Sound wave probe and sound receiving system

By arranging the circuit board of the sonic probe in a sealed cavity and transmitting the sonic signal through the pressure-bearing joint components and leads, the problem of aging or corrosion of the traditional sonic probe circuit board in a high-temperature and high-pressure environment is solved and higher stability is achieved. and reliability.

CN119335516APending Publication Date: 2025-01-21INST OF ACOUSTICS CHINESE ACAD OF SCI
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Patent Information

Application Number
CN202411502031.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2025-01-21

AI Technical Summary

Technical Problem

In high-temperature and high-pressure well logging environments, the circuit board of traditional acoustic probes is easily aged or corroded due to changes in the chemical properties and stability of the silicone oil, affecting the stability and reliability of the probe.

Method used

Design a sound wave probe, the circuit board is set in the sealing cavity formed by the pressure joint component and the pressure compartment. Press the joint component to achieve the isolation of the circuit board and silicon oil.

Benefits of technology

Effectively protect the stability of the circuit board in the high temperature and high -voltage environment, and improve the overall stability and reliability of the sound wave probe and the acoustic system.

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Abstract

The invention discloses a sound wave probe and a receiving sound system. The sonic probe comprises a receiving transducer, a circuit board, a pressure-bearing cabin and a pressure-bearing joint assembly, the pressure-bearing joint assembly is mounted at the opening of the pressure-bearing cabin, the pressure-bearing joint assembly and the pressure-bearing cabin form a sealed cavity, and the circuit board is arranged in the sealed cavity; the receiving transducer is arranged on the outer side wall surface of the pressure-bearing cabin, receives a sound wave signal reflected by a target object, and transmits the sound wave signal to the circuit board through a first lead wire and a pressure-bearing joint assembly which are connected in sequence; the circuit board processes the sound wave signals and transmits the processed sound wave signals outwards through the pressure-bearing connector assembly and the second lead which are connected in sequence. The circuit board is arranged in the sealed cavity, sound wave signals are obtained from the receiving transducer and processed according to the pressure-bearing connector assembly and the first lead, and the processed sound wave signals are transmitted outwards according to the pressure-bearing connector assembly and the second lead; therefore, the circuit board is protected during detection, and the stability of the sound wave probe and a receiving sound system is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of long-range detection of earth acoustic waves in mines, and in particular to an acoustic wave probe and a receiving acoustic system. Background Art

[0002] In high-temperature and high-pressure logging environments, the acoustic probe usually needs to be immersed in silicone oil to effectively transmit the acoustic signal and protect it from the influence of the external high-temperature and high-pressure environment. However, in traditional acoustic probes, the circuit board is often also placed in silicone oil. The chemical properties and stability of the silicone oil itself may change in a long-term high-temperature and high-pressure environment, which may affect its compatibility with the circuit board material, causing aging or corrosion problems on the circuit board, and failing to exert the stability and reliability of the acoustic probe. Summary of the invention

[0003] The present application discloses an acoustic wave probe and an acoustic receiving system.

[0004] In a first aspect, an acoustic wave probe is disclosed. The acoustic wave probe comprises: a receiving transducer, a circuit board, a pressure chamber and a pressure joint assembly; wherein:

[0005] The pressure-bearing joint is installed at the opening of the pressure-bearing cabin, and forms a sealed cavity with the pressure-bearing cabin, wherein the circuit board is arranged in the sealed cavity;

[0006] The receiving transducer is arranged on the outer wall of the pressure chamber, and is used to receive the sound wave signal reflected by the target object, and transmit the sound wave signal to the circuit board through the first lead and the pressure joint assembly connected in sequence;

[0007] The circuit board is used for processing the acoustic wave signal and transmitting the processed acoustic wave signal to the outside through the pressure-bearing joint assembly and the second lead wire which are connected in sequence.

[0008] In a possible implementation, the receiving transducer is disposed on a groove on the outer wall of the pressure chamber.

[0009] In a possible embodiment, the pressure-bearing joint assembly includes a pressure-bearing assembly and a power supply assembly; the pressure-bearing assembly is used to withstand external pressure and form a sealed cavity with the pressure chamber; the power supply assembly is used to electrically connect the circuit board with the first lead, and to electrically connect the circuit board with the second lead.

[0010] In a possible implementation manner, the pressure-bearing joint assembly further includes a fixing assembly for fixing the second lead.

[0011] In a possible implementation manner, the probe further includes a soundproof cover; the soundproof cover is connected to the pressure cabin and is used to protect the pressure joint assembly.

[0012] In a possible implementation, a connection hole is provided on the opening side of the pressure cabin, and a corresponding connection hole is provided on the side of the sound insulation cover connected to the pressure cabin; the connection hole is used to connect the pressure cabin and the sound insulation cover.

[0013] In a possible implementation manner, a connection hole for connecting the pressure chamber and other acoustic wave probes is provided on the other side of the pressure chamber opposite to the opening side.

[0014] In a possible implementation manner, the sound insulation enclosure is provided with an opening for leading the first lead wire and the second lead wire out of the sound insulation enclosure.

[0015] In a possible implementation manner, the acoustic wave probe further includes a gasket for fixing the position of the circuit board in the sealed cavity.

[0016] In a second aspect, a sound receiving system is disclosed, comprising: the sound wave probe as described in any one of the first aspects.

[0017] The acoustic wave probe provided in the present application is configured such that a circuit board is disposed in a sealed cavity formed by a pressure-bearing joint assembly and a pressure-bearing cabin; and according to the pressure-bearing joint assembly and the first lead connected in sequence, the circuit board obtains and processes the acoustic wave signal reflected by the target object from the receiving transducer, and then transmits the processed acoustic wave signal to the outside through the pressure-bearing joint assembly and the second lead connected in sequence, thereby achieving protection of the circuit board in a high-temperature and high-pressure logging environment and improving the stability of the acoustic wave probe and the receiving acoustic system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 One of the structural schematic diagrams of an acoustic wave probe provided in an embodiment of the present application;

[0020] Figure 2 A second structural schematic diagram of an acoustic wave probe provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structure of a receiving sound system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be described below in conjunction with the accompanying drawings. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0023] In the description of the embodiments of the present application, words such as "exemplary", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary", "for example" or "for example" is intended to present related concepts in a concrete way.

[0024] In the description of the embodiments of the present application, the term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, B exists alone, and A and B exist at the same time. In addition, unless otherwise specified, the term "plurality" means two or more.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprises", "has" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0026] In high-temperature and high-pressure logging environments, traditional logging methods such as electromagnetic and nuclear magnetic resonance may be limited, while acoustic remote detection technology can provide stable and reliable geological data. Acoustic remote detection is a technology that uses sound waves for long-distance detection and positioning. It usually involves sending sound wave signals to the target area and determining the location, shape or other characteristics of the target based on the received echo. For example, by measuring the propagation speed and attenuation characteristics of sound waves in underground rocks, acoustic remote detection technology can accurately analyze the lithology, pore structure and fluid properties of the formation, such as the distribution of oil, water and gas. These data are crucial for oilfield exploration, reservoir evaluation and production optimization, helping engineers monitor downhole conditions in real time and make accurate decisions, thereby improving oil and gas production efficiency and economic benefits.

[0027] However, in the above detection environment, the acoustic wave probe usually needs to be immersed in silicone oil, using silicone oil as a lubricant and insulating medium in a high temperature and high pressure environment, and the silicone oil is used to effectively transmit the acoustic wave signal and protect it from the influence of the external high temperature and high pressure environment. However, in traditional acoustic wave probes, the circuit board is often also placed in silicone oil. The chemical properties and stability of the silicone oil itself may change in a long-term high temperature and high pressure environment, which may affect its compatibility with the circuit board material, causing aging or corrosion problems on the circuit board, and failing to exert the stability and reliability of the acoustic wave probe.

[0028] In view of this, the present application proposes an acoustic wave probe and a receiving sound system, which arranges a circuit board in a sealed cavity formed by a pressure-bearing joint assembly and a pressure-bearing cabin; and according to the pressure-bearing joint assembly and the first lead connected in sequence, the circuit board obtains and processes the acoustic wave signal reflected by the target object from the receiving transducer, and then transmits the processed acoustic wave signal to the outside through the pressure-bearing joint assembly and the second lead connected in sequence, thereby isolating the circuit board from the silicone oil, thereby protecting the circuit board in a high-temperature and high-pressure logging environment, and improving the stability of the acoustic wave probe and the receiving sound system.

[0029] The acoustic wave probe provided in this specification is described in detail below in conjunction with the accompanying drawings.

[0030] like Figure 1 One of the structural schematic diagrams of an acoustic wave probe is shown in FIG. Figure 1 As shown, an acoustic wave probe includes a receiving transducer 1, a circuit board 2, a pressure chamber 3 and a pressure joint assembly 4.

[0031] The pressure-bearing joint assembly 4 is installed at the opening of the pressure-bearing chamber 3 to form a sealed cavity with the pressure-bearing chamber 3, wherein the circuit board 2 is arranged in the sealed cavity to achieve isolation between the circuit board 2 and the silicone oil.

[0032] In order to make the circuit board 2 work stably under high temperature and high pressure, in a possible implementation, the material of the pressure chamber 3 can be stainless steel, titanium alloy or other materials that are resistant to high temperature, high pressure, chemical corrosion and mechanical stress.

[0033] In order to fix the position of the circuit board 2 in the sealed cavity, in a possible implementation manner, as Figure 1 As shown, the acoustic wave probe further includes a gasket 6, and the circuit board 2 is fixed by arranging the gasket 6 between the circuit board 2 and the bottom of the sealed cavity.

[0034] After the acoustic wave transmitter emits an acoustic wave signal outward with an appropriate frequency and amplitude, the acoustic wave signal is reflected by different substances in the formation, and is effectively received and recorded by the receiving transducer 1 arranged on the outer wall of the pressure chamber 3, and the reflected acoustic wave signal is transmitted to the circuit board 2 for processing through the first lead and the pressure joint assembly 4 connected in sequence.

[0035] Among them, the receiving transducer 1 is a device that can convert an acoustic wave signal from an acoustic signal to an electrical signal, or convert an electrical signal into an acoustic signal. For example, it can be an acoustic wave sensor in the form of a piezoelectric ceramic crystal, or it can also be an acoustic wave sensor in other forms such as a capacitive sensor, a piezoelectric film, etc.

[0036] In a possible implementation, in order to protect the receiving transducer 1 , a groove may be provided on the outer wall surface of the pressure chamber 3 ; the receiving transducer 1 is arranged on the groove to reduce the collision between the receiving transducer 1 and the outside.

[0037] The circuit board 2 is an electronic circuit board inside the acoustic wave probe, which is used to support and connect various electronic components, such as amplifiers, filters, and analog-to-digital converters. These electronic components and circuits are arranged and connected on the circuit board to form a complete electronic system. After the circuit board 2 obtains the acoustic wave signal from the receiving transducer 1, the electronic components can amplify, filter, condition or otherwise process the received acoustic wave signal to optimize the quality of the acoustic wave signal.

[0038] After the circuit board 2 processes the sound wave signal, the circuit board 2 transmits the processed sound wave signal to the outside through the pressure-bearing joint assembly 4 and the second lead connected in sequence, thereby realizing communication transmission between the sound wave probe and the outside world.

[0039] In a possible embodiment, the pressure-bearing joint assembly 4 may include a pressure-bearing assembly 41 and a power supply assembly 42; the pressure-bearing assembly 41 is used to withstand external pressure and form a sealed cavity with the pressure chamber 3; the power supply assembly 42 is used to electrically connect the circuit board 2 and the first lead, and to electrically connect the circuit board 2 and the second lead.

[0040] In order to fix the second lead, in some possible implementations, such as Figure 2 As shown, the pressure-bearing joint assembly 4 further includes a fixing assembly 43 , which is configured to fix the second lead by arranging the second lead in the fixing assembly 43 and transmitting the second lead from one end of the fixing assembly 43 .

[0041] To protect the pressure-bearing joint assembly 4, in a possible implementation manner, Figure 2 As shown, the acoustic wave probe further includes a sound insulation cover 5.

[0042] The material of the sound insulation cover 5 can be rubber, polytetrafluoroethylene and other sound insulation materials; in special cases, according to actual needs, rubber or polymer, foam plastic can also be used as the internal filling material of the sound insulation cover 5 to effectively absorb and reduce sound wave reflection and interference, and improve the accuracy of measurement.

[0043] In a specific embodiment, the soundproof enclosure 5 is provided with an opening for allowing the first lead to pass through the soundproof enclosure 5, and an opening for allowing the second lead to pass through the soundproof enclosure 5. The first lead is connected from the receiving transducer to the pressure joint assembly 4 through the through hole on the soundproof enclosure 5; similarly, the second lead is connected from the pressure joint assembly 4 to the outside through the through hole on the soundproof enclosure 5.

[0044] In a specific embodiment, a side of the soundproof enclosure 5 connected to the pressure cabin 3 and an opening side of the pressure cabin 3 are both provided with corresponding connection holes, and the pressure cabin 3 and the soundproof enclosure 5 are connected through the connection holes.

[0045] In a high-temperature and high-pressure logging environment, multiple acoustic wave probes are usually required to measure the well at the same time. In order to connect other acoustic wave probes, in a specific implementation, such as Figure 2 As shown, the side of the soundproof cover 5 that is not connected to the pressure cabin 3 is provided with a connection hole for connecting other sound wave probes.

[0046] Correspondingly, in a possible implementation manner, Figure 1 As shown, the other side of the pressure chamber 3 opposite to the opening side is provided with a connection hole for connecting the pressure chamber 3 and other acoustic wave probes. The connection hole for connecting the pressure chamber 3 and other acoustic wave probes can be connected to the connection hole of the sound insulation cover 5 on other acoustic wave probes, or to the connection hole on the pressure chamber 3 of other acoustic wave probes, or to other parts of other acoustic wave probes.

[0047] When multiple acoustic wave probes are connected, in order to facilitate the connection of multiple acoustic wave probes, in a possible implementation, the acoustic wave probe further includes a through-line for connecting the second lead wire with other acoustic wave probes. The through-line is arranged outside the pressure cabin 3 and the soundproof cover 5, and connects the second lead wire of the acoustic wave probe to other acoustic wave probes or external communication equipment.

[0048] The present application also provides a receiving sound system, which includes any of the above-mentioned sound wave probes. Figure 3 A schematic diagram of the structure of a receiving sound system is shown in FIG. Figure 3 As shown, the receiving sound system includes a plurality of sound wave probes.

[0049] By installing multiple sonic probes in the receiving acoustic system, sonic signals can be sent and received from different angles and positions, obtaining more comprehensive geological information and increasing the reliability and accuracy of the data. At the same time, the use of multiple sonic probes can increase the depth and range of detection. The position of each sonic probe can be optimized to cover as much stratum volume as possible in the vertical and horizontal directions, thereby obtaining more detailed underground structure information.

[0050] It is important to note that multiple sonic probes can be set up to receive sonic probes of different frequencies to detect formations of different depths and characteristics. For example, a low-frequency probe is suitable for deep detection, while a high-frequency probe can provide higher-resolution measurements, so using sonic probes of multiple frequencies in the same logging task can fully utilize the flexibility and versatility of sonic technology.

[0051] The above specific implementation methods further illustrate the purpose, technical solutions and beneficial effects of the present application in detail. It should be understood that the above are only specific implementation methods of the present application and are not used to limit the protection scope of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the present application should be included in the protection scope of the present application.

Claims

1. An acoustic wave probe, characterized in that: It comprises a receiving transducer (1), a circuit board (2), a pressure chamber (3) and a pressure joint assembly (4); wherein: The pressure-bearing joint assembly (4) is installed at the opening of the pressure-bearing chamber (3) and forms a sealed cavity with the pressure-bearing chamber (3), wherein the circuit board (2) is arranged in the sealed cavity; The receiving transducer (1) is arranged on the outer wall surface of the pressure chamber (3) and is used to receive the sound wave signal reflected by the target object and transmit the sound wave signal to the circuit board (2) through the first lead wire and the pressure joint assembly (4) connected in sequence; The circuit board (2) is used to process the sound wave signal and transmit the processed sound wave signal to the outside through the pressure-bearing joint assembly (4) and the second lead wire which are connected in sequence.

2. The acoustic wave probe according to claim 1, characterized in that: The receiving transducer (1) is arranged on a groove on the outer wall of the pressure chamber (3).

3. The acoustic wave probe according to claim 1, characterized in that: The pressure-bearing joint assembly (4) comprises a pressure-bearing assembly (41) and a power supply assembly (42); the pressure-bearing assembly (41) is used to withstand external pressure and to form a sealed cavity with the pressure-bearing chamber (3); the power supply assembly (42) is used to electrically connect the circuit board (2) and the first lead, and to electrically connect the circuit board (2) and the second lead.

4. The acoustic wave probe according to claim 1, characterized in that: The pressure-bearing joint assembly (4) further comprises a fixing assembly (43) for fixing the second lead wire.

5. The acoustic wave probe according to claim 1, characterized in that: The probe further comprises a soundproof cover (5); the soundproof cover (5) is connected to the pressure chamber (3) and is used to protect the pressure joint assembly (4).

6. The acoustic wave probe according to claim 5, characterized in that: The opening side of the pressure cabin (3) and the side of the sound insulation cover (5) used for connecting the pressure cabin (3) are both provided with corresponding connection holes; the connection holes are used to connect the pressure cabin (3) and the sound insulation cover (5).

7. The acoustic wave probe according to claim 6, characterized in that: A connection hole for connecting the pressure chamber (3) and other sonic wave probes is provided on the other side of the pressure chamber (3) opposite to the opening side.

8. The acoustic wave probe according to claim 5, characterized in that: The soundproof enclosure (5) is provided with an opening for leading the first lead wire and the second lead wire out of the soundproof enclosure (5).

9. The acoustic wave probe according to claim 1, characterized in that: The acoustic wave probe further comprises a gasket (6) for fixing the position of the circuit board (2) in the sealed cavity.

10. A receiving acoustic system, comprising the acoustic wave probe according to any one of claims 1 to 9.