Continuous electroplating method

Abstract

The invention provides a continuous electroplating method, and relates to the technical field of electroplating. Comprising the steps that pretreated hardware is conveyed at the uniform speed of 1-30 m / min through conveying equipment, copper plating, water washing, filling and leveling nickel plating or nanometer nickel plating or high-temperature nickel plating or corrected nickel plating, water washing, common nickel plating, water washing and high-phosphorus nickel plating are sequentially conducted, and 1-200 ''hardware is obtained; the uniformity deviation of the nickel plating layer is + 10 ''; the problems that a plating layer is poor in complete effect, insufficient in thickness, poor in uniformity, prone to corrosion, poor in environment resistance, low in corrosion resistance and short in service life are solved, high quality and uniformity of the plating layer on the surface of the hardware are achieved, meanwhile, the production efficiency is considered, the environment resistance is improved, the service life is prolonged, and corrosion resistance is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, and in particular to a continuous electroplating method. Background Art

[0002] With the continuous development of science and technology, various electronic devices play an important role in production and life. In various chips and circuit boards used in electronic devices, electroplating is one of the treatment methods to enhance the conductivity of the terminals or make them have better anti-oxidation ability.

[0003] The current electroplating process still has the following problems, such as poor coating effect, insufficient thickness, poor uniformity, etc., which make it susceptible to corrosion, poor environmental resistance, low corrosion resistance, and short service life; therefore, the present invention proposes a continuous electroplating method to at least partially solve the problems that may exist in the prior art. Summary of the invention

[0004] The object of the present invention is to provide a continuous electroplating method, which can propose solutions to the deficiencies of the prior art, so as to at least partially solve the problems that may exist in the prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: A continuous electroplating method comprising: The first continuous electroplating step: the pre-treated hardware is transported by a conveying device at an average speed of 1 to 30 m / min, and copper plating, water washing, plating of filling nickel or nano nickel or high temperature nickel or modified nickel, water washing, plating of ordinary nickel, water washing, plating of high phosphorus nickel are carried out in sequence to obtain a 1-200µ" nickel plating layer with a uniformity deviation of +10µ"; Among them, in the nickel plating reagent for filling nickel plating and ordinary nickel plating, the nickel concentration is 60-110g / L, the nickel cylinder opening agent concentration is 350-550g / L, the nickel chloride concentration is 40-60g / L, the boric acid concentration is 40-60g / L, the pH value is 4.5-5.1, and the temperature range is 40°C-70°C; the water washing is carried out by spraying pure water.

[0006] Optionally, before the first continuous electroplating step, the method further comprises: Pretreatment steps: degreasing, water washing, micro-etching activation, water washing, etc. Specifically include: Use a degreasing agent with a concentration of 60-90g / L at a temperature of 45℃~70℃ to perform ultrasonic degreasing on the hardware, and / or use a degreasing agent with a concentration of 60-90g / L at a temperature of 45℃~70℃ to perform electrolytic degreasing; Pure water spray washing; Use sulfuric acid with a concentration of 8-15°Bé to perform micro-etching and activation treatment on hardware at room temperature; Rinse with pure water again.

[0007] Optionally, after the first continuous electroplating step, the method further comprises: The second continuous electroplating step includes the steps of palladium nickel plating, water washing, gold plating, water washing, platinum plating, water washing, gold plating, and water washing in sequence, specifically including: The palladium-nickel plating is carried out by using a palladium-nickel plating reagent having a nickel concentration of 8-15 g / L, a palladium concentration of 12-22 g / L, a concentration of 8-15° Bé sulfuric acid, a pH value of 4.2-5.2, and a temperature range of 45°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 5-15g / L and a pH value of less than 0.5 at a temperature range of 50°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray.

[0008] Optionally, the palladium-nickel plating process further includes a palladium-nickel pre-plating step before the palladium-nickel plating process, which specifically includes: The palladium-nickel pre-plating is carried out by using a palladium-nickel plating reagent with a nickel concentration of 8-15 g / L, a concentration of 8-15° Bé sulfuric acid, a pH value of 4.2-5.5, and a temperature range of 45°C-70°C.

[0009] Optionally, the method further comprises the steps of sealing and drying after the electroplating is completed, specifically comprising sealing with a sealing agent, washing with pure water, air drying and / or drying in sequence; and further comprising: Water sealing is performed at 50℃-70℃ using a water sealant with a concentration of 1.2-25%; Oil sealing is performed at room temperature using an oil sealant with a concentration of 2.0-10%; Pure water spray washing; Wherein, the drying is carried out by using a baking device at a temperature of 1°C-200°C.

[0010] Optionally, the preprocessing step specifically includes: Use a degreasing agent with a concentration of 70g / L at a temperature of 45℃~70℃ to perform ultrasonic degreasing on the hardware, and / or use a degreasing agent with a concentration of 70g / L at a temperature of 45℃~70℃ to perform electrolytic degreasing; Pure water spray washing; Use 12°Bé sulfuric acid to micro-etch and activate the hardware at room temperature; Rinse with pure water again.

[0011] Optionally, the nickel plating temperature is 60° C., and the nickel plating reagent includes a common nickel plating reagent and a high-temperature nickel plating reagent; The common nickel plating reagent has a nickel concentration of 60-110 g / L, a nickel opening agent concentration of 350-550 g / L, a nickel chloride concentration of 40-60 g / L, a boric acid concentration of 40-60 g / L, and a pH value of 4.5-5.1; The high-temperature nickel plating reagent has a nickel concentration of 10-150 g / L, a nickel cylinder opening agent concentration of 350-550 g / L, a nickel chloride concentration of 40-60 g / L, a boric acid concentration of 40-60 g / L, and a pH value of 2.0-3.5.

[0012] Optionally, the common nickel plating reagent has a nickel concentration of 45 g / L, a nickel opening agent concentration of 450 g / L, a nickel chloride concentration of 12 g / L, a boric acid concentration of 50 g / L, and a pH value of 4.2; The high-temperature nickel plating reagent has a nickel concentration of 90 g / L, a nickel cylinder opening agent concentration of 450 g / L, a nickel chloride concentration of 12 g / L, a boric acid concentration of 45 g / L, and a pH value of 3.0.

[0013] Optionally, the second continuous electroplating step specifically includes: The palladium-nickel plating is carried out by using a palladium-nickel plating reagent having a nickel concentration of 10 g / L, a palladium concentration of 15 g / L, a concentration of 12° Bé sulfuric acid, a pH value of 4.8, and a temperature range of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 10 g / L and a pH value of less than 0.5 at a temperature of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray.

[0014] 10. The method according to claim 4 is characterized in that the step of pre-plating palladium nickel specifically comprises pre-plating palladium nickel using a palladium nickel plating reagent with a nickel concentration of 10 g / L, a concentration of 10° Bé sulfuric acid, a pH value of 4.8, and a temperature of 60°C.

[0015] The present invention has at least the following advantages or beneficial effects: The pre-treated hardware is transported by conveying equipment at an average speed of 1 to 30 m / min, and copper plating, water washing, filling nickel or nano nickel or high temperature nickel or modified nickel plating, water washing, ordinary nickel plating, water washing, high phosphorus nickel plating are carried out in sequence to obtain a 1-200µ" nickel plating layer with a uniformity deviation of +10µ". The problems of poor plating effect, insufficient thickness, poor uniformity, etc., which make it susceptible to corrosion, poor environmental resistance, low corrosion resistance, and short service life are solved, and the high quality and uniformity of the surface plating of the hardware are achieved, while taking into account the production efficiency, improving environmental resistance and service life, as well as corrosion resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A flow chart of the steps of a continuous electroplating method provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0019] Reference Figure 1The embodiment of the present invention provides a continuous electroplating method; the method comprises: a first continuous electroplating step: the pre-treated hardware is transported at an average speed of 1 to 30 m / min by a conveying device, and copper plating, water washing, plating of filling nickel or nano nickel or high temperature nickel or modified nickel, water washing, plating of ordinary nickel, water washing, plating of high phosphorus nickel are carried out in sequence to obtain a 1-200µ" nickel plating layer with a uniformity deviation of +10µ"; wherein, in the nickel plating reagents for plating of filling nickel and plating of ordinary nickel, the nickel concentration is 60-110 g / L, the nickel cylinder opening agent concentration is 350-550 g / L, the nickel chloride concentration is 40-60 g / L, the boric acid concentration is 40-60 g / L, the pH value is 4.5-5.1, and the temperature range is 40°C-70°C; the water washing is carried out by pure water spraying.

[0020] The above-mentioned continuous electroplating is achieved by driving the hardware through a transmission belt so that it can move continuously and uninterruptedly, and enter the required electroplating tanks in turn. A water washing tank is set between each electroplating tank for water washing, so that the electroplating has continuity and improves the electroplating efficiency. At the same time, a uniform and thicker plating layer can be obtained, which has the advantages of stronger corrosion resistance and longer service life; wherein, by spraying with pure water, it can be ensured that the surface of the electroplating layer can be kept clean after each electroplating; wherein, the plating plate thickness of the above-mentioned electroplating equipment is 0.1~2mm, and the effective plating depth is 50mm; the equipment travel speed is 1~30m / min, and the anode plate can be preferably a 500mm*50mm*2mm ruthenium-iridium-titanium mesh; it solves the problem of poor environmental resistance and short service life of hardware products such as connector TYPE-C terminal connector and Apple connector, and improves the corrosion resistance and oxidation resistance of the product itself. Specifically, the conveying equipment can adjust the running speed, and the hardware can be continuously processed at an average speed of 1 to 30 m / min, ensuring production efficiency, which is suitable for large-scale continuous production environments and improving productivity and economic benefits. The uniformity deviation of the coating during the electroplating process is controlled at +10µ", ensuring the uniform distribution of the coating on the surface of the hardware, improving the consistency and appearance quality of the product; the use of multi-layer coating structures such as copper plating, nickel filling or nano nickel not only enhances the adhesion of the coating, but also optimizes the performance of the hardware through the combination of different coatings, such as corrosion resistance and conductivity; when the above-mentioned nickel filling and ordinary nickel plating is performed, the nickel concentration, cylinder opening agent concentration, nickel chloride concentration, boric acid concentration and pH value are strictly controlled. The precise control of these parameters is the key to ensuring the quality and performance of the coating; the temperature range is 40℃-70℃, and the appropriate temperature helps to improve the crystallization quality of the coating and reduce coating defects such as pinholes or cracks, achieving high quality and uniformity of the coating on the surface of the hardware, while taking into account production efficiency, improving environmental resistance and service life, and corrosion resistance.

[0021] Next, the continuous electroplating method in this exemplary embodiment will be further explained.

[0022] In one embodiment of the present application, it can be further explained in combination with the following description that before the first continuous electroplating step, it also includes: a pretreatment step: degreasing, water washing, micro-etching activation, and water washing the hardware to be treated in sequence, specifically including: using a degreasing agent with a concentration of 60-90g / L, at a temperature of 45°C to 70°C, ultrasonic degreasing of the hardware, and / or, using a degreasing agent with a concentration of 60-90g / L, at a temperature of 45°C to 70°C, electrolytic degreasing; pure water spraying; using 8-15°Bé sulfuric acid at a concentration of 8-15°Bé, in a room temperature environment, micro-etching activation treatment of the hardware; pure water spraying again. By using a degreasing agent with a concentration of 60-90g / L, combined with ultrasonic or electrolytic degreasing, it is ensured that the grease on the surface of the hardware is completely removed, thereby improving the adhesion and quality of the subsequent coating. During the degreasing process, the temperature is 45℃~70℃, which helps to accelerate the decomposition of grease, and the concentration of the degreasing agent is controlled at 60-90g / L, which ensures the cleaning effect while avoiding excessive corrosion. By using 8-15°Bé sulfuric acid to micro-etch and activate the hardware at room temperature, the metal surface can be slightly etched to increase its activity and further enhance the bonding strength of the coating.

[0023] In the above degreasing step, ultrasonic degreasing can be used first and then electrolytic degreasing, or one of them can be selected; among them, a 1mm thick stainless steel ultrasonic degreasing tank can be selected, and the preferred size is 50mm*40mm*15mm; the electrolytic degreasing and micro-etching activation tank can be the same 80mm*10mm*15mm equipped with a 10mm thick PP plate.

[0024] In one embodiment of the present application, after the first continuous electroplating step, the second continuous electroplating step is further included: comprising the steps of palladium nickel plating, water washing, gold plating, water washing, platinum plating, water washing, gold plating, and water washing in sequence, specifically including: The palladium-nickel plating is carried out by using a palladium-nickel plating reagent having a nickel concentration of 8-15 g / L, a palladium concentration of 12-22 g / L, a concentration of 8-15° Bé sulfuric acid, a pH value of 4.2-5.2, and a temperature range of 45°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 5-15g / L and a pH value of less than 0.5 at a temperature range of 50°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray washing; Among them, through the above electroplating, the following can be obtained respectively: 1-50µ" gold-plated layer, whose uniformity deviation is +5µ"; 1-100µ" platinum-plated layer, whose uniformity deviation is +5µ"; 1-200µ" nickel-plated layer, whose uniformity deviation is +10µ"; 1-50µ" palladium-plated layer, whose uniformity deviation is +5µ".

[0025] Through the above electroplating process, the first continuous electroplating and the second continuous electroplating steps can be combined, so that the electroplating sequence is copper plating→water washing→filling nickel plating→water washing→ordinary nickel plating→water washing→high-phosphorus nickel plating→water washing→palladium nickel plating→water washing→gold plating→water washing→platinum plating→water washing→gold plating→water washing, and can be replaced and replaced according to needs and actual conditions. For example, the filling nickel can be replaced with nano nickel or high-temperature nickel or modified nickel according to the situation, and the platinum plating section can be replaced with platinum ruthenium, rhodium ruthenium, etc. according to needs. Each electroplating step The electroplating tanks corresponding to the steps are arranged in sequence. According to the needs, 10 nickel-plating tanks can be configured, with a preferred size of 80cm*13cm*15cm, and a 10mm thick PP plate; 3 gold-plating tanks, with a preferred size of 60cm*5cm*6cm, and a 10mm thick PP plate; 12 platinum-plating tanks, with a preferred size of 60cm*5cm*6cm, and a 10mm thick PP plate; 12 palladium-plating tanks, with a preferred size of 60cm*5cm*6cm, and a 10mm thick PP plate.

[0026] In one embodiment of the present application, scheme A: the palladium nickel plating also includes a step of pre-plating palladium nickel, specifically including: pre-plating palladium nickel by using a palladium nickel plating reagent with a nickel concentration of 8-15g / L and a concentration of 8-15°Bé sulfuric acid, a pH value of 4.2-5.5, and a temperature range of 45°C-70°C. By adding the pre-plating palladium nickel step before the formal palladium nickel plating, the pre-plated palladium nickel layer can be used as the basis for the subsequent plating layer, enhancing the bonding force between the plating layer and the substrate material, and ensuring that the plating layer is not easy to peel off; and the pre-plating layer can improve the microscopic roughness of the substrate surface, provide a more uniform "canvas" for the subsequent palladium nickel plating, reduce the local over-thickness or over-thinness of the plating layer, and improve the uniformity of the plating layer. By controlling the pH value and temperature of the pre-plated palladium nickel layer within a specific range (the pH value is 4.2-5.5 and the temperature range is 45°C-70°C), it is helpful to control the microstructure of the plating layer and further improve the performance and quality of the plating layer.

[0027] Furthermore, the step of pre-plating palladium nickel specifically includes pre-plating palladium nickel with a palladium nickel plating reagent having a nickel concentration of 10 g / L, a concentration of 10° Bé sulfuric acid, a pH value of 4.8, and a temperature of 60°C. Precise concentration and temperature control (especially setting the nickel concentration and temperature at intermediate values) ensures the uniformity and adhesion of the subsequent coating. Refined parameter settings help reduce material waste during the electroplating process. At the same time, precise control is also conducive to improving electroplating efficiency and reducing production costs; it helps to improve the stability and repeatability of the process, reduce fluctuations in production, and ensure stable product quality.

[0028] As an example, the pretreatment step specifically includes: using a degreasing agent with a concentration of 70g / L at a temperature of 45°C to 70°C to perform ultrasonic degreasing on the hardware, and / or using a degreasing agent with a concentration of 70g / L at a temperature of 45°C to 70°C to perform electrolytic degreasing; using the above-mentioned degreasing agent; pure water spraying; using a concentration of 12°Bé sulfuric acid at a room temperature environment to perform micro-etching activation treatment on the hardware; and pure water spraying again. Among them, the above-mentioned electrolytic degreasing can use an acidic degreasing agent such as a hydrochloric acid solution, or an aqueous solution containing sodium hydroxide or potassium hydroxide.

[0029] In one embodiment of the present application, the nickel plating temperature is 60°C, and the nickel plating reagent includes a common nickel plating reagent and a high-temperature nickel plating reagent; the common nickel plating reagent has a nickel concentration of 60-110g / L, a nickel cylinder opening agent concentration of 350-550g / L, a nickel chloride concentration of 40-60g / L, a boric acid concentration of 40-60g / L, and a pH value of 4.5-5.1; the high-temperature nickel plating reagent has a nickel concentration of 10-150g / L, a nickel cylinder opening agent concentration of 350-550g / L, a nickel chloride concentration of 40-60g / L, a boric acid concentration of 40-60g / L, and a pH value of 2.0-3.5. The thickness and firmness of the nickel plating layer are ensured by a more suitable reagent concentration range and ambient temperature; in the above-mentioned continuous electroplating process, the target hardware can have enough time and space to be electroplated during uninterrupted transportation by connecting multiple plating tanks.

[0030] Further, the common nickel plating reagent has a nickel concentration of 45g / L, a nickel opening agent concentration of 450g / L, a nickel chloride concentration of 12g / L, a boric acid concentration of 50g / L, and a pH value of 4.2; the high-temperature nickel plating reagent has a nickel concentration of 90g / L, a nickel opening agent concentration of 450g / L, a nickel chloride concentration of 12g / L, a boric acid concentration of 45g / L, and a pH value of 3.0. The stability of electroplating is further ensured by the preferred reagent concentration.

[0031] In one embodiment of the present application, the second continuous electroplating step specifically includes: plating palladium nickel using a palladium nickel plating reagent having a nickel concentration of 10 g / L, a palladium concentration of 15 g / L, a concentration of 12° Bé sulfuric acid, a pH value of 4.8, and a temperature range of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 10 g / L and a pH value of less than 0.5 at a temperature of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray.

[0032] In one embodiment of the present application, the steps of sealing and drying are further included after the electroplating is completed, specifically including sealing with a sealing agent, washing with pure water, air drying and / or baking in sequence; further including: Water sealing is performed at 50℃-70℃ by using a water sealant with a concentration of 1.2-25%. A protective film is formed on the surface of the electroplated layer, which effectively isolates moisture and chemicals and reduces the risk of oxidation and corrosion. It helps to improve the adhesion between the electroplated layer and the substrate, and enhance the wear resistance and durability of the electroplated layer. Oil sealing is performed at room temperature using an oil sealant with a concentration of 2.0-10%. This can form an oil film to reduce friction, improve the lubricity of the metal surface, and reduce wear. It can effectively block the intrusion of moisture and air, prevent metal oxidation, and provide long-lasting anti-corrosion protection. At the same time, it can also improve the adhesion between the electroplating layer and the surface, enhancing the protective effect.

[0033] Pure water spray washing; Among them, air drying can be carried out in an air duct, and the above-mentioned drying is carried out through baking equipment. The two can be used in combination, for example, an angle-adjustable serpentine tube is connected to a high-power blower, and a baking equipment is connected after the air duct to dry it at a temperature of 1°C-200°C, so that it can dry quickly and ensure the degree of dryness, so as to avoid corrosion of hardware caused by high humidity in the package during packaging.

[0034] The pure water spraying between each step can ensure that there is no reagent residue from the previous step, ensure that the hardware is fully cleaned, and avoid the problem of excessive residue causing it to be easily corroded.

[0035] It should be noted that, in the present application, "no reagent residue" means that the residual amount will not have an adverse effect on the hardware, rather than specifically referring to absolutely no residue.

[0036] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0037] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0038] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0039] The above is a detailed introduction to a continuous electroplating method provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A continuous electroplating method, characterized in that: include: The first continuous electroplating step: the pre-treated hardware is transported by a conveying device at an average speed of 1 to 30 m / min, and copper plating, water washing, plating of filling nickel or nano nickel or high temperature nickel or modified nickel, water washing, plating of ordinary nickel, water washing, plating of high phosphorus nickel are carried out in sequence to obtain a 1-200µ" nickel plating layer with a uniformity deviation of +10µ"; Among them, in the nickel plating reagent for filling nickel plating and ordinary nickel plating, the nickel concentration is 60-110g / L, the nickel cylinder opening agent concentration is 350-550g / L, the nickel chloride concentration is 40-60g / L, the boric acid concentration is 40-60g / L, the pH value is 4.5-5.1, and the temperature range is 40°C-70°C; the water washing is carried out by spraying pure water.

2. The method according to claim 1, characterized in that Before the first continuous electroplating step, it also includes: Pretreatment steps: degreasing, water washing, micro-etching activation, water washing, etc. Specifically include: Use a degreasing agent with a concentration of 60-90g / L at a temperature of 45℃~70℃ to perform ultrasonic degreasing on the hardware, and / or use a degreasing agent with a concentration of 60-90g / L at a temperature of 45℃~70℃ to perform electrolytic degreasing; Pure water spray washing; Use sulfuric acid with a concentration of 8-15°Bé to perform micro-etching and activation treatment on hardware at room temperature; Rinse with pure water again.

3. The method according to claim 1 or 2, characterized in that: After the first continuous electroplating step, the method further comprises: The second continuous electroplating step includes the steps of palladium nickel plating, water washing, gold plating, water washing, platinum plating, water washing, gold plating, and water washing in sequence, specifically including: The palladium-nickel plating is carried out by using a palladium-nickel plating reagent having a nickel concentration of 8-15 g / L, a palladium concentration of 12-22 g / L, a concentration of 8-15° Bé sulfuric acid, a pH value of 4.2-5.2, and a temperature range of 45°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 5-15g / L and a pH value of less than 0.5 at a temperature range of 50°C-70°C; Pure water spray washing; Gold plating is carried out by using a gold plating reagent with a gold concentration of 0.1-8 g / L, a cobalt concentration of 0.2-0.8 g / L, a concentration of 7-15° Bé sulfuric acid, a pH value of 3.8-5.0, and a temperature range of 45°C-70°C; Pure water spray.

4. The method according to claim 3, characterized in that The palladium-nickel plating step also includes a palladium-nickel pre-plating step before the palladium-nickel plating step, which specifically includes: The palladium-nickel pre-plating is carried out by using a palladium-nickel plating reagent with a nickel concentration of 8-15 g / L, a concentration of 8-15° Bé sulfuric acid, a pH value of 4.2-5.5, and a temperature range of 45°C-70°C.

5. The method according to claim 3, characterized in that: The method further includes the steps of sealing and drying after the electroplating is completed, specifically including sealing with a sealing agent, washing with pure water, air drying and / or drying in sequence; and further includes: Water sealing is performed at 50℃-70℃ using a water sealant with a concentration of 1.2-25%; Oil sealing is performed at room temperature using an oil sealant with a concentration of 2.0-10%; Pure water spray washing; Wherein, the drying is carried out by using a baking device at a temperature of 1°C-200°C.

6. The method according to claim 2, characterized in that The pre-processing step specifically includes: Use a degreasing agent with a concentration of 70g / L at a temperature of 45℃~70℃ to perform ultrasonic degreasing on the hardware, and / or use a degreasing agent with a concentration of 70g / L at a temperature of 45℃~70℃ to perform electrolytic degreasing; Pure water spray washing; Use 12°Bé sulfuric acid to micro-etch and activate the hardware at room temperature; Rinse with pure water again.

7. The method according to claim 1, characterized in that The nickel plating temperature is 60°C, and the nickel plating reagent includes ordinary nickel plating reagent and high-temperature nickel plating reagent; The common nickel plating reagent has a nickel concentration of 60-110 g / L, a nickel opening agent concentration of 350-550 g / L, a nickel chloride concentration of 40-60 g / L, a boric acid concentration of 40-60 g / L, and a pH value of 4.5-5.1; The high-temperature nickel plating reagent has a nickel concentration of 10-150 g / L, a nickel cylinder opening agent concentration of 350-550 g / L, a nickel chloride concentration of 40-60 g / L, a boric acid concentration of 40-60 g / L, and a pH value of 2.0-3.

5.

8. The method according to claim 7, characterized in that The common nickel plating reagent has a nickel concentration of 45 g / L, a nickel opening agent concentration of 450 g / L, a nickel chloride concentration of 12 g / L, a boric acid concentration of 50 g / L, and a pH value of 4.2; The high-temperature nickel plating reagent has a nickel concentration of 90 g / L, a nickel cylinder opening agent concentration of 450 g / L, a nickel chloride concentration of 12 g / L, a boric acid concentration of 45 g / L, and a pH value of 3.

0.

9. The method according to claim 3, characterized in that: The second continuous electroplating step specifically comprises: The palladium-nickel plating is carried out by using a palladium-nickel plating reagent having a nickel concentration of 10 g / L, a palladium concentration of 15 g / L, a concentration of 12° Bé sulfuric acid, a pH value of 4.8, and a temperature range of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray washing; Platinum plating is performed by using a platinum plating reagent with a platinum concentration of 10 g / L and a pH value of less than 0.5 at a temperature of 60°C; Pure water spray washing; Thin gold plating is performed by using a gold plating reagent with a gold concentration of 0.1-3 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C, or a thick gold plating is performed by using a gold plating reagent with a gold concentration of 1-8 g / L, a cobalt concentration of 0.5 g / L, a concentration of 15° Bé sulfuric acid, a pH value of 4.2, and a temperature of 60°C; Pure water spray.

10. The method according to claim 4, characterized in that The step of pre-plating palladium nickel specifically includes pre-plating palladium nickel using a palladium nickel plating reagent having a nickel concentration of 10 g / L, a concentration of 10° Bé sulfuric acid, a pH value of 4.8, and a temperature of 60°C.

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