Semiconductor manufacturing apparatus and method for controlling the same

Abstract

Various embodiments of the present invention relate to a semiconductor manufacturing apparatus, which may include: a plurality of cups for collecting a chemical substance sprayed during a process; the motor driving module is used for driving a motor to adjust the vertical position of the cup part; the pressure valves are used for driving an air cylinder to adjust the vertical position of the cup part; and a processor for controlling the motor driving module and the pressure valve.

Description

Technical Field

[0001] Various embodiments of the present invention relate to a semiconductor manufacturing apparatus and a control method thereof. Background Art

[0002] Generally, a plurality of patterns formed on a semiconductor substrate can be formed by a photolithography process, which may include a resist coating process, an exposure process, a development process, and a cleaning process.

[0003] Generally, the cleaning process can be performed by a single cleaning device, which may include a spin chuck for fixing the wafer, a chemical nozzle for supplying chemicals to the wafer, and a cup (or processing cup) surrounding the spin chuck and connected to a waste liquid pipe and an exhaust gas pipe at the bottom.

[0004] The background technology of the present invention has been disclosed in Korean Patent Publication No. 10-2021-0128290 (published on October 26, 2021, cup cleaning device and working method thereof). Summary of the invention

[0005] The cup is used to recover the chemical substances sprayed for wafer processing, and its inflow portion is located on the upper side of the wafer. Therefore, when the processing process of the wafer is changed, the chemical substances generated during the processing process may be scattered and mixed with the chemical substances used in other processing processes, which may increase the cost for processing the chemical substances. Therefore, a technical solution for preventing different chemical substances from mixing in the semiconductor manufacturing process is needed.

[0006] Embodiments of the present invention relate to an apparatus and method for preventing different chemical substances from mixing or contaminating the inside or outside of a semiconductor manufacturing apparatus by preventing chemical substances such as cleaning liquid and ultrapure water from scattering during a semiconductor manufacturing process.

[0007] A semiconductor manufacturing device according to one embodiment of the present invention is characterized in that it includes: a plurality of cups for recovering chemicals sprayed during a process; a motor drive module for driving a motor to adjust the upper and lower positions of the cups; a plurality of pressure valves for driving a cylinder to adjust the upper and lower positions of the cups; and a processor for controlling the motor drive module and the pressure valves.

[0008] The present invention is characterized in that, according to the process stage, the processor controls the motor drive module and the pressure valve to adjust designated individual cup parts among the multiple cup parts from the initial position to respective positions corresponding to the process stage, and when the current process is completed, the multiple cup parts are adjusted to the initial position.

[0009] The present invention is characterized in that the processor adjusts the position of at least one of the multiple cups through a motor, and adjusts the positions of the remaining cups of the multiple cups whose positions are not adjusted by the motor through a hydraulic cylinder connected to the pressure valve.

[0010] The present invention is characterized in that the multiple cup parts include a first cup part, a second cup part and a third cup part. When the current process is a first-stage process of recovering chemical substances through the first cup part, the processor adjusts the rotation of the motor connected to the first cup part so that the inlet of the first cup part is located at a specified height on the upper side of the wafer. When the anti-scattering cup part mode is further executed in the first-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup part to the upper side and higher than the specified position of the wafer, and the second cup part and the third cup part maintain their previous initial positions.

[0011] The present invention is characterized in that the multiple cup parts include a first cup part, a second cup part and a third cup part. When the current process is a second-stage process of recovering chemical substances through the second cup part, the processor adjusts the stroke of multiple hydraulic cylinders connected to the second cup part so that the inlet of the second cup part is located at a specified height on the upper side of the wafer, and controls the rotation of the motor so that when the second cup part moves upward while the first cup part maintains an initial interval with the second cup part, the first cup part moves upward at the same time. When the anti-scattering cup part mode is further executed in the second-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup part to the upper side and higher than the specified position of the wafer, and the third cup part maintains the previous disposal position.

[0012] The present invention is characterized in that the multiple cup parts include a first cup part, a second cup part and a third cup part. When the current process is a third-stage process of recovering chemical substances through the third cup part, the processor adjusts the stroke of multiple hydraulic cylinders connected to the third cup part so that the inlet of the third cup part is located at a specified height on the upper side of the wafer, and adjusts the rotation of the motor and the stroke of the hydraulic cylinder so that when the third cup part moves upward while the first cup part and the second cup part maintain an initial interval, the first cup part and the second cup part move upward at the same time. When the anti-scattering cup part mode is further executed in the third-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup part to the upper side and higher than the specified position of the wafer.

[0013] The present invention is characterized in that the processor uses a specified first control method to quickly control the control speed of the cup part from the current position to the target position. When the position of the cup part has not entered the position completion determination interval, the processor continues to use the first control method to adjust the position of the cup part. When the position of the cup part enters the position completion determination interval, the processor uses the second control method to stably adjust the position of the cup part.

[0014] The present invention is characterized in that the position determination completion interval is an interval obtained by adding a specified margin to the target position of the cup portion.

[0015] The present invention is characterized in that the first control mode includes a closed-loop control mode, and the second control mode includes an open-loop control mode.

[0016] A control method for a semiconductor manufacturing device according to another embodiment of the present invention is characterized in that it includes the following steps: recovering the chemical substances sprayed during the process through multiple cups; driving a motor through a motor drive module to adjust the upper and lower positions of the cups; driving a cylinder through multiple pressure valves to adjust the upper and lower positions of the cups; and controlling the motor drive module and the pressure valve through a processor.

[0017] Multiple embodiments of the present invention have the following effects. In a semiconductor manufacturing process, the positions of multiple cups for recovering chemicals sprayed to process wafers can be adjusted individually, and the positions of the cups can be adjusted quickly and stably. At the same time, the cups can be adjusted separately using motors and hydraulic cylinders. This prevents chemicals such as cleaning fluids and ultrapure water from scattering, and prevents the size or volume of the device for controlling the cups from increasing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is an illustrative diagram showing a schematic structure of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0019] Figure 2 The present invention is an illustrative diagram for explaining a method of controlling a motor and a hydraulic cylinder for adjusting a position of a cup portion in a manufacturing device according to an embodiment of the present invention.

[0020] Figure 3 The figure is an exemplary diagram for explaining a method for adjusting the height of a cup portion in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0021] Figure 4 The flowchart is used to explain a method for adjusting the height of a cup portion according to a semiconductor manufacturing process in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0022] Description of Reference Numerals

[0023] 100: control device; 110: processor; 120: pressure valve; 130: sensor module; 140: motor drive module; 150: communication module; 160: storage module; CY: cylinder; M: motor; 301-303: cup part. DETAILED DESCRIPTION

[0024] The following is a description of multiple embodiments in this specification with reference to the accompanying drawings. The embodiments and the terms used therein do not limit the technology recorded in this specification to a specific embodiment, but should be understood to include multiple changes, equivalent technical solutions and / or alternative technical solutions of the corresponding embodiments. In conjunction with the accompanying drawings, similar structures may be marked with similar figure marks. Unless the context clearly indicates other meanings, singular expressions include plural expressions. In this specification, expressions such as "A or B" or "at least one of A and / or B" may include all possible combinations of the listed items. Expressions such as "first", "second", "first" or "second" may modify the corresponding structural elements regardless of order or importance, and are only used to distinguish one structural element from another structural element, but do not limit the corresponding structural elements. When referring to a certain (e.g., first) structural element and another (e.g., second) structural element "(functional or communicative) connection" or "connection", the certain structural element may be directly connected to the other structural element, or may be connected through other structural elements (e.g., third structural elements).

[0025] In this specification, for example, depending on the circumstances, "configured to" may be used interchangeably with "suitable for", "capable of", "changed to", "formed to", "capable of performing", or "designed to perform" in terms of hardware or software. In certain cases, expressions such as "a device configured to perform" may mean that the device "can perform" together with other devices or components. For example, the sentence "a processor configured to perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing the corresponding tasks or a general-purpose processor (e.g., a CPU or an application processor) that can perform the corresponding tasks by running at least one software program stored in a storage module device.

[0026] Figure 1 This is an illustrative diagram showing a schematic structure of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0027] Reference Figure 1The control device 100 (hereinafter referred to as the control device) of the semiconductor manufacturing device may include a processor 110, a pressure valve 120 (or a pressure pneumatic valve), a sensor module 130, a motor driving module 140, a communication module 150 and a storage module 160. However, the present invention is not limited thereto.

[0028] For example, the control device 100 may further include a hydraulic cylinder CY and a motor M for respectively adjusting the positions of the plurality of cup portions, an input device (not shown) for receiving input, and / or an output device (not shown) for outputting information.

[0029] According to various embodiments, the processor 110 may drive an operating system or an application program to control a plurality of hardware or software structural elements connected to the processor 110 , and may perform various data processing and calculations.

[0030] According to an embodiment, the processor 110 may be implemented as a system on chip (SoC). In addition, the processor 110 may load instructions or data received from at least one of the other structural elements into the storage module 160 and process the instructions or data, and may store various data in the storage module 160.

[0031] Furthermore, according to an embodiment, when a wafer is loaded onto a chuck stage device (not shown), information related to the process flow can be identified from the storage module 160. Furthermore, according to the process flow, in the semiconductor manufacturing process, the processor 110 can prevent the location other than the liquid contact part from being contaminated by the chemical substances such as cleaning liquid and ultrapure water scattering to the outside of the cup part through the anti-scattering cup part mode, which is a mode for preventing the chemical substances sprayed for processing the wafer from scattering.

[0032] For example, when a wafer ( Figure 3 When the information W in the chuck table device is loaded into the chuck table device, the processor 110 can identify that the current process is a first stage process of recovering chemical substances through a first cup part among a plurality of cup parts based on the information related to the process flow.

[0033] Furthermore, the processor 110 may further execute an anti-scattering cup mode in the first stage process to prevent chemicals such as the cleaning solution and ultrapure water from scattering outside the cup.

[0034] For another example, when receiving information indicating that a wafer has been loaded onto the chuck stage device through the communication module 150 , the processor 110 may identify the current process as a second-stage process of recovering chemicals through a second cup among the plurality of cups based on information related to the process flow.

[0035] Furthermore, the processor 110 may further execute an anti-scattering cup mode in the second stage process to prevent the cleaning solution, ultrapure water and other chemical substances from scattering outside the cup.

[0036] For another example, when the processor 110 receives information indicating that a wafer has been loaded onto the chuck stage device, the processor 110 may identify the current process as a third stage process of recovering chemicals through a third cup among the plurality of cups based on information related to the process flow.

[0037] Furthermore, the processor 110 may further execute an anti-scattering cup mode during the third stage process to prevent the cleaning solution, ultrapure water and other chemicals from scattering outside the cup.

[0038] According to one embodiment, information related to the process flow may be received through the communication module 150 and / or an input device (not shown) and stored in the storage module 160 .

[0039] According to one embodiment, when the wafer is loaded on the chuck stage device, the positions of the plurality of cups (e.g., the first to third cups) for recovering the chemical substances sprayed for processing the wafer fixed on the chuck stage device may be lower than the home position (or initial position) of the wafer (refer to Figure 3 original position in the image).

[0040] According to one embodiment, the first cup portion ( Figure 3 The inlet of 301) may be located in the second cup portion ( Figure 3 302) on the upper side of the inlet, the second cup portion ( Figure 3 The inlet of 302) may be located at the third cup portion ( Figure 3 The upper side of the inlet of 303).

[0041] According to one embodiment, each cup portion may be in a shape surrounding the chuck table device, and may be arranged to be concentric with the chuck table device.

[0042] According to various embodiments, the processor 110 may control the pressure valve 120 and the motor driving module 140 based on information related to the process flow to adjust the positions of the plurality of cups.

[0043] For example, in the case where the current process is a first-stage process of recovering chemical substances through the first cup part among the plurality of cup parts (refer to Figure 3 In part (a) of FIG. 1 ), the processor 110 can control the motor driving module 140 so that the inlet of the first cup portion 301 among the multiple cup portions is located at a specified height (e.g., 20 mm) on the upper side of the wafer, and can control the pressure valve 120 so that the second cup portion and the third cup portion are located at the initial positions.

[0044] Furthermore, the processor 110 can further execute the anti-scattering cup mode by controlling the motor driving module 140 in the first stage process, thereby making the first cup 301 separated from the upper side of the second cup 302 and located at a designated upper side position (the position can be determined by experiment) higher than the wafer W, thereby preventing the cleaning liquid and ultrapure water and other chemical substances from scattering outside the cup (refer to Figure 3 (b) in the text).

[0045] For another example, in the case where the current process is a second-stage process of recovering chemical substances through a second cup portion among a plurality of cup portions (refer to Figure 3 In part (c) of the figure), the processor 110 can control the pressure valve 120 so that the inlet of the second cup part 302 among the multiple cup parts is located at a specified height on the upper side of the wafer. When the first cup part 301 and the second cup part 302 maintain a specified interval, as the second cup part 302 moves, the first cup part 301 moves upward at the same time, so that the third cup part is located at the initial position.

[0046] Furthermore, the processor 110 further executes the anti-scattering cup mode by controlling the motor driving module 140 in the second stage process, thereby making the first cup 301 separated from the upper side of the second cup 302 and located at a position higher than the upper side of the wafer W (the position can be determined by experiments), thereby preventing the cleaning liquid and ultrapure water and other chemical substances from scattering outside the cup (refer to Figure 3 (d) in the text).

[0047] For another example, when the current process is a third stage process of recovering chemical substances through a third cup portion among a plurality of cup portions (refer to Figure 3 In part (e) of the figure), the processor 110 adjusts the stroke of the multiple hydraulic cylinders connected to the third cup portion 303 (for example, adjusts the stroke to 40 mm), so that the inlet of the third cup portion 303 among the multiple cup portions is located at a specified height (for example, 20 mm) on the upper side of the wafer, and adjusts the rotation of the motor M and the stroke of the hydraulic cylinder so that when the third cup portion 303 moves upward while the first cup portion 301 and the second cup portion 302 maintain an initial interval, the first cup portion 301 and the second cup portion 302 move upward at the same time.

[0048] Furthermore, the processor 110 further executes the anti-scattering cup mode by controlling the motor driving module 140 in the third stage process, thereby making the first cup 301 separated from the upper side of the second cup 302 and located at a position higher than the upper side of the wafer W (the position can be determined by experiments), thereby preventing the cleaning liquid and ultrapure water and other chemical substances from scattering outside the cup (refer to Figure 3 (f) in the text).

[0049] According to one embodiment, while controlling the pressure valve 120, the processor 110 can identify the rod position of the hydraulic cylinder CY connected to the pressure valve 120 and the position of the rod (not shown) working through the motor M through the sensor module 130, and can determine whether the cup height adjusted by the pressure valve 120 and the cup height adjusted by the motor drive module 140 have reached the target position based on the identified positions.

[0050] After the processor 110 adjusts the positions of the plurality of cups based on the information related to the process flow, if the process flow is completed, the pressure valve 120 and the motor driving module 140 may be controlled so that the plurality of cups are located at the original positions.

[0051] According to multiple embodiments, when a control instruction to clean at least one of the multiple cup portions is received through the communication module 150 and / or the input device (not shown), the processor 110 can control the motor drive module 140 and the pressure valve 120 to adjust the position of at least one of the multiple cup portions.

[0052] For example, when a control instruction to clean the first cup part among multiple cup parts is received, the processor 110 can control the motor driving module 140 so that the position of the first cup part 301 is adjusted to a position where cleaning can be performed (for example, the inlet of the cup part is located at a height of 15mm or 10mm on the upper side of the wafer). For another example, when a control instruction to clean the second cup part among multiple cup parts is received, the processor 110 can control the pressure valve 120 so that the position of the second cup part 302 is adjusted to a position where cleaning can be performed. For another example, when a control instruction to clean the third cup part 303 among multiple cup parts is received, the processor 110 can control the pressure valve 120 so that the position of the third cup part 303 is adjusted to a position where cleaning can be performed.

[0053] According to various embodiments, when the positions of at least a portion of the plurality of cup parts are not adjusted to the positions corresponding to the current process, the processor 110 may send a notification signal to an external device through the communication module 150 .

[0054] For example, when the positions of the plurality of cup portions are not adjusted to the positions corresponding to the current process within a specified time, the processor 110 may send a notification signal to an external electronic device (not shown) through the communication module 150 so that the user of the control device 100 may understand the situation.

[0055] According to various embodiments, the motor driving module 140 and the pressure valve 120 may adjust the positions of the plurality of cups, respectively.

[0056] For example, the pressure valve 120 (or pressure pneumatic valve) can be connected to multiple hydraulic cylinders CY, and the motor drive module 140 can be connected to at least one motor M. The hydraulic pressure supplied to the multiple hydraulic cylinders can be adjusted according to the control of the processor 110, and the driving current applied to each motor M can be adjusted, thereby adjusting the position of the cup connected to each hydraulic cylinder CY and motor M respectively.

[0057] According to various embodiments, the sensor module 130 may be provided at each of the plurality of hydraulic cylinders CY, detect the position of the respective rods of the plurality of hydraulic cylinders CY, and transmit information related to the detected rod positions to the processor 110 .

[0058] Furthermore, the sensor module 130 may be respectively provided at least one motor M, detects the position of the rod driven by the motor M, and provides information related to the detected rod position to the processor 110. Thus, the processor 110 may adjust the hydraulic pressure of the hydraulic cylinder CY or adjust the rotation of the motor M corresponding to the rod position detected by the sensor module 130.

[0059] According to various embodiments, the communication module 150 may form a wired communication channel and / or a wireless communication channel between the control device 100 and an external electronic device (not shown), and perform data communication through the formed communication channel.

[0060] According to one embodiment, the communication module 150 may receive information related to the process flow from an external electronic device.

[0061] In the above, it is assumed that there are three cups (for example, the first cup, the second cup, and the third cup) used in the semiconductor manufacturing process, but the present invention is not limited to this. For example, the number of cups used in the semiconductor manufacturing process may be greater than or less than three, and in each case, the position of the cups may be adjusted by the same or similar method as described above. In addition, in this embodiment, the first cup is controlled by the motor M and the second and third cups are controlled by the hydraulic cylinder CY. However, the first, second, and third cups may all be controlled by the motor M, or the second or third cup may be controlled by the motor M.

[0062] Figure 2 The present invention is an illustrative diagram for explaining a method of controlling a motor and a hydraulic cylinder for adjusting a position of a cup portion in a manufacturing device according to an embodiment of the present invention.

[0063] Reference Figure 2 , control devices (e.g. Figure 1The processor 110 of the control device 100 can be electrically connected to multiple pressure valves (120-1 to 120-8). In order to make the rods of multiple hydraulic cylinders (CY-1 to CY-4) connected to the multiple pressure valves (120-1 to 120-8) rise or fall, control signals (for example, a voltage of 0V to 10V) can be output to the multiple pressure valves (120-1 to 120-8) respectively.

[0064] Furthermore, the processor 110 is electrically connected to the plurality of motor driving modules 140 - 1 , 140 - 2 , and a control signal (eg, a driving current) may be applied to each of the motor driving modules 140 - 1 , 140 - 2 to raise or lower a rod (not shown) operated by the plurality of motors M1 , M2 .

[0065] According to one embodiment, the control signals for raising or lowering the rods of the plurality of hydraulic cylinders (CY-1 to CY-4) to specific positions may be acquired through a test process and stored in the storage module 160 of the control device after the test is completed.

[0066] According to various embodiments, the plurality of hydraulic cylinders (CY-1 to CY-4) receive hydraulic pressure from two pressure valves, respectively, so that the rods of the hydraulic cylinders can be fixed (or stopped) at specific positions.

[0067] For example, the first hydraulic cylinder CY-1 can fix the rod at a specific position using the first hydraulic pressure provided by the first pressure valve 120-1 and the second hydraulic pressure provided by the second pressure valve 120-2. Thus, the position of the cup connected to the respective rods of the plurality of hydraulic cylinders (CY-1 to CY-4) can be adjusted. Furthermore, the first motor M1 fixes the rod operated by the motor at a specific position through the driving current provided by the first motor driving module 140-1, thereby, the position of the cup connected to each rod operated by each motor M1, M2 can be adjusted.

[0068] According to one embodiment, a cup portion operated by a hydraulic cylinder may be connected to two hydraulic cylinders, and a cup portion operated by a motor M may be connected to two motors M1 and M2.

[0069] For example, the first cup portion may be connected to the first motor M1 and the second motor M2, the second cup portion may be connected to the first hydraulic cylinder CY-1 and the fourth hydraulic cylinder CY-4, and the third cup portion may be connected to the second hydraulic cylinder CY-2 and the third hydraulic cylinder CY-3.

[0070] According to various embodiments, a plurality of sensor modules (130-1 to 130-4) are respectively provided at a plurality of hydraulic cylinders (CY-1 to CY-4) for detecting the position of a rod of each hydraulic cylinder, and information (or signals (e.g., current signals of 4 mA to 20 mA)) related to the detected rod position may be transmitted to the processor 110. In this case, although not specifically shown in the figure, signals detected by the following sensors may be provided to the processor 110: a sensor for detecting the position of a rod operated by the motor M, and a sensor for detecting the rotation of the motor M.

[0071] The processor 110 can identify the position of each rod of a plurality of hydraulic cylinders (CY-1 to CY-4) based on information provided from a plurality of sensor modules (130-1 to 130-4), and identify the position of the rod working through the motor M based on information detected by a sensor for detecting the position of a rod (not shown) working through the motor M and a sensor for detecting the rotation of the motor M, compare the identified rod position with a target position of the rod corresponding to a current process, and adjust a plurality of pressure valves (120-1 to 120-8) and motor drive modules 140-1, 140-2 respectively based on the comparison result, thereby adjusting the positions of a plurality of cup portions to be suitable for the target position of the current process.

[0072] Figure 3 The figure is an exemplary diagram for explaining a method for adjusting the height of a cup portion in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0073] According to an embodiment of the present invention, the control device (for example, Figure 1 The control device 100 in the process is at the beginning of the process or after the process is completed, such as Figure 3 As shown, the stroke of multiple hydraulic cylinders connected to each cup portion (for example, the stroke is adjusted to 1 mm) and the rotation of the motor can be adjusted so that the positions of the first cup portion 301, the second cup portion 302 and the third cup portion 303 are at the original position (or initial position).

[0074] According to one embodiment, when the first cup portion 301, the second cup portion 302 and the third cup portion 303 are located at the original position (or initial position), the inlet of the cup portion may be located at a position lower than the wafer (refer to Figure 3 original position in the image).

[0075] According to various embodiments, when the current process is a first-stage process of recovering chemical substances through the first cup portion 301, as shown in FIG. Figure 3 As shown in part (a) of FIG. 1 , the control device 100 adjusts the rotation of the motor M connected to the first cup 301 so that the inlet of the first cup 301 is located at a specified height above the wafer W (eg, 20 mm).

[0076] Furthermore, when the anti-scattering cup mode is further performed in the first stage process, as shown in FIG. Figure 3 As shown in part (b) of the figure, the control device 100 can adjust the position through the motor drive module 140 to be further upwardly spaced from the current position of the first cup portion 301 and higher than a specified position of the wafer W (the position or height can be determined by experiments), thereby preventing chemicals such as cleaning liquid and ultrapure water from scattering to the outside of the cup portion.

[0077] In this case, the second cup portion 302 and the third cup portion 303 may maintain their previous initial positions (ie, original positions).

[0078] According to various embodiments, when the current process is a second-stage process of recovering chemicals through the second cup portion 302, as shown in FIG. Figure 3 As shown in part (c) of FIG. 1 , the control device 100 adjusts the strokes of the plurality of hydraulic cylinders connected to the second cup 302 (for example, the strokes are adjusted to 40 mm), so that the inlet of the second cup 302 is located at a specified height (for example, 20 mm) on the upper side of the wafer, and controls the rotation of the motor M so that when the second cup 302 moves upward while the first cup 301 and the second cup 302 maintain an initial interval, the first cup 301 simultaneously moves upward. In this case, the third cup 303 can maintain the previous initial position (i.e., the original position).

[0079] Furthermore, when the anti-scattering cup mode is further performed in the second stage process, as shown in FIG. Figure 3 As shown in part (d) of the figure, the control device 100 can adjust the position through the motor drive module 140 to be further separated upward from the current position of the first cup part 301 and higher than the specified position of the wafer W (the position or height can be determined by experiments), thereby preventing chemicals such as cleaning liquid and ultrapure water from flying outside the cup part.

[0080] According to various embodiments, when the current process is a third stage process of recovering chemicals through the third cup portion 303, as shown in FIG. Figure 3 As shown in part (e), the control device 100 adjusts the stroke of multiple hydraulic cylinders connected to the third cup portion 303 (for example, adjusts the stroke to 40 mm) so that the inlet of the third cup portion 303 is located at a specified height (for example, 20 mm) on the upper side of the wafer, and adjusts the rotation of the motor M and the stroke of the hydraulic cylinder so that when the third cup portion 303 moves upward while the first cup portion 301 and the second cup portion 302 maintain an initial interval, the first cup portion 301 and the second cup portion 302 move upward at the same time.

[0081] Furthermore, when the anti-scattering cup mode is further performed in the third stage process, as shown in FIG. Figure 3 As shown in part (f) of the figure, the control device 100 can adjust the position through the motor drive module 140 to be further upwardly spaced from the current position of the first cup portion 301 and higher than a specified position of the wafer W (the position or height can be determined by experiments), thereby preventing chemicals such as cleaning liquid and ultrapure water from scattering to the outside of the cup portion.

[0082] As described above, in the semiconductor manufacturing process, the control device 100 can individually adjust the positions of multiple cups in consideration of the current process information, and keep the intervals between the inlets for the chemical substances to flow in at a specified size, thereby preventing the mixing of different chemical substances, wherein the multiple cups are used to recover the chemical substances sprayed for processing the wafer. Furthermore, when the anti-scattering cup mode is further executed in each corresponding stage process, the position of the first cup 301 can be adjusted to a position separated from the upper side of the second cup 302 and higher than the upper side of the wafer W (the position or height can be determined by experiments), thereby preventing the chemical substances such as the cleaning solution and ultrapure water from scattering outside the cup.

[0083] Figure 4 The flowchart is used to explain a method for adjusting the height of a cup according to a semiconductor manufacturing process in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0084] Reference Figure 4 In step S101, the control device (eg, Figure 1 The processor 110 of the control device 100 in FIG. 1 may recognize that the wafer W has been loaded onto the chuck stage.

[0085] For example, the processor 110 receives information indicating that the wafer W has been loaded onto the chuck stage through the communication module 150 , thereby being able to recognize that the wafer has been loaded onto the chuck stage.

[0086] In step S102 , in response to recognizing that a wafer has been loaded onto the chuck stage, the processor 110 may adjust positions of the plurality of cups based on an operation mode of the control device 100 .

[0087] For example, the processor 110 obtains information related to the process flow from the storage module 160 , and can control the pressure valve 120 and the motor driving module 140 based on the obtained process flow to adjust the positions of the plurality of cups.

[0088] Specifically, the processor 110 may use a designated first control method (eg, a closed-loop control method or a feedback control method) to increase the control speed of the current position reaching the target position (eg, a 40 mm ascending or descending interval) (step S102 ).

[0089] However, when the first control method (for example, a closed-loop control method or a feedback control method) is used to increase the control speed from the current position to the target position, due to the characteristics of the control method, when approaching the target position, it is possible that the position will repeatedly rise and fall slightly.

[0090] Therefore, in step S103, depending on whether the position of the cup portion enters the position completion determination interval (i.e., the interval after adding the specified margin to the target position), when the position of the cup portion has not entered the position completion determination interval (i.e., the interval after adding the specified margin to the target position) (step S103, no), the processor 110 continues to use the first control method to adjust the position of the cup portion (step S102); when the position of the cup portion enters the position completion determination interval (i.e., the interval after adding the specified margin to the target position) (step S103, yes), the processor 110 uses the second control method (e.g., open-loop control method) to adjust the position of the cup portion (step S104).

[0091] That is, the processor 110 adjusts the position of the cup through an open-loop control method (i.e., no feedback output is given, but a specified target value is input to generate a control signal and control the output). As a result, the position will not fluctuate up and down within the position completion determination interval (i.e., the interval after adding the specified margin to the target position), and can stably reach the target position.

[0092] In step S105 , the processor 110 may identify that the wafer has been unloaded from the chuck stage. For example, after completing the current process, the processor 110 receives information indicating that the wafer has been unloaded from the chuck stage through the communication module 150 , thereby identifying that the wafer has been unloaded from the chuck stage.

[0093] As described above, the control device 100 of this embodiment has the following effects: in the semiconductor manufacturing process, the positions of multiple cups for recovering chemicals sprayed to process wafers can be adjusted individually, and the positions of the cups can be adjusted quickly and stably. At the same time, the cups can be adjusted separately using motors and hydraulic cylinders, thereby preventing chemicals such as cleaning fluids and ultrapure water from scattering, and preventing the size or volume of the device for controlling the cups from increasing.

[0094] The term "module" used in this specification may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component or circuit. A module may be a minimum unit or a part of a component that is constructed as an integral part or performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0095] Various embodiments of the present specification may be implemented in software including at least one instruction stored in a storage medium (eg, Figure 1 The storage module 160 in the storage medium can be stored by a device (machine) (for example, Figure 1 For example, a device (e.g., Figure 1 A processor (eg, Figure 1 The processor 110 in the device can call and execute at least one instruction of the multiple instructions stored in the storage medium. This can enable the device to be operated to perform at least one function according to the at least one instruction called. The at least one instruction may include code generated by a compiler or code that can be executed by an interpreter. The storage medium that can be read by the device can be provided in the form of a non-transitory storage medium. Among them, "non-transitory" can mean that the storage medium is a tangible device and does not include a signal (for example, an electromagnetic wave). The term does not distinguish between the case where data is semi-permanently stored in the storage medium and the case where data is temporarily stored.

[0096] According to multiple embodiments, each structural element (e.g., module or program) of the multiple structural elements described above may include a single or multiple entities. According to multiple embodiments, one or more structural elements or work in the corresponding structural elements described above may be omitted or one or more other structural elements or work may be added. Alternatively or additionally, multiple structural elements (e.g., module or program) may be merged into one structural element. In this case, the merged structural element may perform one or more functions of each structural element in the multiple structural elements in the same or similar manner as the function performed by the corresponding structural element in the multiple structural elements before the merger. According to an embodiment, the work performed by a module, program or other structural element may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the work may be performed in a different order or omitted or one or more other work may be added.

Claims

1. A semiconductor manufacturing device, characterized in that: include: a plurality of cups for recovering chemicals sprayed during the process; A motor driving module, used for driving a motor to adjust the up and down position of the cup portion; A plurality of pressure valves, used for driving the cylinder to adjust the up and down position of the cup portion; as well as A processor is used to control the motor drive module and the pressure valve.

2. The semiconductor manufacturing device according to claim 1, characterized in that According to the process stage, the processor controls the motor drive module and the pressure valve to adjust designated cup parts among the multiple cup parts from the initial position to the respective positions corresponding to the process stage, and when the current process is completed, the multiple cup parts are adjusted to the initial position.

3. The semiconductor manufacturing device according to claim 1, characterized in that: The processor adjusts the position of at least one of the plurality of cups by a motor, and adjusts the positions of the remaining cups of the plurality of cups whose positions are not adjusted by the motor by a hydraulic cylinder connected to the pressure valve.

4. The semiconductor manufacturing device according to claim 1, characterized in that The plurality of cup parts include a first cup part, a second cup part and a third cup part, When the current process is a first-stage process for recovering chemicals through the first cup, the processor adjusts the rotation of the motor connected to the first cup so that the inlet of the first cup is located at a specified height on the upper side of the wafer. When the anti-scattering cup mode is further executed in the first-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup to the upper side and higher than the specified position of the wafer, and the second cup and the third cup maintain their previous initial positions.

5. The semiconductor manufacturing device according to claim 1, wherein: The plurality of cup parts include a first cup part, a second cup part and a third cup part, When the current process is a second-stage process for recovering chemicals through a second cup, the processor adjusts the strokes of multiple hydraulic cylinders connected to the second cup so that the inlet of the second cup is located at a specified height on the upper side of the wafer, and controls the rotation of the motor so that when the second cup moves upward while the first cup maintains an initial interval with the second cup, the first cup moves upward at the same time. When the anti-scattering cup mode is further executed in the second-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup to the upper side and higher than the specified position of the wafer, and the third cup maintains the previous disposal position.

6. The semiconductor manufacturing device according to claim 1, characterized in that: The plurality of cup parts include a first cup part, a second cup part and a third cup part, When the current process is a third-stage process for recovering chemicals through a third cup, the processor adjusts the strokes of multiple hydraulic cylinders connected to the third cup so that the inlet of the third cup is located at a specified height on the upper side of the wafer, and adjusts the rotation of the motor and the stroke of the hydraulic cylinder so that when the third cup moves upward while the first cup and the second cup maintain an initial interval, the first cup and the second cup move upward at the same time. When the anti-scattering cup mode is further executed in the third-stage process, the processor adjusts the position through the motor drive module to be further separated from the current position of the first cup to the upper side and higher than the specified position of the wafer.

7. The semiconductor manufacturing device according to claim 1, characterized in that: The processor uses a specified first control method to quickly control the cup portion to reach a target position from a current position. When the position of the cup portion has not entered the position completion determination interval, the processor continues to use the first control method to adjust the position of the cup portion. When the position of the cup portion enters the position completion determination interval, the processor uses the second control method to stably adjust the position of the cup portion.

8. The semiconductor manufacturing device according to claim 7, characterized in that: The position completion determination interval is an interval obtained by adding a specified margin to the target position of the cup portion.

9. The semiconductor manufacturing device according to claim 7, characterized in that: The first control method includes a closed-loop control method, The second control mode includes an open-loop control mode.

10. A control method for a semiconductor manufacturing device, characterized in that: The steps include: Chemicals ejected during the recovery process are recovered through multiple cups; The motor is driven by a motor driving module to adjust the upper and lower positions of the cup portion; A plurality of pressure valves are used to drive the cylinder to adjust the up and down position of the cup; and The motor driving module and the pressure valve are controlled by a processor.

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