Computing power module, server case and cloud server

Abstract

The embodiment of the invention provides a computing power module, a server case and a cloud server, and the computing power module comprises a substrate, a computing power unit, a first radiator, a second radiator and a locking mechanism. The at least two computing power units are arranged on the first side of the substrate in parallel; the first radiator is arranged on the first side of the substrate and covers the computing power unit and the surface of the first side of the substrate; the second radiator is arranged on the second side of the substrate and covers the surface of the second side of the substrate; the locking mechanism comprises a base and a handle, the base is arranged at the first end of the base plate, the first end of the handle is hinged to the base, and the second end of the handle is detachably connected with the base. According to the technical scheme, the heat dissipation capacity of the computing power module can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of server technology, and in particular to a computing power module, a server chassis and a cloud server. Background Art

[0002] As the performance and power consumption of System on Chips (SoC) continue to increase, SoC will generate a lot of heat when it is in a high-performance state for a long time. If the SoC overheats, it will trigger frequency reduction, sacrificing some performance to reduce the temperature. Summary of the invention

[0003] The embodiments of the present disclosure provide a computing power module, a server chassis and a cloud server to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a computing power module, including:

[0005] substrate;

[0006] A computing power unit, at least two computing power units are arranged in parallel on the first side of the substrate;

[0007] A first heat sink, which is disposed on the first side of the substrate and covers the computing unit and the surface of the first side of the substrate;

[0008] a second heat sink, the second heat sink being disposed on the second side of the substrate and covering a surface of the second side of the substrate;

[0009] The locking mechanism includes a base and a handle, wherein the base is arranged at the first end of the substrate, the first end of the handle is hinged to the base, and the second end of the handle is detachably connected to the base, wherein the first end of the handle also has a snap-on protrusion for cooperating with the mounting position of the computing power module.

[0010] As a second aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a server chassis, including:

[0011] The box body comprises a bottom plate and a pair of side plates connected to the bottom plate;

[0012] A carrier board, which is arranged parallel to the bottom plate and has a plurality of connectors;

[0013] A fan module, the fan module is disposed between a pair of side plates and is used to generate an airflow in a first direction;

[0014] The guide rail frame includes a plurality of bracket plates connected to a pair of side plates, the bracket plates are perpendicular to the carrier plate, the slots on two adjacent bracket plates form a plurality of guide rails extending along the second direction, each group of guide rails and the carrier plate jointly define an installation position, and each installation position corresponds to a connector;

[0015] According to the computing power module provided in the first aspect, the computing power module is arranged in any installation position and is electrically connected to the connector; wherein at least two computing power units of the computing power module are arranged along the second direction;

[0016] The first direction and the second direction are perpendicular to each other.

[0017] As a third aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a cloud server, including: a server chassis provided according to the second aspect.

[0018] The embodiments of the present disclosure adopt the above technical solution to improve the heat dissipation capacity of the computing power module.

[0019] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments provided according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0021] Figure 1 A schematic diagram showing the structure of a computing power module according to an embodiment of the present disclosure is shown;

[0022] Figure 2 A schematic diagram showing the structure of a server chassis according to an embodiment of the present disclosure is shown;

[0023] Figure 3 A schematic structural diagram of a guide rail frame of a server chassis according to an embodiment of the present disclosure is shown;

[0024] Figure 4 A structural schematic diagram showing the assembly process of the guide rail frame and the computing power module according to an embodiment of the present disclosure;

[0025] Figure 5 A cross-sectional schematic diagram of a guide rail frame and a computing power module according to an embodiment of the present disclosure is shown.

[0026] Explanation of the accompanying drawings: 100, computing power module, 110, first radiator, 120, locking mechanism, 121, base, 122, handle, 123, snap-on protrusion, 124, sliding switch, 125, lock tongue, 126, vent, 127, notch, 128, lock hook, 130, positioning edge, 200, server chassis, 210, box body, 211, side panel, 212, ventilation net, 220, carrier board, 221, connector, 230, fan module, 240, guide rail frame, 241, bracket plate, 242, slot, 243, snap-on hole, 244, ventilation window, 245, reinforcement rib, 246, positioning block, 247, edging strip, 260, power module. DETAILED DESCRIPTION

[0027] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0028] Figure 1 FIG. 2 shows a schematic diagram of the structure of a computing power module according to an embodiment of the present disclosure. Figure 1 As shown, the computing power module 100 includes:

[0029] substrate;

[0030] A computing power unit, at least two computing power units are arranged in parallel on the first side of the substrate;

[0031] A first heat sink 110, which is disposed on the first side of the substrate and covers the computing unit and the surface of the first side of the substrate;

[0032] a second heat sink, the second heat sink being disposed on the second side of the substrate and covering a surface of the second side of the substrate;

[0033] The locking mechanism 120 includes a base 121 and a handle 122, wherein the base 121 is disposed at the first end of the substrate, the first end of the handle 122 is hinged to the base 121, and the second end of the handle 122 is detachably connected to the base 121, wherein the first end of the handle 122 also has a snap-on protrusion 123 for cooperating with the mounting position of the computing power module.

[0034] In the disclosed embodiment, the computing power module has Figure 1 The height direction is shown by the X-axis, the length direction is shown by the Y-axis, and the thickness direction is shown by the Z-axis.

[0035] The computing unit is installed on the first side of the substrate. The substrate and the computing unit are blocked and not shown in the figure. The computing unit can be various components with computing power in the prior art, such as SoC board, ARM, MCU, CPLD, FPGA, etc. The number of computing units is not less than two, and multiple computing units are arranged on the first side of the substrate and arranged along the X-axis direction.

[0036] It should be noted that compared with the blade-type computing power module in the related art which usually has 4 or more computing power units, the number of computing power units in the embodiment of the present disclosure usually does not exceed 4. Therefore, the computing power module in the embodiment of the present disclosure is shorter in length, and its appearance is not slender blade-shaped, and the ratio between its two longer sides is smaller.

[0037] The first heat sink 110 is disposed on the first side of the substrate, and a heat conductive material may be disposed between the first heat sink 110 and the computing unit. The second heat sink is disposed on the second side of the substrate, which is not shown in the figure. The second heat sink does not directly contact the computing unit, but assists in heat dissipation on the back of the computing unit. A heat conductive material may also be disposed between the second heat sink and the substrate. The heat conductive material may be one of heat conductive silicone or heat conductive paste.

[0038] The first heat sink 110 and the second heat sink have a metal bottom plate and a plurality of metal fins spaced apart on the metal bottom plate.

[0039] In the X-axis direction, a locking mechanism 120 is provided at the top of the substrate, and a connector for electrical connection with the CPU carrier is provided at the bottom of the substrate. The locking mechanism 120 is used to fix the computing module in the installation position when the connector of the substrate is connected to the connector on the computing module installation position, so as to ensure the stable connection between the computing module and the CPU carrier 220. The locking mechanism 120 includes a base 121 and a handle 122. The handle 122 is used to fix the computing module in the installation position on the one hand, and to facilitate grabbing when taking out the computing module on the other hand.

[0040] In the Y-axis direction, the first end of the handle 122 is hinged to the base 121, and the second end of the handle 122 is detachably connected to the base 121. The first end of the handle 122 also has a buckle protrusion 123 for cooperating with the installation position of the computing power module. When the second end of the handle 122 is connected to the base 121, the buckle protrusion 123 at the first end of the handle 122 extends outward in the Y-axis direction, thereby snapping into the corresponding buckle hole 243 on the installation position to fix the computing power module to the installation position. When the second end of the handle 122 is connected to the base 121, the buckle protrusion 123 on the handle 122 also remains fixedly connected to the installation position. When the second end of the handle 122 is separated from the base 121, the handle 122 can be rotated so that the buckle protrusion 123 retracts inward in the Y-axis direction, so that the locking mechanism 120 is unlocked, and the computing power module can be taken out from the installation position.

[0041] It should also be noted that the blade-type computing power module in the related art is usually designed in such a way that the back of the core board where the computing power unit is located is directly connected to the CPU carrier board, and there is no space on the back to set up a radiator, and only a radiator is set up on the front, resulting in an inability to provide sufficient heat dissipation capacity to support computing power units with higher power consumption. The substrate or core board where the computing power unit in the computing power module of the disclosed embodiment is located is not directly connected to the CPU carrier board, but is connected to the CPU carrier board through a connector at the second end of the substrate, and the substrate and the CPU carrier board are perpendicular to each other, so that the substrate has space on both the front and back sides to set up a radiator.

[0042] According to the solution of the embodiment of the present disclosure, heat sinks are provided on both the front and back sides of the computing power module to improve the heat dissipation capacity.

[0043] In a possible implementation, the computing power module further includes:

[0044] A positioning edge 130 is disposed at the second end and / or the third end of the base plate, one end of the positioning edge 130 abuts against the locking mechanism 120, and the other end extends toward the fourth end of the base plate;

[0045] The first end of the substrate is opposite to the fourth end, and the second end is opposite to the third end.

[0046] In the disclosed embodiment, the positioning rib 130 is used to provide position guidance and limit the moving direction of the computing power module when the computing power module is inserted into the installation position. The positioning rib 130 can be set at the second end of the substrate, or at the third end of the substrate, or at the second end and the third end of the substrate. The second end and the third end are the two ends of the computing power module in the Y-axis direction, that is, the left and right ends, and the first end and the fourth end are the two ends of the computing power module in the X-axis direction, that is, the upper and lower ends.

[0047] In one example, the first heat sink 110 and the second heat sink are connected by screws passing through the two and the substrate. The locking mechanism 120 and the positioning edge 130 can be fixed to the side of the first heat sink 110, or fixed to the side of the second heat sink, or can be connected and fixed to the first heat sink 110 and the second heat sink at the same time.

[0048] In another example, a metal back plate is provided between the second side of the substrate and the second heat sink, and the locking mechanism 120, the positioning edge 130, the first heat sink 110 and the second heat sink are all connected to the back plate.

[0049] According to the solution of the embodiment of the present disclosure, the computing power module is more convenient to install.

[0050] refer to Figure 1 , Figure 4 , Figure 5As shown, in a possible implementation, the base 121 is provided with a handle section and a button section along its length direction;

[0051] A rotating shaft is provided at the first end of the handle section, and a notch communicating with the button section is provided at the second end of the handle section; the first end of the handle 122 is hinged to the rotating shaft, and a locking hook 128 is provided at the second end of the handle 122;

[0052] The button section is provided with a sliding switch 124 that can move along the length direction. The end of the sliding switch 124 facing the handle section is provided with a locking tongue 125. The locking tongue 125 is engaged with a locking hook 128 to lock the second end of the handle 122 with the base 121.

[0053] In the disclosed embodiment, the base 121 is divided into a connected handle section and a button section in the length direction. The length of the handle 122 matches the handle section. The handle section is provided with a switch slot, in which a sliding switch 124 is provided. The width of the sliding switch 124 matches the width of the switch slot, but the length is less than the length of the switch slot. The sliding switch 124 can slide left and right in the switch slot. When the sliding switch 124 slides to the side close to the handle section, the locking tongue 125 extends into the handle section through the notch. At this time, if the handle 122 is pressed down, the locking hook 128 of the handle 122 can be connected with the locking tongue 125 to fix the handle 122. When the sliding switch 124 slides to the side away from the handle section, the locking tongue 125 retracts into the notch, and at this time, the locking hook 128 of the handle 122 can be separated from the locking tongue 125.

[0054] According to the solution of the embodiment of the present disclosure, the connection and separation of the handle 122 and the base 121 are controlled by the sliding switch 124, making the installation and removal of the computing power module more convenient.

[0055] In a possible implementation, a first elastic member is provided between the sliding switch 124 and the base, for allowing the locking tongue 125 of the sliding switch 124 to extend into the handle section through the notch.

[0056] In the disclosed embodiment, the locking tongue 125 is kept in the handle section by the elastic force of the first elastic member, ready to be connected with the locking hook 128 of the handle 122 at any time, and can be reset to the handle section after being retracted to the button section.

[0057] According to the solution of the embodiment of the present disclosure, the slide switch 124 is automatically reset, which is convenient for operation.

[0058] In a possible implementation, a second elastic member is provided between the handle 122 and the base 121 for releasing elastic potential energy to separate the second end of the handle 122 from the base 121 when the sliding switch 124 and the handle 122 are unlocked.

[0059] In the disclosed embodiment, a second elastic member is provided on the base 121 near the rotation axis, and the top of the second elastic member can be against the handle 122. When the handle 122 is pressed down, the second elastic member stores elastic potential energy. When the handle 122 is separated from the sliding switch 124, the elastic potential energy of the second elastic member is released, causing the handle 122 to rotate around the rotation axis and bounce up, and the snap protrusion 123 withdraws from the snap hole 243. At the same time, the second end of the handle 122 is tilted to facilitate grasping.

[0060] In a possible implementation, the main body of the handle 122 and the buckle protrusion 123 are symmetrically arranged on both sides of the rotation axis.

[0061] In the disclosed embodiment, when the second end of the handle 122 is locked with the sliding switch 124 of the base 121 , at least a portion of the snap protrusion 123 is outside the first end of the base, i.e., extends outward along the length direction of the base 121 to extend into the snap hole 243 .

[0062] According to the solution of the embodiment of the present disclosure, the handle 122 can be used for both grasping and locking.

[0063] In a possible implementation, the handle section of the base 121 has a plurality of vents 126 , and the handle 122 has a plurality of hollow notches 127 .

[0064] In the disclosed embodiment, holes are opened in the base 121 and the handle 122 to obtain vents 126 and gaps 127, so that air can circulate on the upper and lower sides of the base 121, thereby improving the heat dissipation capacity.

[0065] Figure 2 A server chassis is provided in one embodiment of the present disclosure. Figure 2 The server chassis 200 shown includes at least the following structures:

[0066] The box body 210 includes a bottom plate and a pair of side plates 211 connected to the bottom plate;

[0067] A carrier board 220, the carrier board 220 is arranged parallel to the bottom plate, and has a plurality of connectors 221;

[0068] A fan module 230, the fan module 230 is disposed between the pair of side plates 211, and is used to generate airflow in a first direction;

[0069] The guide rail frame 240 includes a plurality of bracket plates 241 connected to a pair of side plates 211, the bracket plates 241 are perpendicular to the carrier plate 220, and the slots 242 on two adjacent bracket plates 241 form a plurality of guide rails extending along the second direction, each group of guide rails and the carrier plate 220 jointly define an installation position, and each installation position corresponds to a connector 221;

[0070] According to the computing power module 100 provided in any embodiment of the present disclosure, the computing power module 100 is arranged in any installation position and is electrically connected to the connector 221; wherein at least two computing power units of the computing power module 100 are arranged along the second direction;

[0071] The first direction and the second direction are perpendicular to each other.

[0072] In the disclosed embodiment, the server chassis has Figure 2 The length direction shown by the X-axis, the width direction shown by the Y-axis, the height direction shown by the Z-axis, and the up and down direction. The above-mentioned first direction is the X-axis direction, and the second direction is the Z-axis direction. The bottom plate of the box 210 is arranged horizontally, and a pair of side panels 211 are provided at both ends in the width direction, and the side panels 211 are fixedly connected to the bottom plate. A ventilation net 212 may be provided at both ends in the length direction. The air in the box 210 can circulate along the length direction of the box 210 and exchange with the outside air. The fan module 230 is arranged in the middle area of ​​the box 210, and the fan module 230 includes a plurality of fan units arranged along the Y-axis direction. The airflow generated by the fan module 230 can flow through the array of computing power modules and take away heat.

[0073] The carrier 220 is horizontally arranged on the bottom plate and fixedly connected to the bottom plate. The fan module 230 can be arranged across the carrier 220. Common chassis components such as a power module 260, an Ethernet module, and a chassis management module can be arranged on the carrier 220 on one side of the fan module 230, which are not limited here. A guide rail frame 240 is arranged above the carrier 220 on the other side of the fan module 230, and the guide rail frame 240 forms at least one column of installation positions for computing power modules. The carrier 220 is provided with a connector 221 at a position corresponding to each installation position below, which is used to achieve electrical connection with the computing power module.

[0074] The two bracket plates 241 can form a row of mounting positions, and each mounting position corresponds to a set of guide rails on the two bracket plates 241 and a connector 221 below the mounting position. The computing power module is vertically inserted into the mounting position from above the box 210 in a direction perpendicular to the plane of the box 210. Multiple rows of mounting positions can be provided in the box 210. Each row of mounting positions is parallel to the fan module 230. Any computing power module in a row of mounting positions is parallel in the direction of the airflow formed by the fan module 230, and has no upstream and downstream relationship.

[0075] Since the guide rail formed by the bracket plate 241 is along the second direction perpendicular to the box body 210, the computing power module is also inserted into the installation position along the second direction perpendicular to the plane of the box body 210 during installation. At the same time, the multiple computing power units on the computing power module are also arranged along the second direction. Therefore, each computing power unit is at the same distance from the fan module 230. It can also be understood that for each computing power module, any computing power unit it contains is also parallel on the airflow formed by the fan module 230. Therefore, the airflow flowing through any computing power unit will not be preheated by other computing power units of the computing power module. Therefore, it can be ensured that the temperatures of multiple computing power units in the computing power module are close.

[0076] It should be noted that when multiple columns of computing power modules are installed in the box 210, in the direction of airflow, the airflow of the downstream computing power module will be preheated by the upstream computing power module, but there is no upstream and downstream relationship between the computing power modules in the same column, and the computing power units in each computing power module do not have an upstream and downstream relationship. Therefore, it can still be ensured that the temperature of each column of computing power modules is close, and the temperatures of multiple computing power units in any computing power module are also close. In other words, there will be no two computing power units with large temperature differences in each computing power module. Avoid affecting the performance of other computing power units due to excessive temperatures of a few computing power units in the computing power module.

[0077] According to the solution of the embodiment of the present disclosure, the computing power module is vertically inserted into the box body, so that the heat dissipation capacity obtained by each column of computing power modules is equivalent, and the heat dissipation capacity obtained by the computing power units in each computing power module is equivalent, which facilitates the unified management and control of the operating frequencies of multiple computing power units in the computing power unit; radiators are provided on both sides of the computing power module to improve the heat dissipation capacity, so as to support computing power units with higher power consumption.

[0078] refer to Figures 2 to 5 As shown, in a possible implementation, a plurality of positioning blocks 246 are provided on the bracket plate 241 located on the first side of the installation position, and a slot 242 is formed between two adjacent positioning blocks 246; wherein the width of the slot 242 matches the width of the positioning edge 130 on the computing power module.

[0079] In the disclosed embodiment, each installation position is provided with at least two positioning blocks 246, which are arranged at the upper edge of the bracket plate 241. A slot 242 is formed between two adjacent positioning blocks 246, and one or more slots 242 in the vertical direction form a guide rail. The positioning block 246 can be square, and the positioning edge 130 also has a square cross-section, so that the slot 242 formed by the two positioning blocks 246 can limit the angle of the computing power module to ensure that it is perpendicular to the bracket plate 241. Therefore, it is only necessary to set the positioning block 246 on the bracket plate 241 on one side of the installation position.

[0080] According to the solution of the embodiment of the present disclosure, the positioning block 246 facilitates the installation and removal of the computing power module.

[0081] refer to Figure 3 , Figure 4 As shown, in a possible implementation, a plurality of snap holes 243 are provided on the bracket plate 241 located on the second side of the installation position, and the snap holes 243 are used to accommodate the snap protrusions 123 on the computing power module to fix the computing power module in the installation position.

[0082] In the disclosed embodiment, when the computing power module is inserted into the installation position, the gold finger interface at the bottom of the computing power module is connected to the connector 221 on the carrier 220, and the buckle protrusion 123 at the end of the handle 122 is inserted into the buckle hole 243 by pressing down the handle 122, so that the computing power module is fixed in the installation position. When disassembling, only the sliding switch needs to be flipped to pop up the handle, and the buckle protrusion 123 at the end of the handle is withdrawn from the buckle hole 243, and the computing power module can be taken out from the installation position.

[0083] According to the solution of the embodiment of the present disclosure, the installation and disassembly of the computing power module is further facilitated by the quick-release structure.

[0084] refer to Figure 4 As shown, in a possible implementation, a plurality of ventilation windows 244 are provided on the support plate 241 , and the ventilation windows 244 are located between two adjacent installation positions.

[0085] In the disclosed embodiment, the ventilation windows 244 are used for airflow to pass through, and a ventilation window 244 is provided between every two adjacent mounting positions, and the portion blocked by the mounting position does not need to be provided with a ventilation window 244. The ventilation windows 244 can be divided into two upper and lower columns, and a certain width of the bracket plate body is reserved between the upper and lower columns of ventilation windows 244 to prevent the structural strength of the bracket plate 241 from being too low.

[0086] According to the solution of the embodiment of the present disclosure, the bracket plate 241 takes into account both ventilation effect and structural strength.

[0087] In a possible implementation, a circle of raised reinforcing ribs 245 is provided on the edge of the ventilation window 244 .

[0088] In the disclosed embodiment, the edge of the ventilation window 244 is bent toward the installation position to form a reinforcing rib 245 to improve the structural strength of the bracket plate 241 .

[0089] In one example, the ventilation window 244 is in the shape of a long strip or a rounded rectangle, so that both sides of the ventilation window 244 have a section of reinforcing ribs 245 extending in the vertical direction. This section of the reinforcing ribs 245 can act as a positioning block 246 and cooperate with the positioning block 246 on the other side bracket plate 241 to form a guide rail.

[0090] In a possible implementation, two bracket plates 241 are provided between two adjacent rows of mounting positions, and the corresponding ventilation windows 244 on the two bracket plates 241 do not completely overlap in the first direction.

[0091] In the disclosed embodiment, two adjacent columns of mounting positions may share a bracket plate 241, or they may be separately arranged. In the latter case, there are two bracket plates 241 between the two columns of mounting positions, and a pair of ventilation windows 244 at the same position between the two bracket plates 241 may not completely overlap. The incomplete overlap may be understood as the overlapping portion of the projections of the two in the X-axis direction being not less than 80%, but less than 100%, that is, the two are misaligned by a certain distance in the Y-axis or Z-axis direction, or they may be misaligned by a certain distance in both the Y-axis and Z-axis directions. As a result, when the airflow passes through two ventilation windows 244 continuously, it will be guided by the misaligned ventilation windows 244 to change direction, thereby improving the heat dissipation capacity by means of the change in the direction of the airflow.

[0092] refer to Figure 5 As shown, in a possible implementation, one end of the two bracket plates 241 is provided with an edge strip 247 that is sleeved on the ends of the two bracket plates, and part of the side edge of the edge strip 247 is folded to form a positioning block 246.

[0093] According to the solution of the embodiment of the present disclosure, the tops of the first bracket plate 241 and the second bracket plate 241 between two adjacent rows of mounting positions have a edging strip 247, so that the tops of the two are covered. The positioning block 246 is formed by folding the edge of the edging strip 247, which simplifies the processing difficulty of the bracket plate 241.

[0094] In a possible implementation, the edge strip 247 is formed by folding the extension of the top of the first bracket plate 241 90 degrees toward the second bracket plate 241. The extension is folded 90 degrees again at the position where it contacts the second bracket plate 241 to extend downward. The third fold is performed in the area where the positioning block 246 is required to be formed, so that the positioning block 246 forms a horizontal platform, on which the base 121 of the computing power module can be placed.

[0095] According to the solution of the embodiment of the present disclosure, the bracket plate 241 has positioning and guiding functions and has a simple structure and is easy to process.

[0096] In a possible implementation, the guide rail frame 240 includes at least two columns of mounting positions formed by a bracket plate 241 , and each column of mounting positions is parallel to the fan module 230 .

[0097] In the disclosed embodiment, at least two rows of mounting positions are provided in the box 210. At least one partition plate 248 may be provided between the bracket plates on both sides of each row of mounting positions, and the partition plate 248 is parallel to the computing power module and can separate and guide the airflow.

[0098] In one example, the box 210 is provided with mounting positions formed by three columns of bracket plates 241, and each column has 16 mounting positions. A computing power module can be inserted into each mounting position, and each computing power module has two computing power units, so a maximum of 96 computing power units can be inserted. Compared with blade-type computing power modules, each module usually has four computing power units, and 24 blade-type modules can usually be inserted into the box 210. However, since each module is horizontally inserted into the mounting position from one end of the box 210, the four computing power units of each module are successively located upstream and downstream of the airflow, resulting in a large temperature difference between each other. For cloud phones or cloud game servers, there are currently mobile phone SoCs on the market with a power consumption of more than 16 watts at maximum performance. If the existing box 210 structure design continues to be used, the performance of the SoC can only be limited, and the power consumption and heat generation of each SoC can be reduced; or the number of SoCs in the server chassis can be reduced to reduce the overall power consumption and heat generation of the chassis.

[0099] According to the solution of the embodiment of the present disclosure, the server's heat dissipation support capability for high-power consumption computing units is improved, the density of high-function computing units within a single server chassis is increased, and cost-effectiveness is improved.

[0100] In a possible implementation, the fan module 230 includes a fan bracket and a plurality of fan units. Two ends of the fan bracket are respectively fixedly connected to a pair of side panels 211 , and the plurality of fan units are arranged in parallel in the fan bracket.

[0101] In the disclosed embodiment, the number of fan units can be 4 to 8, and the specific number depends on the width of the box 210 and the diameter of a single fan unit. Multiple fan units fill the cross-section between a pair of side edges to increase the flow rate and velocity of the airflow.

[0102] An embodiment of the present disclosure provides a cloud server, comprising: a server chassis provided according to any of the above embodiments of the present disclosure.

[0103] A cloud server is a virtualized service that provides computing resources over the Internet. It can flexibly provide powerful computing power and storage resources for various application scenarios. The following are some common examples of cloud server application scenarios:

[0104] 1. Cloud Phone Server

[0105] Application scenarios: Cloud mobile server is mainly used to virtualize mobile devices in the cloud, which is suitable for scenarios that require a large number of mobile devices for testing and automated operations, such as mobile application testing, automatic advertising, and game hang-up. Developers can use cloud mobile server to simulate the environment of various mobile devices and conduct cross-platform application testing without purchasing actual hardware devices. It provides efficient resource utilization, low-cost equipment maintenance, and on-demand expansion of the number of devices to meet the application testing needs of various Android and iOS environments.

[0106] 2. Cloud gaming server

[0107] Application scenarios: Cloud gaming servers run games in the cloud and transmit rendering results to players' devices in real time, allowing users to experience large-scale games without having high-performance hardware devices. This application is suitable for gaming scenarios with high hardware requirements, such as 3A masterpieces and VR games. It greatly reduces the hardware threshold for players and supports running high-quality games on low-configuration devices. Players can experience games instantly on any device, reducing the time cost of game downloads and installations.

[0108] 3. Virtual Desktop Infrastructure

[0109] Application scenarios: Virtual desktop infrastructure enables enterprise employees to remotely access company resources and applications through cloud servers. It is suitable for use in scenarios such as multi-location offices, remote work, and BYOD (bring your own device). Enterprises can provide employees with a unified working environment without deploying a large amount of local hardware. It improves data security and management efficiency, reduces the maintenance cost of terminal equipment, and can flexibly provide customized virtual desktop environments for different employees.

[0110] Other components of the cloud server in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0111] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0112] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0113] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0114] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0115] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0116] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A computing power module, comprising: substrate; A computing unit, at least two of which are arranged in parallel on the first side of the substrate; A first heat sink (110), the first heat sink (110) being arranged on the first side of the substrate and covering the computing unit and the surface of the first side of the substrate; a second heat sink disposed on the second side of the substrate and covering a surface of the second side of the substrate; The locking mechanism (120) comprises a base (121) and a handle (122), wherein the base (121) is arranged at the first end of the substrate, the first end of the handle (122) is hinged to the base (121), and the second end of the handle (122) is detachably connected to the base (121), wherein the first end of the handle (122) also has a snap-on protrusion (123) for cooperating with the installation position of the computing power module.

2. The computing power module according to claim 1, further comprising: A positioning edge (130) is arranged at the second end and / or the third end of the base plate, one end of the positioning edge (130) abuts against the locking mechanism (120), and the other end extends toward the fourth end of the base plate; The first end of the substrate is opposite to the fourth end, and the second end is opposite to the third end.

3. The computing power module according to claim 1, wherein: The base (121) is provided with a handle section and a button section along its length direction; The first end of the handle section is provided with a rotating shaft, and the second end of the handle section is provided with a notch communicating with the button section; the first end of the handle is hinged to the rotating shaft, and the second end of the handle is provided with a locking hook (128); The button section is provided with a sliding switch (124) movable along the length direction, and one end of the sliding switch (124) facing the direction of the handle section is provided with a locking tongue (125), and the locking tongue (125) is used to engage with the locking hook (128) to lock the second end of the handle (122) with the base (121).

4. The computing power module according to claim 3, wherein: The main body of the handle (122) and the buckle protrusion (123) are symmetrically arranged on both sides of the rotating shaft.

5. The computing power module according to claim 1, wherein: The handle section of the base (121) has a plurality of ventilation holes (126), and the handle (122) has a plurality of hollow notches (127).

6. A server chassis, comprising: A box body (210) comprising a bottom plate and a pair of side plates (211) connected to the bottom plate; A carrier board (220), the carrier board (220) being arranged parallel to the bottom board, and the carrier board (220) having a plurality of connectors (221); A fan module (230), the fan module (230) being arranged between the pair of side plates (211) and being used to generate an airflow in a first direction; The guide rail frame (240) comprises a plurality of bracket plates (241) connected to the pair of side plates (211), the bracket plates (241) being perpendicular to the carrier plate (220), the slots (242) on two adjacent bracket plates (241) forming a plurality of groups of guide rails extending along the second direction, each group of guide rails and the carrier plate (220) jointly defining an installation position, and each installation position corresponding to one of the connectors (221); According to any one of claims 1 to 5, the computing power module (100) is arranged in any one of the installation positions and is electrically connected to the connector (221); wherein at least two computing power units of the computing power module are arranged along the second direction; The first direction and the second direction are perpendicular to each other.

7. The server chassis according to claim 6, wherein: A plurality of positioning blocks (246) are arranged on the bracket plate (241) located on the first side of the installation position, and a card slot (242) is formed between two adjacent positioning blocks (246); wherein the width of the card slot (242) matches the width of the positioning edge (130) on the computing power module (100).

8. The server chassis according to claim 6, wherein: A plurality of snap holes (243) are provided on the bracket plate (241) located on the second side of the installation position, and the snap holes (243) are used to accommodate snap protrusions (123) on the computing power module (100) to fix the computing power module (100) in the installation position.

9. The server chassis according to claim 6, wherein: A plurality of ventilation windows (244) are provided on the support plate (241), and the ventilation windows (244) are located between two adjacent installation positions.

10. The server chassis according to claim 7, wherein: The edge of the ventilation window (244) is provided with a circle of raised reinforcing ribs (245).

11. The server chassis according to any one of claims 8 to 10, wherein: Two bracket plates (241) are provided between two adjacent rows of mounting positions, and the corresponding ventilation windows (244) on the two bracket plates (241) do not completely overlap in the first direction.

12. The server chassis according to claim 11, wherein: One end of the two support plates (241) is provided with an edge strip (247) which is sleeved on the ends of the two support plates, and part of the side edge of the edge strip (247) is folded to form the positioning block (246).

13. The server chassis according to claim 6, wherein: The guide rail frame (240) comprises at least two rows of mounting positions formed by a bracket plate (241), and each row of mounting positions is parallel to the fan module (230).

14. The server chassis according to claim 6, wherein: The fan module (230) comprises a fan bracket and a plurality of fan units, wherein two ends of the fan bracket are respectively fixedly connected to the pair of side plates (211), and the plurality of fan units are arranged in parallel in the fan bracket.

15. A cloud server, comprising: A server chassis according to any one of claims 6 to 14.

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