All-wireless high-throughput flexibly-extensible electroencephalogram signal acquisition module and preparation method and system of all-wireless high-throughput flexibly-extensible electroencephalogram signal acquisition module

Abstract

The invention relates to an all-wireless high-flux electroencephalogram signal acquisition module capable of being flexibly expanded, which is characterized in that the electroencephalogram signal acquisition module sequentially comprises a plurality of low-flux electroencephalogram acquisition front-end chips, a rewiring layer and a multi-channel electroencephalogram electrode from top to bottom, wherein the front surface of the rewiring layer is connected with each low-flux electroencephalogram acquisition front-end chip; a plurality of electroencephalogram acquisition channel arrangement sites are arranged on the back surface of the rewiring layer; each electroencephalogram acquisition channel arrangement site is connected with the site on the front side of the multi-channel electroencephalogram electrode in a one-to-one correspondence manner. The invention further provides a preparation method of the electroencephalogram signal acquisition module and an electroencephalogram signal acquisition system, activities of thousands of neurons can be recorded and analyzed at the same time, and powerful support is provided for neuroscience research.

Description

Technical Field

[0001] The present invention relates to the technical field of electroencephalogram (EEG) signal acquisition, and in particular to a fully wireless, high-throughput and flexibly expandable electroencephalogram (EEG) signal acquisition module and a preparation method and system thereof. Background Art

[0002] With the continuous deepening of EEG signal research, sometimes it is necessary to record and analyze the activities of thousands of neurons at the same time, or to synchronously observe and compare the EEG activities of multiple experimental subjects. In the existing signal acquisition devices on the market, due to the limitations of the EEG signal acquisition and recording analog front-end chip, a single head device (headstage) usually only supports 32 or 64 channels, so the entire system can be expanded to 1024 channels at most, and it is usually a wired system, which brings many inconveniences to the research in the direction of neuroscience, especially to the observation and exploration of research subjects in a free state. In addition, the integration of these devices is low, the expansion process is cumbersome, and when it is necessary to add photoelectric stimulation or signal processing functions, it is often difficult to achieve easily, and the signal synchronization between multiple channels is poor. Therefore, it is an urgent problem to design an EEG signal acquisition module, preparation method and system that overcome the above defects.

[0003] It should be understood that the above statements merely provide background technology related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0004] The purpose of the present invention is to provide a fully wireless, high-throughput, flexibly expandable EEG signal acquisition module and preparation method and system, which can simultaneously record and analyze the activities of thousands of neurons, providing strong support for neuroscience research.

[0005] In order to achieve the above-mentioned objectives, the present invention provides a fully wireless, high-throughput, and flexibly expandable EEG signal acquisition module, which includes, from top to bottom, a plurality of low-throughput EEG acquisition front-end chips, a rewiring layer, and multi-channel EEG electrodes arranged in a matrix; wherein the front side of the rewiring layer is connected to each of the low-throughput EEG acquisition front-end chips; the back side of the rewiring layer is provided with a plurality of EEG acquisition channel arrangement sites; each of the EEG acquisition channel arrangement sites is respectively connected to a site on the front side of the multi-channel EEG electrode in a one-to-one correspondence.

[0006] Preferably, the number of the low-throughput EEG acquisition front-end chips is N×M, where N and M are both natural numbers; the number of EEG acquisition channel arrangement sites on the back of the redistribution layer is: the number of channels of a single low-throughput EEG acquisition front-end chip×M×N.

[0007] Preferably, a plurality of extension electrodes are arranged on the back of the multi-channel EEG electrode, and each of the extension electrodes is connected to a site on the front of the multi-channel EEG electrode in a one-to-one correspondence; and a microelectrode sensor is arranged on each of the extension electrodes.

[0008] The present invention also provides a method for preparing an EEG signal acquisition module, which is used to prepare the EEG signal acquisition module, comprising the following steps: S1, fixing the low-throughput EEG acquisition front-end chips arranged in a matrix on the release film layer, and encapsulating them by a compression film pressing process to form a chip grain array; S2, grinding the bottom of the release film layer by a grinding process until the bottom surfaces of all low-throughput EEG acquisition front-end chips are exposed; S3, evenly coating a polymer film on the bottom of the ground release film layer by a spin coating method, and covering the bottoms of all low-throughput EEG acquisition front-end chips to form a thin film dielectric. layer; S4, the thin film dielectric layer is subjected to photolithography patterning to form connection lines to realize electrical interconnection between each of the low-throughput EEG acquisition front-end chips; S5, the front side of the rewiring layer is connected to each of the low-throughput EEG acquisition front-end chips; S6, the multiple EEG acquisition channel arrangement sites on the back side of the rewiring layer are respectively connected one-to-one with the sites on the front side of the multi-channel EEG electrode; S7, the multiple extension electrodes are respectively connected one-to-one with the sites on the back side of the multi-channel EEG electrode, and a microelectrode sensor is arranged at the end of each of the extension electrodes to complete the preparation of the EEG signal acquisition module.

[0009] Preferably, in S6, there are two connection methods between the multiple EEG acquisition channel arrangement sites on the back side of the redistribution layer and the sites on the front side of the multi-channel EEG electrode, namely, under bump metallization or solder ball implantation after under bump metallization.

[0010] Preferably, when under-bump metallization is performed on each EEG collection channel arrangement site on the back side of the redistribution layer, the multi-channel EEG electrode is pre-placed in an organic substrate prepreg, the surface of the multi-channel EEG electrode forms an organic substrate, and additional drilling and metallization treatments are required to lead the sites of the multi-channel EEG electrode to the surface of the organic substrate.

[0011] Preferably, when solder balls are implanted after the under-bump metallization of each EEG acquisition channel arrangement site on the back side of the rewiring layer, each EEG acquisition channel arrangement site on the back side of the rewiring layer is matched one-to-one with the site on the front side of the multi-channel EEG electrode, and solder balls are implanted between each EEG acquisition channel arrangement site and the site on the front side of the multi-channel EEG electrode through a reflow soldering process to achieve a welding connection between each EEG acquisition channel arrangement site and the multi-channel EEG electrode.

[0012] Preferably, after the method of implanting solder balls after under-bump metallization is adopted, a sealing material is required to protect the multi-channel electrode; and the sealing material fills the gap between the redistribution layer and the multi-channel EEG electrode except the solder balls.

[0013] The present invention also provides an EEG signal acquisition system, comprising: the EEG signal acquisition module; a host computer connected to the EEG signal acquisition module to acquire EEG signals; and a camera module connected to the host computer to photograph an experimental target so as to synchronously display the behavior of the experimental target on the host computer in real time.

[0014] Preferably, the host computer includes an EEG signal wireless receiving module and a display control module; the EEG signal wireless receiving module is communicatively connected to each of the low-throughput EEG acquisition front-end chips of the EEG signal acquisition module to receive and process the EEG signals transmitted from each of the low-throughput EEG acquisition front-end chips; the display control module receives the EEG signals processed by the EEG signal wireless receiving module and performs display output.

[0015] In summary, compared with the prior art, the present invention provides a fully wireless, high-throughput, flexibly expandable EEG signal acquisition module and a preparation method and system, which significantly improves the integration, scalability and practicality of EEG signal acquisition through high-density integration, precise arrangement, firm connection, multi-functional integration, wireless transmission and synchronous observation technologies. It can simultaneously record and analyze the activities of thousands of neurons, providing strong support for neuroscience research, especially the observation and exploration of research subjects in a free state. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of an EEG signal acquisition module in one embodiment of the present invention;

[0017] Figure 2 It is a front view schematic diagram of an EEG signal acquisition module using an under-bump metallization process in one embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the back side of an EEG signal acquisition module in one embodiment of the present invention;

[0019] Figure 4 It is a front schematic diagram of the process of implanting solder balls after under bump metallization adopted by the EEG signal acquisition module in one embodiment of the present invention. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1 ~Attached Figure 4 , the present invention is further explained by describing a preferred specific embodiment in detail.

[0021] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0022] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0023] like Figures 1 to 3 As shown, the present invention provides a fully wireless, high-throughput, and flexibly expandable EEG signal acquisition module, which includes, from top to bottom, a plurality of low-throughput EEG acquisition front-end chips 11, a rewiring layer 12, and a multi-channel EEG electrode 13 arranged in a matrix; the front side of the rewiring layer 12 is connected to each of the low-throughput EEG acquisition front-end chips 11; the back side of the rewiring layer 12 is provided with a plurality of EEG acquisition channel arrangement sites; each of the EEG acquisition channel arrangement sites is respectively connected to a site on the front side of the multi-channel EEG electrode 13 in a one-to-one correspondence.

[0024] Furthermore, each of the low-throughput EEG acquisition front-end chips 11 can be controlled and output independently.

[0025] The number of the low-throughput EEG acquisition front-end chips 11 is N×M, where N and M are both natural numbers. In a preferred embodiment of the present invention, N and M are equal.

[0026] Furthermore, the number of the EEG acquisition channel arrangement sites on the back side of the redistribution layer 12 is: the number of channels of a single low-throughput EEG acquisition front-end chip×M×N.

[0027] Furthermore, a plurality of extension electrodes 14 are arranged on the back of the multi-channel EEG electrode 13, and each of the extension electrodes 14 is connected to a site on the front of the multi-channel EEG electrode 13 in a one-to-one correspondence; and each of the extension electrodes 14 is provided with a microelectrode sensor, and the extension electrodes 14 are implanted into the brain of the experimental target to collect EEG signals released by nerve cells in the brain of the experimental target and transmit them to the low-throughput EEG acquisition front-end chip 11 through the multi-channel EEG electrode 13.

[0028] The present invention also provides a method for preparing a fully wireless, high-throughput and flexibly expandable EEG signal acquisition module, which specifically comprises the following steps:

[0029] S1, fixing the low-throughput EEG acquisition front-end chips 11 arranged in a matrix on the release film layer, and packaging them by using a compression film pressing process to form a chip grain array;

[0030] S2, grinding the bottom of the release film layer by a grinding process until the bottom surface of all low-throughput EEG acquisition front-end chips 11 is exposed;

[0031] S3, using a spin coating method to evenly coat a polymer film (photosensitive polyimide, PI) on the bottom of the ground release film layer, and cover the bottom of all low-throughput EEG acquisition front-end chips 11 to form a thin film dielectric layer;

[0032] S4, the thin film dielectric layer is patterned by photolithography to form a connection circuit to achieve electrical interconnection between each of the low-throughput EEG acquisition front-end chips 11;

[0033] S5, connecting the front side of the rewiring layer 12 to each of the low-throughput EEG acquisition front-end chips 11;

[0034] S6, connecting the multiple EEG acquisition channel arrangement sites on the back of the rewiring layer 12 to the sites on the front of the multi-channel EEG electrode 13 in a one-to-one correspondence;

[0035] S7, connecting a plurality of extension electrodes 14 to the sites on the back of the multi-channel EEG electrode 13 one by one, and setting a microelectrode sensor at the end of each extension electrode 14 to complete the preparation of the EEG signal acquisition module.

[0036] Furthermore, in S6, there are two connection methods between the multiple EEG acquisition channel arrangement sites on the back side of the redistribution layer 12 and the sites on the front side of the multi-channel EEG electrode 13, namely, under ball metallization (UBM) or solder ball implantation after under ball metallization.

[0037] Among them, Figure 1As shown, the bump metallization is a process performed on the back side of the rewiring layer 12, and its purpose is to lead out each of the EEG acquisition channel arrangement sites on the back side of the rewiring layer 12 and correspond one-to-one with the sites on the front side of the multi-channel EEG electrode 13; when each of the EEG acquisition channel arrangement sites on the back side of the rewiring layer 12 is subjected to under-bump metallization, the multi-channel EEG electrode 13 is pre-placed in an organic substrate prepreg, at which time the organic substrate prepreg on the surface of the multi-channel EEG electrode 13 will be cured to form an organic substrate, and therefore, in order to lead out the sites of the multi-channel EEG electrode 13 to the surface of the organic substrate, additional drilling and metallization processing is required, and the drilling positions on the organic substrate correspond one-to-one with each of the EEG acquisition channel arrangement sites on the back side of the rewiring layer 12; and then each of the EEG acquisition channel arrangement sites on the back side of the rewiring layer 12 is aligned with the sites on the front side of the multi-channel EEG electrode 13, and then a pressing and curing process is directly used to form a firm electrical connection. At this time, no subsequent sealing protection is required, and the organic substrate prepreg can directly form a covering protective layer for the multi-channel EEG electrode 13 after being cured.

[0038] Among them, Figure 4 As shown, when solder balls are implanted after the metallization of each EEG acquisition channel arrangement site on the back of the rewiring layer 12, each EEG acquisition channel arrangement site on the back of the rewiring layer 12 is matched one by one with the site on the front of the multi-channel EEG electrode 13, and solder balls are implanted between each EEG acquisition channel arrangement site and the site on the front of the multi-channel EEG electrode 13 through a reflow soldering process to achieve a welding connection between each EEG acquisition channel arrangement site and the multi-channel EEG electrode 13, so that the two can be electrically connected. It should be noted that after the connection is made by implanting solder balls, a sealing material is required to protect the multi-channel electrode, and the sealing material fills the gap between the rewiring layer 12 and the multi-channel EEG electrode 13 except for the solder balls, wherein the sealing material includes a plastic film, epoxy resin, etc.

[0039] The present invention also provides a fully wireless, high-throughput, and flexibly expandable EEG signal acquisition system, comprising the EEG signal acquisition module; a host computer connected to the EEG signal acquisition module to acquire EEG signals; and a camera module connected to the host computer for photographing an experimental target to synchronously display the behavior of the experimental target in real time on the host computer window interface.

[0040] It can be understood that the camera module is used to capture the external state of the experimental target. For example, when the experimental target suffers from epilepsy, it is possible to observe how the behavior of the experimental target changes, and at the same time as the behavior of the experimental target changes, it is possible to synchronously observe how the EEG signals of the experimental target's brain change.

[0041] Furthermore, the host computer includes an EEG signal wireless receiving module and a display control module; the EEG signal wireless receiving module is communicatively connected to each of the low-throughput EEG acquisition front-end chips 11 of the EEG signal acquisition module to receive and process the EEG signals transmitted from each of the low-throughput EEG acquisition front-end chips 11; the display control module receives the EEG signals processed by the EEG signal wireless receiving module and displays and outputs them.

[0042] Specifically, the EEG signal wireless receiving module has the functions of data processing, state preservation and channel selection; wherein, data processing includes data reception and data caching, and after receiving the EEG signals sent by each of the low-throughput EEG acquisition front-end chips 11, all EEG signals are saved in the information processing cache area; state preservation is used to save the initialization state and the EEG signal cache state as the basis for channel selection; channel selection is used to coordinate the working order between each of the low-throughput EEG acquisition front-end chips 11, that is, to coordinate each of the low-throughput EEG acquisition front-end chips 11 to write EEG signals according to sequential parameters and each of the low-throughput EEG acquisition front-end chips 11 to send EEG signals in sequence. It should be noted that, since each of the low-throughput EEG acquisition front-end chips 11 has a large number of channels, all channels cannot be displayed on the same screen, so they need to be displayed in groups, such as 64 channels in one group, then 1024 channels are 16 groups, and only when the corresponding group is selected, will data be extracted from the information processing cache area and then displayed on the host computer.

[0043] Specifically, the display control module is provided with a port switch, a channel selection switch, an information processing switch, a waveform display switch, a data saving switch, a camera image input switch, an image processing switch, an image display switch and an image saving switch, which respectively have the following functions: a) Port switch: used to start the network port. If there is EEG signal data input, the data of each frame is parsed and the timestamp is updated; b) Channel selection switch: used to send the EEG signal transmitted by the corresponding low-throughput EEG acquisition front-end chip 11 in the EEG acquisition module to the information processing buffer area; c) Information processing switch: used to perform corresponding processing on the received EEG signal, including Including but not limited to filtering, sampling rate adjustment, etc.; d) waveform display switch: used to display the processed EEG signal waveform data on the host computer window interface; e) data saving switch: used to save the waveform data displayed on the host computer window interface into the specified NR21 data file format; f) camera image input switch: used to receive the image data input by the camera module; g) image processing switch: used to process the image data captured by the camera module and display it on the host computer window interface; h) image display switch: used to display the processed image information; i) image saving switch, used to save the processed image information in video format.

[0044] In this embodiment, taking the low-throughput EEG acquisition front-end chip 11 as a 64-channel chip as an example, after the EEG signal enters the low-throughput EEG acquisition front-end chip 11 through 64 channels from the multi-channel EEG electrode 13, the analog signal is converted into a digital signal by an analog-to-digital converter, and then convolution coding is performed, and the convolution-coded data is modulated and sent to the host computer for processing and display. For the host computer part, after the EEG signal wireless receiving module receives the modulated signal of the low-throughput EEG acquisition front-end chip 11, it demodulates the EEG signal according to the coding rules and then transmits it to the display control software. After the display control software detects the data input, it parses the data of each frame and updates the timestamp; it can select the corresponding channel according to the needs and send the corresponding EEG signal to the information processing buffer; it can also sort out the received EEG signal waveform according to the needs, such as filtering; at the same time, the display control software supports the data saving function, and can save the waveform data displayed on the host computer window interface into a specified file format; and the display control software can synchronously display the experimental target image captured by the camera, and perform real-time analysis in conjunction with the EEG signal waveform.

[0045] Furthermore, it is scalable that the low-throughput EEG acquisition front-end chip 11 can be replaced by multifunctional chips such as optical or electrical nerve stimulation chips and signal processing chips, so as to realize an EEG system integrating all functions such as EEG signal acquisition and recording, stimulation, regulation and feedback.

[0046] In other embodiments of the present invention, if a dedicated information processing chip (integrated multifunctional chip) is used to replace the low-throughput EEG acquisition front-end chip 11 in the EEG signal acquisition module, the dedicated information processing chip can directly process the data after receiving the EEG signal data, and quickly decode the cortical activity signal through the built-in algorithm to interpret the brain activity. At the same time, a low-power Bluetooth transmitter module is integrated on the dedicated information processing chip, which can send the decoded cortical activity signal to the host computer, and can also receive control instructions from the host computer. The dedicated information processing chip can send stimulation instructions to the multi-channel programmable neural stimulation chip according to the decoded cortical activity signal through an internal algorithm, and can also receive instructions from the host computer to stimulate instructions to the programmable neural stimulation chip. After receiving the instructions from the information processing chip, the multi-channel programmable neural stimulation chip generates stimulation parameters and waveforms through an internal algorithm and transmits them to the electrodes, thereby forming a complete set of closed-loop circuits for EEG acquisition and stimulation. The host computer can also send EEG stimulation commands via Bluetooth, and then more intuitively observe the changes in brain waves caused by EEG stimulation.

[0047] In summary, the present invention provides a fully wireless, high-throughput, flexibly expandable EEG signal acquisition module and preparation method and system, which significantly improves the integration, scalability and practicality of EEG signal acquisition through high-density integration, precise arrangement, firm connection, multi-functional integration, wireless transmission and synchronous observation technologies, and provides strong support for neuroscience research, especially the observation and exploration of research subjects in a freely moving state.

[0048] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A fully wireless, high-throughput and flexibly expandable EEG signal acquisition module, characterized in that: The EEG signal acquisition module includes, from top to bottom, a plurality of low-throughput EEG acquisition front-end chips, a rewiring layer, and multi-channel EEG electrodes arranged in a matrix; Wherein, the front side of the rewiring layer is connected to each of the low-throughput EEG acquisition front-end chips; A plurality of EEG acquisition channel arrangement sites are arranged on the back of the rewiring layer; Each of the EEG acquisition channel arrangement sites is connected to a site on the front side of the multi-channel EEG electrode in a one-to-one correspondence.

2. The EEG signal acquisition module according to claim 1, characterized in that: The number of the low-throughput EEG acquisition front-end chips is N×M, where N and M are both natural numbers; The number of the EEG acquisition channel arrangement sites on the back side of the redistribution layer is: the number of channels of a single low-throughput EEG acquisition front-end chip×M×N.

3. The EEG signal acquisition module according to claim 2, characterized in that: A plurality of extension electrodes are arranged on the back of the multi-channel EEG electrode, and each of the extension electrodes is connected to a site on the front of the multi-channel EEG electrode in a one-to-one correspondence; And each of the extension electrodes is provided with a microelectrode sensor.

4. A method for preparing an electroencephalogram signal acquisition module, for preparing the electroencephalogram signal acquisition module as claimed in any one of claims 1 to 3, characterized in that: The following steps are involved: S1, fixing the low-throughput EEG acquisition front-end chips arranged in a matrix on the release film layer, and packaging them by using a compression film pressing process to form a chip grain array; S2, grinding the bottom of the release film layer by a grinding process until the bottom surface of all low-throughput EEG acquisition front-end chips is exposed; S3, using a spin coating method to evenly coat the polymer film on the bottom of the ground release film layer, and cover the bottom of all low-throughput EEG acquisition front-end chips to form a thin film dielectric layer; S4, performing photolithography patterning on the thin film dielectric layer to form a connection circuit to achieve electrical interconnection between each of the low-throughput EEG acquisition front-end chips; S5, connecting the front side of the rewiring layer to each of the low-throughput EEG acquisition front-end chips; S6, connecting the plurality of EEG acquisition channel arrangement sites on the back of the rewiring layer to the sites on the front of the multi-channel EEG electrode in a one-to-one correspondence; S7. Connect the multiple extension electrodes to the sites on the back of the multi-channel EEG electrode in a one-to-one correspondence, and set a microelectrode sensor at the end of each extension electrode to complete the preparation of the EEG signal acquisition module.

5. The method for preparing an EEG signal acquisition module according to claim 4, characterized in that: In the above S6, there are two connection modes between the multiple EEG acquisition channel arrangement sites on the back of the redistribution layer and the sites on the front of the multi-channel EEG electrode, namely, under-bump metallization or solder ball implantation after under-bump metallization.

6. The method for preparing an EEG signal acquisition module according to claim 5, characterized in that: When each EEG collection channel arrangement site on the back side of the redistribution layer is subjected to under-bump metallization, the multi-channel EEG electrode is pre-placed in an organic substrate prepreg, the surface of the multi-channel EEG electrode forms an organic substrate, and additional drilling and metallization treatments are required to lead the sites of the multi-channel EEG electrode to the surface of the organic substrate.

7. The method for preparing an electroencephalogram signal acquisition module according to claim 6, characterized in that: When solder balls are implanted after the under-bump metallization of each EEG acquisition channel arrangement site on the back side of the rewiring layer, each EEG acquisition channel arrangement site on the back side of the rewiring layer is matched one by one with the site on the front side of the multi-channel EEG electrode, and solder balls are implanted between each EEG acquisition channel arrangement site and the site on the front side of the multi-channel EEG electrode through a reflow soldering process to achieve a welding connection between each EEG acquisition channel arrangement site and the multi-channel EEG electrode.

8. The method for preparing an EEG signal acquisition module according to claim 7, characterized in that: After the solder ball is implanted after the under-bump metallization, a sealing material is required to protect the multi-channel electrodes; The sealing material fills the gap between the redistribution layer and the multi-channel EEG electrode except the solder balls.

9. An electroencephalogram signal acquisition system, characterized in that: include: The EEG signal acquisition module as claimed in any one of claims 1 to 3; The host computer is connected to the EEG signal acquisition module to obtain the EEG signal; The camera module is connected to the host computer and photographs the experimental target to synchronously display the behavior of the experimental target on the host computer in real time.

10. The electroencephalogram signal acquisition system according to claim 9, characterized in that: The host computer includes an EEG signal wireless receiving module and a display control module; The EEG signal wireless receiving module is communicatively connected with each of the low-throughput EEG acquisition front-end chips of the EEG signal acquisition module to receive and process the EEG signals transmitted from each of the low-throughput EEG acquisition front-end chips; The display control module receives the EEG signal processed by the EEG signal wireless receiving module and performs display output.

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