Small semiconductor laser and packaging method thereof

Abstract

The invention relates to a small semiconductor laser and a packaging method thereof, and belongs to the technical field of semiconductor lasers. The laser comprises a shell, a PCB, a COS unit and a heat sink base, the heat sink base is an L-shaped base, the PCB and the COS unit are arranged on the upper side of the heat sink base, the PCB is connected with the COS unit, and the shell is arranged on the outer side of the heat sink base. According to the invention, the application requirements of small-space and high-reliability laser illumination detection are met.

Description

Technical Field

[0001] The invention relates to a small semiconductor laser and a packaging method thereof, belonging to the technical field of semiconductor lasers. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, and low cost. They are currently widely used in distance measurement, mechanical processing, medical cosmetology, laser communication, etc. Lasers have the advantages of good directionality, high beam quality, high electro-optical conversion efficiency, and long life, and have natural advantages in certain special lighting scenarios. However, when semiconductor lasers are used in lighting scenarios, they are restricted by the use environment, which puts forward higher requirements for small-volume, high-reliability semiconductor lasers. For this reason, the present invention is proposed. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a small semiconductor laser that meets the application requirements of small space and high reliability laser lighting detection.

[0004] The invention also provides a packaging method for the small semiconductor laser.

[0005] The technical solution of the present invention is as follows:

[0006] A small semiconductor laser comprises a housing, a PCB circuit board, a COS unit and a heat sink base, wherein the heat sink base is an L-shaped base, the PCB circuit board and the COS unit are arranged on the upper side of the heat sink base, the PCB circuit board is connected to the COS unit, and the housing is arranged on the outer side of the heat sink base.

[0007] Preferably, according to the present invention, a gold-plated layer is provided on the surface of the PCB circuit board, which is convenient for wire bonding to electrically connect the COS unit and the PCB circuit board, and is also convenient for welding the PCB circuit board on the heat sink. A protection circuit including capacitors and resistors is integrated on the PCB circuit board to avoid reverse current generated during use to damage the laser chip, thereby improving the reliability of laser use.

[0008] Preferably according to the present invention, penetrating positioning holes are provided on the heat sink base and the PCB circuit board to facilitate packaging.

[0009] Preferably, according to the present invention, a dustproof window piece is provided on the heat sink base corresponding to the light emitting side of the COS unit, and the dustproof window piece is fixed in the heat sink base by welding to ensure that the dustproof window piece is firmly and reliably fixed.

[0010] Preferably, according to the present invention, limiting grooves are respectively provided on both sides of the heat sink base, and a plurality of raised buckles are provided in the limiting grooves. The outer shell is a C-shaped shell, and the outer shell is fixed by the raised buckles after being inserted along the limiting grooves. The outer shell itself is elastic and will not cause interference.

[0011] The packaging method of the above-mentioned small semiconductor laser comprises the following steps:

[0012] (1) Place the COS unit and the PCB circuit board on the heat sink base respectively through solder, and then fix several heat sink bases in the sintering fixture in turn;

[0013] (2) placing the sintering fixture in a sintering furnace for high-temperature sintering;

[0014] (3) After sintering is completed, the heat sink base is removed, the COS unit and the PCB circuit board are connected through leads, and then the housing is installed to complete the packaging.

[0015] Preferably according to the present invention, the sintering fixture includes a sintering base, a sintering pressing plate and a sintering pressing block, wherein the sintering base is a rectangular base, a fixed block is arranged in the middle of the sintering base, a fixing hole is arranged on the fixed block, the sintering pressing block is a rectangular parallelepiped, a spring probe is arranged on one side of the sintering pressing block, a pressing groove is arranged on the top of the sintering pressing block, the sintering pressing plate includes a rectangular plate and a buckling plate, a plurality of buckling plates are arranged on both sides of the rectangular plate, and the positions of the buckling plates correspond to the pressing grooves.

[0016] According to the present invention, further preferably, in step (1), the specific steps of fixing the heat sink base to the sintering fixture are:

[0017] ① Place several heat sink bases on the sintered base respectively, and then insert the positioning column into the positioning hole. The positioning column penetrates the heat sink base and then is inserted into the sintered base to realize the positioning of the heat sink base;

[0018] ② Place a sintered compact on the upper side of the heat sink base. A placement hole for placing a positioning column is provided at the bottom of the sintered compact. The spring probe on one side of the sintered compact presses the COS unit downward under the action of the spring force.

[0019] ③ The sintering pressing plate is placed on the fixing block, and bolts are screwed into the fixing holes to fix the sintering pressing block, the heat sink base and the sintering base as a whole.

[0020] The beneficial effects of the present invention are:

[0021] 1. The semiconductor laser of the present invention is small in size and light in weight, does not use volatile adhesives, and can be applied to a variety of special working environments.

[0022] 2. All parts of the semiconductor laser of the present invention are sintered, welded or mechanically fixed, which is firm and reliable and can adapt to more severe working environments.

[0023] 3. The semiconductor laser of the present invention integrates a protection circuit internally while ensuring a small size, thereby preventing the laser from being damaged by reverse voltage of the circuit during use and increasing the service life of the product.

[0024] 4. The sintering fixture of the present invention can realize the simultaneous packaging of multiple laser devices, thereby improving the packaging efficiency, ensuring product consistency and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The schematic diagram of the semiconductor laser structure of the present invention is

[0026] Figure 2 It is a schematic diagram of the internal structure of the semiconductor laser of the present invention;

[0027] Figure 3 A schematic top view of a semiconductor laser of the present invention;

[0028] Figure 4 It is a schematic diagram of the sintered base structure of the present invention;

[0029] Figure 5 It is a schematic diagram of the sintering fixture structure of the present invention;

[0030] Wherein: 1. heat sink base, 2. shell, 3. dustproof window, 4. PCB circuit board, 5. COS unit, 6. capacitor, 7. resistor, 8. positioning hole, 9. raised buckle, 10. sintering base, 11. sintering block, 12. sintering plate, 13. spring probe, 14. fixing block, 15. fixing hole, 16. rectangular plate, 17. buckle plate, 18. gold-plated layer, 19. positioning column. DETAILED DESCRIPTION

[0031] The present invention will be further described below by way of embodiments in conjunction with the accompanying drawings, but is not limited thereto.

[0032] Embodiment 1:

[0033] like Figure 1-3 As shown, this embodiment provides a small semiconductor laser, including a housing 2, a PCB circuit board 4, a COS unit 5 and a heat sink base 1, wherein the heat sink base 1 is an L-shaped base, the PCB circuit board 4 and the COS unit 5 are arranged on the upper side of the heat sink base 1, the PCB circuit board 4 is connected to the COS unit 5, and the housing 5 is arranged on the outer side of the heat sink base 1.

[0034] The surface of the PCB circuit board 4 is provided with a gold-plated layer 18, which is convenient for wire bonding to electrically connect the COS unit and the PCB circuit board, and is also convenient for soldering the PCB circuit board to the heat sink. A protection circuit including a capacitor 6 and a resistor 7 is integrated on the PCB circuit board to prevent the reverse current generated during use from damaging the laser chip and improve the reliability of the laser.

[0035] The heat sink base 1 and the PCB circuit board 4 are provided with penetrating positioning holes 8 for easy packaging.

[0036] A dustproof window piece 3 is arranged on the heat sink base 1 at a position corresponding to the light-emitting side of the COS unit 5 . The dustproof window piece 3 is fixed in the heat sink base by welding to ensure that the dustproof window piece is firmly and reliably fixed.

[0037] Limiting grooves are arranged on both sides of the heat sink base 1, and a plurality of protruding buckles 9 are arranged in the limiting grooves. The shell 2 is a C-shaped shell, and the shell is fixed by the protruding buckles after being inserted along the limiting grooves. The shell itself is elastic and will not cause interference.

[0038] The packaging method of the above-mentioned small semiconductor laser comprises the following steps:

[0039] (1) placing the COS unit 5 and the PCB circuit board 4 on the heat sink base 1 respectively by soldering, and then fixing several heat sink bases 1 in the sintering fixture in sequence;

[0040] (2) placing the sintering fixture in a sintering furnace for high-temperature sintering;

[0041] (3) After sintering is completed, the heat sink base is removed, the COS unit 5 and the PCB circuit board 4 are connected through leads, and then the housing is installed to complete the packaging.

[0042] Embodiment 2:

[0043] A packaging method for a small semiconductor laser as described in Example 1, except that the sintering fixture includes a sintering base 10, a sintering pressing plate 12 and a sintering pressing block 11, wherein the sintering base 10 is a rectangular base, a fixing block 14 is arranged in the middle of the sintering base 10, a fixing hole 15 is arranged on the fixing block 14, the sintering pressing block 11 is a rectangular parallelepiped, a spring probe 13 is arranged on one side of the sintering pressing block 11, a pressing groove is arranged on the top of the sintering pressing block 11, and the sintering pressing plate 12 includes a rectangular plate 16 and a buckling plate 17, a plurality of buckling plates 17 are arranged on both sides of the rectangular plate 16, and the position of the buckling plates 17 corresponds to the pressing groove.

[0044] The specific steps for fixing the heat sink base to the sintering fixture are:

[0045] ① Place several heat sink bases 1 on the sintered base 10 respectively, and then insert the positioning column 19 into the positioning hole 8. The positioning column 19 penetrates the heat sink base and is inserted into the sintered base 10. The sintered base 10 is provided with a through hole for the positioning column to realize the positioning of the heat sink base 1;

[0046] ② A sintered compact 11 is placed on the upper side of the heat sink base 1. A placement hole for placing a positioning column 19 is provided at the bottom of the sintered compact 11. A spring probe 13 on one side of the sintered compact 11 presses down the COS unit 5 under the action of the spring force.

[0047] ③ The sintering pressing plate 12 is placed on the fixing block 14 , and bolts are screwed into the fixing holes 15 to fix the sintering pressing block 11 , the heat sink base 1 and the sintering base 10 as a whole.

[0048] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A small semiconductor laser, characterized in that: It includes a shell, a PCB circuit board, a COS unit and a heat sink base, wherein the heat sink base is an L-shaped base, the PCB circuit board and the COS unit are arranged on the upper side of the heat sink base, the PCB circuit board is connected to the COS unit, and the shell is arranged on the outer side of the heat sink base.

2. The small semiconductor laser according to claim 1, characterized in that A gold-plated layer is provided on the surface of the PCB circuit board.

3. The small semiconductor laser according to claim 2, characterized in that: The heat sink base and the PCB circuit board are provided with penetrating positioning holes.

4. The small semiconductor laser according to claim 1, characterized in that A dustproof window piece is arranged on the heat sink base corresponding to the light emitting side of the COS unit.

5. The small semiconductor laser according to claim 1, characterized in that: Limiting grooves are respectively arranged on both sides of the heat sink base, a plurality of protruding buckles are arranged in the limiting grooves, and the outer shell is a C-shaped shell.

6. The packaging method of a small semiconductor laser according to claim 3, characterized in that: Here are the steps: (1) Place the COS unit and the PCB circuit board on the heat sink base respectively through solder, and then fix several heat sink bases in the sintering fixture in turn; (2) placing the sintering fixture in a sintering furnace for high-temperature sintering; (3) After sintering is completed, the heat sink base is removed, the COS unit and the PCB circuit board are connected through leads, and then the housing is installed to complete the packaging.

7. The packaging method of a small semiconductor laser according to claim 6, characterized in that: The sintering fixture includes a sintering base, a sintering pressing plate and a sintering pressing block, wherein the sintering base is a rectangular base, a fixing block is arranged in the middle of the sintering base, a fixing hole is arranged on the fixing block, the sintering pressing block is a rectangular parallelepiped, a spring probe is arranged on one side of the sintering pressing block, a pressing groove is arranged on the top of the sintering pressing block, the sintering pressing plate includes a rectangular plate and a buckling plate, a plurality of buckling plates are arranged on both sides of the rectangular plate, and the positions of the buckling plates correspond to the pressing grooves.

8. The packaging method of a small semiconductor laser according to claim 7, characterized in that: In step (1), the specific steps of fixing the heat sink base to the sintering fixture are: ① Place several heat sink bases on the sintered base respectively, and then insert the positioning column into the positioning hole. The positioning column penetrates the heat sink base and then is inserted into the sintered base to realize the positioning of the heat sink base; ② Place a sintered compact on the upper side of the heat sink base. A placement hole for placing a positioning column is provided at the bottom of the sintered compact. The spring probe on one side of the sintered compact presses the COS unit downward under the action of the spring force. ③ The sintering pressing plate is placed on the fixing block, and bolts are screwed into the fixing holes to fix the sintering pressing block, the heat sink base and the sintering base as a whole.

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