Ceramic light-emitting semiconductor device molding integrated molding method and control system

Abstract

The present invention belongs to the field of semiconductor device packaging technology, and specifically is a ceramic light-emitting semiconductor device molding method and control system. The ceramic light-emitting semiconductor device molding method of the present invention includes: obtaining preset values ​​and preset ranges of various molding parameters, the molding parameters including mold clamping pressure, mold clamping speed, molding temperature, injection pressure, injection speed and curing time; controlling mold clamping according to preset values ​​of mold clamping pressure and mold clamping speed; heating the injection material and the mold according to preset values ​​of molding temperature; injecting the injection material into the mold cavity of the mold according to preset values ​​of injection pressure and injection speed; obtaining the difference between the actual molding parameters and the preset ranges of various molding parameters during the molding process; adjusting the molding parameters in real time during the molding process according to the operating state of the molding equipment and the difference; and controlling the injection material to gradually solidify in the mold. The present invention can improve the molding production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device packaging, and in particular is a ceramic light-emitting semiconductor device integral molding method and control system. Background Art

[0002] Molded packaging of ceramic light-emitting semiconductor devices is widely used in medium and high power LEDs, backlight LEDs, plant lighting, automotive lighting and other fields. Molded packaging of ceramic light-emitting semiconductor devices can provide excellent optical performance and thermal management effects, making the light-emitting devices perform well in high brightness, long life and high reliability. Especially in occasions requiring high precision and high stability, molded packaging can provide good sealing and stability, prevent the influence of the external environment on the chip, and improve the overall reliability of the product. In order to ensure a good packaging effect, molding parameters such as mold closing pressure, mold closing speed, molding temperature, injection pressure, injection speed, etc. are usually formulated according to the packaging process requirements, and then the pre-established parameters are strictly controlled during the molding process. However, since there are many parameters that need to be controlled, the operating status of some molding equipment that has been used for a long time is not very stable. Therefore, it is easy for the actual molding parameters to exceed the allowable range during the molding and packaging process. At present, it can be compensated by timely adjusting the molding parameters of the molding equipment that exceed the allowable range. However, when the molding equipment is not in good operating condition, the adjustment range of these molding parameters that exceed the allowable range is limited and cannot meet the adjustment requirements. At this time, the current molding and packaging operation can only be abandoned and the molding and packaging process can only be carried out again, which affects the production efficiency. Summary of the invention

[0003] In view of this, the present invention provides a ceramic light-emitting semiconductor device integral molding method and a control system thereof to solve the technical problem of reduced production efficiency caused by excessive deviation of actual molding parameters in the prior art.

[0004] The technical solution adopted by the present invention is:

[0005] In a first aspect, the present invention provides a method for integrally molding a ceramic light-emitting semiconductor device, the method comprising:

[0006] Obtaining preset values ​​and preset ranges of various molding parameters, wherein the molding parameters include mold clamping pressure, mold clamping speed, molding temperature, injection pressure, injection speed, and curing time;

[0007] Control mold closing according to preset values ​​of mold closing pressure and mold closing speed;

[0008] Heating the injection material and the mold according to the preset value of the molding temperature;

[0009] Injecting the injection material into the mold cavity of the mold according to preset values ​​of injection pressure and injection speed;

[0010] Obtaining the difference between the actual molding parameters and the preset range of each molding parameter during the molding process;

[0011] Adjusting molding parameters in real time during the molding process according to the operating status of the molding equipment and the differences;

[0012] Control the injection material to gradually solidify in the mold.

[0013] In a second aspect, the present invention provides a control system for integrated molding of ceramic light-emitting semiconductor devices, the system comprising at least one processor, at least one memory and computer program instructions stored in the memory, and when the computer program instructions are executed by the processor, the method described in the first aspect is implemented.

[0014] Beneficial effects: The ceramic light-emitting semiconductor device integrated molding method and control system of the present invention obtains the actual molding parameters during the molding process during the molding and packaging process, and compares the actual molding parameters with the preset range of the molding parameters set in advance to obtain the difference between the two, and adjusts the molding parameters in real time according to the molding parameter adjustment range allowed by the operating state of the molding equipment and the difference between the actual molding parameters and the preset range of the molding parameters. When the performance of the molding equipment is limited, different molding parameters are reasonably coordinated, and the limitations of the adjustment of a single molding parameter are improved through the joint adjustment of the molding parameters, thereby avoiding production rework caused by insufficient adjustment range of the molding parameters and effectively improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0016] Figure 1 It is a front view of the packaging structure of the ceramic light-emitting semiconductor device in the present invention;

[0017] Figure 2 A top view of the packaging structure of the ceramic light-emitting semiconductor device in the present invention;

[0018] Figure 3 It is a schematic diagram of the process of the method for integrally molding a ceramic light-emitting semiconductor device according to the present invention;

[0019] Figure 4 It is a schematic flow chart of a method for adjusting molding parameters in real time during the molding process of the present invention;

[0020] Figure 5A schematic flow chart of a method for determining molding parameters for adjustment in the present invention;

[0021] Figure 6 It is a schematic flow chart of the method for adjusting molding parameters in the present invention;

[0022] Figure 7 It is a schematic flow chart of the method for coordinated adjustment of injection pressure and molding temperature in the present invention;

[0023] Figure 8 It is a schematic flow chart of the method for coordinated adjustment of injection speed and injection pressure in the present invention;

[0024] Fig. 9 It is a flow chart of the method for selecting the molding parameters for indirect adjustment according to the molding parameter association matrix in the present invention;

[0025] Fig.10 It is a flow chart of a method for arranging the adjustment sequence of the third molding parameter according to the disturbance degree in the present invention;

[0026] Fig.11 It is a schematic flow chart of a method for adjusting the third molding parameter according to the deviation amount in the present invention;

[0027] Fig.12 It is a structural schematic diagram of the ceramic light-emitting semiconductor device molding method and control system of the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in combination with the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or regional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or regional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, all within the protection scope of the present invention.

[0029] Example 1

[0030] This embodiment provides a method for molding a ceramic light-emitting semiconductor device in one piece. The product after the molding is as follows: Figure 1 and Figure 2 As shown, Figure 3 As shown, the one-piece molding method comprises:

[0031] S1: obtaining preset values ​​and preset ranges of various molding parameters, wherein the molding parameters include mold clamping pressure, mold clamping speed, molding temperature, injection pressure, injection speed and curing time;

[0032] The preset values ​​of various molding parameters can be set according to the process requirements, which are generally the optimal values ​​that can meet the process requirements. The preset range of the molding parameters is the range of molding parameter changes that are allowed to be set on the basis of the preset values ​​to ensure the process requirements. For example, under the condition of ensuring the process requirements, the minimum value allowed for a molding parameter is a, and the maximum value allowed is b. The preset range of this molding parameter is [a, b].

[0033] S2: Control the mold closing according to the preset values ​​of the mold closing pressure and the mold closing speed;

[0034] The mold closing pressure refers to the pressure applied when the mold is closed, ensuring that the mold is firmly closed to prevent the packaging material from overflowing or the mold from being misaligned when pressurized. The mold closing speed refers to the speed at which the mold closes, which affects the stability of the mold closing and the filling effect of the packaging material. These two parameters can be preset based on experience to control the stability of the mold closing process, prevent the mold from vibrating or impacting during the closing process, and avoid damage to the chip or mold. Place the manufactured semiconductor device in the mold before closing the mold.

[0035] S3: heating the injection material and the mold according to the preset value of the molding temperature;

[0036] In specific implementation, the injection material can be preheated in stages: during the staged preheating process, it can be preheated at a lower temperature first, and then gradually increased to the final temperature to reduce the temperature difference inside the material and ensure uniform preheating.

[0037] S4: injecting the injection material into the mold cavity of the mold according to preset values ​​of injection pressure and injection speed;

[0038] When the injection material and the mold are heated to the preset temperature, the packaging material can be injected into the mold. During the injection process, the flow of the injection material is controlled according to the preset injection pressure and injection speed, so that the injection material can fully fill the mold cavity and the bubbles can be discharged from the mold cavity in time.

[0039] S5: obtaining the difference between the actual molding parameters and the preset range of each molding parameter during the molding process;

[0040] The difference between the actual molding parameters and the preset range of the molding parameters refers to the difference between the actual molding parameters and the preset range. When the actual molding parameters are greater than the upper limit of the preset range, the difference can be quantified as the actual molding parameters minus the upper limit of the preset range. When the actual molding parameters are less than the lower limit of the preset range, the difference can be quantified as the actual molding parameters minus the lower limit of the preset range.

[0041] S6: adjusting molding parameters in real time during the molding process according to the operating state of the molding equipment and the difference;

[0042] The operating state of the molding equipment refers to the various performances that can be achieved when the molding equipment is currently running, and these performances include the ranges within which the various molding parameters of the molding equipment can be adjusted. Ideally, the preset ranges of various molding parameters are set according to the performance that the molding equipment can achieve. However, when the molding equipment occasionally fails and cannot operate in a state that fully meets the process requirements, the ranges that the molding parameters of the molding equipment can achieve cannot meet the preset ranges of various molding parameters. In this embodiment, when there is a large difference between the actual molding parameters and the preset ranges of various molding parameters, the operating state of the molding equipment is first obtained, and then multiple molding parameters are coordinated according to the operating state of the molding equipment. The molding process can be completed even when the molding equipment is not operating well, thereby avoiding production interruptions and affecting production efficiency.

[0043] S7: Control the injection material to gradually solidify in the mold.

[0044] This step controls the solidification of the injection material to transform the packaging material from a liquid or colloidal state to a solid state, fix it around the chip and substrate, and form a stable packaging structure. The solidified packaging material can resist moisture, dust and chemical pollution in the external environment, and protect the LED chip from erosion by the external environment. After solidification, the packaging material has excellent light transmittance and uniformity, which can effectively reduce light loss and improve the light efficiency of the LED. The solidified packaging material and the chip substrate are tightly combined, which helps to dissipate heat and keep the temperature of the chip stable during operation.

[0045] like Figure 4 As shown, in this embodiment, the S6: adjusting the molding parameters in real time during the molding process according to the operating state of the molding equipment and the difference also includes:

[0046] S61: taking the actual molding parameters exceeding the preset range as the target molding parameters;

[0047] During the molding process, the molding parameters are detected to obtain actual molding parameters, and then the detected molding parameters are compared with the preset range of the corresponding molding parameters set in advance, and those actual molding parameters that exceed the preset range are screened out as target molding parameters for analysis and processing.

[0048] S62: Obtaining the actual adjustment range of each molding parameter of the molding equipment according to the operating state of the molding equipment;

[0049] The actual adjustment range of molding parameters is determined by the current state of the molding equipment. When the molding equipment is not in good operating condition, the actual adjustment range of molding parameters is greatly limited. For example, when the injection device of the molding equipment is not operating properly, the range of injection pressure that the molding equipment can currently provide will be reduced. For another example, when the heating system of the molding equipment is not operating properly, the floating range of the molding temperature provided by the molding equipment will also be reduced.

[0050] S63: Determine a molding parameter for adjustment according to the difference between the actual adjustment range and the preset range of the target molding participation;

[0051] This step can analyze the difference between the target molding parameters and the preset range, and then select appropriate molding parameters for adjustment according to the adjustment capability of the molding equipment reflected by the actual adjustment range.

[0052] S64: adjusting the molding parameters that need to be adjusted according to the difference between the target molding parameters and the preset range.

[0053] like Figure 5 As shown, S63: the method for determining the molding parameters for adjustment according to the difference between the actual adjustment range and the target molding participation preset range specifically includes:

[0054] S631: Obtaining an actual adjustment range of a molding parameter corresponding to a target molding parameter;

[0055] For example, if the target molding parameter is injection pressure, then the actual adjustment range of the injection pressure of the molding equipment is obtained; for example, if the target molding parameter is injection speed, then the actual adjustment range of the injection speed of the molding equipment is obtained.

[0056] S632: judging whether the individual adjustment amount of the target molding parameter exceeds the actual adjustment range according to the target molding parameter, the preset range corresponding to the target molding parameter, and the actual adjustment range;

[0057] The individual adjustment amount of the target molding parameter refers to the amount by which the target molding parameter needs to be adjusted when the target molding parameter is adjusted to the preset range of the corresponding molding parameter. For example, if the target molding parameter is the actual molding temperature T, and the corresponding preset range is [Tmin, Tmax], if T>Tmax, then the individual adjustment amount of the target molding parameter is T-Tmax, and if Tmin>T, then the individual adjustment amount of the target molding parameter is T-Tmin. Since the actual adjustment range of the molding equipment is limited, if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range, simply adjusting the target molding parameter cannot meet the process requirements.

[0058] S633: If the actual adjustment range is not exceeded, the target molding parameter is used as the first adjustment molding parameter;

[0059] If the individual adjustment amount of the target molding parameter does not exceed the actual adjustment range, it indicates that the current operating state of the molding equipment satisfies the condition that only the target molding parameter needs to be adjusted individually to return the molding parameter to the preset range.

[0060] S634: If the target molding parameters are beyond the actual adjustment range, determining whether there are molding parameters that can be adjusted indirectly;

[0061] The indirectly adjustable molding parameters are molding parameters that can compensate for the adjustment range of a certain molding parameter by adjustment when the adjustment range of the molding parameter is limited. In the specific implementation, a relationship table of the indirectly adjustable molding parameters corresponding to each molding parameter is stored in advance. For example, the relationship table can store the molding parameters that are indirectly adjustable when the injection speed is the injection pressure, the molding parameters that are indirectly adjustable when the molding temperature is the injection pressure, and the molding parameters that are indirectly adjustable when the molding temperature is the injection speed.

[0062] S635: If there is no indirectly adjustable molding parameter, the target molding parameter is used as the first adjusted molding parameter;

[0063] S636: If there is an indirectly adjustable molding parameter, determine the directly adjusted molding parameter and the indirectly adjusted molding parameter as the second molding parameter and the third molding parameter respectively according to the difference, the actual adjustment range and the target molding parameter.

[0064] like Fig. 9 As shown, the step S636: if there is an indirectly adjustable molding parameter, determining the directly adjusted molding parameter and the indirectly adjusted molding parameter as the second molding parameter and the third molding parameter respectively according to the difference, the actual adjustment range and the target molding parameter also includes:

[0065] S6361: Constructing the molding parameter correlation matrix;

[0066] Specifically include:

[0067] Determine the molding parameters involved in the molding process and mark them as a set of variables. For example: P1: mold closing pressure, P2 mold closing speed, P3 molding temperature, P4: injection pressure, P5: injection speed, P6: curing time.

[0068] The molding parameters are formed into a molding parameter set {P1, P2, P3, P4, P5, P6};

[0069] For each pair of molding parameters, the relationship between them is analyzed, and the relationship includes correlation, influence direction and influence intensity. Correlation refers to whether there is a direct or indirect correlation between parameters. Correlation includes positive correlation and negative correlation. Positive correlation means that when one parameter increases, the other parameter also increases (such as injection pressure and injection speed). Negative correlation means that when one parameter increases, the other parameter decreases (such as molding temperature and curing time). Influence intensity refers to the influence of one parameter change on another parameter, which can be expressed by quantitative indicators (such as correlation). 0 means no correlation, positive value means positive correlation, larger value means stronger correlation, negative value means negative correlation, smaller value means stronger negative correlation.

[0070] Construct an N×N matrix, where N is the total number of molding parameters. Each element R(i,j) of the matrix represents the parameter P i For parameter P j 's relevance.

[0071] S6362: Calibrate the correlation and direction between various molding parameters to determine the values ​​of various elements in the matrix;

[0072] The value of the correlation between the two molding parameters can be calibrated through experiments.

[0073] S6363: Obtaining the allowed range of relevance;

[0074] The allowable range of correlation can be set based on experience, and a range with a strong influence between molding parameters can be selected as the allowable range of correlation.

[0075] S6364: Determine, according to the target molding parameters and the molding parameter association matrix, a molding parameter whose correlation with the target molding parameters is within the allowable range of the correlation as an indirectly adjusted molding parameter, namely, a third molding parameter.

[0076] In this step, parameters with a high correlation with the target molding parameters are selected as the molding parameters to be indirectly adjusted. When the molding parameters to be directly adjusted cannot meet the process requirements, the molding parameters to be indirectly adjusted are adjusted.

[0077] The directly adjusted molding parameters are the target molding parameters, and the indirectly adjusted molding parameters are the molding parameters that can make up for the insufficient adjustment amount of the target molding parameters.

[0078] By selecting the molding parameters to be indirectly adjusted through the molding parameter association matrix, the molding parameters with better adjustment effects can be specifically screened out, thereby enhancing the adjustment effect.

[0079] like Fig.10As shown, the S6364: determining, according to the target molding parameter and the molding parameter association matrix, a molding parameter whose correlation with the target molding parameter is within the correlation allowable range as the third molding parameter also includes;

[0080] S63641: Obtain the disturbance degree of each third molding parameter;

[0081] If adjusting a molding parameter may lead to a high complexity of continuous compensation of other subsequent molding parameters, the disturbance of the molding parameter is large; otherwise, the disturbance is small;

[0082] The method for obtaining the disturbance degree of each third molding parameter specifically includes:

[0083] Obtaining the correlation value of each molding parameter with other molding parameters in the molding parameter correlation matrix;

[0084] The disturbance degree of the molding parameters is determined according to the absolute value of the correlation value between each molding parameter and other molding parameters in the molding parameter association matrix, wherein the disturbance degree is positively correlated with the absolute value of the correlation value.

[0085] The corresponding relationship between the disturbance degree and the correlation degree can be obtained through curve calibration through experiments.

[0086] S63642: Determine the priority adjustment order of each third molding parameter according to the disturbance degree of each third molding parameter;

[0087] If the disturbance degree of adjusting a parameter is large, it will not be adopted as a priority; on the contrary, the parameter with a small disturbance degree will be adjusted first to ensure the stability of the entire production process; for this reason, in this step, the priority adjustment order of the parameter with a small absolute value of the disturbance degree is arranged higher in the sorting, which can significantly simplify the adjustment of the remaining parameters.

[0088] S63643: Determine whether the disturbance degree between two adjacent third molding parameters in the priority adjustment sequence is less than a disturbance degree difference threshold;

[0089] If the disturbance degree between two adjacent third molding parameters is less than the disturbance degree difference threshold, it indicates that the disturbance degrees between the two third molding parameters are not much different and the order can be exchanged. The disturbance degree difference threshold can be set based on experience.

[0090] S63644: if otherwise, the priority adjustment order of the two adjacent third molding parameters is maintained unchanged;

[0091] If the disturbance degree between two adjacent third molding parameters is greatly different, no sequential adjustment is performed, thereby ensuring the stability of the production process.

[0092] S63645: If yes, obtain the stable working range of two adjacent third molding parameters;

[0093] The stable working range of the third molding parameter is the working range of the third molding parameter in which the equipment can still work in a relatively ideal state after the third molding parameter is adjusted. The stable working range of each molding parameter can be obtained through experiments.

[0094] S63646: Obtaining the relative position relationship between two adjacent third molding parameters after adjustment and the stable working range;

[0095] The relative positional relationship between the two third molding parameters and the stable working range is obtained respectively, that is, the distance between the two adjacent third molding parameters and the upper limit and the lower limit of the corresponding stable working range is obtained.

[0096] S63647: Re-determine the adjustment priority of two adjacent third molding parameters according to the relative position parameters, wherein the third molding parameter that is in the corresponding stable working range and is farther away from the boundary of the corresponding stable working area has a higher adjustment priority; since the stable working range has two boundaries, an upper limit and a lower limit, the boundary closest to the corresponding third molding parameter is used as the basis for sorting.

[0097] S63648: Obtaining a non-ideal adjustment range of a stable working interval corresponding to each indirect adjustment parameter;

[0098] The non-ideal adjustment range is a position close to the boundary of the stable working range. Within this range, the operation of the device is extremely unstable. The non-ideal adjustment range can be specifically determined through experiments.

[0099] S63649: Filter the third molding parameter in the non-ideal adjustment range in the corresponding stable working interval as the limiting adjustment parameter that needs to reduce the adjustment amount.

[0100] In this embodiment, the third molding parameter that is adjusted to a non-ideal adjustment range is adjusted as little as possible to avoid instability in the production process.

[0101] This embodiment optimizes the adjustment of molding equipment parameters by comprehensively controlling the adjustment sequence of the third molding parameter from two dimensions: the disturbance degree of the molding parameter and the stable working range. This can improve the adjustment response speed while ensuring the stability of the production process.

[0102] like Fig.11 As shown, in this embodiment, the step S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter further includes:

[0103] S6431: Obtain the deviation of the second molding parameter after adjustment from the preset range.

[0104] S6432: Obtaining correlation values ​​between the second molding parameter and each third molding parameter according to the molding parameter association matrix;

[0105] S6433: Divide the deviation amount in the preset range into a plurality of sub-deviation amounts corresponding to each third molding parameter one by one according to the correlation value between the second molding parameter and each third molding parameter, wherein the size of the sub-deviation amount is linearly related to the correlation value of the corresponding third molding parameter.

[0106] In this step, the deviation amount is divided according to the correlation value between the second molding parameter and each third molding parameter. The larger the absolute value of the correlation value is, the larger the divided deviation amount is, and vice versa.

[0107] S6434: Adjust each third molding parameter according to the sub-deviation amount corresponding to the third molding parameter.

[0108] In this step, when adjusting each third molding parameter, the adjustment is made according to the corresponding sub-deviation amount after the division, that is, the adjustment amount of a third molding parameter is based on the size of the corresponding sub-deviation amount after the division. This adjustment method can optimize the adjustment efficiency while making full use of each third molding parameter, so that each third molding parameter can obtain a faster adjustment response with a smaller adjustment amount.

[0109] like Figure 6 As shown, in this embodiment, as one of the molding parameter adjustment methods, the step S64: adjusting the molding parameters to be adjusted according to the difference between the target molding parameters and the preset range also includes:

[0110] S641: If the individual adjustment amount of the target molding parameter does not exceed the actual adjustment range or the individual adjustment amount of the target molding parameter exceeds the actual adjustment range but there is no indirectly adjustable parameter, adjust the first molding parameter according to the actual molding parameter and the corresponding preset range;

[0111] At this time, if the individual adjustment amount of the target molding parameter does not exceed the actual adjustment range, the target molding parameter is directly adjusted to the preset range of the corresponding molding parameter. If the individual adjustment amount of the target molding parameter exceeds the actual adjustment range but there is no parameter that can be adjusted indirectly, the target molding parameter is adjusted to the value closest to the preset range of the corresponding molding parameter.

[0112] S642: If the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, the second molding parameter is adjusted according to the actual molding parameter and the preset range of the corresponding molding parameter;

[0113] S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter.

[0114] In specific implementation, the step S642: if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter also includes:

[0115] S6421A: Determine an adjustment amount of the second molding parameter according to an actual adjustment range and the second molding parameter;

[0116] The adjustment amount of the second molding parameter is the amount of adjustment of the second molding parameter when the second molding parameter is adjusted to a preset range closest to the corresponding molding parameter within the actual adjustment range of the molding equipment.

[0117] S6422A: adjusting the second molding parameter according to the adjustment amount of the second molding parameter;

[0118] The step S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter further includes:

[0119] S6431A: Determine a supplementary adjustment amount of the second molding parameter according to an adjustment result of the second molding parameter and a preset range of the corresponding molding parameter;

[0120] In this step, the minimum difference between the adjusted value of the second molding parameter and the preset range of the molding parameter can be first obtained, and this difference is the supplementary adjustment amount of the second molding parameter;

[0121] S6432A: Obtaining an actual adjustment range corresponding to the third molding parameter according to the operating state of the molding equipment;

[0122] S6433A: Obtaining an expected adjustment amount of a third molding parameter corresponding to a supplementary adjustment amount of a second molding parameter;

[0123] The expected adjustment amount of the third molding parameter refers to the amount of adjustment required for the third molding parameter to achieve the same process effect as the second molding parameter after the third molding parameter is adjusted according to the expected adjustment amount. The corresponding relationship between the two can be calibrated in advance through experiments.

[0124] S6434A: Adjust the third molding parameter according to an actual adjustment range corresponding to the third molding parameter and an expected adjustment amount of the third molding parameter.

[0125] In this step, when the second molding parameter is adjusted, the third molding parameter is used for supplementary adjustment to make up for the insufficient adjustment amount of the second molding parameter after being limited by the molding parameter adjustment range of the molding equipment. This embodiment compensates for the molding parameter adjustment defects when the molding equipment is in a poor operating state by coordinating multiple molding parameters, and can avoid rework operations caused by substandard molding parameters as much as possible, thereby improving production efficiency.

[0126] For example, when the second molding parameter is the injection pressure and the third molding parameter is the molding temperature, Figure 7 As shown, the step S642: if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter also includes:

[0127] S6421: Determine the adjustment amount of the injection pressure according to the injection pressure and the actual adjustment range of the injection pressure of the molding equipment;

[0128] In specific implementation, the adjustment amount when the injection pressure is adjusted to the maximum value and the minimum value of the actual adjustment range can be obtained, and then the adjustment amount closest to the preset range of the injection pressure after adjustment is taken as the adjustment amount of the injection pressure.

[0129] S6422: adjusting the injection pressure according to the adjustment amount of the injection pressure;

[0130] In this step, the injection pressure is first adjusted to a value closest to the preset range of the injection pressure within the actual adjustment range of the injection pressure of the molding equipment.

[0131] The step S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter further includes:

[0132] S6431: Determine a supplementary adjustment amount of the injection pressure according to the adjustment amount of the injection pressure and a preset range of the injection pressure;

[0133] S6432: Obtaining an actual adjustment range corresponding to the molding temperature according to the operating state of the molding equipment;

[0134] This step obtains the adjustment range of the molding temperature that the molding equipment can actually provide. The molding temperature that the molding equipment can provide is determined by the current state of the molding equipment.

[0135] S6433: Obtaining the expected adjustment amount of the molding temperature corresponding to the supplementary adjustment amount of the injection pressure;

[0136] S6434: Adjust the molding temperature according to the actual adjustment range of the molding temperature of the molding equipment and the expected adjustment amount of the molding temperature.

[0137] When the injection pressure is insufficient to overcome the internal resistance of the mold, resulting in incomplete filling, this step increases the molding temperature, reduces the viscosity of the packaging material, improves the material fluidity, and compensates for the situation where the mold cavity cannot be completely filled due to insufficient injection pressure.

[0138] For another example, when the second molding parameter is the injection speed and the third molding parameter is the injection pressure, Figure 8 As shown, the step S642: if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter also includes:

[0139] S6423: Determine the injection speed adjustment amount according to the injection speed and the actual adjustment range of the injection speed of the molding equipment;

[0140] In specific implementation, the adjustment amount when the injection speed is adjusted to the maximum value and the minimum value of the actual adjustment range can be obtained, and then the adjustment amount closest to the preset range of the injection speed after adjustment is taken as the adjustment amount of the injection pressure.

[0141] S6424: adjusting the injection speed according to the injection speed adjustment amount;

[0142] In this step, the injection pressure is first adjusted to a value closest to the preset range of the injection speed within the actual adjustment range of the injection speed of the molding equipment.

[0143] The step S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter further includes:

[0144] S6435: Determine a supplementary adjustment amount of the injection speed according to the adjustment amount of the injection speed and a preset range of the injection speed;

[0145] S6436: Obtaining an actual adjustment range corresponding to the injection pressure according to the operating state of the molding equipment;

[0146] This step obtains the adjustment range of the injection pressure that the molding equipment can actually provide. The injection pressure that the molding equipment can provide is determined by the current state of the molding equipment.

[0147] S6437: Obtaining an expected adjustment amount of the injection pressure corresponding to the supplementary adjustment amount of the injection speed;

[0148] S6438: Adjust the injection pressure according to the actual adjustment range of the injection pressure of the molding equipment and the expected adjustment amount of the injection pressure.

[0149] This embodiment can make the material quickly fill the distal region of the mold cavity by supplementing and adjusting the injection pressure when the injection speed is insufficient, so as to ensure uniform distribution of the material and reduce bubble formation.

[0150] For another example, when the second molding parameter is the molding temperature and the third molding parameter is the injection speed, the step S642: if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter also includes:

[0151] S64203: Determine the adjustment amount of the molding temperature according to the molding temperature and the actual adjustment range of the molding temperature of the molding equipment;

[0152] S64204: adjusting the molding temperature according to the adjustment amount of the molding temperature;

[0153] The step S643: adjusting the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter further includes:

[0154] S64305: Determine a supplementary adjustment amount of the molding temperature according to the adjustment amount of the molding temperature and a preset range of the molding temperature;

[0155] S64306: Obtaining an actual adjustment range corresponding to the injection speed according to the operating status of the molding equipment;

[0156] S64307: Obtaining the expected adjustment amount of the injection speed corresponding to the supplementary adjustment amount of the molding temperature;

[0157] S64308: Adjust the molding temperature according to the actual adjustment range of the molding temperature of the molding equipment and the expected adjustment amount of the molding temperature.

[0158] After adopting the above scheme, this embodiment can detect whether the molding temperature is lower than the preset range in the first step; reasonably increase the injection speed to improve the material flow rate, ensure that the material can quickly fill all areas of the mold cavity, and avoid uneven filling problems caused by cooling and solidification.

[0159] In this embodiment, S7: controlling the injection material to gradually solidify in the mold further includes:

[0160] S71: Divide the process of the injection material from the beginning of solidification to complete solidification into several solidification progresses;

[0161] Specifically, it can be divided in the following way: the solidification progress when the injection material just starts to solidify is taken as the starting progress, the solidification degree corresponding to each unit temperature reduction of the injection material when the injection material is naturally cooled is taken as a solidification progress, and the solidification progress when the injection material is completely solidified is taken as the termination progress. In specific implementation, the solidification degree corresponding to each solidification progress can be recorded through experiments. For example, the solidification progress at the beginning of the injection material is 0, the solidification progress when the injection material is reduced by one unit temperature is 1, and the solidification progress when the injection material is reduced by another unit temperature is 2. The solidification progress is repeatedly extrapolated until the corresponding solidification progress when the injection material is completely solidified is n, where n is a positive integer greater than or equal to 1.

[0162] S71: Obtaining the solidification progress of the injection material in each area of ​​the mold;

[0163] In this step, the curing degree of the injection material in each area during the molding process can be detected first, and then the corresponding curing progress can be found according to the curing degree. The curing degree of the injection material can be detected by the temperature of the injection material, or by known curing degree detection methods such as ultrasonic detection, conductivity detection, and optical monitoring, which are not limited here.

[0164] S72: Obtaining the difference between the solidification progress of each region in the mold and the adjacent region according to the solidification progress of the injection material in each region in the mold;

[0165] The difference in curing progress between an area and its adjacent area in the mold is the curing progress of the area minus the curing progress of the adjacent area. For example, if the curing progress of a certain area is 3 and the curing progress of one of its adjacent areas is 2, then the difference in curing progress between the area and the adjacent area is 1. If the curing progress of another adjacent area of ​​the area is 5, then the difference in curing progress between the area and the adjacent area is -2.

[0166] S73: Execute a curing temperature control curve determination process, wherein the curing temperature control curve adjustment process includes:

[0167] Obtaining the area with the largest difference in curing progress among the areas of the currently undetermined temperature control curve as the target area;

[0168] The curing temperature control curve determination process is a cyclic execution process. Each cycle determines a temperature control curve for a target area and its adjacent areas. Each cycle only processes areas that have not yet been formulated for a temperature control curve at the beginning of the current cycle until temperature control curves are formulated for all areas.

[0169] Acquire an area adjacent to the target area and having a determined temperature control curve as a reference area;

[0170] The temperature control curve of the target area and its adjacent areas is determined according to the curing progress difference corresponding to the target area and the curing temperature control curve of the reference area.

[0171] If the curing progress difference between the target area and the adjacent area is positive, the temperature control curve of the target area can be set to maintain the current temperature or increase the temperature. The greater the curing progress difference, the higher the temperature rise of the temperature control curve. The temperature control curve of the area adjacent to the target area can also be set to rapid cooling. The greater the curing progress difference, the faster the cooling speed. If the curing progress difference between the target area and the adjacent area is negative, the temperature control curve of the target area can be set to rapid reduction. The greater the curing progress difference, the faster the cooling speed of the temperature control curve. The temperature control curve of the area adjacent to the target area can also be set to maintain the current temperature or increase the temperature. The greater the curing progress difference, the higher the temperature rise.

[0172] S74: Determine whether the temperature control curves of all the regions have been determined. If not, execute the curing temperature control curve determination process. If yes, control the temperature of each region according to the curing temperature control curve of each region.

[0173] This embodiment controls the solidification process of each area of ​​the injection material in the mold cavity during the molding process in the aforementioned manner, so that the solidification process of each area is kept as consistent as possible, thereby avoiding the problem of excessive internal stress of the packaged product caused by different solidification processes in each area.

[0174] In this embodiment, S4: injecting the injection material into the mold cavity of the mold according to the preset values ​​of the injection pressure and the injection speed also includes:

[0175] S41: acquiring the injection pressure and injection speed of the first-stage injection stage as the first-stage injection pressure and the first-stage injection speed respectively;

[0176] S42: determining the injection pressure and injection speed of the second injection stage according to the first injection pressure and the first injection speed as the second injection pressure and the second injection speed, respectively, wherein the second injection pressure is greater than the first injection pressure, and the second injection speed is less than the first injection speed;

[0177] S43: determining the injection pressure and injection speed of the third injection stage according to the second injection pressure and the second injection speed as the third injection pressure and the third injection speed, respectively, wherein the third injection pressure is equal to the second injection pressure, and the third injection speed is equal to the second injection speed;

[0178] S44: controlling the molding equipment to perform the first-stage injection according to the first-stage injection pressure and the first-stage injection speed, and maintaining the pressure in the mold cavity for a first preset time after the first-stage injection is completed;

[0179] S45: controlling the molding equipment to perform second-stage injection according to the second-stage injection pressure and the second-stage injection speed, and maintaining the pressure in the mold cavity for a second preset time after the second-stage injection is completed;

[0180] S46: Controlling the molding equipment to perform third-level injection according to the third-level injection pressure and the third-level injection speed, and maintaining the pressure in the mold cavity for a third preset time after the third-level injection is completed.

[0181] This embodiment uses a three-stage injection method to gradually control the flow and filling effect of the packaging material, thereby improving the filling accuracy and reducing bubbles and internal stress. The first stage of injection is used to start filling the mold cavity. It is a relatively gentle stage. The purpose is to allow the material to enter the mold smoothly and avoid material overflow or bubble generation.

[0182] The pressure of the first-stage injection can be low pressure as the initial filling pressure so that the packaging material enters the mold cavity evenly to avoid the generation of bubbles.

[0183] First stage injection speed: low speed to ensure that the material enters the mold cavity smoothly without impacting the mold, maintaining the consistency of packaging.

[0184] The second injection is the main filling stage, during which pressure can be increased to allow the material to quickly fill most areas of the cavity. The injection pressure at this time must ensure that the material fills the mold evenly. The second injection can use a moderate amount of pressure to push the material to quickly fill the cavity, reducing material cooling and uneven flow.

[0185] The third level injection is the final filling stage. It is mainly used to compensate for the shrinkage of the material during cooling and eliminate bubbles to ensure the quality of the finished product. Its pressure and injection speed can be equal to the pressure and injection speed of the second level injection.

[0186] In the case that the injection is not performed according to the set injection pressure and injection speed in the previous injection process, this embodiment corrects the three-stage injection process by adjusting the parameters in the subsequent injection process, specifically, the step S4: injecting the injection material into the mold cavity of the mold according to the preset values ​​of the injection pressure and injection speed also includes:

[0187] S401: During the first-stage injection process, detecting whether the actual injection pressure of the first-stage injection exceeds a first injection pressure threshold;

[0188] The first injection pressure threshold is the maximum value of the first injection pressure allowed, and the value can be set based on experience.

[0189] S402: if yes, adjusting the mold temperature during the first preset time and the third level injection according to the difference between the actual injection pressure of the first level injection and the first injection pressure threshold;

[0190] If the first injection pressure is too high, the holding time of the second injection can be extended, so that the uneven stress caused by the excessive pressure during the first injection process, which is caused by the rapid cooling of the material, can be fully released in the mold cavity. At the same time, the mold temperature can be increased during the third injection to delay the solidification time. The higher the actual injection pressure, the longer the holding time of the second injection.

[0191] S403: During the second-stage injection process, detecting whether the actual injection pressure of the second-stage injection exceeds a second injection pressure threshold;

[0192] S404: If yes, determining whether the actual injection pressure of the second-level injection exceeds the third injection pressure threshold;

[0193] The third injection pressure threshold is greater than the second injection pressure threshold.

[0194] S405: if the actual injection pressure of the second injection does not exceed the third injection pressure threshold, adjusting the second preset time and the mold temperature during the third injection according to the difference between the actual injection pressure of the second injection and the third injection pressure threshold;

[0195] If the actual injection pressure of the second-level injection is between the second injection pressure threshold and the third injection pressure threshold, the second preset time and the mold temperature during the third-level injection can be adjusted preferentially to eliminate the stress caused by the excessive second-level injection pressure by extending the holding time of the second-level injection and increasing the mold temperature during the third-level injection.

[0196] S406: If the actual injection pressure of the second-stage injection exceeds the third injection pressure threshold, the third injection pressure is adjusted and the third injection pressure is gradually reduced.

[0197] If the actual injection pressure of the second-level injection exceeds the third injection pressure threshold, it indicates that the actual injection pressure of the second-level injection is too high. At this time, the adjustment of the third injection pressure is increased and the third injection pressure is gradually lowered, thereby further eliminating the stress caused by the excessive injection pressure.

[0198] Example 2

[0199] like Fig.12 As shown, this embodiment also provides a ceramic light-emitting semiconductor device molding integrated control system, which includes at least one processor 401 and at least one memory 402. Specifically, the processor 401 can be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or can be configured to implement one or more integrated circuits of the embodiment of the present invention.

[0200] The memory 402 may include a large capacity memory 402 for data or instructions. By way of example and not limitation, the memory 402 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 402 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 402 may be inside or outside the data processing device. In a specific embodiment, the memory 402 is a non-volatile solid-state memory 402. In a specific embodiment, the memory 402 includes a read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0201] The processor 401 implements the control method in the above-mentioned embodiment by reading and executing the computer program instructions stored in the memory 402 .

[0202] In one example, the control system of this embodiment may further include a communication interface 403 and a bus, wherein the processor 401, the memory 402, and the communication interface 403 are connected through the bus and communicate with each other.

[0203] The communication interface 403 is mainly used to implement the communication between the modules, devices, units and / or equipment in the embodiment of the present invention.

[0204] The bus includes hardware, software or both, and the various components for controlling the system are coupled to each other. For example, but not limitation, the bus may include an accelerated graphics port (AGP) or other graphics bus, an enhanced industrial standard architecture (EISA) bus, a front-side bus (FSB), a hypertransport (HT) interconnection, an industrial standard architecture (ISA) bus, an infinite bandwidth interconnection, a low pin count (LPC) bus, a memory 402 bus, a microchannel architecture (MCA) bus, a peripheral component interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a serial advanced technology attachment (SATA) bus, a video electronics standard association local (VLB) bus or other suitable buses or a combination of two or more of these. Where appropriate, bus 410 may include one or more buses. Although the embodiments of the present invention describe and illustrate specific buses, the present invention contemplates any suitable bus or interconnection.

[0205] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figure. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiment, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention. The functional blocks shown in the structural block diagram described above can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, plug-in, function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted on a transmission medium or communication link via a data signal carried in a carrier. "Machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, and the like. The code segments can be downloaded via a computer network such as the Internet, an intranet, etc. It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0206] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A method for integrally molding a ceramic light-emitting semiconductor device, characterized in that: The method comprises: Obtaining preset values ​​and preset ranges of various molding parameters, wherein the molding parameters include mold clamping pressure, mold clamping speed, molding temperature, injection pressure, injection speed, and curing time; Control mold closing according to preset values ​​of mold closing pressure and mold closing speed; Heating the injection material and the mold according to the preset value of the molding temperature; Injecting the injection material into the mold cavity of the mold according to preset values ​​of injection pressure and injection speed; Obtaining the difference between the actual molding parameters and the preset range of each molding parameter during the molding process; Adjusting molding parameters in real time during the molding process according to the operating status of the molding equipment and the differences; Control the gradual solidification of the injected material in the mold; The real-time adjustment of molding parameters during the molding process according to the operating state of the molding equipment and the difference also includes: taking the actual molding parameters beyond the preset range as the target molding parameters; Obtaining the actual adjustment range of each molding parameter of the molding equipment according to the operating status of the molding equipment; Determining a molding parameter for adjustment according to the actual adjustment range and the difference between the target molding parameter and the preset range; Adjust the molding parameters that need to be adjusted according to the difference between the target molding parameters and the preset range; The step of determining the molding parameters for adjustment according to the actual adjustment range and the difference between the target molding parameters and the preset range further comprises: Obtaining an actual adjustment range of a molding parameter corresponding to a target molding parameter; Determining whether a separate adjustment amount of the target molding parameter exceeds the actual adjustment range according to the target molding parameter, the preset range corresponding to the target molding parameter, and the actual adjustment range; If it does not exceed the actual adjustment range, the target molding parameter is used as the first adjustment molding parameter; If it exceeds the actual adjustment range, it is determined whether there are molding parameters that can be indirectly adjusted for the target molding parameters; If there is no indirectly adjustable molding parameter, the target molding parameter is used as the first adjusted molding parameter; If there is an indirectly adjustable molding parameter, the directly adjusted molding parameter and the indirectly adjusted molding parameter are determined as the second molding parameter and the third molding parameter respectively according to the difference, the actual adjustment range and the target molding parameter.

2. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 1, characterized in that: The step of adjusting the molding parameters to be adjusted according to the difference between the target molding parameters and the preset range also includes: If the individual adjustment amount of the target molding parameter does not exceed the actual adjustment range or the individual adjustment amount of the target molding parameter exceeds the actual adjustment range but there is no indirectly adjustable parameter, the first molding parameter is adjusted according to the actual molding parameter and the corresponding preset range; If the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, the second molding parameter is adjusted according to the actual molding parameter and the preset range of the corresponding molding parameter; The third molding parameter is adjusted according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter.

3. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 2, characterized in that: If there is an indirectly adjustable molding parameter, determining the directly adjusted molding parameter and the indirectly adjusted molding parameter as the second molding parameter and the third molding parameter respectively according to the difference, the actual adjustment range and the target molding parameter also includes: Construct the molding parameter correlation matrix; Calibrate the correlation and direction between various molding parameters; Get the allowed range of relevance; According to the target molding parameters and the molding parameter association matrix, a molding parameter whose correlation with the target molding parameters is within the allowable range of the correlation is determined as an indirectly adjusted molding parameter.

4. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 3, characterized in that: The step of determining, according to the target molding parameters and the molding parameter association matrix, a molding parameter whose correlation with the target molding parameters is within the correlation allowable range as the third molding parameter also includes: Obtaining the disturbance degree of each third molding parameter; Determining a priority adjustment order of each third molding parameter according to the disturbance degree of each third molding parameter; Determining whether the disturbance degree between two adjacent third molding parameters in the priority adjustment sequence is less than a disturbance degree difference threshold; If otherwise, the priority adjustment order of the two adjacent third molding parameters is kept unchanged; If yes, then obtain the stable working range of two adjacent third molding parameters; Obtaining the relative position relationship between two adjacent third molding parameters after adjustment and the stable working range; Re-determining the adjustment priority order of two adjacent third molding parameters according to the relative position relationship, wherein the adjustment priority order of the third molding parameter that is in the corresponding stable working range and is farther from the boundary of the corresponding stable working area is higher; Obtaining a non-ideal adjustment range of a stable working interval corresponding to each indirect adjustment parameter; Selecting a third molding parameter in a non-ideal adjustment range within a corresponding stable working interval as a limiting adjustment parameter that needs to reduce an adjustment amount; The step of obtaining the disturbance degree of each third molding parameter further includes: Obtaining the correlation value of each molding parameter with other molding parameters in the molding parameter correlation matrix; The disturbance degree of the molding parameters is determined according to the absolute value of the correlation value between each molding parameter and other molding parameters in the molding parameter association matrix, wherein the disturbance degree is positively correlated with the absolute value of the correlation value.

5. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 3, characterized in that: The adjusting of the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter also includes: Obtaining a deviation between the second molding parameter after adjustment and a preset range; Acquire the correlation value between the second molding parameter and each third molding parameter according to the molding parameter association matrix; According to the correlation value between the second molding parameter and each third molding parameter, the deviation amount in the preset range is divided into a plurality of sub-deviation amounts corresponding to each third molding parameter one by one, and the magnitude of the sub-deviation amount is linearly related to the correlation value of the corresponding third molding parameter; Each third molding parameter is adjusted according to the sub-deviation amount corresponding to the third molding parameter.

6. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 2, characterized in that: When the second molding parameter is the injection pressure and the third molding parameter is the molding temperature, if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter includes: Determine the adjustment amount of injection pressure according to the actual adjustment range of injection pressure and injection pressure of molding equipment; Adjust the injection pressure according to the injection pressure adjustment amount; The adjusting of the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter also includes: Determining a supplementary adjustment amount of the injection pressure according to the adjustment amount of the injection pressure and a preset range of the injection pressure; Obtaining the actual adjustment range of the molding temperature according to the operating status of the molding equipment; Obtaining an expected adjustment amount of the molding temperature corresponding to the supplementary adjustment amount of the injection pressure; The molding temperature is adjusted according to the actual molding temperature adjustment range of the molding equipment and the expected adjustment amount of the molding temperature.

7. The method for integrally molding a ceramic light-emitting semiconductor device according to claim 2, characterized in that: When the second molding parameter is the injection speed and the third molding parameter is the injection pressure, if the individual adjustment amount of the target molding parameter exceeds the actual adjustment range and there is an indirectly adjustable molding parameter, adjusting the second molding parameter according to the actual molding parameter and the preset range of the corresponding molding parameter also includes: Determine the injection speed adjustment amount according to the injection speed and the actual adjustment range of the injection speed of the molding equipment; Adjust the injection speed according to the injection speed adjustment amount; The adjusting of the third molding parameter according to the adjustment result of the second molding parameter and the corresponding preset range of the molding parameter also includes: Determining a supplementary adjustment amount of the injection speed according to the adjustment amount of the injection speed and a preset range of the injection speed; Obtain the actual adjustment range of the injection pressure according to the operating status of the molding equipment; Obtaining an expected adjustment amount of the injection pressure corresponding to the supplementary adjustment amount of the injection speed; The injection pressure is adjusted according to the actual adjustment range of the injection pressure of the molding equipment and the expected adjustment amount of the injection pressure.

8. A ceramic light-emitting semiconductor device molded integrally formed control system, characterized in that: The method comprises at least one processor, at least one memory and computer program instructions stored in the memory, and when the computer program instructions are executed by the processor, the method according to any one of claims 1 to 7 is implemented.

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