Electronic device, circuit board and vehicle
By using the interlaced multi-layer structure of graphene and hexagonal boron nitride in the circuit board, the heat dissipation efficiency and insulation performance of the electronic device are improved, the problems of insufficient thermal conductivity and high cost in the prior art are solved, and the heat dissipation structure is simplified. Reduced costs.
Patent Information
- Application Number
- CN202310875762.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-17
- Publication Date
- 2025-01-17
AI Technical Summary
In existing electronic devices, the chip heat dissipation structure has problems of insufficient thermal conductivity and high cost, especially the copper inserts and thermal interface materials have poor performance in heat dissipation, resulting in low heat transfer efficiency.
The circuit board formed by mixing graphene and hexagonal boron nitride into a polymer matrix can improve thermal conductivity and insulation through the interlaced multi-layer structure of graphene and hexagonal boron nitride, simplify the heat dissipation structure, and reduce the copper insert and thermal interface. Reliance on materials.
It realizes more efficient heat transfer and reduces the cost of heat dissipation structure, simplifies the heat dissipation design of electronic devices, and improves insulation performance.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to electronic devices, and more particularly to a chip heat dissipation structure, a circuit board and a vehicle in the electronic devices. Background Art
[0002] With the rapid development of new energy vehicles, vehicles use more chips such as MOSFET chips and power chips IGBT. For example, for a charging device with an integrated high and low voltage conversion device, multiple MOSFET (metal-oxide-semiconductor field-effect transistor) chips are configured on it. The chips will generate a lot of heat during use, and there is a need to improve the heat dissipation structure of various chips.
[0003] Figure 1 A heat dissipation method is shown, in which a copper wire 92 is arranged on a printed circuit board 91, an electronic component 93 such as a chip is connected to the copper wire, and a copper insert 94 (Cu-inlay) is arranged at a position where the printed circuit board 91 and the electronic component 93 are attached, and a heat sink 97 is arranged on the side of the printed circuit board 91 opposite to the electronic component to transfer heat to the heat sink 97 through the copper insert 94. An insulating heat-conducting layer needs to be arranged between the copper insert 94 and the heat sink 97. The current method is to apply a heat sink paste 95 (HSP heat sink paste) on the copper insert 94, and apply a thermal interface material 96 (TIM thermal interface material) between the heat sink paste 95 and the heat sink 97. HSP is mainly composed of epoxy resin and A12O3 filler, which has a thermal conductivity of about 1.3W / m·k and an insulation breakdown voltage greater than 27kV / mm to play an insulating and heat-conducting role. However, in terms of heat dissipation, HSP will become a bottleneck in the structure. On the other hand, the process and cost of embedding copper 94 into the printed circuit board 91 are also relatively high.
[0004] Therefore, it is desirable to provide an electronic component heat dissipation structure having good heat dissipation and insulation performance. Summary of the invention
[0005] The purpose of this application is to solve or at least alleviate the problems existing in the prior art.
[0006] According to one aspect of the present invention, there is provided an electronic device, comprising: A circuit board, the circuit board having a first side and a second side opposite to each other, the circuit board comprising a substrate and circuits arranged on the first side of the substrate; one or more electronic components attached to the first side of the circuit board and electrically connected to the circuitry; a heat sink thermally coupled to the circuit board so that heat dissipated by the one or more electronic components is transferred to the heat sink via the circuit board; The circuit board includes a polymer matrix and graphene and hexagonal boron nitride mixed into the polymer matrix.
[0007] Optionally, in the electronic device, the second side and / or edge of the circuit board is soldered to the heat sink.
[0008] Optionally, in the electronic device, the one or more electronic components are attached to the first side of the circuit board by sintering.
[0009] Optionally, in the electronic device, the graphene and hexagonal boron nitride form an interlaced multilayer structure in the polymer matrix.
[0010] Optionally, in the electronic device, the plane in which the substrate is located is substantially parallel to the layers of graphene and hexagonal boron nitride.
[0011] Optionally, in the electronic device, the circuit includes one or more layers of copper wire, which are laminated on the first side of the circuit board, and in the case of multiple layers of copper wire, the multiple layers of copper wire are separated by layers of graphene and hexagonal boron nitride.
[0012] Optionally, in the electronic device, the electronic component is a field effect transistor chip, and the electronic device is a voltage conversion unit of a vehicle or a charging device integrated with a voltage conversion unit.
[0013] A circuit board is also provided, which has a first side and a second side opposite to each other, and includes a substrate and circuits arranged on the first side of the substrate, wherein the circuit board includes a polymer matrix and graphene and hexagonal boron nitride mixed into the polymer matrix.
[0014] Optionally, the graphene and hexagonal boron nitride form an alternating multilayer structure in the polymer matrix, wherein the plane in which the substrate is located is substantially parallel to the layers of graphene and hexagonal boron nitride, and wherein the circuit comprises one or more layers of copper wire, which are laminated on the first side of the circuit board, and in the case of multiple layers of copper wire, the multiple layers of copper wire are separated by layers of graphene and hexagonal boron nitride.
[0015] A vehicle is also provided, the vehicle including the electronic device according to various embodiments.
[0016] The device according to the embodiment of the present invention provides a simplified heat dissipation structure of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The disclosure of the present application will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the drawings are used to represent similar components, among which: Figure 1 A conventional heat dissipation structure of an electronic device is shown; Figure 2 A heat dissipation structure of an electronic device according to an embodiment of the present invention is shown; and Figure 3 The internal structure of a substrate according to an embodiment of the present invention is shown. DETAILED DESCRIPTION
[0018] refer to Figure 2 , which shows an electronic device according to an embodiment of the present invention, which is used in an electric vehicle, for example, and can be used as a voltage conversion unit of the electric vehicle or a charging device or inverter integrated with a voltage conversion unit. The electronic device includes: a circuit board 2, the circuit board 2 has a first side (the top side in the figure) and a second side (the bottom side in the figure) opposite to each other, the circuit board 2 includes a substrate 23 and a circuit 21 arranged on the first side of the substrate; one or more electronic components 3 attached to the first side of the circuit board and electrically connected to the circuit 21, such as various chips; and a heat sink 1, the heat sink 1 is directly thermally coupled with the circuit board 2 so that the heat dissipated by the one or more electronic components 3 is transferred to the heat sink 1 via the circuit board 2, wherein the substrate 2 includes a polymer matrix and graphene and hexagonal boron nitride mixed in the polymer matrix.
[0019] Graphene, as a new material, can be added to polymers as an additive to increase their thermal conductivity. Hexagonal boron nitride (h-BN) has similar properties to graphene and can also be used as an additive to enhance thermal conductivity and insulation performance. In a paper entitled "Non-covalent poly(2-ethylhexyl acrylate) (P2EHA) / functionalized graphene / h-boronnitride flexible composites with enhanced adhesive and thermal conductivity by a facilitated latex approach" published on January 24, 2017 in the journal Composites Part A: Applied Science and Manufacturing by Zheng Su, Hua Wang, Xianzhu Ye, et al. (the full text of which is incorporated herein by reference), the application of the composite formed by adding functionalized graphene and hexagonal boron nitride to P2EHA polymer in thermal interface materials (TIM) and its exemplary preparation method and performance are mentioned. The inventor of the present invention noticed this characteristic and applied it to the circuit board for the first time, thereby improving the heat dissipation structure of the circuit board itself and the chip material, thereby simplifying the circuit board structure and reducing the cost of the heat dissipation structure. In an embodiment of the present invention, graphene and hexagonal boron nitride are also added to the polymer matrix used for the circuit board to increase the thermal conductivity and insulation of the circuit board, and the heat dissipation structure is improved based on the improved circuit board. In some embodiments, the polymer matrix can be made of epoxy resin or any other suitable resin.
[0020] In some embodiments, one or more electronic components 3 are attached to the first side of the circuit board by sintering (e.g., silver sintering). Figure 2 As shown, the second side of the circuit board 2 is soldered to the heat sink 1, and the soldering layer is, for example, a copper soldering layer 22, which tightly connects the circuit board 2 and the heat sink 1 to improve the heat transfer efficiency. The above soldering process can be performed after the sintering process is completed.
[0021] In some embodiments, Figure 3 As shown, graphene and hexagonal boron nitride form an interlaced multilayer structure in the circuit board 2, including graphene sheets 201 and hexagonal boron nitride sheets 202. In some embodiments, as Figure 3As shown, the plane where the substrate is located is substantially parallel to the graphene and hexagonal boron nitride layers, that is, the plane where the graphene and hexagonal boron nitride layers are located is substantially parallel to the plane where the substrate is located. The graphene sheet 201 and the hexagonal boron nitride sheet 202 have good thermal conductivity within the sheet plane, so the heat emitted by one or more electronic components 3 is basically diffused along the substrate plane direction and gradually transferred to the heat sink 1. In some embodiments, while ensuring insulation, the edge of the circuit board 2 can also be welded to the heat sink 1, thereby facilitating heat dissipation along the layer plane direction.
[0022] In some embodiments, the circuit 21 includes one or more layers of copper wires, which are laminated on the first side of the circuit board 2 after etching, and the multiple layers of copper wires are separated by layers of graphene and hexagonal boron nitride. In some embodiments, one or more electronic components 3 are field effect transistor chips, and the electronic device is a voltage conversion unit of a vehicle or a charging device integrated with a voltage conversion unit.
[0023] Therefore, according to the embodiment of the present invention, there is no need to use copper embedding parts, HSP and TIM, thereby simplifying the structure and cost of the heat dissipation device.
[0024] A circuit board 2 is also provided, the circuit board 2 has a first side and a second side opposite to each other, the circuit board includes a substrate 23 and a circuit 21 arranged on the first side of the substrate, wherein the substrate 23 includes a polymer matrix and graphene and hexagonal boron nitride mixed in the polymer matrix. In some embodiments, the graphene and hexagonal boron nitride form an interlaced multilayer structure in the polymer matrix. In some embodiments, the plane in which the substrate 23 is located is substantially parallel to the layers of graphene and hexagonal boron nitride, and wherein the circuit 21 includes one or more layers of copper wire, the one or more layers of copper wire are laminated on the first side of the circuit board and separated by the layers of graphene and hexagonal boron nitride. A vehicle is also provided, the vehicle including an electronic device according to various embodiments.
[0025] The specific embodiments described above in this application are only for more clearly describing the principles of this application, wherein each component is clearly shown or described to make the principles of the present invention easier to understand. Without departing from the scope of this application, those skilled in the art can easily make various modifications or changes to this application. Therefore, it should be understood that these modifications or changes should be included in the scope of patent protection of this application.
Claims
1. An electronic device, comprising: A circuit board (2), the circuit board (2) having a first side and a second side opposite to each other, the circuit board (2) comprising a substrate (22) and a circuit (21) arranged on the first side of the substrate (22); One or more electronic components (3) attached to a first side of the circuit board (2) and electrically connected to the circuit; a heat sink (1), the heat sink (1) being thermally coupled to the circuit board (2) so that heat dissipated by the one or more electronic components (3) is transferred to the heat sink (1) via the circuit board (2); The circuit board (2) comprises a polymer matrix and graphene and hexagonal boron nitride mixed into the polymer matrix.
2. The electronic device according to claim 1, characterized in that: The second side and / or edge of the circuit board (2) is soldered to the heat sink (1).
3. The electronic device according to claim 1, characterized in that: The one or more electronic components (3) are attached to the first side of the circuit board (2) by sintering.
4. The electronic device according to any one of claims 1 to 3, characterized in that: The graphene and hexagonal boron nitride form an interlaced multilayer structure (201, 202) in the polymer matrix.
5. The electronic device according to claim 4, characterized in that: The plane of the substrate is substantially parallel to the layers of graphene and hexagonal boron nitride.
6. The electronic device according to claim 4, characterized in that: The circuit (21) comprises one or more layers of copper wires, which are laminated on the first side of the circuit board and, in the case of multiple layers of copper wires, are separated by layers of graphene and hexagonal boron nitride.
7. The electronic device according to any one of claims 1 to 3, characterized in that: The one or more electronic components (3) are field effect transistor chips, and the electronic device is a voltage conversion unit of a vehicle or a charging device integrated with a voltage conversion unit.
8. A circuit board, characterized in that: The circuit board (2) has a first side and a second side opposite to each other, and comprises a substrate (22) and a circuit (21) arranged on the first side of the substrate, wherein the circuit board (2) comprises a polymer matrix and graphene and hexagonal boron nitride mixed in the polymer matrix.
9. The circuit board according to claim 8, characterized in that: The graphene and hexagonal boron nitride form an alternating multilayer structure (201, 202) in the polymer matrix, wherein the plane of the substrate (22) is substantially parallel to the layers of graphene and hexagonal boron nitride, and wherein the circuit (21) comprises one or more layers of copper wire, the one or more layers of copper wire being laminated on the first side of the circuit board, and in the case of multiple layers of copper wire, the multiple layers of copper wire are separated by the layers of graphene and hexagonal boron nitride.
10. A vehicle, characterized in that: The vehicle comprises the electronic device according to any one of claims 1-9.