Packaging equipment for photoelectric component

Abstract

The invention provides packaging equipment for a photoelectric component. The bottom of the supporting platform is provided with a fixed circular truncated cone, the bottom of the fixed circular truncated cone is rotatably provided with a rotating platform, the bottom of the rotating platform is fixedly provided with a rotating motor, and the top of the supporting platform is fixedly provided with a top cover packaging device, a chip loading box, a bottom shell loading box and a glue pumping device. According to the packaging equipment for the photoelectric component, when packaging work is carried out, the rotating platform continuously rotates to enable the packaged part of the photoelectric component to fall into the loading box, packaging glue is squeezed into the photoelectric component through the glue outlet device to be sealed, the packaging action is carried out at a time under rotation of the photoelectric component, and the packaging efficiency is improved. The packaging continuity is achieved, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic component packaging, and in particular to a packaging device for optoelectronic components. Background Art

[0002] The packaging of optoelectronic components is mainly to protect sensitive optoelectronic components, provide electrical connections, and realize specific functions. Packaging can protect optoelectronic devices from the influence of the external environment. The packaging material can isolate the chip circuit from the external environment and prevent impurities in the air from corroding the circuit. Packaging can adjust the fine lead spacing of the chip to the spacing suitable for the size of the printed circuit board, realize the size transformation from small to large, reduce operating costs and material costs, and improve work efficiency and reliability.

[0003] In the current packaging technology of optoelectronic components, in order to ensure the strength of the welding between the chip and the solder pin of the optoelectronic component, glue dispensing is usually performed after welding to protect the optoelectronic device. The existing component packaging equipment mainly uses a pump air machine to use gas pressure to pressure squeeze the glue in the hose through the glue outlet head for packaging. However, the current packaging equipment has insufficient control over the glue output, and the control of the glue output amount is difficult to master, and cannot adapt to the packaging of optoelectronic components of different sizes.

[0004] Therefore, it is necessary to provide a packaging device for optoelectronic components to solve the above technical problems. Summary of the invention

[0005] The present invention provides a packaging device for optoelectronic components, which solves the problem that the packaging device has insufficient control over the glue output amount, the glue output amount is difficult to control, and the packaging of optoelectronic components of different sizes cannot be adapted.

[0006] In order to solve the above technical problems, the present invention provides a packaging device for optoelectronic components, comprising:

[0007] Support platform;

[0008] Support legs, the tops of the four support legs are fixedly installed on the four sides of the bottom of the support platform, the bottom of the support platform is fixedly installed with a fixed column, the bottom of the fixed column is fixedly installed with a fixed platform, the bottom of the fixed platform is rotatably installed with a rotating platform, the bottom of the rotating platform is fixedly installed with a rotating motor, the top of the support platform is respectively penetrated by a top cover packaging device, a chip loading box and a bottom shell loading box, the top cover packaging device and the bottom outlets of the chip loading box and the bottom shell loading box are all in contact with the top of the rotating platform, the top cover packaging device includes a top shell packaging box , the top shell packaging box is arranged on the supporting platform, and the bottom outlet of the top shell packaging box is fitted with the top of the rotating platform, a pressure plate is set inside the top shell packaging box, a packaging box top cover is fixedly installed on the top of the pressure plate through a telescopic rod, a first spring is set on the telescopic rod between the packaging box top cover and the pressure plate, a loading box is slidably installed on the rotating platform through the loading port, a sliding track is opened on the top of the rotating platform, the bottom of the push-out block is slidably installed on the sliding track of the rotating platform, and a push-out block is fixedly installed on the back of the loading box;

[0009] A glue pumping device, the glue pumping device includes: an extrusion box, the bottom of the extrusion box is fixedly installed on the top of the supporting platform, an extrusion plate is slidably installed inside the extrusion box, a screw is threadedly connected to the center position of the extrusion plate, a gear is fixedly installed on the bottom of the screw, a toothed plate fixing leg is fixedly installed on the top of the rotating platform, an arc-shaped toothed plate is fixedly installed on the top of the toothed plate fixing leg, the arc-shaped toothed plate and the gear are meshed for transmission, and the glue outlet of the glue pumping device is connected to a glue hose.

[0010] Preferably, a second spring is connected between the rotating platform and the ejection block.

[0011] Preferably, a material removal protrusion is fixedly installed on the top of the fixing platform and close to the right side of the top cover packaging device.

[0012] Preferably, the glue pipe is connected to a glue discharge device, the surface of the glue discharge device is arranged at the bottom of the support platform, the glue discharge device includes a fixed block, the top of the fixed block is fixedly installed on the bottom of the support platform, a glue storage cylinder is fixedly installed on the top of the fixed block, and the glue storage cylinder passes through the support platform, a glue discharge adjustment device is rotatably installed on the bottom of the fixed block, a glue discharge pipe is fixedly installed on the bottom of the glue discharge adjustment device, and a glue discharge orifice plate is fixedly installed on the inner surface of the glue discharge pipe.

[0013] Preferably, the glue outlet adjustment device comprises a rotating ring, the surface of the rotating ring is rotatably mounted on the surface of the fixed block, a rotating shield is fixedly mounted on the inner surface of the rotating ring, and a fixed shield is rotatably mounted on the surface of the glue outlet hole plate.

[0014] Preferably, a sliding connecting rod is provided on one side surface of the rotating shield and the fixed shield, and a hole adapted to the sliding connecting rod is opened on the other side surface for cooperation, so that the rotating shield and the fixed shield are slidably connected.

[0015] Preferably, the glue outlet holes of the glue outlet hole plate are of uniform size and evenly distributed, and the rotating shield plate can accurately control the glue outlet.

[0016] Compared with the related art, the packaging device for optoelectronic components provided by the present invention has the following beneficial effects:

[0017] The present invention provides a packaging device for optoelectronic components. The packaging glue is pressed into a glue inlet and outlet device through a glue pumping device. The arc tooth plate is driven to mesh with a gear through the rotation of a rotating platform. The amount of glue output is controlled by the meshing length of the arc tooth plate and the gear. Each time the rotating platform rotates once, the station is aligned with the glue outlet and then the glue is pumped for packaging. The glue output amount is controlled and fixed, which greatly increases the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a preferred embodiment of a packaging device for optoelectronic components provided by the present invention;

[0019] Figure 2 for Figure 1 A schematic structural diagram of the top cover packaging device shown;

[0020] Figure 3 for Figure 1 The schematic diagram of the structure of the package launch shown;

[0021] Figure 4 for Figure 1 The structural schematic diagram of the glue pump device shown;

[0022] Figure 5 for Figure 4 The schematic diagram of the structure inside the glue pump device shown;

[0023] Figure 6 A schematic structural diagram of another preferred embodiment of a packaging device for optoelectronic components provided by the present invention;

[0024] Figure 7 for Figure 6 The structural schematic diagram of the glue discharging device shown;

[0025] Figure 8 for Figure 7 The structural schematic diagram of the glue outlet orifice plate of the glue outlet device shown;

[0026] Fig. 9 for Figure 7 The structural schematic diagram of the glue discharging regulating device shown;

[0027] Numbers in the figure: 1. supporting leg, 2. supporting platform, 3. rotating platform, 4. rotating motor, 5. fixed platform, 6. fixed column, 7. glue pumping device, 71. extrusion box, 72. extrusion plate, 73. screw rod, 74. arc tooth plate, 75. gear, 76. tooth plate fixing leg, 8. glue discharging device, 81. glue storage cylinder, 82. fixed block, 83. glue discharging adjustment device, 831. rotating ring, 832. rotating baffle, 833. fixed baffle, 84. glue discharging tube, 85. glue discharging hole plate, 9. top cover packaging device, 901. packaging box top cover, 902. first spring, 903. pressure plate, 904. top shell packaging box, 10. chip loading box, 11. bottom shell loading box, 12. loading box, 13. ejection block, 14. unloading protrusion, 15. glue hose, 16. second spring, 901. packaging box top cover. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0029] First embodiment

[0030] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , a packaging device for optoelectronic components, comprising:

[0031] Support platform 2;

[0032] Support legs 1, the tops of the four support legs 1 are respectively fixedly installed around the bottom of the support platform 2, the bottom of the support platform 2 is fixedly installed with a fixing column 6, the bottom of the fixing column 6 is fixedly installed with a fixing platform 5, the bottom of the fixing platform 5 is rotatably installed with a rotating platform 3, the bottom of the rotating platform 3 is fixedly installed with a rotating motor 4, the top of the support platform 2 is respectively penetrated by a top cover packaging device 9, a chip loading box 10 and a bottom shell loading box 11, the bottom outlets of the top cover packaging device 9, the chip loading box 10 and the bottom shell loading box 11 are all in contact with the top of the rotating platform 3, the top cover packaging device 9 includes a top shell packaging box 904, the top shell sealing The packing box 904 is arranged on the supporting platform 2, and the bottom outlet of the top shell packaging box 904 is fitted with the top of the rotating platform 3. The top shell packaging box 904 is provided with a pressure plate 903. The top of the pressure plate 903 is fixedly provided with a packaging box top cover 901 through a telescopic rod. The telescopic rod between the packaging box top cover 901 and the pressure plate 903 is provided with a first spring 902. The rotating platform 3 is slidably provided with a loading box 12 through the loading port. The top of the rotating platform 3 is provided with a sliding track. The bottom of the push-out block 13 is slidably provided on the sliding track of the rotating platform 3. The back of the loading box 12 is fixedly provided with a push-out block 13.

[0033] The glue pumping device 7 comprises: an extrusion box 71, the bottom of which is fixedly mounted on the top of the support platform 2, an extrusion plate 72 is slidably mounted inside the extrusion box 71, a screw rod 73 is threadedly connected to the center of the extrusion plate 72, a gear 75 is fixedly mounted on the bottom of the screw rod 73, a toothed plate fixing leg 76 is fixedly mounted on the top of the rotating platform 3, an arc-shaped toothed plate 74 is fixedly mounted on the top of the toothed plate fixing leg 76, the arc-shaped toothed plate 74 is meshed with the gear 75 for transmission, and a glue outlet of the glue pumping device 7 is connected to a glue hose 15.

[0034] When the first spring 902 is in an uncompressed state, it bounces the pressure plate 903 to the bottom of the top shell packaging box 904 .

[0035] A second spring 16 is connected between the rotating platform 3 and the pushing block 13 .

[0036] A material removal protrusion 14 is fixedly installed on the top of the fixing platform 5 and close to the right side of the top cover packaging device 9 .

[0037] A long round rod is arranged at the center of the packaging box top cover 901, and the round rod can be retracted, so that the optoelectronic components can be better packaged under the action of the first spring.

[0038] When the rotating motor 4 rotates, each loaded bottom shell and chip will coincide with the center position corresponding to the work station, ensuring the normal operation of the device.

[0039] The working principle of a packaging device for optoelectronic components provided by the present invention is as follows:

[0040] When performing the optoelectronic component packaging work, first load the packaged bottom shell into the bottom shell loading box 11, start the rotating motor 4 to drive the rotating platform 3 to rotate, and when the sealed bottom shell falls into the loading port of the rotating platform 3 and rotates to the next station, the chip loading box 10 is loaded with chips, and the chips fall into the sealed bottom shell. The rotating platform 3 continues to rotate to the next station, and the arc-shaped toothed plate 74 is meshed with the gear 75 to drive the extrusion plate 72 to continuously extrude the packaging glue and squeeze the glue toward the center position of the sealed bottom shell. After the glue extrusion is completed, it rotates to the last station for top shell packaging, and the top shell is placed in the top shell packaging box 904. While falling into the packaging, the first spring 902 will give a certain pressure to the pressure plate 903 to better seal the optoelectronic components. Before reaching the next station, the top of the rotating platform 3 will seal the exits of the bottom shell loading box 11, the chip loading box 10 and the top shell packaging box 904 to prevent items from falling. When the packaging size of the optoelectronic components changes, the required amount of sealing glue also changes.

[0041] Compared with the related art, the packaging device for optoelectronic components provided by the present invention has the following beneficial effects:

[0042] When the rotating motor 4 is started to drive the rotating platform 3 to rotate, before reaching the next workstation, the top of the rotating platform 3 will seal the exits of the bottom shell loading box 11, the chip loading box 10 and the top shell packaging box 904. The rotation of the rotating platform 3 drives the continuous engagement of the arc-shaped tooth plate 74 and the gear 75 to control the glue output amount, so that the glue output amount becomes fixed and reliable, which greatly improves the packaging efficiency of optoelectronic components.

[0043] Second embodiment

[0044] Please refer to Figure 6 , Figure 7 , Figure 8 and Fig. 9 Based on the packaging device for optoelectronic components provided in the first embodiment of the present application, the second embodiment of the present application provides another packaging device for optoelectronic components. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0045] Specifically, the second embodiment of the present application provides a packaging device for optoelectronic components, which is different in that the glue pipe 15 is connected to a glue discharging device 8, the surface of the glue discharging device 8 is arranged at the bottom of the supporting platform 2, the glue discharging device 8 comprises a fixed block 82, the top of the fixed block 82 is fixedly installed at the bottom of the supporting platform 2, a glue storage cylinder 81 is fixedly installed at the top of the fixed block 82, the glue storage cylinder 81 runs through the supporting platform 2, a glue discharging adjustment device 83 is rotatably installed at the bottom of the fixed block 82, a glue discharging pipe 84 is fixedly installed at the bottom of the glue discharging adjustment device 83, and a glue discharging hole plate 85 is fixedly installed on the inner surface of the glue discharging pipe 84;

[0046] The glue discharge adjustment device 83 includes: a rotating ring 831, the surface of which is rotatably mounted on the surface of the fixed block 82, a rotating shield 832 is fixedly mounted on the inner surface of the rotating ring 831, and a fixed shield 833 is rotatably mounted on the surface of the glue discharge hole plate 85. A sliding connecting rod is provided on one side surface of the rotating shield 832 and the fixed shield 833, and a hole adapted to the sliding connecting rod is provided on the other side surface to cooperate with the rotating shield 832 and the fixed shield 833, so that the rotating shield 832 and the fixed shield 833 are slidably connected. The glue discharge holes of the glue discharge hole plate 85 are of uniform size and evenly distributed, and the rotating shield 832 can accurately control the glue discharge.

[0047] The arrangement of the toothed plate fixing legs 76 does not hinder the rotation of the rotating platform 3 and the operation of the unloading protrusions 14 .

[0048] After being pushed out by the blanking protrusion 14, the pushing block 13 will automatically retract to the initial position.

[0049] When entering the glue discharging station, it is necessary to ensure that when entering, the arc tooth plate 74 starts to engage with the gear 75 to squeeze glue when the right edge of the glue outlet completely enters the interior of the packaging bottom shell. When exiting, when the left edge of the glue outlet is about to approach the surface leaving the packaging bottom shell, the arc tooth plate 74 starts to disengage from the gear 75 and no longer squeezes glue.

[0050] The working principle of a packaging device for optoelectronic components provided by the present invention is as follows:

[0051] Start the rotating motor 4 to drive the rotating platform 3 to rotate, and the arc-shaped toothed plate 74 also rotates together. When the packaging bottom shell falls into the loading box 12 and the chip falls into the packaging bottom shell and rotates to the next sealing station, the rotating platform 3 rotates, and the arc-shaped toothed plate 74 engages with the gear 75. The movement of the arc-shaped toothed plate 74 drives the gear 75 to rotate, and then drives the screw rod 73 to rotate. When the screw rod 73 rotates, the extrusion plate 72 moves to squeeze the packaging glue inside the extrusion box 71 into the glue in and out device 8. When packaging components of different sizes, the rotating shield plate 832 is driven by rotating the rotating ring 831 to block the glue outlet hole plate 85 to control the glue outlet rate. When the glue outlet is completed, the packaging top shell is packaged. After the end, the rotating platform 3 continues to rotate until the push-out block 13 contacts the unloading protrusion 14, and the loading box 12 is gradually pushed out, and the packaging of an optoelectronic component is completed.

[0052] Compared with the related art, the packaging device for optoelectronic components provided by the present invention has the following beneficial effects:

[0053] The rotating motor 4 drives the rotating platform 3 to rotate. When the bottom shell of the package falls into the loading box 12, the chip falls into the bottom shell of the package. When the rotating platform 3 carries the optoelectronic components and rotates to the glue discharging station, the arc tooth plate 74 meshes with the gear 75. The movement of the arc tooth plate 74 drives the gear 75 to rotate, and then drives the screw 73 to rotate. When the screw 73 rotates, the extrusion plate 72 moves to squeeze the packaging glue inside the extrusion box 71 into the glue discharging device 8. When packaging components of different sizes, the rotating shield plate 832 is driven by the rotating ring 831 to block the glue discharging hole plate 85 to control the glue discharging rate. When the glue discharging is completed, the top shell of the package is packaged. After the end, the rotating platform 3 continues to rotate until the push-out block 13 contacts the unloading protrusion 14, and the loading box 12 is gradually pushed out. The continuity and work efficiency of the packaging work are greatly improved.

[0054] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A packaging device for optoelectronic components, characterized in that: include: Support platform; Support legs, the tops of the four support legs are fixedly installed on the four sides of the bottom of the support platform, the bottom of the support platform is fixedly installed with a fixed column, the bottom of the fixed column is fixedly installed with a fixed platform, the bottom of the fixed platform is rotatably installed with a rotating platform, the bottom of the rotating platform is fixedly installed with a rotating motor, the top of the support platform is respectively penetrated by a top cover packaging device, a chip loading box and a bottom shell loading box, the top cover packaging device and the bottom outlets of the chip loading box and the bottom shell loading box are all in contact with the top of the rotating platform, the top cover packaging device includes a top shell packaging box , the top shell packaging box is arranged on the supporting platform, and the bottom outlet of the top shell packaging box is fitted with the top of the rotating platform, a pressure plate is set inside the top shell packaging box, a packaging box top cover is fixedly installed on the top of the pressure plate through a telescopic rod, a first spring is set on the telescopic rod between the packaging box top cover and the pressure plate, a loading box is slidably installed on the rotating platform through the loading port, a sliding track is opened on the top of the rotating platform, the bottom of the push-out block is slidably installed on the sliding track of the rotating platform, and a push-out block is fixedly installed on the back of the loading box; A glue pumping device is arranged on the supporting platform, and the glue pumping device comprises: an extrusion box, the bottom of which is fixedly mounted on the top of the supporting platform, an extrusion plate is slidably mounted inside the extrusion box, a screw is threadedly connected to the center position of the extrusion plate, a gear is fixedly mounted on the bottom of the screw, a toothed plate fixing leg is fixedly mounted on the top of the rotating platform, an arc-shaped toothed plate is fixedly mounted on the top of the toothed plate fixing leg, the arc-shaped toothed plate and the gear are meshed for transmission, and a glue outlet of the glue pumping device is connected to a glue hose.

2. A packaging device for optoelectronic components according to claim 1, characterized in that: A second spring is connected between the rotating platform and the pushing block.

3. A packaging device for optoelectronic components according to claim 2, characterized in that: A material removal protrusion is fixedly installed on the top of the fixing platform and close to the right side of the top cover packaging device.

4. The packaging device for optoelectronic components according to claim 1, characterized in that: The glue pipe is connected to a glue discharging device, the surface of the glue discharging device is arranged at the bottom of the supporting platform, the glue discharging device includes a fixed block, the top of the fixed block is fixedly installed on the bottom of the supporting platform, a glue storage cylinder is fixedly installed on the top of the fixed block, and the glue storage cylinder runs through the supporting platform, a glue discharging adjustment device is rotatably installed on the bottom of the fixed block, a glue discharging pipe is fixedly installed on the bottom of the glue discharging adjustment device, and a glue discharging orifice plate is fixedly installed on the inner surface of the glue discharging pipe.

5. The packaging device for optoelectronic components according to claim 4, characterized in that: The glue outlet adjustment device comprises a rotating ring, the surface of which is rotatably mounted on the surface of the fixed block, a rotating shield is fixedly mounted on the inner surface of the rotating ring, and a fixed shield is rotatably mounted on the surface of the glue outlet hole plate.

6. The packaging device for optoelectronic components according to claim 5, characterized in that: A sliding connecting rod is provided on one side surface of the rotating shield and the fixed shield, and a hole adapted to the sliding connecting rod is opened on the other side surface for cooperation, so that the rotating shield and the fixed shield are slidably connected.

7. The packaging device for optoelectronic components according to claim 6, characterized in that: The glue outlet holes of the glue outlet hole plate are of uniform size and evenly distributed, and the rotating shield plate can accurately control the glue outlet.

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