Display panel, manufacturing method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a manufacturing method of the display panel and electronic equipment, and relates to the technical field of display. The display panel comprises the array substrate, the light-emitting device layer, the planarization layer and the collimation light path layer, and the planarization layer is arranged on the side, away from the array substrate, of the light-emitting device layer, so that the problem that the collimation light path layer is stripped due to the fact that the surface of a light-emitting device is uneven can be effectively solved; and the connection stability between the light emitting device layer and the collimation light path layer is improved, so that the reliability of fingerprint unlocking under the screen and the user experience are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Fingerprints are the most commonly used feature in biometrics and are widely used in modern smart devices (such as smartphones, smart watches and tablets). Integrating fingerprint recognition units into display panels has become the mainstream solution in the industry. However, the above solution still has some shortcomings. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, an object of the present application is to provide a display panel, a method for manufacturing a display panel, and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a display panel, the display panel comprising:

[0005] An array substrate, wherein a fingerprint recognition unit is provided in the array substrate;

[0006] A light emitting device layer, the light emitting device layer is located on one side of the array substrate, and the light emitting device layer includes light emitting devices distributed in an array;

[0007] a planarization layer, the planarization layer being located on a side of the light emitting device layer away from the array substrate;

[0008] A collimating light path layer, the collimating light path layer is located on a side of the planarizing layer away from the array substrate, the collimating light path layer includes a collimating channel for allowing light to pass through, wherein an orthographic projection of the collimating channel on the array substrate at least partially overlaps with an orthographic projection of the fingerprint recognition unit on the array substrate.

[0009] In a possible implementation, the display panel further includes a reflective layer, and the reflective layer is located on a side of the collimating light path layer away from the array substrate;

[0010] Preferably, the orthographic projection of the fingerprint recognition unit on the array substrate is outside the orthographic projection of the light emitting device on the array substrate;

[0011] Preferably, the fingerprint recognition unit comprises a photoelectric sensor.

[0012] In a possible implementation manner, the surface of the planarization layer away from the array substrate has a microstructure;

[0013] Preferably, the thickness of the planarization layer is 8 μm to 20 μm;

[0014] Preferably, the refractive index of the planarization layer is 1.2 to 1.7;

[0015] Preferably, the planarization layer is an optical adhesive layer;

[0016] Preferably, the material of the planarization layer includes resin material.

[0017] In a possible implementation, the collimating light path layer includes a first light shielding layer, a first light transmitting layer, a second light shielding layer and a second light transmitting layer;

[0018] The first light shielding layer is located at a side of the planarization layer away from the array substrate, and the first light shielding layer includes a plurality of discretely distributed first light shielding portions;

[0019] The first light-transmitting layer is located on a side of the first light-shielding layer away from the array substrate;

[0020] The second light shielding layer is located on a side of the first light-transmitting layer away from the array substrate, and the second light shielding layer includes a plurality of discretely distributed second light shielding portions;

[0021] The second light-transmitting layer is located on a side of the second light-shielding layer away from the array substrate;

[0022] Preferably, the orthographic projections of the first light shielding portion and the second light shielding portion on the array substrate are located outside the orthographic projection of the collimating channel on the array substrate;

[0023] Preferably, the refractive index of the first light-transmitting layer and the second light-transmitting layer is 1.2-1.7.

[0024] In a possible implementation manner, the orthographic projection of the first light shielding portion on the array substrate is located within the orthographic projection of the second light shielding portion on the array substrate;

[0025] Preferably, the orthographic projection shape of the first light shielding portion and / or the second light shielding portion on the array substrate includes a rectangle or a circle;

[0026] Preferably, the size of the orthographic projection of the first light shielding portion on the array substrate is 4 μm to 6 μm, and the size of the orthographic projection of the second light shielding portion on the array substrate is 6.5 μm to 8.5 μm.

[0027] In a possible implementation, the reflective layer includes a plurality of reflective units, and an orthographic projection of the reflective unit on the array substrate at least partially overlaps with an orthographic projection of the fingerprint recognition unit on the array substrate;

[0028] Preferably, the orthographic projection shape of the reflection unit on the array substrate includes a circle;

[0029] Preferably, the reflecting unit comprises a reflecting lens;

[0030] Preferably, the size of the orthographic projection of the reflection unit on the array substrate is 10 μm to 15 μm.

[0031] In a second aspect, an embodiment of the present application further provides a method for manufacturing a display panel, the method comprising:

[0032] An array substrate is provided, wherein a fingerprint recognition unit is disposed in the array substrate;

[0033] A light emitting device layer is manufactured on one side of the array substrate, wherein the light emitting device layer includes light emitting devices distributed in an array;

[0034] Making a planarization layer on a side of the light emitting device layer away from the array substrate;

[0035] A collimating optical path layer including a collimating channel is fabricated on a side of the planarizing layer away from the array substrate, wherein an orthographic projection of the collimating channel on the array substrate at least partially overlaps with an orthographic projection of the fingerprint recognition unit on the array substrate.

[0036] In a possible implementation, the step of manufacturing a planarization layer on a side of the light-emitting device layer away from the array substrate includes:

[0037] Forming a photoresist layer on a side of the light emitting device layer away from the array substrate, and curing the photoresist layer to obtain a cured photoresist layer;

[0038] Performing ion beam bombardment treatment on the cured photoresist layer to form a microstructure on the surface of the photoresist layer away from the array substrate to obtain the planarization layer;

[0039] Preferably, after the step of manufacturing a collimating optical path layer including collimating channels on a side of the planarizing layer away from the array substrate, the method further comprises:

[0040] A reflective layer is formed on a side of the collimating light path layer away from the array substrate.

[0041] In a possible implementation manner, the step of manufacturing a collimating optical path layer on a side of the planarization layer away from the array substrate includes:

[0042] A first light-shielding material layer is formed on a side of the planarization layer away from the array substrate, and the first light-shielding material layer is patterned to obtain a first light-shielding layer including a plurality of first light-shielding portions;

[0043] A first light-transmitting layer is formed on a side of the first light-shielding layer away from the array substrate;

[0044] A second light-shielding material layer is formed on a side of the first light-transmitting layer away from the array substrate, and the second light-shielding material layer is patterned to obtain a second light-shielding layer including a plurality of second light-shielding portions;

[0045] A second light-transmitting layer is formed on a side of the second light-shielding layer away from the array substrate.

[0046] In a third aspect, an embodiment of the present application further provides an electronic device, comprising a display panel as described in any one of the first aspects, or a display panel manufactured by the method for manufacturing a display panel as described in any one of the second aspects.

[0047] Based on any of the above aspects, the display panel, the manufacturing method of the display panel and the electronic device provided in the embodiments of the present application include an array substrate, a light-emitting device layer, a planarization layer and a collimation light path layer. By setting a planarization layer on the side of the light-emitting device layer away from the array substrate, and connecting the light-emitting device layer and the collimation light path layer through the planarization layer, the problem of peeling of the collimation light path layer caused by the uneven surface of the light-emitting device can be effectively solved, and the connection stability between the light-emitting device layer and the collimation light path layer can be improved, thereby improving the reliability of under-screen fingerprint unlocking and user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0049] Figure 1 A schematic diagram of a film layer structure of a display panel provided in an embodiment of the present application;

[0050] Figure 2 A schematic diagram of another film layer structure of a display panel provided in an embodiment of the present application;

[0051] Figure 3 A schematic diagram of a process for manufacturing a display panel provided in an embodiment of the present application;

[0052] Figure 4 for Figure 3 The corresponding process diagram;

[0053] Figure 5 for Figure 3 Flow chart of sub-steps corresponding to step S130;

[0054] Figure 6 for Figure 3Flow chart of sub-steps corresponding to step S140;

[0055] Figure 7 for Figure 6 Corresponding process diagram. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0058] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0059] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0060] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0062] In the scheme of integrating the fingerprint recognition unit into the display panel, the optical fingerprint recognition technology of light refraction and reflection is used for fingerprint recognition. In the related art, in order to realize optical fingerprint recognition, a collimated light path layer is usually made on the light emitting device layer, and the collimated light path layer includes a collimated light path. When the light source of the light emitting device is projected onto the glass surface with fingerprint pressing, the light will be reflected and refracted differently at different texture positions, and the reflected light can be projected onto the photoelectric sensor through the collimated light path, and the photoelectric sensor forms a corresponding fingerprint image based on the captured reflected light. However, the current optical fingerprint recognition technology has the problem that the recognition accuracy needs to be improved. After analyzing the above problems, the inventors found that the array substrate is made of thin film transistors (TFT) and photoelectric sensors, which will cause the surface of the array substrate to be uneven, thereby affecting the flatness of the light emitting device layer. When the collimated light path layer is made on the light emitting device layer, it will cause poor adhesion between the two. The collimated light path layer is easily peeled off from the light emitting device layer, resulting in the difficulty in ensuring the accuracy and stability of the collimated light path, thereby affecting the reliability and user experience of fingerprint unlocking under the screen.

[0063] In order to solve the above-mentioned technical problems, the inventor innovatively designed the following technical solutions, and the specific implementation solutions of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0064] Please refer to Figure 1 An embodiment of the present application provides a display panel 10 , which includes an array substrate 110 , a light emitting device layer 120 , a planarization layer 130 and a collimating optical path layer 140 .

[0065] The array substrate 110 includes multiple conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit for driving the light-emitting device 121 in the light-emitting device layer 120 can be formed in the array substrate 110. A fingerprint recognition unit 111 can also be provided in the array substrate 110. The fingerprint recognition unit 111 can be connected to the thin film transistor in the array substrate 110. The fingerprint recognition unit 111 can receive reflected light reflected from the fingerprint and generate a corresponding fingerprint image based on the reflected light. Exemplarily, the fingerprint recognition unit 111 can be a photoelectric sensor.

[0066] The light emitting device layer 120 is located on one side of the array substrate 110, and the light emitting device layer 120 includes light emitting devices 121 distributed in an array, wherein the light emitting devices 121 may be OLED devices. In addition, the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110 may be located outside the orthographic projection of the light emitting device 121 on the array substrate 110, thereby ensuring that the fingerprint recognition unit 111 captures the reflected light and forms an accurate fingerprint image based on the captured reflected light without being affected by the light emitting device 121.

[0067] The planarization layer 130 can be located on a side of the light-emitting device layer 120 away from the array substrate 110. The surface flatness of the planarization layer 130 is greater than the surface flatness of the light-emitting device layer 120. The light-emitting device layer 120 and the collimating light path layer 140 are connected through the planarization layer 130. This can solve the problem of insufficient adhesion between the light-emitting device layer 120 and the collimating light path layer 140 due to the unevenness of the array substrate 110 in the related technology, and effectively improve the connection stability between the light-emitting device layer 120 and the collimating light path layer 140.

[0068] Among them, the collimating light path layer 140 includes a collimating channel for light to pass through. In order to allow the reflected light to be captured by the fingerprint recognition unit 111, the orthographic projection of the collimating channel on the array substrate 110 at least partially overlaps with the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110. Preferably, the center of the orthographic projection of the collimating channel on the array substrate 110 coincides with the center of the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110.

[0069] In this embodiment, by setting a planarization layer 130 on the side of the light-emitting device layer 120 away from the array substrate 110, the problem of peeling of the collimating light path layer 140 caused by the uneven surface of the light-emitting device 121 can be effectively solved, and the connection stability between the light-emitting device layer 120 and the collimating light path layer 140 can be improved, thereby improving the reliability of under-screen fingerprint unlocking and user experience.

[0070] For further information, please refer to Figure 2 The display panel may further include a reflective layer 150 located on the side of the collimating light path layer 140 away from the array substrate 110. The reflective layer 150 may focus the light reflected back from the fingerprint so that sufficient reflected light passes through the collimating light path layer 140 to reach the fingerprint recognition unit 111, thereby ensuring the accuracy of the fingerprint image.

[0071] Furthermore, in order to improve the adhesion between the planarization layer 130 and the collimating optical path layer 140, the surface of the planarization layer 130 away from the array substrate 110 has a microstructure. Exemplarily, the microstructure includes a surface micro-concave-convex structure or a surface micro-texture structure formed by ion beam impacting the surface of the planarization layer 130.

[0072] In order to ensure the light transmission effect of the optical path planarization layer 130, the planarization layer 130 can be an optical adhesive layer made of a colorless, transparent, high light transmittance, and good bonding strength optical material. For example, the planarization layer 130 can be made of a resin material with a high refractive index. The refractive index of the planarization layer 130 is 1.2 to 1.7. For example, the refractive index of the planarization layer 130 includes 1.2, 1.24, 1.31, 1.36, 1.42, 1.5, 1.55, 1.59, 1.62, 1.66 or 1.7, etc. Preferably, the refractive index of the planarization layer 130 is 1.5. The thickness of the planarization layer 130 is 8 μm to 20 μm. For example, the thickness of the planarization layer 130 includes 8 μm, 10 μm, 12 μm, 15 μm, 17 μm, 19 μm or 20 μm, etc. Preferably, the thickness of the planarization layer 130 is 17 μm.

[0073] Please refer again Figure 2 The collimating light path layer 140 may include a first light-shielding layer 141, a first light-transmitting layer 142, a second light-shielding layer 143 and a second light-transmitting layer 144, wherein the material of the first light-transmitting layer 142 and the second light-transmitting layer 144 may be the same as or different from the material of the planarization layer 130. Preferably, the material of the first light-transmitting layer 142 and the second light-transmitting layer 144 may be the same as the material of the planarization layer 130.

[0074] The first light-shielding layer 141 is located on a side of the planarization layer 130 away from the array substrate 110. The first light-shielding layer 141 includes a plurality of discretely distributed first light-shielding portions 1411. The first light-transmitting layer 142 is located on a side of the first light-shielding layer 141 away from the array substrate 110. Optical glue may be filled between adjacent first light-shielding portions 1411. In some implementations of the present embodiment, the first light-transmitting layer 142 also fills the gaps between adjacent first light-shielding portions 1411.

[0075] The second light-shielding layer 143 is located on a side of the first light-transmitting layer 142 away from the array substrate 110. The second light-shielding layer 143 includes a plurality of discretely distributed second light-shielding portions 1431. The second light-transmitting layer 144 is located on a side of the second light-shielding layer 143 away from the array substrate 110, wherein optical glue may be further filled between adjacent second light-shielding portions 1431. In some implementations of the present embodiment, the second light-transmitting layer 144 also fills the gaps between adjacent second light-shielding portions 1431.

[0076] In the above structure, the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is located within the orthographic projection of the second light shielding portion 1431 on the array substrate 110, that is, the size of the second light shielding portion 1431 is slightly larger than the size of the first light shielding portion 1411. In addition, the orthographic projections of the first light shielding portion 1411 and the second light shielding portion 1431 on the array substrate 110 may be located outside the orthographic projection of the collimating channel on the array substrate 110, and the orthographic projections of the first light shielding portion 1411 and the second light shielding portion 1431 on the array substrate 110 may be located outside the orthographic projection of the fingerprint identification unit 111 on the array substrate 110. In other words, the collimating channel is a light transmission path defined by the first light shielding portion 1411 and the second light shielding portion 1431. Specifically, the light from the light-emitting device 121 is emitted toward the fingerprint placed above the reflective layer 150 through a collimating channel, and the reflective layer 150 focuses the reflected light reflected by the fingerprint and projects it along the collimating channel onto the fingerprint recognition unit 111, wherein the second shading portion 1431 can block stray light and / or scattered light in the environment and perform a first collimation on the reflected light to reduce the influence of stray light and / or scattered light on the reflected light, and then the first shading portion 1411 performs a second collimation on the reflected light and projects it onto the photoelectric sensor, so that the photoelectric sensor constructs a fingerprint image based on the captured reflected light.

[0077] The orthographic projection shape of the first light shielding portion 1411 and / or the second light shielding portion 1431 on the array substrate 110 includes a rectangle, a circle, etc., the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is 4μm to 6μm, and the size of the orthographic projection of the second light shielding portion 1431 on the array substrate 110 is 6.5μm to 8.5μm. Exemplarily, the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 includes 4μm, 4.2μm, 4.35μm, 4.5μm, 5μm, 5.7μm, 5.85μm or 6μm, etc., and the size of the orthographic projection of the second light shielding portion 1431 on the array substrate 110 includes 6.5μm, 6.55μm, 6.6μm, 6.75μm, 7μm, 7.5μm, 8μm, 8.25μm or 8.5μm, etc. Preferably, the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is 5 μm, and the size of the orthographic projection of the second light shielding portion 1431 on the array substrate 110 is 7 μm.

[0078] It should be noted that the above-mentioned dimensions are related to the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110. By way of example, when the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110 is a rectangle, the dimensions refer to the size of the long side of the rectangle, and when the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110 is a circle, the dimensions refer to the size of the diameter of the circle.

[0079] In addition, the refractive indexes of the first light-transmitting layer 142 and the second light-transmitting layer 144 may be the same or different. Preferably, the refractive indexes of the first light-transmitting layer 142 and the second light-transmitting layer 144 are the same as the refractive index of the planarization layer 130. The refractive indexes of the first light-transmitting layer 142 and the second light-transmitting layer 144 may be 1.2 to 1.7. For example, the refractive indexes of the first light-transmitting layer 142 and the second light-transmitting layer 144 include 1.2, 1.24, 1.31, 1.36, 1.42, 1.5, 1.55, 1.59, 1.62, 1.66 or 1.7. Preferably, the refractive indexes of the first light-transmitting layer 142 and the second light-transmitting layer 144 are 1.5. The thickness of the first light-transmitting layer 142 is 15 μm to 20 μm, and the thickness of the second light-transmitting layer 144 is 8 μm to 12 μm. Exemplarily, the thickness of the first light-transmitting layer 142 is 15 μm, 15.5 μm, 16 μm, 17 μm, 18 μm, 19 μm, 19.5 μm or 20 μm, and the thickness of the second light-transmitting layer 144 is 8 μm, 8.25 μm, 8.5 μm, 9 μm, 10 μm, 11 μm, 11.5 μm, 11.75 μm or 12 μm, and the thickness of the first light-transmitting layer 142 is 17 μm, and the thickness of the second light-transmitting layer 144 is 10 μm.

[0080] Further, please refer again to Figure 2 , the reflective layer 150 may include a plurality of reflective units 151, and the orthographic projections of the plurality of reflective units 151 on the array substrate 110 may at least partially overlap with the orthographic projections of the fingerprint identification unit 111 on the array substrate 110, so as to shorten the light transmission path and reduce light loss. Among them, the height of the reflective unit 151 is less than the film thickness of the reflective layer 150, and the film thickness of the reflective layer 150 is 6μm to 8μm. For example, the film thickness of the reflective layer 150 includes 6.5μm, 6.55μm, 6.6μm, 6.75μm, 7μm, 7.5μm, 7.8μm, 7.95μm, 8μm, etc. The orthographic projection shape of the reflective unit 151 on the array substrate 110 includes a circle, and the size of the orthographic projection of the reflective lens on the array substrate 110 is 10μm to 15μm, which is related to the orthographic projection shape of the reflective unit 151 on the array substrate 110. Exemplarily, when the orthographic projection shape of the reflective unit 151 on the array substrate 110 is a circle, the size of the reflective lens refers to the diameter of the circle. The size of the orthographic projection of the reflective lens on the array substrate 110 includes 10μm, 10.25μm, 10.5μm, 11μm, 12μm, 13μm, 14μm, 14.5μm, 14.75μm, 15μm, etc. Preferably, the reflective unit 151 is a reflective lens, and the maximum diameter of the reflective lens is 13μm and the height is 5μm.

[0081] Based on the same inventive concept, the present application also provides a method for manufacturing a display panel 10. Figure 3 and Figure 4 , Figure 3 The flowchart of the method for manufacturing a display module provided in this embodiment is illustrated. Figure 4 for Figure 3 The corresponding process diagram is combined with the following Figure 3 and Figure 4 , each step of the method for manufacturing the display module is described in detail.

[0082] Step S11: providing an array substrate.

[0083] The array substrate 110 is provided with a fingerprint recognition unit 111, which can receive reflected light reflected from the fingerprint and generate a corresponding fingerprint image according to the reflected light. Exemplarily, the fingerprint recognition unit 111 can be a photoelectric sensor.

[0084] Step S12: manufacturing a light emitting device layer on one side of the array substrate.

[0085] The light emitting device layer 120 includes light emitting devices 121 distributed in an array, wherein the light emitting devices 121 may be OLED devices. In addition, the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110 may be located outside the orthographic projection of the light emitting device 121 on the array substrate 110, thereby ensuring that the fingerprint recognition unit 111 captures the reflected light and forms an accurate fingerprint image based on the captured reflected light without being affected by the light emitting device 121.

[0086] Step S13: forming a planarization layer on a side of the light emitting device layer away from the array substrate.

[0087] The surface flatness of the planarization layer 130 on the side away from the array substrate is greater than the surface flatness of the light emitting device layer 120 on the side away from the array substrate.

[0088] Step S14: manufacturing a collimating optical path layer including a collimating channel on a side of the planarizing layer away from the array substrate.

[0089] Among them, the collimating light path layer 140 includes a collimating channel for light to pass through. In order to allow the reflected light to be captured by the fingerprint recognition unit 111, the orthographic projection of the collimating channel on the array substrate 110 at least partially overlaps with the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110. Preferably, the center of the orthographic projection of the collimating channel on the array substrate 110 coincides with the center of the orthographic projection of the fingerprint recognition unit 111 on the array substrate 110.

[0090] After this step, a reflective layer 150 can also be made on the side of the collimated light path layer 140 away from the array substrate. Specifically, the reflective layer 150 can focus the light reflected back from the fingerprint so that sufficient reflected light passes through the collimated light path layer 140 to reach the fingerprint recognition unit 111, thereby ensuring the accuracy of the fingerprint image.

[0091] In this embodiment, by setting a planarization layer 130 on the side of the light-emitting device layer 120 away from the array substrate 110, the problem of peeling of the collimating light path layer 140 caused by the uneven surface of the light-emitting device 121 can be effectively solved, the connection stability between the light-emitting device layer 120 and the collimating light path layer 140 can be improved, and the product reliability can be improved.

[0092] For further information, please refer to Figure 5 , step S13 can be implemented by the following method.

[0093] Step S131: forming a photoresist layer on a side of the light emitting device layer away from the array substrate, and curing the photoresist layer to obtain a cured photoresist layer.

[0094] In this step, a photoresist layer can be first formed on the side of the light-emitting device layer 120 away from the array substrate 110 by coating optical glue. In order to ensure the light transmittance effect of the optical path flattening layer 130, the flattening layer 130 can be an optical glue layer made of a colorless, transparent optical material with high light transmittance and good bonding strength. Exemplarily, the flattening layer 130 can be made of a transparent resin material with a high refractive index.

[0095] Next, the photoresist layer is vacuumed and cured to obtain a cured photoresist layer, wherein vacuuming and curing the photoresist layer can release stress in the photoresist layer and improve the stability of the film layer.

[0096] Step S132: performing ion beam bombardment treatment on the cured photoresist layer to form a microstructure on the surface of the photoresist layer away from the array substrate to obtain a planarization layer.

[0097] In this step, the cured photoresist layer is subjected to ion beam bombardment treatment, so that a surface micro-concave-convex structure or a surface micro-texture structure can be formed on the surface of the cured photoresist layer, thereby improving the adhesion between the planarization layer 130 and the collimating optical path layer 140 .

[0098] In the present embodiment, the refractive index of the planarization layer 130 is 1.2 to 1.7, and preferably, the refractive index of the planarization layer 130 is 1.5. The thickness of the planarization layer 130 is 8 μm to 20 μm, and illustratively, the thickness of the planarization layer 130 includes 8 μm, 10 μm, 12 μm, 15 μm, 17 μm, 19 μm or 20 μm, and preferably, the thickness of the planarization layer 130 is 17 μm.

[0099] For further information, please refer to Figure 6 and Figure 7 , Figure 6 is a schematic diagram of a sub-step flow chart of step S14, Figure 7 for Figure 6 The corresponding process is drawn, and the following will be combined Figure 6 and Figure 7 The implementation method of step S14 is described in detail.

[0100] Step S141: forming a first light-shielding material layer on a side of the planarization layer away from the array substrate, and patterning the first light-shielding material layer to obtain a first light-shielding layer including a plurality of first light-shielding portions.

[0101] In this step, a first light shielding material layer may be formed on the surface of the planarization layer 130 away from the array substrate 110 by coating a light shielding material, and the first light shielding material layer may be patterned to obtain a plurality of first light shielding portions 1411, and then an optical glue may be filled between adjacent first light shielding portions 1411 to form a first light shielding layer 141. The orthographic projection shape of the first light shielding portion 1411 on the array substrate 110 includes a rectangle, a circle, etc., and the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is 4 μm to 6 μm. Exemplarily, the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 includes 4 μm, 4.2 μm, 4.35 μm, 4.5 μm, 5 μm, 5.7 μm, 5.85 μm or 6 μm, etc. Preferably, the size of the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is 5 μm.

[0102] Step S142: forming a first light-transmitting layer on a side of the first light-shielding layer away from the array substrate.

[0103] In this step, the first light-transmitting layer 142 can be made by coating optical glue (for example, OCA glue), wherein the thickness of the first light-transmitting layer 142 is 15μm~20μm, and the refractive index of the first light-transmitting layer 142 can be 1.2~1.7. Exemplarily, the thickness of the first light-transmitting layer 142 is 15μm, 15.5μm, 16μm, 17μm, 18μm, 19μm, 19.5μm or 20μm, etc., and the first light-transmitting layer 142 includes 1.2, 1.24, 1.31, 1.36, 1.42, 1.5, 1.55, 1.59, 1.62, 1.66 or 1.7, etc. Preferably, the thickness of the first light-transmitting layer 142 is 17μm, and the refractive index of the first light-transmitting layer 142 is 1.5.

[0104] In some implementations of this embodiment, the first light-transmitting layer 142 may be manufactured while optical glue is filled between adjacent first light-shielding portions 1411 .

[0105] Step S143: forming a second light shielding material layer on a side of the first light-transmitting layer away from the array substrate, and patterning the second light shielding material layer to obtain a second light shielding layer including a plurality of second light shielding portions.

[0106] In this step, a second light-shielding material layer can be formed by first coating a light-shielding material on the surface of the first light-shielding layer 141 away from the array substrate 110, and the second light-shielding material layer can be patterned to obtain a plurality of second light-shielding portions 1431. Then, transparent optical glue (for example, OCA glue) is filled between adjacent second light-shielding portions 1431 to form a second light-shielding layer 143. Among them, the shape of the orthographic projection of the second light shading portion 1431 on the array substrate 110 includes a rectangle, a circle, etc., and the size of the orthographic projection of the second light shading portion 1431 on the array substrate 110 is 6.5μm to 8.5μm. Exemplarily, the size of the orthographic projection of the second light shading portion 1431 on the array substrate 110 includes 6.5μm, 6.55μm, 6.6μm, 6.75μm, 7μm, 7.5μm, 8μm, 8.25μm or 8.5μm, etc. Preferably, the size of the orthographic projection of the second light shading portion 1431 on the array substrate 110 is 7μm.

[0107] It should be noted that the above-mentioned dimensions are related to the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110. By way of example, when the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110 is a rectangle, the dimensions refer to the size of the long side of the rectangle, and when the orthographic projection shape of the first light shading portion 1411 and / or the second light shading portion 1431 on the array substrate 110 is a circle, the dimensions refer to the size of the diameter of the circle.

[0108] Step S144: forming a second light-transmitting layer on a side of the second light-shielding layer away from the array substrate.

[0109] In this step, the second light-transmitting layer 144 can be made by coating optical glue (for example, OCA glue), wherein the thickness of the second light-transmitting layer 144 is 8μm~12μm, and the refractive index of the second light-transmitting layer 144 can be 1.2~1.7. Exemplarily, the thickness of the second light-transmitting layer 144 is 8μm, 8.25μm, 8.5μm, 9μm, 10μm, 11μm, 11.5μm, 11.75μm, 12μm, etc., and the second light-transmitting layer 144 includes 1.2, 1.24, 1.31, 1.36, 1.42, 1.5, 1.55, 1.59, 1.62, 1.66 or 1.7, etc. Preferably, the thickness of the second light-transmitting layer 144 is 10μm, and the refractive index of the second light-transmitting layer 144 is 1.5.

[0110] In some implementations of this embodiment, the second light-transmitting layer 144 may be manufactured while optical glue is filled between adjacent second light-shielding portions 1431 .

[0111] In this embodiment, the orthographic projection of the first light shielding portion 1411 on the array substrate 110 is located within the orthographic projection of the second light shielding portion 1431 on the array substrate 110, that is, the size of the second light shielding portion 1431 is slightly larger than the size of the first light shielding portion 1411. In addition, the orthographic projections of the first light shielding portion 1411 and the second light shielding portion 1431 on the array substrate 110 may be located outside the orthographic projection of the collimating channel on the array substrate 110, and the orthographic projections of the first light shielding portion 1411 and the second light shielding portion 1431 on the array substrate 110 may be located outside the orthographic projection of the fingerprint identification unit 111 on the array substrate 110. In other words, the collimating channel is a light transmission path defined by the first light shielding portion 1411 and the second light shielding portion 1431. Specifically, the light from the light-emitting device 121 is emitted toward the fingerprint placed above the reflective layer 150 through a collimating channel, and the reflective layer 150 focuses the reflected light reflected by the fingerprint and projects it along the collimating channel onto the fingerprint recognition unit 111, wherein the second shading portion 1431 can block stray light and / or scattered light in the environment for a first collimation, thereby reducing the influence of stray light and / or scattered light on the reflected light, and then the first shading portion 1411 performs a second collimation on the reflected light and projects it onto the photoelectric sensor, so that the photoelectric sensor constructs a fingerprint image based on the captured reflected light.

[0112] In addition, an embodiment of the present application further provides an electronic device, which may include any one of the display panels 10 in the above embodiments, or a display panel 10 manufactured by the above method. The electronic device can realize under-screen fingerprint unlocking based on the above display panel 10. Specifically, the display panel 10 includes an array substrate 110, a light-emitting device layer 120, a planarization layer 130, and a collimation optical path layer 140. The light-emitting device layer 120 and the collimation optical path layer 140 are connected by the planarization layer 130, which effectively improves the connection stability between the light-emitting device layer 120 and the collimation optical path layer 140, thereby improving the reliability and user experience of under-screen fingerprint unlocking.

[0113] In summary, the embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. The display panel includes an array substrate, a light-emitting device layer, a planarization layer, and a collimating light path layer. By setting a planarization layer on the side of the light-emitting device layer away from the array substrate, the problem of peeling of the collimating light path layer caused by the uneven surface of the light-emitting device can be effectively solved, and the connection stability between the light-emitting device layer and the collimating light path layer can be improved, thereby improving the reliability of under-screen fingerprint unlocking and user experience.

[0114] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: An array substrate, wherein a fingerprint recognition unit is provided in the array substrate; A light emitting device layer, the light emitting device layer is located on one side of the array substrate, and the light emitting device layer includes light emitting devices distributed in an array; a planarization layer, the planarization layer being located on a side of the light emitting device layer away from the array substrate; A collimating light path layer, the collimating light path layer is located on a side of the planarizing layer away from the array substrate, the collimating light path layer comprises a collimating channel, wherein an orthographic projection of the collimating channel on the array substrate at least partially overlaps with an orthographic projection of the fingerprint recognition unit on the array substrate.

2. The display panel according to claim 1, wherein: The display panel further comprises a reflective layer, wherein the reflective layer is located on a side of the collimating light path layer away from the array substrate; Preferably, the orthographic projection of the fingerprint recognition unit on the array substrate is outside the orthographic projection of the light emitting device on the array substrate; Preferably, the fingerprint recognition unit comprises a photoelectric sensor.

3. The display panel according to claim 1, wherein: The surface of the planarization layer away from the array substrate has a microstructure; Preferably, the thickness of the planarization layer is 8 μm to 20 μm; Preferably, the refractive index of the planarization layer is 1.2 to 1.7; Preferably, the planarization layer is an optical adhesive layer; Preferably, the material of the planarization layer includes resin material.

4. The display panel according to claim 1, wherein: The collimating light path layer comprises a first light shielding layer, a first light transmitting layer, a second light shielding layer and a second light transmitting layer; The first light shielding layer is located at a side of the planarization layer away from the array substrate, and the first light shielding layer includes a plurality of discretely distributed first light shielding portions; The first light-transmitting layer is located on a side of the first light-shielding layer away from the array substrate; The second light shielding layer is located on a side of the first light-transmitting layer away from the array substrate, and the second light shielding layer includes a plurality of discretely distributed second light shielding portions; The second light-transmitting layer is located on a side of the second light-shielding layer away from the array substrate; Preferably, the orthographic projections of the first light shielding portion and the second light shielding portion on the array substrate are located outside the orthographic projection of the collimating channel on the array substrate; Preferably, the refractive index of the first light-transmitting layer and the second light-transmitting layer is 1.2-1.

7.

5. The display panel according to claim 4, wherein: The orthographic projection of the first light shielding portion on the array substrate is located within the orthographic projection of the second light shielding portion on the array substrate; Preferably, the orthographic projection shape of the first light shielding portion and / or the second light shielding portion on the array substrate includes a rectangle or a circle; Preferably, the size of the orthographic projection of the first light shielding portion on the array substrate is 4 μm to 6 μm, and the size of the orthographic projection of the second light shielding portion on the array substrate is 6.5 μm to 8.5 μm.

6. The display panel according to claim 2, wherein: The reflective layer comprises a plurality of reflective units, and the orthographic projections of the reflective units on the array substrate at least partially overlap with the orthographic projections of the fingerprint recognition units on the array substrate; Preferably, the orthographic projection shape of the reflection unit on the array substrate includes a circle; Preferably, the reflecting unit comprises a reflecting lens; Preferably, the size of the orthographic projection of the reflection unit on the array substrate is 10 μm to 15 μm.

7. A method for manufacturing a display panel, characterized in that: The method comprises: An array substrate is provided, wherein a fingerprint recognition unit is disposed in the array substrate; A light emitting device layer is manufactured on one side of the array substrate, wherein the light emitting device layer includes light emitting devices distributed in an array; Making a planarization layer on a side of the light emitting device layer away from the array substrate; A collimating optical path layer including a collimating channel is fabricated on a side of the planarizing layer away from the array substrate, wherein an orthographic projection of the collimating channel on the array substrate at least partially overlaps with an orthographic projection of the fingerprint recognition unit on the array substrate.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The step of forming a planarization layer on a side of the light emitting device layer away from the array substrate comprises: Forming a photoresist layer on a side of the light emitting device layer away from the array substrate, and curing the photoresist layer to obtain a cured photoresist layer; Performing ion beam bombardment treatment on the cured photoresist layer to form a microstructure on the surface of the photoresist layer away from the array substrate to obtain the planarization layer; Preferably, after the step of manufacturing a collimating optical path layer including collimating channels on a side of the planarizing layer away from the array substrate, the method further comprises: A reflective layer is formed on a side of the collimating light path layer away from the array substrate.

9. The method for manufacturing a display panel according to claim 7, characterized in that: The step of manufacturing a collimating optical path layer on a side of the planarization layer away from the array substrate comprises: A first light-shielding material layer is formed on a side of the planarization layer away from the array substrate, and the first light-shielding material layer is patterned to obtain a first light-shielding layer including a plurality of first light-shielding portions; A first light-transmitting layer is formed on a side of the first light-shielding layer away from the array substrate; A second light-shielding material layer is formed on a side of the first light-transmitting layer away from the array substrate, and the second light-shielding material layer is patterned to obtain a second light-shielding layer including a plurality of second light-shielding portions; A second light-transmitting layer is formed on a side of the second light-shielding layer away from the array substrate.

10. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 6, or a display panel manufactured by the method for manufacturing a display panel described in any one of claims 7 to 9.

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