Electronic package and fabrication method thereof

Abstract

An electronic package and a method of fabricating the same, mainly providing an electronic component on a carrier structure, then forming a cladding layer cladding the electronic component, and providing a shielding layer on the cladding layer to cover the electronic component wherein the cladding layer is bonded with a shielding structure such that the shielding structure is located between the shielding layer and the electronic component, by means of a plurality of shielding mechanisms of the shielding structure and the shielding layer, the electronic component is prevented from being interfered by external electromagnetic interference.

Description

Technical Field

[0001] The present invention relates to a semiconductor device, in particular to an electronic package with a shielding structure and a manufacturing method thereof. Background Art

[0002] With the evolution of semiconductor technology, semiconductor products have been developed in different packaging product types. In order to improve electrical quality, many semiconductor products have shielding functions to prevent electromagnetic interference (EMI).

[0003] like Figure 1 As shown, the conventional semiconductor package 1 places a semiconductor chip 11 on a packaging substrate 10, and the semiconductor chip 11 is electrically connected to the packaging substrate 10. Next, a packaging colloid 13 is formed on the packaging substrate 10 to cover the semiconductor chip 11. After that, a shielding layer 12 is formed on the packaging colloid 13 to protect the semiconductor chip 11 from external EMI.

[0004] However, in the existing semiconductor package 1, if the external electromagnetic wave is too strong or the semiconductor chip 11 is a low-frequency component, it will be difficult to prevent the problem of electromagnetic interference by only using a single metal layer as the shielding layer 12, resulting in signal transmission errors of the semiconductor chip 11.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Summary of the invention

[0006] In view of the above-mentioned deficiencies of the prior art, the present invention provides an electronic package and a method for manufacturing the same, which can at least partially solve the problems of the prior art.

[0007] The electronic package of the present invention comprises: a supporting structure; an electronic component, which is arranged on the supporting structure and electrically connected to the supporting structure; a covering layer, which is arranged on the supporting structure and covers the electronic component; a shielding structure, which is combined with the covering layer to cover the electronic component; and a shielding layer, which is arranged on the covering layer and allows the shielding structure to be located between the shielding layer and the electronic component.

[0008] The present invention also provides a method for manufacturing an electronic package, comprising: placing an electronic component on a supporting structure and electrically connecting the electronic component to the supporting structure; forming a coating layer on the supporting structure and coating the electronic component; combining a shielding structure with the coating layer so that the shielding structure covers the electronic component; and forming a shielding layer on the coating layer and positioning the shielding structure between the shielding layer and the electronic component.

[0009] In the aforementioned electronic package and its manufacturing method, the shielding structure includes a plurality of metal layers.

[0010] In the aforementioned electronic package and its manufacturing method, the shielding structure includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer, and the material forming the first metal layer is the same as the material forming the fifth metal layer, and the material forming the second metal layer is the same as the material forming the fourth metal layer.

[0011] In the aforementioned electronic package and its manufacturing method, the shielding structure includes a chromium layer, a nickel layer and / or a copper layer.

[0012] In the aforementioned electronic package and its manufacturing method, the shielding structure is a metal plate made of a single material.

[0013] In the aforementioned electronic packaging component and its manufacturing method, the shielding structure is arranged outside the covering layer.

[0014] In the aforementioned electronic packaging component and its manufacturing method, the shielding structure is embedded in the coating layer.

[0015] The aforementioned electronic package and its manufacturing method further include arranging a shielding member on the supporting structure so that the covering layer covers the shielding member. For example, the shielding member is a metal block or a magnetic conductive block. Alternatively, a plurality of shielding members surrounding the electronic component are arranged on the supporting structure.

[0016] The aforementioned electronic package and its manufacturing method also include a pre-cutting process to allow a cutting tool to pass through the shielding structure and form a cutting groove in the cladding layer. The metal burrs on the side wall of the shielding structure can also be etched away. Then, a singulation process is performed at the position of the cutting groove to allow a cutting tool to pass through the cladding layer and the supporting structure, so that a step structure is formed on the side of the cladding layer.

[0017] From the above, it can be seen that in the electronic package and its manufacturing method of the present invention, the shielding structure is mainly designed to be located between the shielding layer and the electronic component, so that the external electromagnetic interference is reflected away from the electronic component through multiple shielding mechanisms, and even buffered and weakened by these shielding mechanisms. Therefore, compared with the prior art, the electronic components of the electronic package of the present invention will not be affected by electromagnetic interference, thereby effectively improving the reliability of the terminal product.

[0018] Furthermore, the manufacturing method of the present invention can manufacture the electronic package using existing materials, processes and machines, so there is no need to increase or develop new processes and materials, or even purchase machines, so the manufacturing method of the present invention can effectively save manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0020] FIG. 2A to FIG. 2DFIG. 4 is a cross-sectional schematic diagram of a method for manufacturing an electronic package according to a first embodiment of the present invention.

[0021] Figure 2B-1 for Figure 2B A partially enlarged cross-sectional schematic diagram of .

[0022] FIG. 3A to FIG. 3D FIG. 4 is a cross-sectional schematic diagram of a manufacturing method of a second embodiment of an electronic package of the present invention.

[0023] Figure 3A-1 for Figure 3A A cross-sectional schematic diagram of another embodiment of the present invention.

[0024] Figure 4A for Figure 2A A cross-sectional schematic diagram of another embodiment of the present invention.

[0025] Figure 4B for Figure 4A A cross-sectional schematic diagram of another embodiment of the present invention.

[0026] Figure 4B-1 for Figure 4B Schematic top view of .

[0027] Figure 4C for Figure 2A Schematic cross-sectional view of other embodiments.

[0028] Main component symbols

[0029] 1 Semiconductor Package

[0030] 10 Package substrate

[0031] 11. Semiconductor Chip

[0032] 12,22 Shielding

[0033] 13 Encapsulation colloid

[0034] 2,3,4a,4b,4c Electronic packaging

[0035] 2a,3a Shielding structure

[0036] 20 Load-bearing structure

[0037] 20a First side

[0038] 20b Second side

[0039] 20c Side

[0040] 21 Electronic components

[0041] 21a Action surface

[0042] 21b Non-active surface

[0043] 210 Conductive bump

[0044] 23 Coating

[0045] 23a First surface

[0046] 23b Second surface

[0047] 230 Cutting groove

[0048] 23c Side

[0049] 24 Insulation layer

[0050] 25a First metal layer

[0051] 25b Fifth metal layer

[0052] 250 Third Metal Layer

[0053] 251 Second Metal Layer

[0054] 252 Fourth Metal Layer

[0055] 29 Conductive element

[0056] 36 Bonding layer

[0057] 37,38 Shielding

[0058] 37a Top surface

[0059] D1,D2 Width

[0060] S-ladder structure

[0061] L Cutting path. DETAILED DESCRIPTION

[0062] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0063] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", "one", etc. cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0064] FIG. 2A to FIG. 2D It is a cross-sectional schematic diagram of a manufacturing method of a first embodiment of an electronic package 2 of the present invention.

[0065] like Figure 2A As shown, a supporting structure 20 is provided, which has a first side 20a and a second side 20b opposite to each other, and at least one electronic component 21 is disposed on the first side 20a of the supporting structure 20. Next, a coating layer 23 is formed on the first side 20a of the supporting structure 20 so that the coating layer 23 covers the electronic component 21.

[0066] The supporting structure 20 is a circuit structure with a core layer (such as a hard substrate with a dielectric layer and a circuit layer formed on the dielectric layer stacked on the core layer) or a coreless circuit structure (such as a soft substrate with a dielectric layer and a circuit layer formed on the dielectric layer stacked on the core layer).

[0067] In this embodiment, the material forming the circuit layer is copper, and the material forming the dielectric layer is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0068] It should be understood that the supporting structure 20 may also be other carriers for supporting chips, such as an organic board, a wafer, or other carriers with metal routing, and is not limited to the above.

[0069] The electronic component 21 is an active component, a passive component or a combination thereof, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor.

[0070] In the present embodiment, the electronic component 21 is a radio frequency chip, such as a Bluetooth chip or a Wi-Fi chip, but it can also be other electronic components 21 that are not interfered by electromagnetic waves. For example, the electronic component 21 has an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a has a plurality of electrode pads (not shown), so that the electrode pads are disposed on the first side 20a of the supporting structure 20 in a flip chip manner through a plurality of conductive bumps 210 such as solder materials to electrically connect the circuit layer; or, the electronic component 21 can be electrically connected to the circuit layer in a wire bonding manner through a plurality of welding wires (not shown). However, the method for electrically connecting the electronic component 21 to the circuit layer is not limited to the above.

[0071] The coating layer 23 has a first surface 23 a and a second surface 23 b opposite to each other, so that the coating layer 23 is bonded to the first side 20 a of the supporting structure 20 through the second surface 23 b .

[0072] In the present embodiment, the coating layer 23 is an insulating material, such as polyimide (PI), dry film, packaging colloid or molding compound such as epoxy. For example, the coating layer 23 can be formed on the supporting structure 20 by liquid compound, injection, lamination or compression molding.

[0073] like Figure 2B As shown, a shielding structure 2 a is formed on the first surface 23 a of the cladding layer 23 .

[0074] In this embodiment, the shielding structure 2a includes a plurality of metal layers, such as Figure 2B-1 For example, a first metal layer 25a such as chromium, a second metal layer 251 such as nickel, a third metal layer 250 such as copper, a fourth metal layer 252 such as nickel, and a fifth metal layer 25b such as chromium are stacked one after another away from the electronic element 21. The material forming the first metal layer 25a is the same as the material forming the fifth metal layer 25b, and the material forming the second metal layer 251 is the same as the material forming the fourth metal layer 252.

[0075] Furthermore, an insulating layer 24 may be formed on the first surface 23a of the cladding layer 23 so that the insulating layer 24 contacts the first surface 23a of the cladding layer 23 and the first metal layer 25a of the shielding structure 2a. The insulating layer 24 is, for example, a solder mask.

[0076] like Figure 2CAs shown, a pre-cutting (half-cutting) process is performed to form a cutting groove 230 on the first surface 23a of the cladding layer 23. Since in this pre-cutting process, the cutting tool will pass through the metal portion of the shielding structure 2a to generate metal burrs, the sidewall of the shielding structure 2a can be etched by an etching solution to remove the metal burrs extended by the cutting.

[0077] In this embodiment, the pre-cutting process adopts a half-cutting form, so that the cutting groove 230 does not penetrate the supporting structure 20 and the cladding layer 23 .

[0078] like Figure 2D As shown, corresponding to the position of the cutting groove 230, along Figure 2C The cutting path L shown is used for singulation process to form the side surfaces 23c and 20c of the coating layer 23 and the supporting structure 20, respectively. Since the full cutting process only cuts the non-metallic part (i.e., the cutting tool only passes through the coating layer 23 and the supporting structure 20), the problem of metal burrs will not occur. Next, a shielding layer 22 is formed on the shielding structure 2a and the insulating layer 24, and the shielding layer 22 is extended to the side surface 23c of the coating layer 23 and the side surface 20c of the supporting structure 20 to obtain the electronic package 2, wherein the shielding structure 2a is located between the shielding layer 22 and the electronic component 21.

[0079] In this embodiment, after the aforementioned half-cutting process and full-cutting process, the side surface 23 c of the cladding layer 23 is formed into a step structure S through the cutting groove 230 .

[0080] Furthermore, the shielding layer 22 may be formed of materials such as gold, silver, copper (Cu), nickel (Ni), iron (Fe), aluminum (Al), stainless steel (Sus), etc. For example, the shielding layer 22 may be formed by electroplating, coating, sputtering, chemical plating, electroless plating, or evaporation. Alternatively, the shielding layer 22 may also be formed of a metal cover plate or a conductive film, and then provided in a bonding manner.

[0081] In addition, before the singulation process is performed, a plurality of conductive elements 29 such as solder balls can be formed on the second side 20b of the supporting structure 20 as required, and electrically connected to the circuit layer of the supporting structure 20 for subsequent placement of electronic devices such as packaging structures, chips or circuit boards (not shown).

[0082] Therefore, the manufacturing method of the present invention mainly forms the shielding structure 2a between the shielding layer 22 and the electronic component 21, so that the external electromagnetic interference is reflected away from the electronic component 21 through multiple shielding mechanisms, and even buffered and weakened by these shielding mechanisms. Therefore, compared with the prior art, the electronic package 2 of the present invention strengthens the electromagnetic shielding effect of the upper area of ​​the electronic component 21, so that the electronic component 21 will not be affected by electromagnetic interference, thereby improving the reliability of the terminal product.

[0083] Furthermore, the manufacturing method of the present invention can manufacture the electronic package 2 using existing materials, processes and machines, so there is no need to increase or develop new processes and materials, or even purchase machines, so the manufacturing method of the present invention can effectively save manufacturing costs.

[0084] FIG. 3A to FIG. 3D Schematic cross-sectional view of the manufacturing method of the second embodiment of the electronic package 3 of the present invention. The difference between this embodiment and the first embodiment lies in the position of the shielding structure 3a, and the other processes are substantially the same, so the same parts will not be described in detail below.

[0085] like Figure 3A As shown, a supporting structure 20 is provided, which has a first side 20a and a second side 20b opposite to each other, and at least one electronic component 21 is disposed on the first side 20a of the supporting structure 20. Then, at least one shielding member 37 is disposed on the first side 20a of the supporting structure 20.

[0086] In this embodiment, the shielding member 37 comprises a magnetically conductive material, such as a ferrite block or an inductor block. Figure 3A-1 As shown, the shielding member 38 may also be a metal block such as a copper pillar.

[0087] like Figure 3B As shown, continued Figure 3A The manufacturing process shown forms a shielding structure 3 a on the inactive surface 21 b of the electronic component 21 .

[0088] In this embodiment, the shielding structure 3a is a metal plate of a single material, such as a copper sheet, which is disposed on the inactive surface 21b of the electronic component 21 through a bonding layer 36. For example, the bonding layer 36 is a glue material such as epoxy resin.

[0089] Furthermore, the width D2 of the shielding structure 3a is greater than the width D1 of the electronic component 21. For example, the position of the shielding structure 3a relative to the first side 20a of the supporting structure 20 is higher than the position of the top surface 37a of the shielding member 37 relative to the first side 20a of the supporting structure 20.

[0090] like Figure 3CAs shown, a coating layer 23 is formed on the first side 20 a of the supporting structure 20 , so that the coating layer 23 covers the electronic component 21 , the bonding layer 36 , the shielding member 37 and the shielding structure 3 a .

[0091] In this embodiment, the shielding member 37 and the shielding structure 3 a are not exposed outside the cladding layer 23 .

[0092] like Figure 3D As shown, along Figure 3C The singulation process is performed along the cutting path L shown. Next, a shielding layer 22 is formed on the cladding layer 23 and extends to the side surface 20 c of the supporting structure 20 to obtain the electronic package 3 , wherein the shielding structure 3 a is located between the shielding layer 22 and the electronic component 21 .

[0093] In this embodiment, before the singulation process is performed, a plurality of conductive elements 29 such as solder balls can be formed on the second side 20b of the supporting structure 20 as required, and electrically connected to the circuit layer of the supporting structure 20 for subsequent placement of electronic devices such as packaging structures, chips or circuit boards (not shown).

[0094] Furthermore, if Figure 4A The electronic package 4a shown or Figure 4B In the electronic package 4b ​​shown in the figure, the shielding members 37, 38 may also be arranged on the first side 20a of the supporting structure 20 of the first embodiment. For example, a plurality of the shielding members 37 may surround the electronic component 21, such as Figure 4B-1 shown.

[0095] In addition, if Figure 4C In the electronic package 4c shown, the shielding structure 3a may also be provided on the inactive surface 21b of the electronic component 21 of the first embodiment via a bonding layer 36.

[0096] Therefore, the manufacturing method of the present invention mainly configures the shielding layer 22, the shielding structure 2a, 3a and the shielding parts 37, 38 around the electronic component 21, so that when the electronic package 2, 3, 4a, 4b, 4c is in operation, the electronic component 21 will not be affected by external electromagnetic interference (EMI), especially the side of the electronic component 21 can be prevented from being affected by electromagnetic interference. Therefore, compared with the electronic package 2 of the first embodiment, the electronic package 3, 4a, 4b, 4c of the second embodiment has better electrical operation function, thereby further improving the electrical performance of the terminal product.

[0097] Furthermore, the manufacturing method of the present invention can manufacture the electronic packages 3, 4a, 4b, 4c using existing materials, processes and machines, so there is no need to increase or develop new processes and materials, or even purchase machines, so the manufacturing method of the present invention can effectively save manufacturing costs.

[0098] The present invention further provides an electronic package 2, 3, 4a, 4b, 4c, comprising: a supporting structure 20, at least one electronic component 21, a coating layer 23, a shielding layer 22 and a shielding structure 2a, 3a.

[0099] The electronic component 21 is disposed on the supporting structure 20 and electrically connected to the supporting structure 20 .

[0100] The coating layer 23 is disposed on the supporting structure 20 and covers the electronic component 21 .

[0101] The shielding structures 2 a , 3 a are combined with the covering layer 23 to cover the electronic component 21 .

[0102] The shielding layer 22 is disposed on the cladding layer 23 and the shielding structures 2 a, 3 a are located between the shielding layer 22 and the electronic component 21 .

[0103] In one embodiment, the shielding structure 2a includes a plurality of metal layers.

[0104] In one embodiment, the shielding structure 2a includes a first metal layer 25a, a second metal layer 251, a third metal layer 250, a fourth metal layer 252 and a fifth metal layer 25b, and the material forming the first metal layer 25a is the same as the material forming the fifth metal layer 25b, and the material forming the second metal layer 251 is the same as the material forming the fourth metal layer 252.

[0105] In one embodiment, the shielding structure 2a includes a chromium layer, a nickel layer and / or a copper layer.

[0106] In one embodiment, the shielding structure 3 a is a metal plate made of a single material.

[0107] In one embodiment, the shielding structure 2 a is disposed outside the cladding layer 23 .

[0108] In one embodiment, the shielding structure 3 a is embedded in the cladding layer 23 .

[0109] In one embodiment, the electronic package 3, 4a, 4b, 4c further includes shielding members 37, 38 disposed on the supporting structure 20, so that the covering layer 23 covers the shielding members 37, 38. For example, the shielding members 37, 38 are metal blocks or magnetic conductive blocks. Alternatively, a plurality of shielding members 37 surrounding the electronic component 21 are disposed on the supporting structure 20.

[0110] In summary, the electronic package and its manufacturing method of the present invention, through the design that the shielding structure is located between the shielding layer and the electronic component, make the external electromagnetic interference be reflected away from the electronic component through multiple shielding mechanisms, and even be buffered and weakened by these shielding mechanisms. Therefore, the electronic components of the electronic package of the present invention will not be affected by electromagnetic interference, thereby effectively improving the reliability of the terminal product.

[0111] Furthermore, the manufacturing method of the present invention can manufacture the electronic package using existing materials, processes and machines, so there is no need to increase or develop new processes and materials, or even purchase machines, so the manufacturing method of the present invention can effectively save manufacturing costs.

[0112] The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, comprising: load-bearing structure; An electronic component is disposed on the supporting structure and electrically connected to the supporting structure; A coating layer, disposed on the supporting structure and covering the electronic component; A shielding structure, combined with the coating layer to cover the electronic component; as well as The shielding layer is arranged on the covering layer and the shielding structure is located between the shielding layer and the electronic element.

2. The electronic package of claim 1, wherein: The shielding structure includes a plurality of metal layers.

3. The electronic package of claim 1, wherein: The shielding structure includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer. The material forming the first metal layer is the same as the material forming the fifth metal layer, and the material forming the second metal layer is the same as the material forming the fourth metal layer.

4. The electronic package of claim 1, wherein: The shielding structure includes a chromium layer, a nickel layer and / or a copper layer.

5. The electronic package of claim 1, wherein: The shielding structure is a metal plate made of a single material.

6. The electronic package of claim 1, wherein: The shielding structure is arranged outside the covering layer.

7. The electronic package of claim 1, wherein: The shielding structure is embedded in the coating layer.

8. The electronic package of claim 1, wherein: The electronic package also includes a shielding component arranged on the supporting structure, so that the covering layer covers the shielding component.

9. The electronic package of claim 8, wherein: The shielding component is a metal block or a magnetic conductive block.

10. The electronic package of claim 8, wherein: A plurality of the shielding members are arranged on the supporting structure to surround the electronic component.

11. The electronic package of claim 1, wherein: A stepped structure is formed on the side surface of the coating layer.

12. A method for manufacturing an electronic package, comprising: Placing an electronic component on a supporting structure and electrically connecting the electronic component to the supporting structure; forming a coating layer on the supporting structure and covering the electronic component; Combining a shielding structure with the covering layer so that the shielding structure covers the electronic component; as well as A shielding layer is formed on the cladding layer, and the shielding structure is located between the shielding layer and the electronic element.

13. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure includes a plurality of metal layers.

14. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer. The material forming the first metal layer is the same as the material forming the fifth metal layer, and the material forming the second metal layer is the same as the material forming the fourth metal layer.

15. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure includes a chromium layer, a nickel layer and / or a copper layer.

16. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure is a metal plate made of a single material.

17. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure is arranged outside the covering layer.

18. The method for manufacturing an electronic package according to claim 12, wherein: The shielding structure is embedded in the coating layer.

19. The method for manufacturing an electronic package as claimed in claim 12, wherein: The manufacturing method also includes arranging a shielding component on the bearing structure so that the covering layer covers the shielding component.

20. The method for manufacturing an electronic package according to claim 19, wherein: The shielding element is a metal block or a magnetic conductive block.

21. The method for manufacturing an electronic package according to claim 19, wherein: A plurality of shielding members surrounding the electronic component are arranged on the supporting structure.

22. The method for manufacturing an electronic package according to claim 12, wherein: The manufacturing method further comprises performing a pre-cutting process to allow a cutting tool to pass through the shielding structure and form a cutting groove in the cladding layer.

23. The method for manufacturing an electronic package as claimed in claim 22, wherein: The manufacturing method further comprises etching away metal burrs on the sidewall of the shielding structure.

24. The method for making an electronic package as claimed in claim 22, wherein: The manufacturing method further comprises performing a singulation process corresponding to the cutting groove position so as to allow a cutting tool to pass through the coating layer and the bearing structure, so that a side surface of the coating layer forms a step structure.

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