Wafer clamping arm and system, method and device for wafer clamping arm control

Abstract

The invention discloses a wafer clamping arm and a system, a method and a device for controlling the wafer clamping arm, the wafer clamping arm comprises a clamping arm, a sensor and peripheral support and a transmission structure, the sensor and peripheral support is connected with the clamping arm and comprises a receiving sensor support for holding and clamping the receiving end of a correlation sensor, and the transmission structure is connected with the sensor and peripheral support. The transmitting sensor support clamps the transmitting end of the correlation sensor, and the bottom of the receiving sensor support and the bottom of the transmitting sensor support are each of a large hydrophobic included angle structure; the transmission structure is configured to drive the clamping arm to lift the wafer to be processed out of the semiconductor wet process environment through a control instruction, and the control instruction is obtained under the condition that the correlation sensor determines that the clamping arm clamps the wafer to be processed. Therefore, when the wafer clamping arm can clamp the wafer to be lifted out of a wet grinding environment, the water drop path can be shunted and condensed, so that the water drops can be quickly separated and drop, and the detection reliability of the sensor is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer clamping arm and a system, method and device for controlling the wafer clamping arm. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the degree of automation in the manufacturing of semiconductor products has also increased. Semiconductor wafers refer to the substrate silicon wafers used in the production of silicon semiconductor integrated circuits. Because of their round shape, they are called wafers. In the production process of wafers, there is a process to grind both sides of the wafer. There are many wafer grinding technologies. The grinding method commonly used in the modern semiconductor industry is chemical-mechanical polishing (CMP). Chemical-mechanical polishing is used to flatten the etched surface of the wafer to nanometer-level smoothness, and various indicators such as the warpage and flatness of the silicon wafer are taken into account to avoid problems encountered in the microlithography and etching process of silicon wafers in high-end applications. Therefore, wafer grinding is an important part of semiconductor processing technology.

[0003] For the double-sided processing unit, when grinding the wafer, the wafer needs to be placed in the groove of the carrier and placed in a semiconductor wet process environment for grinding and other processing. In the existing technology, these steps are completed manually, with low production efficiency, high labor intensity for operators, and low precision, which can easily affect the quality of the wafer. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a wafer clamping arm and a system, method and device for controlling the wafer clamping arm. The technical problem to be solved by the present invention is achieved through the following technical solutions: A first aspect of an embodiment of the present invention provides a wafer clamping arm, characterized in that it comprises: a clamping arm, a sensor and a peripheral bracket, and a transmission structure, wherein: The sensor and the peripheral bracket are connected to the clamping arm, including: a receiving sensor bracket at the receiving end of the clamping and shooting sensor, and a transmitting sensor bracket at the transmitting end of the clamping and shooting sensor, and the bottoms of the receiving sensor bracket and the transmitting sensor bracket are respectively large hydrophobic angle structures; The transmission structure is configured to drive the clamping arm through control instructions to pull the wafer to be processed out of the semiconductor wet process environment, wherein the control instructions are obtained based on the situation where the clamping arm clamps the wafer to be processed according to the through-beam sensor.

[0005] A second aspect of an embodiment of the present invention provides a system for controlling a wafer clamping arm, comprising: a control device, and the above-mentioned wafer clamping arm; wherein: The control device is respectively connected to the through-beam sensor and the transmission structure of the wafer clamping arm, and is configured to control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment when it is determined according to the through-beam sensor that the wafer clamping arm has clamped the wafer to be processed.

[0006] A third aspect of an embodiment of the present invention provides a method for controlling a wafer clamping arm, comprising: Control the transmitting end of the through-beam sensor to send a detection signal; When it is determined that the receiving end of the through-beam sensor does not receive the detection signal, it is determined that the wafer clamping arm clamps the wafer to be processed; The transmission structure is used to control the wafer clamping arm to pull the wafer to be processed out of the semiconductor wet process environment.

[0007] A fourth aspect of an embodiment of the present invention provides a device for controlling a wafer clamping arm, the device comprising a processor and a memory storing program instructions, the processor being configured to execute the above-mentioned method for controlling a wafer clamping arm when executing the program instructions.

[0008] Beneficial effects of the present invention: The wafer clamping arm includes: a clamping arm, a sensor and a peripheral bracket, and a transmission structure. In this way, after the wafer clamping arm is determined to have clamped the wafer to be processed according to the through-beam sensor, the clamping arm can clamp the wafer and enter the wet grinding environment, thereby improving the safety of semiconductor processing, and can control the clamping arm to perform corresponding operations, thereby improving the semiconductor production efficiency and accuracy. In addition, the bottoms of the sensor and the peripheral bracket are respectively large hydrophobic angle structures, which can divert the path of condensed water droplets, so that when the wafer is taken out of the wet grinding environment, the water droplets are quickly separated and dripped from both sides of the through-beam sensor, thereby reducing the probability of water droplets penetrating into the through-beam sensor and forming interfering water mist and water film on the lens surface, further improving the sensor detection reliability.

[0009] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0010] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of the structure of a wafer clamping arm provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a wafer clamping arm provided by an embodiment of the present invention; Figure 3 A schematic diagram of a water drop comb flow for a wafer clamping arm provided in an embodiment of the present invention; Figure 4 A schematic diagram of a water drop comb flow for a wafer clamping arm provided in an embodiment of the present invention; Figure 5 A schematic diagram of the architecture of a wafer clamping arm control system provided by an embodiment of the present invention; Figure 6 A schematic flow chart of a method for controlling a wafer clamping arm provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a wafer clamping arm control device provided by an embodiment of the present invention; Figure 8 A schematic structural diagram of a wafer clamping arm control device provided in an embodiment of the present invention.

[0012] In the attached drawings: 1. detection clamping arm; 2. clamping arm; 3. receiving sensor bracket; 4. receiving sensor cover; 5. transmitting sensor bracket; 6. transmitting sensor bracket cover; 7. supporting inclined plate; 8. clamping fingers; 9. detection clamping connecting block; 10. clamping connecting block; 11. clamping cylinder; 12. cylinder bracket; 13. optical fiber amplifier cover; 14. cylinder cover; 15. through-beam sensor; 16. semiconductor wafer; 17. optical fiber amplifier. DETAILED DESCRIPTION

[0013] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0014] With the development of science and technology, the degree of automation in semiconductor product manufacturing is becoming higher and higher. During the grinding process, the wafer needs to be placed in a wet process environment. In the embodiment of the present invention, the wafer to be processed can be clamped by a clamping arm composed of a detection clamping arm, a clamping arm, a supporting inclined plate, and clamping fingers, and then placed in a wet grinding environment for processing, thereby improving the safety of semiconductor processing, and controlling the clamping arm to perform corresponding operations, thereby improving semiconductor production efficiency and production accuracy. Moreover, after the wafer is clamped by the clamping arm and pulled out from the wet grinding environment, the water vapor and water droplets in the wet process environment may flow and invade the surface of the sensor lens to form interfering water mist and water film, thereby causing the sensor to misjudge. Therefore, in the embodiment of the present invention, the wafer clamping arm adopts one or more structures such as a diversion avoidance structure, a large hydrophobic angle structure, a descending wedge-shaped slope, and a curved surface connection structure to enable the wafer clamping arm to leave the wet environment. When the wafer is pulled, the condensed water droplets are quickly separated to realize the hydrophobic structure of the peripheral bracket of the wafer sensor, divert the condensed water droplets, and the water droplets are quickly separated and dripped, and do not flow and invade the surface of the sensor lens to form interfering water mist and water film, thereby avoiding causing the sensor to misjudge and alarm, thereby improving the reliability of sensor detection and further improving the utilization rate of the wafer clamping arm environment switching.

[0015] A first aspect of an embodiment of the present invention provides a wafer clamping arm, comprising: a clamping arm, a sensor and a peripheral bracket, and a transmission structure, wherein: The gripping arm is configured to grip a wafer.

[0016] The sensor and the surrounding bracket are connected to the clamping arm, including: a through-beam sensor and a corresponding sensor bracket, which are configured so that when the clamping arm clamps the wafer, the receiving end of the through-beam sensor cannot receive the detection signal sent by the transmitting end.

[0017] The transmission structure is also connected to the clamping arm and is configured to drive the clamping arm through control instructions to pull the wafer to be processed out of the semiconductor wet process environment, wherein the control instructions are obtained based on the situation where the clamping arm clamps the wafer to be processed based on the through-beam sensor.

[0018] In some embodiments, Figure 1 and Figure 2 As shown, the clamping arm includes: a detection clamping arm 1, a clamping arm 2, a supporting inclined plate 7, and clamping fingers 8, wherein the clamping fingers 8 are respectively installed on both ends of the detection clamping arm 1 and the clamping arm 2, so that the wafer 16 can be clamped by multiple clamping fingers 8.

[0019] In order to automatically detect whether the wafer clamping arm has clamped the wafer and automatically determine the position of the wafer, in an embodiment of the present invention, Figure 1As shown, the sensor and the surrounding brackets include: a receiving sensor bracket 3, a transmitting sensor bracket 5, and a beam sensor 15; wherein, the receiving sensor bracket 3 installed on the detection clamping arm 1 clamps the receiving end of the beam sensor 15, and the transmitting sensor bracket 5 installed on the detection clamping arm 1 clamps the transmitting end of the beam sensor 15.

[0020] The transmitting end of the through-beam sensor 15 can send out a detection signal. When the clamping fingers 8 do not clamp the wafer, the receiving end of the through-beam sensor 15 can receive the detection signal. However, if the clamping fingers 8 clamp the wafer, the receiving end of the through-beam sensor 15 cannot receive the detection signal. Therefore, the through-beam sensor 15 can be used to determine whether the clamping arm clamps the semiconductor wafer.

[0021] In order to automatically control the wafer clamping arm to clamp the wafer and enter the wet process environment, or pull it out from the wet process environment, or control the wafer clamping arm to clamp the wafer for other movements or flipping, etc., the wafer clamping arm can also include a transmission structure. Through the transmission structure, the wafer clamping arm can be controlled to pull the wafer to be processed out of the semiconductor wet process environment, or perform other movements.

[0022] like Figure 1 and Figure 2 As shown, the transmission structure includes: a clamping cylinder 11, a cylinder bracket 12 for mounting the clamping cylinder 11, a detection clamping connecting block 9 connecting the clamping cylinder 11 and the detection clamping arm 1, and a clamping connecting block 10 connecting the clamping cylinder 11 and the clamping arm 2. In this way, the detection clamping arm 1 and the clamping arm 2 can be driven to move up and down by controlling the cylinder.

[0023] Of course, in the embodiment of the present invention, the transmission structure is not limited to this, and may also be other transmission structures, such as a solenoid valve, a piston structure and a corresponding connecting block, which are not listed in detail.

[0024] Since the wafer clamping arm will clamp the wafer into the wet process environment for corresponding processing, in order to protect each device and electrical safety, etc. Figure 1 and Figure 2 As shown, the wafer clamping arm may further include: a receiving sensor cover plate 4, a transmitting sensor cover plate 6, and a cylinder cover plate 14; thus, the receiving sensor cover plate 4 and the receiving sensor bracket 3 together protect the receiving end of the opposite-shooting sensor 15, and the transmitting sensor cover plate and the transmitting sensor bracket 5 together protect the transmitting end of the opposite-shooting sensor 15. The cylinder cover plate 14 can protect the clamping cylinder 11.

[0025] Of course, if Figure 1 and Figure 2As shown, the wafer clamping arm may include: a fiber optic amplifier 17, and a fiber optic amplifier cover 13 for protecting the fiber optic amplifier 17. The fiber optic amplifier 17 can further improve the reliability and accuracy of semiconductor processing.

[0026] It can be seen that in the embodiment of the present invention, after the wafer clamping arm determines that the wafer to be processed is clamped by the through-beam sensor, the clamping arm can clamp the wafer into a wet grinding environment, thereby improving the safety of semiconductor processing, and the clamping arm can be controlled to perform corresponding operations, thereby improving semiconductor production efficiency and production accuracy.

[0027] The wafer is clamped by the clamping arm and pulled out of the wet grinding environment. Since the water vapor and water droplets in the wet process environment may flow and invade the surface of the sensor lens to form interfering water mist and water film, thereby causing the sensor to misjudge. Therefore, in some embodiments of the present invention, the wafer clamping arm adopts one or more structures such as a shunt avoidance structure, a large hydrophobic angle structure, a descending wedge-shaped slope, and a curved surface connection structure to enable the wafer clamping arm to leave the wet environment and quickly separate the hydrophobic condensed water droplets when pulling the wafer, so as to realize the hydrophobic structure of the peripheral bracket of the wafer sensor, divert the condensed water droplets, and the water droplets are quickly separated and dripped without flowing and invading the surface of the sensor lens to form interfering water mist and water film, thereby avoiding causing the sensor to misjudge and alarm, thereby improving the reliability of sensor detection and further improving the working efficiency of the wafer clamping arm.

[0028] The enlarged image of the wafer inspection sensor and the sensor peripheral bracket and the schematic diagram of the water droplet comb flow can be seen as Figure 3 As shown, the bottom of the receiving sensor bracket 3 and the transmitting sensor bracket 5 are respectively large hydrophobic angle structures, so that when the wafer clamping arm is pulled out from the semiconductor wet process environment, water droplets will flow on the surface of the wafer clamping arm. When they reach the bottom of the receiving sensor bracket 3 and the transmitting sensor bracket 5, the large hydrophobic angle structure can divert the condensed water droplet path, so that the water droplets are quickly separated and dripped from both sides of the opposing sensor 15, thereby reducing the probability of water droplets penetrating into the opposing sensor and forming interfering water mist and water film on the lens surface, thereby improving the reliability of sensor detection.

[0029] Of course, in some embodiments, such as Figure 3 As shown, the surfaces of the receiving sensor bracket 3 and the transmitting sensor bracket 5 include: descending wedge-shaped inclined planes. In this way, when the wafer clamping arm is pulled out from the semiconductor wet process environment, water droplets will flow on the surface of the wafer clamping arm. When the wafer clamping arm descends along the surfaces of the receiving sensor bracket 3 and the transmitting sensor bracket 5, the descending wedge-shaped inclined planes shrink and gravity condenses the water droplets to expand, which can also speed up the speed of water droplet separation and dripping, reduce the water droplets flowing on the surface of the opposite-beam sensor 15, and protect the opposite-beam sensor 15.

[0030] In some embodiments, the receiving sensor cover 4 and the receiving sensor bracket 3 not only protect the receiving end of the opposing beam sensor 15, but also form a diversion avoidance structure. Similarly, the transmitting sensor cover and the transmitting sensor bracket 5 not only protect the transmitting end of the opposing beam sensor 15, but also form a diversion avoidance structure. When the wafer clamping arm is pulled out of the semiconductor wet process environment, water droplets that flow on the surface of the wafer clamping arm can be diverted through the diversion avoidance structure to reduce the water droplets that flow on the surface of the opposing beam sensor 15, thereby protecting the opposing beam sensor 15.

[0031] like Figure 3 As shown, in some embodiments, the surfaces of the diversion avoidance structure are connected to each other by curved surfaces, so that when the wafer clamping arm is pulled out from the semiconductor wet process environment, the interface boundary curve flow gathers and amplifies the water droplets, and the interface boundary curve arc and the bottom fox top of the surface boundary arc surface are gravity-stretched to separate the water droplets. Similarly, the speed of water droplet separation and dripping can be accelerated, and the water droplets hanging on the surface of the opposing sensor 15 can be reduced, that is, the opposing sensor 15 can also be protected.

[0032] Moreover, Figure 4 As shown, the clamping finger 8 includes: a V-shaped groove arc groove bottom and a V-shaped groove annular side wall. In this way, when the wafer clamping arm is pulled out from the semiconductor wet process environment, the V-shaped groove arc groove bottom interface of the wafer clamping finger 8 diverts water droplets, and the V-shaped groove annular side wall interface shrinks and rheologically condenses water droplets, which can also speed up the speed of water droplet separation and dripping, reduce water droplets hanging on the wafer clamping arm, make the wafer clamping arm dry quickly, and further improve the stability and work efficiency of the wafer clamping arm.

[0033] Combination Figure 3 and Figure 4 In some embodiments of the present invention, when the wafer clamping arm is pulled out of the semiconductor wet process environment, the water droplets hanging on the surface of the wafer clamping arm can be combed and diverted through the diversion avoidance structure and the large hydrophobic angle structure, and the water droplets can be amplified by the gravity condensation of the descending wedge-shaped slope, the amplified water droplets by the interface junction curve flow, and the gravity stretching of the interface junction curve arc and the bottom fox top of the profile interface arc surface to accelerate the speed of water droplet separation and dripping; and the water droplets can be further combed through the interface of the V-groove arc groove bottom interface of the wafer clamping finger 8 to divert the water droplets and the interface of the V-groove annular side wall shrinkage rheology condense the water droplets, thereby reducing the water droplets invading the surface of the sensor lens to form interfering water mist and water film, avoiding the probability of causing the sensor to misjudge the alarm, improving the reliability of sensor detection, and thereby improving the wafer clamping arm environment switching utilization rate and work efficiency.

[0034] The wafer clamping arm provided by the embodiment of the present invention can be applied to the semiconductor wafer manufacturing process, and with the development of science and technology, semiconductor products can be manufactured automatically. That is, the wafer clamping arm can be controlled by the control device to manufacture semiconductor products. Therefore, the system for the wafer clamping arm includes: a control device, and the above-mentioned wafer clamping arm. Among them, the control device is respectively connected to the through-beam sensor and the transmission structure of the wafer clamping arm, and is configured to control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment when it is determined that the wafer clamping arm clamps the wafer to be processed according to the through-beam sensor.

[0035] In some embodiments, the control device can also determine that the wafer clamping arm has clamped the wafer to be processed based on the through-beam sensor, and then control the wafer clamping arm through the transmission structure to move the wafer to be processed into the semiconductor wet process environment for processing.

[0036] The following is an example of an automated manufacturing process of a system for a wafer clamping arm provided by an embodiment of the present invention.

[0037] like Figure 5 As shown, the system for the wafer gripping arm may include: a control device 100 and a wafer gripping arm 200. The control device 100 may include: a CPU, a microcontroller unit (MCU), etc., which may be located in the wafer gripping arm 200 or may be a separate device electrically connected to the wafer gripping arm 200.

[0038] The wafer gripping arm 200 may be Figure 1 and Figure 2 As shown, therefore, the transmission mechanism of the wafer clamping arm 200 includes: a clamping cylinder, a cylinder support, etc. Therefore, the control device 100 can control the movement of the clamping cylinder through control instructions to achieve control of the movement of the wafer clamping arm.

[0039] Furthermore, the control device 100 can also be connected to the through-beam sensor of the wafer clamping arm 200, can control the transmitting end of the through-beam sensor to send out a detection signal, and can also obtain the detection signal collected by the receiving end of the through-beam sensor.

[0040] Therefore, during the wet process of semiconductor wafers, the transmitting end of the through-beam sensor is controlled to send a detection signal, and when it is determined that the receiving end of the through-beam sensor has not received the detection signal, it is determined that the wafer clamping arm has clamped the wafer to be processed. At this time, the control device 100 can control the clamping cylinder through control instructions, and drive the clamping arm by detecting the clamping block, the clamping block, etc., to place the wafer to be processed clamped by the wafer clamping arm into the semiconductor wet process environment for processing.

[0041] After completing the semiconductor wet process, the control device 100 can control the transmitting end of the through-beam sensor to send a detection signal according to the received command information, and determine that the wafer clamping arm has clamped the wafer to be processed when it is determined that the receiving end of the through-beam sensor has not received the detection signal. The command information may be sent by the user, or it may be generated based on obtaining the processing parameters of the wafer or after reaching the set processing time.

[0042] Then, the control device 100 can control the clamping cylinder through control instructions, and drive the clamping arm by detecting the clamping block, the clamping block, etc., to pull the wafer to be processed clamped by the wafer clamping arm out of the semiconductor wet process environment. During the pulling process, the diversion and avoidance structure and the large hydrophobic angle structure of the wafer clamping arm can be used to comb and divert the water droplets hanging on the surface of the wafer clamping arm, and the downward wedge-shaped slope of the wafer clamping arm can shrink gravity to condense the water droplets, and the interface junction curve can flow to amplify the water droplets. The interface junction curve arc and the bottom fox top of the profile interface arc can gravity stretch the water droplets to separate, thereby accelerating the speed of water droplet separation and dripping; in addition, the V-groove circular arc groove bottom interface of the wafer clamping fingers in the wafer clamping arm can be used to divert water droplets, and the V-groove annular side wall interface can shrink rheologically condense water droplets to further comb water, thereby reducing the possibility of water droplets invading the surface of the sensor lens to form interfering water mist and water film, avoiding the probability of sensor false alarm, improving sensor detection reliability, and thereby improving the wafer clamping arm environment switching utilization rate and work efficiency.

[0043] It can be seen that in this embodiment, the control device can control the corresponding sensor and transmission structure of the wafer clamping arm to realize the automation of semiconductor wafers entering and exiting the semiconductor wet process environment, thereby improving the production efficiency of wafer processing. In addition, due to the large hydrophobic angle structure, shunt avoidance structure, curved surface connection, V-groove and other hydrophobic structures of the wafer clamping arm, water droplets can drip quickly when the wafer clamping arm is pulled out of the semiconductor wet process environment, reducing the water droplets invading the surface of the sensor lens to form interfering water mist and water film, avoiding the probability of causing the sensor to misjudge the alarm, improving the reliability of sensor detection, and thus improving the environmental switching utilization rate and work efficiency of the wafer clamping arm.

[0044] The system control device used for the wafer clamping arm can control the wafer clamping arm's shooting sensor and transmission structure to realize the automation of semiconductor wafers entering and exiting the semiconductor wet process environment. Figure 6 As shown, in some embodiments, a process for wafer gripper arm control may include: Step 601: Control the transmitting end of the through-beam sensor to send a detection signal.

[0045] The control device may control the transmitting end of the beam sensor to send a detection signal upon receiving the first instruction information, wherein the first instruction information may be sent by the user after the semiconductor wet process is completed. Alternatively, it may be generated after the semiconductor wet process is completed based on the processing parameters of the wafer, or it may be generated after the set processing time is reached.

[0046] Step 602: When it is determined that the receiving end of the through-beam sensor has not received the detection signal, it is determined that the wafer clamping arm has clamped the wafer to be processed.

[0047] Step 603: Control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0048] If the wafer gripping arm is Figure 1 and Figure 2 As shown, the control device can control the clamping cylinder through control instructions, and drive the clamping arm by detecting the clamping block, the clamping block, etc., to pull the wafer to be processed held by the wafer clamping arm out of the semiconductor wet process environment. Similarly, due to the large hydrophobic angle structure, shunt avoidance structure, curved surface connection, V-groove and other hydrophobic structures of the wafer clamping arm, water droplets can drip quickly when the wafer clamping arm is pulled out of the semiconductor wet process environment, reducing the water droplets invading the surface of the sensor lens to form interfering water mist and water film, avoiding the probability of causing the sensor to misjudge the alarm, and improving the reliability of sensor detection.

[0049] Of course, in the embodiment of the present invention, the control device can also control the wafer clamping arm to place the wafer to be processed into the semiconductor wet process environment, that is, the method also includes: controlling the transmitting end of the through-beam sensor to send a detection signal; when it is determined that the receiving end of the through-beam sensor has not received the detection signal, determining that the wafer clamping arm has clamped the wafer to be processed; and controlling the wafer clamping arm through the transmission structure to place the wafer to be processed into the semiconductor wet process environment. In some embodiments, the transmitting end of the through-beam sensor can be controlled to send a detection signal according to the received second instruction information.

[0050] It can be seen that in this embodiment, the control device can control the shooting sensor and transmission structure of the wafer clamping arm, realize the automation of semiconductor wafers entering and exiting the semiconductor wet process environment, and improve the production efficiency of wafer processing.

[0051] According to the above-mentioned process of wafer clamping arm control, a device for wafer clamping arm control can be constructed. Figure 7 A device for controlling a wafer clamping arm provided in an embodiment of the present invention can be applied to a control device of a system for a wafer clamping arm, and is respectively connected to a corresponding sensor and a transmission structure of the wafer clamping arm, such as Figure 7 As shown, the device 700 includes: a first control module 710 , a first determination module 720 , and a second control module 730 .

[0052] The first control module 710 is configured to control the transmitting end of the through-beam sensor to send a detection signal.

[0053] The first determination module 720 is configured to determine that the wafer clamping arm clamps the wafer to be processed when it is determined that the receiving end of the through-beam sensor does not receive the detection signal.

[0054] The second control module 730 is configured to control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0055] In some embodiments, the first control module 710 is specifically configured to control the transmitting end of the through-beam sensor to send a detection signal according to the received first control instruction.

[0056] In some embodiments, the first control module 710 is further configured to control the transmitting end of the through-beam sensor to send a detection signal according to the received second control instruction.

[0057] In some embodiments, the second control module 730 is further configured to control the wafer clamping arm through the transmission structure to place the wafer to be processed into the semiconductor wet process environment.

[0058] It can be seen that in the embodiment of the present invention, for semiconductor wet process, the device for controlling the wafer clamping arm can control the corresponding sensor and transmission structure of the wafer clamping arm, realize the automation of semiconductor wafers entering and exiting the semiconductor wet process environment, and improve the production efficiency of wafer processing. In addition, due to the large hydrophobic angle structure, shunt avoidance structure, curved surface connection, V-groove and other pulling hydrophobic structures of the wafer clamping arm, when the wafer clamping arm is pulled out of the semiconductor wet process environment, water droplets can drip quickly, reducing the water droplets invading the surface of the sensor lens to form interfering water mist and water film, avoiding the probability of causing the sensor to misjudge the alarm, and improving the reliability of sensor detection.

[0059] Combination Figure 8 , an embodiment of the present invention provides a device 800 for controlling a wafer clamping arm, comprising: The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for controlling the wafer clamping arm of the above embodiment.

[0060] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0061] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes the functional application and data processing by running the program instructions / modules stored in the memory 1001, that is, the method for controlling the wafer clamping arm in the above method embodiment is implemented.

[0062] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0063] An embodiment of the present invention provides a control device for a wafer clamping arm, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a control method for a wafer clamping arm when executing the program instructions.

[0064] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for controlling a wafer clamping arm.

[0065] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0066] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0067] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0068] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer clamping arm, characterized in that: include: Clamping arm, sensor and peripheral bracket, transmission structure, among which, The sensor and the peripheral bracket are connected to the clamping arm, and include: a receiving sensor bracket (3) at the receiving end of the clamping counter-shooting sensor (15), and a transmitting sensor bracket (5) at the transmitting end of the clamping counter-shooting sensor (15), and the bottoms of the receiving sensor bracket (3) and the transmitting sensor bracket (5) are respectively large hydrophobic angle structures; The transmission structure is configured to drive the clamping arm to pull the wafer to be processed out of the semiconductor wet process environment through control instructions, wherein the control instructions are obtained based on the situation where the clamping arm clamps the wafer to be processed according to the through-beam sensor (15).

2. The wafer gripping arm according to claim 1, characterized in that: The surfaces of the receiving sensor bracket (3) and the transmitting sensor bracket (5) include descending wedge-shaped inclined surfaces.

3. The wafer gripping arm according to claim 1, characterized in that: Also includes: A receiving sensor cover plate (4) and a transmitting sensor cover plate (6); wherein: The receiving sensor cover plate (4) and the receiving sensor bracket (3) form a flow diversion and avoidance structure; The transmitting sensor cover plate (6) and the transmitting sensor bracket (5) form a flow diversion and avoidance structure.

4. The wafer gripping arm according to claim 3, characterized in that: The surfaces of the flow diversion and avoidance structure are connected with curved surfaces.

5. The wafer gripping arm according to claim 1, characterized in that: The clamping arm comprises: a detection clamping arm (1), a clamping arm (2), a supporting inclined plate (7), and a clamping finger (8); The clamping fingers (8) are respectively mounted on the two ends of the detection clamping arm (1) and the clamping arm (2); when the clamping fingers (8) clamp the wafer to be processed, the receiving end of the through-beam sensor (15) cannot receive the detection signal sent by the transmitting end of the through-beam sensor (15).

6. The wafer gripping arm according to claim 5, characterized in that: The clamping finger (8) comprises: a V-shaped groove arc groove bottom and a V-shaped groove annular side wall.

7. The wafer clamping arm according to any one of claims 1 to 6, characterized in that: The transmission structure comprises: a clamping cylinder (11), a cylinder bracket (12) for mounting the clamping cylinder (11), a detection clamping connecting block (9) connecting the clamping cylinder (11) and the detection clamping arm (1), and a clamping connecting block (10) connecting the clamping cylinder (11) and the clamping arm (2).

8. A system for controlling a wafer clamping arm, characterized in that: It comprises: a control device, and a wafer clamping arm as claimed in any one of claims 1 to 7; wherein, The control device is respectively connected to the through-beam sensor and the transmission structure of the wafer clamping arm, and is configured to control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment when it is determined according to the through-beam sensor that the wafer clamping arm has clamped the wafer to be processed.

9. A method for controlling a wafer clamping arm, characterized in that: The wafer clamping arm as claimed in any one of claims 1 to 7, the method comprising: Control the transmitting end of the through-beam sensor to send a detection signal; When it is determined that the receiving end of the through-beam sensor does not receive the detection signal, it is determined that the wafer clamping arm clamps the wafer to be processed; The transmission structure is used to control the wafer clamping arm to pull the wafer to be processed out of the semiconductor wet process environment.

10. A device for controlling a wafer clamping arm, the device comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for wafer gripping arm control as claimed in claim 9 when executing the program instructions.

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