Encapsulation structure girdling method

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and provides a ring cutting method of a packaging structure, the ring cutting method is used for carrying out a ring cutting process on the plastic-packaged packaging structure, the packaging structure comprises a packaging main body and a plastic packaging layer, and the ring cutting method comprises the following steps: obtaining a first surface image and a second surface image of the packaging structure; acquiring a plurality of first edge points of the plastic package layer from the first surface image and calculating to obtain coordinates of a first circle center; acquiring a plurality of second edge points of the packaging main body from the second surface image and calculating to obtain coordinates of a second circle center; according to the first circle center and the second circle center, a first equivalent circle center coordinate of the plastic packaging layer and a second equivalent circle center coordinate of the packaging body are calculated, and accurate positioning of the packaging structure is achieved; and the pre-generated first cutting path is compensated according to the first equivalent circle center and the second equivalent circle center to generate the second cutting path, and ring cutting operation is performed on the packaging structure according to the second cutting path, so that the reliability and the processing accuracy of the ring cutting process are effectively improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a ring cutting method for a packaging structure. Background Art

[0002] With the development of society and the advancement of semiconductor technology, the market has put forward higher and higher requirements on the size and performance of semiconductor devices. In order to improve the competitiveness of products, it is necessary to develop new semiconductor processes on thin substrates to improve product performance and reduce product size. In the new semiconductor process, an injection molding process is designed for injection molding and packaging of wafers. After the injection molding process is completed, the packaging structure formed after injection molding needs to be subjected to a ring cutting process to remove the excess plastic sealing layer on the periphery of the wafer.

[0003] At present, when the packaging structure after plastic sealing is subjected to the ring cutting process, since there is no graphic mark on the surface of the packaging structure formed after plastic sealing, the traditional positioning method cannot achieve the precise positioning of the wafer, resulting in poor accuracy of the ring cutting process, and in severe cases, the ring cutting effect cannot meet the design requirements. In addition, the packaging structure after plastic sealing may have a warping phenomenon. When the ring cutting process is performed using the blade of the cutting machine, the problem of incoming material warping will be faced. In order to solve the problem of incoming material warping, the cutting machine needs to introduce a specific working mode, which is equivalent to adding a film-attaching process to the wafer during the wafer processing process, resulting in an increase in the production cost of the product and a reduction in the production efficiency of the product. Therefore, there is an urgent need for a new ring cutting method for the packaging structure to solve the technical problems existing in the prior art. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a method for ring cutting of a packaging structure to solve the problem of poor precision of the ring cutting process of the packaging structure in the prior art, and to effectively improve the reliability and processing accuracy of the ring cutting process.

[0005] In order to achieve the above-mentioned purpose and other related purposes, a ring cutting process is performed on a plastic-sealed packaging structure, wherein the packaging structure includes a packaging body and a plastic sealing layer covering the front and side surfaces of the packaging body, and the process includes the following steps:

[0006] Acquire a first side image and a second side image of the packaging structure;

[0007] Acquire a plurality of first edge points of the plastic sealing layer from the first surface image;

[0008] Acquire a plurality of second edge points of the package body from the second surface image;

[0009] Based on the first edge point and the second edge point, coordinates of a plurality of first circle centers of the plastic encapsulation layer and coordinates of a plurality of second circle centers of the package body are calculated;

[0010] Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the packaging body are calculated;

[0011] According to the first equivalent circle center and the second equivalent circle center, compensating the pre-generated first cutting path to generate a second cutting path;

[0012] Performing a circular cutting operation on the packaging structure according to the second cutting path.

[0013] Optionally, acquiring a plurality of first edge points of the plastic sealing layer from the first surface image comprises the following steps:

[0014] Performing edge detection and positioning on the plastic sealing layer in the first surface image to obtain an edge contour of the plastic sealing layer;

[0015] Acquire a plurality of first edge points from the edge contour of the plastic packaging layer;

[0016] Wherein, a plurality of the first edge points are arranged at intervals from each other, and the number of the first edge points is at least 4.

[0017] Optionally, acquiring a plurality of second edge points of the package body from the second surface image comprises the following steps:

[0018] Performing edge locating on the package body in the second surface image to obtain an edge contour of the package body;

[0019] Acquire a plurality of second edge points from the edge contour of the package body;

[0020] Wherein, a plurality of the second edge points are arranged at intervals from each other, and the number of the second edge points is at least 4.

[0021] Optionally, based on the first edge point and the second edge point, calculating the coordinates of a plurality of first circle centers of the plastic encapsulation layer and the coordinates of a plurality of second circle centers of the package body comprises the following steps:

[0022] Using the first edge points and the second edge points, respectively, a plurality of first point sets and a plurality of second point sets are formed; wherein each of the first point sets includes three first edge points, and each of the second point sets includes three second edge points;

[0023] The coordinates of the first circle center and the coordinates of the second circle center are calculated based on the first point set and the second point set, respectively.

[0024] Optionally, based on the first circle center and the second circle center, calculating the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the packaging body comprises the following steps:

[0025] Calculating an average value of coordinates of a plurality of first circle centers to obtain the coordinates of the first equivalent circle center;

[0026] The coordinate average of multiple second circle centers is calculated to obtain the coordinate of the second equivalent circle center.

[0027] Optionally, compensating the pre-generated first cutting path to generate the second cutting path comprises the following steps:

[0028] Calculate the coordinate difference between the second equivalent circle center and the first equivalent circle center;

[0029] Coordinate compensation is performed on the first cutting path according to the coordinate difference to generate the second cutting path.

[0030] Optionally, performing a ring cutting operation on the packaging structure according to the second cutting path includes the following steps:

[0031] Segmenting the second cutting path along the circumference of the packaging structure to divide the second cutting path into a plurality of cutting segments;

[0032] According to the segmented second cutting path, the packaging structure is subjected to segmented circular cutting.

[0033] Optionally, performing a ring cutting operation on the packaging structure according to the second cutting path includes the following steps:

[0034] Dividing the packaging structure into N cutting layers along the axial direction of the packaging structure, and recording them as the first to Nth cutting layers in sequence, where N is a positive integer greater than 2;

[0035] Generating a cutting path for each cutting layer according to the second cutting path;

[0036] Segmenting the cutting path of each cutting layer along the circumference of the packaging structure to divide the cutting path of each cutting layer into a plurality of sub-cutting segments;

[0037] According to the cutting path of each of the segmented cutting layers, segmented circular cutting operations are performed on the N cutting layers respectively.

[0038] Optionally, generating a cutting path for each cutting layer according to the second cutting path comprises the following steps:

[0039] Using the second cutting path as the cutting path of the first cutting layer;

[0040] The cutting path of the i-th cutting pattern is deflected around the axis of the packaging body to obtain the cutting path of the i+1-th cutting layer, where i is a positive integer and 1≤i≤N-1.

[0041] Optionally, according to the second cutting path, a laser cutting device is used to perform a circular cutting operation on the packaging structure, and a cleaning device is used to clean the packaging structure after the circular cutting operation.

[0042] As described above, the ring cutting method of the packaging structure provided by the present application has at least the following beneficial effects:

[0043] The circular cutting method of the packaging structure of the present application obtains multiple first edge points and second edge points from the first surface image and the second surface image, and calculates the first circle center and the second circle center, and further calculates the first equivalent circle center and the second equivalent circle center, thereby achieving precise positioning of the packaging structure, the packaging body and the plastic sealing layer, and improving the reliability of the circular cutting process. According to the first equivalent circle center and the second equivalent circle center, the pre-generated first cutting path is compensated to obtain the second cutting path, which effectively improves the processing accuracy of the circular cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1 Shown is a flow chart of a ring cutting method for a packaging structure provided in the first embodiment of the present application.

[0046] Figure 2 Shown is a structural schematic diagram of the packaging structure provided in Example 1 of the present application.

[0047] Figure 3 Shown is a schematic cross-sectional structure diagram of the packaging structure provided in Example 1 of the present application.

[0048] Figure 4 Shown is a schematic diagram of the structure for obtaining the first edge point provided in the first embodiment of the present application.

[0049] Figure 5 Shown is a schematic diagram of the structure for obtaining the second edge point provided in the first embodiment of the present application.

[0050] Figure 6Shown is a schematic diagram of the structure of forming a second cutting path provided in the first embodiment of the present application.

[0051] Figure 7 Shown is a structural schematic diagram of segmenting the second cutting path provided in the first embodiment of the present application.

[0052] Figure 8 It is a schematic diagram showing the structure of the warped packaging structure in the prior art.

[0053] Fig. 9 Shown is a structural schematic diagram of layering the packaging structure provided in the second embodiment of the present application.

[0054] Reference numerals:

[0055] 10. Packaging structure; 11. Plastic packaging layer; 12. Packaging body; 131. First cutting path; 132. Second cutting path; 133. First equivalent circle center; 134. Second equivalent circle center. DETAILED DESCRIPTION

[0056] In order to make the technical purpose, technical solution and technical effect of the present application clearer, the technical solution in the present application will be clearly and completely described in conjunction with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0058] In the description of the present application, it should be noted that the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more implementations or examples in a suitable manner.

[0059] Embodiment 1

[0060] The present embodiment provides a ring cutting method for a packaging structure, which is used to perform a ring cutting process on a plastic-sealed packaging structure 10, wherein the packaging structure 10 includes a packaging body 12 and a plastic sealing layer 11, wherein the packaging body 12 can be, for example, a semiconductor device such as a wafer, and the plastic sealing layer 11 is coated on the front and side surfaces of the packaging body 12. Figure 1 The ring cutting method of the packaging structure provided in this embodiment includes steps S1 to S7, specifically including:

[0061] Step S1: Acquire a first surface image and a second surface image of a packaging structure;

[0062] Step S2: Acquire a plurality of first edge points of the plastic sealing layer from the first surface image;

[0063] Step S3: acquiring a plurality of second edge points of the plastic-sealed body from the second surface image;

[0064] Step S4: based on the first edge point and the second edge point, calculating the coordinates of a plurality of first circle centers of the plastic packaging layer and the coordinates of a plurality of second circle centers of the packaging body;

[0065] Step S5: based on the first circle center and the second circle center, calculate and obtain the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle of the packaging body;

[0066] Step S6: compensating the pre-generated first cutting path according to the first equivalent circle center and the second equivalent circle to generate a second cutting path;

[0067] Step S7: performing a circular cutting operation on the packaging structure according to the second cutting path.

[0068] The ring cutting method of the packaging structure of this embodiment will be described in detail below with reference to the accompanying drawings. It should be noted that the above sequence does not strictly represent the process sequence of the ring cutting method of the packaging structure protected by this application, and those skilled in the art can change it according to the actual processing steps.

[0069] First, step S1 is performed to obtain a first surface image and a second surface image of the packaging structure 10 .

[0070] In this embodiment, refer to Figure 2 and Figure 3The package structure 10 has a first surface and a second surface that are arranged opposite to each other. The first surface of the package structure 10 is the surface of the side where the plastic encapsulation layer 11 covers the front of the package body 12 in the package structure 10, and the second surface of the package structure 10 is the surface of the side where the package body 12 is exposed. Optionally, the image of the first surface and the second surface of the package structure 10 can be obtained by using an image acquisition device provided by the cutting device, or by using an industrial camera, or by using other suitable methods.

[0071] In an optional embodiment, the first side image includes an edge area image of the plastic encapsulation layer 11 and is recorded as the first edge area image. The first edge area image can be an integral image or a combination of multiple images. The second side image includes an edge area image of the package body 12 and is recorded as the second edge area image. The second edge area image can be an integral image or a combination of multiple images. Optionally, the first side image can also include an image of the front side of the package structure 10, and the second side image can also include an image of the back side of the package structure 10.

[0072] Then, step S2 is performed to obtain a plurality of first edge points of the plastic sealing layer 11 from the first surface image; wherein the first edge points can be understood as points constituting the edge contour of the plastic sealing layer 11 in the first surface image.

[0073] Specifically, refer to Figure 4 , edge-finding and positioning are performed on the first surface image, and then the edge contour of the plastic sealing layer 11 is obtained from the first surface image; after obtaining the edge contour of the plastic sealing layer 11, multiple edge points are selected from the edge contour of the plastic sealing layer 11 as first edge points; optionally, the selected multiple first edge points are spaced apart from each other, and the number of the first edge points is at least 4, for example, 4, 6, 8 or other suitable numbers.

[0074] In an optional embodiment, multiple first edge points are evenly spaced along the circumference of the edge contour of the plastic packaging layer 11, so that there is a relatively large spacing distance between the multiple first edge points, thereby improving the accuracy of the calculation results and further improving the processing accuracy of the circumferential cutting process.

[0075] Next, step S3 is performed to obtain a plurality of second edge points of the plastic-encapsulated body from the second surface image; wherein the second edge points can be understood as points constituting the edge contour of the plastic-encapsulated body in the second surface image.

[0076] Specifically, refer to Figure 5, edge-finding and locating the second surface image, and then obtaining the edge contour of the package body 12 from the second surface image; after obtaining the edge contour of the plastic-encapsulated body, multiple edge points are selected from the edge contour of the package body 12 as second edge points; optionally, the selected multiple second edge points are spaced apart from each other, and the number of second edge points is at least 4, for example, 4, 6, 8 or other suitable numbers. In addition, in this embodiment, step S2 and step S3 can be performed simultaneously or separately, for example, step S2 and step S3 can be performed in sequence respectively, or step S3 and step S2 can be performed in sequence respectively.

[0077] In an optional embodiment, multiple second edge points are evenly spaced along the circumference of the edge contour of the package body 12 so that there is a relatively large spacing distance between the multiple second edge points, thereby improving the accuracy of the calculation results and further improving the processing accuracy of the circumferential cutting process.

[0078] Next, step S4 is performed to calculate the coordinates of a plurality of first circle centers of the plastic packaging layer 11 and the coordinates of a plurality of second circle centers of the packaging body 12 based on the first edge point and the second edge point.

[0079] In this embodiment, image processing software or other suitable tools can be used to process the first surface image to obtain multiple first edge points, and the second surface image can be processed to obtain multiple second edge points. A rectangular coordinate system is set in the image processing software. According to the coordinates of the first edge point and the second edge point in the rectangular coordinate system, the coordinates of multiple first circle centers and the coordinates of multiple second circle centers can be calculated.

[0080] In an optional embodiment, the first edge points and the second edge points are used to form a plurality of first point sets and a plurality of second point sets, respectively, and the coordinates of the first center of the circle and the coordinates of the second center of the circle are calculated based on the first point set and the second point solution. Specifically, the first edge points are used to form a plurality of first point sets, wherein each first point set includes three first edge points, and the coordinates of a first center of the circle can be calculated based on the three first edge points in each point set. By calculating the plurality of first point sets, the coordinates of the plurality of first center of the circle can be calculated. Optionally, each two first point sets have at least one first edge point with different coordinates. The second edge points are used to form a plurality of second point sets, wherein each second point set includes three second edge points, and the coordinates of a second center of the circle are determined. By calculating the plurality of second point sets, the coordinates of the plurality of second center of the circle can be calculated. Optionally, each two second point sets have at least one second edge point with different coordinates.

[0081] Next, step S5 is performed to calculate the coordinates of the first equivalent circle center 133 of the plastic packaging layer 11 and the coordinates of the second equivalent circle 134 of the package body 12 based on the first circle center and the second circle center.

[0082] Specifically, refer to Figure 6 According to the calculated multiple first circle centers, a compensation algorithm can be used to form a circle center as the equivalent circle center of the plastic encapsulation layer 11 and recorded as the first equivalent circle center 133. Similarly, according to the calculated multiple second circle centers, a compensation algorithm can be used to form a circle as the equivalent circle center of the package body 12 and recorded as the second equivalent circle 134. The precise positioning of the plastic encapsulation layer 11 and the package body 12 is achieved through the coordinates of the first equivalent circle center 133 and the coordinates of the second equivalent circle 134, thereby improving

[0083] In an optional embodiment, the coordinates of a circle center may be obtained by an average algorithm, specifically, the coordinate averages of multiple first circle centers are calculated to obtain the coordinates of the first equivalent circle center 133; the coordinate averages of multiple second circle centers are calculated to obtain the coordinates of the second equivalent circle 134. The coordinates of the first equivalent circle center 133 and the coordinates of the second equivalent circle 134 may also be calculated using other suitable compensation algorithms, such as by using a weighted average algorithm to calculate the coordinates of the first equivalent circle center 133 and the coordinates of the second equivalent circle 134, but the present embodiment is not limited thereto.

[0084] Next, step S6 is performed to compensate the pre-generated first cutting path 131 according to the first equivalent circle center 133 and the second equivalent circle 134 to generate the second cutting path 132 .

[0085] In this embodiment, refer to Figure 6 There will be a certain position offset between the calculated first equivalent circle center 133 and the second equivalent circle 134. According to the above position offset, the pre-generated first cutting path 131 is compensated to obtain the second cutting path 132, so that the distance between the edge of the package structure 10 after cutting and the package body 12 is a preset fixed value.

[0086] In an optional embodiment, compensating the pre-generated first cutting path 131 to generate the second cutting path 132 includes the following steps: calculating the coordinate difference between the second equivalent circle 134 and the first equivalent circle center 133; and performing coordinate compensation on the first cutting path 131 according to the coordinate difference to generate the second cutting path 132. Specifically, the coordinate value of the second equivalent circle 134 is subtracted from the coordinate value of the first equivalent circle center 133 to obtain the coordinate difference, and the coordinate difference is added to the coordinate of each cutting point on the first cutting path 131 to obtain the new coordinate of each cutting point to form the second cutting path 132.

[0087] Finally, step S7 is performed to perform a circular cutting operation on the package structure 10 according to the second cutting path 132. Specifically, the package structure 10 is cut along the second cutting path 132 by using a cutting device to complete the circular cutting operation on the package structure 10.

[0088] In an alternative embodiment, reference Figure 7 , the second cutting path 132 is segmented along the circumference of the packaging structure 10 to divide the second cutting path 132 into a plurality of cutting segments, and the packaging structure 10 is segmented and circularly cut according to the segmented second cutting path 132. Optionally, the second cutting path 132 is divided into at least 2 or more cutting segments along its circumference; further, the second cutting path 132 is divided into at least 4 or more cutting segments along its circumference, for example, the second cutting path 132 can be divided into 6, 8 or other number of cutting segments along its circumference. The specific number of the divided cutting segments can be adaptively set according to the actual size of the packaging structure 10 and the packaging body 12.

[0089] In the prior art, when the encapsulation structure 10 is subjected to the circumcision process by the cutting equipment, in order to ensure high processing accuracy, it is often necessary to rely on the high-precision positioning of the encapsulation structure 10. However, there is no marking pattern on the surface of the encapsulation structure 10, so that the cutting equipment cannot accurately position the encapsulation structure 10 in the traditional way, resulting in poor accuracy of the circumcision process for the encapsulation structure 10, so that the effect of the circumcision cannot meet the design requirements. The circumcision method of this embodiment obtains a plurality of first edge points and a second edge point from the first surface image and the second surface image, and calculates a plurality of first circle centers of the plastic encapsulation layer 11 and a plurality of second circle centers of the encapsulation body 12, and then calculates a first equivalent circle center 133 and a second equivalent circle 134, thereby realizing the precise positioning of the encapsulation structure 10 and the encapsulation body 12, i.e., the plastic encapsulation layer 11, and improving the reliability and processing accuracy of the circumcision process.

[0090] In an optional embodiment, after step S7, the following step is further included: using a cleaning device to clean the packaging structure 10. Specifically, after the packaging structure 10 is circularly cut according to the second cutting path 132, cutting the plastic encapsulation material will cause residues to accumulate on the surface of the packaging structure 10. The surface of the packaging structure 10 is cleaned by using a cleaning device and adjusting parameters such as the flow rate and pressure of the cleaning device to keep the surface of the packaging structure 10 clean.

[0091] In an optional embodiment, a laser cutting device is used to perform a ring cutting operation on the packaging structure 10 .

[0092] In the prior art, reference Figure 8When the packaging structure 10 that has completed the plastic encapsulation process is subjected to the ring cutting process, a cutting machine with a blade is used for cutting. This cutting method faces the problem of incoming material warping when feeding the material. In order to solve the problem of incoming material warping, a specific working mode needs to be introduced, which is equivalent to adding a film pasting process, increasing the production cost and reducing the production efficiency. The ring cutting method of this embodiment uses a laser cutting device to cut the packaging structure 10, which overcomes the technical problem of incoming material warping in the prior art, does not require an additional film pasting process, reduces the production cost, and improves the production efficiency.

[0093] In summary, the circular cutting method of the present embodiment ensures the accuracy and reliability of the calculation results by performing edge finding and positioning on the plastic layer 11 and the packaging body 12 in the first side image and the second side image to obtain the first edge point and the second edge point; the first edge point and the second edge point are calculated to obtain the first equivalent circle center 133 and the second equivalent circle 134, thereby achieving precise positioning of the packaging structure 10 and improving the reliability and processing accuracy of the circular cutting process; the use of laser cutting equipment for circular cutting overcomes the problem of warping of incoming materials, eliminates the need for an additional film pasting process, reduces production costs, and improves production efficiency.

[0094] Embodiment 2

[0095] This embodiment provides another method for ring cutting of a packaging structure, which also includes steps S1 to S7 in the first embodiment. The similarities with the first embodiment are not repeated here. The difference lies in the specific features of the ring cutting operation of the packaging structure 10 according to the second cutting path 132 in step S7.

[0096] In this embodiment, after completing step S6 to obtain the second cutting path 132 , step S7 is performed to perform a circular cutting operation on the package structure 10 according to the second cutting path 132 .

[0097] Specifically, refer to Fig. 9 , the packaging structure 10 is divided into N cutting layers along the axial direction of the packaging structure 10, and they are recorded as the first to Nth cutting layers in sequence, where N is a positive integer greater than 2; according to the second cutting path 132, a cutting path for each cutting layer is generated; the cutting path of each cutting layer is segmented along the circumferential direction of the packaging structure 10 to divide the cutting path of each cutting layer into a plurality of sub-cutting segments; according to the cutting path of each cutting layer, a plurality of sub-cutting segments of the N cutting layers are respectively subjected to segmented circular cutting operations.

[0098] In an optional embodiment, the cutting path of each cutting layer is divided into M sub-cutting segments, where M is a positive integer greater than 2. Optionally, M can also be set to a positive integer greater than 4, for example, the cutting path of each cutting layer is divided into 4 sub-cutting segments, or 6 sub-cutting segments, or 8 sub-cutting segments; wherein the specific number of sub-cutting segments into which the cutting path of each cutting layer is divided can be adaptively set according to the actual size of the packaging structure 10 and the packaging body 12.

[0099] In an optional embodiment, the packaging structure 10 is divided into N cutting layers along its axial direction, and N can be set to 2, 4, 6, 8 or other suitable values, for example. Optionally, the thickness of each cutting layer is 10 mm to 100 mm, and the number of divided cutting layers can be set according to the thickness of each cutting layer. Furthermore, the cutting device is a laser cutting device, and the thickness of each cutting layer can be set according to the focal length parameter of the laser cutting device, which can improve the working efficiency and accuracy of the cutting device in performing circular cutting on the packaging structure 10.

[0100] In an optional embodiment, the second cutting path 132 is used as the cutting path of each cutting layer to obtain cutting paths of N cutting layers.

[0101] In an optional embodiment, generating a cutting path for each cutting layer includes the following steps: using the second cutting path 132 as the cutting path for the first cutting layer; deflecting the cutting path of the i-th cutting layer around the axis of the package body 12 to obtain the cutting path of the i+1-th cutting layer, where i is a positive integer and 1≤i≤N-1. Optionally, the cutting path of the i-th cutting layer is deflected around the axis of the package body 12 according to a preset deflection angle to obtain the cutting path of the i+1-th cutting layer; further, the deflection angle is less than or equal to 5°.

[0102] In the prior art, when laser cutting equipment is used for multi-segment cutting, there is often a problem of overlapping cutting, which may lead to problems such as reduced circular cutting accuracy. In order to solve the problem of overlapping cutting, in this embodiment, by setting a deflection angle and controlling the cutting path of each cutting layer to be deflected compared to the cutting path of the previous cutting layer, it can ensure that the joints in the segmented cutting can be fully processed, and effectively solve the problem of overlapping cutting, thereby improving the processing effect and working reliability of the circular cutting process.

[0103] In summary, the ring cutting method of the packaging structure of this embodiment also includes steps S1 to S7 in embodiment one, and therefore also has the beneficial effects of embodiment one. In addition, in this embodiment, the packaging structure 10 is divided into multiple cutting layers, and the cutting path of each cutting layer is deflected, which further improves the reliability and processing effect of the ring cutting process.

[0104] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify, change or combine the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A method for ring cutting of a packaging structure, for performing a ring cutting process on a plastic-sealed packaging structure, wherein the packaging structure comprises a packaging body and a plastic sealing layer covering the front and side surfaces of the packaging body, wherein: The following steps are involved: Acquire a first side image and a second side image of the packaging structure; Acquire a plurality of first edge points of the plastic sealing layer from the first surface image; Acquire a plurality of second edge points of the package body from the second surface image; Based on the first edge point and the second edge point, coordinates of a plurality of first circle centers of the plastic encapsulation layer and coordinates of a plurality of second circle centers of the package body are calculated; Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the packaging body are calculated; According to the first equivalent circle center and the second equivalent circle center, compensating the pre-generated first cutting path to generate a second cutting path; Performing a circular cutting operation on the packaging structure according to the second cutting path.

2. The ring cutting method of the packaging structure according to claim 1, characterized in that: Acquiring a plurality of first edge points of the plastic encapsulation layer from the first surface image comprises the following steps: Performing edge detection and positioning on the plastic sealing layer in the first surface image to obtain an edge contour of the plastic sealing layer; Acquire a plurality of first edge points from the edge contour of the plastic packaging layer; Wherein, a plurality of the first edge points are arranged at intervals from each other, and the number of the first edge points is at least 4.

3. The ring cutting method of the packaging structure according to claim 1, characterized in that: Acquiring a plurality of second edge points of the package body from the second surface image comprises the following steps: Performing edge locating on the package body in the second surface image to obtain an edge contour of the package body; Acquire a plurality of second edge points from the edge contour of the package body; Wherein, a plurality of the second edge points are arranged at intervals from each other, and the number of the second edge points is at least 4.

4. The ring cutting method of the packaging structure according to claim 1, characterized in that: Based on the first edge point and the second edge point, the coordinates of the first circle centers of the plastic encapsulation layer and the coordinates of the second circle centers of the package body are calculated, including the following steps: Using the first edge points and the second edge points, respectively, a plurality of first point sets and a plurality of second point sets are formed; wherein each of the first point sets includes three first edge points, and each of the second point sets includes three second edge points; The coordinates of the first circle center and the coordinates of the second circle center are calculated based on the first point set and the second point set, respectively.

5. The ring cutting method of the packaging structure according to claim 1, characterized in that: Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the packaging body are calculated, including the following steps: Calculating an average value of coordinates of a plurality of first circle centers to obtain the coordinates of the first equivalent circle center; The coordinate average of multiple second circle centers is calculated to obtain the coordinate of the second equivalent circle center.

6. The ring cutting method of the packaging structure according to claim 1, characterized in that: Compensating a pre-generated first cutting path to generate a second cutting path includes the following steps: Calculate the coordinate difference between the second equivalent circle center and the first equivalent circle center; Coordinate compensation is performed on the first cutting path according to the coordinate difference to generate the second cutting path.

7. The ring cutting method of the packaging structure according to claim 1, characterized in that: Performing a circular cutting operation on the packaging structure according to the second cutting path includes the following steps: Segmenting the second cutting path along the circumference of the packaging structure to divide the second cutting path into a plurality of cutting segments; According to the segmented second cutting path, the packaging structure is subjected to segmented circular cutting.

8. The ring cutting method of the packaging structure according to claim 1, characterized in that: Performing a circular cutting operation on the packaging structure according to the second cutting path includes the following steps: Dividing the packaging structure into N cutting layers along the axial direction of the packaging structure, and recording them as the first to Nth cutting layers in sequence, where N is a positive integer greater than 2; Generating a cutting path for each cutting layer according to the second cutting path; Segmenting the cutting path of each cutting layer along the circumference of the packaging structure to divide the cutting path of each cutting layer into a plurality of sub-cutting segments; According to the cutting path of each of the segmented cutting layers, segmented circular cutting operations are performed on the N cutting layers respectively.

9. The ring cutting method of the packaging structure according to claim 8, characterized in that: Generating a cutting path for each cutting layer according to the second cutting path includes the following steps: Using the second cutting path as the cutting path of the first cutting layer; The cutting path of the i-th cutting pattern is deflected around the axis of the packaging body to obtain the cutting path of the i+1-th cutting layer, where i is a positive integer and 1≤i≤N-1.

10. The ring cutting method of the packaging structure according to claim 1, characterized in that: According to the second cutting path, a laser cutting device is used to perform a circular cutting operation on the packaging structure, and a cleaning device is used to clean the packaging structure after the circular cutting operation.

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