Method for manufacturing structure and method for manufacturing electronic component device

Abstract

The present invention addresses the problem of providing: a method for manufacturing a structure capable of suppressing warping of a support member due to volume shrinkage of a thermosetting resin; and a method for manufacturing an electronic component device. The present invention relates to a method for manufacturing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, the method comprising the steps of: disposing a thermosetting resin composition on each of both surfaces of the support member; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on one surface of the support member.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a structure and a method for manufacturing an electronic component device. Background Art

[0002] As a manufacturing technology for electronic component devices, a technology called wafer-level packaging has attracted attention in recent years (see, for example, Patent Document 1). Wafer-level packaging is not to cut a wafer into individual electronic component device sizes before packaging, but to package the wafer in a wafer state and then cut the wafer.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-17717 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the manufacturing method of the electronic component device, the periphery of the electronic component arranged on the support member such as the silicon substrate is usually sealed with a sealing material containing a thermosetting resin. Specifically, the thermosetting resin contained in the sealing material is heated and cured, so that a sealing portion is formed around the electronic component arranged on the support member. At this time, the volume of the sealing portion formed by the cured product of the sealing material shrinks compared with the sealing material before heating due to the curing reaction of the thermosetting resin and the cooling of the self-heating state. Sometimes the supporting member is warped due to the volume shrinkage of such a sealing material.

[0008] When performing a sealing process such as wafer-level packaging, the larger the area of ​​the support member, the more likely it is that the support member will warp due to volume shrinkage of the sealing portion. If the support member is warped, there is a risk of reduced accuracy in subsequent processes such as wafer cutting.

[0009] In view of the above circumstances, an object of one embodiment of the present invention is to provide: a method for manufacturing a structure capable of suppressing warping of a support member caused by volume shrinkage of a thermosetting resin; and a method for manufacturing an electronic component device.

[0010] Means for solving problems

[0011] Specific means for solving the above-mentioned problems include the following aspects.

[0012] <1> A method for producing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, the method comprising the following steps:

[0013] Disposing a thermosetting resin composition on both surfaces of the supporting member;

[0014] curing the thermosetting resin composition; and

[0015] The cured product of the thermosetting resin composition disposed on one surface of the supporting member is removed.

[0016] <2> The method for producing a structure according to <1>, wherein the volume shrinkage after curing of the thermosetting resin composition disposed on one surface of the support member is 80% to 120% of the volume shrinkage after curing of the thermosetting resin composition disposed on the other surface of the support member.

[0017] <3> The method for producing a structure according to <1> or <2>, wherein the thermosetting resin composition disposed on each surface of the supporting member is in a layered form.

[0018] <4> The method for producing a structure according to any one of <1> to <3>, wherein the area of ​​the region where the thermosetting resin composition is disposed on one surface of the support member is 80% to 120% of the area of ​​the region where the thermosetting resin composition is disposed on the other surface of the support member.

[0019] <5> The method for producing a structure according to any one of <1> to <4>, further comprising the step of cutting the support member after or before removing the cured product of the thermosetting resin composition.

[0020] <6> A method for producing an electronic component device, comprising: a supporting member, an electronic component disposed on one surface of the supporting member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the following steps:

[0021] Disposing a thermosetting resin composition on the surface of the supporting member on which the electronic component is disposed and on the surface opposite to the surface on which the electronic component is disposed;

[0022] curing the thermosetting resin composition; and

[0023] The cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed is removed.

[0024] <7> A method for manufacturing an electronic component device according to <6>, wherein the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member on which the electronic components are arranged is 80% to 120% of the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member opposite to the surface on which the electronic components are arranged.

[0025] <8> The method for producing an electronic component device according to <6> or <7>, wherein the thermosetting resin composition disposed on each surface of the support member is in a layered form.

[0026] <9> A method for manufacturing an electronic component device according to any one of <6> to <8>, wherein the area of ​​a region where a thermosetting resin composition is arranged on a surface of a supporting member on which electronic components are arranged is 80% to 120% of the area of ​​a region where a thermosetting resin composition is arranged on a surface of the supporting member opposite to the surface on which electronic components are arranged.

[0027] <10> The method for producing an electronic component device according to any one of <6> to <9>, wherein the thermosetting resin composition disposed around the electronic component is a sealing material.

[0028] <11> The method for producing an electronic component device according to <10>, wherein the thermosetting resin composition disposed on the surface opposite to the surface on which the electronic component is disposed is a sealing material.

[0029] <12> The method for producing an electronic component device according to any one of <6> to <11>, further comprising the step of cutting the support member after or before removing the cured product of the thermosetting resin composition.

[0030] Effects of the Invention

[0031] According to one embodiment of the present invention, there are provided a method for manufacturing a structure capable of suppressing warping of a supporting member caused by volume shrinkage of a thermosetting resin and a method for manufacturing an electronic component device. DETAILED DESCRIPTION

[0032] The term "step" in the present invention includes not only a step that is independent of other steps, but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step can be achieved.

[0033] In the present invention, the numerical range indicated by "to" includes the numerical values ​​described before and after "to" as the minimum value and the maximum value, respectively.

[0034] In the numerical range recorded in stages in the present invention, the upper limit or lower limit recorded in a numerical range can be replaced by the upper limit or lower limit of the numerical range recorded in other stages. In addition, in the numerical range recorded in the present invention, the upper limit or lower limit of the numerical range can be replaced by the value shown in the embodiment.

[0035] In the present invention, each component may contain a plurality of corresponding substances. When there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the content or content of each component refers to the total content or content of the plurality of substances present in the composition.

[0036] In the present invention, particles corresponding to each component may include multiple types. When multiple types of particles corresponding to each component exist in the composition, the particle size of each component refers to the value for the mixture of the multiple types of particles present in the composition unless otherwise specified.

[0037] <Method for manufacturing structure>

[0038] One embodiment of the present invention is a method for manufacturing a structure, which is a method for manufacturing a structure having a support member and a cured product of a thermosetting resin composition disposed on one side of the support member, the method for manufacturing the structure comprising the following steps:

[0039] Disposing a thermosetting resin composition on both surfaces of the supporting member;

[0040] curing the thermosetting resin composition; and

[0041] The cured product of the thermosetting resin composition disposed on one surface of the supporting member is removed.

[0042] In the method of this embodiment, the thermosetting resin is cured in a state where the thermosetting resin composition is disposed on both surfaces of the supporting member.

[0043] Therefore, when the thermosetting resin contained in the thermosetting resin composition is cured, the volume shrinkage occurs on both sides of the support member. As a result, compared with the case where the thermosetting resin composition is arranged on only one side of the support member and cured, the support member is less likely to warp toward any one side. Therefore, a structure in which the warping of the support member is suppressed can be obtained.

[0044] In addition, in the method of this embodiment, the components or their amounts contained in the thermosetting resin composition are not adjusted, and the warping of the supporting member can be suppressed by arranging the thermosetting resin composition on both sides of the supporting member. Therefore, even a thermosetting resin composition that has a large volume shrinkage and is prone to warping of the supporting member can be used to manufacture a structure that suppresses the warping of the supporting member.

[0045] In the method of this embodiment, there is no particular limitation on the method of configuring the thermosetting resin composition on both sides of the supporting member. For example, it can be selected from known methods such as compression molding, injection molding, and coating. The thermosetting resin composition pre-formed into a sheet can be attached to the supporting member directly or through a release layer.

[0046] The thermosetting resin composition may be arranged on each surface of the supporting member simultaneously or sequentially.

[0047] From the viewpoint of suppressing warping of the supporting member, the volume shrinkage rate after curing of the thermosetting resin composition arranged on one side of the supporting member is preferably 80% to 120% of the volume shrinkage rate after curing of the thermosetting resin composition arranged on the other side of the supporting member, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (i.e., the volume shrinkage rate after curing of the thermosetting resin composition arranged on one side is equal to the volume shrinkage rate after curing of the thermosetting resin composition arranged on the other side).

[0048] In the present invention, the volume shrinkage of the thermosetting resin composition is measured by the following method.

[0049] (1) A test piece formed of a cured product of a thermosetting resin composition was prepared by transfer molding using a mold having dimensions of 127 mm in length×6.4 mm in height×12.7 mm in width when measured at room temperature (25° C.).

[0050] (2) The prepared test piece is immediately removed from the mold and cooled to room temperature (25°C). Thereafter, the dimensions of the test piece are measured using a vernier caliper. The measurement is performed on two test pieces (test piece 1 and test piece 2) prepared under the same conditions.

[0051] (3) The volume shrinkage (%) was calculated from the dimensions of the test piece measured at room temperature and the dimensions of the mold measured at room temperature according to the following formula. In the following formula, D1 is the dimension (mm) of the mold used in the molding of the test piece 1 in the longitudinal direction, d1 is the dimension (mm) of the test piece 1 in the longitudinal direction, D2 is the dimension (mm) of the mold used in the molding of the test piece 2 in the longitudinal direction, and d2 is the dimension (mm) of the test piece 2 in the longitudinal direction.

[0052] [Mathematical formula 1]

[0053]

[0054] From the viewpoint of suppressing the warping of the supporting member, the thermosetting resin composition disposed on each surface of the supporting member is preferably in a layered state. When the thermosetting resin composition disposed on each surface of the supporting body is in a layered state, the thickness of one layer is preferably 80% to 120% of the thickness of the other layer, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (i.e., the thickness of one layer is equal to the thickness of the other layer).

[0055] When the thickness of the layered thermosetting resin composition is not constant, it is preferred that the maximum value of the thickness satisfy the above-mentioned conditions.

[0056] From the viewpoint of suppressing warping of the supporting member, the area of ​​the region where the thermosetting resin composition is arranged on one side of the supporting member is preferably 80% to 120% of the area of ​​the region where the thermosetting resin composition is arranged on the other side of the supporting member, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (i.e., the area of ​​the region where the thermosetting resin composition is arranged on one side is equal to the area of ​​the region where the thermosetting resin composition is arranged on the other side).

[0057] The method for curing the thermosetting resin composition disposed on both surfaces of the supporting member is not particularly limited, and can be selected according to the type of thermosetting resin and the like.

[0058] For example, the thermosetting resin composition can be cured by heating to a temperature at which the thermosetting resin contained in the thermosetting resin composition undergoes a curing reaction.

[0059] The method for removing the cured product of the thermosetting resin composition disposed on one side of the supporting member is not particularly limited. For example, there can be cited: a method for removing the cured product of the thermosetting resin composition using a grinder or the like, a method for removing the cured product of the thermosetting resin composition using a chemical reagent or the like, a method for removing the peeling layer disposed between the cured product of the thermosetting resin composition and the supporting member by peeling it off from the supporting member, etc.

[0060] The method of this embodiment may include steps other than the above steps as necessary.

[0061] For example, the following steps may be included: after or before removing the cured product of the thermosetting resin composition disposed on one side of the supporting member, the supporting member is cut off. From the perspective of work efficiency, it is preferred that the supporting member is cut off after removing the cured product of the thermosetting resin composition disposed on one side of the supporting member.

[0062] The method of cutting the support member is not particularly limited, and for example, a dicing machine used to cut a wafer in the manufacturing process of an electronic component device can be used.

[0063] (Thermosetting resin composition)

[0064] The thermosetting resin composition used in the above method is a composition containing at least a thermosetting resin. The thermosetting resin composition may contain only a thermosetting resin or a thermosetting resin and other components.

[0065] The type of thermosetting resin is not particularly limited and can be selected according to the purpose of the structure and the like.

[0066] For example, the thermosetting resin may be selected from epoxy resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, urethane resin, silicone resin and maleimide resin. In one embodiment, the thermosetting resin may be epoxy resin.

[0067] The thermosetting resin contained in the thermosetting resin composition disposed on one side of the supporting member and the thermosetting resin contained in the thermosetting resin composition disposed on the other side of the supporting member may be of the same type or of different types. From the viewpoint of suppressing the warping of the supporting member, the thermosetting resin contained in the thermosetting resin composition disposed on one side of the supporting member and the thermosetting resin contained in the thermosetting resin composition disposed on the other side of the supporting member are preferably of the same type.

[0068] The thermosetting resin composition may contain components other than the thermosetting resin.

[0069] As components other than the thermosetting resin, fillers, curing agents, curing accelerators, coupling agents, ion exchangers, mold release agents, flame retardants, colorants, and the like are mentioned.

[0070] (Supporting member)

[0071] The type of the supporting member used in the above method is not particularly limited and can be selected according to the purpose of the structure. The supporting member can be, for example, an inorganic material such as silicon, metal, carbon, or an organic material such as resin, or a composite of an inorganic material and an organic material.

[0072] In one embodiment, the support member may be a wafer. In the present invention, a wafer refers to a disk-shaped object used as a material for an electronic component device.

[0073] In the method of the present invention, even if the area of ​​the supporting member is large, the warping caused by the volume shrinkage of the thermosetting resin composition can be effectively suppressed. Therefore, the area of ​​the supporting member used in the method of this embodiment can be 25 cm 2 Over 100cm 2 Above or 300cm 2 The area of ​​the support member can be 3000cm 2 Below, 2000cm 2 Below or 1000cm 2 the following.

[0074] For the method of the present invention, even if the thickness of the supporting member is thin, the warping caused by the volume shrinkage of the thermosetting resin composition can be effectively suppressed. Therefore, the thickness of the supporting member used in the method of this embodiment can be 5000 μm or less, 3000 μm or less, or 1000 μm or less. The thickness of the supporting member can be 10 μm or more, 50 μm or more, or 100 μm or more.

[0075] Materials other than the supporting member and the thermosetting resin composition may be used in the production of the structure.

[0076] For example, when the structure is used as an electronic component device, an electronic component can be used.

[0077] A structure containing electronic components can be obtained, for example, by configuring a thermosetting resin composition on both sides of a supporting member in a state where the electronic components are configured on one side of the supporting member, then curing the thermosetting resin composition, and then removing the cured product of the thermosetting resin composition configured on the side of the supporting member where the electronic components are not configured.

[0078] The use of the structure produced by the method of the present invention is not particularly limited. For example, the structure including the electronic component can be used as an electronic component device.

[0079] <Method for manufacturing electronic component device>

[0080] One embodiment of the present invention is a method for manufacturing an electronic component device, which comprises a supporting member, an electronic component disposed on one surface of the supporting member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the following steps:

[0081] Disposing a thermosetting resin composition on the surface of the supporting member on which the electronic component is disposed and on the surface opposite to the surface on which the electronic component is disposed;

[0082] curing the thermosetting resin composition; and

[0083] The cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed is removed.

[0084] In the method of this embodiment, the thermosetting resin is cured in a state where the thermosetting resin composition is disposed on both surfaces of the supporting member.

[0085] Therefore, when the thermosetting resin contained in the thermosetting resin composition is cured, the volume shrinkage occurs on both sides of the supporting member. As a result, compared with the case where the thermosetting resin composition is arranged on only one side of the supporting member and cured, the supporting member is less likely to warp toward any one side. Therefore, an electronic component device in which the warping of the supporting member is suppressed can be obtained.

[0086] In addition, in the method of this embodiment, the components or their amounts contained in the thermosetting resin composition are not adjusted, and the warping of the supporting member can be suppressed by arranging the thermosetting resin composition on both sides of the supporting member. Therefore, even a thermosetting resin composition that has a large volume shrinkage and is prone to warping of the supporting member can be used to manufacture an electronic component device in which the warping of the supporting member is suppressed.

[0087] In the method of this embodiment, there is no particular limitation on the method of configuring the thermosetting resin composition on both sides of the supporting member. For example, it can be selected from known methods such as compression molding, injection molding, and coating. The thermosetting resin composition pre-formed into a sheet can be attached to the supporting member directly or through a release layer.

[0088] The thermosetting resin composition may be arranged on each surface of the supporting member simultaneously or sequentially.

[0089] From the viewpoint of suppressing warping of the supporting member, the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member on which the electronic components are arranged is preferably 80% to 120% of the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member opposite to the surface on which the electronic components are arranged, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (that is, the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member on which the electronic components are arranged is equal to the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member opposite to the surface on which the electronic components are arranged).

[0090] From the viewpoint of suppressing the warping of the supporting member, the thermosetting resin composition arranged on each surface of the supporting member is preferably in a layered state. In the case where the thermosetting resin composition arranged on each surface of the support is in a layered state, the thickness of the layer arranged on the surface of the supporting member on which the electronic components are arranged is preferably 80% to 120% of the thickness of the layer arranged on the surface of the supporting member opposite to the surface on which the electronic components are arranged, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (i.e., the thickness of the layer arranged on the surface of the supporting member on which the electronic components are arranged is equal to the thickness of the layer arranged on the surface of the supporting member opposite to the surface on which the electronic components are arranged).

[0091] When the thickness of the layered thermosetting resin composition is not constant, it is preferred that the maximum value of the thickness satisfy the above-mentioned conditions.

[0092] From the viewpoint of suppressing warping of the supporting member, the area of ​​the region where the thermosetting resin composition is arranged in the surface of the supporting member on which the electronic components are arranged is preferably 80% to 120% of the area of ​​the region where the thermosetting resin composition is arranged in the surface of the supporting member opposite to the surface on which the electronic components are arranged, more preferably 90% to 110%, further preferably 95% to 105%, and particularly preferably 100% (that is, the area of ​​the region where the thermosetting resin composition is arranged in the surface of the supporting member on which the electronic components are arranged is equal to the area of ​​the region where the thermosetting resin composition is arranged in the surface of the supporting member opposite to the surface on which the electronic components are arranged).

[0093] The method for curing the thermosetting resin composition disposed on both surfaces of the supporting member is not particularly limited, and can be selected according to the type of thermosetting resin and the like.

[0094] For example, the thermosetting resin composition can be cured by heating to a temperature at which the thermosetting resin contained in the thermosetting resin composition undergoes a curing reaction.

[0095] There is no particular limitation on the method for removing the cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed. For example, there can be cited: a method for removing the cured product of the thermosetting resin composition using a grinder or the like, a method for removing the cured product of the thermosetting resin composition using a chemical reagent or the like, a method for removing the peeling layer disposed between the cured product of the thermosetting resin composition and the supporting member from the supporting member, and the like.

[0096] The method of this embodiment may include steps other than the above steps as necessary.

[0097] For example, the following steps may be included: after or before removing the cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed, the supporting member is cut. From the viewpoint of work efficiency, it is preferred that the supporting member is cut after removing the cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed.

[0098] The method of cutting the support member is not particularly limited, and for example, a dicing machine used for cutting a wafer in the manufacturing process of an electronic component device can be used.

[0099] As for the details and preferred ranges of the thermosetting resin composition and the supporting member used in the method of the present embodiment, the details and preferred ranges of the thermosetting resin composition and the supporting member used in the above-mentioned method for producing a structure can be referred to.

[0100] The thermosetting resin composition used in the method of this embodiment can be a sealing material. The sealing material is, for example, arranged around the electronic component (including between the electronic component and the supporting member) to protect the electronic component. The sealing material can be solid or liquid at room temperature (25°C).

[0101] Examples of the sealing material include a sealing material containing at least an epoxy resin as a resin component and a curing agent, and an inorganic filler such as silica and alumina.

[0102] The content ratio of the resin component in the sealing material may be, for example, 10% to 70% by volume, 15% to 60% by volume, or 20% to 50% by volume of the entire sealing material.

[0103] The content ratio of the inorganic filler in the sealing material may be, for example, 30% to 90% by volume, 40% to 85% by volume, or 50% to 80% by volume of the entire sealing material.

[0104] The sealing material may further contain a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, a colorant such as carbon black, and the like.

Claims

1. A method for producing a structure, comprising: a supporting member and a cured product of a thermosetting resin composition disposed on one side of the supporting member; the method comprising the following steps: Disposing a thermosetting resin composition on both surfaces of the supporting member; curing the thermosetting resin composition; as well as The cured product of the thermosetting resin composition disposed on one surface of the supporting member is removed.

2. The method for manufacturing a structure according to claim 1, wherein: The volume shrinkage rate of the thermosetting resin composition disposed on one surface of the support member after curing is 80% to 120% of the volume shrinkage rate of the thermosetting resin composition disposed on the other surface of the support member after curing.

3. The method for manufacturing a structure according to claim 1, wherein: The thermosetting resin composition disposed on each surface of the supporting member is in a layered form.

4. The method for manufacturing a structure according to claim 1, wherein: The area of ​​the region where the thermosetting resin composition is arranged on one surface of the supporting member is 80% to 120% of the area of ​​the region where the thermosetting resin composition is arranged on the other surface of the supporting member.

5. The method for manufacturing a structure according to any one of claims 1 to 4, further comprising the following steps: The supporting member is cut after or before the cured product of the thermosetting resin composition is removed.

6. A method for manufacturing an electronic component device, comprising: a supporting member, an electronic component disposed on one surface of the supporting member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the following steps: Disposing a thermosetting resin composition on the surface of the supporting member on which the electronic component is disposed and on the surface opposite to the surface on which the electronic component is disposed; curing the thermosetting resin composition; and The cured product of the thermosetting resin composition disposed on the surface of the supporting member opposite to the surface on which the electronic component is disposed is removed.

7. The method for manufacturing an electronic component device according to claim 6, wherein: The volume shrinkage rate after curing of the thermosetting resin composition disposed on the surface of the support member on which the electronic component is disposed is 80% to 120% of the volume shrinkage rate after curing of the thermosetting resin composition disposed on the surface of the support member opposite to the surface on which the electronic component is disposed.

8. The method for manufacturing an electronic component device according to claim 6, wherein: The thermosetting resin composition disposed on each surface of the supporting member is in a layered form.

9. The method for manufacturing an electronic component device according to claim 6, wherein: The area of ​​the region where the thermosetting resin composition is arranged on the surface of the support member where the electronic component is arranged is 80% to 120% of the area of ​​the region where the thermosetting resin composition is arranged on the surface of the support member opposite to the surface where the electronic component is arranged.

10. The method for manufacturing an electronic component device according to claim 6, wherein: The thermosetting resin composition disposed around the electronic component is a sealing material.

11. The method for manufacturing an electronic component device according to claim 10, wherein: The thermosetting resin composition disposed on the surface opposite to the surface on which the electronic component is disposed serves as a sealing material.

12. The method for manufacturing an electronic component device according to any one of claims 6 to 11, further comprising the following steps: The supporting member is cut after or before the cured product of the thermosetting resin composition is removed.

Images