Device waste treatment method and device manufacturing method

Abstract

The purpose of the present invention is to provide a device waste treatment method and a device manufacturing method which are capable of suppressing the burden caused by waste treatment of installation facilities. In a device disposal method, in a carrying-out step (step S20), a device (50) disposed in a radiation environment on which radiation acts is carried out from an installation facility (100). Furthermore, in the disassembly step (step S130), the disassembly work of the device (50) is performed in another location (110) different from the installation facility (100). Therefore, in the installation facility (100) provided with the device (50), after the carrying-out process is carried out, disassembly work of the device (50) does not need to be carried out. In other places (110), the device (50) can be disassembled in an environment suitable for disassembly work without limitation of the width during operation of the device (50), such as installation of the facility (100). As a result, it is possible to suppress the burden caused by disposal of the installation facility (100).

Description

Technical Field

[0001] This application claims priority based on Japanese Patent Application No. 2023-122605 filed on Jul. 27, 2023. The entire contents of the Japanese Patent Application are incorporated herein by reference.

[0002] The invention relates to a device waste treatment method and a device manufacturing method. Background Art

[0003] Conventionally, as a device arranged in a facility, there is known a device shown in Patent Document 1. The device shown in Patent Document 1 is a self-shielded cyclotron, and since it generates radiation during operation, when it is disposed of, the irradiated parts of the device components and surrounding parts need to be disposed of as radioactive contaminants.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-160462

[0005] Here, the above-mentioned device is dismantled in the cyclotron room of the installation facility. However, since the cyclotron room is narrow, it is difficult to dismantle the radioactive part. In addition, since the dismantling operation is noisy, it is difficult to dismantle the radiopharmaceutical manufacturing device installed in the installation facility such as a hospital, for example, during daytime diagnosis. Therefore, there is a problem that the waste disposal brings a heavy burden to the installation facility. Summary of the invention

[0006] Therefore, an object of the present invention is to provide a method for disposing of an apparatus and a method for manufacturing an apparatus that can suppress the burden of the disposal process on installation facilities.

[0007] In one embodiment, the device disposal method of the present invention disposes a device that is a waste object configured in a setting facility, and the device disposal method comprises: a moving-out process, moving the device configured in a radiation environment where radiation is acted upon from the setting facility; and a disassembly process, disassembling the device in a location other than the setting facility.

[0008] In the device disposal method, in the unloading process, the device placed in the radiation environment where radiation acts is unloaded from the installation facility. And, in the disassembly process, the device disassembly operation is performed in another place different from the installation facility. In this way, in the installation facility where the device is installed, after the unloading process is performed, it is not necessary to perform the device disassembly operation. In other places, such as the installation facility, there is no width restriction when the device is in operation, and the device can be disassembled in an environment suitable for the disassembly operation. In this way, the burden of the disposal of the installation facility can be suppressed.

[0009] The device can be placed in a closed space with a function of shielding radiation in the installation facility. In order to minimize the number of components that block radiation in the closed space, the space becomes narrow. Therefore, it is difficult to dismantle the device in the closed space. Therefore, it is effective to dismantle the device in other places.

[0010] The method may be as follows: a first component placed on the floor and a second component as a device placed on the first component are arranged in a closed space, at least a portion of the second component is radially arranged, and the second component is mounted on the first component by a detachable mounting mechanism. Therefore, the second component to be carried out can be easily detached from the first component placed on the floor and carried out from the closed space.

[0011] The second component may include a yoke, a magnetic pole, and a vacuum box that are detachably connected to each other via a connecting component. The yoke, the magnetic pole, and the vacuum box can be easily disassembled by removing the connecting component. Thus, by disassembling into each component in a short time without generating dust, it is easy to carry out from the closed space.

[0012] The second component may include a self-shielding member that covers the yoke, the magnetic pole and the vacuum box and has a radiation shielding capability, and the self-shielding member may be formed by combining a plurality of detachable parts. In this case, since the self-shielding member can also be easily disassembled into parts, it is easy to carry out from the closed space.

[0013] The enclosed space may have a carry-out port of a size that allows the largest component to be carried out of the detachable components in the second component, or a carry-out port of a size that allows the largest component to be carried out is provided in the enclosed space, and the components are carried out from the carry-out port. Thus, when the second component is disassembled into the components, dust is not generated due to collision with the wall of the enclosed space, and the components can be easily carried out from the carry-out port.

[0014] The detachable components in the second member can be carried out in order starting from the components arranged near the carrying-out port. At this time, the generation of dust etc. caused by the components being crushed by collision with other components can be suppressed.

[0015] In other places, the device can be disassembled and the disassembled parts can be sorted and discarded based on the degree of radioactivity. In this case, since the parts with a high degree of radioactivity can be selectively discarded, the amount of waste can be reduced.

[0016] In other places, the irradiated parts of the equipment that have produced a radiation dose exceeding the specified value can be identified, cut out and discarded. The closed space where the facility is installed is difficult to identify because the space itself is irradiated, but in other places, it can be accurately identified.

[0017] The radioactive part can be identified by core drilling. In this case, the radioactive part can be identified from the device and then classified.

[0018] The device disposal method may include a transport step of shielding radiation generated from the device and transporting the device from the installation facility to another location. In this case, when transporting the device from the installation facility to another location, radiation leakage from the device can be suppressed.

[0019] The other places may have a dismantling area for dismantling the device, which is covered with a scattering suppression member to suppress dust scattering. In this case, in the dismantling area, work can be performed in a state where dust scattering is suppressed when dismantling the device.

[0020] The radioactive part identified in other places can be transported to the disposal area, and the parts other than the radioactive part in the device can be transported to the recycling area. In this case, the radioactive part is discarded in the disposal area, and the parts other than the radioactive part can be reused in the recycling area without being discarded.

[0021] The device manufacturing method involved in the present invention manufactures a new device in the installation facility after discarding a device that is a discarded object configured in the installation facility. In the device manufacturing method, after moving a device configured in a radiation environment where radiation is acted upon from the installation facility, the new device is manufactured in the radiation environment of the installation facility while disassembling the device in a location other than the installation facility.

[0022] In this device manufacturing method, a device placed in a radiation environment where radiation acts is carried out from a setting facility. And, the disassembly operation of the device is performed in another place different from the setting facility. In this way, in the setting facility where the device is installed, it is not necessary to perform the disassembly operation of the device after carrying it out. In other places, such as the setting facility, there is no width restriction when the device is in operation, and the device can be disassembled in an environment suitable for the disassembly operation. Here, in the setting facility after the device to be discarded is carried out, the following operations can be performed. Therefore, when the disassembly operation of the device is performed in another place different from the setting facility, a new device is manufactured in the radiation environment of the setting facility. Thereby, there is no need to wait for the device to be disassembled, and the next new device can be manufactured in the radiation environment. Thereby, the burden of disposal of the setting facility can be suppressed.

[0023] Effects of the Invention

[0024] According to the present invention, it is possible to provide a device disposal method and a device manufacturing method capable of suppressing the burden of disposal on installation facilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram showing a facility for carrying out the device disposal method according to the embodiment of the present invention.

[0026] Figure 2 It is a top cross-sectional view of the RI production apparatus 1 .

[0027] Figure 3 It is a front cross-sectional view of the RI production apparatus 1 .

[0028] Figure 4 is a disassembled perspective view of the accelerator showing the vacuum box disassembled in a manner such that the interior is visible.

[0029] Figure 5 This is a diagram showing an example of a layout in which an RI production device equipped with a self-shielding member is arranged in a building of a PET facility.

[0030] Figure 6 This is a diagram showing an example of a layout in which an RI production device not equipped with a self-shielding member is arranged in a building of a PET facility.

[0031] Figure 7 This is a process diagram showing the steps of the device disposal method.

[0032] Figure 8 middle, Figure 8 (a) is a process diagram showing the process of transporting the components of the device from the installation facility to another location, Figure 8 (b) is a process diagram showing the contents of work in other places and installation facilities.

[0033] Fig. 9 It is a diagram showing a transport vehicle.

[0034] Fig.10 This is an enlarged schematic diagram showing a portion of the factory site.

[0035] Fig.11 This is an enlarged schematic diagram of the reuse plant area and waste storage facilities.

[0036] Fig.12 This is an enlarged rough diagram of the disassembled area.

[0037] In the figure: 6-self-shielding part, 42-magnetic pole, 44-vacuum box, 46-magnetic yoke, 50-device, 51-first part, 52-second part, 75-enclosed space, 78-exit, 100-installation facility, 110-other places, 113-waste storage facility (waste area), 204-disassembly area, 210-operation test area (reuse area), 221-accelerator use area (reuse area). DETAILED DESCRIPTION

[0038] Hereinafter, the device disposal method according to the embodiment of the present invention will be described in detail with reference to the drawings. In the description, the words "upper" and "lower" are sometimes used, which correspond to the upper direction and the lower direction in the drawings.

[0039] The device disposal method according to the present embodiment is a method of disposing of the device 50 to be disposed of that is placed in the installation facility 100 . Figure 1 1 is a schematic diagram showing a facility for implementing the device disposal method according to the present embodiment. Figure 1 As shown, in the device disposal method, the device 50 to be disposed of is removed from the radiation environment of the installation facility 100, and the device 50 is dismantled in another place 110 different from the installation facility 100. The radiation environment refers to an environment where radiation acts, and is the range covered by radiation generated during the operation of the device 50.

[0040] In the present embodiment, the RI manufacturing device 1 is used as the device 50 to be disposed. The PET facility 101 is used as the installation facility 100. The PET facility 101 is a facility that performs medical treatment using a drug for inspection of a radioisotope (RI) used in positron tomography (PET). The PET facility 101 has a building 102 in which the RI manufacturing device 1 is arranged. The RI manufacturing device 1 that becomes a disposal object in the PET facility 101 is carried out to the outside of the building 102. The portion of the building 102 that is irradiated by the arrangement and use of the RI manufacturing device 1 is dismantled and handed over to the RI Association or the like.

[0041] The unloaded RI manufacturing apparatus 1 is transported to a factory 111 which is another place 110 different from the PET facility 101. The factory 111 includes a reuse factory 112 and a waste storage facility 113. The reuse factory 112 is a factory that takes out reusable parts from the RI manufacturing apparatus 1. The reuse factory 112 includes a recycling station 114 and a sorting station 116. The recycling station 114 is a place where the RI manufacturing apparatus 1 that has been transported is received. The sorting station 116 is a place where the RI manufacturing apparatus 1 is disassembled and the disassembled components are sorted based on the degree of radioactivity. In the sorting station 116, the components of the RI manufacturing apparatus 1 are sorted into reusable parts and radioactive contaminants. The waste storage facility 113 is a facility that stores radioactive waste. The waste storage facility 113 includes a radioactive contaminant storage station 117. The radioactive contaminant storage station 117 is a place where radioactive contaminants sorted from the RI manufacturing apparatus 1 are stored. The radioactive contaminants stored in the radioactive contaminant storage station 117 for a predetermined period are handed over to the RI Association.

[0042] Next, refer to Figure 2 to Figure 4 , the structure of the RI production apparatus 1 as the apparatus 50 to be discarded will be described. Figure 2 It is a top cross-sectional view of the RI production apparatus 1 . Figure 3 It is a front cross-sectional view of the RI production apparatus 1 . Figure 4 This is a disassembled perspective view of the accelerator 2 , which is disassembled and shown in a manner such that the vacuum box 44 is visible inside.

[0043] like Figure 2 and Figure 3 As shown, the RI manufacturing apparatus 1 includes a target device 10. The RI manufacturing apparatus 1 manufactures radioactive isotopes (RI). The RI manufacturing apparatus 1 can be used as a cyclotron for PET, for example. The RI manufactured by the RI manufacturing apparatus 1 is used, for example, to manufacture radiopharmaceuticals (including radiopharmaceuticals) as radioisotope-labeled compounds (RI compounds). As radioisotope-labeled compounds used in PET examinations (positron emission tomography examinations) in hospitals, etc., there are 18 F-FDG (fluorodeoxyglucose), 18 F-FLT (fluorothymidine), 18 F-FMISO (Fluoronitriloimidazole), 11 C-raclopride, etc.

[0044] Figure 2 to Figure 4 The RI manufacturing device 1 shown as an example is a so-called self-shielded particle accelerator system, which includes an accelerator 2 for accelerating charged particles and a self-shielding member 6 as a radiation shield (wall body) for surrounding the accelerator 2 and shielding radiation. In the internal space S surrounded by the self-shielding member 6, in addition to the accelerator 2, a target device 10 for manufacturing RI, a vacuum pump 4 for evacuating the inside of the accelerator 2, and the like are arranged. In addition, in the internal space S, accessories required for the operation of the accelerator 2, accessories for cooling the target device 10, and the like are arranged.

[0045] The accelerator 2 is a so-called vertical cyclotron. Figure 4 As shown in FIG. 1 , the accelerator 2 includes a pair of magnetic poles 42, a vacuum box 44, and an annular yoke 46 surrounding the pair of magnetic poles 42 and the vacuum box 44. A portion of the pair of magnetic poles 42 is inserted into the vacuum box 44, and the upper surfaces face each other with a predetermined gap in the vacuum box 44. In the gap between the pair of magnetic poles 42, particles such as protons and deuterons are accelerated. The accelerated particles are charged particle beams B (see FIG. 1 ). Figure 2 and Figure 3 ) is ejected from the side 45 of the vacuum box 44.

[0046] like Figure 2 and Figure 3As shown, the target device 10 is a device for receiving the charged particle beam B irradiated from the accelerator 2 to produce RI, and has a container for accommodating raw materials (such as target water; 18 The target device 10 is covered by a target shield 7 provided in the accelerator 2.

[0047] The self-shielding member 6 is composed of a plurality of parts and is formed to cover the accelerator 2 and the target device 10. The self-shielding member 6 is a structure in which the accelerator 2 and the target device 10 are arranged and in which the RI is manufactured by irradiating the charged particle beam B from the accelerator 2 to the target. The self-shielding member 6 is a structure for shielding the radiation generated when manufacturing the RI and preventing the radiation from leaking to the outside of the self-shielding member 6.

[0048] like Figure 2 As shown, the self-shielding member 6 includes: side walls 11 and 12, which are opposed to each other in the irradiation direction of the charged particle beam B; and side walls 13 and 14, which are opposed to each other in the horizontal direction orthogonal to the irradiation direction of the charged particle beam B. The side wall 11 and the side wall 12 are arranged to be separated from each other, and the side wall 13 and the side wall 14 are arranged to be separated from each other. The ends of one side of the side walls 13 and 14 are connected to the two ends of the side wall 11, and the ends of the other side of the side walls 13 and 14 are connected to the two ends of the side wall 12. As a result, the internal space S of the self-shielding member 6 is surrounded by the side walls 11, 12, 13, and 14 without a gap on all sides.

[0049] like Figure 3 As shown, the upper end of the self-shielding member 6 is closed by the upper wall portion 15. That is, the upper wall portion 15 is connected to the upper end of the side walls 11, 12, 13, 14. The lower end of the side walls 11, 12, 13, 14 is set on the floor 16. Thus, the internal space S surrounded by the side walls 11, 12, 13, 14 is closed by the upper wall portion 15 and the floor 16 in the up and down direction without a gap.

[0050] Next, refer to Figure 5 An example of a layout in which the RI production apparatus 1 including the self-shielding member 6 is disposed in the building 102 of the PET facility 101 will be described. Figure 5 (a) shows a side view of the layout. Figure 5 (b) shows a plan view of the layout. The building 102 has a cyclotron chamber 70. In addition, a closed space 75 surrounded by a wall 76 and a ceiling 77 that shield radiation is formed inside the wall 71 that partitions the cyclotron chamber 70. The wall 76 is made of a material that has a function of shielding radiation, such as concrete. Thus, the RI manufacturing device 1 is arranged in the closed space 75 that has a function of shielding radiation in the PET facility 101. The thickness of the wall 76 and the ceiling 77 is set to, for example, about 0.6 to 0.8 m.

[0051] The closed space 75 is provided with a first component 51 installed on the floor and a second component 52 as a device 50 installed on the first component 51. The second component 52 is a component that is at least partially radiated. The degree of radiation of the second component 52 may be higher than that of the first component 51. In addition, in the present embodiment, the degree of radiation of the second component 52 is higher than that of the first component 51, but the relationship between the degree of radiation of the second component 52 and the first component 51 is not limited to this. It is sufficient that at least a portion of the second component 52 is radiated. Figure 5 In the example shown, a stand 53 installed on the floor of the closed space 75 is used as the first component 51. As the second component 52, an RI manufacturing device 1 having a self-shielding member 6 is used. The second component 52 is mounted on the first component 51 using a detachable mounting mechanism. The detachable mounting mechanism refers to a mechanism that can release the fixation of the second component 52 and the first component 51 without destruction (cutting, crushing, chiseling, etc.), and various fixing tools such as bolts are used. In addition, a guide portion 55 for opening and closing a portion of the self-shielding member 6 is formed on the stand 53 (see Figure 5 (b)). The guide portion 55 is formed by forming a groove on the upper surface of the stand 53 and installing a component for sliding the self-shielding member 6. Figure 6 As shown in FIG. 1 , the mechanism for stably arranging the second member 52 on the guide rail 54 is also a detachable mounting mechanism. At least a portion of the second member 52 is radially disposed. Figure 6 As shown in FIG. 1 , for an RI manufacturing apparatus 1 having a self-shielding member 6, a guide rail 54 protruding from the floor can be used as the first member 51. Also, for an RI manufacturing apparatus 1 not having a self-shielding member 6, a guide rail 54 protruding from the floor can be used as the first member 51. Figure 5 The stand 53 on which the guide portion 55 is formed is shown as the first member 51 .

[0052] The second member 52 includes a yoke 46, a magnetic pole 42, and a vacuum box 44 (see Figure 4 ). The connection member is a mechanical connection mechanism such as a bolt, and is a member that can be released without being destroyed. As described above, the self-shielding member 6 is composed of a plurality of detachable parts.

[0053] The closed space 75 is provided with a carrying port 78 having a size that allows the largest component among the detachable components in the second member 52 to be carried out. Figure 5In the example shown in (b), a carry-out port 78 is provided in one of the four wall portions 76. In addition, in the case where a self-shielding member 6 is provided, since the wall portion 76 is not radialized, the carry-out port 78 can be formed by simply destroying the wall portion 76. In addition, the enclosed space 75 may also have a carry-out port 78. In this case, the carry-out port 78 may be an existing door of the enclosed space 75. The detachable components in the second part 52 include the yoke 46, the magnetic pole 42, the vacuum box 44 and the various parts of the self-shielding member 6. Among them, the component with the largest outer dimension becomes the largest component. As the largest component, the parts of the self-shielding member 6 can be cited. The size of the carry-out port 78 is set to a size that the largest component will not collide with the edge of the carry-out port 78.

[0054] Here, the closed space 75 is formed according to the size of the RI manufacturing device 1, and in addition to the size of the RI manufacturing device 1 itself, a space of the degree of passage (close to the accelerator 2) for workers to pass through is ensured. However, the size of the closed space 75 is not enough to fully operate the device for chiseling. Chiseling refers to the destruction of a structure such as a wall or a ground room made of concrete, or cutting a surface to shape it.

[0055] Next, refer to Figure 6 An example of a layout in which an RI production apparatus 1 not having a self-shielding member 6 is disposed in a building 102 of a PET facility 101 will be described. Figure 6 (a) shows a side view of the layout. Figure 6 (b) shows a plan view of the layout. In the case where the RI manufacturing apparatus 1 does not have the self-shielding member 6, the accelerator 2 is arranged in a state of being exposed in the closed space 75. Therefore, the thickness of the wall 76, the ceiling 77, and the floor 79 surrounding the closed space 75 to shield the radiation is greater than Figure 5 For example, the thickness of the wall 76, the ceiling 77, and the floor 79 is set to about 1.3 to 2.2 m.

[0056] exist Figure 6 In the example shown, a guide rail 54 provided on the floor of the closed space 75 is used as the first component 51. An RI manufacturing apparatus 1 without the self-shielding member 6 is used as the second component 52. The second component 52 is mounted on the first component 51 by a detachable mounting mechanism. By stably arranging the second component 52 on the guide rail 54, the first component 51 and the second component 52 are detachably mounted.

[0057] exist Figure 6In the example shown, a discharge port 78 having a size that allows the largest component to be discharged is provided in the closed space 75. The discharge port 78 is provided by destroying one of the four walls 76. At this time, the radialized portion is crushed by chiseling the inner side of the wall 76, and the dust is recovered. Thereafter, the wall 76 is destroyed from the outer side to provide the discharge port 78.

[0058] Next, refer to Figure 7 , the steps of the device disposal method are explained. Figure 7 (a) is a process diagram showing the processing contents in the PET facility 101. Figure 7 (b) is a process diagram showing the processing contents in the factory 111.

[0059] like Figure 7 As shown in (a), in the PET facility 101, a discharge port 78 is formed in the closed space 75 (step S10). When the discharge port 78 is not provided in the closed space 75, the discharge port 78 is formed by destroying the wall portion 76. In the case where the closed space 75 is provided with a discharge port 78, the discharge port 78 is formed by opening the door. In the case where the irradiated part is crushed by chiseling the inner side of the wall portion 76, the dust is collected and discarded.

[0060] Next, the RI manufacturing device 1 as the device 50 is unloaded from the unloading port 78 of the closed space 75 and transported to the factory 111 (step S20: unloading process). When unloading, the device 50 can be self-lifted from below, and rollers can be inserted to slide the device 50. Alternatively, it can be moved using a push cart. After the device 50 is unloaded to the outside of the closed space 75, it can be lifted by a crane.

[0061] At this time, the yoke, the magnetic poles, and the connection parts between the vacuum box are removed for disassembly. In addition, if there is a self-shielding member 6, the self-shielding member 6 is disassembled into individual parts. The detachable components in the device 50 are sequentially unloaded starting from the components arranged near the unloading port 78.

[0062] After all the components of the device 50 are moved out of the closed space 75, they are transported from the PET facility 101 to the factory 111 by a vehicle or the like.

[0063] Next, the building 102 is disposed of (step S30). At this time, the wall 76, ceiling 77 and floor 79 of the closed space 75 after the device 50 is removed are destroyed by chiseling or the like. The radioactive materials are collected and put into iron drums, which are then handed over to the RI Association.

[0064] like Figure 7As shown in (b), the device 50 transported is received in the factory 111 (step S110). In the factory 111, the irradiated part of the device 50 that produces a radiation dose greater than a predetermined value is identified (step S120). And, based on the identification result, the device 50 is disassembled (step S130: disassembly process). The disassembled parts are classified based on the size of the irradiation and discarded (step S140).

[0065] In step S130, based on the result of the determination, the irradiated portion is cut out, and in step S140, the cut out portion is discarded as a radioactive contaminant. The portion that is not irradiated is reused. The yoke of the device 50, which is an iron block, and the self-shielding member 6, which is a concrete block, are disassembled by cutting using a wire saw or the like or chiseling the cutting surface. Among the disassembled items, the irradiated items are stored in a radioactive contaminant storage station. In step S120, for example, the irradiated portion can be determined by core drilling.

[0066] Here, a method for identifying the radioactive part of the self-shielding member 6 by core drilling is described. In order to confirm the radioactive state of the self-shielding member 6 in the depth direction, core drilling is performed at multiple locations (for example, about 10 locations) from the inner side of the self-shielding member 6 to obtain concrete samples. The core sample is cut into rings in the depth direction, and each sample at each depth is crushed into particles. The radioactive energy is then measured using a radiation detector to identify the radioactive nuclide. If the radioactive energy distribution in the depth direction is understood, the range of radioactive energy can be confirmed based on its radioactive energy concentration. The part determined to be radioactive is chiseled and classified as a radioactive contaminant.

[0067] Next, refer to Figure 8 (a) of the present invention will describe the process of transporting the components of the device 50 from the installation facility 100 to another location 110 (from the PET facility 101 to the factory 111). Figure 8 As shown in (a), the transport operator receives the components of the device 50 from the PET facility 101 (step S210). At this time, the transport operator loads the components 59 of the device 50 into the cargo box 301 of the transport vehicle 300 (refer to Fig. 9). In the cargo box 301, the component 59 of the device 50 is covered with a shielding member 80 to shield the radiation generated by it. The shielding member 80 is a member capable of shielding radiation, and is not particularly limited as long as it is a member capable of covering the component 59. For example, as the shielding member 80, a sheet having radiation shielding performance can be used. The sheet is not particularly limited, for example, a sheet containing lead can be used. For example, the component 59 is wound with plastic or the like in multiple layers, and then covered with a lead sheet from above. In addition, the lead sheet is about 1 to 2 mm, for example, it can have a size of about 1m×1m or 0.5m×0.5m. In addition, a simple thin plate-shaped member of lead (without impurities) can be used as the lead sheet. In addition, the shielding member 80 is not limited to a sheet-shaped member, and the component 59 can also be separated by a partition having a shielding function. For example, the component 59 can be separated by a partition that can support the lead sheet. In step S210, the radiation dose leaked from the component 59 is measured, and if it satisfies a predetermined standard, transportation is performed. The method of measuring radiation is not particularly limited, and for example, the measurement may be performed at the exit 302 of the cargo box 301.

[0068] Next, the components 59 of the device 50 are transported from the installation facility 100 to the other location 110 while shielding the radiation generated from the components 59 of the device 50 (step S220: transport process). The transport vehicle 300 moves from the installation facility 100 to the other location 110 together with the device 50. As described above, during the transport, the transport is performed in a state where the radiation leakage from the cargo box 301 is suppressed. Next, after the transport worker arrives at the other location 110, the components 59 of the device 50 are handed over (step S230).

[0069] Thus, the component 59 of the device 50 can be transported in a state where the radiation leakage from the cargo box 301 to the outside is suppressed. In the past, the component 5 was placed in an iron barrel, but if the leakage dose exceeded a specified value, it was necessary to wait in a specified space in the hospital until the dose dropped. However, in this embodiment, by covering the component 59 of the device 50 with the shielding member 80, it is not necessary to wait in the hospital, and the space in the hospital can be effectively used.

[0070] like Figure 8As shown in (b), after the device 50 disposed in the radiation environment acted upon by radiation is moved out from the installation facility 100, a new device 50 can be manufactured in the radiation environment of the installation facility 100 while performing a processing operation (step S410) of the device 50 in another location 110 different from the installation facility 100. In the installation facility 100, the components for the new device 50 are moved into the closed space 75 (step S310). Next, the new device 50 is assembled in the closed space 75. The operations of steps S310 and S320 are performed at the same timing as the processing operations 410 in the other location 110, but all operations in the two locations do not need to be performed at the same time, as long as the timing of the start to end of the operations partially overlaps. In addition, the processing operations 410 may include Figure 7 The operation of steps S110 to S140 shown in (b).

[0071] Next, refer to Figure 10 to Figure 12 , a specific example of the structure and work content of the factory 111 as the other place 110 is described in detail. Fig.10 This is an enlarged schematic diagram showing a part of the site of the factory 111. The factory 111 includes an operation test area 210 (recycling area), a building 220, a recycling factory area 200, and a waste storage facility 113 (waste area).

[0072] The operation test area 210 has an accelerator room and an irradiation room for irradiating particle beams accelerated by the accelerator. In the operation test area 210, an operation test can be performed to assemble the reusable products 140 sorted in the reuse factory area 200 into the device and investigate their usability. The building 220 has an accelerator use area 221 (reuse area) and a recycling station 114. The accelerator use area 221 is an area where the accelerator 2 is used. The recycling station 114 is an area where the accelerator 2 is used. Fig. 9 ) is a place where radioactive materials 141 (components 59 of the device 50) are received. The radioactive materials 141 received by the recycling station 114 are transported to the recycling factory area 200. In the recycling factory area 200, the components 59 of the device 50 are classified into reusable products 140 and waste 142 according to the radiation dose. The recycling factory area 200 has Figure 1 The functions of the recycling station 114 and the sorting station 116 are performed in the waste storage facility 113. The waste 142 is stored.

[0073] refer to Fig.11 , a specific example of reusing the factory area 200 is described in further detail. Fig.11 FIG. 2 is an enlarged schematic diagram of the reuse plant area 200 and the waste storage facility 113. Fig.11As shown, the reuse factory area 200 includes a reuse processing factory 201, a reused product storage area 202, and an inspection room 203. The reuse processing factory 201 is a factory that performs reuse processing on the received radioactive materials 141 and classifies them into reused products 140 and waste 142. The reuse processing factory 201 includes a dismantling area 204. The reused product storage area 202 is a place for storing the classified reused products 140. The inspection room 203 includes a contamination inspection room for performing contamination inspection, a measurement room for measuring radiation, and the like.

[0074] refer to Fig.12 , a specific example of the disassembly area 204 is described in further detail. Fig.12 is an enlarged schematic diagram of the disassembled area 204. In addition, for comparison with the disassembled area 204, Fig.12 FIG. 7 shows an enclosed space 75 of a PET facility 101. Fig.12 As shown, the disassembly area 204 is an area for disassembling the device 50, which is covered by a scattering suppression member 205 to suppress the scattering of dust. The scattering suppression member 205 is not particularly limited as long as it can suppress the scattering of dust generated by the disassembly operation of the device 50. For example, a plastic film, a partition, etc. can be used. A ventilation device 206 is provided in the disassembly area 204 to ventilate the area and collect the scattered dust. In addition, dust can also become radioactive substances, so if the workers inhale it, there will be health problems. Therefore, the ventilation device 206 can not only discharge the dust to the outside, but also set a filter to recover the dust. A processing device 207 for disassembling the various components 59 of the device 50 is provided in the disassembly area 204. The processing device 207 is a device for cutting work such as a wire saw, a device for chiseling work, etc. The disassembly area 204 ensures a wide space SP for disassembly work. The various components 59 of the disassembled device 50 are arranged in the space SP. The waste 142 (radioactive part) identified in the disassembly area 204 is transported to the waste storage facility 113 as a waste area, and the reusable products 140 (parts other than the radioactive part) in the storage device 50 at the reusable product placement area 202 are then transported to the operation test area 210 and the accelerator use area 221 as recycling areas.

[0075] like Fig.12As shown, inside the closed space 75 of the PET facility 101, the gap GP1 between the device 50 and the wall is very narrow, and it is difficult to ensure a working space (about 1m) for chiseling and the like. On the other hand, compared with the closed space 75, the dismantling area 204 of the other place 110 ensures a sufficiently spacious space. Therefore, in the dismantling area 204, compared with the case where the dismantling work is performed in the closed space 75, the work can be performed efficiently. In addition, the closed space 75 is a dedicated space for operating the device 50, so sometimes the lighting equipment is insufficient and it is dim for the work. On the other hand, the dismantling area 204 is an area mainly for work, so it is bright. Since the closed space 75 is part of the medical facility, it cannot make noise, and it is difficult to work because the working time is limited. On the other hand, the dismantling area 204 is an area in a spacious factory, so it can be operated without worrying about making noise and suppressing the limitation of the working time. There are no equipment required for dismantling in the closed space 75, and there is no dust treatment equipment. On the other hand, necessary equipment and dust handling equipment can be installed in the dismantling area 204 .

[0076] Next, the operation and effects of the device disposal method according to the present embodiment will be described.

[0077] First, as a comparative example, a case where the device 50 is dismantled in the closed space 75 of the installation facility 100 will be described. Since the RI manufacturing device 1 includes a yoke (about 20 tons of iron), a self-shielding member (about 100 tons of concrete), etc., in order to dismantle these, cutting work and chiseling work using a wire saw or the like are required. However, in general, in order to minimize the amount of radiation shielding materials, the closed space 75 is suppressed to the minimum space required to install the RI manufacturing device 1. For example, Figure 5 and Figure 6As shown, if the moving range of the guide 55 or the guide rail 54 is considered, only the space for setting the RI manufacturing device 1 and the space for the passage for the workers to pass are ensured in the closed space 75. Therefore, the closed space 75 is a very narrow space for cutting or chiseling operations. In addition, since the dust generated during the operation is radioactive, it is necessary to collect and process them with a dust collector in order to prevent the internal exposure of the workers or to prevent them from scattering outside the management area. In addition, noise is generated during the cutting or chiseling operation, so the hospital under diagnosis has to limit the operation to holidays or at night, and if there is an inpatient facility nearby, measures need to be taken to reduce the noise. In addition, the iron drum containing radioactive contaminants cut in the facility for shipment to the RI Association needs to reduce the surface dose of the iron drum to a certain value or less in order to be handed over to the RI Association. Therefore, it is necessary to reduce the radiation dose generated from the discontinued RI manufacturing device 1 and to cool it down within a certain period of time (waiting time). As a result, there is a problem of a large burden on the disposal of the installation facility 100.

[0078] In the device disposal method according to the present embodiment, in the unloading process (step S20), the device 50 disposed in the radiation environment where radiation acts is unloaded from the installation facility 100. And, in the disassembly process (step S130), the device 50 is disassembled in another place 110 different from the installation facility 100. In this way, in the installation facility 100 where the device 50 is installed, it is not necessary to disassemble the device 50 after the unloading process is performed. In the other place 110, there is no limitation on the width when the device 50 is in operation, as in the installation facility 100, and the device 50 can be disassembled in an environment suitable for the disassembly work. Thus, the burden of the disposal of the installation facility 100 can be suppressed.

[0079] By receiving the RI manufacturing device 1 in the factory 111, the disassembly work can be performed using the dedicated equipment in the factory. Therefore, the work space and equipment required for the operator can be prepared, and safety can be improved. In addition, in the installation facility 100, there is no need to perform work in the facility except for the work during the unloading, thereby reducing the impact on the facility. In addition, the RI manufacturing device 1 to be unloaded needs to suppress the dose on the surface of the device in accordance with the regulations during transportation, but this is easier than reducing the surface dose of the iron drum with limited size and weight for transfer to the RI Association, and the cooling period can also be relatively short.

[0080] The device 50 can be placed in a closed space 75 having a function of shielding radiation in the installation facility 100. In order to minimize the number of components that block radiation, the closed space 75 is a narrow space. Therefore, it is difficult to dismantle the device 50 in the closed space 75. Therefore, it is effective to perform the dismantling work in other places.

[0081] The first component 51 installed on the floor and the second component 52 as the device 50 installed on the first component 51 are arranged in the closed space 75, at least a part of the second component 52 is radialized, and the second component 52 is mounted on the first component 51 by a detachable mounting mechanism. Therefore, the second component 52 to be carried out can be easily removed from the first component 51 installed on the floor and carried out from the closed space 75.

[0082] The second member 52 may include a yoke 46, a magnetic pole 42, and a vacuum box 44 that are detachably connected to each other by a connecting member. By removing the connecting member, the yoke 46, the magnetic pole 42, and the vacuum box 44 can be easily removed. Thus, by disassembling into each component in a short time without generating dust, it is easy to carry out from the closed space 75.

[0083] The second component 52 may include a self-shielding member 6 that covers the yoke 46, the magnetic pole 42, and the vacuum box 44 and has a radiation shielding capability, and the self-shielding member 6 may be formed by combining a plurality of detachable parts. At this time, since the self-shielding member 6 can also be easily disassembled into parts, it is easy to carry out from the closed space 75.

[0084] The closed space 75 may have a discharge port 78 of a size that allows the largest component to be discharged from the detachable components in the second member 52, or a discharge port 78 of a size that allows the largest component to be discharged may be provided in the closed space 75, and the components may be discharged from the discharge port 78. Thus, when the second member 52 is disassembled into the components, dust is not generated due to collision with the wall portion 76 of the closed space 75, and the components can be easily discharged from the discharge port 78.

[0085] The detachable components in the second member 52 can be carried out in order starting from the components arranged near the carrying-out port 78. In this case, the generation of dust etc. caused by the components being crushed by collision with other components can be suppressed. In addition, it is easy to ensure space during the chiseling operation, and the generation of dust etc. can be suppressed.

[0086] In another place 110, the device 50 can be disassembled, and the disassembled parts can be classified and discarded based on the degree of radioactivity. In this case, since the parts with a high degree of radioactivity can be selectively discarded, the amount of waste can be reduced.

[0087] In other places 110, irradiated parts of device 50 that have generated a radiation dose greater than a predetermined value can be identified, cut out, and discarded. The closed space of installation facility 100 is difficult to identify because the space itself is irradiated, but other places can accurately identify it.

[0088] The radioactive part can be identified by core drilling. In this case, the radioactive part can be determined from the device 50 and then classified.

[0089] The device disposal method may include a transport step of transporting the device 50 from the installation facility 100 to another location 110 while shielding the radiation generated from the device 50. In this case, when the device 50 is transported from the installation facility 100 to another location 110, leakage of radiation from the device 50 can be suppressed.

[0090] The other place 110 may include a dismantling area 204 for dismantling the device 50, which is covered with a scattering suppression member 205 to suppress scattering of dust. In this case, in the dismantling area 204, work can be performed in a state where scattering of dust is suppressed when dismantling the device 50.

[0091] The radioactive part identified in the other place 110 can be transported to the disposal area, and the part other than the radioactive part in the device 50 can be transported to the recycling area. In this case, the radioactive part is discarded in the disposal area, and the part other than the radioactive part can be reused in the recycling area without being discarded. In addition, in addition to the non-radioactive parts (parts that are not radioactive), for example, self-shielding parts, yokes, etc., which have no problem in recycling even if they are radioactive according to the shape of the object, can also be judged for recycling.

[0092] The device manufacturing method involved in this embodiment manufactures a new device 50 in the installation facility 100 after discarding the device 50 that is a discarded object configured in the installation facility 100. In the device manufacturing method, after the device 50 configured in a radiation environment where radiation is acted on is moved out of the installation facility 100, the new device 50 is manufactured in the radiation environment of the installation facility 100 while the device 50 is disassembled in another place 110 different from the installation facility 100.

[0093] In the device manufacturing method, the device 50 disposed in the radiation environment where radiation acts is carried out from the installation facility 100. And the disassembly work of the device 50 is performed in another place 110 different from the installation facility 100. In this way, in the installation facility 100 where the device 50 is installed, it is not necessary to disassemble the device 50 after carrying it out. In other places, there is no limitation on the width when the device 50 is in operation, as in the installation facility 100, and the device 50 can be disassembled in an environment suitable for the disassembly work. Here, the next operation can be performed in the installation facility 100 after the device 50 to be discarded is carried out. Therefore, when the disassembly work of the device 50 is performed in another place 110 different from the installation facility 100, a new device 50 is manufactured in the radiation environment of the installation facility 100. Therefore, it is possible to manufacture the next new device 50 in the radiation environment without waiting for the device 50 to be disassembled. Therefore, it is possible to suppress the burden of the disposal treatment of the installation facility (100).

[0094] As mentioned above, although one embodiment of the present invention has been described, the present invention is not limited to the above embodiment, and modifications are possible within the scope of the gist described in each claim.

[0095] For example, the second component may not be the RI manufacturing device, but may be a beam line of charged particle beam, a magnet of BT system, a gantry of a proton beam irradiation device, a BNCT device, or the like.

[0096] Figure 5 and Figure 6 The layout shown is just an example and can be changed appropriately.

Claims

1. A method for disposing of a device disposed of in a facility, the method comprising: a carrying out step of carrying out the device placed in a radiation environment where radiation is applied from the installation facility; and The dismantling step is to dismantle the device at a location other than the installation facility.

2. The method for disposing of a device according to claim 1, wherein: The device is arranged in the installation facility in a closed space having a function of shielding radiation.

3. The method for disposing of a device according to claim 2, wherein: A first component installed on the floor and a second component as the device installed on the first component are arranged in the closed space. At least a portion of the second member is radiated, The second component is mounted on the first component by a detachable mounting mechanism.

4. The method for disposing of a device according to claim 3, wherein: The second component includes a yoke, a magnetic pole, and a vacuum box which are detachably connected to each other via a connecting member.

5. The method for disposing of a device according to claim 4, wherein: The second component includes a self-shielding member that covers the yoke, the magnetic pole, and the vacuum box and has a radiation shielding capability. The self-shielding member is constructed by combining a plurality of detachable parts.

6. The method for disposing of a device according to claim 4, wherein: The enclosed space has an outlet of a size capable of carrying out the largest component among the detachable components in the second part, or a outlet of a size capable of carrying out the largest component is provided in the enclosed space, and the component is carried out from the outlet.

7. The method for disposing of a device according to claim 6, wherein: The detachable components in the second member are carried out in order starting from the components arranged near the carrying-out port.

8. The method for disposing of a device according to claim 1, wherein: In the other location, the device is disassembled, and the disassembled parts are classified and discarded based on the size of the radioactive materials.

9. The method for disposing of a device according to claim 1, wherein: In the other place, an irradiated portion in the device that has generated a radiation dose exceeding a predetermined value is identified, and the irradiated portion is cut out and discarded.

10. The method for disposing of a device according to claim 9, wherein: The radioactive portion was identified by core drilling.

11. The method for disposing of a device according to claim 1, comprising: The transport step is to transport the device from the installation facility to the other location while shielding the radiation generated from the device.

12. The method for disposing of a device according to claim 8, wherein: The other location has a disassembly area for disassembling the device, which is covered with a scattering suppression member to suppress scattering of dust.

13. The method for disposing of a device according to claim 9, wherein: The radioactive part identified in the other place is transported to a disposal area, and the part other than the radioactive part in the device is transported to a recycling area.

14. A device manufacturing method, comprising: after discarding a device to be discarded arranged in an installation facility, manufacturing a new device in the installation facility, wherein: When the device is carried out from the installation facility and placed in a radiation environment where radiation acts, and then processed in another location different from the installation facility, the new device is manufactured in the radiation environment of the installation facility.

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