Solder paste smearing device facilitating clamping during machining of multi-form circuit board

Abstract

The invention discloses a solder paste smearing device convenient for machining and clamping a multi-form circuit board, and belongs to the technical field of circuit board machining, the solder paste smearing device comprises an equipment box, the upper surface of the equipment box is in bolted connection with a working frame, and the upper surface of the working frame is fixedly connected with a motor; transverse electric sliding rails are fixedly connected to the inner walls of the left side and the right side of the working frame; and the material box is fixedly connected to the back surface of the equipment box. When the solder paste smearing device convenient for machining and clamping of the multi-form circuit board works, a workpiece is placed on a working frame, a motor is started at the moment, the motor drives a long pin to rotate, then a long plate drives a push plate to synchronously descend under the action of the long pin and a stand column, and when the push plate descends, a cross rod and a movable plate can be pushed, so that the workpiece is clamped; the movable plate drives the pressing rods to move towards the middle of the working frame, the pressing rods are distributed on the side face of the movable plate at equal intervals, and therefore the pressing rods can abut against all positions of the workpiece under the action of the movable plate and the reset spring, and the workpiece can be stabilized conveniently.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a solder paste coating device which is convenient for processing and clamping multi-form circuit boards. Background Art

[0002] Circuit boards can transmit signals, control and implement various logic functions, manage power, and protect circuits and components. They have the advantages of high density and high flexibility. During the processing of circuit boards, solder paste coating devices are required to facilitate the subsequent soldering of circuit boards.

[0003] For example, a solder paste applying device with publication number CN215145497U, which is published on December 14, 2021, comprises a fixed seat, a material receiving cylinder, an air supply regulator and a foot switch, the foot switch is electrically connected to the air supply regulator, the air supply regulator is connected to one end of the fixed seat through an air supply hose, the other end of the fixed seat is detachably connected to one end of the material receiving cylinder, and the other end of the material receiving cylinder is provided with a discharging mechanism for realizing solder paste discharging, the material receiving cylinder is used to load the solder paste to be applied, the inner cavity of the fixed seat is connected to the inner cavity of the material receiving cylinder, and the air supply regulator is connected to an external air supply device; in the solder paste applying device disclosed in the utility model, the air delivered by the external air supply device is delivered to the inner cavity of the material receiving cylinder through the air supply regulator, and the air supply amount is adjusted by the air supply regulator, so that the pressure of the air in the material receiving cylinder on the solder paste can be adjusted, so as to realize the controllable adjustment of the solder paste output amount, avoid the situation of excessive or insufficient solder paste output amount, and improve the solder paste application effect;

[0004] Another example is a solder paste coating device for circuit boards with publication number CN210225929U, which is published on 2020-03-31. It includes a frame, on which a solder paste coating device mechanism is arranged; a bottom plate is arranged below the solder paste coating device mechanism, and conveyor belts are arranged on both sides of the bottom plate; a loading trough is arranged at one end of the conveyor belt, and connecting frames are arranged on both sides of the loading trough; a horizontally arranged No. 1 telescopic cylinder is fixedly connected to a side surface of each connecting frame away from the loading trough, and the No. 1 telescopic cylinder is fixedly connected to the frame; a loading conveyor belt is arranged on a side surface of the connecting frame away from the No. 1 telescopic cylinder; a suction plate is arranged above the loading trough, and a suction pipe is connected above the suction plate; a vertically arranged No. 2 telescopic cylinder is connected above the suction plate, and the No. 2 telescopic cylinder is fixedly connected to the frame. The utility model can not only reduce labor intensity, but also has the advantage of higher safety;

[0005] Another example is a PCB pad solder paste smearing device with publication number CN220139839U, which is published on 2023-12-05, including a base, a carrier plate is arranged above the base, and the carrier plate is used to place the PCB pad; the carrier plate is connected to the base through multiple sets of connecting rods, and a fixing rod is fixedly arranged on the carrier plate, and a smearing pressure plate is movably installed on the fixing rod; a plurality of smearing holes are arranged on the smearing pressure plate, and the smearing holes correspond to the patch positions of the PCB pads; a connecting bracket is fixedly installed on the base, and a smearing brush is installed on the connecting bracket, and the smearing brush is used to apply solder paste to the PCB pads; the cooperation of the positioning rod and the positioning hole of the utility model plays a role in positioning the smearing pressure plate, so as to ensure that the smearing hole and the PCB patch position are accurately aligned, and the smearing accuracy of the solder paste is improved, and the smearing pressure plate is provided with smearing holes for applying solder paste, and the smearing holes correspond to the patch positions of the PCB pads, and the smearing holes can ensure the accuracy of the PCB solder paste smearing device;

[0006] During use, the solder paste coating device will face circuit boards of different sizes and shapes. During use, the device in the above application is not convenient for quickly clamping circuit boards of different sizes and shapes, which leads to a small working range of the solder paste coating device and great limitations during operation. The solder paste is composed of solder powder, flux and other surfactants. When the solder paste is left stationary for a long time, it will sink due to its own gravity, and then precipitation and stratification will occur. The device in the above application does not have the function of stirring the solder paste during operation, which will affect the subsequent use of the solder paste and the welding quality, and bring unnecessary trouble to the subsequent welding work.

[0007] In view of the above problems, it is urgent to carry out innovative design based on the original solder paste coating device. Summary of the invention

[0008] The purpose of the present invention is to provide a solder paste coating device that is convenient for processing and clamping multi-form circuit boards, so as to solve the problem proposed in the above background technology that it is inconvenient to quickly clamp circuit boards of different sizes and shapes during use, which leads to a small working range of the solder paste coating device, large limitations during operation, and a lack of the function of stirring the solder paste during operation, which in turn affects the subsequent use of the solder paste, affects the welding quality, and brings unnecessary troubles to the subsequent welding work.

[0009] To achieve the above-mentioned object, the present invention provides the following technical solution: a solder paste coating device that is convenient for processing and clamping a multi-form circuit board, comprising an equipment box, a working frame is bolted to the upper surface of the equipment box, a motor is fixedly connected to the upper surface of the working frame, and transverse electric slide rails are fixedly connected to the inner walls on the left and right sides of the working frame;

[0010] A solder paste coating device that is convenient for processing and clamping multi-form circuit boards, further comprising:

[0011] A moving plate, wherein the moving plate is slidably arranged inside the horizontal electric slide rail, and the lower surface of the moving plate is fixedly connected with the vertical electric slide rail, and a coating rod is slidably arranged inside the vertical electric slide rail, and a fixed tube is fixedly connected to the back of the coating rod;

[0012] A cross bar, wherein the cross bar is slidably arranged inside the working frame, and a movable plate is fixedly connected to the end of the cross bar, and a pressure rod is slidably arranged inside the movable plate;

[0013] A pump, the pump is fixedly connected to the bottom upper surface of the working frame, the input end of the pump is fixedly connected to a feed pipe, the output end of the pump is fixedly connected to a discharge pipe, and the outer wall of the working frame is rotatably connected to a transition shaft;

[0014] The material box is fixedly connected to the back of the equipment box, and a rotating shaft is rotatably arranged inside the material box, and a stirring blade is fixedly connected to the surface of the rotating shaft.

[0015] Preferably, the output end of the motor is fixedly connected with a long pin, and the surface of the long pin is threadedly connected with a long plate, and the upper surface of the working frame is fixedly connected with a column, and the column runs through the interior of the long plate.

[0016] Preferably, a push plate is fixedly connected to the surface of the long plate, and the push plates are symmetrically distributed about the center of the long plate, and the lower surface of the push plate is inclined.

[0017] Preferably, the cross bar passes through the interior of the working frame, and a ball is rotatably arranged inside the cross bar, and the surface of the ball fits with the surface of the push plate.

[0018] Preferably, the pressure rods are distributed at equal intervals inside the movable plate, and a return spring having an elastic return function is fixedly connected to the surface of the pressure rods, and the other side of the return spring is fixedly connected to the inner wall of the movable plate.

[0019] Preferably, a connecting plate is fixedly connected to the surface of the crossbar, and a connecting spring having an elastic reset function is fixedly connected to the surface of the connecting plate, and the other side of the connecting spring is fixedly connected to the outer wall of the equipment box.

[0020] Preferably, a traction rope is fixedly connected to the surface of the push plate, and the traction rope passes around the surface of the transition shaft, and the other side of the traction rope is wound and fixedly connected to the surface of the rotating shaft.

[0021] Preferably, connecting pieces are fixedly connected to both left and right sides of the material box, the stirring blades are evenly spaced on the surface of the rotating shaft, and the rotating shaft passes through the interior of the material box and the connecting pieces.

[0022] Preferably, a torsion spring having an elastic reset function is fixedly connected to the surface of the rotating shaft, and the other side of the torsion spring is fixedly connected to the inner wall of the connecting piece.

[0023] Preferably, a baffle is fixedly connected to the end of the rotating shaft, and the baffle is symmetrically distributed about the center of the rotating shaft.

[0024] Compared with the prior art, the invention has the following beneficial effects: the solder paste coating device that is convenient for processing and clamping multi-form circuit boards adopts a new structural design, so that the device can clamp multi-form circuit boards, and at the same time, the solder paste can be stirred during operation so that the solder paste will not be delaminated, which is convenient for subsequent processing of circuit boards. The specific contents are as follows:

[0025] (1) The solder paste coating device that is convenient for clamping multi-form circuit boards during processing, when working, places the workpiece on the working frame, then starts the motor, the motor drives the long pin to rotate, and then the long plate drives the push plate to descend synchronously under the action of the long pin and the column, when the push plate descends, it pushes the cross bar and the movable plate, so that the movable plate drives the pressure rod to move to the middle position of the working frame, and the pressure rods are evenly spaced on the side of the movable plate, so that the pressure rods can support various positions of the workpiece under the action of the movable plate and the return spring, so as to facilitate the stability of the workpiece;

[0026] Furthermore, when the crossbar is pushed, the connecting plate will be driven to squeeze the connecting spring, and when the motor rotates, the motor drives the long plate and the push plate to move upward, at which time the crossbar loses the pressure of the push plate, and then the crossbar, the movable plate and the pressure rod will move back under the action of the connecting plate and the connecting spring, and at this time the pressure rod will also move back under the action of the return spring, so as to facilitate the next use;

[0027] Furthermore, during operation, the balls on the surface of the crossbar reduce the friction between the crossbar and the push plate, making it easier for the push plate to push the crossbar;

[0028] (2) The solder paste smearing device is convenient for clamping the processing of multi-form circuit boards. When the push plate descends, the push plate will drive the rotating shaft to rotate through the traction rope. When the rotating shaft rotates, it will drive the stirring blade to rotate synchronously. When the stirring blade rotates, it can stir the solder paste inside the material box, which is convenient for the subsequent use of the solder paste;

[0029] Furthermore, during use, the discharge pipe and the fixed pipe are connected through an external hose. When working, the pump is started, and the pump feeds the coating rod through the feed pipe and the discharge pipe. At the same time, the coating rod is driven to work through the horizontal electric slide rail and the vertical electric slide rail, which is convenient for solder paste coating;

[0030] Furthermore, during the rotation of the shaft, the shaft will stretch the torsion spring inside the connecting plate, and when the push plate rises, the shaft loses the tension of the traction rope. At this time, the shaft will rotate under the action of the torsion spring. When the shaft rotates, the traction rope will be reeled in to facilitate the next use of the shaft. At the same time, the baffles at both ends of the shaft make the traction rope work stably, and the transition shaft maximizes the tension of the traction rope. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the connection structure between the equipment box and the working frame of the present invention;

[0032] Figure 2 This is a schematic diagram of the connection structure between the equipment box and the material box of the present invention;

[0033] Figure 3 This is a schematic diagram of the connection structure between the long board and the push board of the present invention;

[0034] Figure 4 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0035] Figure 5 It is a schematic diagram of a partial cutaway structure of the working frame of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of the movable plate in working state of the present invention;

[0037] Figure 7 This is a schematic diagram of the connection structure between the pressure rod and the return spring of the present invention;

[0038] Figure 8 This is a schematic diagram of the connection structure between the transverse electric slide rail and the moving plate of the present invention;

[0039] Fig. 9 This is a schematic diagram of the connection structure between the rotating shaft and the connecting piece of the present invention;

[0040] Fig.10 It is a schematic diagram of the connection structure of the rotating shaft and the torsion spring of the present invention.

[0041] In the figure: 1. Equipment box; 2. Working frame; 3. Motor; 4. Column; 5. Long board; 6. Long pin; 7. Push plate; 8. Movable board; 9. Pressure rod; 10. Horizontal electric slide rail; 11. Moving plate; 12. Vertical electric slide rail; 13. Application rod; 14. Cross bar; 15. Ball; 16. Connecting plate; 17. Connecting spring; 18. Reset spring; 19. Transition shaft; 20. Traction rope; 21. Pump; 22. Feed pipe; 23. Discharge pipe; 24. Material box; 25. Rotating shaft; 26. Connecting piece; 27. Fixed pipe; 28. Stirring blade; 29. ​​Baffle; 30. Torsion spring. DETAILED DESCRIPTION

[0042] See also Figure 1-Figure 10 The present invention provides the following technical solution: a solder paste coating device that is convenient for processing and clamping multi-form circuit boards:

[0043] Embodiment 1: By providing the pressure rod 9 and the return spring 18, the circuit board of different sex can be clamped, such as Figure 1-Figure 7 As shown:

[0044] It comprises an equipment box 1, the upper surface of which is bolted to a working frame 2, the upper surface of which is fixedly connected to a motor 3, and the inner walls on the left and right sides of the working frame 2 are fixedly connected to transverse electric slide rails 10;

[0045] A solder paste coating device that is convenient for processing and clamping multi-form circuit boards, further comprising:

[0046] A moving plate 11, the moving plate 11 is slidably arranged inside the horizontal electric slide rail 10, and the lower surface of the moving plate 11 is fixedly connected with the vertical electric slide rail 12, and the inside of the vertical electric slide rail 12 is slidably arranged with a smear rod 13, and the back of the smear rod 13 is fixedly connected with a fixed tube 27;

[0047] A cross bar 14, the cross bar 14 is slidably arranged inside the working frame 2, and the end of the cross bar 14 is fixedly connected to a movable plate 8, and a pressure rod 9 is slidably arranged inside the movable plate 8, a pump 21, the pump 21 is fixedly connected to the bottom upper surface of the working frame 2, and the input end of the pump 21 is fixedly connected to a feed pipe 22, and the output end of the pump 21 is fixedly connected to a discharge pipe 23, and a transition shaft 19 is rotatably connected to the outer wall of the working frame 2;

[0048] The material box 24 is fixedly connected to the back of the equipment box 1, and a rotating shaft 25 is rotatably arranged inside the material box 24, and a stirring blade 28 is fixedly connected to the surface of the rotating shaft 25, a long pin 6 is fixedly connected to the output end of the motor 3, and a long plate 5 is threadedly connected to the surface of the long pin 6, and a column 4 is fixedly connected to the upper surface of the working frame 2, and the column 4 runs through the interior of the long plate 5.

[0049] The surface of the long board 5 is fixedly connected with a push plate 7, and the push plate 7 is symmetrically distributed about the center of the long board 5, and the lower surface of the push plate 7 is inclined, the cross bar 14 runs through the interior of the working frame 2, and the inside of the cross bar 14 is rotatably provided with a ball 15, and the surface of the ball 15 is in contact with the surface of the push plate 7.

[0050] The pressure rods 9 are evenly spaced inside the movable plate 8 , and a return spring 18 having an elastic return function is fixedly connected to the surface of the pressure rods 9 , and the other side of the return spring 18 is fixedly connected to the inner wall of the movable plate 8 .

[0051] During operation, the workpiece is placed on the working frame 2, and the motor 3 is started at this time. The motor 3 drives the long pin 6 to rotate, and then the long plate 5 drives the push plate 7 to descend synchronously under the action of the long pin 6 and the column 4. When the push plate 7 descends, it will push the cross bar 14 and the movable plate 8, so that the movable plate 8 drives the pressure rod 9 to move to the middle position of the working frame 2, and the pressure rods 9 are evenly spaced on the side of the movable plate 8, so the pressure rod 9 will contact the protrusion of the workpiece. When the movable plate 8 continues to move to the middle position of the working frame 2, the pressure rods 9 at other positions will contact the concave part of the workpiece. Therefore, the pressure rod 9 will support various positions of the workpiece under the action of the movable plate 8 and the return spring 18, so as to facilitate the stability of the workpiece. In the working process, the ball 15 on the surface of the cross bar 14 reduces the friction between the cross bar 14 and the push plate 7, so that the push plate 7 can push the cross bar 14.

[0052] Embodiment 2: Different from Embodiment 1, the cross bar 14 can be returned to its original position by means of the connecting plate 16 and the connecting spring 17, so as to facilitate the subsequent use. Figure 5 and Figure 6 As shown:

[0053] A connecting plate 16 is fixedly connected to the surface of the cross bar 14 , and a connecting spring 17 having an elastic reset function is fixedly connected to the surface of the connecting plate 16 , and the other side of the connecting spring 17 is fixedly connected to the outer wall of the equipment box 1 .

[0054] When the cross bar 14 is pushed, it will drive the connecting plate 16 to squeeze the connecting spring 17. When the motor 3 rotates, the motor 3 drives the long board 5 and the push plate 7 to move upward. At this time, the cross bar 14 loses the pressure of the push plate 7, and then the cross bar 14, the movable plate 8 and the pressure rod 9 will move back under the action of the connecting plate 16 and the connecting spring 17. At this time, the pressure rod 9 also moves back under the action of the reset spring 18, which is convenient for the next use.

[0055] Embodiment 3: Different from Embodiment 2, the stirring blade 28 is provided to mix and stir the materials in the material box 24, so as to facilitate the use of solder paste. Figure 8-Figure 10 As shown:

[0056] A traction rope 20 is fixedly connected to the surface of the push plate 7, and the traction rope 20 is passed around the surface of the transition shaft 19, and the other side of the traction rope 20 is wrapped and fixedly connected to the surface of the rotating shaft 25. The left and right sides of the material box 24 are fixedly connected with connecting pieces 26, and the stirring blades 28 are evenly spaced on the surface of the rotating shaft 25, and the rotating shaft 25 passes through the interior of the material box 24 and the connecting piece 26.

[0057] A torsion spring 30 that plays an elastic reset role is fixedly connected to the surface of the rotating shaft 25, and the other side of the torsion spring 30 is fixedly connected to the inner wall of the connecting piece 26. A baffle 29 is fixedly connected to the end of the rotating shaft 25, and the baffle 29 is symmetrically distributed about the center of the rotating shaft 25.

[0058] When the push plate 7 descends, the push plate 7 will drive the rotating shaft 25 to rotate inside the material box 24 through the traction rope 20. When the rotating shaft 25 rotates, it will drive the stirring blade 28 to rotate synchronously. When the stirring blade 28 rotates, it can stir the solder paste inside the material box 24 to make the solder paste mixed more fully, which is convenient for the subsequent use of the solder paste. During use, the discharge pipe 23 and the fixed pipe 27 are connected through an external hose. When working, the pump 21 is started, and the pump 21 supplies material to the smear rod 13 through the feed pipe 22 and the discharge pipe 23. At the same time, the movable plate 11 is driven to move through the horizontal electric slide rail 10. The rotating shaft 25 is moved, and the smearing rod 13 is driven to work through the vertical electric slide rail 12, which is convenient for the solder paste smearing work. During the rotation of the rotating shaft 25, the rotating shaft 25 will stretch the torsion spring 30 inside the connecting piece 26. When the push plate 7 rises, the rotating shaft 25 loses the pulling force of the traction rope 20. At this time, the rotating shaft 25 will rotate under the action of the torsion spring 30. When the rotating shaft 25 rotates, the traction rope 20 will be reeled up to facilitate the next use of the rotating shaft 25. At the same time, the baffles 29 at both ends of the rotating shaft 25 make the traction rope 20 work stably, and the transition shaft 19 maximizes the pulling force of the traction rope 20.

Claims

1. A solder paste smearing device that is convenient for processing and clamping a multi-form circuit board, comprising an equipment box (1), a working frame (2) being bolted to the upper surface of the equipment box (1), a motor (3) being fixedly connected to the upper surface of the working frame (2), and transverse electric slide rails (10) being fixedly connected to the inner walls on the left and right sides of the working frame (2); It is characterized in that Also includes: A movable plate (11), wherein the movable plate (11) is slidably arranged inside the transverse electric slide rail (10), and a vertical electric slide rail (12) is fixedly connected to the lower surface of the movable plate (11), and an application rod (13) is slidably arranged inside the vertical electric slide rail (12), and a fixed tube (27) is fixedly connected to the back of the application rod (13); A cross bar (14), wherein the cross bar (14) is slidably arranged inside the working frame (2), and the end of the cross bar (14) is fixedly connected to a movable plate (8), and a pressure bar (9) is slidably arranged inside the movable plate (8); A pump (21), the pump (21) being fixedly connected to the bottom upper surface of the working frame (2), the input end of the pump (21) being fixedly connected to a feed pipe (22), the output end of the pump (21) being fixedly connected to a discharge pipe (23), and a transition shaft (19) being rotatably connected to the outer wall of the working frame (2); A material box (24) is fixedly connected to the back of the equipment box (1), and a rotating shaft (25) is rotatably arranged inside the material box (24), and a stirring blade (28) is fixedly connected to the surface of the rotating shaft (25).

2. According to claim 1, a solder paste coating device that is convenient for processing and clamping multi-form circuit boards is characterized in that: The output end of the motor (3) is fixedly connected to a long pin (6), and the surface of the long pin (6) is threadedly connected to a long plate (5); the upper surface of the working frame (2) is fixedly connected to a column (4), and the column (4) passes through the interior of the long plate (5).

3. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 2 is characterized in that: A push plate (7) is fixedly connected to the surface of the long plate (5), and the push plate (7) is symmetrically distributed about the center of the long plate (5), and the lower surface of the push plate (7) is inclined.

4. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 3 is characterized in that: The cross bar (14) passes through the interior of the working frame (2), and a ball (15) is rotatably arranged inside the cross bar (14), and the surface of the ball (15) is in contact with the surface of the push plate (7).

5. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 1 is characterized in that: The pressure rods (9) are evenly spaced inside the movable plate (8), and a return spring (18) having an elastic return function is fixedly connected to the surface of the pressure rods (9), and the other side of the return spring (18) is fixedly connected to the inner wall of the movable plate (8).

6. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 1 is characterized in that: A connecting plate (16) is fixedly connected to the surface of the cross bar (14), and a connecting spring (17) having an elastic reset function is fixedly connected to the surface of the connecting plate (16), and the other side of the connecting spring (17) is fixedly connected to the outer wall of the equipment box (1).

7. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 3 is characterized in that: A traction rope (20) is fixedly connected to the surface of the push plate (7), and the traction rope (20) passes around the surface of the transition shaft (19), and the other side of the traction rope (20) is wound and fixedly connected to the surface of the rotating shaft (25).

8. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 1 is characterized in that: The left and right sides of the material box (24) are fixedly connected with connecting pieces (26), the stirring blades (28) are evenly spaced on the surface of the rotating shaft (25), and the rotating shaft (25) passes through the interior of the material box (24) and the connecting pieces (26).

9. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 8, characterized in that: A torsion spring (30) having an elastic reset function is fixedly connected to the surface of the rotating shaft (25), and the other side of the torsion spring (30) is fixedly connected to the inner wall of the connecting piece (26).

10. The solder paste coating device for facilitating the processing and clamping of multi-form circuit boards according to claim 1, characterized in that: A baffle (29) is fixedly connected to the end of the rotating shaft (25), and the baffles (29) are symmetrically distributed about the center of the rotating shaft (25).

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