Horizontal copper deposition production line and control method

Abstract

The invention relates to the technical field of circuit board production equipment, and discloses a horizontal copper deposition production line and a control method.The horizontal copper deposition production line comprises a reaction tank, a spraying assembly and a controller, the spraying assembly comprises a fixing base, a driving motor and at least two spraying pipes, the fixing base is fixed to the reaction tank, and a motor support is arranged in the middle of the fixing base; the two sides of the motor frame are each provided with at least one rotating connector, the driving motor is installed on the motor support, an output shaft of the motor is connected with an eccentric rotating shaft, the eccentric rotating shaft is connected with a first connecting rod, the other end of the first connecting rod is provided with a transmission shaft, and the upper end of the motor support is provided with a horizontal sliding groove. The input end of the spraying pipe is arranged on a rotating connector, the rotating connector is provided with a flow control valve, the outer wall of the spraying pipe is connected with a second connecting rod, the other end of the second connecting rod is hinged to the transmission shaft, the spraying pipe is provided with two first spraying openings, and the controller driving motor and the flow control valve are electrically connected to the controller.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production equipment, and in particular to a horizontal copper deposition production line and a control method thereof. Background Art

[0002] Circuit boards are important electronic components, supporting bodies for electronic components, and carriers for electrical connections of electronic components. Copper plating is the abbreviation of chemical copper plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank to form a copper layer to metallize the holes, so that copper is deposited on the surface of the original insulating substrate to achieve electrical connectivity between layers. Copper plating is widely used in the production of printed circuit boards with through holes.

[0003] Existing copper deposition equipment generally includes a frame, a tank, a spray mechanism, and a transmission mechanism. The circuit board is placed horizontally on a roller for transmission, and a chemical solution is sprayed onto the circuit board through a spray device arranged above the roller. The chemical solution reacts with the copper deposition holes on the circuit board and copper is deposited in the holes. However, the existing copper deposition equipment has the following problems: the spray device is only provided with a single liquid outlet, and the contact time and amount of chemical solution of the circuit board transported on the roller are relatively small, resulting in a prolonged reaction copper deposition time, and there are differences in the copper deposition of each hole, and even defective products may be produced. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a horizontal copper deposition production line, which improves the spraying effect through structural improvement, helps to speed up the reaction, and improves the consistency of copper deposition in each hole.

[0005] The present invention also proposes a control method applied to the above-mentioned horizontal copper deposition production line.

[0006] According to the first aspect of the present invention, the horizontal copper deposition production line includes a reaction tank, a spray assembly and a controller. The reaction tank is provided with an inner cavity, and a conveying assembly is arranged in the inner cavity to convey the circuit board; the spray assembly is connected to the reaction tank, and the spray assembly includes a fixed seat, a driving motor and at least two spray pipes. The fixed seat is fixed on the reaction tank, and a motor bracket is arranged in the middle of the fixed seat. At least one rotating joint is arranged on both sides of the motor bracket, and the driving motor is installed on the motor bracket. The output shaft of the motor is connected to an eccentric rotating shaft, and the eccentric rotating shaft is connected to a first connecting rod. The other end of the first connecting rod is provided with a transmission shaft. , a horizontal sliding groove is arranged on the upper end of the motor bracket, the transmission shaft is passed through the sliding groove, the input end of the spray pipe is installed on the rotary joint, the rotary joint is provided with a flow control valve, the outer wall of the spray pipe is connected with a second connecting rod, the other end of the second connecting rod is hinged to the transmission shaft, the spray pipe is provided with two first spray ports arranged oppositely, the first spray ports are in a straight line shape and extend along the axial direction of the spray pipe, when the transmission shaft is located at the center of the sliding groove, the two first spray ports of the spray pipe are located in the same horizontal plane; the driving motor and the flow control valve of the controller are electrically connected to the controller.

[0007] The horizontal copper deposition production line according to the first embodiment of the present invention has at least the following beneficial effects: The circuit board is transported by the conveying assembly, and the liquid medicine enters the spray pipe through the rotating joint and then flows out from the two first spray ports of the spray pipe. The controller controls the operation of the driving motor of the spray assembly, and the driving motor drives the second connecting rod through the first connecting rod, thereby driving the spray pipe to rotate, so that the liquid medicine flowing out of the first spray port swings, and the spray assembly outputs multiple liquid medicines, and the liquid medicines are in a swinging state, which increases the contact time between the liquid medicine and the circuit board, and quickly covers the circuit board, speeds up the reaction of copper deposition, makes the copper deposition effects of each hole of the circuit board close, and improves product quality.

[0008] According to some embodiments of the first aspect of the present invention, a rotating disk is fixed to the output shaft of the motor, and the eccentric rotating shaft is fixed to a side of the rotating disk, and the eccentric rotating shaft deviates from the output shaft.

[0009] According to some embodiments of the first aspect of the present invention, a turntable is fixed to the output shaft of the motor, a cam groove is arranged on the periphery of the turntable, and the eccentric rotating shaft passes through the cam groove.

[0010] According to some embodiments of the first aspect of the present invention, the outer wall of the spray pipe is provided with two support ears, the two support ears are distributed on opposite sides of the spray pipe, the support ears are connected with pins, and the second connecting rod is provided with a through hole matching the pin.

[0011] According to some embodiments of the first aspect of the present invention, the spray pipe is further provided with a second spray port, the second spray port is located between the two first spray ports, and the width of the second spray port is smaller than the width of the first spray port.

[0012] According to some embodiments of the first aspect of the present invention, the reaction tank is connected to two of the spray assemblies, the two spray assemblies are arranged relatively on two opposite side walls of the inner cavity, and the spray pipes of the two spray assemblies are arranged in an alternating manner.

[0013] According to some embodiments of the first aspect of the present invention, one end of the spray pipe away from the rotary joint is an opening, and a plug is installed in the opening.

[0014] According to some embodiments of the first aspect of the present invention, the reaction tank is connected to a filtering device, the inner cavity includes a spray chamber and an immersion chamber, the spray assembly is located in the spray chamber, the liquid outlet of the filtering device is connected to the spray assembly through a pipe, the liquid return port of the filtering device is connected to the lower end of the immersion chamber through a pipe, and a plurality of guide plates are arranged in the immersion chamber, the guide plates are arranged obliquely and the end close to the spray assembly is the high end, and the two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber.

[0015] According to some embodiments of the first aspect of the present invention, a partition is arranged between the spray chamber and the immersion chamber, a liquid hole is arranged at the lower end of the partition, the guide plate is arranged in the liquid hole, and a detachable filter is connected to the lower end of the guide plate, and the filter closes the channel formed by the guide plate and the reaction tank.

[0016] According to the control method of the embodiment of the second aspect of the present invention, applied to the horizontal copper deposition production line described in the embodiment of the first aspect, the control method comprises the following steps: S100, the conveying assembly conveys a circuit board, and the circuit board moves in the inner cavity of the reaction tank; S200, the controller controls the flow control valve to start, and the liquid medicine flows out from the two first spray ports of the spray pipe and falls on the circuit board; S300, the controller controls the drive motor to start, and the drive motor drives the second connecting rod through the first connecting rod, thereby driving at least two of the spray pipes to rotate, so that the liquid medicine flowing out of the first spray port swings.

[0017] According to the control method of the embodiment of the second aspect of the present invention, in the step S200, the flow rate of the spray pipe is controlled by the flow control valve, and the flow rate of the spray pipe satisfies:

[0018] Where Q(t) is the flow rate at time t, is the basic flow rate (i.e. the lowest flow rate in the entire cycle), K is the coefficient of change of the flow rate, which is set according to the number of holes on the circuit board, T is the cycle length, that is, the length of time the circuit board passes through the spray component during the movement, and t is the current time, calculated from the start of the cycle.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which: Figure 1 A cross-sectional view of a reaction tank in an embodiment of the first aspect of the present invention; Figure 2 for Figure 1 A local enlarged view of point A; Figure 3 It is a front view of the spray assembly in the embodiment of the first aspect of the present invention; Figure 4 It is an exploded schematic diagram of a spray assembly in an embodiment of the first aspect of the present invention; Figure 5 It is a schematic diagram of the arrangement of two spray assemblies in an embodiment of the first aspect of the present invention.

[0021] The figures are as follows: Reaction tank 100, spray chamber 101, immersion chamber 102, guide plate 110, partition plate 120, liquid hole 121, filter screen 130; Spray assembly 200, fixed base 210, drive motor 220, eccentric shaft 221, first connecting rod 222, transmission shaft 223, turntable 224, spray pipe 230, first spray port 231, support ear 232, pin 233, motor bracket 240, horizontal sliding groove 241, second connecting rod 242, rotary joint 250, plug 260. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0025] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0026] It is understandable that, referring to Figures 1 to 4 The embodiment of the first aspect of the present invention proposes a horizontal copper deposition production line, which is used to perform copper deposition processing on a circuit board. After drilling, the circuit board undergoes an oxidation-reduction reaction in the horizontal copper deposition production line to form a copper layer, thereby metallizing the holes, so that copper is deposited on the surface of the originally insulating substrate to achieve electrical connectivity between layers.

[0027] The core component of the horizontal copper deposition production line is the reaction tank 100. The reaction tank 100 forms an inner cavity, and a conveying component is arranged in the inner cavity. The conveying component is used to convey the circuit board so that the circuit board moves horizontally in the inner cavity. The conveying component can be a series of chains, conveyor belts, rollers or other conveying devices, which can ensure that the circuit board moves smoothly and horizontally in the reaction tank 100 so as to contact the liquid in the tank.

[0028] Another key component of the horizontal copper deposition production line is the spray assembly 200, which is connected to the reaction tank 100 and is used to spray the liquid during the copper deposition process of the circuit board so that the liquid is sprayed on the circuit board. The spray assembly 200 includes a fixed seat 210, a drive motor 220, at least two spray pipes 230, a motor bracket 240, a rotary joint 250, an eccentric shaft 221, a first connecting rod 222, a transmission shaft 223, a sliding groove 241, a flow control valve and a second connecting rod 242.

[0029] The fixing base 210 is fixed on the reaction tank 100, a motor bracket 240 is arranged in the middle of the fixing base 210, at least one rotary joint 250 is arranged on both sides of the motor bracket 240, and the rotary joint 250 is used to connect the spray pipe 230, so that the liquid medicine can enter the spray pipe 230, and keep the seal when the spray pipe 230 rotates. The driving motor 220 is installed on the motor bracket 240, the output shaft of the driving motor 220 is connected to the eccentric shaft 221, the eccentric shaft 221 is connected to the first connecting rod 222, the other end of the first connecting rod 222 is provided with a transmission shaft 223, and the transmission shaft 223 is penetrated in the horizontal sliding groove 241 at the upper end of the motor bracket 240. The input end of the spray pipe 230 is installed on the rotary joint 250, and the rotary joint 250 is provided with a flow control valve for controlling the flow of the liquid medicine entering the spray pipe 230. It can be understood that the liquid medicine is delivered by an infusion pump, and the infusion pump is connected to the rotary joint 250 through a pipeline to input the liquid medicine into the spray pipe 230. The outer wall of the spray pipe 230 is connected with a second connecting rod 242, and the other end of the second connecting rod 242 is hinged to the transmission shaft 223. The spray pipe 230 is provided with two first spray ports 231 arranged oppositely. The first spray port 231 is in a straight line shape and extends along the axial direction of the spray pipe 230. The liquid medicine flowing out of the first spray port 231 is in a waterfall shape. The length of the first spray port 231 is set according to the width of the circuit board so that the sprayed liquid medicine can cover the entire circuit board.

[0030] Reference Figure 3 When the transmission shaft 223 is located at the center of the sliding groove 241, the two first spray ports 231 of the spray pipe 230 are located at the same horizontal plane to ensure uniform spraying. When the driving motor 220 is running, the first connecting rod 222 is driven to move through the eccentric rotating shaft 221, and the first connecting rod 222 drives the second connecting rod 242 through the transmission shaft 223. The second connecting rod 242 drives the spray pipe 230 to rotate, so that the liquid medicine flowing out of the first spray port 231 swings, and the liquid medicine flowing out of the two first spray ports 231 contacts the circuit board during the swing, which can increase the contact time and the amount of liquid medicine.

[0031] The controller is the control center of the horizontal copper deposition production line, and the drive motor 220 and the flow control valve are electrically connected to the controller. The controller can be a PLC (programmable logic controller) or similar industrial control equipment, which is used to receive operation instructions, control the start, stop and speed of the drive motor 220, and the opening, closing and adjustment of the flow control valve. The controller can be connected to an operation interface (such as a touch screen or a control panel) so that the operator can monitor the operating status of the production line and make necessary adjustments.

[0032] In the actual production process, the circuit board is first sent into the inner cavity of the reaction tank 100 by the conveying assembly, and the liquid medicine enters the spray pipe 230 through the rotary joint 250, and then flows out from the two first spray ports 231 of the spray pipe 230. The controller controls the operation of the drive motor 220 of the spray assembly 200, and the drive motor 220 drives the second connecting rod 242 through the first connecting rod 222, thereby driving the spray pipe 230 to rotate, so that the liquid medicine flowing out of the first spray port 231 swings. The spray assembly 200 has at least two spray pipes 230, outputs at least four ways of liquid medicine, and the liquid medicine is in a swinging state, which increases the contact time between the liquid medicine and the circuit board, and the liquid medicine quickly covers the circuit board, speeds up the reaction copper deposition, makes the copper deposition effect of each hole of the circuit board close, and improves the product quality. The horizontal copper deposition production line realizes automated and efficient copper deposition processing, improves the production quality and consistency of the circuit board. In addition, the spray assembly 200 is assembled as an integral component and can be applied to the existing horizontal copper deposition production line. According to the layout of the horizontal copper deposition production line, a suitable number of horizontal copper deposition production lines can be selected and installed, making it suitable for circuit board manufacturing companies of various sizes.

[0033] Reference Figure 4 In some embodiments of the present invention, the connection method of the drive motor 220 and the first connecting rod 222 in the horizontal copper deposition production line is specifically defined. The output shaft of the drive motor 220 is fixed with a turntable 224, which is a key component connecting the drive motor 220 and the eccentric shaft 221. The turntable 224 is usually made of a solid material, such as steel or aluminum alloy, to ensure stability and durability during high-speed rotation. The eccentric shaft 221 is fixed to the side of the turntable 224 and deviates from the center line of the output shaft of the drive motor 220. The eccentric design makes the eccentric shaft 221 reciprocate with a fixed eccentricity when the turntable 224 rotates, and is transmitted to the transmission shaft 223 through the first connecting rod 222, so that the transmission shaft 223 reciprocates in the horizontal sliding groove 241, thereby driving the spray pipe 230 to reciprocate. The eccentricity of the eccentric shaft 221 can be adjusted as needed, for example, by replacing the turntable 224 of different sizes to control the amplitude and speed of the rotation of the spray pipe 230 .

[0034] During the operation of the horizontal copper deposition production line, after the motor is started, the output shaft drives the turntable 224 to rotate. The rotation of the turntable 224 drives the first connecting rod 222 to produce reciprocating motion through the eccentric shaft 221. The first connecting rod 222 is transmitted to the second connecting rod 242 through the transmission shaft 223, so that the spray pipe 230 reciprocates within a certain angle range, thereby causing the liquid flowing out of the first spray port 231 to swing, which can cover a wider area, thereby spraying the circuit board more evenly and efficiently.

[0035] It is understandable that in order to achieve precise spray control, the controller can adjust the speed of the drive motor 220, thereby controlling the rotation speed of the turntable 224 and the reciprocating speed of the eccentric shaft 221. The operator can adjust the spray speed and range according to the type of circuit board and the characteristics of the copper plating liquid to achieve the best copper plating effect.

[0036] In other embodiments of the present invention, the turntable of the output shaft of the driving motor 220 in the horizontal copper deposition production line is of another design, and a cam groove is arranged on the periphery of the turntable, and the cam groove is a through groove, and the shape and size of the cam groove are designed to be adapted to the eccentric shaft 221. The eccentric shaft 221 is inserted into the cam groove, and the center line of the eccentric shaft 221 deviates from the center line of the turntable. The eccentric design enables the eccentric shaft 221 to generate reciprocating displacement motion along the cam groove when the turntable is driven by the motor to rotate, and is transmitted to the transmission shaft 223 through the first connecting rod 222, so that the transmission shaft 223 reciprocates in the horizontal sliding groove 241, thereby driving the spray pipe 230 to reciprocate, and realizing uniform spraying of the circuit board.

[0037] In actual applications, the rotation speed of the turntable and the eccentricity of the eccentric shaft 221 can be precisely controlled to adjust the rotation speed and amplitude of the spray pipe 230. The operator can adjust the operating parameters of the spray assembly 200 according to different copper deposition requirements and circuit board sizes to achieve the best copper deposition effect.

[0038] It is understandable that there are other solutions for the connection structure between the second connecting rod 242 and the spray pipe 230, such as a cable is arranged around the outer wall of the spray pipe 230, one end of the cable is fixed to the spray pipe 230, and the other end is fixed to the second connecting rod 242. When the second connecting rod 242 moves with the transmission shaft 223, the spray pipe 230 can be pulled to rotate by the cable, and a torsion spring is arranged between the spray pipe 230 and the fixed seat 210, and the spray pipe 230 is driven to reset by the force provided by the torsion spring, which can also realize the rotation of the spray pipe 230. Alternatively, the second connecting rod 242 is set as a cable, the cable is wound around the spray pipe 230 for one circle and fixed, the cable moves with the transmission shaft 223, and the spray pipe 230 can be pulled to rotate, and a torsion spring is arranged between the spray pipe 230 and the fixed seat 210, and the spray pipe 230 is driven to reset by the force provided by the torsion spring.

[0039] Reference Figure 4In some embodiments of the present invention, the structure of the spray pipe 230 is specifically defined. The outer wall of the spray pipe 230 is provided with two lugs 232. The two lugs 232 are distributed on opposite sides of the spray pipe 230. Each lug 232 is connected to a pin 233, and the pin 233 is connected to the second connecting rod 242. It can be understood that the spray pipe 230 is provided with two lugs 232, which can improve the versatility. The spray pipe 230 can be installed on the left or right rotating joint 250, and the lugs 232 at the corresponding position can be used, which improves the assembly speed, and can also reduce the specifications and reduce the production cost when producing the spray pipe 230. The second connecting rod 242 is provided with a through hole that matches the pin 233. The pin 233 passes through the through hole and is installed on the lug 232. The second connecting rod 242 can rotate relative to the pin 233. The pin 233 can be a screw, one section of which is a smooth section without threads, and the smooth section is inserted into the through hole of the second connecting rod 242 to meet the requirement of free rotation of the second connecting rod 242; or, the pin 233 can also be a rivet, which itself is a smooth cylindrical shape and cooperates with the through hole of the second connecting rod 242 to meet the requirement of free rotation of the second connecting rod 242.

[0040] It is understood that in some embodiments of the present invention, in addition to the two first spray ports 231 arranged relatively, the spray pipe 230 is also provided with a second spray port, and the second spray port is located in the middle of the two first spray ports 231. This layout helps to provide more uniform and comprehensive spray coverage. The width of the second spray port is designed to be smaller than the width of the first spray port 231, mainly considering that the second spray port is located on the lower side of the spray pipe 230. Under the influence of gravity, the second spray port outputs the liquid the fastest. Therefore, the width of the second spray port is set to be smaller to balance the amount of liquid output, thereby optimizing the distribution of liquid output from each spray port, so that the liquid falls on the circuit board more evenly, thereby improving the efficiency and quality of the copper deposition process. By adding a second spray port, the amount of liquid output can be further increased. When the spray pipe 230 reciprocates, the three-way liquid swings and falls on the circuit board, accelerating the speed of contact between the liquid and the circuit board and increasing the contact area. Of course, the number of second spray ports can also be two, three, or more, depending on the size of the circuit board, the number of openings and the operating speed of the horizontal copper deposition production line. It can be adjusted. Since the spray pipe 230 is detachable, it can be achieved by replacing the spray pipe 230 of different specifications, which is simple and easy to use.

[0041] In addition, by adjusting the position and width of the second spray port, it can be optimized according to the size and shape of different circuit boards to meet different production needs. The flexibility of the structure enables the horizontal copper deposition production line to adapt to changing production scenarios and improve the versatility and practicality of the production line.

[0042] It is understood that in some embodiments of the present invention, the end of the spray pipe 230 away from the rotary joint 250 is designed to be open. This design allows the spray pipe 230 to be more convenient for maintenance and inspection. In order to ensure the sealing of the spray pipe 230 in use, a plug 260 is installed in the opening. The plug 260 is usually made of corrosion-resistant materials, such as stainless steel or engineering plastics, to adapt to potentially corrosive chemical environments. The design of the plug 260 ensures that it can be tightly matched with the opening of the spray pipe 230 to prevent the liquid from leaking or external contaminants from entering the spray pipe 230. When maintenance or inspection is required, the plug 260 can be easily removed, and a threaded connection can be used and a sealing ring can be used to prevent leakage. The opening of the spray pipe 230 and the plug 260 are equipped to help reduce maintenance time and improve the operating efficiency of the production line. When the spray pipe 230 needs to be inspected or cleaned, the plug 260 can be quickly removed, and finally the plug 260 can be reinstalled to restore the spray pipe 230 to a working state.

[0043] Reference Figure 5 Considering the acceleration and uniformity of spraying, in some embodiments of the present invention, two spray assemblies 200 can be used in combination, that is, the reaction tank 100 is connected to two spray assemblies 200, and the two spray assemblies 200 are arranged relatively on the two opposite side walls of the inner cavity of the reaction tank 100. The spray assembly 200 uses two spray pipes 230 as an example for explanation. The spray pipes 230 of the two spray assemblies 200 are staggered, which means that along the conveying direction of the circuit board, there are four spray pipes 230 to spray the circuit board. The staggered spray pipes 230 help to achieve more comprehensive spray coverage, ensuring that each part of the circuit board can be quickly covered by the liquid medicine, which can reduce the copper deposition defects caused by uneven spraying. Of course, the spray assembly 200 using three spray pipes 230 or more spray pipes 230 can also be staggered, which also meets the use requirements. In actual applications, the design of the spray assembly 200 allows the operator to adjust the position and layout of the spray pipe 230 according to the size and shape of the circuit board to achieve the best spray effect. Moreover, each spray pipe 230 has three or more output ports, and the sprayed liquid swings under the drive of the spray pipe 230, which can fully cover the circuit board and accelerate the reaction of copper deposition.

[0044] Reference Figure 1 In some embodiments of the present invention, the connection method between the reaction tank 100 and the filtering device is defined. The reaction tank 100 is connected with the filtering device in order to recover and clean the liquid medicine and prevent impurities from entering the copper deposition process, thereby ensuring the product quality of the circuit board.

[0045] The inner cavity of the reaction tank 100 is divided into two parts: a spray chamber 101 and an immersion chamber 102. The spray assembly 200 is located in the spray chamber 101, and the liquid outlet of the filter device is connected to the spray assembly 200 through a pipeline. An infusion pump is usually provided to transport and pressurize the liquid medicine. The filter device is used to filter out impurities in the liquid medicine to ensure the cleanliness of the liquid medicine. The return port of the filter device is connected to the lower end of the immersion chamber 102 through a pipeline, so that the liquid after the reaction can flow back to the filter device for recycling. The position of the conveying assembly in the immersion chamber 102 is relatively low, so that the circuit board can be immersed in the liquid medicine, further improving the copper deposition effect.

[0046] It is understandable that, considering that the circuit board will carry some particles after the holes are processed, and the copper produced by the reaction will also fall off, there is a certain amount of impurities in the liquid medicine, and a plurality of guide plates 110 are arranged in an inclined manner. The end of the guide plate 110 close to the spray assembly 200 is the high end. When the impurities written in the liquid medicine flow, due to the difference in specific gravity, the impurities will gather at the bottom. The guide plate 110 plays a guiding and blocking role, prompting the impurities to flow along the bottom surface of the immersion chamber 102, and finally enter the filter device, and the filter device is used to filter out the impurities. The two sides of the guide plate 110 are respectively fixedly connected to the opposite side walls of the immersion chamber 102, which can prevent the impurities from moving upward and increase the stability of the structure.

[0047] The length, placement angle, number of groups and water entry depth of the guide plate 110 will affect the diversion effect. For example, the length of the guide plate 110 can be selected to be 30m-50m, and the placement angle can be 30°-60°, which can be adjusted according to the flow rate of the liquid medicine.

[0048] Reference Figure 1 Furthermore, a partition 120 is provided between the spray chamber 101 and the immersion chamber 102. The partition 120 serves to isolate the two chambers. The partition 120 is provided with a liquid through hole 121 so that the liquid can flow between the two chambers. A guide plate 110 is also arranged in the liquid through hole 121. A detachable filter screen 130 is connected to the lower end of the guide plate 110. The function of the filter screen 130 is to prevent solid impurities from passing through, which is conducive to reducing impurities entering the immersion chamber 102. The detachable design of the filter screen 130 allows easy disassembly when cleaning or replacement is required, which is helpful for maintenance and servicing.

[0049] It is understandable that the guide plate 110 in the immersion chamber 102 can also be equipped with a filter 130 to gradually filter out impurities. Multiple filter screens 130 can be set to gradually increase the mesh size so that the liquid that finally flows into the filter device does not contain particulate impurities.

[0050] The embodiment of the second aspect of the present invention provides a control method, which is applied to the horizontal copper deposition production line of the embodiment of the first aspect, and the control method includes the following steps: S100: The conveying component conveys the circuit board, and the circuit board moves in the inner cavity of the reaction tank 100. The conveying component moves at a set speed to ensure that the circuit board moves smoothly in the inner cavity of the reaction tank 100. The circuit board is conveyed under the spraying component 200 to receive the spray of the liquid medicine.

[0051] S200: The controller controls the flow control valve to start, and the liquid medicine flows out from the two first spray ports 231 of the spray pipe 230 and falls on the circuit board. The flow control valve is responsible for adjusting the flow of the liquid medicine to ensure that the liquid medicine is sprayed out from the spray port with appropriate pressure and flow. The controller adjusts the opening of the flow control valve according to the preset program or the operator's instructions to control the flow of the liquid medicine. This step is the key in the copper deposition process and directly affects the distribution of the liquid medicine on the circuit board.

[0052] S300: The controller controls the drive motor 220 to start, and the drive motor 220 drives the second connecting rod 242 through the first connecting rod 222, thereby driving at least two spray pipes 230 to rotate, so that the liquid medicine flowing out of the first spray port 231 swings. The spray pipe 230 reciprocates, so that the sprayed liquid medicine swings, which helps the liquid medicine to cover the circuit board more evenly, increases the contact time between the liquid medicine and the circuit board, and the liquid medicine quickly covers the circuit board, speeds up the reaction copper deposition, and makes the copper deposition effect of each hole of the circuit board close, thereby improving the product quality. The horizontal copper deposition production line realizes automated and efficient copper deposition processing, and improves the production quality and consistency of the circuit board.

[0053] The controller can be an advanced PLC system, which automatically adjusts the working parameters of the flow control valve and the drive motor 220 according to the type, size and required copper deposition quality of the circuit board. In addition, the controller can also monitor the status of the production line in real time, including the temperature of the chemical solution, the chemical concentration in the reaction tank 100 and the moving speed of the circuit board to ensure the stability and consistency of the copper deposition process.

[0054] In some embodiments of the second aspect of the present invention, in step S200, the flow rate of the spray pipe 230 is controlled by the flow control valve, and the flow rate of the spray pipe 230 satisfies:

[0055] Where Q(t) is the flow rate at time t, is the basic flow rate (i.e., the lowest flow rate in the entire cycle), K is the coefficient of change of the flow rate, which is set according to the number of holes on the circuit board, T is the cycle length, that is, the length of time the circuit board passes through the spray assembly 200 during movement, and t is the current time, which is calculated from the start of the cycle. The flow rate of the spray pipe 230 is controlled according to the above equation, so that in the initial and final sections where the circuit board contacts the liquid medicine, the flow rate of the liquid medicine sprayed out by the spray pipe 230 is relatively large, while the flow rate of the liquid medicine sprayed out in the middle section is relatively small. The liquid medicine flow rate in the initial section is large, which can quickly cover the circuit board and speed up the reaction; the flow rate in the middle section is small, which is conducive to saving liquid medicine, because there is already liquid medicine on the circuit board at this time; the increase in the liquid medicine flow rate in the latter section is to increase the copper deposition to the holes at the rear end of the circuit board. The time these holes contact the liquid medicine is relatively short, so the flow rate of the liquid medicine is increased to make the copper deposition more uniform.

[0056] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Horizontal copper deposition production line, characterized in that: include: A reaction tank, wherein the reaction tank is provided with an inner cavity, and a conveying component is arranged in the inner cavity to convey the circuit board; A spray assembly is connected to the reaction tank, the spray assembly comprises a fixed seat, a driving motor and at least two spray pipes, the fixed seat is fixed on the reaction tank, a motor bracket is arranged in the middle of the fixed seat, at least one rotating joint is arranged on both sides of the motor bracket, the driving motor is installed on the motor bracket, the output shaft of the motor is connected with an eccentric rotating shaft, the eccentric rotating shaft is connected with a first connecting rod, the other end of the first connecting rod is provided with a transmission shaft, a horizontal sliding groove is arranged on the upper end of the motor bracket, the transmission shaft is penetrated in the sliding groove, the input end of the spray pipe is installed on the rotating joint, the rotating joint is provided with a flow control valve, the outer wall of the spray pipe is connected with a second connecting rod, the other end of the second connecting rod is hinged to the transmission shaft, the spray pipe is provided with two first spray ports arranged oppositely, the first spray port is in a straight line shape and extends along the axial direction of the spray pipe, when the transmission shaft is located at the center of the sliding groove, the two first spray ports of the spray pipe are located in the same horizontal plane; A controller, wherein the driving motor and the flow control valve are electrically connected to the controller.

2. The horizontal copper deposition production line according to claim 1, characterized in that: A rotating disk is fixed to the output shaft of the motor, and the eccentric rotating shaft is fixed to the side of the rotating disk, and the eccentric rotating shaft deviates from the output shaft.

3. The horizontal copper deposition production line according to claim 1, characterized in that: A rotating disk is fixed to the output shaft of the motor, a cam groove is arranged on the periphery of the rotating disk, and the eccentric rotating shaft passes through the cam groove.

4. The horizontal copper deposition production line according to claim 1, characterized in that: The outer wall of the spray pipe is provided with two support ears, the two support ears are distributed on opposite sides of the spray pipe, the support ears are connected with pins, and the second connecting rod is provided with a through hole matching the pins.

5. The horizontal copper deposition production line according to claim 1, characterized in that: The spray pipe is further provided with a second spray port, which is located between the two first spray ports, and the width of the second spray port is smaller than the width of the first spray port.

6. The horizontal copper deposition production line according to claim 1, characterized in that: The reaction tank is connected to two spray assemblies, which are arranged opposite to each other on two opposite side walls of the inner cavity, and the spray pipes of the two spray assemblies are arranged in a staggered manner.

7. The horizontal copper deposition production line according to claim 1, characterized in that: The reaction tank is connected to a filtering device, the inner cavity includes a spray chamber and an immersion chamber, the spray assembly is located in the spray chamber, the liquid outlet of the filtering device is connected to the spray assembly through a pipeline, and the liquid return port of the filtering device is connected to the lower end of the immersion chamber through a pipeline, and a plurality of guide plates are arranged in the immersion chamber, the guide plates are arranged obliquely and the end close to the spray assembly is the high end, and the two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber.

8. The horizontal copper deposition production line according to claim 7, characterized in that: A partition is arranged between the spray chamber and the immersion chamber, a liquid hole is arranged at the lower end of the partition, the guide plate is arranged in the liquid hole, a detachable filter is connected to the lower end of the guide plate, and the filter closes the channel formed by the guide plate and the reaction tank.

9. A control method, applied to a horizontal copper deposition production line as claimed in any one of claims 1 to 8, characterized in that: The control method comprises the following steps: S100, the conveying assembly conveys a circuit board, and the circuit board moves in the inner cavity of the reaction tank; S200, the controller controls the flow control valve to start, and the liquid medicine flows out from the two first spray ports of the spray pipe and falls on the circuit board; S300, the controller controls the drive motor to start, and the drive motor drives the second connecting rod through the first connecting rod, thereby driving at least two of the spray pipes to rotate, so that the liquid medicine flowing out of the first spray port swings.

10. The control method according to claim 9, characterized in that: In the step S200, the flow rate of the spray pipe is controlled by the flow control valve, and the flow rate of the spray pipe satisfies: Where Q(t) is the flow rate at time t, is the basic flow rate (i.e. the lowest flow rate in the entire cycle), K is the coefficient of change of the flow rate, which is set according to the number of holes on the circuit board, T is the cycle length, that is, the length of time the circuit board passes through the spray component during the movement, and t is the current time, calculated from the start of the cycle.

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