Preparation process of solder resist hole plugging ink for via hole of printed circuit board

Abstract

The invention relates to a preparation process of solder resist hole plugging ink for a via hole of a printed circuit board, and relates to the technical field of preparation of the printed circuit board. The invention also adopts a device for preparing the solder resist hole plugging ink for the via hole of the printed circuit board, and the preparation device comprises two bearing seats which are symmetrically distributed up and down and are used for bearing the printed circuit board, and can solve the following problems in the prior art: firstly, the solder resist hole plugging ink is used for preparing the solder resist hole plugging ink for the via hole of the printed circuit board; in the prior art, only a single printed circuit board can be subjected to resistance welding hole plugging operation, and different batches of printed circuit boards cannot be subjected to resistance welding hole plugging operation; secondly, in the prior art, the hole plugging ink of the printed circuit board is cured one by one, so that the whole curing time is long, and the processing efficiency is low; afterwards, clamping equipment in the prior art only clamps the printed circuit board in a unilateral limiting mode, and when the printed circuit board is extruded by external force, the printed circuit board is easy to deviate, and even the printed circuit board is broken.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board preparation, and in particular to a process for preparing solder resist plugging ink for via holes in printed circuit boards. Background Art

[0002] The solder mask plugging ink preparation process for printed circuit board (PCB) via holes is a technology specifically used in the PCB production process. Its purpose is to fill the via holes with solder mask ink to prevent solder from penetrating into the holes during the soldering process, thereby protecting the conductive properties and mechanical strength of the circuit board.

[0003] For example, a Chinese patent with publication number CN116390359A discloses a process for preparing solder mask plugging ink for printed circuit board via holes, which is completed by a coating device, which includes a support frame, a moving mechanism and a plugging mechanism. In the plugging mechanism designed by the invention, two feeding pumps cooperate with the feeding pipe during the movement toward each other to simultaneously feed the front and rear sides of the via hole, so that the front and rear sides of the via hole are plugged at the same time, reducing the time for solder mask plugging on both sides of the printed circuit board respectively, and improving the efficiency of solder mask plugging on the printed circuit board; the cleaning round rod and the cleaning sponge can clean the via hole, so that the surface of the via hole after cleaning is smoother and neater, and the adhesion between the via hole and the subsequent solder mask plugging ink is increased.

[0004] However, the above-mentioned solder mask plugging ink preparation process for printed circuit board via holes still has some shortcomings in actual use:

[0005] 1. First, the plugging mechanism of the above-mentioned prior art design can simultaneously feed the front and rear sides of the via hole through the cooperation of two feeding pumps and the feeding pipe, thereby reducing the time for solder mask plugging on both sides of the printed circuit board. However, it can only perform solder mask plugging operations on a single hole on the printed circuit board. With the development of printed circuit board technology, the shapes of existing printed circuit boards are different, and the positions of the via holes on the upper printed circuit boards are also different. Therefore, the efficiency of performing solder mask plugging operations on a single hole of the printed circuit board is very low, and the prior art can only perform solder mask plugging operations on a single printed circuit board, which leads to its certain singleness and inability to perform solder mask plugging operations on printed circuit boards of different batches.

[0006] 2. Secondly, in the prior art, the curing time of solder mask ink ranges from a few minutes to tens of minutes. In order to obtain the best curing effect, it is recommended to follow the guidance and recommended parameters provided by the ink manufacturer. A multi-layer heating process is often required, which will result in a longer curing time for the solder mask ink. If the solder mask plugging operation and the solder mask ink heating film forming operation are performed one by one on the via holes of the printed circuit board, the efficiency is very low, which will eventually lead to a situation where the printed circuit board is in short supply.

[0007] 3. In the prior art, when clamping a printed circuit board, the clamping device in the prior art only clamps the printed circuit board in a unilateral limiting manner. When an external force squeezes the printed circuit board, it is easy to cause the printed circuit board to shift, or even break.

[0008] Therefore, based on the above-stated viewpoints, there is still room for improvement in the existing process for preparing solder mask plugging ink for printed circuit board via holes. Summary of the invention

[0009] In order to solve the above problems, the present invention provides a process for preparing solder resist plugging ink for via holes of a printed circuit board.

[0010] A process for preparing solder mask plugging ink for via holes in a printed circuit board comprises the following steps:

[0011] S1. Preparation: Prepare solder mask plugging ink for plugging the via holes of the printed circuit board and check whether the whole equipment is operating normally;

[0012] S2. Printed circuit board transportation: transport the printed circuit boards to be processed in batches and allow them to enter the designated processing area for processing in turn;

[0013] S3, solder mask plugging holes on the printed circuit board: fill the pre-prepared solder mask plugging hole ink into several via holes on the printed circuit board and around several via holes on the printed circuit board at the same time, and make it cover all the via holes on the printed circuit board;

[0014] S4, heating and curing to form a film: a plurality of via holes on the printed circuit board are simultaneously heated to cure the solder resist plugging ink filled in the plurality of via holes on the printed circuit board to form a film;

[0015] S5. Batch operation: The positions and sizes of several via holes on the upper end of different types of printed circuit boards are inconsistent. Therefore, the solder mask plugging ink filling device corresponding to the via holes of the printed circuit board is quickly replaced to achieve solder mask plugging of the via holes of different types of printed circuit boards.

[0016] In addition, a solder mask plugging ink preparation device for the via holes of a printed circuit board is used to complete the process. The preparation device includes two supporting seats that are symmetrically distributed up and down and are used to support the printed circuit boards. A conveyor for transporting the printed circuit boards is provided on the supporting seats. Regulators for adjusting the distance between the two are provided on both sides of the supporting seats, and the supporting seats are set on a supporting frame through the regulator, and the supporting frame is set on the ground.

[0017] A plugging part for performing synchronous solder resist plugging operation on the conductive holes on the printed circuit board is arranged on the support frame and located on both sides of the supporting seat, and a curing part for curing the ink used for solder resist plugging is arranged on the plugging part.

[0018] Preferably, the plugging portion includes an ink storage plate distributed parallel to the printed circuit board to be processed and an inkjet tube integrally connected to the ink storage plate, the ink storage plates are symmetrically arranged on the support frame, and the inkjet tubes on the two ink storage plates are relatively distributed.

[0019] The support frame is also provided with an injector for injecting ink, and a connecting pipe is installed on the injector. One end of the connecting pipe away from the injector is movably installed on the ink filling port on the back side of the ink storage plate by means of threaded connection.

[0020] Preferably, the curing component includes a heating plate slidably mounted on the ink storage plate and a conductive hood for heat conduction arranged on the heating plate, the heating plate is slidably mounted on the inkjet tube of the ink storage plate, the conductive hood is arranged at one end of the heating plate away from the ink storage plate, and the conductive hood and the heating plate are penetrated on the inkjet tube.

[0021] The heating plate is provided with a power harness connected to an external power source by plugging.

[0022] Preferably, a replacement component for quickly replacing printed circuit boards of different models is provided on the back side of the ink storage plate, and the replacement component includes a fixing block, a clamping block, a partition, a clamping spring, a clamping cone block and a traction rope.

[0023] The clamping block is installed on the back side of the ink storage plate, and the fixed block is slidably inserted on the side of the clamping block away from the ink storage plate. The fixed block is a hollow structure, and the partition is arranged at the inner middle part of the fixed block. The clamping spring is symmetrically arranged at both ends of the partition and extends to the outside of the fixed block. The clamping cone block is arranged on the side of the clamping spring away from the partition, and the clamping cone block slides through the fixed block to extend to the outside of the fixed block, and the inclined surface of the clamping cone block is distributed in the direction of the clamping block. A square groove for the clamping cone block to slide is provided on the fixed block, and the two ends of the traction rope are respectively connected to one side of the two clamping cone blocks close to the clamping spring, and the middle part of the traction rope slides through the fixed block along the middle part of the clamping spring and is arranged on the upper side of the fixed block, and a traction groove for the traction rope to slide is provided on the fixed block.

[0024] Preferably, the support frame is also provided with a synchronization unit for synchronously regulating the two plug hole parts to synchronously process the two side surfaces of the printed circuit board, and the synchronization unit includes a T-shaped block, a bidirectional screw, a slider, a one-way cylinder and a synchronous motor.

[0025] The T-shaped block is slidably installed in the length direction of the support frame, the bidirectional screw is rotatably installed on the T-shaped block, the slider is symmetrically arranged on the bidirectional screw and slidably arranged on the T-shaped block, the one-way cylinder is installed on the slider, and the output end of the one-way cylinder faces upward, the output end of the one-way cylinder is connected to the fixed block, and the synchronous motor is installed on the bidirectional screw.

[0026] Preferably, the adjuster includes two groups of adjustment columns and an adjustment threaded rod which are vertically upward and arranged on both sides of the upper end of the support frame along the length direction of the support frame. Execution blocks are installed at both ends of the support seat. The execution blocks are slidably passed through the adjustment columns, and the support seat is connected to the adjustment threaded rod by a threaded connection. The adjustment threaded rod is a bidirectional threaded structure.

[0027] Preferably, an opening and closing component for opening and closing the solder resist plugging ink is also provided in the inkjet tube of the ink storage plate, and the opening and closing component includes a sensing sheet, a sensing spring, a linkage rope and an opening and closing sheet.

[0028] The sensing plate is slidably arranged on the inner wall of the inkjet tube, the sensing spring is arranged between the sensing plate and the inkjet tube through a protective tube, the linkage rope is installed at one end of the sensing plate away from the ink outlet of the inkjet tube, the end of the linkage rope away from the sensing plate slides through the inkjet tube and is arranged on an opening and closing plate, and the opening and closing plate is symmetrically hinged at the ink outlet of the inkjet tube through a torsion spring.

[0029] Preferably, the conveyor includes conveying rollers, conveying springs, conveying belts, clamping rollers, clamping springs and conveying motors; the conveying rollers are rotatably installed on both sides of the supporting seat in the length direction through conveying springs, the conveying belts are sleeved on two conveying rollers, the clamping springs are arranged on the inner side of the supporting seat at equal intervals along the length direction of the supporting seat, the clamping rollers are arranged on the clamping springs through auxiliary frames, and the clamping rollers are abutted against the conveying belts, and the conveying motor is arranged on the conveying rollers on one side.

[0030] Preferably, a heat insulation layer is provided on the surface of the inkjet tube and the opening and closing piece.

[0031] Preferably, a plurality of friction rollers are arranged at equal intervals on the inner side of the supporting seat.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] 1. The plugging part of the present invention can simultaneously block a plurality of conductive holes on an entire printed circuit board, which greatly reduces the time for blocking the printed circuit board and improves its processing efficiency. The heating plate can also heat and cure the conductive holes on the printed circuit board at the same time, avoiding the problem of poor efficiency caused by processing the conductive holes of the printed circuit board one by one.

[0034] 2. The adjuster in the present invention is mainly used to adjust the distance between the two supporting seats. By adjusting the distance between the two supporting seats, printed circuit boards of different sizes can be effectively clamped and conveyed. At the same time, the two ends of the printed circuit board are limited by the two supporting seats, which can avoid displacement and breakage of the printed circuit board when processing the printed circuit board.

[0035] 3. The conveyor in the present invention is arranged on the regulator, and the conveyor can effectively ensure the movement of the printed circuit board between the supporting seats, avoiding the complicated operation of manual loading and unloading of the printed circuit board, and greatly improving the processing efficiency of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0037] Figure 1 It is a schematic diagram of the main structure of the present invention.

[0038] Figure 2 It is a schematic diagram of the structure of the regulator of the present invention.

[0039] Figure 3 It is a schematic diagram of the structure between the conveyor and the regulator of the present invention.

[0040] Figure 4 It is a structural explosion diagram of the conveyor of the present invention.

[0041] Figure 5 It is a schematic diagram of the structure between the plugging part and the curing member of the present invention.

[0042] Figure 6 It is a schematic diagram of the structure among the plugging part, the curing part and the synchronization unit of the present invention.

[0043] Figure 7 It is a schematic structural diagram of the plugging hole portion of the present invention.

[0044] Figure 8 The present invention Figure 7 A partial enlarged view of point B in FIG.

[0045] Fig. 9 It is a first-view structural schematic diagram of the replacement component of the present invention.

[0046] Fig.10 It is a second perspective structural schematic diagram of the replacement component of the present invention.

[0047] Fig.11 The present invention is a flow chart of a process for preparing solder resist plugging ink for via holes of a printed circuit board.

[0048] In the figure, A, printed circuit board; 1, support seat; 2, conveyor; 3, regulator; 4, support frame; 5, plug hole part; 6, curing part; 50, ink storage plate; 51, inkjet tube; 52, ejector; 53, connecting pipe; 54, ink filling port; 60, heating plate; 61, conductive cover; 62, power harness; 7, replacement component; 70, fixing block; 71, clamping block; 72, partition; 73, clamping spring; 74, clamping cone block; 75, traction rope; 8, Synchronous unit; 80, T-block; 81, bidirectional screw; 82, one-way cylinder; 83, slider; 84, synchronous motor; 30, adjusting column; 31, adjusting threaded rod; 32, execution block; 55, opening and closing component; 550, induction plate; 551, induction spring; 552, linkage rope; 553, opening and closing plate; 20, conveying roller; 21, conveying spring; 22, conveying belt; 23, clamping roller; 24, clamping spring; 25, conveying motor; 26, friction roller. DETAILED DESCRIPTION

[0049] The following is combined with Figure 1-Figure 11 While embodiments of the invention have been described in detail, the invention can be implemented in many different ways as defined and covered by the claims.

[0050] The embodiment of the present application discloses a process for preparing solder resist plugging ink for via holes of a printed circuit board. It is explained that the process for preparing solder resist plugging ink for via holes of a printed circuit board is mainly used in the process of performing solder resist on the via holes of a printed circuit board A. In terms of technical effect, the shapes of the existing printed circuit boards A are all different, and the positions of the via holes of the upper printed circuit boards A are also different. Therefore, the efficiency of performing solder resist plugging on a single hole of the printed circuit board A is very low, and the existing technology can only perform solder resist plugging on a single printed circuit board A, which results in a certain degree of singleness and an inability to perform solder resist plugging on printed circuit boards A of different batches.

[0051] Secondly, in the prior art, the curing time of solder mask ink ranges from a few minutes to tens of minutes. In order to obtain the best curing effect, it is recommended to follow the guidance and recommended parameters provided by the ink manufacturer. A multi-layer heating process is often required, which will result in a longer curing time for the solder mask ink. If the solder mask plugging operation and the solder mask ink heating film forming operation are performed one by one on the via holes of the printed circuit board A, the efficiency is very low, which will eventually lead to a situation where the printed circuit board A is in short supply.

[0052] Embodiment 1:

[0053] Reference Figure 1As shown, this embodiment is completed by using a device for preparing solder mask plugging ink for via holes of a printed circuit board, the preparation device includes two supporting seats 1 symmetrically distributed up and down and used to support the printed circuit board A, the supporting seat 1 is provided with a conveyor 2 for transporting the printed circuit board A, and the supporting seat 1 is provided with adjusters 3 on both sides of the supporting seat 1 for adjusting the distance therebetween, and the supporting seat 1 is arranged on a supporting frame 4 through the adjuster 3, and the supporting frame 4 is arranged on the ground.

[0054] It should be noted that the adjuster 3 is a structural schematic diagram of adjusting the distance between the two supporting seats 1 in the present invention. By adjusting the distance between the two supporting seats 1, the printed circuit boards A of different sizes can be effectively clamped and conveyed. At the same time, the two ends of the printed circuit board A are limited by the two supporting seats 1, so that the printed circuit board A can be prevented from being displaced and broken when processing the printed circuit board A.

[0055] The conveyor 2 is arranged on the regulator 3, and the conveyor 2 can effectively ensure the movement of the printed circuit board A between the supporting seats 1, avoiding the complicated operation of manual loading and unloading of the printed circuit board A, and greatly improving the processing efficiency of the printed circuit board A.

[0056] A plugging portion 5 for performing simultaneous solder resist plugging operations on the conductive holes on the printed circuit board A is provided on the support frame 4 and located on both sides of the support seat 1. A curing member 6 for curing the ink used for solder resist plugging is provided on the plugging portion 5.

[0057] After the printed circuit board A is placed on the conveyor 2 and the support seat 1, the plugging portion 5 blocks the conductive holes on the printed circuit board A, and the curing member 6 heats and cures the blocked conductive holes, including the sealing of the blocked conductive holes.

[0058] The plugging portion 5 in the present invention can simultaneously perform blocking operations on a plurality of conductive holes on an entire printed circuit board A, which greatly reduces the time for blocking processing of the printed circuit board A and improves its processing efficiency. The heating plate 60 can also heat and cure the conductive holes on the printed circuit board A at the same time, avoiding the problem of poor efficiency caused by processing the conductive holes of the printed circuit board A one by one.

[0059] Reference Figure 2 As shown, that is, a structural schematic diagram of the position adjustment of the supporting seat 1 in this embodiment; the adjuster 3 includes two groups of adjusting columns 30 and an adjusting threaded rod 31 which are vertically upward and arranged on both sides of the support frame 4 along the length direction of the support frame 4 at the upper end of the support frame 4, the supporting seat 1 is slidably penetrated through the adjusting columns 30, and the supporting seat 1 is connected to the adjusting threaded rod 31 by a threaded connection, and the adjusting threaded rod 31 is a bidirectional threaded structure.

[0060] First, the two supporting seats 1 are distributed up and down, and the distance between the two supporting seats 1 is relatively far. When the printed circuit board A needs to be processed, the printed circuit board A is placed on the supporting seat 1 on one side, and then the adjusting threaded rod 31 is rotated. The adjusting threaded rod 31 drives the two supporting seats 1 to approach each other until the two supporting seats 1 are against the upper and lower ends of the printed circuit board A, but the printed circuit board A is not clamped to the point that it cannot move along the supporting seat 1, so that the printed circuit board A can slide along the length direction of the supporting seat 1 driven by the conveyor 2.

[0061] When the next batch of printed circuit boards A to be processed needs to be processed, the adjusting threaded rod 31 is rotated in the opposite direction. At this time, the two supporting seats 1 are separated, and the next batch of printed circuit boards A to be processed can be placed on the supporting seats 1. As the adjusting threaded rod 31 is rotated, the two supporting seats 1 limit and clamp the two sides of the printed circuit board A.

[0062] See also Figure 3 and Figure 4 As shown, it is a schematic diagram of the structure of the conveyor 2 in this embodiment; the conveyor 2 includes a conveying roller 20, a conveying spring 21, a conveying belt 22, a clamping roller 23, a clamping spring 24 and a conveying motor 25; the conveying roller 20 is rotatably installed on both sides of the length direction of the supporting seat 1 through the conveying spring 21, the conveying belt 22 is sleeved on the two conveying rollers 20, the clamping springs 24 are arranged on the inner side of the supporting seat 1 at equal intervals along the length direction of the supporting seat 1, the clamping roller 23 is arranged on the clamping spring 24 through an auxiliary frame, and the clamping roller 23 is against the conveying belt 22, and the conveying motor 25 is arranged on the conveying roller 20 on one side, and the conveying motor 25 can drive the conveying belt 22 to rotate, and the conveying belt 22 drives the printed circuit board A to move along the length direction of the supporting seat 1 through friction.

[0063] In the initial state, the printed circuit board A is plugged and installed on the supporting seat 1 from one side of the supporting seat 1. After the printed circuit board A is processed, the printed circuit board A is removed from the supporting seat 1 from the other side of the supporting seat 1 to realize the unloading of the printed circuit board A.

[0064] Furthermore, in order to improve the installation stability between the printed circuit board A and the support seat 1, the present invention also proposes a clamping roller 23 and a clamping spring 24. After the printed circuit board A is installed on the support seat 1, the clamping roller 23 uses the elastic force of the clamping spring 24 to make the conveyor belt 22 contact the surface of the printed circuit board A. At this time, when the conveyor belt 22 rotates, the printed circuit board A can be ensured to move along the support seat 1. In this way, not only can the printed circuit board A be quickly loaded and unloaded, and the complexity of loading and unloading the printed circuit board A is reduced, but also the stability of the printed circuit board A can be ensured, and the printed circuit board A can be prevented from being broken due to the squeezing of the horizontal lateral external force after the inkjet tube 51 contacts its surface.

[0065] See also Figure 4 As shown, further, a plurality of closely arranged friction rollers 26 are rotatably provided at equal intervals on the support seat 1 .

[0066] The friction roller 26 can reduce the friction between the bottom of the printed circuit board A and the bottom of the supporting seat 1, thereby preventing the bottom of the printed circuit board A from being worn during the movement.

[0067] Reference Figure 5 and Figure 6 As shown, that is, a schematic diagram of the structure between the ink storage plate 50 and the inkjet tube 51 in this embodiment; specifically, the plugging portion 5 includes an ink storage plate 50 distributed in parallel with the printed circuit board A to be processed and an inkjet tube 51 integrally connected to the ink storage plate 50, the ink storage plates 50 are symmetrically arranged on the support frame 4, and the inkjet tubes 51 on the two ink storage plates 50 are relatively distributed.

[0068] The support frame 4 is also provided with an injector 52 for injecting ink, and a connecting pipe 53 is installed on the injector 52. One end of the connecting pipe 53 away from the injector 52 is movably installed on the ink filling port 54 on the back side of the ink storage plate 50 by means of a threaded connection.

[0069] It should be noted that a fixed amount of plugging ink is filled in the injector 52 in advance.

[0070] After the printed circuit board A is installed on the supporting seat 1, the printed circuit board A is distributed vertically. At this time, the plugging parts 5 for processing the printed circuit board A are located on both sides of the printed circuit board A, and the distances between the plugging parts 5 on both sides and the printed circuit board A are the same. The purpose is to ensure that the conductive holes on both sides of the printed circuit board A can be processed at the same time, improve the integrity of the conductive hole solder mask plugging ink, avoid gaps or holes in the middle of the blocked ink, and cause poor sealing of the conductive hole.

[0071] During the specific implementation process, the two ink storage plates 50 are driven by the synchronization unit 8 to approach the printed circuit board A, so that the inkjet tube 51 on the ink storage plate 50 is against the conductive hole on the printed circuit board A, and then the plugging ink enters the ink storage plate 50 along the inkjet tube 51, so that the ink storage plate 50 is filled with the plugging ink, and finally the ink enters the conductive hole on the printed circuit board A along the inkjet tube 51 at the same time, until the plugging ink completely fills the conductive hole of the printed circuit board A.

[0072] Reference Figure 5 , Figure 6 and Figure 7As shown, that is, a schematic diagram of the structure for heating and curing the plugging ink in the conducting hole in this embodiment; specifically, the curing member 6 includes a heating plate 60 slidably mounted on the ink storage plate 50 and a conductive cover 61 for heat conduction arranged on the heating plate 60, the heating plate 60 is slidably mounted on the inkjet tube 51 of the ink storage plate 50, the conductive cover 61 is arranged at one end of the heating plate 60 away from the ink storage plate 50, and the conductive cover 61 and the heating plate 60 are penetrated on the inkjet tube 51.

[0073] A power harness 62 connected to an external power source is installed on the heating plate 60 by plugging.

[0074] It should be noted that the conductive cover 61 is installed on the heating plate 60. When the heating plate 60 is heated, the conductive cover 61 can quickly transfer heat to the area of ​​the via hole of the printed circuit board A to ensure that the plugging ink in the via hole can be quickly cured.

[0075] Furthermore, the heating plate 60 is connected to the power harness 62 by plugging, so the heating plate 60 and the power harness 62 can be quickly separated and connected.

[0076] Reference Fig. 9 and Fig.10 As shown, that is, a schematic diagram of the structure for quickly replacing the ink storage plate 50 in this embodiment; specifically, a replacement component 7 for quickly replacing different types of printed circuit boards A is provided on the back side of the ink storage plate 50, and the replacement component 7 includes a fixed block 70, a clamping block 71, a partition 72, a clamping spring 73, a clamping cone block 74 and a traction rope 75. The locking cam 77 is provided on the left side of the locking cam 73 and the locking cam 78 is provided on the right side of the locking cam 73. The locking cam 77 is provided on the right side of the locking cam 73 and the locking cam 78 is provided on the left side of the locking cam 73. The locking cam 77 is provided on the right side of the locking cam 73 and the locking cam 78 is provided on the right side of the locking cam 73.

[0077] It should be noted that, in the present invention, the ink storage plate 50 and the inkjet tube 51 are connected by threaded connection, so the ink storage plate 50 and the inkjet tube 51 can be quickly disassembled and assembled.

[0078] It should be noted that, in the present invention, a variety of different ink storage plates 50 are designed as molds, which can block the conducting holes at the upper ends of printed circuit boards A of different models.

[0079] The heating plate 60 and the power harness 62 in the present invention are connected by plugging, so the heating plate 60 and the power harness 62 can be quickly disassembled and installed.

[0080] The heating plate 60 is slidably mounted on the ink ejection tube 51 of the ink reservoir plate 50 , so the heating plate 60 and the ink reservoir plate 50 can be replaced as a whole.

[0081] When the present invention completes processing of the first batch of printed circuit boards A and needs to process the second batch of printed circuit boards A, if the size of the second batch of printed circuit boards A is different from that of the first batch of printed circuit boards A, the conductive holes at different positions on the printed circuit boards A in different batches can be blocked by replacing the corresponding ink storage plates 50 and heating plates 60.

[0082] During the specific implementation process, the operator aligns the clamping block 71 on the back side of the ink storage plate 50 with the fixed block 70, and then inserts the fixed block 70 into the clamping groove on the ink storage plate 50. At this time, the ink storage plate 50 and the fixed block 70 are quickly clamped, ensuring the connection between the ink storage plate 50 and the fixed block 70. When a different ink storage plate 50 needs to be replaced, the traction rope 75 is pulled, and the traction rope 75 drives the clamping cone block 74 to hide inside the fixed block 70, so that the clamping cone block 74 is separated from the clamping block 71. At this time, the ink storage plate 50 can be separated from the fixed block 70, so as to replace it with a different ink storage plate 50 and connect the new ink storage plate 50 to the fixed block 70.

[0083] Replay Figure 6 As shown, that is, a schematic diagram of the structure of the synchronization unit 8 in this embodiment; specifically, the support frame 4 is also provided with a synchronization unit 8 for synchronously regulating the two plug hole parts 5 to synchronously process the two side surfaces of the printed circuit board A, and the support frame 4 is also provided with a synchronization unit 8 for synchronously regulating the two plug hole parts 5 to synchronously process the two side surfaces of the printed circuit board, and the synchronization unit 8 includes a T-shaped block 80, a bidirectional screw 81, a slider 83, a one-way cylinder 82 and a synchronous motor 84.

[0084] The T-shaped block 80 is slidably installed in the length direction of the support frame 4, the bidirectional screw 81 is rotatably installed on the T-shaped block 80, the slider 83 is symmetrically arranged on the bidirectional screw 81 and slidably arranged on the T-shaped block 80, the one-way cylinder 82 is installed on the slider 83, and the output end of the one-way cylinder 82 faces upward, the output end of the one-way cylinder 82 is connected to the fixed block 70, and the synchronous motor 84 is installed on the bidirectional screw 81.

[0085] The support frame 4 is provided with a mover for controlling the movement of the T-shaped block 80 .

[0086] The main function of the synchronization unit 8 is to ensure that the two ink storage plates 50 can move synchronously, realize the synchronous processing of the via holes of the printed circuit board A, and ensure the stability of the blocking of the via holes.

[0087] First, the mover can drive the ink storage plate 50 to move along the length direction of the support frame 4, and then the synchronous motor 84 drives the bidirectional screw 81 to rotate, and the slider 83 on the bidirectional screw 81 can move relatively, thereby realizing the synchronous relative movement of the two ink storage plates 50, and the one-way cylinder 82 can drive the fixed block 70 and the ink storage plate 50 set on its upper end to move up and down.

[0088] Embodiment 2:

[0089] Reference Figure 8 As shown, on the basis of Example 1, in order to further ensure the stability of the curing of the plugging ink and to be able to continue to block the conductive holes of the printed circuit board A subsequently, the present invention proposes an opening and closing component 55, through which the heating plate 60 can locally heat the conductive holes of the printed circuit board A while avoiding the heat from heating the inkjet tube 51, causing the plugging ink inside the inkjet tube 51 to solidify, thereby affecting the subsequent processing of the printed circuit board A.

[0090] Specifically, an opening and closing component 55 for opening and closing the solder resist plugging ink is further provided in the inkjet tube 51 of the ink storage plate 50 . The opening and closing component 55 includes a sensing sheet 550 , a sensing spring 551 , a linkage rope 552 and an opening and closing sheet 553 .

[0091] The sensing piece 550 is slidably arranged on the inner wall of the inkjet tube 51, the sensing spring 551 is arranged between the sensing piece 550 and the inkjet tube 51 through a protective tube, the linkage rope 552 is installed at the end of the sensing piece 550 away from the ink outlet of the inkjet tube 51, the end of the linkage rope 552 away from the sensing piece 550 slides through the inkjet tube 51 and is arranged on the opening and closing piece 553, and the opening and closing piece 553 is symmetrically hinged at the ink outlet of the inkjet tube 51 through a torsion spring.

[0092] In the initial state, the induction spring 551 has a certain elastic force on the induction sheet 550, so that the induction sheet 550 is close to the induction spring 551, but the induction sheet 550 can slide in the inkjet tube 51, and in the initial state, the opening and closing sheet 553 is in a closed state, and the two opening and closing sheets 553 block the ink outlet of the inkjet tube 51.

[0093] When the injector 52 sprays the plugging ink outward, the plugging ink has a certain pressure. When the plugging ink passes through the inkjet tube 51, the plugging ink will squeeze the sensing plate 550, so that the linkage rope 552 on the sensing plate 550 pulls the opening and closing plate 553, so that the opening and closing plate 553 opens. At this time, the plugging ink can be sprayed outward along the inkjet tube 51, so that the plugging ink fills the conductive hole on the printed circuit board A.

[0094] See also Fig.11 As shown, the process for preparing the solder mask plugging ink for the via hole of the printed circuit board in the present invention comprises the following steps:

[0095] S1. Preparation: Prepare solder mask plugging ink for plugging the via holes of the printed circuit board A in advance, and check whether the entire equipment is operating normally.

[0096] S2. Transport of printed circuit boards A: The printed circuit boards A to be processed are placed on the supporting seats 1 in turn, and then the two supporting seats 1 are moved relative to each other until the two supporting seats 1 limit the two sides of the printed circuit board A, and then the printed circuit boards A on the supporting seats 1 are transported in batches by the conveyor 2, so that they enter the designated processing area in turn for processing.

[0097] S3. Solder resist plugging of holes on printed circuit board A: When printed circuit board A is limitedly clamped between two supporting seats 1, the ink reservoir plate 50 moves relatively until the inkjet tube 51 on the ink reservoir plate 50 abuts against the via holes on printed circuit board A, and then the pre-prepared solder resist plugging ink is sprayed out through the inkjet tube 51 to fill several via holes on printed circuit board A and around several via holes on printed circuit board A, and cover all via holes on printed circuit board A.

[0098] S4, heating and curing to form a film: start the heating plate 60, and the heating plate 60 guides the heat to the vicinity of the plurality of via holes of the printed circuit board A through the conductive cover 61, and the plurality of via holes on the printed circuit board A are heated simultaneously by the heating plate 60, so that the solder resist plugging ink filled in the plurality of via holes on the printed circuit board A is cured to form a film.

[0099] S5. Batch operation: The positions and sizes of the via holes on the upper end of different types of printed circuit boards A may be inconsistent. Therefore, the solder resist plugging ink filling device corresponding to the via holes of the printed circuit board A can be quickly replaced to achieve solder resist plugging of the via holes of different types of printed circuit boards A.

[0100] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and therefore it is intended that all changes within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0101] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A process for preparing solder mask plugging ink for via holes in printed circuit boards, characterized in that: The following steps are involved: S1. Preparation: Prepare solder mask plugging ink for plugging the via holes of the printed circuit board and check whether the whole equipment is operating normally; S2. Printed circuit board transportation: transport the printed circuit boards to be processed in batches and allow them to enter the designated processing area for processing in turn; S3, solder mask plugging holes on the printed circuit board: fill the pre-prepared solder mask plugging hole ink into several via holes on the printed circuit board and around several via holes on the printed circuit board at the same time, and make it cover all the via holes on the printed circuit board; S4, heating and curing to form a film: a plurality of via holes on the printed circuit board are simultaneously heated to cure the solder resist plugging ink filled in the plurality of via holes on the printed circuit board to form a film; S5. Batch operation: The positions and sizes of the via holes on the upper ends of different types of printed circuit boards are different. Therefore, the solder mask plugging ink filling device corresponding to the via holes of the printed circuit board is quickly replaced to realize solder mask plugging of the via holes of different types of printed circuit boards. A solder mask plugging ink preparation device for a printed circuit board through hole is used to prepare the solder mask plugging ink. The preparation device comprises two support seats (1) symmetrically distributed up and down and used to support the printed circuit board. A conveyor (2) for transporting the printed circuit board is arranged on the support seat (1). Regulators (3) for adjusting the distance between the two are arranged on both sides of the support seat (1). The support seat (1) is arranged on a support frame (4) through the regulator (3). The support frame (4) is arranged on the ground. A plugging portion (5) for performing a synchronous solder resist plugging operation on the conductive holes on the printed circuit board is provided on the support frame (4) and located on both sides of the supporting seat (1). A curing member (6) for curing the ink used for solder resist plugging is provided on the plugging portion (5).

2. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: The plugging portion (5) comprises an ink storage plate (50) arranged in parallel with the printed circuit board to be processed and an inkjet tube (51) integrally connected to the ink storage plate (50), the ink storage plate (50) being symmetrically arranged on the support frame (4), and the inkjet tubes (51) on the two ink storage plates (50) being arranged opposite to each other; The support frame (4) is also provided with an injector (52) for injecting ink, and the injector (52) is provided with a connecting pipe (53), and one end of the connecting pipe (53) away from the injector (52) is movably mounted on the ink filling port (54) on the back side of the ink storage plate (50) by means of a threaded connection.

3. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: The curing member (6) comprises a heating plate (60) slidably mounted on an ink storage plate (50) and a conduction cover (61) for heat conduction arranged on the heating plate (60), wherein the heating plate (60) is slidably mounted on an inkjet tube (51) of the ink storage plate (50), the conduction cover (61) is arranged at one end of the heating plate (60) away from the ink storage plate (50), and the conduction cover (61) and the heating plate (60) are arranged on the inkjet tube (51); The heating plate (60) is provided with a power harness (62) connected to an external power source by plugging.

4. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 2, characterized in that: A replacement assembly (7) for quickly replacing printed circuit boards of different models is arranged on the back side of the ink storage plate (50), and the replacement assembly (7) comprises a fixing block (70), a clamping block (71), a partition (72), a clamping spring (73), a clamping cone block (74) and a traction rope (75); The clamping block (71) is installed on the back side of the ink storage plate (50), the fixed block (70) is slidably inserted on the side of the clamping block (71) away from the ink storage plate (50), the fixed block (70) is a hollow structure, the partition (72) is arranged at the inner middle part of the fixed block (70), the clamping spring (73) is symmetrically arranged at both ends of the partition (72) and extends to the outside of the fixed block (70), the clamping cone block (74) is arranged on the side of the clamping spring (73) away from the partition (72), and the clamping cone block (74) is slidably inserted into the fixed block ( The fixing block (70) extends toward the outside of the fixing block (70), and the inclined surface of the clamping cone block (74) is distributed in the direction of the clamping block (71); the fixing block (70) is provided with a square groove for the clamping cone block (74) to slide; the two ends of the traction rope (75) are respectively connected to one side of the two clamping cone blocks (74) close to the clamping spring (73); the middle part of the traction rope (75) slides along the middle part of the clamping spring (73) to pass through the fixing block (70) and is arranged on the upper side of the fixing block (70); the fixing block (70) is provided with a traction groove for the traction rope (75) to slide.

5. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: The support frame (4) is also provided with a synchronization unit (8) for synchronously regulating the two plug hole parts (5) to synchronously process the two side surfaces of the printed circuit board, and the synchronization unit (8) includes a T-shaped block (80), a bidirectional screw (81), a slider (83), a one-way cylinder (82) and a synchronous motor (84); The T-shaped block (80) is slidably mounted on the length direction of the support frame (4); the bidirectional screw (81) is rotatably mounted on the T-shaped block (80); the slider (83) is symmetrically arranged on the bidirectional screw (81) and slidably arranged on the T-shaped block (80); the one-way cylinder (82) is mounted on the slider (83), and the output end of the one-way cylinder (82) faces upward; the output end of the one-way cylinder (82) is connected to the fixed block (70); and the synchronous motor (84) is mounted on the bidirectional screw (81).

6. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: The adjuster (3) comprises two groups of adjusting columns (30) and adjusting threaded rods (31) which are arranged vertically upward and on both sides of the support frame (4) along the length direction, and are arranged at the upper end of the support frame (4). The two ends of the support seat (1) are equipped with execution blocks (32), and the execution blocks (32) are slidably inserted into the adjustment columns (30). The support seat (1) is connected to the adjustment threaded rod (31) by means of a threaded connection, and the adjustment threaded rod (31) is a bidirectional threaded structure.

7. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 2, characterized in that: An opening and closing component (55) for opening and closing the solder resist plugging ink is also arranged in the inkjet tube (51) of the ink storage plate (50), and the opening and closing component (55) comprises a sensing sheet (550), a sensing spring (551), a linkage rope (552) and an opening and closing sheet (553); The sensing plate (550) is slidably arranged on the inner wall of the inkjet tube (51); the sensing spring (551) is arranged between the sensing plate (550) and the inkjet tube (51) through a protective tube; the linkage rope (552) is installed at one end of the sensing plate (550) away from the ink outlet of the inkjet tube (51); the end of the linkage rope (552) away from the sensing plate (550) slides through the inkjet tube (51) and is arranged on the opening and closing plate (553); the opening and closing plate (553) is symmetrically hinged at the ink outlet of the inkjet tube (51) through a torsion spring.

8. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: The conveyor (2) comprises a conveying roller (20), a conveying spring (21), a conveying belt (22), a clamping roller (23), a clamping spring (24) and a conveying motor (25); the conveying roller (20) is rotatably mounted on both sides of a supporting seat (1) in a length direction through the conveying spring (21); the conveying belt (22) is sleeved on two conveying rollers (20); the clamping spring (24) is arranged on the inner side of the supporting seat (1) at equal intervals along the length direction of the supporting seat (1); the clamping roller (23) is arranged on the clamping spring (24) through an auxiliary frame, and the clamping roller (23) is pressed against the conveying belt (22); and the conveying motor (25) is arranged on the conveying roller (20) on one side.

9. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 7, characterized in that: The surfaces of the inkjet tube (51) and the opening and closing piece (553) are provided with a heat insulation layer.

10. The process for preparing solder mask plugging ink for via holes in a printed circuit board according to claim 1, characterized in that: A plurality of friction rollers (26) are arranged at equal intervals on the inner side of the supporting seat (1).

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