Processing technology for copper-clad plate

Abstract

The invention relates to the technical field of copper-clad plate processing, in particular to a processing technology for a copper-clad plate, which comprises the following steps: S1, preparing semi-finished sizing paper; s2, pressing the copper-clad plate; s3, embrittlement glue coating is carried out; s4, stacking the copper-clad plates; s5, uniformly cutting and drilling the stacked copper-clad plates; s6, performing low-temperature embrittlement separation and vibration separation; and S7, when preparation of a single batch of copper-clad plates is completed, the copper-clad plates are selected for detection, side edge profile curves of the copper-clad plates for detection are obtained, and whether the copper-clad plates are qualified or not is determined based on profile coincidence parameters, determined by the side edge profile curves, of the single copper-clad plates. According to the method, the copper-clad plate is selected to be detected, the parameters of the copper-clad plate are obtained, the parameters comprise the side edge profile curve and the profile difference parameter, the copper-clad plate is judged according to the obtained parameters, when it is determined that the copper-clad plate is unqualified, the machining process of the copper-clad plate is controlled and adjusted in real time according to the specific conditions of the copper-clad plate, and the production efficiency of the copper-clad plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of copper clad laminate processing, in particular to a processing technology for copper clad laminates. Background Art

[0002] As electronic products become increasingly multifunctional, their components are also becoming increasingly lightweight, thin, short, and compact. The widespread application of high-density integrated circuit technology, in particular, is placing demands on consumer electronics for high performance, reliability, and safety, while industrial electronics are also being challenged to achieve superior technical performance, low cost, and low energy consumption. Consequently, the copper-clad laminate (CCL), the core material of electronic products, faces higher technical requirements, more challenging operating environments, and stricter environmental protection requirements.

[0003] Copper clad laminate (CCL), primarily used in the production of printed circuit boards, is made from fiber paper, glass fiber cloth, or non-woven glass fiber (commonly known as glass mat) as a reinforcing material, impregnated with resin, coated with copper foil on one or both sides, and then hot-pressed. Due to differences in raw materials and manufacturing structures, the technical performance of existing CCL substrates varies.

[0004] According to the different composition structures and reinforcement materials of copper clad laminates, existing copper clad laminates can be divided into the following categories, each with its own advantages and disadvantages: 1. Paper-based copper-clad laminate: Although the production process of paper-based copper-clad laminate is simple and the production cost is low, many of its properties can no longer meet the technical requirements for high performance of many electronic products.

[0005] 2. Special reinforced material based copper clad laminate: Special reinforced material based copper clad laminate is a new type of copper clad laminate developed in recent years. However, due to its high processing technology and high production cost, it is currently only used in electronic products with special requirements.

[0006] 3. Glass fiber cloth-based copper clad laminate: Glass fiber cloth-based copper clad laminate (ie FR-4 copper clad laminate) is the most widely used type of CCL product. Its composition structure uses glass fiber cloth as the outer material and glass fiber cloth as the core material. Figure 1 The copper-clad laminate shown here consists of copper foil layers 1 and 5, an upper layer 2 and a lower layer 4 of fiberglass cloth, and three sheets of glued fiberglass cloth as a core material 3. FR-4 copper-clad laminates offer excellent heat resistance, electrical properties, mechanical strength, and chemical resistance. However, they are not suitable for stamping processes in PCB production, suffer from poor dimensional stability of the substrate, and exhibit significant warpage, resulting in relatively high production costs.

[0007] 4. Composite Epoxy Material Copper Clad Laminate: Composite Epoxy Material copper clad laminate, among the existing CCL products, is commonly glass fiber cloth / fiber paper composite copper clad laminate (hereinafter referred to as "CEM-1 copper clad laminate"), glass fiber cloth / glass fiber non-woven fabric composite copper clad laminate (hereinafter referred to as "CEM-3 copper clad laminate"). Among them, the application of CEM-3 copper clad laminate is second only to FR-4 copper clad laminate. Its composition structure uses glass fiber cloth as the outer material and glass fiber non-woven fabric as the core material. Figure 2 The copper-clad laminate shown here comprises copper foil layers 1 and 5, an upper layer 2 and a lower layer 4 of glass fiber cloth, and three sheets of glued glass fiber non-woven fabric as a core material 3. CEM-3 copper-clad laminate offers excellent stamping and machinability, as well as good dimensional stability, and its production cost is significantly lower than that of FR-4 copper-clad laminate. However, compared to FR-4, its mechanical strength and heat resistance are relatively inferior, making it inadequate for high-performance integrated circuits and high-frequency, high-speed, and high-capacity electrical components.

[0008] In terms of reinforcing material production, glass fiber cloth involves a series of processes, including melting, drawing, weaving, heat treatment, surface treatment, and drying. Compared to other reinforcing materials, it has higher industrial costs, high energy consumption, heavy pollution, and high environmental costs. Glass fiber non-woven fabric, on the other hand, involves pulping, papermaking, gluing, and drying. Relatively speaking, it has lower industrial costs, lower energy consumption, less pollution, and lower environmental costs. Each material has its own advantages and disadvantages.

[0009] Chinese Patent Publication No.: CN102189722B discloses a copper-clad laminate comprising at least one copper foil layer, the copper-clad laminate further comprising an upper layer and a lower layer made of glass fiber cloth, and a core material located between the upper layer and the lower layer; the core material is composed of a glass fiber cloth prepreg and a glass fiber non-woven fabric prepreg stacked in any manner, and also discloses a processing method for the aforementioned copper-clad laminate, comprising at least the steps of preparing glue, gluing, stacking, pressing, etc.; it can be seen that the above technical solution has the following problems: the processing process of the copper-clad laminate cannot be controlled and adjusted in real time, which affects the production efficiency of the copper-clad laminate. Summary of the Invention

[0010] To this end, the present invention provides a processing technology for copper clad laminates to overcome the problem in the prior art that the processing of the copper clad laminates cannot be controlled and adjusted in real time, which affects the production efficiency of the copper clad laminates.

[0011] To achieve the above object, the present invention provides a processing technology for copper clad laminates, comprising: S1, preparation of semi-finished sized paper, obtaining impregnated glass fiber cloth and glass fiber non-woven fabric; S2, pressing of copper clad laminate, laminating the half-finished sizing paper and copper foil under high temperature and high pressure; S3, embrittlement adhesive coating, applying the embrittlement adhesive to the pressed copper clad laminate; S4, copper clad laminate stacking, stacking the copper clad laminates and preparing for the next step of cutting and drilling; S5, unified cutting and drilling of stacked copper clad laminates; S6, low temperature embrittlement separation and vibration separation, using the characteristics of low temperature embrittlement glue to make the embrittlement glue brittle at low temperature, and separate the copper clad laminates through vibration separation; S7, when a single batch of copper clad laminates is prepared, copper clad laminates are selected for testing, a side profile curve of the copper clad laminates for testing is obtained, and a profile coincidence parameter for a single copper clad laminate determined based on the side profile curve is used to determine whether the copper clad laminates are qualified, including: Determining that the copper clad laminate is unqualified, determining a contour difference parameter based on the acquired image information of the copper clad laminate, and determining a processing method for the copper clad laminate preparation parameters based on the contour difference parameter, including adjusting the pressing pressure of the copper clad laminate to a corresponding value, adjusting the angle of cutting the stacked copper clad laminate to a corresponding value, or adjusting the vibration separation frequency of step S6 to a corresponding value; Alternatively, when the copper clad laminate is determined to be qualified, the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

[0012] Furthermore, in S7, the process of determining the contour coincidence parameter for the copper clad laminate based on the side contour curve includes: Acquire side image information of the copper clad laminate, and identify a side contour curve of the copper clad laminate in the side image information; The side profile curve is overlapped and compared with the preset side profile curve, and the ratio of the overlap length to the total length of the preset side profile curve is obtained to obtain the profile overlap parameter; Determine whether a single copper clad laminate is qualified based on the contour coincidence parameters, including: If the contour coincidence parameter is less than or equal to the first preset contour coincidence parameter, the single copper clad laminate is determined to be unqualified, a contour difference parameter is determined based on the acquired image information of the copper clad laminate, and a processing method for the copper clad laminate preparation parameters is determined based on the contour difference parameter; If the contour overlap parameter is less than or equal to the second preset contour overlap parameter and greater than the first preset contour overlap parameter, the single copper clad laminate is determined to be unqualified, and a treatment method for the semi-finished sizing paper preparation is determined based on the number of copper clad laminate layers; If the contour coincidence parameter is greater than the second preset contour coincidence parameter, the single copper clad laminate is determined to be qualified, and the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

[0013] Furthermore, the processing method for preparing the semi-finished sizing paper is determined based on the number of copper clad laminate layers, including: If the number of copper clad laminate layers is less than or equal to the preset number of layers, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to a corresponding value based on the contour coincidence parameter; If the number of copper clad laminate layers is greater than a preset number of layers, the pressing temperature of the copper clad laminate is adjusted to a corresponding value based on the number of copper clad laminate layers.

[0014] Furthermore, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to corresponding values ​​based on the contour coincidence parameter, wherein: The increase in the dipping time of the glass fiber cloth and the glass fiber non-woven fabric determined based on the contour coincidence parameter is inversely proportional to the contour coincidence parameter; Adjust the pressing temperature of the copper clad laminate to the corresponding value based on the number of copper clad laminate layers, where: The pressing temperature of the copper clad laminate determined based on the number of copper clad laminate layers is proportional to the number of copper clad laminate layers.

[0015] Furthermore, in said S7, determining the contour difference parameter based on the acquired image information of the single copper clad laminate includes: Obtaining side profile difference parameters based on image information of a single copper clad laminate, aligning and comparing the side profile curve with a preset side profile curve, identifying each overlap abnormal area, obtaining the distance between each overlap abnormal area, and solving the variance of each distance to obtain the side profile difference parameters; Obtaining a top-view contour difference parameter based on image information of a single copper-clad laminate, obtaining top-view image information of the copper-clad laminate, identifying an edge contour curve of the copper-clad laminate in the top-view image information, overlapping and comparing the edge contour curve with a preset edge contour curve, identifying each overlapping abnormal area, obtaining a distance between each overlapping abnormal area, solving a variance of the distance between each overlapping abnormal area, and obtaining a top-view contour difference parameter; Based on the side profile difference parameters, the processing method for the copper clad laminate preparation parameters is determined, including: If the side view profile difference parameter is less than or equal to the first preset side view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the side profile difference parameter is less than or equal to the second preset side profile difference parameter and greater than the first preset side profile difference parameter, determining a processing method for the copper clad laminate preparation parameters based on the top profile difference parameter; If the side view profile difference parameter is greater than the second preset side view profile difference parameter, the vibration separation frequency is adjusted to a corresponding value based on the side view profile difference parameter.

[0016] Furthermore, based on the top view profile difference parameters, a processing method for copper clad laminate preparation parameters is determined, including: If the top view profile difference parameter is less than or equal to the preset top view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the top view profile difference parameter is greater than the preset top view profile difference parameter, the cutting angle for the stacked copper clad laminates is adjusted to a corresponding value based on the top view profile difference parameter.

[0017] Furthermore, the pressing pressure of the copper clad laminate is adjusted to a corresponding value based on the average thickness of the copper clad laminate, wherein: The pressing pressure of the copper clad laminate determined based on the average thickness of the copper clad laminate is proportional to the average thickness of the copper clad laminate.

[0018] Furthermore, the cutting angle of the stacked copper clad laminate is adjusted to a corresponding value based on the top view profile difference parameter, wherein: The adjustment amplitude of the cutting angle of the stacked copper clad laminate determined based on the top view profile difference parameter is positively correlated with the top view profile difference parameter.

[0019] Furthermore, the vibration separation frequency is adjusted to a corresponding value based on the side profile difference parameter, wherein: The vibration separation frequency determined based on the side profile difference parameter is inversely proportional to the side profile difference parameter.

[0020] Compared with the prior art, the beneficial effect of the present invention lies in that copper clad laminates are selected for testing, parameters of the copper clad laminates are obtained, including side profile curves and profile difference parameters, the copper clad laminates are judged based on the obtained parameters, and when the copper clad laminates are determined to be unqualified, the processing process of the copper clad laminates is controlled and adjusted in real time based on the specific conditions of the copper clad laminates, thereby improving the production efficiency of the copper clad laminates.

[0021] Furthermore, side image information of the copper clad laminate is obtained, the side profile curve is detected, and the profile overlap parameter is obtained. When the profile overlap parameter is less than or equal to the second preset profile overlap parameter and greater than the first preset profile overlap parameter, a small abnormal area appears on the side surface of the copper clad laminate. At this time, the specific processing method for the preparation process is determined in combination with the number of copper clad laminate layers. When the number of copper clad laminate layers is less than or equal to the preset number of layers, the number of layers is low and an abnormal area appears on the side surface of the copper plate. In this case, there is an area where the core material thickness is too high. Due to the abnormality in the dipping process, the copper clad laminate is not bonded and fastened, resulting in warping. At this time, the dipping time is adjusted to balance the preparation efficiency and the quality of the fastening glue, thereby further improving the qualified rate of the copper clad laminate preparation. When the number of copper clad laminate layers is greater than the preset number of layers, the number of layers is high, and only a small abnormal area appears on the side surface of the copper plate. In this case, the copper clad laminate is unevenly pressed due to the abnormality in the pressing process. At this time, the pressing temperature of the copper clad laminate is adjusted, and the preparation process of the copper clad laminate is adjusted in real time according to the specific situation of the copper clad laminate, effectively improving the preparation efficiency of the copper clad laminate.

[0022] Furthermore, when the contour overlap parameter is less than or equal to the first preset contour overlap parameter, a large range of unevenness appears on the side of the copper clad laminate. In this case, the side profile difference parameter of the copper clad laminate is obtained to determine the processing method for the preparation parameters of the copper clad laminate in a targeted manner. The side profile difference parameter of the copper clad laminate characterizes the distribution of abnormal concave and convex areas on the side of the copper clad laminate. When the side profile difference parameter is less than or equal to the first preset side profile difference parameter, there are continuous large abnormal areas. In this case, the pressing process is adjusted due to abnormalities in the pressing process; when the side profile difference parameter is greater than the second preset side profile difference parameter, the vibration frequency is too high during vibration separation, resulting in excessive impact and vibration of the copper clad laminate during the separation process, thereby producing irregular concave and convex areas on the side surface. At this time, the vibration separation frequency is adjusted to further improve the production efficiency of the copper clad laminate while ensuring the production quality of the copper clad laminate.

[0023] Furthermore, when the side profile difference parameter is less than or equal to the second preset side profile difference parameter and greater than the first preset side profile difference parameter, it is impossible to determine the specific situation of the copper clad laminate based solely on this parameter. In combination with the obtained top profile difference parameter, it is comprehensively determined how to deal with it. Targeted data for the copper clad laminate is obtained for specific processing, which effectively reduces the amount of data processing. When the top profile difference parameter is less than or equal to the preset top profile difference parameter, regional abnormalities occur due to unqualified pressing process. At this time, the pressing pressure is adjusted to ensure that the layers of the copper clad laminate are tightly connected. When the top profile difference parameter is greater than the preset top profile difference parameter, due to abnormal cutting, the cutting edges of each side of the copper clad laminate overlap with the preset edge profile curve. At this time, the cutting angle of the copper clad laminate is corrected, which effectively improves the processing accuracy of the copper clad laminate and further improves the production efficiency of the copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A flowchart of the steps of a processing process for a copper clad laminate according to an embodiment of the present invention; Figure 2 This is a logic decision diagram for determining whether a single copper-clad laminate is qualified based on contour coincidence parameters according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention.

[0026] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0027] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0028] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0029] See also Figure 1 and Figure 2 As shown in the figure, they are respectively a flowchart of the steps of the processing technology for copper clad laminates according to an embodiment of the present invention, and a logic determination diagram for determining whether a single copper clad laminate is qualified based on the contour coincidence parameter; a processing technology for copper clad laminates according to an embodiment of the present invention includes: S1, preparation of semi-finished sized paper, obtaining impregnated glass fiber cloth and glass fiber non-woven fabric; S2, pressing of copper clad laminate, laminating the half-finished sizing paper and copper foil under high temperature and high pressure; S3, embrittlement adhesive coating, applying the embrittlement adhesive to the pressed copper clad laminate; S4, copper clad laminate stacking, stacking the copper clad laminates and preparing for the next step of cutting and drilling; S5, unified cutting and drilling of stacked copper clad laminates; S6, low temperature embrittlement separation and vibration separation, using the characteristics of low temperature embrittlement glue to make the embrittlement glue brittle at low temperature, and separate the copper clad laminates through vibration separation; S7, when a single batch of copper clad laminates is prepared, copper clad laminates are selected for testing, a side profile curve of the copper clad laminates for testing is obtained, and a profile coincidence parameter for a single copper clad laminate determined based on the side profile curve is used to determine whether the copper clad laminates are qualified, including: Determining that the copper clad laminate is unqualified, determining a contour difference parameter based on the acquired image information of the copper clad laminate, and determining a processing method for the copper clad laminate preparation parameters based on the contour difference parameter, including adjusting the pressing pressure of the copper clad laminate to a corresponding value, adjusting the angle of cutting the stacked copper clad laminate to a corresponding value, or adjusting the vibration separation frequency of step S6 to a corresponding value; Alternatively, when the copper clad laminate is determined to be qualified, the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

[0030] Specifically, copper clad laminates are selected for testing, and their parameters, including side profile curves and profile difference parameters, are obtained. The copper clad laminates are judged based on the obtained parameters. When the copper clad laminates are determined to be unqualified, the processing of the copper clad laminates is controlled and adjusted in real time based on their specific conditions, thereby improving the production efficiency of the copper clad laminates.

[0031] Specifically, in S7, the process of determining the contour coincidence parameter for the copper clad laminate based on the side contour curve includes: Acquire side image information of the copper clad laminate, and identify a side contour curve of the copper clad laminate in the side image information; The side profile curve is overlapped and compared with the preset side profile curve, and the ratio of the overlap length to the total length of the preset side profile curve is obtained to obtain the profile overlap parameter; Determine whether a single copper clad laminate is qualified based on the contour coincidence parameters, including: If the contour coincidence parameter is less than or equal to the first preset contour coincidence parameter, the single copper clad laminate is determined to be unqualified, a contour difference parameter is determined based on the acquired image information of the copper clad laminate, and a processing method for the copper clad laminate preparation parameters is determined based on the contour difference parameter; If the contour overlap parameter is less than or equal to the second preset contour overlap parameter and greater than the first preset contour overlap parameter, the single copper clad laminate is determined to be unqualified, and a treatment method for the semi-finished sizing paper preparation is determined based on the number of copper clad laminate layers; If the contour coincidence parameter is greater than the second preset contour coincidence parameter, the single copper clad laminate is determined to be qualified, and the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

[0032] Specifically, there is no limitation on the selection of the preset side profile curve. It can be a side profile curve of a copper clad laminate with a smooth and qualified profile fitted by computer, or a side profile curve of a qualified copper clad laminate obtained, which will not be elaborated here.

[0033] Specifically, the number of copper clad laminate layers is the sum of the number of copper foil layers, the number of glass fiber cloth layers, and the number of glass fiber non-woven fabric layers in the copper clad laminate.

[0034] Specifically, the first preset contour coincidence parameter C1 is selected within the interval [0.62, 0.73], and the second preset contour coincidence parameter C2 is selected within the interval [0.94, 0.97].

[0035] Specifically, the processing method for preparing semi-finished sizing paper is determined based on the number of copper clad laminate layers, including: If the number of copper clad laminate layers is less than or equal to the preset number of layers, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to a corresponding value based on the contour coincidence parameter; If the number of copper clad laminate layers is greater than a preset number of layers, the pressing temperature of the copper clad laminate is adjusted to a corresponding value based on the number of copper clad laminate layers.

[0036] Specifically, the preset number of layers N0 is selected within the interval [4, 6].

[0037] Specifically, the side image information of the copper clad laminate is obtained, the side profile curve is detected, and the profile overlap parameter is obtained. When the profile overlap parameter is less than or equal to the second preset profile overlap parameter and greater than the first preset profile overlap parameter, a small abnormal area appears on the side surface of the copper clad laminate. At this time, the specific processing method for the preparation process is determined in combination with the number of copper clad laminate layers. When the number of copper clad laminate layers is less than or equal to the preset number of layers, the number of layers is low and an abnormal area appears on the side surface of the copper plate. In this case, there is an area where the core material thickness is too high. Due to the abnormality in the dipping process, the copper clad laminate is not bonded and fastened, resulting in warping. At this time, the dipping time is adjusted to balance the preparation efficiency and the quality of the fastening glue, thereby further improving the qualified rate of the copper clad laminate preparation. When the number of copper clad laminate layers is greater than the preset number of layers, the number of layers is high, and only a small abnormal area appears on the side surface of the copper plate. In this case, the copper clad laminate is unevenly pressed due to the abnormality in the pressing process. At this time, the pressing temperature of the copper clad laminate is adjusted, and the preparation process of the copper clad laminate is adjusted in real time according to the specific situation of the copper clad laminate, effectively improving the preparation efficiency of the copper clad laminate.

[0038] Specifically, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to corresponding values ​​based on the contour coincidence parameter, where: The increase in the dipping time of the glass fiber cloth and the glass fiber non-woven fabric determined based on the contour coincidence parameter is inversely proportional to the contour coincidence parameter.

[0039] In this embodiment, optionally, Comparing the contour coincidence parameter with a first preset coincidence comparison threshold and a second preset coincidence comparison threshold; If the contour overlap parameter is less than or equal to the first preset overlap comparison threshold, the dipping time is adjusted to 1.32 times the initial dipping time; If the contour coincidence parameter is less than or equal to the second preset coincidence comparison threshold and greater than the first preset coincidence comparison threshold, the dipping time is adjusted to 1.22 times the initial dipping time; If the contour coincidence parameter is greater than the second preset coincidence comparison threshold, the dipping time is adjusted to 1.12 times the initial dipping time; The first preset overlap comparison threshold is 0.81C2, and the second preset overlap comparison threshold is 0.87C2.

[0040] Specifically, when the adjustment of the dipping time is completed, the moving speed of the semi-finished sized paper after dipping is adjusted to 0.89 times the initial moving speed.

[0041] Specifically, the pressing temperature of the copper clad laminate is adjusted to a corresponding value based on the number of copper clad laminate layers, where: The pressing temperature of the copper clad laminate determined based on the number of copper clad laminate layers is proportional to the number of copper clad laminate layers.

[0042] In this embodiment, optionally, Comparing the number of copper clad laminate layers with a first preset layer number comparison threshold and a second preset layer number comparison threshold; If the number of copper clad laminate layers is less than or equal to the first preset layer comparison threshold, the pressing temperature is adjusted to 1.11 times the initial pressing temperature; If the number of copper clad laminate layers is less than or equal to the second preset layer comparison threshold and greater than the first preset layer comparison threshold, the pressing temperature is adjusted to 1.18 times the initial pressing temperature; If the number of copper clad laminate layers is greater than the second preset layer comparison threshold, the pressing temperature is adjusted to 1.27 times the initial pressing temperature; The first preset layer number comparison threshold is 1.4N0, and the second preset layer number comparison threshold is 1.6N0.

[0043] Specifically, in S7, determining the contour difference parameter based on the acquired image information of the single copper clad laminate includes: Obtaining side profile difference parameters based on image information of a single copper clad laminate, aligning and comparing the side profile curve with a preset side profile curve, identifying each overlap abnormal area, obtaining the distance between each overlap abnormal area, and solving the variance of each distance to obtain the side profile difference parameters; Obtaining a top-view contour difference parameter based on image information of a single copper-clad laminate, obtaining top-view image information of the copper-clad laminate, identifying an edge contour curve of the copper-clad laminate in the top-view image information, overlapping and comparing the edge contour curve with a preset edge contour curve, identifying each overlapping abnormal area, obtaining a distance between each overlapping abnormal area, solving a variance of the distance between each overlapping abnormal area, and obtaining a top-view contour difference parameter; Based on the side profile difference parameters, the processing method for the copper clad laminate preparation parameters is determined, including: If the side view profile difference parameter is less than or equal to the first preset side view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the side profile difference parameter is less than or equal to the second preset side profile difference parameter and greater than the first preset side profile difference parameter, determining a processing method for the copper clad laminate preparation parameters based on the top profile difference parameter; If the side view profile difference parameter is greater than the second preset side view profile difference parameter, the vibration separation frequency is adjusted to a corresponding value based on the side view profile difference parameter.

[0044] Specifically, the first preset side view profile difference parameter Y1 is selected within the interval [0.88L0, 0.95L0], the second preset side view profile difference parameter Y2 is selected within the interval [1.35L0, 2.3L0], and L0 is the average value of the side view profile difference parameters of each copper clad laminate in history.

[0045] Specifically, the average thickness of the copper clad laminate is the average thickness of the copper clad laminate obtained based on the side profile curve of the copper clad laminate.

[0046] Specifically, when the contour overlap parameter is less than or equal to the first preset contour overlap parameter, a large range of unevenness appears on the side of the copper clad laminate. In this case, the side profile difference parameter of the copper clad laminate is obtained to determine the processing method for the preparation parameters of the copper clad laminate in a targeted manner. The side profile difference parameter of the copper clad laminate characterizes the distribution of abnormal concave and convex areas on the side of the copper clad laminate. When the side profile difference parameter is less than or equal to the first preset side profile difference parameter, there are continuous large abnormal areas. In this case, the pressing process is adjusted due to abnormalities in the pressing process; when the side profile difference parameter is greater than the second preset side profile difference parameter, due to vibration separation, the vibration frequency is too high, resulting in excessive impact and vibration of the copper clad laminate during the separation process, thereby producing irregular concave and convex areas on the side surface. At this time, the vibration separation frequency is adjusted to further improve the production efficiency of the copper clad laminate while ensuring the production quality of the copper clad laminate.

[0047] Specifically, the processing method for the copper clad laminate preparation parameters is determined based on the top view profile difference parameters, including: If the top view profile difference parameter is less than or equal to the preset top view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the top view profile difference parameter is greater than the preset top view profile difference parameter, the cutting angle for the stacked copper clad laminates is adjusted to a corresponding value based on the top view profile difference parameter.

[0048] Specifically, the preset top view profile difference parameter K0 is selected within the interval [1.32F0, 1.85F0], and F0 is the average value of the top view profile difference parameters of each historical copper clad laminate.

[0049] Specifically, when the side profile difference parameter is less than or equal to the second preset side profile difference parameter and greater than the first preset side profile difference parameter, it is impossible to determine the specific situation of the copper clad laminate based solely on this parameter. The top profile difference parameter obtained is combined to comprehensively determine how to deal with it. Targeted data for the copper clad laminate is obtained for specific processing, which effectively reduces the amount of data processing. When the top profile difference parameter is less than or equal to the preset top profile difference parameter, regional abnormalities occur due to unqualified pressing process. At this time, the pressing pressure is adjusted to ensure that the layers of the copper clad laminate are tightly connected. When the top profile difference parameter is greater than the preset top profile difference parameter, due to abnormal cutting, the cutting edges of each side of the copper clad laminate overlap with the preset edge profile curve. At this time, the cutting angle of the copper clad laminate is corrected, which effectively improves the processing accuracy of the copper clad laminate and further improves the production efficiency of the copper clad laminate.

[0050] Specifically, the pressing pressure of the copper clad laminate is adjusted to a corresponding value based on the average thickness of the copper clad laminate, wherein: The pressing pressure of the copper clad laminate determined based on the average thickness of the copper clad laminate is proportional to the average thickness of the copper clad laminate.

[0051] In this embodiment, optionally, comparing the average thickness with a first predetermined average thickness and a second predetermined average thickness; If the average thickness is less than or equal to the first preset average thickness, adjusting the pressing pressure on the copper clad laminate to 1.13 times the initial pressing pressure; If the average thickness is less than or equal to the second preset average thickness and greater than the first preset average thickness, adjusting the pressing pressure for the copper clad laminate to 1.23 times the initial pressing pressure; If the average thickness is greater than the second predetermined average thickness, adjusting the pressing pressure on the copper clad laminate to 1.33 times the initial pressing pressure; Specifically, the first preset average thickness is selected within the interval [0.8, 1], and the second preset average thickness is selected within the interval [2.4, 3].

[0052] Specifically, the cutting angle of the stacked copper clad laminate is adjusted to a corresponding value based on the top view profile difference parameter, wherein: The adjustment amplitude of the cutting angle of the stacked copper clad laminate determined based on the top view profile difference parameter is positively correlated with the top view profile difference parameter.

[0053] In this embodiment, optionally, Comparing the top view contour difference parameter with a first preset top view comparison threshold and a second preset top view comparison threshold; If the top view contour difference parameter is less than or equal to the first preset top view comparison threshold, the adjustment range of the cutting angle is determined to be 1.1 times the initial adjustment range; If the top view contour difference parameter is less than or equal to the second preset top view comparison threshold and greater than the first preset top view comparison threshold, the adjustment range of the cutting angle is determined to be 1.17 times the initial adjustment range; If the top view contour difference parameter is greater than the second preset top view comparison threshold, the adjustment range of the cutting angle is determined to be 1.21 times the initial adjustment range; The first preset overlooking comparison threshold is 2.3K0, and the second preset overlooking comparison threshold is 4.5K0.

[0054] Specifically, the vibration separation frequency is adjusted to a corresponding value based on the side profile difference parameter, where: The vibration separation frequency determined based on the side profile difference parameter is inversely proportional to the side profile difference parameter.

[0055] In this embodiment, optionally, comparing the side view profile difference parameter with a first preset side view comparison threshold and a second preset side view comparison threshold; If the side view profile difference parameter is less than or equal to the first preset side view comparison threshold, adjusting the vibration separation frequency to 0.92 times the initial vibration separation frequency; If the side view profile difference parameter is less than or equal to the second preset side view comparison threshold and greater than the first preset side view comparison threshold, adjusting the vibration separation frequency to 0.87 times the initial vibration separation frequency; If the side view profile difference parameter is greater than a second preset side view comparison threshold, adjusting the vibration separation frequency to 0.72 times the initial vibration separation frequency; The first preset side view comparison threshold is 1.3Y2, and the second preset side view comparison threshold is 2.6Y2.

[0056] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

[0057] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A processing technology for copper clad laminate, characterized in that: include: S1, preparation of semi-finished glued paper, obtaining glass fiber cloth and glass fiber non-woven fabric that have been impregnated with glue; S2, pressing of copper clad laminate, laminating the semi-finished sizing paper and copper foil under high temperature and high pressure; S3, embrittlement adhesive coating, coating the embrittlement adhesive onto the pressed copper clad laminate; S4, copper clad laminate stacking, stacking the copper clad laminates to prepare for the next step of cutting and drilling; S5, unified cutting and drilling of stacked copper clad laminates; S6, low temperature embrittlement separation and vibration separation, using the characteristics of low temperature embrittlement glue to make the embrittlement glue brittle at low temperature, and separate the copper clad laminates through vibration separation; S7, when the preparation of a single batch of copper clad laminates is completed, copper clad laminates are selected for testing, a side profile curve of the copper clad laminates for testing is obtained, and a profile coincidence parameter for a single copper clad laminate determined based on the side profile curve is used to determine whether the copper clad laminates are qualified, including: Determine that the copper clad laminate is unqualified, determine the contour difference parameter based on the acquired image information of the copper clad laminate, and determine the processing method for the copper clad laminate preparation parameters based on the contour difference parameter, including adjusting the pressing pressure of the copper clad laminate to a corresponding value, adjusting the cutting angle of the stacked copper clad laminate to a corresponding value, or adjusting the vibration separation frequency of step S6 to a corresponding value; Or, when the copper clad laminate is determined to be qualified, the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

2. The processing technology for copper clad laminate according to claim 1, characterized in that: In S7, the process of determining the profile coincidence parameter for the copper clad laminate based on the side profile curve includes: Acquire side image information of the copper clad laminate, and identify a side contour curve of the copper clad laminate in the side image information; The side contour curve is compared with the preset side contour curve in terms of overlap, and the length ratio of the overlap length to the total length of the preset side contour curve is obtained to obtain the contour overlap parameter; Determine whether a single copper clad laminate is qualified based on the contour overlap parameters, including: If the contour coincidence parameter is less than or equal to the first preset contour coincidence parameter, the single copper clad laminate is determined to be unqualified, and the contour difference parameter is determined based on the acquired image information of the copper clad laminate, and the processing method for the copper clad laminate preparation parameters is determined based on the contour difference parameter; If the contour overlap parameter is less than or equal to the second preset contour overlap parameter and greater than the first preset contour overlap parameter, the single copper clad laminate is judged to be unqualified, and a treatment method for the preparation of the semi-finished glued paper is determined based on the number of copper clad laminate layers; If the contour overlap parameter is greater than the second preset contour overlap parameter, the single copper clad laminate is determined to be qualified, and the current preparation parameters are continuously used to complete the preparation of the copper clad laminate.

3. The processing technology for copper clad laminate according to claim 2, characterized in that: The processing method for the preparation of semi-finished glue paper is determined based on the number of copper clad laminate layers, including: If the number of copper clad laminate layers is less than or equal to the preset number of layers, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to a corresponding value based on the contour coincidence parameter; If the number of copper clad laminate layers is greater than a preset number of layers, the pressing temperature of the copper clad laminate is adjusted to a corresponding value based on the number of copper clad laminate layers.

4. The processing technology for copper clad laminate according to claim 3, characterized in that: Based on the contour coincidence parameter, the dipping time of the glass fiber cloth and the glass fiber non-woven fabric is adjusted to the corresponding value, where: The increase in the dipping time of the glass fiber cloth and the glass fiber non-woven fabric determined based on the contour coincidence parameter is inversely proportional to the contour coincidence parameter; The pressing temperature of the copper clad laminate is adjusted to the corresponding value based on the number of copper clad laminate layers, where: The pressing temperature of the copper clad laminate determined based on the number of copper clad laminate layers is proportional to the number of copper clad laminate layers.

5. The processing technology for copper clad laminate according to claim 4, characterized in that: In S7, determining the contour difference parameter based on the acquired image information of the single copper clad laminate includes: Obtaining side profile difference parameters based on image information of a single copper-clad laminate, comparing the side profile curve with the preset side profile curve, identifying each overlap abnormal area, obtaining the distance between each overlap abnormal area, solving the variance of each distance, and obtaining the side profile difference parameters; Obtaining a top view contour difference parameter based on the image information of a single copper clad laminate, obtaining the top view image information of the copper clad laminate, identifying the edge contour curve of the copper clad laminate in the top view image information, comparing the edge contour curve with the preset edge contour curve, identifying each overlap abnormal area, obtaining the distance between each overlap abnormal area, solving the variance of the distance between each overlap abnormal area, and obtaining the top view contour difference parameter; Based on the side profile difference parameters, the processing method for the copper clad laminate preparation parameters is determined, including: If the side view profile difference parameter is less than or equal to the first preset side view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the side view profile difference parameter is less than or equal to the second preset side view profile difference parameter and greater than the first preset side view profile difference parameter, then determining a processing method for the copper clad laminate preparation parameters based on the top view profile difference parameter; If the side view profile difference parameter is greater than the second preset side view profile difference parameter, the vibration separation frequency is adjusted to a corresponding value based on the side view profile difference parameter.

6. The processing technology for copper clad laminate according to claim 5, characterized in that: Based on the top view profile difference parameters, the processing method for the copper clad laminate preparation parameters is determined, including: If the top view profile difference parameter is less than or equal to the preset top view profile difference parameter, adjusting the pressing pressure of the copper clad laminate to a corresponding value based on the average thickness of the copper clad laminate; If the top view profile difference parameter is greater than the preset top view profile difference parameter, the cutting angle for the stacked copper clad laminate is adjusted to a corresponding value based on the top view profile difference parameter.

7. The processing technology for copper clad laminate according to claim 6, characterized in that: The pressing pressure of the copper clad laminate is adjusted to a corresponding value based on the average thickness of the copper clad laminate, where: The pressing pressure of the copper clad laminate determined based on the average thickness of the copper clad laminate is proportional to the average thickness of the copper clad laminate.

8. The processing technology for copper clad laminate according to claim 7, characterized in that: The cutting angle of the stacked copper clad laminate is adjusted to a corresponding value based on the top view profile difference parameter, wherein: The adjustment amplitude of the cutting angle of the stacked copper clad laminate determined based on the top view profile difference parameter is positively correlated with the top view profile difference parameter.

9. The processing technology for copper clad laminate according to claim 8, characterized in that: The vibration separation frequency is adjusted to a corresponding value based on the side profile difference parameter, where: The vibration separation frequency determined based on the side view profile difference parameter is inversely proportional to the side view profile difference parameter.

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