Non-interference liquid cooling equipment for vehicle-mounted electronic equipment
By using pressurization mechanism and electronic control components in vehicle-mounted equipment to adjust the coolant flow rate, combined with one-way conducting pipelines and clamping design, the problems of uneven heat dissipation and dust-proof and waterproofing in the existing technology are solved, and efficient heat dissipation and low-power are achieved The balance of consumption and improves the dust and waterproof performance of the equipment.
Patent Information
- Application Number
- CN202411845666.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-01-14
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The liquid-cooled cooling method of existing vehicle-mounted equipment cannot be adjusted according to the heat dissipation of electronic equipment, resulting in uneven heat dissipation effect and increased power consumption. At the same time, the connection port lacks dust-proof and waterproof function, which is easy to damage.
A liquid cooling device for on-board electronic equipment without interference is designed, using pressurization mechanism and electrical control components to adjust the flow of coolant, ensuring the unidirectional flow of coolant through the pressurized cylinder and one-way conducting pipe, and combining with the wiring mechanism card. The connection design realizes dust-proof and waterproof function.
The heat dissipation degree is adjusted according to the heat dissipation amount, the heat dissipation efficiency and power consumption balance are improved, and the equipment is protected through dust-proof and waterproof design, ensuring the stability and durability of the equipment.
Smart Images

Figure CN119317085A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of cooling vehicle-mounted equipment, and in particular to non-interference liquid cooling equipment for vehicle-mounted electronic equipment. Background Art
[0002] With the development of driving technology, the requirements for electronic equipment in vehicle-mounted equipment applications are becoming higher and higher. As the power consumption of the vehicle-mounted core computing unit continues to increase, and the installation location of the vehicle-mounted core computing unit is no longer limited to the interior of the vehicle cab, the vehicle-mounted core computing unit is required to have high heat dissipation efficiency and dust and water resistance.
[0003] At present, electronic devices in vehicle-mounted equipment applications generally adopt liquid cooling for heat dissipation, but the liquid cooling method of electronic devices in vehicle-mounted equipment applications is relatively limited. During the heat dissipation process, due to the different heat dissipation of different electronic devices, if equivalent heat dissipation is adopted, on the one hand, it will lead to uneven heat dissipation effect, and on the other hand, it will lead to increased power consumption, that is, the heat dissipation degree cannot be adjusted according to the heat dissipation. Secondly, the connectors required by the electronic devices in vehicle-mounted equipment applications often do not have dust and water proof functions, which can easily cause damage. Summary of the invention
[0004] In view of the deficiencies of the prior art, the present invention provides a non-interference liquid cooling device for vehicle-mounted electronic equipment, which solves the problem that the heat dissipation degree cannot be adjusted according to the heat dissipation amount.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an interference-free liquid cooling device for vehicle-mounted electronic equipment, comprising a shell, three electronic equipment bodies arranged at the bottom of the shell, a liquid cooling mechanism for cooling the electronic equipment bodies is arranged on the upper surface of the shell, three pressurizing mechanisms and a pressurizing cylinder are arranged inside the shell, a piston for pressurizing by the pressurizing mechanism is arranged inside the pressurizing cylinder, a liquid inlet of the pressurizing cylinder is connected to the liquid cooling mechanism, a liquid outlet of the pressurizing cylinder is connected to a flow channel pipe, the flow channel pipe is spirally wound around the outer surface of the electronic equipment body, and flows back to the liquid cooling mechanism through a reflux pipe; The front side of the housing is provided with an electric control component for controlling the adaptive flow of the cooling liquid inside the liquid cooling mechanism. The electric control component is controlled by temperature. The higher the temperature, the greater the flow of the liquid cooling mechanism. The power connection ends of the three electronic equipment bodies all extend out of the shell and are connected with a wiring mechanism, and the wiring mechanism is used to connect an external connector.
[0006] Preferably, the liquid cooling mechanism includes a liquid cooling box fixedly connected to the upper surface of the shell, a semiconductor refrigeration plate is arranged on the front side of the liquid cooling box, the inner side of the semiconductor refrigeration plate is in contact with the coolant inside the liquid cooling box, a cooling fan for external heat dissipation of the semiconductor refrigeration plate is arranged on the outer side of the semiconductor refrigeration plate, cooling fins are also arranged on the front bottom of the liquid cooling box, and a liquid filling port is arranged on the upper surface of the liquid cooling box.
[0007] Preferably, the electronic control component includes a power supply, a control switch, three parallel thermistors, and a capacitor. The thermistor is a negative temperature coefficient thermistor device. The three thermistors are in contact with the heating ports of three electronic equipment bodies respectively. The capacitor provides electrical energy support for the pressurizing mechanism.
[0008] Preferably, the pressurizing mechanism includes a fixed frame fixedly connected to the upper inner wall of the shell, a driving disk connected to the power supply end of the capacitor is arranged inside the fixed frame, the rotation speed of the driving disk is proportional to the capacity of the capacitor, the front side of the driving disk is rotatably connected to the outside with a connecting rod, the bottom of the connecting rod is rotatably connected to a slide plate, the bottom of the slide plate is fixedly connected to a guide rod, the bottom of the guide rod slides through the interior of the pressurizing cylinder and is fixedly connected to the piston.
[0009] Preferably, the liquid inlet of the pressurizing cylinder is connected to the liquid cooling mechanism through a unidirectional first conduit, and the liquid outlet of the pressurizing cylinder is connected to the flow channel tube through a unidirectional second conduit.
[0010] Preferably, the wiring mechanism includes a connector, the outer wall of the connector is fixedly sleeved with a snap-on sleeve, the outer side of the snap-on sleeve is penetrated by a hollow cylinder, the outer surface of the hollow cylinder is plugged with a first rack, the bottom side wall of the first rack is meshed with a gear, the side wall of the gear is meshed with a second rack, and the bottom of the second rack is fixedly connected with a clamping head for clamping with an external connector.
[0011] Preferably, the upper end of the second rack is fixedly connected to a first spring, and the upper end of the first spring is fixedly connected to the upper inner wall of the hollow cylinder.
[0012] Preferably, a cavity is provided at the bottom of the clamp head, a second spring is fixedly connected to the inner wall of the cavity, and an extrusion plate is fixedly connected to the outer end of the second spring.
[0013] The present invention provides a non-interference liquid cooling device for vehicle-mounted electronic equipment, which has the following beneficial effects: 1. The present invention adopts the design of the pressurizing mechanism and the pressurizing cylinder so that the coolant in the liquid cooling mechanism can be fully pressurized inside the pressurizing cylinder, thereby increasing the flow rate of the coolant and further improving the heat dissipation efficiency; at the same time, the liquid inlet and the liquid outlet of the pressurizing cylinder are respectively connected to the liquid cooling mechanism and the flow channel pipe through the first and second unidirectional conductive conduits, ensuring the unidirectional flow of the coolant in the system, avoiding the backflow and mixing of the coolant in the system, and ensuring the consistency and stability of the heat dissipation effect.
[0014] 2. The present invention, through the design of the electronic control component, enables the coolant inside the liquid cooling mechanism to adapt and flow according to the heat generated by the electronic device body. When the heat generated by the electronic device body increases, the resistance value of the thermistor decreases, and the discharge power of the capacitor increases, thereby increasing the rotation speed of the drive disk, that is, accelerating the reciprocating speed of the piston, thereby increasing the flow rate of the coolant inside the liquid cooling mechanism, thereby improving the heat dissipation efficiency; similarly, when the heat generated by the electronic device body decreases, the resistance value of the thermistor increases, and the discharge power of the capacitor decreases, thereby reducing the rotation speed of the drive disk, that is, reducing the reciprocating speed of the piston, thereby reducing the flow rate of the coolant inside the liquid cooling mechanism, thereby avoiding unnecessary power consumption. Therefore, the present invention can adjust the degree of heat dissipation according to the heat dissipation amount, and achieve a balance between efficient heat dissipation and low power consumption.
[0015] 3. The present invention adopts the design of the wiring mechanism. When the external connector is connected to the connector, the card block on the outer surface of the external connector is inserted into the cavity, which will drive the extrusion plate to retract, and under the action of the first rack, the second rack and the first spring, it is stuck into the card head to achieve docking; secondly, when it needs to be removed, just press the first rack, and under the action of the second spring, the external connector can be ejected. This design not only ensures a stable connection between the external connector and the connector, but also prevents dust and moisture from entering the interior of the electronic device body, thereby improving the dustproof and waterproof performance of the device.
[0016] In summary, the present invention realizes an interference-free liquid cooling device for vehicle-mounted electronic equipment through reasonable structural design and optimized control strategy, which can adjust the heat dissipation degree according to the heat dissipation amount, has a balance between efficient heat dissipation and low power consumption, and has good dustproof and waterproof performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is an overall cross-sectional schematic diagram of the present invention; Figure 3 It is a front view schematic diagram of the present invention; Figure 4 It is a schematic side view of the liquid cooling box of the present invention; Figure 5It is a schematic diagram of the pressurizing mechanism of the present invention; Figure 6 The schematic diagram of the electric control principle of the present invention, wherein “R NTC " stands for negative temperature coefficient thermistor, and "C" stands for capacitor"; Figure 7 It is a schematic diagram of the connection mechanism of the present invention; Figure 8 for Figure 7 A schematic diagram of the enlarged structure at point A in the middle.
[0018] Among them, 1. housing; 2. electronic equipment body; 3. liquid cooling mechanism; 4. pressurizing mechanism; 5. pressurizing cylinder; 7. piston; 8. first conduit; 9. second conduit; 10. flow channel; 11. return pipe; 12. electronic control component; 13. thermistor; 14. wiring mechanism; 31. Liquid cooling box; 32. Semiconductor cooling sheet; 33. Cooling fan; 34. Cooling fins; 35. Liquid filling port; 41. fixed frame; 42. driving plate; 43. connecting rod; 44. sliding plate; 45. guide rod; 141. Connector; 142. Snap-on sleeve; 143. Hollow cylinder; 144. First rack; 145. Gear; 146. Second rack; 147. Clamp; 148. First spring; 149. Cavity; 1491. Second spring; 1492. Extrusion plate. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0020] Embodiment 1: Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, an embodiment of the present invention provides an interference-free liquid cooling device for vehicle-mounted electronic equipment, including a shell 1, three electronic equipment bodies 2 arranged at the bottom of the shell 1, a liquid cooling mechanism 3 for cooling the electronic equipment body 2 is arranged on the upper surface of the shell 1, and a coolant is arranged inside the liquid cooling mechanism 3. Three pressurizing mechanisms 4 and a pressurizing cylinder 5 are arranged inside the shell 1, and a piston 7 for pressurizing by the pressurizing mechanism 4 is arranged inside the pressurizing cylinder 5. The liquid inlet of the pressurizing cylinder 5 is connected to the liquid cooling mechanism 3, and the liquid outlet of the pressurizing cylinder 5 is connected to the flow channel pipe 10. Specifically, the liquid inlet of the pressurizing cylinder 5 is connected to the liquid cooling mechanism 3 through a unidirectional first conduit 8, and the liquid outlet of the pressurizing cylinder 5 is connected to the flow channel pipe 10 through a unidirectional second conduit 9. The flow channel pipe 10 is spirally wound around the outer surface of the electronic equipment body 2 and refluxes to the liquid cooling mechanism 3 through a reflux pipe 11.
[0021] The above structure, through the design of the pressurizing mechanism 4 and the pressurizing cylinder 5, enables the coolant in the liquid cooling mechanism 3 to be fully pressurized inside the pressurizing cylinder 5, thereby increasing the flow rate of the coolant and further improving the heat dissipation efficiency; at the same time, the liquid inlet and the liquid outlet of the pressurizing cylinder 5 are respectively connected to the liquid cooling mechanism 3 and the flow channel tube 10 through the unidirectional first conduit 8 and the second conduit 9, ensuring the unidirectional flow of the coolant in the system, avoiding the backflow and mixing of the coolant in the system, and ensuring the consistency and stability of the heat dissipation effect.
[0022] The front of the housing 1 is provided with an electric control component 12 for controlling the adaptive flow of the cooling liquid inside the liquid cooling mechanism 3. The electric control component 12 is temperature controlled. The higher the temperature, the greater the flow of the liquid cooling mechanism 3. Specifically, the electric control component 12 includes a 220V AC power supply, a control switch, three parallel thermistors 13, and an immutable capacitor C. The thermistor 13 is a negative temperature coefficient thermistor device. The three thermistors 13 are in contact with the heating ports of the three electronic equipment bodies 2. The capacitor provides power support for the pressurizing mechanism 4. Secondly, the pressurizing mechanism 4 includes a fixed connection A fixed frame 41 is connected to the upper inner wall of the shell 1, and a driving disk 42 connected to the power supply end of the capacitor is arranged inside the fixed frame 41. The rotation speed of the driving disk 42 is proportional to the capacity of the capacitor. The front side of the driving disk 42 is rotatably connected to the outside with a connecting rod 43, and the bottom of the connecting rod 43 is rotatably connected to a slide plate 44. The bottom of the slide plate 44 is fixedly connected to a guide rod 45. The bottom of the guide rod 45 slides through the inside of the pressurizing cylinder 5 and is fixedly connected to the piston 7. The driving disk 42 rotates, and under the action of the connecting rod 43, the slide plate 44, the guide rod 45 and the piston 7 are driven to reciprocate up and down.
[0023] The above structure, through the design of the electronic control component 12, enables the coolant inside the liquid cooling mechanism 3 to adapt and flow according to the heat generation of the electronic device body 2. When the heat generation of the electronic device body 2 increases, the resistance value of the thermistor 13 decreases, and the discharge power of the capacitor increases, thereby increasing the rotation speed of the drive disk 42, that is, accelerating the reciprocating speed of the piston 7, thereby increasing the flow rate of the coolant inside the liquid cooling mechanism 3, thereby improving the heat dissipation efficiency; similarly, when the heat generation of the electronic device body 2 decreases, the resistance value of the thermistor 13 increases, and the discharge power of the capacitor decreases, thereby reducing the rotation speed of the drive disk 42, that is, reducing the reciprocating speed of the piston 7, thereby reducing the flow rate of the coolant inside the liquid cooling mechanism 3, thereby avoiding unnecessary power consumption. Therefore, the present invention can adjust the degree of heat dissipation according to the heat dissipation amount, and achieve a balance between efficient heat dissipation and low power consumption.
[0024] The power connection ends of the three electronic equipment bodies 2 all extend out of the housing 1 and are connected to a wiring mechanism 14 , which is used to connect to an external connector.
[0025] Embodiment 2: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, an embodiment of the present invention provides a non-interference liquid cooling device for vehicle-mounted electronic equipment, including a shell 1, three electronic equipment bodies 2 arranged at the bottom of the shell 1, and the upper surface of the shell 1 is provided with a liquid cooling mechanism 3 for cooling the electronic equipment body 2. Specifically, the liquid cooling mechanism 3 includes a liquid cooling box 31 fixedly connected to the upper surface of the shell 1, a semiconductor cooling plate 32 is arranged on the front side of the liquid cooling box 31, the inner side of the semiconductor cooling plate 32 is in contact with the cooling liquid inside the liquid cooling box 31, and a cooling fan 33 for external heat dissipation of the semiconductor cooling plate 32 is arranged on the outer side of the semiconductor cooling plate 32, and a cooling fin 34 is also arranged on the front bottom of the liquid cooling box 31, and a liquid filling port 35 is arranged on the upper surface of the liquid cooling box 31. The liquid cooling mechanism 3 is provided with cooling liquid inside.
[0026] The above structure can cool the coolant inside the liquid cooling box 31 at its cold end under the action of the semiconductor cooling sheet 32, and dissipate heat at its hot end through the external cooling fan 33.
[0027] Three pressurizing mechanisms 4 and a pressurizing cylinder 5 are arranged inside the shell 1. A piston 7 for pressurizing through the pressurizing mechanism 4 is arranged inside the pressurizing cylinder 5. The liquid inlet of the pressurizing cylinder 5 is connected to the liquid cooling mechanism 3, and the liquid outlet of the pressurizing cylinder 5 is connected to the flow tube 10. Specifically, the liquid inlet of the pressurizing cylinder 5 is connected to the liquid cooling mechanism 3 through a unidirectional first conduit 8, and the liquid outlet of the pressurizing cylinder 5 is connected to the flow tube 10 through a unidirectional second conduit 9. The flow tube 10 is spirally wound around the outer surface of the electronic device body 2 and refluxes to the liquid cooling mechanism 3 through the reflux pipe 11.
[0028] The above structure, through the design of the pressurizing mechanism 4 and the pressurizing cylinder 5, enables the coolant in the liquid cooling mechanism 3 to be fully pressurized inside the pressurizing cylinder 5, thereby increasing the flow rate of the coolant and further improving the heat dissipation efficiency; at the same time, the liquid inlet and the liquid outlet of the pressurizing cylinder 5 are respectively connected to the liquid cooling mechanism 3 and the flow channel tube 10 through the unidirectional first conduit 8 and the second conduit 9, ensuring the unidirectional flow of the coolant in the system, avoiding the backflow and mixing of the coolant in the system, and ensuring the consistency and stability of the heat dissipation effect.
[0029] The front of the housing 1 is provided with an electric control component 12 for controlling the adaptive flow of the cooling liquid inside the liquid cooling mechanism 3. The electric control component 12 is temperature controlled. The higher the temperature, the greater the flow of the liquid cooling mechanism 3. Specifically, the electric control component 12 includes an AC power supply, a control switch, three parallel thermistors 13, and a capacitor. The thermistor 13 is a negative temperature coefficient thermistor device. The three thermistors 13 are in contact with the heating ports of the three electronic equipment bodies 2. The capacitor provides power support for the pressurizing mechanism 4. Secondly, the pressurizing mechanism 4 includes a 1, a fixed frame 41 is provided on the inner wall of the upper part of the fixed frame 41, a driving disk 42 connected to the power supply end of the capacitor is arranged inside the fixed frame 41, the rotation speed of the driving disk 42 is proportional to the capacity of the capacitor, the front side of the driving disk 42 is rotatably connected to the outside with a connecting rod 43, the bottom of the connecting rod 43 is rotatably connected to a slide plate 44, the bottom of the slide plate 44 is fixedly connected to a guide rod 45, the bottom of the guide rod 45 slides through the inside of the pressurizing cylinder 5 and is fixedly connected to the piston 7, the driving disk 42 rotates, and under the action of the connecting rod 43, the slide plate 44, the guide rod 45 and the piston 7 are driven to reciprocate up and down.
[0030] The above structure, through the design of the electronic control component 12, enables the coolant inside the liquid cooling mechanism 3 to adapt and flow according to the heat generation of the electronic device body 2. When the heat generation of the electronic device body 2 increases, the resistance value of the thermistor 13 decreases, and the discharge power of the capacitor increases, thereby increasing the rotation speed of the drive disk 42, that is, accelerating the reciprocating speed of the piston 7, thereby increasing the flow rate of the coolant inside the liquid cooling mechanism 3, thereby improving the heat dissipation efficiency; similarly, when the heat generation of the electronic device body 2 decreases, the resistance value of the thermistor 13 increases, and the discharge power of the capacitor decreases, thereby reducing the rotation speed of the drive disk 42, that is, reducing the reciprocating speed of the piston 7, thereby reducing the flow rate of the coolant inside the liquid cooling mechanism 3, thereby avoiding unnecessary power consumption. Therefore, the present invention can adjust the degree of heat dissipation according to the heat dissipation amount, and achieve a balance between efficient heat dissipation and low power consumption.
[0031] The power connection ends of the three electronic equipment bodies 2 all extend out of the housing 1 and are connected to a wiring mechanism 14 , which is used to connect to an external connector.
[0032] Example 3: Combination Figure 7 and Figure 8 On the basis of the second embodiment, the power connection ends of the three electronic equipment bodies 2 all extend out of the housing 1 and are connected to a wiring mechanism 14, which is used to connect an external connector. Specifically, the wiring mechanism 14 includes a connector 141, and a clamping sleeve 142 is fixedly sleeved on the outer wall of the connector 141. A hollow cylinder 143 is penetrated through the outer side of the clamping sleeve 142. A first rack 144 is inserted into the outer surface of the hollow cylinder 143. The bottom side wall of the first rack 144 is meshedly connected to a gear 145. The gear 145 is connected to the outer side wall of the first rack 144. The side wall of 45 is meshedly connected with a second rack 146, the upper end of the second rack 146 is fixedly connected with a first spring 148, the upper end of the first spring 148 is fixedly connected to the upper inner wall of the hollow cylinder 143, the bottom of the second rack 146 is fixedly connected with a clamping head 147 for clamping with an external joint, and secondly, a cavity 149 is provided at the bottom of the clamping head 147, the inner wall of the cavity 149 is fixedly connected with a second spring 1491, and the outer end of the second spring 1491 is fixedly connected with an extrusion plate 1492.
[0033] In the above structure, when the external connector is connected to the connector 141, the block on the outer surface of the external connector is inserted into the cavity 149, which will drive the extrusion plate 1492 to retract, and under the action of the first rack 144, the second rack 146 and the first spring 148, it is stuck into the clamp head 147 to achieve docking; secondly, when it needs to be removed, just press the first rack 144, and under the action of the second spring 1491, the external connector can be ejected. This design not only ensures a stable connection between the external connector and the connector 141, but also prevents dust and moisture from entering the electronic device body 2, thereby improving the dustproof and waterproof performance of the device.
[0034] Working principle: The vehicle-mounted electronic equipment does not interfere with the liquid cooling equipment. When the heat generated by one of the electronic equipment bodies 2 increases, the resistance value of the corresponding thermistor 13 decreases, and the discharge power of the capacitor increases, thereby increasing the rotation speed of the drive disk 42. The drive disk 42 rotates, and under the action of the connecting rod 43, the slide plate 44, the guide rod 45 and the piston 7 are driven to move up and down, that is, the reciprocating speed of the piston 7 is accelerated, thereby increasing the coolant flow inside the liquid cooling mechanism 3, thereby improving the heat dissipation efficiency; When the heat generated by the electronic device body 2 decreases, the resistance value of the corresponding thermistor 13 increases, and the discharge power of the capacitor decreases, thereby reducing the rotation speed of the drive disk 42, that is, reducing the reciprocating speed of the piston 7, and thereby reducing the flow rate of the coolant inside the liquid cooling mechanism 3, thereby avoiding unnecessary power consumption, that is, being able to adjust the heat dissipation degree according to the heat dissipation amount, and achieving a balance between efficient heat dissipation and low power consumption; Secondly, when the connector 141 needs to be connected to the external connector, the card block on the outer surface of the external connector is inserted into the cavity 149, which will drive the extrusion plate 1492 to retract, and under the action of the first rack 144, the second rack 146 and the first spring 148, it is clamped into the clamp head 147 to achieve docking; When it is necessary to remove it, the first rack 144 is pressed, and the external connector can be ejected under the action of the second spring 1491. This design not only ensures a stable connection between the external connector and the connector 141, but also prevents dust and moisture from entering the electronic device body 2, thereby improving the dustproof and waterproof performance of the device.
[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A non-interference liquid cooling device for vehicle-mounted electronic equipment, characterized in that: The invention comprises a shell (1), three electronic equipment bodies (2) arranged at the bottom of the shell (1), the upper surface of the shell (1) being provided with a liquid cooling mechanism (3) for cooling the electronic equipment bodies (2), three pressurizing mechanisms (4) and a pressurizing cylinder (5) being arranged inside the shell (1), a piston (7) being arranged inside the pressurizing cylinder (5) for pressurizing by the pressurizing mechanism (4), a liquid inlet of the pressurizing cylinder (5) being connected to the liquid cooling mechanism (3), a liquid outlet of the pressurizing cylinder (5) being connected to a flow channel (10), the flow channel (10) being spirally wound around the outer surface of the electronic equipment body (2) and refluxed to the liquid cooling mechanism (3) through a reflux pipe (11); An electric control component (12) for controlling the adaptive flow of the cooling liquid inside the liquid cooling mechanism (3) is arranged on the front side of the housing (1); the electric control component (12) is temperature controlled; the higher the temperature, the greater the flow of the liquid cooling mechanism (3); The power connection ends of the three electronic equipment bodies (2) all extend out of the housing (1) and are connected to a wiring mechanism (14), and the wiring mechanism (14) is used to connect to an external connector.
2. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 1, characterized in that: The liquid cooling mechanism (3) comprises a liquid cooling box (31) fixedly connected to the upper surface of the shell (1); a semiconductor cooling plate (32) is arranged on the front side of the liquid cooling box (31); the inner side of the semiconductor cooling plate (32) is in contact with the cooling liquid inside the liquid cooling box (31); a cooling fan (33) for external heat dissipation of the semiconductor cooling plate (32) is arranged on the outer side of the semiconductor cooling plate (32); a cooling fin (34) is also arranged on the front bottom of the liquid cooling box (31); and a liquid injection port (35) is arranged on the upper surface of the liquid cooling box (31).
3. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 1, characterized in that: The electric control component (12) comprises a power supply, a control switch, three parallel-connected thermistors (13), and a capacitor. The thermistors (13) are negative temperature coefficient thermistor devices. The three thermistors (13) are in contact with the heating ports of three electronic equipment bodies (2) respectively. The capacitor provides electrical energy support for the pressurizing mechanism (4).
4. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 3, characterized in that: The pressurizing mechanism (4) comprises a fixed frame (41) fixedly connected to the upper inner wall of the shell (1); a driving disk (42) connected to the power supply end of the capacitor is arranged inside the fixed frame (41); the rotation speed of the driving disk (42) is proportional to the capacity of the capacitor; a connecting rod (43) is rotatably connected to the front side of the driving disk (42) on the outer side; a slide plate (44) is rotatably connected to the bottom of the connecting rod (43); a guide rod (45) is fixedly connected to the bottom of the slide plate (44); the bottom of the guide rod (45) slides through the inside of the pressurizing cylinder (5) and is fixedly connected to the piston (7).
5. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 4, characterized in that: The liquid inlet of the pressurizing cylinder (5) is connected to the liquid cooling mechanism (3) via a unidirectional first conduit (8), and the liquid outlet of the pressurizing cylinder (5) is connected to the flow channel tube (10) via a unidirectional second conduit (9).
6. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 1, characterized in that: The wiring mechanism (14) comprises a connector (141), the outer wall of the connector (141) is fixedly sleeved with a snap-on sleeve (142), the outer side of the snap-on sleeve (142) is penetrated by a hollow cylinder (143), the outer surface of the hollow cylinder (143) is plugged with a first rack (144), the bottom side wall of the first rack (144) is meshedly connected with a gear (145), the side wall of the gear (145) is meshedly connected with a second rack (146), and the bottom of the second rack (146) is fixedly connected with a clamping head (147) for clamping with an external connector.
7. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 6, characterized in that: The upper end of the second rack (146) is fixedly connected to a first spring (148), and the upper end of the first spring (148) is fixedly connected to the upper inner wall of the hollow cylinder (143).
8. The non-interference liquid cooling device for vehicle-mounted electronic equipment according to claim 7, characterized in that: A cavity (149) is provided at the bottom of the clamping head (147); a second spring (1491) is fixedly connected to the inner wall of the cavity (149); and an extrusion plate (1492) is fixedly connected to the outer end of the second spring (1491).
Citation Information
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