Electronic device

Abstract

The invention discloses electronic equipment which comprises a screen module and a circuit board assembly, the circuit board assembly comprises a circuit board, an electronic device and a covering layer, the electronic device is arranged on the circuit board, and the covering layer comprises an insulating layer attached to the electronic device and a shielding layer attached to the insulating layer. The insulating layer is used for insulating and isolating the shielding layer and the electronic device; the screen module is provided with a first grounding area, the portion, opposite to the first grounding area, of the insulating layer comprises a plurality of convex hulls, the shielding layer comprises a plurality of convex hull wrapping portions, the convex hulls are covered with the convex hull wrapping portions, the convex hull wrapping portions and the convex hulls form a plurality of grounding electric connection protrusions respectively, and the heights of the grounding electric connection protrusions are equal. The circuit board is provided with a second grounding area, the convex hull wrapping parts are in electric contact with the first grounding area, and the shielding layer is electrically connected with the second grounding area. According to the scheme, the problem that the shielding layer in the electronic equipment related to the related technology is difficult to stably realize shielding grounding can be solved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment design, and specifically relates to an electronic equipment. Background Art

[0002] With the continuous development of the information society and the continuous improvement of user needs, electronic devices (such as mobile phones, tablets, etc.) have more and more functions. In order to provide more and more functions, more and more electronic devices are integrated into electronic devices. At the same time, electronic devices carry functions such as high-frequency wireless communication and high-speed signal processing. Therefore, the requirements for electromagnetic shielding of electronic devices will always exist and will become higher and higher.

[0003] In order to prevent the electronic devices from being affected by electromagnetic interference, the electronic devices involved in the related art are equipped with a shielding cover to achieve electromagnetic shielding. Specifically, the shielding cover covers the corresponding electronic devices. However, the height of the shielding cover is relatively large and it cannot contact the electronic devices because it is made of metal, which will lead to a relatively large thickness of the electronic device, which is ultimately not conducive to the design of the electronic device towards a thinner direction.

[0004] In order to alleviate this problem, the related technology further designs an electronic device in which a shielding layer is covered on the electronic device. Compared with the shielding cover, the shielding layer can fit closely to the electronic device, so it will not occupy too much space in the thickness direction of the electronic device, which is conducive to designing the electronic device to be thinner.

[0005] The shielding cover mentioned above not only performs a shielding function, but is also used to realize the grounding of the screen module of the electronic device. Specifically, a conductive member such as conductive foam is arranged in the gap between the screen module and the shielding cover, and the screen module is electrically connected to the grounding area in the electronic device through the conductive foam and the shielding cover in turn. However, the electronic devices in the electronic devices involved in the related art cannot carry the conductive members well, which leads to unstable grounding of the screen module. Moreover, the elasticity of the conductive foam is poor, and it cannot effectively relieve the pressure applied by the screen module, which leads to the electronic devices being subjected to greater pressure and being easily damaged. Summary of the invention

[0006] The invention discloses an electronic device to solve the problem that it is difficult to stably realize shielding grounding of a shielding layer in the electronic device involved in the related art.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: The present application discloses an electronic device, the disclosed electronic device comprises a screen module and a circuit board assembly, wherein the circuit board assembly comprises a circuit board, an electronic device and a covering layer, the electronic device is arranged on the circuit board, the covering layer comprises an insulating layer attached to the electronic device and a shielding layer attached to the insulating layer, the insulating layer is used to insulate and isolate the shielding layer from the electronic device; The screen module has a first grounding area, the portion of the insulating layer opposite to the first grounding area includes a plurality of convex bumps, the shielding layer includes a plurality of convex bump covering portions, the plurality of convex bump covering portions cover the plurality of convex bumps, and respectively form a plurality of grounding electrical connection protrusions with the plurality of convex bumps, the plurality of grounding electrical connection protrusions have the same height, the circuit board has a second grounding area, the plurality of convex bump covering portions are all in electrical contact with the first grounding area, and the shielding layer is electrically connected to the second grounding area.

[0008] The technical solution adopted by the present invention can achieve the following technical effects: The electronic device disclosed in the embodiment of the present invention improves the structure of the covering layer so that the covering layer can form multiple grounding electrical connection protrusions of equal height, and the convex covering parts of the multiple grounding electrical connection protrusions are directly in contact with the first grounding area to form multiple grounding electrical connections. In this structure, the heights of the multiple grounding electrical connection protrusions are equal, and they are directly in contact with the first grounding area to form multiple electrical connection structures, so the stability of the grounding electrical connection can be improved. This structure does not require the use of intermediate parts such as conductive foam, so it can avoid the problem of unstable grounding caused by the inability of the conductive part to be well supported due to the inability of the covering layer to form a flat supporting surface. At the same time, the multiple grounding electrical connection protrusions are distributed at intervals, and a gap is formed between two adjacent grounding electrical connection protrusions, so that the whole formed by the multiple grounding electrical connection protrusions is similar to an electrical connection structure with larger pores. Therefore, compared with the denser conductive foam, this electrical connection structure has a better elastic buffering function, which can relieve the pressure applied by the screen module, and can reduce the adverse effects of this part of the pressure on the electronic device, so that the electronic device is not easily damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a cross-sectional view of a partial structure of an electronic device disclosed in an embodiment of the present invention; Figure 2 It is a cross-sectional view of a partial structure of another electronic device disclosed in an embodiment of the present invention.

[0010] Description of reference numerals: 10-screen module, 11-screen, 12-flexible circuit board, 121-first grounding area, 20-circuit board assembly, 21-circuit board, 22-electronic device, 23-covering layer, 231-insulating layer, 2311-convex hull, 2312-void, 2313-flat layer, 232-shielding layer, 2321-convex hull covering part, 30-Electrical connector, 40-shell, 50-inner cavity of the device. DETAILED DESCRIPTION

[0011] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0014] Please refer to Figure 1 to Figure 2 An embodiment of the present application discloses an electronic device, which includes a screen module 10 and a circuit board assembly 20.

[0015] The screen module 10 is a display module of the electronic device, and has a first grounding area 121. The electronic device generally further includes a housing 40, the screen module 10 is connected to the housing 40, the screen module 10 and the housing 40 form a device inner cavity 50, and the circuit board assembly 20 is disposed in the device inner cavity 50.

[0016] The circuit board assembly 20 includes a circuit board 21, an electronic device 22, and a cover layer 23. The circuit board 21 can be a main board of an electronic device, or a sub-board of an electronic device, or a circuit board other than a sub-board, a main board, etc. in an electronic device, and the embodiment of the present invention is not limited thereto. The electronic device 22 is arranged on the circuit board 21, so as to realize installation on the circuit board 21, and also realize electrical connection between the electronic device 22 and the circuit board 21. Specifically, the electronic device 22 can be installed on the circuit board 21 by welding process, patch process, etc.

[0017] The covering layer 23 is used to cover the electronic device 22 in a fitting manner. Specifically, the covering layer 23 can cover one electronic device 22 or multiple electronic devices 22, which is not limited in the embodiment of the present invention. Of course, the covering layer 23 also covers the corresponding area of ​​the circuit board 21. The covering layer 23 includes an insulating layer 231 and a shielding layer 232. The insulating layer 231 is formed of an insulating material (such as insulating glue), and the insulating layer 231 performs an insulating function. The shielding layer 232 is formed of a metal material (such as copper, aluminum, silver, etc.), and the shielding layer 232 not only performs a shielding function, but also can perform a conductive function to achieve the grounding electrical connection described later. The insulating layer 231 is attached to the electronic device 22 and covers the electronic device 22, the shielding layer 232 is attached to the insulating layer 231 and covers the insulating layer 231, the insulating layer 231 is located between the shielding layer 232 and the electronic device 22, and the insulating layer 231 is used to insulate and isolate the shielding layer 232 from the electronic device 22.

[0018] The portion of the insulating layer 231 opposite to the first grounding region 121 includes a plurality of convex bumps 2311. The shielding layer 232 includes a plurality of convex bump covering portions 2321, which are local structures on the shielding layer 232 for covering the convex bumps 2311. The plurality of convex bump covering portions 2321 on the shielding layer 232 covering the plurality of convex bumps 2311 form a plurality of grounding electrical connection protrusions with the plurality of convex bumps 2311, the plurality of grounding electrical connection protrusions are of equal height, the plurality of grounding electrical connection protrusions are spaced apart, and two adjacent grounding electrical connection protrusions do not contact, so a gap can be formed between the two adjacent grounding electrical connection protrusions. For example, a convex bump covering portion 2321 covers a corresponding convex bump 2311, thereby forming a grounding electrical connection protrusion.

[0019] The circuit board 21 has a second grounding area. The second grounding area can be a copper leakage area on the circuit board 21. The convex hulled area 2321 of the multiple grounding electrical connection protrusions are all in electrical contact with the first grounding area 121, and the shielding layer 232 is electrically connected to the second grounding area. Since the convex hulled area 2321 is a part of the shielding layer 232, it has a conductive function. In this case, the first grounding area 121 of the screen module 10 is electrically connected to the second grounding area through multiple grounding electrical connection protrusions, and finally the screen module 10 is grounded.

[0020] The electronic device disclosed in the embodiment of the present invention improves the structure of the covering layer 23 so that the covering layer 23 can form a plurality of grounding electrical connection protrusions of equal height, and the convex covering parts 2321 of the plurality of grounding electrical connection protrusions are all in direct contact and electrical connection with the first grounding area 121, thereby forming a plurality of grounding electrical connections. In this structure, the heights of the plurality of grounding electrical connection protrusions are equal, and they are in direct contact with the first grounding area 121 to form a plurality of electrical connection structures, thereby improving the stability of the grounding electrical connection. This structure does not require the use of intermediate parts such as conductive foam, thereby avoiding the problem of unstable grounding caused by the inability of the covering layer 23 to form a flat supporting surface, resulting in the inability of the conductive part to be well supported. At the same time, multiple grounding electrical connection protrusions are distributed at intervals, and gaps are formed between two adjacent grounding electrical connection protrusions, so that the whole formed by the multiple grounding electrical connection protrusions is similar to an electrical connection structure with larger pores. Therefore, compared with the denser conductive foam, this electrical connection structure has better elastic buffering function, and can alleviate and absorb the pressure applied by the screen module 10, and can reduce the adverse effects of this part of the pressure on the electronic device 22, making the electronic device 22 less likely to be damaged.

[0021] As described above, there can be multiple electronic devices 22. In an embodiment where there are multiple electronic devices 22, the device area of ​​the electronic device 22 opposite to the multiple grounding electrical connection protrusions can be larger than the device area of ​​the electronic device 22 at other positions of the circuit board 21. It should be noted that the device area refers to the area of ​​the surface of the electronic device facing away from the circuit board 21. Other positions of the circuit board 21 refer to the area on the circuit board 21 other than the area opposite to the first grounding area 121. In this embodiment, the area where multiple grounding electrical connection protrusions are formed on the covering layer 23 covers the electronic device with a larger device area, which is conducive to better sharing the pressure applied by the screen module 10, so that the electronic device 22 is not easily damaged. Moreover, when a covering layer 23 is set on such an electronic device 22 with a larger device area, the corresponding area of ​​the covering layer 23 is easier to design and form multiple grounding electrical connection protrusions of equal height.

[0022] In other embodiments, there are multiple electronic devices 22, and the height difference between the electronic devices 22 opposite to the multiple grounding electrical connection protrusions can be smaller than the height difference between the electronic devices 22 at other positions of the circuit board 21. This structure can make the corresponding area of ​​the cover layer 23 more flat, and it is easier to design and form multiple grounding electrical connection protrusions with equal heights.

[0023] In the embodiment of the present invention, the insulating layer 231 may be an insulating film, and similarly, the shielding layer 232 may also be a shielding film. In order to make it easier to design the insulating layer 231 to have different thicknesses at different locations, in other embodiments, the insulating layer 231 may be a coated insulating layer, and similarly, the shielding layer 232 may be a coated shielding layer. The coated insulating layer may be formed by coating, spraying, or the like to form a layer of insulating material. The shielding layer 232 may be formed by coating, spraying, or the like to form a layer of shielding material (e.g., metal powder).

[0024] In the embodiment of the present invention, the plurality of grounding electrical connection protrusions may be unevenly distributed. In order to achieve force balance, the plurality of grounding electrical connection protrusions may be evenly distributed.

[0025] In order to further improve the elasticity of the electrical connection structure formed by the multiple grounding electrical connection protrusions, in a further embodiment, a cavity 2312 may be provided in the convex hump 2311. And / or, a portion of the insulating layer 231 opposite to the convex hump 2311 may be provided with a cavity 2312. In other words, at least one of the convex hump 2311 and the portion of the insulating layer 231 opposite to the convex hump 2311 is provided with a cavity 2312. The opening of the cavity 2312 can make the area on the cover layer 23 opposite to the first grounding area 121 have a larger porosity, thereby further improving the elastic buffering performance of the electrical connection structure, so as to better absorb the pressure applied by the screen module 10.

[0026] In the embodiment of the present invention, the portion of the insulating layer 231 opposite to the first grounding region 121 may further include a flat layer 2313, the surface of the flat layer 2313 facing the first grounding region 121 is relatively flat, and a plurality of convex bumps 2311 may be provided on the flat layer 2313. Specifically, the plurality of convex bumps 2311 and the flat layer 2313 are an integrated structure. The portion of the flat layer 2313 opposite to the plurality of convex bumps 2311 may be provided with the above-mentioned cavity 2312. In one embodiment, the surface of the flat layer 2313 facing the first grounding region 121 is a plane, so that it is easier to achieve equal heights of the plurality of grounding electrical connection bumps.

[0027] The embodiment of the present invention does not limit the number of cavities 2312 corresponding to each convex hump 2311, nor does it limit the size of the cavities 2312. In a specific production process, the thickness of each position of the flat layer 2313 may not be completely equal. Based on this, in one embodiment, the size of the cavities 2312 may be proportional to the thickness of the corresponding position of the flat layer 2313, that is, the area with a larger thickness of the flat layer 2313 may be provided with a larger-sized cavity 2312, thereby improving the elastic buffering performance of the area with a larger thickness.

[0028] In other embodiments, the number of cavities 2312 may be proportional to the thickness of the relative parts of the flat layer 2313, that is, more cavities 2312 may be provided in the thicker areas of the flat layer 2313, thereby improving the elastic buffering performance of the thicker areas.

[0029] In an embodiment of the present invention, the screen module 10 may include a screen 11 and a flexible circuit board 12. The screen 11 is the display body of the screen module 10. The screen 11 may be an LCD (Liquid Crystal Display) screen or an OLED (Organic Light-Emitting Diode) screen. The embodiment of the present invention does not limit the specific type of the screen 11. The first end of the flexible circuit board 23 may be attached to the back of the screen 11. The second end of the flexible circuit board 12 is electrically connected to the circuit board 21 through an electrical connector 30. The electrical connector 30 may be a board-to-board electrical connector. The flexible circuit board 12 can realize the power supply and electrical control connection of the circuit board 21 for the screen module 10. The flexible circuit board 12 may include a first grounding area 121, which is located at the first end of the flexible circuit board 12. Of course, in other embodiments, the back of the screen 11 may form the first grounding area 121 in a coating manner. The embodiment of the present invention does not limit the specific formation method of the first grounding area 121.

[0030] The electronic device disclosed in the embodiments of the present application may be a smart phone, a tablet computer, an e-book reader, a wearable device (such as a smart watch), an electronic game console, VR (Virtual Reality) glasses, and the like. The embodiments of the present application do not limit the specific types of electronic devices.

[0031] In order to facilitate understanding of the structure described above, an embodiment of the present invention discloses a method for preparing a circuit board assembly 20. The molding process of the circuit board assembly 20 is described below by way of example. The preparation method includes: An electronic device 22 of a larger size or a plurality of electronic devices 22 of equal height are arranged adjacent to each other at a location on the circuit board 21 opposite to the first grounding area 121 .

[0032] An insulating layer 231 is set in the area where the electronic device 22 on the circuit board 21 is located, so that the insulating layer 231 is attached to and covers the electronic device 22, wherein the thickness of the portion of the insulating layer 231 opposite to the first grounding area 121 is increased to a preset thickness by local dispensing (glue to form the insulating layer 231) or controlling the amount of glue, and the preset thickness is greater than the thickness of other areas of the insulating layer 231, so that the insulating layer 231 with the preset thickness can form the flat layer 2313 mentioned above.

[0033] Glue is dispensed locally on the insulating layer 231 at a location opposite to the first grounding region 121 to form a plurality of convex bumps 2311 .

[0034] The area on the circuit board 21 that does not need to be covered by the insulating layer 231 is cleaned to remove the corresponding part of the insulating layer 231 .

[0035] The shielding layer 232 is coated on the insulating layer 231, and the shielding layer 232 is electrically connected to the second grounding area on the circuit board 21. The shielding layer 232 is attached to the insulating layer 231 and covers the insulating layer 231. Specifically, the electrical connection between the shielding layer 232 and the second grounding area can be achieved by welding, conductive adhesive bonding, etc.

[0036] During the process of assembling the electronic device, the grounding electrical connection protrusion formed by the shielding layer 232 covering the plurality of convex bumps 2311 is electrically contacted with the first grounding area 121, thereby realizing the electrical connection between the shielding layer 232 and the first grounding area 121. Since the shielding layer 232 is electrically connected to the second grounding area, and the shielding layer 232 is electrically contacted with the first grounding area 121, the first grounding area 121 is electrically connected to the second grounding area through the shielding layer 232, and finally the screen module 10 and the circuit board 21 are electrically connected to the ground.

[0037] In other embodiments, in the process of forming a plurality of convex bumps 2311 or forming a portion on the insulating layer 231 opposite to the first grounding area 121, the glue line or the amount of glue output can be controlled, so that the cavity 2312 described above can be formed. It should be noted that in the embodiment of the present invention, the cavity 2312 can be an open structure, that is, the cavity 2312 is connected to the external environment. In this case, the cavity 2312 can be considered as a through hole or a blind hole. In other embodiments, the cavity 2312 can also be a cave structure of a sealed space. This structure can not only improve the elastic buffering performance of the electrical connection structure, thereby alleviating the pressure applied by the screen module 10 to the electronic device 22, but also make the electrical connection structure not easily crushed by the screen module 10, ensuring elastic buffering while ensuring the stability of electrical contact.

[0038] In the embodiment of the present invention, the insulating layer 231 and the shielding layer 232 can be formed by using 3D coating technology, or by using board-level packaging technology, or by using a film layer attachment process, which is not limited by the embodiment of the present invention.

[0039] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0040] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. An electronic device, characterized in that: Comprising a screen module (10) and a circuit board assembly (20), wherein the circuit board assembly (20) comprises a circuit board (21), an electronic device (22) and a covering layer (23), the electronic device (22) being arranged on the circuit board (21), the covering layer (23) comprising an insulating layer (231) attached to the electronic device (22) and a shielding layer (232) attached to the insulating layer (231), and the insulating layer (231) being used for insulating and isolating the shielding layer (232) from the electronic device (22); The screen module (10) has a first grounding region (121); a portion of the insulating layer (231) opposite to the first grounding region (121) includes a plurality of convex bumps (2311); the shielding layer (232) includes a plurality of convex bump covering portions (2321); the plurality of convex bump covering portions (2321) cover the plurality of convex bumps (2311) and respectively form a plurality of grounding electrical connection protrusions with the plurality of convex bumps (2311); the plurality of grounding electrical connection protrusions have the same height; the circuit board (21) has a second grounding region; the plurality of convex bump covering portions (2321) are all in electrical contact with the first grounding region (121); and the shielding layer (232) is electrically connected to the second grounding region.

2. The electronic device according to claim 1, characterized in that: A cavity (2312) is provided in the convex bump (2311); or a cavity (2312) is provided on the insulating layer (231) at a location opposite to the convex bump (2311).

3. The electronic device according to claim 2, characterized in that: The portion of the insulating layer (231) opposite to the first grounding region (121) further comprises a flat layer (2313), the plurality of convex hulls (2311) are arranged on the flat layer (2313), and the portion of the flat layer (2313) opposite to the plurality of convex hulls (2311) is provided with the cavity (2312).

4. The electronic device according to claim 3, characterized in that: The size of the cavity (2312) is proportional to the thickness of the corresponding portion of the flat layer (2313).

5. The electronic device according to claim 3, characterized in that: The number of the cavities (2312) is proportional to the thickness of the corresponding portions of the flat layer (2313).

6. The electronic device according to claim 1, characterized in that: There are a plurality of electronic devices (22), and a device area of ​​the electronic devices (22) opposite to the plurality of grounding electrical connection protrusions is larger than a device area of ​​the electronic devices (22) at other positions of the circuit board (21).

7. The electronic device according to claim 1, characterized in that: There are a plurality of electronic devices (22), and a height difference between the electronic devices (22) opposite to the plurality of grounding electrical connection protrusions is smaller than a height difference between the electronic devices (22) at other positions of the circuit board (21).

8. The electronic device according to claim 1, characterized in that: The insulating layer (231) is a coated insulating layer, and the shielding layer (232) is a coated shielding layer.

9. The electronic device according to claim 1, characterized in that: The plurality of grounding electrical connection protrusions are evenly distributed.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The screen module (10) comprises a screen (11) and a flexible circuit board (12), wherein a first end of the flexible circuit board (12) is attached to the back of the screen (11), a second end of the flexible circuit board (12) is electrically connected to the circuit board (21) via an electrical connector (30), and the flexible circuit board (12) comprises the first grounding area (121).

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