transmission mechanism 3;

[0062] The clamping and brushing part 9 is slidably mounted in the lowering mechanism 10, wherein:

[0063] The transmission mechanism 3 is suitable for transporting the peripheral semiconductor wafers to the bottom plate 4 via the plurality of the longitudinal strips 6, so that the peripheral semiconductor wafers are arranged in batches in multiple rows on the bottom plate 4;

[0064] Driving the clamping and cleaning brush 9 can clamp all the peripheral semiconductor wafers on the bottom plate 4;

[0065] The clamping and brushing part 9 is suitable for subjecting the peripheral semiconductor wafer to a brushing action, so as to complete the preliminary cleaning of the peripheral semiconductor wafer;

[0066] The linear moving mechanism 7 and the lowering mechanism 10 are suitable for driving the clamping and brushing part 9 to perform lateral movement and sinking respectively, so that the peripheral semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine 1 for cleaning. The linear moving mechanism 7 can be a linear motor or a gear rack transmission mechanism, etc., which can realize linear reciprocating movement;

[0067] Driving the hot drying section 11 can generate a flowing hot air flow and can discharge it bidirectionally toward the external semiconductor wafer, so that the external semiconductor wafer is in a dry and hot environment. The cleaning device for semiconductor wafers can automatically arrange the semiconductor wafers to be cleaned as required under the cooperation of the transmission mechanism 3 and the clamping and brushing section 9, and can stably clamp all the arranged semiconductor wafers. In addition, under the joint action of the linear moving mechanism 7 and the lowering mechanism 10, all the clamped wafers can be smoothly sent to the cleaning tank of the ultrasonic cleaning machine 1 for cleaning, while ensuring batch cleaning and taking into account the fast and convenient placement and removal of semiconductor wafers, thereby effectively ensuring overall high-efficiency cleaning. The cleaning device for semiconductor wafers uses the clamping and brushing section 9 as a carrier of the semiconductor wafer in the cleaning tank of the ultrasonic cleaning machine 1 to support it for cleaning, and can make all the semiconductor wafers spread out in a layer, so that the front and back sides of the semiconductor wafers are fully exposed in the cleaning tank for cleaning, which can not only prevent the semiconductor wafers from affecting each other in the case of batch cleaning, but also completely prevent foreign objects from interfering with smaller semiconductor wafers during cleaning, effectively ensuring cleaning. Efficiency and cleaning effect. The clamping brush cleaning part 9 can be used to finely brush the front and back sides of all semiconductor wafers before sending the semiconductor wafers into the cleaning tank of the ultrasonic cleaning machine 1 for cleaning, so as to remove some of the pollutants on the semiconductor wafers, thereby improving the cleaning effect of the semiconductor wafers and ensuring the thorough cleaning of the pollutants. At the same time, a pretreatment process is formed to prevent semiconductor wafers with too many pollutants from being directly placed in the cleaning tank for cleaning, which causes the cleaning liquid to be contaminated too quickly, and prolong the single service life of the cleaning liquid of the ultrasonic cleaning machine 1, avoiding the need for frequent replacement and causing cumbersome operations and economic losses. After the semiconductor wafers are cleaned, the hot drying part 11 can be used to continuously blow dry hot air toward the front and back sides of the semiconductor wafers, so that the semiconductor wafers are continuously wrapped in the dry hot air flow, and the drying operation of the semiconductor wafers is realized, thereby greatly improving the connectivity of the production line. There is no need to transfer the semiconductor wafers to other locations for drying, which not only ensures the production efficiency, but also effectively avoids the risk of secondary contamination of the cleaned semiconductor wafers in the process of transferring them to the drying location, thereby ensuring the effectiveness of cleaning.

[0068] Optionally, the clamping and brushing portion 9 includes a plurality of clamping strips 91 arranged in the same direction as the bottom flat plate 4, and the plurality of clamping strips 91 are arranged in pairs facing each other, and are respectively installed on a plurality of first hanging blocks 92 and a plurality of second hanging blocks 93 at the upper ends of the plurality of clamping strips 91, and the plurality of first hanging blocks 92 and the plurality of second hanging blocks 93 are arranged at intervals, and a base strip 94 arranged in the same direction above the plurality of first hanging blocks 92 and the plurality of second hanging blocks 93, a first rectangular groove 95 and a second rectangular groove 96 are opened on the lower half of the base strip 94 along the long side direction of the base strip 94, and the second rectangular groove 96 is The first rectangular groove 96 is located behind the first rectangular groove 95, two through grooves are opened on the upper half of the base bar 94 and respectively connected to the second rectangular groove 96 and the first rectangular groove 95, a plurality of first connecting plates 97 and a plurality of second connecting plates 98 are respectively slidably mounted in the two through grooves, two conjoined bars 99 are respectively mounted on the plurality of first connecting plates 97 and the plurality of second connecting plates 98, and two first electric push rods 991 are mirror-imaged at both ends of the base bar 94, and the output shafts of the two first electric push rods 991 are respectively connected to the two conjoined bars 99;

[0069] A plurality of the clamping strips 91 are attached to the surface of the bottom plate 4, and the lower ends of the plurality of the clamping strips 91 are attached to the baffle 5;

[0070] A plurality of the first hanging blocks 92 are slidably installed in the first rectangular groove 95, and a plurality of the first connecting plates 97 are respectively connected to the plurality of the first hanging blocks 92;

[0071] A plurality of the second hanging blocks 93 are slidably installed in the second rectangular grooves 96, and a plurality of the second connecting plates 98 are respectively connected to the plurality of the second hanging blocks 93. Before cleaning, it is necessary to set the number of semiconductor wafers to be cleaned in a single batch first, that is, the arrangement height of the semiconductor wafers on the bottom flat plate 4 should be controlled to an appropriate level, so as to ensure that all the semiconductor wafers in the current batch can be sent into the cleaning tank of the ultrasonic cleaning machine 1 and covered by the cleaning liquid for cleaning subsequently. In the initial state, the output shafts of the two first electric push rods 991 are both in the extended state with the same amount. After the conveying mechanism 3 conveys all the semiconductor wafers to be cleaned in the current batch onto the bottom flat plate 4 and arranges them, synchronously drive the two first electric push rods 991 to synchronously pull the two connecting bars 99, a plurality of the first connecting plates 97 and a plurality of the second connecting plates 98 towards each other. One first electric push rod 991 pulls a plurality of clamping bars 91 connected to the plurality of first hanging blocks 92 in the same direction, while the other first electric push rod 991 pulls a plurality of clamping bars 91 connected to the plurality of second hanging blocks 93 in the opposite direction, so that every two opposite clamping bars 91 gradually close until all the semiconductor wafers are clamped, and then stop driving the two first electric push rods 991. The clamping and brushing part 9 is used to put and take out the semiconductor wafers in batches into and out of the cleaning tank of the ultrasonic cleaning machine 1, ensuring that the putting and taking out of the semiconductor wafers can be completed quickly and conveniently, and effectively improving the overall cleaning efficiency; at the same time, after a batch of semiconductor wafers are all clamped by the clamping and brushing part 9, the semiconductor wafers are in a single-layer spread state, so that both the front and back sides of the semiconductor wafers can be completely exposed. When they enter the cleaning tank of the ultrasonic cleaning machine 1 for cleaning, both the front and back sides can be thoroughly cleaned, thereby avoiding mutual influence between the semiconductor wafers or interference from foreign objects, and ensuring a high-quality cleaning effect.

[0072] Optionally, the clamping and brushing part 9 further includes a C-shaped plate 992 arranged in the same direction as the bottom flat plate 4 and installed on the plurality of the support columns 8, and the left open end of the C-shaped plate 992 faces the bottom flat plate 4. Two groups of a plurality of cleaning brushes 993 installed oppositely inside the C-shaped plate 992, a groove member 994 horizontally placed at the top end of the C-shaped plate 992, a tension member 995 with one end slidably installed in the groove member 994, an extension panel 996 connected to the side of the groove member 994 away from the tension member 995, and a second electric push rod 997 installed on the extension panel 996, and the output shaft of the second electric push rod 997 is connected to the tension member 995;

[0073] The other end of the tension member 995 is integrally connected to the base bar 94;

[0074] A number of the clamping strips 91 are aligned with the gaps between two groups of a number of the cleaning brushes 993, ensuring that a number of the clamping strips 91 can enter. However, the gaps between two groups of a number of the cleaning brushes 993 are smaller than the thickness of a number of the clamping strips 91, so as to ensure that after a number of the clamping strips 91 clamping the semiconductor wafers enter the inside of the C-shaped plate 992, two groups of a number of the cleaning brushes 993 can fully contact the front and back sides of the semiconductor wafers to brush them;

[0075] The base strip 94 is higher than the top surface of the C-shaped plate 992. Before the transfer mechanism 3 transfers the semiconductor wafers, a number of the clamping strips 91 are adjusted to a state of fitting the surface of the bottom flat plate 4 and the lower end being in contact with the baffle 5 through the linear movement mechanism 7 and the lowering mechanism 10; after clamping all the semiconductor wafers on the bottom flat plate 4, the second electric push rod 997 is driven to pull the tension member 995 backward along the groove member 994, so as to pull the base strip 94 backward synchronously, thereby enabling a number of the clamping strips 91 and the semiconductor wafers clamped by them to gradually enter the C-shaped plate 992. After all the semiconductor wafers enter the C-shaped plate 992, the second electric push rod 997 is driven in the reverse direction to push them out. Repeating this process for multiple back-and-forth movements, during which the front and back sides of all the semiconductor wafers are finely brushed by two groups of a number of the cleaning brushes 993 for many times. Furthermore, before the semiconductor wafers are cleaned by the ultrasonic cleaning machine 1, they are first subjected to a pretreatment to remove stubborn contaminants on the semiconductor wafers, or contaminants that are not easily cleaned by the ultrasonic cleaning machine 1, etc., removing a part of the existing contaminants on the semiconductor wafers in advance, ensuring the cleaning effect of the semiconductor wafers, guaranteeing the thoroughness of the cleaning of the contaminants. At the same time, it can effectively prevent directly putting the semiconductor wafers with excessive attached contaminants into the cleaning tank for cleaning, which causes the cleaning liquid to be polluted too quickly, extends the single service life of the cleaning liquid in the ultrasonic cleaning machine 1, and avoids the cumbersome operation and economic losses caused by frequent replacement; after the pretreatment is completed, the second electric push rod 997 is used to reset a number of the clamping strips 91 to ensure that they can smoothly enter the cleaning tank of the ultrasonic cleaning machine 1.

[0076] Optionally, the lowering mechanism 10 includes a number of sinking grooves 101 formed on the surface of the C-shaped plate 992 and perpendicular to the groove member 994, a mounting plate member 102 installed at the lower end of the C-shaped plate 992, and a cylinder 103 provided on the mounting plate member 102;

[0077] The output end of the cylinder 103 is connected to the middle of the groove member 994;

[0078] The bottom of the groove member 994 is slidably installed in several of the recessed grooves 101. After the pre-treatment of the semiconductor wafer is completed and several clamping bars 91 are reset, first, the linear movement mechanism 7 is used to horizontally move several clamping bars 91. After they reach appropriate positions, the driving cylinder 103 is driven to directly pull down the groove member 994 along several recessed grooves 101, and indirectly synchronously move the tension member 995 and the base bar 94 downward until the entire semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine 1 and is submerged by the cleaning liquid, ensuring that the semiconductor wafer is smoothly cleaned by the ultrasonic cleaning machine 1.

[0079] Optionally, the hot air drying part 11 includes a hot air blower 12 arranged on the linear movement mechanism 7, two transfer air boxes 13 installed on the side of the C-shaped plate 992, two external blowing channels 14 respectively connected to the two transfer air boxes 13, an accumulation chamber 15 installed at the air outlet of the hot air blower 12, and two delivery pipes 16 with one end connected to the accumulation chamber 15 and the other end respectively connected to the two transfer air boxes 13;

[0080] The two external blowing channels 14 are inclined and arranged facing each other;

[0081] The movement trajectories of several clamping bars 91 are located between the two external blowing channels 14 to prevent the external blowing channels 14 from hindering the movement of several clamping bars 91. After the cleaning is completed in the ultrasonic cleaning machine 1, the driving cylinder 103 is reversely driven to fish out the semiconductor wafer from the cleaning tank of the ultrasonic cleaning machine 1 until the groove member 994 is pushed up to the highest position, that is, the state where the base bar 94 is higher than the top surface of the C-shaped plate 992, and maintained for a certain period of time. During this process, the linear movement mechanism 7 needs to be coordinated to control all of them above the cleaning tank of the ultrasonic cleaning machine 1 to prevent the remaining cleaning liquid on several clamping bars 91 and the semiconductor wafer from dripping to other positions and causing pollution; Subsequently, the second electric push rod 997 is used to pull several clamping bars 91 backward towards the two external blowing channels 14 until the outermost clamping bar 91 is close to the two external blowing channels 14. Then, the hot air blower 12 is started. The hot air blower 12 starts to blow hot air and sends the hot air to the two transfer air boxes 13 along the accumulation chamber 15 and the two delivery pipes 16 in sequence, and finally blows out obliquely through the two external blowing channels 14, so that both the front and back surfaces of the semiconductor wafer on several clamping bars 91 are continuously blown by the dry hot air, so that the semiconductor wafer is continuously wrapped in the dry hot air flow, realizing the drying operation of the semiconductor wafer, thereby greatly improving the connection of the production line. There is no need to transfer the semiconductor wafer to other places for drying, which not only ensures the production efficiency, but also effectively avoids the risk of secondary pollution of the cleaned semiconductor wafer during the process of transferring it to the drying location, ensuring the effectiveness of the cleaning.

[0082] Optionally, the transmission mechanism 3 includes a reference table 31 horizontally installed on the retention bracket 2, and a number of conveyor belts 32 linearly arranged on the reference table 31, ensuring that the semiconductor wafers to be cleaned can be sequentially sent to the bottom flat plate 4 through the number of conveyor belts 32;

[0083] A number of the conveyor belts 32 are respectively aligned with the gaps between a number of pairs of oppositely arranged clamping strips 91, ensuring that the number of conveyor belts 32 accurately group and sequentially arrange the semiconductor wafers to a preset position, so as to ensure that the semiconductor wafers fall within the clamping area of the number of clamping strips 91 and are smoothly clamped;

[0084] A number of the guiding strips 6 are respectively close to a number of the conveyor belts 32, ensuring that the semiconductor wafers can smoothly slide down along the guiding strips 6 to the bottom flat plate 4 after leaving the conveyor belts 32.

[0085] Optionally, rubber strips 17 are installed on the opposite sides of a number of the clamping strips 91. When clamping, the soft rubber strips 17 form a certain protection for the semiconductor wafers to prevent the semiconductor wafers from being clamped and damaged; at the same time, the soft rubber strips 17 have the ability to deform, so as to ensure that even when there are slight errors in the semiconductor wafers resulting in inconsistent sizes, under the continuous closing of the two clamping strips 91 on both sides, the rubber strips 17 can adapt to the shape of the semiconductor wafers in the middle, so as to ensure that all the semiconductor wafers are firmly clamped and the error tolerance rate is improved.

[0086] Optionally, a number of groups of guiding eaves 18 are installed on the top of the bottom flat plate 4, and a number of groups of the guiding eaves 18 are close to a number of the second hanging blocks 93;

[0087] A number of groups of the guiding eaves 18 correspond to a number of the conveyor belts 32 one by one, and a number of groups of guiding eaves 18 are used to intercept and prevent on the movement route of the semiconductor wafers to prevent the semiconductor wafers from sliding wantonly out of the movement route, ensuring that they can smoothly slide into the clamping area of a number of clamping strips 91.

[0088] Optionally, a receiving dish 19 is detachably installed on the bottom of the lower surface of the U-shaped plate 992. When two groups of a number of cleaning brushes 993 brush the semiconductor wafers, the receiving dish 19 can catch the pollutants brushed off and sliding down along the U-shaped plate 992 to a certain extent, thus reducing the subsequent cleaning pressure.

[0089] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cleaning device for semiconductor wafers, characterized in that: include: An ultrasonic cleaning machine (1), a retaining bracket (2) mounted on the side of the ultrasonic cleaning machine (1), a transmission mechanism (3) mounted horizontally on the retaining bracket (2), a bottom plate (4) obliquely arranged on the retaining bracket (2), a baffle (5) hinged at the lower end of the bottom plate (4), a plurality of longitudinal strips (6) connected to the upper end of the bottom plate (4) at equal intervals, a linear moving mechanism (7) arranged at the rear of the ultrasonic cleaning machine (1), a plurality of pillars (8) mounted in an array on the linear moving mechanism (7), a clamping and brushing section (9) mounted on the plurality of pillars (8), a lowering mechanism (10) arranged on the clamping and brushing section (9), and a heat drying section (11) arranged on the linear moving mechanism (7) and the clamping and brushing section (9); A plurality of the longitudinal strips (6) are close to the transmission mechanism (3); The clamping and brushing part (9) is slidably mounted in the lowering mechanism (10), wherein: The transport mechanism (3) is suitable for transporting the peripheral semiconductor wafers to the bottom plate (4) in rows via the plurality of the longitudinal strips (6), so that the peripheral semiconductor wafers are arranged in batches in multiple rows on the bottom plate (4); The clamping and brushing part (9) is driven to clamp all the peripheral semiconductor wafers on the bottom plate (4); The clamping and brushing part (9) is suitable for subjecting the peripheral semiconductor wafer to a brushing action, so as to complete the preliminary cleaning of the peripheral semiconductor wafer; The linear moving mechanism (7) and the lowering mechanism (10) are suitable for driving the clamping and brushing part (9) to perform lateral movement and downward movement respectively, so that the peripheral semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine (1) for cleaning; Driving the heat baking part (11) can generate a flowing hot air flow and discharge it bidirectionally toward the external semiconductor wafer, so that the external semiconductor wafer is in a dry heat environment.

2. The semiconductor wafer cleaning device according to claim 1, characterized in that: The clamping and brushing part (9) includes a plurality of clamping strips (91) arranged in the same direction as the bottom flat plate (4), and the plurality of clamping strips (91) are arranged facing each other in pairs. A plurality of first hanging blocks (92) and a plurality of second hanging blocks (93) are respectively installed at the upper ends of the plurality of clamping strips (91), and the plurality of first hanging blocks (92) and the plurality of second hanging blocks (93) are arranged at intervals. A base strip block (94) is arranged above the plurality of first hanging blocks (92) and the plurality of second hanging blocks (93) in the same direction. A first rectangular groove (95) and a second rectangular groove (96) are formed in the lower half of the base strip block (94) along the long side direction of the base strip block (94), and the second rectangular groove (96) is located behind the first rectangular groove (95). Two through grooves are formed in the upper half of the base strip block (94) and are respectively connected to the second rectangular groove (96) and the first rectangular groove (95). A plurality of first connecting plates (97) and a plurality of second connecting plates (98) are respectively slidably installed in the two through grooves. Two connecting strips (99) are respectively installed on the plurality of first connecting plates (97) and the plurality of second connecting plates (98). Two first electric push rods (991) are mirror-symmetrically arranged at both ends of the base strip block (94), and the output shafts of the two first electric push rods (991) are respectively connected to the two connecting strips (99); The plurality of clamping strips (91) are attached to the surface of the bottom flat plate (4), and the lower ends of the plurality of clamping strips (91) are all in contact with the baffle (5); The plurality of first hanging blocks (92) are slidably installed in the first rectangular groove (95), and the plurality of first connecting plates (97) are respectively connected to the plurality of first hanging blocks (92); The plurality of second hanging blocks (93) are slidably installed in the second rectangular groove (96), and the plurality of second connecting plates (98) are respectively connected to the plurality of second hanging blocks (93).

3. The cleaning device for semiconductor wafers according to claim 2, wherein The clamping and brushing part (9) further includes a U-shaped plate (992) arranged in the same direction as the bottom flat plate (4) and installed on the plurality of support columns (8), and the left open end of the U-shaped plate (992) faces the bottom flat plate (4). Two groups of a plurality of cleaning brushes (993) are oppositely installed inside the U-shaped plate (992). A groove member (994) is horizontally placed at the top of the U-shaped plate (992). A tension member (995) is slidably installed at one end in the groove member (994). An extension panel (996) is connected to the side of the groove member (994) away from the tension member (995). A second electric push rod (997) is installed on the extension panel (996), and the output shaft of the second electric push rod (997) is connected to the tension member (995); The other end of the tension member (995) is integrally connected to the base strip block (94); The plurality of clamping strips (91) are aligned with the gap between the two groups of a plurality of cleaning brushes (993); The substrate strip (94) is higher than the top surface of the U-shaped plate (992).

4. The cleaning device for semiconductor wafers according to claim 3, wherein the lowering mechanism (10) includes a plurality of sinking grooves (101) formed on the surface of the U-shaped plate (992) and perpendicular to the groove member (994), a mounting plate member (102) mounted on the lower end of the U-shaped plate (992), and a cylinder (103) disposed on the mounting plate member (102); the output end of the cylinder (103) is connected to the middle of the groove member (994); the bottom of the groove member (994) is slidably mounted in a plurality of the sinking grooves (101).

5. The cleaning device for semiconductor wafers according to claim 4, wherein the heat drying part (11) includes a hot air blower (12) disposed on the linear moving mechanism (7), two transfer air boxes (13) mounted on the side surface of the U-shaped plate (992), two outer blowing channels (14) respectively communicating with the two transfer air boxes (13), a storage chamber (15) mounted at the air outlet of the hot air blower (12), and two conveying pipes (16) with one end communicating with the storage chamber (15) and the other end respectively communicating with the two transfer air boxes (13); the two outer blowing channels (14) are obliquely arranged and face each other; the movement tracks of a plurality of the clamping strips (91) are located between the two outer blowing channels (14).

6. The cleaning device for semiconductor wafers according to claim 5, wherein the transmission mechanism (3) includes a reference table (31) horizontally mounted on the fixing bracket (2), and a plurality of conveyor belts (32) linearly arranged on the reference table (31); a plurality of the conveyor belts (32) are respectively aligned with the gaps between a plurality of the clamping strips (91) arranged in pairs facing each other; a plurality of the along strips (6) are respectively close to a plurality of the conveyor belts (32).

7. The cleaning device for semiconductor wafers according to claim 6, wherein rubber strips (17) are mounted on the facing sides of a plurality of the clamping strips (91).

8. The cleaning device for semiconductor wafers according to claim 7, wherein a plurality of groups of guiding eaves (18) are mounted on the top of the bottom flat plate (4), and a plurality of groups of the guiding eaves (18) are close to a plurality of the second hanging blocks (93); a plurality of groups of the guiding eaves (18) correspond to a plurality of the conveyor belts (32) one by one.

9. The cleaning device for semiconductor wafers according to claim 8, wherein a receiving dish (19) is detachably mounted on the bottom of the lower surface of the U-shaped plate (992).

Images