Heating device of semiconductor equipment and semiconductor equipment

Abstract

The invention provides a heating device of semiconductor equipment, the semiconductor equipment comprises a process chamber, the heating device comprises a lamp box and a heating lamp, the heating lamp is arranged in the lamp box, and the lamp box is rotatably arranged above the process chamber and used for heating a wafer in the process chamber; the lamp box is connected with a driving mechanism which is used for driving the lamp box to rotate. The lamp box is arranged above the process chamber in a rotatable mode, and the lamp box is driven to rotate through the driving mechanism. In the technological process, the lamp box is used for driving the heating lamp to rotate to heat the wafer in the technological chamber, the wafer does not need to be rotated, the problems that an existing magnetic suspension system is complex in structure, poor in stability and high in cost are solved, and the stability of a machine table can be improved and the cost of the machine table can be reduced while the uniformity of an existing wafer technology is kept.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and more specifically relates to a heating device for semiconductor equipment and semiconductor equipment. Background Art

[0002] In semiconductor equipment, for the rapid heating process (RTP), hundreds of halogen lamps are usually used to heat the wafer. In order to achieve process uniformity, the wafer is usually rotated at a constant speed of several hundred revolutions per minute during the process. At the same time, hundreds of halogen lamps are located on the upper end of the wafer and cover the entire area of ​​the wafer. The wafer is heated in real time during the process. When the process stops, hundreds of halogen lamps stop heating synchronously. At present, the rotation of the wafer is usually achieved through a magnetic levitation system. The rotor in the magnetic levitation system is located inside the process chamber, and the stator in the magnetic levitation system is located outside the process chamber. However, the magnetic levitation system has complex structure, poor stability, affects process uniformity, and is costly. Summary of the invention

[0003] Based on the technical problems existing in the prior art, the present invention proposes a heating device for semiconductor equipment and semiconductor equipment, aiming to solve the technical problems of the magnetic suspension system in the semiconductor equipment, such as complex structure, poor stability, affecting process uniformity and high cost.

[0004] To achieve the above-mentioned purpose, according to one aspect of the present invention, a heating device for a semiconductor device is provided, the semiconductor device includes a process chamber, the heating device includes a light box and a heating lamp, the heating lamp is arranged in the light box, and the light box is rotatably arranged above the process chamber for heating the wafer in the process chamber; the light box is connected to a driving mechanism, and the driving mechanism is used to drive the light box to rotate.

[0005] Optionally, the driving mechanism includes a driving motor and a transmission assembly, the power input end of the transmission assembly is connected to the power output end of the driving motor, the power output end of the transmission assembly is connected to the light box, and the transmission assembly can drive the light box to rotate by rotating the driving motor.

[0006] Optionally, the transmission assembly includes a synchronous pulley and a synchronous belt. The synchronous pulley is arranged on the output shaft of the driving motor, and the synchronous pulley is connected to the light box through the synchronous belt.

[0007] Optionally, the driving mechanism further includes a coupling, and the driving motor is connected to the synchronous pulley via the coupling.

[0008] Optionally, the interior of the light box has a cooling channel.

[0009] Optionally, the cooling channel extends along the circumference of the lamp box.

[0010] Optionally, the heating lamp is arranged horizontally or vertically in the light box.

[0011] Optionally, there are multiple heating lamps, and the multiple heating lamps are divided into multiple heating lamp groups, and the multiple heating lamp groups are distributed along the vertical direction or the horizontal direction.

[0012] Optionally, each heating lamp group includes a plurality of heating lamps, and the plurality of heating lamps in each heating lamp group are distributed in a horizontal direction.

[0013] According to another aspect of the present invention, there is provided a semiconductor device comprising the above-mentioned heating device.

[0014] The present invention provides a heating device for semiconductor equipment and semiconductor equipment. A light box is rotatably arranged above a process chamber, and a driving mechanism is used to drive the light box to rotate. During the process, the light box is used to drive a heating lamp to rotate to heat the wafer in the process chamber. Therefore, there is no need to rotate the wafer, which solves the problems of complex structure, poor stability and high cost of the existing magnetic suspension system. While maintaining the uniformity of the existing wafer process, the stability of the machine can be improved and the cost of the machine can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A schematic structural diagram of a heating device for a semiconductor device provided in some embodiments of the present invention; Figure 2 A schematic structural diagram of a heating device for a semiconductor device provided in some other embodiments of the present invention.

[0017] The reference numerals in the above drawings are as follows: 1. Process chamber; 2. Wafer; 3. Edge ring; 4. Support ring; 5. Air inlet channel; 6. Air outlet channel; 7. Light box; 8. Heating lamp; 9. Sealing plate; 10. Drive motor; 11. Synchronous pulley; 12. Synchronous belt; 13. Coupling; 14. Cooling channel; 15. Lamp holder substrate; 16. Slip ring structure; 17. Skeleton. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Please refer to Figure 1As shown, it shows the preferred structure of the semiconductor device provided by the embodiment of the present invention. As shown in the figure, the semiconductor device includes a process chamber 1 and a heating device, wherein an edge ring 3 for carrying a wafer 2 is arranged inside the process chamber 1, and the edge ring 3 is arranged above the bottom of the process chamber 1 through a support ring 4, so that the wafer 2 is located at the process position; the top of the process chamber 1 has an opening, and the heating device is arranged at the opening of the process chamber 1; the side wall of the process chamber 1 has an inlet channel 5 and an outlet channel 6 arranged oppositely, and the process gas enters the process chamber 1 through the inlet channel 5, reaches the surface of the wafer 2, and after performing the process reaction in the process chamber 1, it is discharged from the process chamber 1 through the outlet channel 6.

[0024] See also Figure 1 As shown, in some embodiments, the heating device includes a light box 7 and a heating lamp 8, and the heating lamp 8 is arranged in the light box 7. For example, the light box 7 is cylindrical, and a plurality of heating lamps 8 are installed in the light box 7. Each heating lamp 8 is vertically installed in the light box 7, and the plurality of heating lamps 8 are arranged in a honeycomb shape; a sealing plate is also provided at the bottom of the light box 7 to seal the light box 7. For example, the sealing plate 9 is a flat plate, which is located between the top opening of the process chamber 1 and the bottom of the light box 7, and is tightly fitted to the top edge of the process chamber 1 to separate the light box 7 from the process chamber 1; of course, the light box 7 and the sealing plate 9 can also be other shapes.

[0025] The light box 7 is rotatably disposed above the process chamber 1, and is used to heat the wafer 2 in the process chamber 1. Specifically, the light box 7 rotates around its central axis, so as to heat the wafer 2 uniformly.

[0026] The light box 7 is connected to a driving mechanism for driving the light box 7 to rotate. Specifically, the power output end of the driving mechanism can be connected to the light box 7 to rotate the light box 7, and then the heating lamp 8 is driven to rotate under the action of the light box 7 to achieve uniform heating of the wafer 2.

[0027] By applying the above technical solution of the present invention, the light box 7 is rotatably arranged above the process chamber 1, and the light box 7 is driven to rotate by a driving mechanism. During the process, the light box 7 is used to drive the heating lamp 8 to rotate to heat the wafer 2 in the process chamber 1. Therefore, there is no need to rotate the wafer 2, which solves the problems of complex structure, poor stability and high cost of the existing magnetic suspension system. While maintaining the uniformity of the existing wafer process, the stability of the machine can be improved and the cost of the machine can be reduced.

[0028] See also Figure 1As shown, in some embodiments, the driving mechanism includes a driving motor 10 and a transmission assembly, the power input end of the transmission assembly is connected to the power output end of the driving motor 10, the power output end of the transmission assembly is connected to the light box 7, and the transmission assembly can drive the light box 7 to rotate through the rotation of the driving motor 10. Specifically, the output shaft of the driving motor 10 is connected to the light box 7 through the transmission assembly, so that the light box 7 rotates, and then the heating lamp 8 is driven to rotate under the action of the rotation of the light box 7, so as to achieve uniform heating of the wafer 2.

[0029] See also Figure 1 As shown, in some embodiments, the transmission assembly includes a synchronous pulley 11 and a synchronous belt 12, and the synchronous pulley 11 is arranged on the output shaft of the driving motor 10, and the synchronous pulley 11 and the light box 7 are connected by the synchronous belt 12. Specifically, the synchronous belt 12 is wound between the synchronous pulley 11 and the light box 7, and the synchronous pulley 11 is driven by the driving motor 10 to rotate, thereby driving the synchronous belt 12 to rotate, thereby driving the light box 7 to rotate, and realizing the heating lamp 8 to rotate and heat. The driving motor 10 and the light box 7 are connected and transmitted by the synchronous pulley 11 and the synchronous belt 12. The transmission structure is reliable, the movement and braking accuracy are high, the stability of the machine is improved, and the transmission structure is simple, which greatly saves the equipment cost. Among them, the synchronous pulley 11 can be a gear, a sprocket or a pulley, and the synchronous belt 12 can be a toothed belt, a chain or a belt. Of course, the transmission assembly can also adopt other transmission structures, such as a transmission structure in which gears are meshed with gears, which is not limited here.

[0030] See also Figure 1 As shown, in some embodiments, the driving mechanism further includes a coupling 13, and the driving motor 10 is connected to the synchronous pulley 11 through the coupling 13. Specifically, the output shaft of the driving motor 10 is connected to the rotating shaft of the synchronous pulley 11 through the coupling 13.

[0031] See also Figure 1 As shown, in some embodiments, the interior of the lamp box 7 has a cooling channel 14 for cooling the heating lamp 8 in the lamp box 7. The cooling channel 14 has an inlet and an outlet for the cooling medium to flow in and out. The cooling medium can be cooling gas or cooling liquid.

[0032] See also Figure 1 As shown, in some embodiments, the cooling channel extends along the circumference of the light box 7. For example, the heating lamps 8 in the light box 7 are arranged in a honeycomb shape, and an annular cooling channel 14 is formed around the light box 7, which can effectively cool the heating lamps 8, thereby protecting the heating lamps and extending their service life.

[0033] See also Figure 2As shown, in some embodiments, the heating lamp 8 is horizontally or vertically arranged in the light box 7. For example, the heating lamp 8 adopts a long lamp tube, which is horizontally placed in the light box 7, that is, the length of the lamp tube extends in the horizontal direction, wherein the length of the lamp tube is greater than the diameter of the wafer, thereby greatly reducing the number of heating lamps 8, reducing the complexity of controlling the heating lamp 8, simplifying the control of the heating lamp 8, facilitating installation and maintenance, and the corresponding structure of the light box 7 and the cooling structure in the light box 7 can also be simplified, thereby simplifying the system and achieving effective cost reduction; or the heating lamp 8 is vertically arranged in the light box 7, for example, a short lamp tube is adopted, the length of the lamp tube extends in the vertical direction, and multiple short lamp tubes are horizontally arranged in the light box 7 according to the required heating range of the wafer to cover the required heating range.

[0034] See also Figure 2 As shown, in some embodiments, the number of heating lamps 8 is multiple, and the multiple heating lamps 8 are divided into multiple heating lamp groups, and the multiple heating lamp groups are distributed in the vertical direction or the horizontal direction. For example, the multiple heating lamps 8 are divided into two heating lamp groups, and the two heating lamp groups are arranged up and down, wherein each heating lamp 8 in each heating lamp group adopts a long lamp tube arranged horizontally, which can reduce the number of heating lamps 8 installed and meet the heating temperature requirements. Of course, multiple heating lamp groups can also be arranged in the horizontal direction, and each heating lamp 8 in each heating lamp group is arranged vertically, and the present invention is not limited here.

[0035] In some embodiments, each heating lamp group includes a plurality of heating lamps 8, and the plurality of heating lamps 8 in each heating lamp group are distributed in the horizontal direction. Specifically, each heating lamp group includes a plurality of long lamp tubes, each long lamp tube is arranged horizontally, and the plurality of long lamp tubes in each heating lamp group are evenly distributed in the horizontal direction.

[0036] See also Figure 1 and Figure 2 As shown, in some embodiments, the output shaft of the driving motor 10 drives the synchronous pulley 11 to rotate, and the synchronous pulley 11 drives the light box 7 to rotate through the synchronous belt 12, and the heating lamp 8 rotates synchronously with the light box 7. A lamp holder substrate 15 is provided above the light box 7, and the heating lamp 8 is connected to the lamp holder substrate 15, wherein the lamp holder substrate 15 is a PCB circuit board. The lamp holder substrate 15 transmits electrical signals to the electric control cabinet and the power cabinet of the machine through the slip ring structure 16, and the common slip ring structure 16 is an electrical slip ring. The lamp holder substrate 15 transmits electrical signals by contacting with the slip ring structure 16. During the rotation of the light box 7, the electrical contact point of the electrical slip ring transmits current or signals by rolling or sliding. Among them, the slip ring structure 16 is fixed on the skeleton 17 and does not rotate itself, thereby avoiding spraining of the wire during rotation.

[0037] It can be understood that the light box 7 is a rotating light box 7 structure, and the sealing structure between the light box 7 and the process chamber 1 can be a rotating sealing structure.

[0038] According to another aspect of the present invention, a semiconductor device is provided, comprising the above-mentioned heating device. It is understandable that the beneficial effects of the above-mentioned semiconductor device can be found in the relevant description of the above-mentioned heating device of the semiconductor device, which will not be repeated here.

[0039] In summary, the heating device for semiconductor equipment and the semiconductor equipment provided by this embodiment have at least the following beneficial technical effects: (1) During the process, the driving motor and the light box 7 are connected and driven by the synchronous pulley 11 and the synchronous belt 12, so that the light box 7 rotates and drives the heating lamp 8 to rotate to heat the wafer 2 in the process chamber 1. There is no need to rotate the wafer 2. While maintaining the uniformity of the existing wafer process, the stability of the machine is improved and the cost of the machine is reduced; (2) Since the light box 7 is rotatable, the heating lamp 8 can have different forms, and the installation method can be adjusted as needed, thereby effectively reducing the number of heating lamps 8 and reducing the difficulty of installation and maintenance; (3) The present invention has a simple structure and is easy to operate. It is not only applicable to RTP process chambers, but also applicable to other process chambers with similar heating functions of semiconductor equipment.

[0040] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A heating device for a semiconductor device, characterized in that: The semiconductor equipment includes a process chamber, the heating device includes a light box and a heating lamp, the heating lamp is arranged in the light box, and the light box is rotatably arranged above the process chamber, for heating the wafer in the process chamber; The light box is connected to a driving mechanism, and the driving mechanism is used to drive the light box to rotate.

2. The heating device for semiconductor equipment according to claim 1, characterized in that: The driving mechanism includes a driving motor and a transmission assembly, wherein a power input end of the transmission assembly is connected to a power output end of the driving motor, and a power output end of the transmission assembly is connected to the light box. The transmission assembly can drive the light box to rotate by rotating the driving motor.

3. The heating device for semiconductor equipment according to claim 2, characterized in that: The transmission assembly includes a synchronous pulley and a synchronous belt. The synchronous pulley is arranged on the output shaft of the driving motor. The synchronous pulley is connected to the light box through the synchronous belt.

4. The heating device for semiconductor equipment according to claim 3, characterized in that: The driving mechanism further comprises a coupling, and the driving motor is connected to the synchronous pulley via the coupling.

5. The heating device for semiconductor equipment according to claim 1, characterized in that: The interior of the light box is provided with a cooling channel.

6. The heating device for semiconductor equipment according to claim 5, characterized in that: The cooling channel extends along the circumference of the lamp box.

7. The heating device for semiconductor equipment according to claim 1, characterized in that: The heating lamp is arranged horizontally or vertically in the light box.

8. The heating device for semiconductor equipment according to claim 7, characterized in that: There are multiple heating lamps, and the multiple heating lamps are divided into multiple heating lamp groups. The multiple heating lamp groups are distributed along the vertical direction or the horizontal direction.

9. The heating device for semiconductor equipment according to claim 8, characterized in that: Each of the heating lamp groups includes a plurality of the heating lamps, and the plurality of heating lamps in each of the heating lamp groups are distributed in a horizontal direction.

10. A semiconductor device, characterized in that: The heating device comprises a heating device as claimed in any one of claims 1 to 9.

Images