Diode packaging equipment and packaging process

Abstract

The invention relates to the technical field of diode production equipment, and discloses diode packaging equipment and packaging technology.The diode packaging equipment comprises a supporting table, an operation table is arranged on one side of the supporting table, a supporting plate is arranged at the top of the supporting table, supporting frames are arranged on the supporting plate, a protection plate is arranged between the supporting frames, and an operation instrument is arranged on the operation table; a conveying pipe is arranged on the operation instrument in a communicating mode, an injection head is arranged at one end of the conveying pipe, a driving source is arranged in the supporting plate, a rotating plate is arranged at the output end of the driving source, and an adjusting assembly is arranged on the rotating plate; an auxiliary assembly is arranged on the top of the supporting plate. The adjusting assembly is used for correcting and guiding the diode chip placed above the adjusting assembly before packaging; the auxiliary assembly is used for eliminating bubbles when the diode chip is packaged. Compared with the prior art, the packaging material is ensured to be uniformly distributed on the chip, the packaging integrity is ensured, and the packaging process is more stable and reliable.

Description

Technical Field

[0001] The present invention relates to the technical field of diode production equipment, and in particular to diode packaging equipment and a packaging process. Background Art

[0002] A diode is a common electronic component. It is a device with two electrodes that allows current to flow in only one direction. The packaging of a diode refers to connecting the electronic pins on a silicon wafer to external connectors with wires for connection with other devices. The packaging of a diode not only plays the role of installation, fixation, sealing, chip protection and enhancing electrical and thermal properties, but also the connection between the external circuit and the internal chip can be achieved through the packaged pins. The packaged diode is also easy to install and transport.

[0003] During the packaging process, glue is usually dispensed on the chip surface and then bonded. This process is usually done manually or semi-manually. The chip and the diode are bonded. Traditionally, this process is mostly implemented manually or semi-manually. The first worker uses a glue dispenser to dispense glue on the blank, and then passes the glued blank to the next worker. This greatly restricts the packaging efficiency of the diode when packaging the diode.

[0004] In the prior art, a Chinese patent document with publication number CN117316825A proposes a semiconductor chip packaging device and a working method thereof, comprising a workbench and a conveying mechanism arranged between the workbench, a plurality of groups of bearing grooves are arranged at intervals on the surface of the conveying mechanism, the bearing grooves are used to carry and store diodes to be packaged, and the conveying mechanism is used to convey the diodes arranged in the bearing grooves; before packaging the diode and the chip, the top of the diode is pre-dispensed with glue, so that the packaging stability of the diode and the chip is higher and the fitting is more stable, but in actual use, there are still subsequent processing quality problems caused by inaccurate placement of the diode chip, and at the same time, when packaging the chip, gaps or bubbles will be generated between the packaging material and the chip, thereby affecting the diode packaging quality. Therefore, the present application discloses a diode packaging device and a packaging process to meet the requirements of uniform distribution of packaging materials on the chip and ensuring the integrity of the packaging. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the shortcomings of the prior art, the present invention provides a diode packaging device and packaging process, which have the advantages of ensuring that the chip is in the correct position before packaging, effectively avoiding the problem of chip position deviation during the packaging process, and improving the packaging accuracy. It solves the subsequent processing quality problems caused by inaccurate placement of the diode chip. When packaging the chip, gaps or bubbles will be generated between the packaging material and the chip, thereby affecting the diode packaging quality and other series of problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a diode packaging device, comprising a support table, an operating table is arranged on one side of the support table, a support plate is arranged on the top of the support table, a support frame is arranged on the support plate, a protective plate is arranged between the support frames, an operating instrument is arranged on the operating table, a transport tube is connected to the operating instrument, an injection head is arranged at one end of the transport tube, a driving source is arranged in the support plate, a rotating plate is arranged at the output end of the driving source, and an adjustment component is arranged on the rotating plate; an auxiliary component is arranged on the top of the support plate; the adjustment component is used for correcting and guiding the diode chip placed thereon before packaging; the auxiliary component is used for eliminating bubbles when packaging the diode chip.

[0009] Preferably, the adjustment assembly includes multiple groups of mounting plates arranged on the rotating plate, a lifting rod is arranged through the mounting plate, a synchronization plate is arranged on the lifting rod, a second connecting rod is arranged through the synchronization plate, a deflection plate is sleeved on the second connecting rod, a first connecting rod is sleeved on one end of the deflection plate, an adjustment arm is rotatably arranged on the first connecting rod, a rotating rod is arranged through the adjustment arm, the adjustment arm rotates relative to the rotating rod, and the rotating rod is arranged through the mounting plate.

[0010] Preferably, the auxiliary component includes multiple sets of guide rails fixedly arranged on the support plate, the guide rails are interconnected, the height of the guide rails increases from both sides to the middle, and multiple sets of adjustment grooves are opened on one side of the guide rail, and the adjustment grooves are arranged in a wave shape.

[0011] Preferably, a contact platform is provided on the top of the lifting rod, a mounting seat is provided on the top of the contact platform, a mounting groove is provided on the mounting seat, the mounting groove is matched with the contact platform, and an extension plate is provided on one side of the mounting seat.

[0012] Preferably, a limiting head is provided at the bottom of the lifting rod, and a limiting groove is provided in the guide rail, and the limiting groove is matched with the limiting head.

[0013] Preferably, a guide rail is provided on the support plate, a movable rail is slidably provided inside the guide rail, an injection head is penetrated through the movable rail, one end of the injection head is connected with the transport tube, a fixed plate is fixedly provided on the guide rail, a pushing cylinder is provided on the fixed plate, a suction cup is provided at the output end of the pushing cylinder, and the suction cup is in contact with the extension plate.

[0014] Preferably, a collecting trough is provided on one side of the support platform, and the collecting trough is provided on one side of the fixing plate.

[0015] Preferably, it is characterized in that: a plurality of groups of deviation-correcting grooves are provided on the inner wall of the adjusting arm.

[0016] A diode packaging process, applied in the above-mentioned diode packaging device, comprises the following steps:

[0017] S1. Select packaging materials: According to the application scenario of the diode, select suitable packaging materials to ensure that they have good insulation, thermal conductivity and mechanical strength;

[0018] S2, mold preparation: Place the mounting bases of different sizes on the contact table according to the requirements, and rotate the rotating plate to proceed to the next step;

[0019] S3, injection molding: heat the packaging material to a fluid state, control the packaging material to enter the support table through the transport pipe through the operating instrument, inject the packaging material into the mounting seat through the injection head, and repeatedly lift and lower the lifting rod under the guidance of the limit head, so that the bubbles in the mounting seat can be dissipated during the vibration process, completely wrapping the chip and the lead;

[0020] S4, demoulding and inspection: Push the suction cup of the cylinder to absorb the extension plate, separate the mounting base from the contact table, and check the appearance and size of the package.

[0021] (III) Beneficial effects

[0022] Compared with the prior art, the present invention provides a diode packaging device and packaging process, which has the following beneficial effects:

[0023] 1. The diode packaging equipment and packaging process, when the rotating plate is driven by the driving source in the supporting plate and the supporting plate rotates synchronously, the bottom of the lifting rod moves along the guide, and the lifting rod can drive the synchronous plate to rise and fall synchronously through the height change of the guide. When the synchronous plate changes with the height of the lifting rod, it can drive the second connecting rod to rise, thereby driving the deflection plate to rotate around the axis of the first connecting rod, and at the same time, the first connecting rod drives the adjustment arm to deflect around the axis of the rotating rod, thereby increasing the distance between the adjustment arms, and realizing the effect of opening the adjustment arms when the contact table is raised, which is convenient for placing the mounting seat on the contact table, thereby improving the efficiency of diode chip packaging.

[0024] 2. The diode packaging equipment and packaging process, when the mounting seat is placed on the contact table, the rotating plate continues to rotate, so that the height of the lifting rod is lowered. At this time, the adjusting arms are close to each other. When the mounting seat is deviated, the adjusting arms are close to each other, so that the correction groove can contact the edge of the mounting seat. Because the adjusting arms are kept close to each other in the process of approaching each other, the degree of contact of the correction groove with the edge of the mounting seat can be kept consistent, so that the mounting seat is rotated on the contact table, and the position of the mounting seat is corrected. The position of the chip before packaging can be accurately corrected and guided to ensure that the chip is in the correct position before packaging. Not only the accuracy of chip positioning is improved, but also the automation level of the equipment is improved, the manual operation error is reduced, and the packaging quality is improved.

[0025] 3. The diode packaging equipment and packaging process can make the limit head at the bottom of the lifting rod move in the guide by rotating the rotating plate. The guides are connected to each other and the guide height is increased from both sides to the middle. When the rotating plate rotates, the lifting rod can maintain a complete rotation cycle. At the same time, when the limit head contacts the adjustment groove, the adjustment groove is arranged in a wave shape, which can make the lifting rod quickly reciprocate and rise, thereby achieving the effect of vibrating the mounting base, thereby ensuring that the bubbles existing during packaging are eliminated, thereby ensuring the packaging effect of the diode and reducing the packaging quality problems caused by bubbles.

[0026] 4. The diode packaging equipment and packaging process, the packaging material is transported to the injection head through a transport tube, and is injected into the diode chip to be packaged, and the bubbles are eliminated by the auxiliary components. At the same time, when the packaged diode moves to one side of the fixed plate, the suction cup at the output end of the cylinder is pushed to adsorb the extension plate, so that the mounting seat can be taken, and the mounting seat can be dropped into the collection tank, so that the packaged diode can be taken, and then the entire packaging process is completed, which effectively improves the automation operation of the packaging process and improves the packaging efficiency.

[0027] 5. The diode packaging equipment and packaging process selects appropriate packaging materials according to the application scenario, and prepares the mounting seats of different sizes and high-precision molds on the contact table. The packaging material is transported to the injection head through the operating instrument and the transport tube, and injected into the mounting seat. During the injection molding process, the lifting rod is repeatedly lifted and lowered under the guidance of the limit head, so that the bubbles in the mounting seat of the packaging material are dissipated through vibration, ensuring that the material evenly covers the chip and the lead. Finally, the mounting seat and the contact table are separated by the suction cup of the pushing cylinder, the packaged diode is taken out, and its appearance and size are inspected to ensure the packaging quality; the repeated movement of the lifting rod effectively eliminates the bubbles in the packaging material, ensuring the integrity and uniformity of the packaging. At the same time, the design of the pushing cylinder and the suction cup simplifies the demoulding process, reduces the complexity of manual operation, and improves the level of automation. Through strict inspection steps, it is ensured that the package body is free of bubbles, cracks or dimensional deviations, which improves the stability and quality of the product. The overall process is efficient and reliable and can adapt to the diode packaging needs of different scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle;

[0029] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention from a second viewing angle;

[0030] Figure 3 It is a schematic diagram of the three-dimensional structure of the support frame of the present invention;

[0031] Figure 4 It is a schematic diagram of the three-dimensional structure of the support plate and the support frame of the present invention;

[0032] Figure 5 This is a schematic diagram of the three-dimensional structure of the support plate of the present invention;

[0033] Figure 6 It is a schematic diagram of the three-dimensional structure of the regulating arm of the present invention;

[0034] Figure 7 This is a schematic diagram of the three-dimensional structure of the mounting plate of the present invention;

[0035] Figure 8 It is a schematic diagram of the three-dimensional structure of the guide rail of the present invention;

[0036] Fig. 9 This is a schematic diagram of the three-dimensional structure of the adjustment tank of the present invention;

[0037] Fig.10 It is a schematic diagram of the three-dimensional structure of the mounting seat of the present invention;.

[0038] In the figure: 1. support table; 2. operating table; 3. support plate; 4. support frame; 5. operating instrument; 6. transport tube; 7. protective plate; 8. guide rail; 9. moving rail; 10. injection head; 11. rotating plate; 12. mounting plate; 13. lifting rod; 14. synchronization plate; 15. deflection plate; 16. first connecting rod; 17. second connecting rod; 18. adjustment arm; 19. rotating rod; 20. correction groove; 21. contact table; 22. guide; 23. adjustment groove; 24. limit head; 25. mounting seat; 26. mounting groove; 27. extension plate; 28. fixing plate; 29. ​​pushing cylinder; 30. collecting groove. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a diode packaging device and packaging process.

[0041] In a typical implementation of the present application, Figure 1-Figure 10 As shown, a diode packaging device comprises a support table 1, an operating table 2 is arranged on one side of the support table 1, a support plate 3 is arranged on the top of the support table 1, a support frame 4 is arranged on the support plate 3, a protective plate 7 is arranged between the support frames 4, an operating instrument 5 is arranged on the operating table 2, a transport tube 6 is connected to the operating instrument 5, an injection head 10 is arranged at one end of the transport tube 6, a driving source is arranged in the support plate 3, a rotating plate 11 is arranged at the output end of the driving source, and an adjusting component is arranged on the rotating plate 11; an auxiliary component is arranged on the top of the support plate 3; the adjusting component is used for guiding the diode chip placed thereon to correct the deviation before packaging; the auxiliary component is used for eliminating bubbles when packaging the diode chip;

[0042] The operating instrument 5 transports the packaging material to the injection head 10 through the connected transportation tube 6. The injection head 10 accurately packages the diode chip. The driving source in the support plate 3 drives the rotating plate 11 to rotate through the output end. The adjustment component adjusts the position according to the specific position of the chip to ensure that the chip is in the correct position before packaging, effectively avoiding the problem of chip position offset during the packaging process and improving the packaging accuracy. The auxiliary component eliminates bubbles during the packaging process to ensure that the packaging material is evenly distributed on the chip, ensuring the integrity of the packaging, making the packaging process more stable and reliable, reducing packaging defects, reducing manual operation errors, and overall improving the production efficiency and packaging quality of the equipment.

[0043] As a preferred implementation in this embodiment, refer to the attached Figure 1-Figure 7 The adjustment assembly includes a plurality of mounting plates 12 arranged on a rotating plate 11, a lifting rod 13 is arranged in the mounting plate 12, a synchronous plate 14 is arranged on the lifting rod 13, a second connecting rod 17 is arranged on the synchronous plate 14, a deflection plate 15 is sleeved on the second connecting rod 17, a first connecting rod 16 is sleeved on one end of the deflection plate 15, an adjustment arm 18 is rotatably arranged on the first connecting rod 16, a rotating rod 19 is arranged on the adjustment arm 18, the adjustment arm 18 rotates relative to the rotating rod 19, and the rotating rod 19 is arranged on the mounting plate 12; a plurality of deviation correction grooves 20 are provided on the inner wall of the adjustment arm 18;

[0044] When the rotating plate 11 rotates synchronously with the supporting plate 3 driven by the driving source in the supporting plate 3, the bottom of the lifting rod 13 moves along the guide 22. Through the height change of the guide 22, the lifting rod 13 can drive the synchronous plate 14 to rise and fall synchronously. When the synchronous plate 14 changes with the height of the lifting rod 13, it can drive the second connecting rod 17 to rise, thereby driving the deflection plate 15 to rotate around the axis of the first connecting rod 16, and at the same time, the first connecting rod 16 drives the adjustment arm 18 to deflect around the axis of the rotating rod 19, thereby increasing the distance between the adjustment arms 18, so that when the contact platform 21 is raised, the adjustment arms 18 can be opened, so that the mounting seat 25 can be placed on the contact platform 21, thereby improving the efficiency of diode chip packaging.

[0045] At the same time, after the mounting seat 25 is placed on the contact table 21, the rotating plate 11 continues to rotate, so that the height of the lifting rod 13 is lowered. At this time, the adjusting arms 18 are close to each other. When the placement position of the mounting seat 25 deviates, the adjusting arms 18 are close to each other, so that the correction groove 20 can contact the edge of the mounting seat 25. Because the adjusting arms 18 are close to each other in the process of approaching each other, the degree of contact of the correction groove 20 with the edge of the mounting seat 25 can be kept consistent, so that the mounting seat 25 can rotate on the contact table 21, and then the position of the mounting seat 25 is corrected, and the position before chip packaging can be accurately corrected and guided to ensure that the chip is in the correct position before packaging, which not only improves the accuracy of chip positioning, but also improves the automation level of the equipment, reduces manual operation errors, and improves packaging quality.

[0046] As a preferred implementation in this embodiment, refer to the attached Figure 4 , Figure 5 , Figure 8 and Fig. 9The auxiliary components include multiple groups of guide rails 22 fixedly arranged on the support plate 3, the guide rails 22 are interconnected, the height of the guide rails 22 increases from both sides to the middle, and multiple groups of adjustment grooves 23 are provided on one side of the guide rail 22, and the adjustment grooves 23 are arranged in a wave shape; a contact platform 21 is provided on the top of the lifting rod 13, a mounting seat 25 is provided on the top of the contact platform 21, a mounting groove 26 is provided on the mounting seat 25, and the mounting groove 26 is adapted to the contact platform 21, and an extension plate 27 is provided on one side of the mounting seat 25; a limiting head 24 is provided at the bottom of the lifting rod 13, and a limiting groove is provided in the guide rail 22, and the limiting groove is adapted to the limiting head 24;

[0047] By rotating the rotating plate 11, the limit head 24 at the bottom of the lifting rod 13 can be moved in the guide 22. By connecting the guides 22 to each other and increasing the height of the guides 22 from both sides to the middle, the lifting rod 13 can maintain a complete rotation cycle when the rotating plate 11 rotates. At the same time, when the limit head 24 contacts the adjustment groove 23, the adjustment groove 23 is arranged in a wave shape, so that the lifting rod 13 can be lifted and lowered quickly, thereby achieving the effect of vibrating the mounting seat 25, thereby ensuring that the bubbles existing during packaging are eliminated, thereby ensuring the packaging effect of the diode and reducing the packaging quality problems caused by bubbles.

[0048] As a preferred implementation in this embodiment, refer to the attached Figure 1-Figure 4 A guide rail 8 is provided on the support plate 3, a movable rail 9 is slidably provided in the guide rail 8, an injection head 10 is penetrated on the movable rail 9, one end of the injection head 10 is connected with the transport pipe 6, a fixed plate 28 is fixedly provided on the guide rail 8, a pushing cylinder 29 is provided on the fixed plate 28, a suction cup is provided at the output end of the pushing cylinder 29, and the suction cup is in contact with the extension plate 27; a collecting tank 30 is provided on one side of the support platform 1, and the collecting tank 30 is provided on one side of the fixed plate 28;

[0049] The packaging material is transported to the injection head 10 through the transport tube 6 and injected into the diode chip to be packaged. The bubbles are eliminated by the auxiliary components. At the same time, when the packaged diode moves to one side of the fixed plate 28, the suction cup at the output end of the cylinder 29 is pushed to adsorb the extension plate 27, so that the mounting seat 25 can be taken out, and the mounting seat 25 can fall into the collection tank 30, thereby completing the taking of the packaged diode and completing the entire packaging process, effectively improving the automation of the packaging process and improving the packaging efficiency.

[0050] A diode packaging process, applied in the above-mentioned diode packaging device, comprises the following steps:

[0051] S1. Select packaging materials: According to the application scenario of the diode, select suitable packaging materials to ensure that they have good insulation, thermal conductivity and mechanical strength;

[0052] S2. Mold preparation: Mounting seats 25 of different sizes are placed on the contact table 21 according to the requirements, and the next step is performed by rotating the rotating plate 11. A high-precision mold is selected to ensure the consistency of size and smooth surface so that the material can evenly fill the mold without bubbles or voids;

[0053] S3, injection molding: the packaging material is heated to a fluid state, the packaging material is controlled by the operating device 5 to enter the support platform 1 through the transport pipe 6, the packaging material is injected into the mounting seat 25 through the injection head 10, and the lifting rod 13 is repeatedly lifted and lowered under the guidance of the limit head 24, so that the bubbles in the mounting seat 25 can be dissipated during the vibration process, and the chip and the lead are completely wrapped to ensure uniform distribution of the material;

[0054] S4, demoulding and inspection: by pushing the suction cup of the cylinder 29 to absorb the extension plate 27, the mounting seat 25 is separated from the contact table 21, and the appearance and size of the package are checked to ensure that there are no bubbles, cracks or dimensional deviations.

[0055] According to the application scenario, the appropriate packaging material is selected, and the mounting seats 25 of different sizes and the high-precision mold preparation work are carried out on the contact table 21. The packaging material is transported to the injection head 10 through the operating instrument 5 and the transport tube 6, and injected into the mounting seat 25. During the injection molding process, the lifting rod 13 is repeatedly lifted and lowered under the guidance of the limit head 24, so that the bubbles of the packaging material in the mounting seat 25 are dissipated by vibration, ensuring that the material evenly covers the chip and the lead. Finally, the mounting seat 25 and the contact table 21 are separated by the suction cup of the pushing cylinder 29, and the packaged diode is taken out, and its appearance and size are checked to ensure the packaging quality; through the repeated movement of the lifting rod 13, the bubbles in the packaging material are effectively eliminated, ensuring the integrity and uniformity of the packaging. At the same time, the design of the pushing cylinder 29 and the suction cup simplifies the demoulding process, reduces the complexity of manual operation, and improves the level of automation. Through strict inspection steps, it is ensured that the package body is free of bubbles, cracks or dimensional deviations, and the stability and quality of the product are improved. The overall process is efficient and reliable, and can adapt to the diode packaging needs of different scenarios.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging device, comprising a support platform (1), an operating platform (2) is arranged on one side of the support platform (1), a support plate (3) is arranged on the top of the support platform (1), a support frame (4) is arranged on the support plate (3), and a protective plate (7) is arranged between the support frames (4), characterized in that: The operating table (2) is provided with an operating instrument (5), the operating instrument (5) is connected with a transport tube (6), one end of the transport tube (6) is provided with an injection head (10), a driving source is provided in the support plate (3), a rotating plate (11) is provided at the output end of the driving source, and an adjusting component is provided on the rotating plate (11); an auxiliary component is provided on the top of the support plate (3); The adjusting component is used to correct and guide the diode chip placed above it before packaging; The auxiliary component is used to eliminate bubbles when packaging the diode chip.

2. The diode packaging device according to claim 1, characterized in that: The adjustment assembly comprises a plurality of mounting plates (12) arranged on the rotating plate (11); a lifting rod (13) is arranged through the mounting plate (12); a synchronous plate (14) is arranged on the lifting rod (13); a second connecting rod (17) is arranged through the synchronous plate (14); a deflection plate (15) is sleeved on the second connecting rod (17); a first connecting rod (16) is sleeved on one end of the deflection plate (15); an adjustment arm (18) is rotatably arranged on the first connecting rod (16); a rotating rod (19) is arranged through the adjustment arm (18); the adjustment arm (18) rotates relative to the rotating rod (19); and the rotating rod (19) is arranged through the mounting plate (12).

3. The diode packaging device according to claim 2, characterized in that: The auxiliary component comprises a plurality of guide rails (22) fixedly arranged on the support plate (3), the guide rails (22) being interconnected, the height of the guide rails (22) increasing from both sides to the middle, and a plurality of adjustment grooves (23) being arranged on one side of the guide rail (22), the adjustment grooves (23) being arranged in a wave shape.

4. The diode packaging device according to claim 3, characterized in that: A contact platform (21) is arranged on the top of the lifting rod (13), a mounting seat (25) is arranged on the top of the contact platform (21), a mounting groove (26) is provided on the mounting seat (25), the mounting groove (26) is adapted to the contact platform (21), and an extension plate (27) is arranged on one side of the mounting seat (25).

5. The diode packaging device according to claim 4, characterized in that: A limiting head (24) is arranged at the bottom of the lifting rod (13), and a limiting groove is provided in the guide rail (22), and the limiting groove is adapted to the limiting head (24).

6. The diode packaging device according to claim 5, characterized in that: The support plate (3) is provided with a guide rail (8), a movable rail (9) is slidably provided inside the guide rail (8), an injection head (10) is penetrated through the movable rail (9), one end of the injection head (10) is connected to the transport pipe (6), a fixed plate (28) is fixedly provided on the guide rail (8), a pushing cylinder (29) is provided on the fixed plate (28), a suction cup is provided at the output end of the pushing cylinder (29), and the suction cup is in contact with the extension plate (27).

7. The diode packaging device according to claim 6, characterized in that: A collecting trough (30) is provided on one side of the support platform (1), and the collecting trough (30) is provided on one side of the fixing plate (28).

8. The diode packaging device according to claim 2, characterized in that: The inner wall of the adjusting arm (18) is provided with a plurality of groups of deviation-correcting grooves (20).

9. A diode packaging process, applied in a diode packaging device as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Select packaging materials: According to the application scenario of the diode, select suitable packaging materials to ensure that they have good insulation, thermal conductivity and mechanical strength; S2. Mold preparation: Mounting seats (25) of different sizes are placed on the contact table (21) according to requirements, and the rotating plate (11) is rotated to perform the next step; S3, injection molding: the packaging material is heated to a fluid state, and the packaging material is controlled by the operating instrument (5) to enter the support platform (1) through the transport pipe (6), and the packaging material is injected into the mounting seat (25) through the injection head (10), and the lifting rod (13) is repeatedly lifted and lowered under the guidance of the limit head (24), so that the bubbles in the mounting seat (25) can be dissipated during the vibration process, and the chip and the lead are completely wrapped; S4, demoulding and inspection: by pushing the suction cup of the cylinder (29) to absorb the extension plate (27), the mounting seat (25) and the contact table (21) are separated, and the appearance and size of the package are inspected.

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