Wafer boat box cooling method, system and device and storage medium

Abstract

The invention provides a crystal boat box cooling method, system and device and a storage medium, and relates to the field of temperature control, and the method comprises the steps: after moving a crystal boat box to a preset loading position, measuring the current temperature of the crystal boat box, and obtaining a total value of heat needing to be removed based on the temperature and a preset target temperature; then, a first removal heat value needing to be removed by the cold water and a second removal heat total value needing to be removed by the inert gas are determined on the basis of a preset cooling proportion, and the target cold water flow of the cooling-water machine is calculated on the basis of the first removal heat value and the cooling efficiency of the cooling-water machine; a target gas flow rate of the inert gas is calculated based on the second removal heat value and a cooling efficiency of the inert gas, and the cold water and the inert gas are respectively controlled based on the target cold water flow rate and the target gas flow rate. Compared with a natural cooling mode depending on a wafer boat box in the prior art, the cooling rate is greatly improved by additionally arranging the cooling-water machine and adopting a cold water and inert gas synergistic cooling mode.

Description

Technical Field

[0001] The present invention relates to the field of automatic control technology, and in particular to a wafer boat box cooling method, system, device and storage medium. Background Art

[0002] Atomic layer deposition (ALD) equipment is an advanced technology equipment used for thin film preparation. It can control the growth of thin films with atomic-level precision on the surface of various materials. ALD is a thin film growth technology based on surface saturation reaction. It constructs thin films layer by layer by alternately introducing two different precursor gases to carry out self-limiting chemical reactions on the substrate surface.

[0003] In atomic layer deposition equipment, Loadlock (pre-loaded chamber) technology is a key component used to safely transfer wafers into and out of the reaction chamber while maintaining vacuum. As a buffer, Loadlock can smoothly transition between different pressure environments (such as atmospheric pressure and vacuum environment) to prevent sudden pressure changes from damaging the wafer or equipment. At the same time, it can maintain the cleanliness of the internal environment and prevent external contaminants from entering the reaction chamber.

[0004] After the process cycle of current batch ALD machines is completed, the temperature of the wafer box is often high (usually reaching about 250°C), and its cooling rate is slow, requiring more than an hour to drop to a safe temperature that is accessible to the human body (50°C). This slow cooling significantly reduces the overall operating efficiency of the equipment. In addition, if the temperature is not cooled quickly enough, the stress in the wafer cannot be released in time, which may cause defects to occur and expand. The temperature difference between the inside and outside of the wafer may also cause thermal stress, and slow cooling will aggravate this stress, which may lead to quality problems such as wafer deformation or cracking. Summary of the invention

[0005] In view of this, embodiments of the present invention provide a wafer boat box cooling method, system, device and storage medium to increase the wafer boat box cooling rate.

[0006] According to one aspect of the present invention, a method for cooling a wafer boat box is provided. The method is applied to a pre-loading chamber, wherein the pre-loading chamber includes a wafer boat box to be cooled, and the pre-loading chamber also includes a cooling base and a thermocouple. The cooling base uses cold water generated by a chiller to cool the pre-loading chamber, and the thermocouple is used to measure the temperature of the wafer boat box. The method includes: Measuring the current temperature of the wafer boat box, and calculating the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; Based on the preset cooling ratio and the target total heat value, determining a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas; Determine a target chilled water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the chilled water and the chilled water flow rate, the temperature difference of the chilled water being the difference between the outlet temperature and the inlet temperature of the chiller; Determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow rate of the inert gas and the difference between the current temperature and a preset target temperature; The cold water flow valve of the chiller is controlled based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and the inert gas valve is controlled based on the target gas flow so that the inert gas is injected into the preloading chamber according to the target gas flow.

[0007] In a possible embodiment, the pre-loading chamber further includes: a vacuum gauge, the vacuum gauge is used to measure the pressure in the pre-loading chamber, and the method further includes: Measuring the current temperature of the wafer boat box according to a preset sampling period, and returning to the step of calculating the total target heat value to be removed based on the difference between the current temperature and the preset target temperature when the current temperature does not reach the target temperature; When the current temperature reaches the target temperature, the cold water flow valve is closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the inert gas valve is closed.

[0008] In a possible embodiment, determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: Based on the specific heat capacity, density and temperature difference of the cold water, the cooling efficiency of the cold water is obtained; Determining a target chilled water flow rate of the chiller based on the first heat removal value and the ratio of the cooling efficiency; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: Based on the specific heat capacity of the inert gas and the difference between the current temperature of the wafer boat box and the target temperature, the cooling efficiency of the inert gas is obtained; A target mass flow rate of the inert gas is determined based on a ratio of the first heat removal value and a cooling efficiency of the inert gas.

[0009] In a possible embodiment, the calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature includes: Calculate the target total calorie value according to the following formula: Q = m × c × ΔT Wherein, Q is the target total heat value, m is the mass of the wafer boat box, C is the specific heat capacity of the wafer boat box, and ΔT is the difference between the current temperature and the target temperature; The step of determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: The target cold water flow rate is calculated according to the following formula:

[0010] in, is the target cold water flow rate, is the first heat removal value, is the specific heat capacity of cold water, is the density of cold water, is the temperature difference of the cold water; The target mass flow rate is calculated according to the following formula:

[0011] in, for the second heat removal value, is the target mass flow rate of the target gas, is the specific heat capacity of the inert gas, is the difference between the current temperature of the wafer boat box and the target temperature.

[0012] In a possible embodiment, the inert gas valve includes a gas valve and a mass flow controller; the cold water flow valve of the chiller controlled based on the target cold water flow includes: Controlling the opening of the cold water flow valve based on the target cold water flow, so that the chiller outputs cold water to the cooling base according to the target cold water flow; controlling an inert gas valve based on the target gas flow rate so that the inert gas is injected into the pre-loading chamber according to the target gas flow rate; Opening the gas valve and controlling the mass flow controller according to the target mass flow rate, so that the inert gas is injected into the pre-loading chamber according to the target gas flow rate; The method further comprises: When the current temperature reaches the target temperature, the cold water flow valve and the mass flow controller are closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the gas valve is closed.

[0013] According to another aspect of the present invention, a wafer boat box cooling system is provided, the system is applied to a pre-loading chamber, the pre-loading chamber includes a wafer boat box to be cooled, the pre-loading chamber also includes a cooling base and a thermocouple, the cooling base uses cold water generated by a chiller to cool the pre-loading chamber, the thermocouple is used to measure the temperature of the wafer boat box, the system includes: A measuring module, used for measuring the current temperature of the wafer boat box, and calculating the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; A calculation module, for determining a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas based on a preset cooling ratio and the target total heat value; determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on a temperature difference of the cold water and a cold water flow rate, wherein the temperature difference of the cold water is a difference between an outlet temperature and an inlet temperature of the chiller; determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on a mass flow rate of the inert gas and a difference between the current temperature and a preset target temperature; A control module is used to control the cold water flow valve of the chiller based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and control the inert gas valve based on the target gas flow so that the inert gas is injected into the pre-loading chamber according to the target gas flow.

[0014] In a possible embodiment, the pre-loading chamber further includes: a vacuum gauge, the vacuum gauge is used to measure the pressure in the pre-loading chamber, and the system further includes: A sampling module is used to measure the current temperature of the wafer box according to a preset sampling period, and when the current temperature does not reach the target temperature, return to the step of calculating the total target heat to be removed based on the difference between the current temperature and the preset target temperature; when the current temperature reaches the target temperature, close the cold water flow valve, and when the pressure in the pre-loading chamber reaches the preset pressure, close the inert gas valve.

[0015] In a possible embodiment, determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: Based on the specific heat capacity, density and temperature difference of the cold water, the cooling efficiency of the cold water is obtained; Determining a target chilled water flow rate of the chiller based on the first heat removal value and the ratio of the cooling efficiency; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: Based on the specific heat capacity of the inert gas and the difference between the current temperature of the wafer boat box and the target temperature, the cooling efficiency of the inert gas is obtained; A target mass flow rate of the inert gas is determined based on a ratio of the first heat removal value and a cooling efficiency of the inert gas.

[0016] According to another aspect of the present invention, a wafer boat box cooling device is provided, the device comprising: a cold water cooling circuit and an inert gas cooling circuit, the cold water cooling circuit comprising a cooling base, a thermocouple, a chiller and a cold water flow valve, the inert gas cooling circuit comprising: an inert gas, a mass flow controller, and a gas valve; The cooling base is arranged at the bottom of the pre-loading cavity, and is used to cool the wafer boat box in the pre-loading cavity by using the cold water output by the chiller; The thermocouple is connected to the pre-loading chamber and is used to measure the temperature of the wafer boat box in the pre-loading chamber; The cold water flow valve is used to control the chiller to output cold water to the cooling base based on the target cold water flow rate, the gas valve is used to control the on and off of the inert gas, and the mass flow controller is used to control the injection of the inert gas into the pre-loading chamber based on the target gas flow rate, wherein the target cold water flow rate and the target gas flow rate are obtained by the following steps: measuring the current temperature of the wafer boat box by a thermocouple, and calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature; determining the first removal temperature corresponding to the chiller based on the preset cooling ratio and the target total heat value; The calorific value and the second calorific value removed corresponding to the inert gas; based on the first calorific value removed and the cooling efficiency of the chiller, determining the target cold water flow of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the cold water and the cold water flow, and the temperature difference of the cold water is the difference between the outlet temperature and the inlet temperature of the chiller; based on the second calorific value removed and the cooling efficiency of the inert gas, determining the target gas flow of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow of the inert gas and the difference between the current temperature and the preset target temperature.

[0017] According to another aspect of the present invention, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to enable a computer to execute any of the above-mentioned wafer boat box temperature reduction methods.

[0018] One or more technical solutions provided in the embodiments of the present invention measure the current temperature of the crystal boat box after moving the crystal boat box to the preset loading position in the pre-loading chamber, and obtain the total heat value that needs to be removed based on the temperature and the preset target temperature, and then determine the first heat value that needs to be removed by the cold water and the second total heat value that needs to be removed by the inert gas based on the preset cooling ratio, calculate the target cold water flow of the chiller based on the first heat value and the cooling efficiency of the chiller, calculate the target gas flow of the inert gas based on the second heat value and the cooling efficiency of the inert gas, and control the cold water and inert gas based on the target cold water flow and target gas flow. Compared with the method of relying on the natural cooling of the crystal boat box in the prior art, the cooling rate is greatly improved by adding a chiller and using the method of coordinated cooling of cold water and inert gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Further details, features and advantages of the invention are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which: Figure 1 A schematic flow chart of a wafer boat box cooling method provided by an embodiment of the present invention; Figure 2 A schematic diagram of controlling the flow rates of cold water and inert gas in a wafer boat box cooling method provided by an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a pre-loading chamber used in the related art; Figure 4 A flow chart of unloading a wafer boat box and cooling the wafer boat box in the related art; Figure 5 A schematic diagram of the structure of a pre-loading chamber provided in an embodiment of the present invention; Figure 6 A schematic flow chart of a wafer boat box cooling method provided by an embodiment of the present invention; Figure 7 A schematic diagram comparing a cooling curve of a wafer boat box cooling method provided by an embodiment of the present invention and a cooling curve of natural cooling; Figure 8 A schematic diagram of a structure of a wafer boat box cooling device provided by an embodiment of the present invention Fig. 9 A block diagram of an exemplary electronic device that can be used to implement an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0020] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0021] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0022] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0023] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0024] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0025] In order to increase the cooling speed of the crystal boat box, the embodiments of the present invention provide a crystal boat box cooling method, system, device and storage medium. The crystal boat box cooling method provided by the embodiments of the present invention can be applied to any electronic device with a crystal boat box cooling function, and the electronic device can be a computer, a mobile terminal, an industrial computer, etc. In a possible embodiment, the electronic device can be a host computer of an ALD device, and the host computer is used to control the operation of the ALD device, the loading and unloading of the crystal boat box, etc. In a possible embodiment, the crystal boat box cooling method provided by the embodiments of the present invention can be applied to a pre-loading chamber, the pre-loading chamber includes a crystal boat box to be cooled, the pre-loading chamber also includes a cooling base and a thermocouple, the cooling base uses cold water generated by a chiller to cool the pre-loading chamber, and the thermocouple is used to measure the temperature of the crystal boat box. The scheme of the present invention is described below with reference to the accompanying drawings: Figure 1 A schematic flow chart of a wafer boat box cooling method provided in an embodiment of the present invention may include the following steps: S101, measuring the current temperature of the wafer boat box, and calculating the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; S102, determining a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas based on a preset cooling ratio and the target total heat value; S103, determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the cold water and the cold water flow rate, and the temperature difference of the cold water is the difference between the outlet temperature and the inlet temperature of the chiller; S104, determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow rate of the inert gas and the difference between the current temperature and a preset target temperature; S105. Control the cold water flow valve of the chiller based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and control the inert gas valve based on the target gas flow so that the inert gas is injected into the pre-loading chamber according to the target gas flow.

[0026] By applying the embodiment of the present invention, after the wafer boat box is moved to the preset loading position in the pre-loading chamber, the current temperature of the wafer boat box is measured, and the total heat value to be removed is obtained based on the temperature and the preset target temperature, and then the first heat value to be removed by the cold water and the second total heat value to be removed by the inert gas are determined based on the preset cooling ratio, the target cold water flow of the chiller is calculated based on the first heat value and the cooling efficiency of the chiller, the target gas flow of the inert gas is calculated based on the second heat value and the cooling efficiency of the inert gas, and the cold water and the inert gas are controlled based on the target cold water flow and the target gas flow. Compared with the method of relying on the natural cooling of the wafer boat box in the prior art, the cooling rate is greatly improved by adding a chiller and using the method of coordinated cooling of cold water and inert gas.

[0027] The above S101-S105 are exemplarily described below: The crystal boat box cooling method provided in the embodiment of the present invention can be applied to a batch atomic layer deposition device (ALD), which may include a reaction chamber and a pre-loading chamber. The reaction chamber is the core part of the ALD device, which is usually a high vacuum environment for accommodating substrates and precursors for chemical reactions. The pre-loading chamber is used to safely deliver the substrate into and out of the reaction chamber while maintaining a vacuum state. A gate valve is provided between the reaction chamber and the pre-loading chamber, and the gate valve is used to control the reaction chamber entrance switch, thereby isolating the reaction chamber from the pre-loading chamber. That is, the air pressure between the reaction chamber and the loading chamber is independent.

[0028] The batch atomic deposition equipment also includes a lifting device, a manipulator, a motor, a dry pump, a valve, a vacuum gauge, an inert gas generator, and the like. The lifting device is used to drive the upper cover of the reaction chamber to move vertically, forming an isolation between the inner and outer cavities, and allowing the crystal boat box to be loaded and unloaded. The manipulator is used to grab the crystal boat box, and the manipulator is controlled by a motor to perform loading and unloading operations of the crystal boat box. The motor includes a vertical control motor and a horizontal control motor. The vertical control motor is a stepping motor, which is used to control the movement of the manipulator in the vertical direction, and the horizontal control motor is used to control the movement of the manipulator in the horizontal direction.

[0029] The above-mentioned dry pump is used to extract gas. Specifically, it can extract the gas in the pre-loading chamber, thereby reducing the air pressure in the pre-loading chamber. The above-mentioned valve includes a first dry pump valve and a second dry pump valve. The first dry pump valve and the second dry pump valve are valves that use flexible diaphragms as opening and closing elements. The first dry pump valve and the second dry pump valve have different openings, wherein the opening refers to the degree to which the valve is opened, usually measured in angles or strokes. Different valve openings result in different pressure reduction efficiencies when using the same dry pump. Valves with larger openings have faster pressure reduction efficiency, while valves with smaller openings have slower pressure reduction efficiency. The pressure reduction efficiency refers to the value of the pressure reduction in the pre-loading chamber per unit time.

[0030] In a possible embodiment, when loading the wafer boat box into the reaction chamber or unloading it into the pre-loading chamber, it is necessary to maintain the vacuum in the pre-loading chamber, that is, it is necessary to use a dry pump to reduce the air pressure in the pre-loading chamber to the vacuum pressure. As a possible implementation method, a valve with a smaller opening can be used to control the dry pump to extract the gas in the pre-loading chamber, and when the pressure in the pre-loading chamber reaches a first preset pressure, a valve with a larger opening can be used to control the dry pump to extract the gas in the pre-loading chamber until the air pressure in the pre-loading chamber is reduced to the vacuum pressure. The vacuum pressure can be 0 or other values ​​close to 0, which can be set according to the actual application scenario. Through this technical solution, the wafer damage caused by the excessively fast rate of change of the air pressure in the pre-loading chamber can be avoided.

[0031] The vacuum gauge is used to measure the pressure in the pre-loading chamber, and the inert gas generator is used to generate inert gas, which is usually nitrogen (N2). The valve may also include a gas valve, which is used to control the on and off of the inert gas. The inert gas is usually used to pressurize the pre-loading chamber and purge the precursor that may remain on the wafer boat box.

[0032] In a possible embodiment, the pre-loading chamber may further include a cooling base, a water chiller and a thermocouple. The cooling base is installed at the bottom of the pre-loading chamber and is used to cool the pre-loading chamber by cold water, that is, to cool the wafer boat box in the pre-loading chamber. The bottom of the pre-loading chamber refers to the surface in direct contact with the wafer boat box. The cold water refers to cooling water, and its temperature is lower than the preset water temperature, which can be determined according to the actual process.

[0033] The water chiller is a device for generating cold water. Exemplarily, the water chiller may include a water outlet and a water inlet. Correspondingly, the cooling base may also include a water outlet and a water inlet. The water outlet of the water chiller is connected to the water inlet of the cooling base through a pipeline to input cold water into the cooling base. The water outlet of the cooling base is connected to the water inlet of the water chiller through a pipeline to recover the cold water in the cooling base. The crystal boat box is cooled by the cold water flowing through the cooling base.

[0034] Based on Newton's law of cooling, the heat transfer rate is Φ=h×A×ΔT, where h is the convective heat transfer coefficient, which is a fixed value and the unit is usually W / m²·℃; A is the heat transfer area and the unit can be m²; ΔT is the temperature difference and the unit is usually ℃.

[0035] It can be seen that the larger the heat transfer area, the faster the heat transfer rate; the larger the temperature difference, the faster the heat transfer rate. Therefore, the contact area between the cooling substrate and the bottom of the pre-loading chamber can be set to the largest possible value to increase the heat transfer area and thus improve the heat transfer efficiency. At the same time, in order to avoid mechanical interference, that is, to avoid the cooling base from affecting other mechanical components in the ALD device, it is necessary to limit the maximum value of the contact area between the cooling substrate and the pre-loading chamber. This maximum value can be determined based on actual device parameters, and the present invention does not make specific limitations on this.

[0036] The thermocouple is connected to the pre-loading chamber and is used to measure the temperature in the pre-loading chamber, that is, the temperature of the wafer boat box. For example, a small hole can be provided on the bottom surface of the pre-loading chamber, and a thermocouple is provided at the small hole, and the thermocouple can measure the temperature of the wafer boat box through the small hole.

[0037] In one possible embodiment, after the wafer boat box is taken from the reaction chamber to the pre-loading chamber by a manipulator, the temperature of the wafer boat box can be measured by a thermocouple to obtain the current temperature of the wafer boat box, and the total target heat value to be removed can be calculated based on the difference between the current temperature and the preset target temperature. In another possible embodiment, the process temperature of the wafer boat box after the process is completed can also be considered as the current temperature of the wafer boat box.

[0038] As a possible implementation, the above target total heat value can be calculated by the following specific heat capacity formula: Q = m × c × ΔT Wherein, Q is the target total heat value, m is the mass of the wafer boat box, C is the specific heat capacity of the wafer boat box, and ΔT is the difference between the current temperature and the target temperature.

[0039] In the present invention, the temperature of the wafer boat box is cooled by the cooperation of cold water and nitrogen. As a possible implementation method, the target total heat value can be allocated based on the preset cooling ratio to obtain the first heat removal value that needs to be removed by the cold water and the second heat removal value that needs to be removed by the inert gas. The above-mentioned preset cooling ratio is used to represent the ratio of the first heat removal value to the second heat removal value. The ratio can be set according to the actual application scenario. For example, it can be determined according to the cooling values ​​of the cold water and nitrogen per unit time. The present invention does not make specific limitations on this.

[0040] In a possible embodiment, the target cold water flow rate of the chiller can be determined based on the first heat removal value and the cooling efficiency of the chiller, and the cooling efficiency of the chiller is determined based on the temperature difference between the water inlet and the water outlet of the chiller and the cold water flow rate. Specifically, the larger the temperature difference, the higher the cooling efficiency, and the larger the cold water flow rate, the higher the cooling efficiency.

[0041] As a possible implementation, the cooling efficiency of the cold water can be obtained based on the specific heat capacity, density and temperature difference of the cold water; and the target cold water flow rate of the chiller can be determined based on the ratio of the first heat removal value and the cooling efficiency.

[0042] Exemplarily, the target cold water flow rate is calculated according to the following formula:

[0043] in, is the target cold water flow rate, is the first heat removal value, is the specific heat capacity of cold water, is the density of cold water, is the temperature difference of the cold water.

[0044] In a possible embodiment, the target gas flow rate of the inert gas can be determined based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow rate of the inert gas and the difference between the current temperature and the preset target temperature. The cooling efficiency is positively correlated with the temperature difference, that is, the higher the temperature difference, the higher the cooling efficiency, and the higher the mass flow rate of the inert gas, the higher the cooling efficiency. The mass flow rate refers to the mass of fluid passing through a specific cross section per unit time. In the International System of Units, the standard unit of mass flow is kilograms per second (kg / s).

[0045] As a possible implementation, the cooling efficiency of the inert gas can be obtained based on the specific heat capacity of the inert gas, the difference between the current temperature of the crystal boat box and the target temperature; and the target mass flow rate of the inert gas can be determined based on the ratio of the first heat removal value and the cooling efficiency of the inert gas.

[0046] Exemplarily, the target mass flow of the target gas can be calculated by the following formula:

[0047] in, for the second heat removal value, is the target mass flow rate of the target gas, is the specific heat capacity of the inert gas, is the difference between the current temperature of the wafer boat box and the target temperature.

[0048] According to the ideal gas equation: PV = nRT Where P is the pressure of the ideal gas, V is the volume of the ideal gas, n is the number of moles of the gas, R is the universal gas constant (approximately 8.31 J / mol•K), and T is the temperature of the gas (unit: Kelvin).

[0049] It can be seen that, ideally, the product of the pressure and volume of the gas is proportional to the temperature. Considering that during the vacuuming process, the gas in the system is extracted, resulting in a decrease in the system pressure. According to the principles of thermodynamics, the gas does work on the outside during the expansion process, thereby reducing the internal energy of the system and the temperature will drop accordingly. This process is called adiabatic expansion, because the vacuuming process is usually carried out very quickly, and the heat does not have time to enter and exit the system by conduction, convection or radiation. Therefore, vacuuming will cause the temperature inside the system to drop. Breaking the vacuum is to introduce external gas into a system that has been evacuated. This process will increase the internal energy of the system because the external gas will do work on it when it enters the system. The vacuum breaking process is very fast and is an approximately isentropic process, and the increase in the system temperature will not be very obvious. Therefore, the target mass flow rate can be obtained more accurately through the above technical solution.

[0050] In a possible embodiment, the cold water flow valve of the chiller can be controlled based on the target cold water flow rate so that the chiller outputs cold water to the cooling base according to the target cold water flow rate; and the inert gas valve can be controlled based on the target gas flow rate so that the inert gas is injected into the pre-loading chamber according to the target gas flow rate.

[0051] Exemplarily, the opening of the cold water flow valve can be controlled based on the target cold water flow, so that the chiller outputs cold water to the cooling base according to the target cold water flow; the inert gas valve can be controlled based on the target gas flow, so that the inert gas is injected into the pre-loading chamber according to the target gas flow. Specifically, the gas valve can be opened, and the mass flow controller can be controlled according to the target mass flow, so that the inert gas is injected into the pre-loading chamber according to the target gas flow.

[0052] In a possible embodiment, the current temperature of the wafer boat box can be measured according to a preset sampling period, and when the current temperature does not reach the target temperature, the step of calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature is returned. The above sampling period can be determined according to the actual application scenario, such as 1s, 500ms, etc.

[0053] Through the above technical solution, the cold water flow rate and the target mass flow rate are changed in real time according to the current temperature of the crystal boat box, thereby achieving uniform cooling.

[0054] When the current temperature reaches the target temperature, the cold water flow valve is closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the inert gas valve is closed. Specifically, the mass flow controller can be closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the gas valve is closed.

[0055] like Figure 2 As shown, Figure 2 A schematic diagram of cold water flow rate and inert gas mass flow rate control of a wafer boat box cooling method provided in an embodiment of the present invention, specifically, may include the following process: The current temperature Treal of the wafer boat box is measured, and the target temperature difference △T is obtained based on the current temperature Treal and the set target temperature Ttg, and the total heat Qtotal in the pre-loading chamber loadlock is calculated based on the target temperature difference △T. The water cooling heat Q1 and the air cooling heat Q2 are obtained based on the total heat Qtotal and the preset cooling ratio.

[0056] Based on the water cooling heat and the chiller temperature difference △T1, the target cold water flow Qwater is obtained, and the crystal boat box is cooled based on the target cold water flow; based on the air cooling heat and the above-mentioned target temperature difference △T, the target mass flow rate of the inert gas is obtained, and the mass flow rate of the inert gas is controlled based on the target mass flow rate by using the mass flow controller MFC to cool the crystal boat box.

[0057] The temperature of the wafer boat box is measured according to a preset sampling period, and when the temperature of the wafer boat box does not reach the target temperature, the above steps are repeated until the temperature of the wafer boat box drops to the target temperature.

[0058] like Figure 3 As shown, Figure 3 The schematic diagram of the structure of the pre-loading chamber used in the related art includes a chamber Load Lock, a longitudinal motor M2, a transverse motor M1, a vacuum gauge P1, a dry pump (PUMP) VP1, a valve DV-VP21, a valve DV-VP22, a valve DV-NLL and nitrogen N2. The vacuum gauge is used to measure the chamber pressure PT-LL. The pre-loading chamber is connected to the reaction chamber, and the connection state is controlled by the slit valve. The reaction chamber includes a lifting device Lifter above.

[0059] Based on the pre-loading chamber structure, the corresponding wafer boat box unloading process is as follows: Figure 4As shown, the chamber pressure is reduced to vacuum by controlling valve DV-VP21 and valve DV-VP22. Specifically, the opening of valve DV-VP22 is smaller than that of valve DV-VP21. First, valve DV-VP22 is opened, valve DV-VP21 is closed, and the chamber gas is extracted by a dry pump. The chamber pressure PT-LL is measured by a vacuum gauge to see if it is less than or equal to the preset pressure Vc. If not, continue this step. If so, close valve DV-VP22 and open valve DV-VP21. Determine whether the chamber pressure PT-LL is less than or equal to the preset bottom pressure Vp. If so, determine that the chamber pressure has been reduced to vacuum. If not, continue to use valve DV-VP21 to control the dry pump to extract the chamber gas.

[0060] Then open the slit valve between the chamber and the reaction chamber, move the crystal boat box in the reaction chamber to the chamber of the pre-loaded chamber by controlling the longitudinal motor and the transverse motor, and close the slit valve. Then close the valve DV-VP22, and open the valve DV-NLL to inject inert gas into the chamber. When the air pressure in the chamber increases to the preset air pressure Va, close the valve DV-NLL. Specifically, the air pressure PT-LL in the chamber can be measured using a vacuum gauge according to a preset sampling period to determine whether PT-LL is greater than or equal to Va. If so, close the valve DV-NLL, if not, continue to inject inert gas.

[0061] It can be seen that in the related art, after the wafer boat box is moved to the pre-loading chamber, the cooling measures only include natural cooling and inert gas assisted cooling, and the cooling efficiency of this cooling method is very slow.

[0062] like Figure 5 As shown, Figure 5 A structural schematic diagram of a pre-loading chamber provided for an embodiment of the present invention, the pre-loading chamber includes a chamber Load Lock, a longitudinal motor M2, a transverse motor M1, a vacuum gauge P1, a dry pump VP1, a valve DV-VP21, a valve DV-VP22, a valve DV-NLL and nitrogen N2, as well as a cooling base CB1, a thermocouple TE-CB1, a chiller Chiller, a diaphragm valve DV-H2O and a mass flow controller MFC-NLL.

[0063] Based on this structure, an embodiment of the present invention provides a method for cooling a wafer boat box, such as Figure 6 As shown, Figure 6 A schematic flow chart of a wafer boat box cooling method provided in an embodiment of the present invention may include the following steps: S601, start the dry pump VP1.

[0064] S602 , open DV-VP22 and close DV-VP21 to reduce the pressure in the pre-loading chamber by using VP1.

[0065] S603, using PT-LL to monitor the pressure in the pre-loading chamber in real time, and determine whether the pressure is not greater than the first pressure Vc. If so, execute S604; if not, return to S602 to continuously reduce the pressure in the pre-loading chamber.

[0066] S604, open DV-VP21 and close DV-VP22 to continuously reduce the pressure in the pre-loading chamber by using VP1, and the opening degree of DV-VP21 is greater than that of DV-VP22.

[0067] S605: Determine whether the pressure is not greater than the vacuum pressure Vp. If so, execute S606; if not, return to S604.

[0068] S606, open the slit valve, and control the longitudinal motor M2 to move to the low position.

[0069] S607, control the transverse motor M1 to move to the film taking position.

[0070] S608, control the longitudinal motor M2 to move to the high position, control the transverse motor M1 to move to the initial position, and close the slit valve, that is, move the wafer boat box to the wafer taking position in the pre-loading chamber.

[0071] S609, measure the temperature of the wafer boat box, and calculate the total heat value to be removed based on the temperature and the preset target temperature. Specifically, the total heat value Q=m×c×ΔT, where m is the mass of the wafer boat box, c is the specific heat capacity of the wafer boat box, and ΔT is the difference between the current temperature Treal of the wafer boat box and the target temperature Ttarget.

[0072] S610: Based on the total calorific value and the preset ratio, determine the calorific value Q1 that needs to be removed by cold water and the calorific value Q2 that needs to be removed by inert gas. Calculate the cooling water flow rate and nitrogen flow rate based on the calorific value. Specifically, the cooling water flow rate Qwater = Q1 / (Cp×ρ×ΔT1), and the nitrogen flow rate QN2 = Q2 / (Cp×ΔT).

[0073] S611, measuring the temperature of the wafer boat box TE-CB1 by a thermocouple to determine whether the temperature is less than or equal to a preset target temperature, such as 50°C. If so, execute S612, if not, return to S610.

[0074] S612, close DV-VP21, and open DV-NLL to pressurize the pre-loading chamber with inert gas.

[0075] S613, determine whether the pressure PT-LL measured by the vacuum gauge is greater than or equal to the second preset pressure Va, if so, close DV-NLL, if not, return to S612.

[0076] like Figure 7 As shown, Figure 7 The figure is a schematic diagram comparing the cooling curve of the wafer boat box cooling method provided by the embodiment of the present invention with the cooling curve of natural cooling. The horizontal axis of the figure is the cooling time, and the vertical axis is the temperature. It can be seen that in the related art, it takes 70 minutes to reduce the temperature of the wafer boat box to a removable temperature. The application of the embodiment of the present invention significantly improves the cooling rate, and it only takes 20 minutes to reduce the temperature to a temperature that can be reached by the natural cooling method in 70 minutes. In addition, the ideal temperature of the embodiment of the present invention can be flexibly set to improve the user's experience of taking the wafer boat box.

[0077] By applying the embodiment of the present invention, a cooling device is added to the original technical solution to ensure that the wafer boat box can be cooled quickly. The residence time of the wafer in the loadlock is reduced, thereby speeding up the production process and improving the overall production efficiency. Furthermore, by increasing the cooling water flow rate and the nitrogen mass flow rate to coordinate the cooling control algorithm, the uniformity of the cooling rate can be guaranteed, and problems such as thermal stress caused by temperature differences can be prevented. By controlling the cooling rate, defects and contamination on the wafer surface can be reduced, and the overall quality of the wafer can be improved. In addition, the ideal temperature can be set flexibly, and the temperature of the wafer can be controlled more accurately, which is crucial for steps that require specific temperature processes. And the application of the embodiment of the present invention can optimize the use of the cooling system, reduce energy consumption, and reduce operating costs.

[0078] Based on the same inventive concept, an embodiment of the present invention further provides a wafer boat box cooling system, wherein the device is applied to a pre-loading chamber, wherein the pre-loading chamber includes a wafer boat box to be cooled, and the pre-loading chamber also includes a cooling base and a thermocouple, wherein the cooling base uses cold water generated by a chiller to cool the pre-loading chamber, and the thermocouple is used to measure the temperature of the wafer boat box, such as Figure 8 As shown, the system 800 may include: The measuring module 801 is used to measure the current temperature of the wafer boat box and calculate the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; The calculation module 802 is used to determine a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas based on a preset cooling ratio and the target total heat value; determine a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the cold water and the cold water flow rate, and the temperature difference of the cold water is the difference between the outlet temperature and the inlet temperature of the chiller; determine a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow rate of the inert gas and the difference between the current temperature and the preset target temperature; The control module 803 is used to control the cold water flow valve of the chiller based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and control the inert gas valve based on the target gas flow so that the inert gas is injected into the pre-loading chamber according to the target gas flow.

[0079] In a possible embodiment, the pre-loading chamber further includes: a vacuum gauge, the vacuum gauge is used to measure the pressure in the pre-loading chamber, and the system further includes: A sampling module is used to measure the current temperature of the wafer box according to a preset sampling period, and when the current temperature does not reach the target temperature, return to the step of calculating the total target heat to be removed based on the difference between the current temperature and the preset target temperature; when the current temperature reaches the target temperature, close the cold water flow valve, and when the pressure in the pre-loading chamber reaches the preset pressure, close the inert gas valve.

[0080] In a possible embodiment, determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: Based on the specific heat capacity, density and temperature difference of the cold water, the cooling efficiency of the cold water is obtained; Determining a target chilled water flow rate of the chiller based on the first heat removal value and the ratio of the cooling efficiency; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: Based on the specific heat capacity of the inert gas and the difference between the current temperature of the wafer boat box and the target temperature, the cooling efficiency of the inert gas is obtained; A target mass flow rate of the inert gas is determined based on a ratio of the first heat removal value and a cooling efficiency of the inert gas.

[0081] According to another aspect of the present invention, a wafer boat box cooling device is provided. Figure 5 As shown, the device comprises: a cold water cooling circuit and an inert gas cooling circuit, the cold water cooling circuit comprises a cooling base, a thermocouple, a chiller and a cold water flow valve, and the inert gas cooling circuit comprises: an inert gas, a mass flow controller, and a gas valve; The cooling base is arranged at the bottom of the pre-loading cavity, and is used to cool the wafer boat box in the pre-loading cavity by using the cold water output by the chiller; The thermocouple is connected to the pre-loading chamber and is used to measure the temperature of the wafer boat box in the pre-loading chamber; The cold water flow valve is used to control the chiller to output cold water to the cooling base based on the target cold water flow rate, the gas valve is used to control the on and off of the inert gas, and the mass flow controller is used to control the injection of the inert gas into the pre-loading chamber based on the target gas flow rate, wherein the target cold water flow rate and the target gas flow rate are obtained by the following steps: measuring the current temperature of the wafer boat box by a thermocouple, and calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature; determining the first removal temperature corresponding to the chiller based on the preset cooling ratio and the target total heat value; The calorific value and the second calorific value removed corresponding to the inert gas; based on the first calorific value removed and the cooling efficiency of the chiller, determining the target cold water flow of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the cold water and the cold water flow, and the temperature difference of the cold water is the difference between the outlet temperature and the inlet temperature of the chiller; based on the second calorific value removed and the cooling efficiency of the inert gas, determining the target gas flow of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow of the inert gas and the difference between the current temperature and the preset target temperature.

[0082] The exemplary embodiment of the present invention further provides an electronic device, comprising: at least one processor; and a memory connected to the at least one processor in communication. The memory stores a computer program that can be executed by the at least one processor, and the computer program is used to enable the electronic device to perform a method according to an embodiment of the present invention when executed by the at least one processor.

[0083] Exemplary embodiments of the present invention also provide a non-transitory computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor of a computer, is used to cause the computer to perform a method according to an embodiment of the present invention.

[0084] An exemplary embodiment of the present invention further provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor of a computer, the computer is used to enable the computer to perform a method according to an embodiment of the present invention.

[0085] refer to Fig. 9 , a block diagram of an electronic device 900 that can be used as a server or client of the present invention will now be described, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0086] like Fig. 9 As shown, the electronic device 900 includes a computing unit 901, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 902 or a computer program loaded from a storage unit 908 into a random access memory (RAM) 903. In the RAM 903, various programs and data required for the operation of the electronic device 900 can also be stored. The computing unit 901, the ROM 902, and the RAM 903 are connected to each other via a bus 904. An input / output (I / O) interface 905 is also connected to the bus 904.

[0087] A plurality of components in the electronic device 900 are connected to the I / O interface 905, including: an input unit 906, an output unit 907, a storage unit 908, and a communication unit 909. The input unit 906 may be any type of device capable of inputting information to the electronic device 900, and the input unit 906 may receive input digital or character information, and generate key signal inputs related to user settings and / or function control of the electronic device. The output unit 907 may be any type of device capable of presenting information, and may include, but is not limited to, a display, a speaker, a video / audio output terminal, a vibrator, and / or a printer. The storage unit 908 may include, but is not limited to, a disk, an optical disk. The communication unit 909 allows the electronic device 900 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks, and may include, but is not limited to, a modem, a network card, an infrared communication device, a wireless communication transceiver, and / or a chipset, such as a Bluetooth™ device, a WiFi device, a WiMax device, a cellular communication device, and / or the like.

[0088] The computing unit 901 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 901 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 901 performs the various methods and processes described above. For example, in some embodiments, the above-mentioned wafer boat box cooling method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 908. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 900 via the ROM 902 and / or the communication unit 909. In some embodiments, the computing unit 901 may be configured to perform the above-mentioned wafer boat box cooling method in any other appropriate manner (e.g., by means of firmware).

[0089] The program code for implementing the method of the present invention can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code can be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0090] In the context of the present invention, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0091] As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., disk, optical disk, memory, programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0092] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0093] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0094] A computer system may include clients and servers. Clients and servers are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship to each other.

Claims

1. A method for cooling a wafer boat box, characterized in that: The method is applied to a pre-loading chamber, wherein the pre-loading chamber includes a wafer boat box to be cooled, and the pre-loading chamber also includes a cooling base and a thermocouple, wherein the cooling base uses cold water generated by a chiller to cool the pre-loading chamber, and the thermocouple is used to measure the temperature of the wafer boat box, and the method includes: Measuring the current temperature of the wafer boat box, and calculating the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; Based on the preset cooling ratio and the target total heat value, determining a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas; Determine a target chilled water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the chilled water and the chilled water flow rate, the temperature difference of the chilled water being the difference between the outlet temperature and the inlet temperature of the chiller; Determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow rate of the inert gas and the difference between the current temperature and a preset target temperature; The cold water flow valve of the chiller is controlled based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and the inert gas valve is controlled based on the target gas flow so that the inert gas is injected into the preloading chamber according to the target gas flow.

2. The method according to claim 1, characterized in that: The pre-loading chamber further includes: a vacuum gauge, the vacuum gauge is used to measure the pressure in the pre-loading chamber, and the method further includes: Measuring the current temperature of the wafer boat box according to a preset sampling period, and returning to the step of calculating the total target heat value to be removed based on the difference between the current temperature and the preset target temperature when the current temperature does not reach the target temperature; When the current temperature reaches the target temperature, the cold water flow valve is closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the inert gas valve is closed.

3. The method according to claim 2, characterized in that The step of determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: Based on the specific heat capacity, density and temperature difference of the cold water, the cooling efficiency of the cold water is obtained; Determining a target chilled water flow rate of the chiller based on the first heat removal value and the ratio of the cooling efficiency; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: Based on the specific heat capacity of the inert gas and the difference between the current temperature of the wafer boat box and the target temperature, the cooling efficiency of the inert gas is obtained; A target mass flow rate of the inert gas is determined based on a ratio of the first heat removal value and a cooling efficiency of the inert gas.

4. The method according to claim 3, characterized in that The calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature includes: Calculate the target total calorie value according to the following formula: Q = m × c × ΔT Wherein, Q is the target total heat value, m is the mass of the wafer boat box, C is the specific heat capacity of the wafer boat box, and ΔT is the difference between the current temperature and the target temperature; The step of determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: The target cold water flow rate is calculated according to the following formula: in, is the target cold water flow rate, is the first heat removal value, is the specific heat capacity of cold water, is the density of cold water, is the temperature difference of the cold water; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: The target mass flow rate of the target gas is calculated according to the following formula: in, For the second removed heat value, is the target mass flow rate of the target gas, is the specific heat capacity of the inert gas, is the difference between the current temperature of the wafer boat box and the target temperature.

5. The method according to claim 3, characterized in that: The inert gas valve includes a gas valve and a mass flow controller; the cold water flow valve for controlling the chiller based on the target cold water flow includes: Controlling the opening of the cold water flow valve based on the target cold water flow, so that the chiller outputs cold water to the cooling base according to the target cold water flow; controlling an inert gas valve based on the target gas flow rate so that the inert gas is injected into the pre-loading chamber according to the target gas flow rate; Opening the gas valve and controlling the mass flow controller according to the target mass flow rate, so that the inert gas is injected into the pre-loading chamber according to the target gas flow rate; The method further comprises: When the current temperature reaches the target temperature, the cold water flow valve and the mass flow controller are closed, and when the pressure in the pre-loading chamber reaches a preset pressure, the gas valve is closed.

6. A wafer boat box cooling system, characterized in that: The system is applied to a pre-loading chamber, the pre-loading chamber includes a wafer boat box to be cooled, the pre-loading chamber also includes a cooling base and a thermocouple, the cooling base uses cold water generated by a chiller to cool the pre-loading chamber, the thermocouple is used to measure the temperature of the wafer boat box, and the system includes: A measuring module, used for measuring the current temperature of the wafer boat box, and calculating the total target heat value to be removed based on the difference between the current temperature and a preset target temperature; A calculation module, for determining a first heat removal value corresponding to the chiller and a second heat removal value corresponding to the inert gas based on a preset cooling ratio and the target total heat value; determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller; the cooling efficiency of the chiller is obtained based on a temperature difference of the cold water and a cold water flow rate, wherein the temperature difference of the cold water is a difference between an outlet temperature and an inlet temperature of the chiller; determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas; the cooling efficiency of the inert gas is obtained based on a mass flow rate of the inert gas and a difference between the current temperature and a preset target temperature; A control module is used to control the cold water flow valve of the chiller based on the target cold water flow so that the chiller outputs cold water to the cooling base according to the target cold water flow; and control the inert gas valve based on the target gas flow so that the inert gas is injected into the pre-loading chamber according to the target gas flow.

7. The system according to claim 6, characterized in that The pre-loading chamber further includes: a vacuum gauge, the vacuum gauge is used to measure the pressure in the pre-loading chamber, and the system further includes: A sampling module is used to measure the current temperature of the wafer box according to a preset sampling period, and when the current temperature does not reach the target temperature, return to the step of calculating the total target heat to be removed based on the difference between the current temperature and the preset target temperature; when the current temperature reaches the target temperature, close the cold water flow valve, and when the pressure in the pre-loading chamber reaches the preset pressure, close the inert gas valve.

8. The system according to claim 7, characterized in that The step of determining a target cold water flow rate of the chiller based on the first heat removal value and the cooling efficiency of the chiller includes: Based on the specific heat capacity, density and temperature difference of the cold water, the cooling efficiency of the cold water is obtained; Determining a target chilled water flow rate of the chiller based on the first heat removal value and the ratio of the cooling efficiency; The step of determining a target gas flow rate of the inert gas based on the second heat removal value and the cooling efficiency of the inert gas comprises: Based on the specific heat capacity of the inert gas and the difference between the current temperature of the wafer boat box and the target temperature, the cooling efficiency of the inert gas is obtained; A target mass flow rate of the inert gas is determined based on a ratio of the first heat removal value and a cooling efficiency of the inert gas.

9. A wafer boat box cooling device, characterized in that: The device comprises: a cold water cooling circuit and an inert gas cooling circuit, wherein the cold water cooling circuit comprises a cooling base, a thermocouple, a chiller and a cold water flow valve, and the inert gas cooling circuit comprises: an inert gas, a mass flow controller and a gas valve; The cooling base is arranged at the bottom of the pre-loading cavity, and is used to cool the wafer boat box in the pre-loading cavity by using the cold water output by the chiller; The thermocouple is connected to the pre-loading chamber and is used to measure the temperature of the wafer boat box in the pre-loading chamber; The cold water flow valve is used to control the chiller to output cold water to the cooling base based on the target cold water flow rate, the gas valve is used to control the on and off of the inert gas, and the mass flow controller is used to control the injection of the inert gas into the pre-loading chamber based on the target gas flow rate, wherein the target cold water flow rate and the target gas flow rate are obtained by the following steps: measuring the current temperature of the wafer boat box by a thermocouple, and calculating the target total heat value to be removed based on the difference between the current temperature and the preset target temperature; determining the first removal temperature corresponding to the chiller based on the preset cooling ratio and the target total heat value; The calorific value and the second calorific value removed corresponding to the inert gas; based on the first calorific value removed and the cooling efficiency of the chiller, determining the target cold water flow of the chiller; the cooling efficiency of the chiller is obtained based on the temperature difference of the cold water and the cold water flow, and the temperature difference of the cold water is the difference between the outlet temperature and the inlet temperature of the chiller; based on the second calorific value removed and the cooling efficiency of the inert gas, determining the target gas flow of the inert gas; the cooling efficiency of the inert gas is obtained based on the mass flow of the inert gas and the difference between the current temperature and the preset target temperature.

10. A non-transitory computer-readable storage medium storing computer instructions, wherein: The computer instructions are used to make a computer execute the method according to any one of claims 1-5.

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