Ceramic secondary metallization rotary nickel plating process for energy storage system

Abstract

The invention discloses a ceramic secondary metallization rotary nickel plating process for an energy storage system. The ceramic secondary metallization rotary nickel plating process comprises the following steps: S1, cleaning; s2, activating; s3, micro-etching is carried out; s4, rotary nickel plating; and S5, cleaning and drying. Through the rotary nickel plating process, the ceramic surface can uniformly rotate in a plating solution, uniform deposition of a plating layer is ensured, and the common problems of uneven thickness and poor adhesion of the plating layer in the traditional nickel plating process are reduced; an inhibitor and a wetting agent are added into a plating solution, electroplating parameters are optimized, hydrogen bubbles are removed through a rotating device, plating layer defects caused by the hydrogen bubbles in the electroplating process are overcome, and the overall quality of a plating layer is improved; according to the nickel plating process, the problem of skip plating in the electroplating process is solved, the integrity and coverage range of a plating layer are ensured, after the process is cured, the qualified rate of the nickel plating process in production can reach 95-98%, and the consistency of the production efficiency and the product quality is remarkably improved.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic nickel plating, and in particular to a ceramic secondary metallization rotary nickel plating process for an energy storage system. Background Art

[0002] In energy storage systems, ceramic materials are often used to manufacture key components such as batteries and capacitors because of their excellent electrical insulation and chemical stability. However, in order to improve the conductivity, corrosion resistance and adhesion of the coating of ceramic components, they usually need to be metallized. Currently, most ceramic parts of new energy storage systems use electroplating technology, but this process has the following defects:

[0003] First, during the electroplating process, excessive hydrogen evolution will cause bubbles to form on the surface of the nickel layer. The bubble ratio is sometimes as high as 60% to 100%. The formation of such bubbles not only affects the integrity of the nickel layer, but also reduces the air tightness of the ceramic parts, thereby affecting their overall performance. Secondly, due to the existence of potential difference during the electroplating process and the limitation of conductivity, the thickness of the nickel layer is usually uneven and easily exceeds the prescribed range. The uneven thickness will weaken the durability and functionality of the coating. In addition, due to poor contact of the hanger, local areas are prone to leakage plating, resulting in incomplete coating, which affects the protective performance and appearance quality of the ceramic parts. Summary of the invention

[0004] The object of the present invention is to provide a ceramic secondary metallization rotary nickel plating process for an energy storage system to solve the problems raised in the background technology.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following solutions:

[0006] A ceramic secondary metallization spin nickel plating process for an energy storage system comprises the following steps:

[0007] S1. Cleaning: Ultrasonic cleaning is performed on the ceramic surface to remove grease and dirt;

[0008] S2, activation: completely immerse the workpiece in a solution of 300-500ml / L hydrochloric acid and 500-700ml / L deionized water, soak at 20-25°C for 15-30min, and wash with deionized water three times after activation, each time for 2min, to remove the residual activation solution;

[0009] S3, micro-etching: soak the workpiece in 100-200ml / L molybdenum activator solution, maintain the temperature at 30-50℃ for 8-15min, then transfer to the pickling solution, wash with deionized water three times after micro-etching, each washing for 2min, to ensure that the micro-etching residue is completely removed, treat the waste liquid, neutralize, precipitate and filter by adding alkaline lime or sodium hydroxide, and adjust the pH to 7-8;

[0010] S4, spin nickel plating: immerse the workpiece in a nickel plating solution mixed with 100-200ml / L HA-810A, 100-200ml / L HA-810B and 600-800ml / L water, add inhibitor and wetting agent, treat at 60-80°C for 50-70min, start the rotating device for nickel plating, and control the rotation speed at 20-50rpm;

[0011] S5. Cleaning and drying: After the spin nickel plating is completed, the workpiece is taken out and cleaned for 5 minutes using a spray cleaning device. The cleaned workpiece is dried until there is no watermark on the ceramic part and the metal surface.

[0012] As a further solution of the present technical solution, the ultrasonic frequency in S1 is 40kHz, and the cleaning time is 10-15min:

[0013] As a further solution of the present technical solution, the mixed activator in S2 is 0.1-0.5 g / L of fluoride and 1-3 g / L of phosphate.

[0014] As a further solution of the present technical solution, the pickling solution of S3 is a mixture of 200-300 ml / L hydrochloric acid, 200-300 ml / L sulfuric acid and 200-500 ml / L water.

[0015] As a further solution of the present technical solution, the inhibitor in S4 is 10-50 mg / L sodium dodecyl sulfate, and the wetting agent is 50-200 mg / L polyethylene glycol.

[0016] As a further solution of the present technical solution, S4 also includes regularly checking and adjusting the composition of the plating solution to control the pH value of the nickel plating solution between 8.5-9.2.

[0017] As a further solution of the present technical solution, the temperature of the drying treatment in S5 is 110-130° C., and the drying time is 1-5 min.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. Through the rotary nickel plating process, the ceramic surface can be evenly rotated in the plating solution to ensure uniform deposition of the coating, reducing the problems of uneven coating thickness and poor adhesion common in the traditional nickel plating process;

[0020] 2. By adding inhibitors and wetting agents to the plating solution, optimizing electroplating parameters, and using a rotating device to remove hydrogen bubbles++, the coating defects caused by hydrogen bubbles during the electroplating process are solved and the overall quality of the coating is improved;

[0021] 3. The problem of missed plating during the electroplating process is solved, ensuring the integrity and coverage of the coating. After the process is solidified, the qualified rate of nickel plating in production can reach 95-98%, significantly improving production efficiency and consistency of product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The present invention is a secondary metallization rotary nickel plating process flow chart. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] Example 1

[0025] refer to Figure 1 , a ceramic secondary metallization spin nickel plating process for energy storage system, comprising the following steps:

[0026] S1. Cleaning: Ultrasonic cleaning is performed on the ceramic surface to remove grease and dirt;

[0027] S2, activation: completely immerse the workpiece in a solution of 300-500ml / L hydrochloric acid and 500-700ml / L deionized water, soak at 20-25°C for 15-30min, and wash with deionized water three times after activation, each time for 2min, to remove the residual activation solution;

[0028] S3, micro-etching: soak the workpiece in 100-200ml / L molybdenum activator solution, maintain the temperature at 30-50℃ for 8-15min, then transfer to the pickling solution, wash with deionized water three times after micro-etching, each washing for 2min, to ensure that the micro-etching residue is completely removed, treat the waste liquid, neutralize, precipitate and filter by adding alkaline lime or sodium hydroxide, and adjust the pH to 7-8;

[0029] S4, spin nickel plating: immerse the workpiece in a nickel plating solution mixed with 100-200ml / L HA-810A, 100-200ml / L HA-810B and 600-800ml / L water, add inhibitor and wetting agent, treat at 60-80°C for 50-70min, start the rotating device for nickel plating, and control the rotation speed at 20-50rpm;

[0030] S5. Cleaning and drying: After the spin nickel plating is completed, the workpiece is taken out and cleaned for 5 minutes using a spray cleaning device. The cleaned workpiece is dried until there is no watermark on the ceramic part and the metal surface.

[0031] The ultrasonic frequency in S1 is 40kHz and the cleaning time is 10-15min:

[0032] Wherein, the mixed activator in S2 is 0.1-0.5 g / L of fluoride and 1-3 g / L of phosphate.

[0033] The pickling solution of S3 is a mixture of 200-300 ml / L hydrochloric acid, 200-300 ml / L sulfuric acid and 200-500 ml / L water.

[0034] Wherein, the inhibitor in S4 is 10-50 mg / L sodium dodecyl sulfate, and the wetting agent is 50-200 mg / L polyethylene glycol.

[0035] Wherein, the S4 also includes regularly checking and adjusting the composition of the plating solution to control the pH value of the nickel plating solution between 8.5-9.2.

[0036] The temperature of the drying process in S5 is 110-130° C., and the drying time is 1-5 min.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A ceramic secondary metallization spin nickel plating process for energy storage system, characterized in that: The following steps are involved: S1. Cleaning: Ultrasonic cleaning is performed on the ceramic surface to remove grease and dirt; S2, activation: completely immerse the workpiece in a solution of 300-500ml / L hydrochloric acid and 500-700ml / L deionized water, then add the mixed activator, soak for 15-30min at 20-25℃, and wash with deionized water three times after activation, each time for 2min, to remove the residual activation solution; S3, micro-etching: soak the workpiece in 100-200ml / L molybdenum activator solution, maintain the temperature at 30-50℃ for 8-15min, then transfer to the pickling solution, wash with deionized water three times after micro-etching, each washing for 2min, to ensure that the micro-etching residue is completely removed, treat the waste liquid, neutralize, precipitate and filter by adding alkaline lime or sodium hydroxide, and adjust the pH to 7-8; S4, spin nickel plating: immerse the workpiece in a nickel plating solution mixed with 100-200ml / L HA-810A, 100-200ml / L HA-810B and 600-800ml / L water, add inhibitor and wetting agent, treat at 60-80°C for 50-70min, start the rotating device for nickel plating, and control the rotation speed at 20-50rpm; S5. Cleaning and drying: After the spin nickel plating is completed, the workpiece is taken out and cleaned for 5 minutes using a spray cleaning device. The cleaned workpiece is dried until there is no watermark on the ceramic part and the metal surface.

2. A ceramic secondary metallization rotary nickel plating process for energy storage system according to claim 1, characterized in that: The ultrasonic frequencies in S1 are 40kHz and 80kHz, the working time of the two frequencies is half each, and the total cleaning time is 10-15 minutes.

3. The ceramic secondary metallization rotary nickel plating process for energy storage system according to claim 1, characterized in that: The mixed activator in S2 is 0.1-0.5 g / L of fluoride and 1-3 g / L of phosphate.

4. The ceramic secondary metallization rotary nickel plating process for energy storage system according to claim 1, characterized in that: The pickling solution of S3 is a mixture of 200-300 ml / L hydrochloric acid, 200-300 ml / L sulfuric acid and 200-500 ml / L water.

5. The ceramic secondary metallization rotary nickel plating process for energy storage system according to claim 1, characterized in that: The inhibitor in S4 is 10-50 mg / L sodium dodecyl sulfate, and the wetting agent is 50-200 mg / L polyethylene glycol.

6. The ceramic secondary metallization rotary nickel plating process for energy storage system according to claim 1, characterized in that: The step S4 also includes regularly checking and adjusting the composition of the plating solution to control the pH value of the nickel plating solution to be between 8.5 and 9.

2.

7. The ceramic secondary metallization spin nickel plating process for energy storage system according to claim 1, characterized in that: The temperature of the drying process in S5 is 110-130° C., and the drying time is 1-5 min.

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