Manifold micro-channel type radiator and radiating method

Abstract

The invention belongs to the technical field of heat exchange of electronic equipment, and discloses a manifold micro-channel type radiator and a heat dissipation method.The manifold micro-channel type radiator comprises a plurality of radiator modules arranged in a linear array, and each radiator module comprises two symmetrically-arranged heat dissipation units; the heat dissipation unit comprises a manifold distributor and a micro-channel; a cold side manifold channel and a hot side manifold channel are processed on the manifold distributor; the cold side manifold channel is of a channel structure which is reduced in the flowing-in direction of a coolant, and the hot side manifold channel is a uniform-section channel; the width of the hot side manifold channel is greater than the width of the inlet end of the cold side manifold channel; the micro-channel comprises a micro-channel substrate and a micro-channel main body arranged on the micro-channel substrate; the micro-channel main body comprises a cold side micro-channel area and a hot side micro-channel area; the hot side micro-channel area comprises a plurality of hot side micro-channels which are arranged in parallel, and each hot side micro-channel is provided with a plurality of pin fins which are linearly distributed; the purpose of effectively utilizing the cooling potential of the hot side manifold channel is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of heat exchange of electronic equipment, and in particular relates to a manifold microchannel radiator and a heat dissipation method. Background Art

[0002] With the rapid development of artificial intelligence, highly integrated circuits and microelectronic devices have been widely used to enable electronic devices to have more functions, better performance and smaller size; however, the high integration of electronic devices leads to the emergence of high heat flux per unit area; according to existing research data, the heat flux density of traditional integrated circuits has reached 100W / cm², while in some special electronic devices, the heat flux density can be as high as 500W / cm², or even exceed 1000W / cm²; for example: advanced radar, high-power IGBT (Insulated Gate Bipolar Transistor) and high-power laser diode arrays; since the high operating temperature of electronic equipment can easily reduce its safety, operating life and performance, research on heat dissipation of electronic equipment has become an important direction of scientific and technological development.

[0003] Microchannel heat sinks have become an important solution to the thermal management problems of high heat flux density electronic chips due to their compact structure, high efficiency, light weight, safety and other superior properties. However, traditional microchannel heat sinks have been unable to meet the thermal management performance requirements of the new generation of electronic equipment. Specifically, in the existing microchannel cooling technology, most of the focus is on the optimization of the cold manifold side, while there is less research on the hot manifold side. Although the optimization of the cold manifold side can improve the cooling effect, in actual applications, the cooling potential of the hot manifold side has not been fully explored and utilized, which can easily lead to problems such as uneven cooling, complex structure and high pressure drop, limiting the efficiency and application scope of microchannel heat sinks. Summary of the invention

[0004] In view of the technical problems existing in the prior art, the present invention provides a manifold microchannel radiator and a heat dissipation method to solve the technical problems that the traditional microchannel radiator easily leads to uneven cooling, complex structure and high pressure drop.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: The present invention provides a manifold microchannel radiator, comprising a plurality of radiator modules arranged in a linear array, each radiator module comprising two symmetrically arranged radiating units; the radiating units comprising a manifold distributor and a microchannel; the manifold distributor is arranged directly above the microchannel; The manifold distributor is processed with a cold side manifold channel and a hot side manifold channel; the cold side manifold channel is a channel structure that decreases along the coolant inflow direction, and the hot side manifold channel is a channel with a constant cross-section; wherein the width of the hot side manifold channel is greater than the inlet end width of the cold side manifold channel; The microchannel includes a microchannel substrate and a microchannel body arranged on the microchannel substrate; the microchannel body includes a cold side microchannel area and a hot side microchannel area; the hot side microchannel area includes a plurality of hot side microchannels arranged in parallel, and each of the hot side microchannels is provided with a plurality of linearly distributed pin fins.

[0006] Furthermore, the cold side microchannel area includes a plurality of cold side microchannels arranged in parallel, and the cold side microchannels and the hot side microchannels are arranged in parallel with each other; wherein the width of the cold side microchannel is smaller than the width of the hot side microchannel.

[0007] Furthermore, the sum of the width of the cold side microchannel and the width of the cold side microchannel interval is equal to the sum of the width of the hot side microchannel and the width of the hot side microchannel interval; wherein the cold side microchannel interval is the interval between two adjacent cold side microchannels, and the hot side microchannel interval is the interval between two adjacent hot side microchannels.

[0008] Furthermore, the arrangement direction of the plurality of pin-fins on the hot-side microchannel is perpendicular to the flow direction of the coolant in the hot-side manifold channel.

[0009] Furthermore, the cross-section of the pin fin is a circular structure.

[0010] Furthermore, the cold-side manifold channel and the hot-side manifold channel are separated by a rib wall body.

[0011] Furthermore, a first end rib wall is provided at the end of the cold side manifold channel, and the first end rib wall is connected to the first side wall of the rib wall body; a second end rib wall is provided at the inlet end of the hot side manifold channel, and the second end rib wall is connected to the second side wall of the rib wall body.

[0012] Furthermore, the inlet width of the cold side manifold channel is 150 μm, and the end width of the cold side manifold channel is 50 μm; the inlet width and the end width of the hot side manifold channel are both 175 μm.

[0013] Furthermore, the width of the cold side microchannel is 30 μm, and the width of the hot side microchannel is 40 μm; the sum of the width of the cold side microchannel and the width of the cold side microchannel interval and the sum of the width of the hot side microchannel and the width of the hot side microchannel interval are both 60 μm.

[0014] The present invention also provides a heat dissipation method, comprising: The manifold microchannel heat sink is installed on the electronic device to be cooled; wherein the outer surface of the microchannel substrate is connected to the electronic device to be cooled; When the electronic device to be cooled is in operation, the coolant enters the microchannel body through the cold-side manifold channel, and after heat exchange in the microchannel body, flows out through the hot-side manifold channel.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The manifold microchannel radiator provided by the present invention designs the hot side manifold channel as a channel with equal cross-section, and designs the width of the hot side manifold channel to be larger than the inlet end width of the cold side manifold channel, so that the coolant can be more evenly distributed in the entire hot side manifold channel, thereby significantly reducing the wall temperature, improving the temperature uniformity, avoiding the hot spot problem, achieving the purpose of effectively utilizing the cooling potential of the hot side manifold channel, and enhancing the overall cooling effect; secondly, by adding pin fins in the hot side microchannel, the direct convection heat exchange in the hot side microchannel is converted into an outward swept single-row tube bundle flow, which not only effectively increases the heat exchange surface of the hot side microchannel The present invention can also significantly enhance the convective heat transfer by destroying the formation of the flow interface layer in the microchannel based on the tube bundle, so as to greatly improve the hot spot temperature and temperature uniformity of the heat exchange surface, thereby enhancing the cooling effect; the present invention optimizes the structure of the hot manifold side to reduce the flow resistance in the hot side manifold channel, thereby reducing the pressure drop of the overall system, significantly improving the performance of the microchannel radiator, not only achieving efficient heat dissipation, but also reducing the system pressure drop, providing a new solution for the heat dissipation of electronic equipment with high heat flux density; the radiator can dissipate up to 1425W / cm at a pressure drop of 9762.9Pa 2 The heat flux density is greatly improved, which significantly improves the performance of microchannel cooling technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the overall structure of the manifold microchannel radiator provided in Example 1; Figure 2 is a schematic diagram of the three-dimensional structure of the heat dissipation unit in Example 1; Figure 3 This is a top view of the heat dissipation unit in Example 1.

[0018] Among them, 1 is a manifold distributor, 2 is a microchannel; 11 is a cold side manifold channel, 12 is a hot side manifold channel, 13 is a rib wall body, 14 is a first end rib wall, 15 is a second end rib wall; 21 is a microchannel substrate, 22 is a microchannel body; 221 is a cold side microchannel region, 222 is a hot side microchannel region, 223 is a cold side microchannel, 224 is a hot side microchannel, and 225 is a pin fin. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects solved by this application clearer, the technical solutions in the embodiments of this application will be described clearly and completely in combination with the drawings in the embodiments of this application; obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] Example 1 As attached Figure 1-3 As shown, this embodiment 1 provides a manifold microchannel radiator, including a plurality of radiator modules arranged in a linear array, each radiator module including two symmetrically arranged heat dissipation units; the heat dissipation unit includes a manifold distributor 1 and a microchannel 2; the manifold distributor 1 is arranged directly above the microchannel 2.

[0021] The manifold distributor 1 is processed with a cold side manifold channel 11 and a hot side manifold channel 12; the cold side manifold channel 11 is a channel structure that decreases along the coolant inflow direction, and the hot side manifold channel 12 is a channel with a constant cross section; wherein the width of the hot side manifold channel 12 is greater than the inlet end width of the cold side manifold channel 11; In this embodiment 1, the cold-side manifold channel 11 and the hot-side manifold channel 12 are blocked by a rib wall body 13; a first end rib wall 14 is also provided at the end of the cold-side manifold channel 11, and the first end rib wall 14 is connected to the first side wall of the rib wall body 13; a second end rib wall 15 is also provided at the inlet end of the hot-side manifold channel 12, and the second end rib wall 15 is connected to the second side wall of the rib wall body 13.

[0022] The microchannel 2 includes a microchannel substrate 21 and a microchannel body 22 arranged on the microchannel substrate 21; the microchannel body 22 includes a cold side microchannel area 221 and a hot side microchannel area 222; the cold side microchannel area 221 is located directly below the cold side manifold channel 11, and the hot side microchannel area 222 is located directly below the hot side manifold channel 12; the cold side microchannel area 221 includes a plurality of cold side microchannels 223 arranged in parallel, and the hot side microchannel area 222 includes a plurality of hot side microchannels 224 arranged in parallel; wherein the cold side microchannel 223 and the hot side microchannel 224 are arranged parallel to each other; each of the hot side microchannels 224 is provided with a plurality of linearly distributed pin fins 225, and the arrangement direction of the plurality of pin fins 225 on the hot side microchannel 224 is perpendicular to the flow direction of the coolant in the hot side manifold channel 12; the cross section of the pin fin 225 is a circular structure.

[0023] The width of the cold side microchannel 223 is smaller than the width of the hot side microchannel 224; the sum of the width of the cold side microchannel 223 and the width of the cold side microchannel interval is equal to the sum of the width of the hot side microchannel 224 and the width of the hot side microchannel interval; wherein the cold side microchannel interval is the interval between two adjacent cold side microchannels 223, and the hot side microchannel interval is the interval between two adjacent hot side microchannels 224.

[0024] It should be noted that the cold side microchannel 223 in the cold side microchannel area 221 is connected to the hot side microchannel 224 in the hot side microchannel 222 in a one-to-one correspondence; when the coolant enters the microchannel body 22, it flows through the cold side microchannel 223 and the hot side microchannel 224 successively, and then flows out from the hot side manifold channel 12.

[0025] Dimensional features: The thickness of the microchannel substrate is h b = 50 μm, the height of the manifold distributor and the height of the microchannel are h div =275 μm and h c = 125 μm; manifold length ( L ) is 1.2 mm, and the microchannel length W 0.4mm; the cold manifold inlet width is W c1 =150μm, the width of the cold manifold end is W c2 =50μm. The inlet width of the heat manifold is W h1 = 175 μm, the width of the heat manifold end is W h2=175μm. Microchannel inlet and outlet width w c,in and w c,out 30μm and 40μm respectively. w c,in and w f,in The sum of w c,out and w f,out The total diameter of the pin fins is 60 μm. There are 5 pin fins on the heat manifold side, and the diameter of each pin fin is 14 μm.

[0026] Working principle: The hot manifold and cold manifold in the manifold distributor are located on both sides of the microchannel body. The coolant enters the lower microchannel through the cold manifold to fully exchange heat with the heat exchange surface, thereby taking away the heat from the heating surface; the hot manifold side adopts a manifold design with uniform width and wider width, which can significantly reduce the overall pressure drop compared with the tapered or expanded structure of the hot manifold side. The microchannel body includes multiple microchannels with uniform width, narrow inlet and wide outlet, which are used with fins to enhance the cooling effect. The arrangement of the microchannels ensures that the coolant can be evenly distributed on the entire hot manifold side, significantly reducing the wall temperature, improving temperature uniformity, and avoiding hot spot problems.

[0027] The manifold microchannel radiator described in this embodiment 1 has a manifold distributor on the upper layer and a microchannel body on the lower layer. The radiator adopts a microchannel design with uniform and wider width on the hot manifold side, rather than increasing the manifold width along the overall flow direction. This design can greatly improve the cooling efficiency on the hot manifold side and reduce the pressure drop of the overall system. In addition, the present invention also adds pin fins in the microchannel on the hot manifold side to further enhance the cooling effect, and adopts a narrow inlet and wide outlet design for the microchannel inlet and outlet to adapt to the pin fins on the hot manifold side. Normally, the coolant flows from the cold manifold into the lower microchannel, where it conducts concentrated heat exchange with the heat exchange surface, and then flows out from the hot manifold; in actual applications, the present invention can dissipate up to 1425W / cm at a pressure drop of 9762.9Pa. 2 The heat flux density of the microchannel cooling technology is significantly improved. In the optimized design of the heat manifold side, the width and arrangement of the microchannels are precisely calculated to ensure that the coolant can be evenly distributed, thereby improving the overall cooling effect and reducing the energy consumption of the system. This innovative design method is not only suitable for the heat dissipation needs of current high heat flux density electronic chips, but also provides new ideas for more efficient and low-energy thermal management solutions in the future.

[0028] Example 2 The structure and principle of the manifold microchannel radiator provided in this embodiment 2 are basically the same as those of the manifold microchannel radiator described in the above embodiment 1, except that: In this embodiment 2, a cover plate is further included; the cover plate is provided with a coolant inlet and a coolant outlet, the coolant inlet is used to be connected to the inlet end of the cold side manifold channel 11, and the coolant outlet is used to be connected to the end of the hot side manifold channel 12; wherein the coolant inlet on the cover plate serves as an inflow channel for the coolant, and the coolant outlet serves as a discharge channel for the coolant after heat exchange.

[0029] Example 3 This embodiment 3 provides a heat dissipation method, which uses the manifold microchannel heat sink described in the above embodiment 1 or embodiment 2, and includes the following steps: The manifold microchannel heat sink is installed on the electronic device to be cooled; wherein the outer surface of the microchannel substrate 21 is connected to the electronic device to be cooled; When the electronic device to be cooled is in operation, the coolant enters the microchannel body 22 through the cold-side manifold channel 11, and after heat exchange in the microchannel body 22, flows out through the hot-side manifold channel 12; wherein, after the coolant enters the microchannel body 22, it flows successively through the cold-side microchannel 223 and the hot-side microchannel 224, and fully exchanges heat in the process of flowing through the cold-side microchannel 223 and the hot-side microchannel 224.

[0030] In the present invention, a manifold design with uniform and wider width is adopted on the hot manifold side, so that the coolant can be more evenly distributed on the entire hot manifold side, thereby significantly reducing the wall temperature, improving temperature uniformity, and avoiding hot spot problems. This design effectively utilizes the cooling potential of the hot manifold side and enhances the overall cooling effect; by optimizing the structural design of the hot manifold side, the flow resistance is reduced on the wider hot manifold side, thereby reducing the pressure drop of the overall system. This design not only improves the cooling efficiency, but also reduces the energy consumption of the cooling system, and is suitable for high-efficiency and energy-saving heat dissipation requirements; the present invention can dissipate up to 1425W / cm at a pressure drop of 9762.9Pa. 2 The heat flux density is greatly improved, which significantly improves the performance of microchannel cooling technology.

[0031] The present invention significantly improves the performance of the microchannel radiator by optimizing the structure of the heat manifold side, not only achieving efficient heat dissipation, but also reducing the system pressure drop, providing a new solution for the heat dissipation of electronic devices with high heat flux density. In the context of the rapid development of big data and artificial intelligence, this innovative design has important application prospects and market value, and can effectively cope with the increasing power consumption and heat dissipation challenges of electronic devices.

[0032] The above embodiment is only one of the implementation methods that can realize the technical solution of the present invention. The scope of protection claimed by the present invention is not limited only to this embodiment, but also includes changes, replacements and other implementation methods that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed by the present invention.

Claims

1. A manifold microchannel radiator, characterized in that: It comprises a plurality of heat sink modules arranged in a linear array, each heat sink module comprising two symmetrically arranged heat sink units; the heat sink unit comprises a manifold distributor (1) and a microchannel (2); the manifold distributor (1) is arranged directly above the microchannel (2); The manifold distributor (1) is machined with a cold-side manifold channel (11) and a hot-side manifold channel (12); the cold-side manifold channel (11) is a channel structure that tapers along the coolant inflow direction, and the hot-side manifold channel (12) is a channel with a constant cross-section; wherein the width of the hot-side manifold channel (12) is greater than the inlet end width of the cold-side manifold channel (11); The microchannel (2) comprises a microchannel substrate (21) and a microchannel body (22) arranged on the microchannel substrate (21); the microchannel body (22) comprises a cold side microchannel region (221) and a hot side microchannel region (222); the hot side microchannel region (222) comprises a plurality of hot side microchannels (224) arranged in parallel, and each of the hot side microchannels (224) is provided with a plurality of linearly distributed pin fins (225).

2. A manifold microchannel radiator according to claim 1, characterized in that: The cold side microchannel region (221) comprises a plurality of cold side microchannels (223) arranged in parallel, wherein the cold side microchannels (223) and the hot side microchannels (224) are arranged in parallel with each other; wherein the width of the cold side microchannels (223) is smaller than the width of the hot side microchannels (224).

3. A manifold microchannel radiator according to claim 2, characterized in that: The sum of the width of the cold side microchannel (223) and the width of the cold side microchannel interval is equal to the sum of the width of the hot side microchannel (224) and the width of the hot side microchannel interval; wherein the cold side microchannel interval is the interval between two adjacent cold side microchannels (223), and the hot side microchannel interval is the interval between two adjacent hot side microchannels (224).

4. The manifold microchannel radiator according to claim 1, characterized in that: The arrangement direction of the plurality of pin fins (225) on the hot side microchannel (224) is perpendicular to the flow direction of the coolant in the hot side manifold channel (12).

5. A manifold microchannel radiator according to claim 4, characterized in that: The cross section of the pin fin (225) is a circular structure.

6. The manifold microchannel radiator according to claim 1, characterized in that: The cold-side manifold channel (11) and the hot-side manifold channel (12) are blocked by a rib wall body (13).

7. A manifold microchannel radiator according to claim 6, characterized in that: A first end rib wall (14) is also provided at the end of the cold side manifold channel (11), and the first end rib wall (14) is connected to the first side wall of the rib wall body (13); a second end rib wall (15) is also provided at the inlet end of the hot side manifold channel (12), and the second end rib wall (15) is connected to the second side wall of the rib wall body (13).

8. The manifold microchannel radiator according to claim 1, characterized in that: The inlet end width of the cold side manifold channel (11) is 150 μm, and the end width of the cold side manifold channel (11) is 50 μm; the inlet end and end width of the hot side manifold channel (12) are both 175 μm.

9. The manifold microchannel radiator according to claim 3, characterized in that: The width of the cold side microchannel (223) is 30 μm, and the width of the hot side microchannel (224) is 40 μm; the sum of the width of the cold side microchannel (223) and the width of the cold side microchannel interval, and the sum of the width of the hot side microchannel (224) and the width of the hot side microchannel interval are both 60 μm.

10. A heat dissipation method, characterized in that: include: The manifold microchannel heat sink according to any one of claims 1 to 9 is mounted on an electronic device to be cooled; wherein the outer surface of the microchannel substrate (21) is connected to the electronic device to be cooled; When the electronic device to be cooled is in operation, the coolant enters the microchannel body (22) through the cold-side manifold channel (11), and after heat exchange in the microchannel body (22), flows out through the hot-side manifold channel (12).

Images