Immersed liquid cooling equipment

By setting a spoiler device in the body of the liquid cooling box, the fan component disturb the coolant to improve its flow speed, solve the problem of limited heat dissipation capacity of the existing liquid cooling plate on low power consumption devices, and achieve a more efficient heat dissipation effect.

CN119383932APending Publication Date: 2025-01-28JIASHAN FUDAN RESEARCH INSTITUTE
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Patent Information

Application Number
CN202411959172.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-01-28

AI Technical Summary

Technical Problem

The existing liquid-cooled heat dissipation capacity of low-power devices is limited, and due to the low thermal conductivity of thermal grease, the heat dissipation effect of the chip is affected.

Method used

Design an immersion liquid cooling device, including liquid cooling box, circulating cooling device, heating device and spoiler device. The spoiler device disturb the coolant by the fan component, which improves its flow speed, enabling the coolant to quickly circulate and enhance the heat dissipation efficiency of the heating device.

Benefits of technology

By setting a spoiler device in the body in the body, the coolant can absorb and take away the heat more quickly when it is exposed to the heating device, improves the heat dissipation efficiency and effect, and solves the problem of slower coolant rate in the existing liquid cooling system. Essence

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides immersed liquid cooling equipment, which comprises a liquid cooling box body with a hollow interior; the circulating cooling device is connected with the liquid cooling box body through a pipeline assembly and is used for circularly conveying cooling liquid to the liquid cooling box body; the at least one heating device is arranged in the liquid cooling box body; and the turbulent flow device is arranged in the liquid cooling box body corresponding to the heating device, and the turbulent flow device is used for disturbing the cooling liquid, so that the cooling liquid flowing through the heating device can rapidly and circularly flow to accelerate heat dissipation of the heating device. According to the invention, the turbulent flow device is arranged in the liquid cooling box body corresponding to the heating device, and the turbulent flow device disturbs the cooling liquid in the liquid cooling box body, so that the cooling liquid flowing through the heating device can rapidly and circularly flow, namely the cooling liquid rapidly flows out after absorbing heat in the process of contacting with the heating device; the time for the cooling liquid to absorb and take away heat is shortened, and the heat dissipation efficiency and the heat dissipation effect of the heating device are improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to an immersion liquid cooling device. Background Art

[0002] In the prior art, liquid cooling heat sinks usually use water as the heat dissipation medium, which has the best heat absorption performance and is the best heat dissipation medium. Currently, the focus is on the heat dissipation of high-power devices, while low-power devices (such as memory, PSU) still adopt air cooling mode. In addition, plate liquid cooling is indirect liquid cooling. In actual application, it needs to be assembled with the chip by screws, and a layer of thermal conductive silicone grease is required between the liquid cooling heat sink and the chip for heat dissipation; thermal conductive silicone grease is mainly a mixture of silicone oil and insulating filler, and has a low thermal conductivity, usually 3W / mK, which seriously affects the heat dissipation capacity of the chip.

[0003] In view of this, it is necessary to propose an immersion liquid cooling device to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide an immersion liquid cooling device to improve the problem that the existing liquid cooling heat sink has limited heat dissipation capacity for chips.

[0005] The present invention provides an immersion liquid cooling device, comprising: Liquid cooling box, hollow inside; A circulating cooling device, connected to the liquid cooling box through a pipeline assembly and used for circulating cooling liquid to the liquid cooling box; At least one heating device is disposed in the liquid cooling box; A spoiler device is arranged in the liquid cooling box corresponding to the heating device, and the spoiler device is used to disturb the coolant so that the coolant flowing through the heating device can circulate quickly to accelerate the heat dissipation of the heating device.

[0006] The beneficial effect of the immersion liquid cooling equipment provided by the present invention is that: by arranging the spoiler device in the liquid cooling box corresponding to the heat generating device, the spoiler device disturbs the coolant in the liquid cooling box, so that the coolant flowing through the heat generating device can circulate rapidly, that is, the coolant absorbs heat in the process of contacting the heat generating device and then flows out rapidly, thereby shortening the time for the coolant to absorb heat and take away heat, and improving the heat dissipation efficiency and heat dissipation effect of the heat generating device.

[0007] In a possible embodiment, the liquid cooling box has a liquid inlet and a liquid outlet; the spoiler device includes a plurality of fan assemblies arranged in the liquid cooling box corresponding to the heating device, and the fan assembly is arranged closer to the liquid inlet than the heating device.

[0008] The beneficial effect is that after the coolant enters the liquid cooling box from the liquid inlet, it first passes through the fan assembly, and the rotation of the fan assembly disturbs the coolant, accelerates the flow of the coolant, and improves the heat dissipation capacity of the heating device.

[0009] In a possible embodiment, the immersion liquid cooling device also includes a flow equalizing plate arranged in the liquid cooling box corresponding to the heat generating device, and a plurality of flow guide holes arranged at intervals are provided through the flow equalizing plate, and a plurality of the fan assemblies are arranged at intervals on the flow equalizing plate.

[0010] The beneficial effect is that by providing the flow equalizing plate, the coolant can flow evenly in the liquid cooling box.

[0011] In a possible embodiment, a plurality of mounting holes are provided through the flow equalizing plate, and the mounting holes are arranged one-to-one corresponding to the fan assemblies; the spoiler device also includes a sleeve installed in the mounting hole and a support assembly provided in the sleeve, and the fan assembly is supported in the sleeve of the corresponding mounting hole through the support assembly, and a circulation space is formed in the sleeve except for the support assembly and the fan assembly to circulate the coolant.

[0012] Its beneficial effect is that the fan assembly can be supported in the mounting hole through the sleeve and the support assembly, and the coolant can flow through the circulation space. The rotation of the fan assembly can disturb the coolant flowing through the circulation space, thereby driving the accelerated flow of the surrounding coolant and improving the heat dissipation effect.

[0013] In a possible embodiment, the support assembly includes a support tube located in the sleeve and a first support rod supported and connected between the support tube and the sleeve; the fan assembly includes an intermediate cylinder, a plurality of fan blades and a driving member, the plurality of fan blades are arranged on the outer wall of the intermediate cylinder at intervals along the circumferential direction of the intermediate cylinder, the driving member is arranged in the support tube, and the driving member is connected to the intermediate cylinder to drive the intermediate cylinder to rotate.

[0014] Its beneficial effects are: the support tube is supported in the sleeve by the first support rod, a first guide gap is formed between the support tube and the sleeve to circulate the coolant, the fan assembly consisting of an intermediate tube, a plurality of fan blades and a driving member has a simple structure, the driving member of the fan assembly is accommodated in the sleeve, and under the drive of the driving member, the fan blades can rotate to play a turbulent role, thereby accelerating the circulation of the coolant.

[0015] In a possible embodiment, the support assembly further includes a support plate and a second support rod disposed on the support plate, wherein one end of the second support rod away from the support plate is detachably disposed on the sleeve, and the intermediate tube is located between the support plate and the support tube.

[0016] Its beneficial effect lies in that: the support plate is supported in the sleeve by the second support rod, a second guide gap is formed between the support plate and the second support rod to circulate coolant, and the intermediate tube is located between the support plate and the support tube, that is, the support tube and a plurality of the first support rods block one side of the fan assembly, and the support plate and a plurality of the second support rods block the other side of the fan assembly, thereby protecting the fan assembly from both sides of the fan assembly.

[0017] In a possible embodiment, there are several first support rods and the several first support rods are spaced apart along the circumferential direction of the support tube; and / or there are several second support rods and the several second support rods are spaced apart along the circumferential direction of the support plate.

[0018] Its beneficial effect is that a plurality of the first support rods are arranged at intervals along the circumferential direction of the support tube to enhance the stability of the installation of the support tube, and a plurality of the second support rods are arranged at intervals along the circumferential direction of the support plate to enhance the stability of the installation of the support plate, thereby enhancing the stability of the overall structure of the spoiler.

[0019] In a possible embodiment, the fan assembly is arranged toward a side of the heat-generating device, so that the cooling liquid after turbulence can flow along the side of the heat-generating device.

[0020] The beneficial effect is that the cooling liquid after turbulence can flow toward the side of the heating device, ensuring that the cooling liquid after turbulence can fully contact the side of the heating device and exchange heat, thereby improving the heat dissipation effect of the heating device.

[0021] In a possible embodiment, the immersion liquid cooling device also includes a hollow chassis disposed in the liquid cooling box body, the heating device is disposed in the chassis, at least one inlet is provided on a side surface of the chassis close to the spoiler device, and at least one outlet is provided on a side surface of the chassis away from the spoiler device.

[0022] The beneficial effect is that a plurality of the heating devices can be conveniently installed and fixed through the chassis.

[0023] In a possible embodiment, the circulating cooling device includes a cooling box with a hollow interior and a circulating pump and a cooling element arranged in the cooling box, the circulating pump is installed on the pipeline assembly, and the cooling element is used to cool the coolant in the pipeline assembly.

[0024] The beneficial effect is that: under the driving action of the circulating pump, the coolant can flow cyclically between the cooling box and the liquid cooling box, and the coolant is cooled by the cooling element. The cooled coolant can enter the liquid cooling box again to cool and dissipate the heat of the heating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the immersion liquid cooling device of the present invention.

[0026] Figure 2 It is an exploded view of the spoiler and the flow equalizing plate in the immersion liquid cooling device of the present invention.

[0027] Figure 3 It is a schematic diagram of a flow equalizing plate in an immersion liquid cooling device of the present invention in one embodiment.

[0028] Figure 4 It is a schematic diagram of a flow equalizing plate in an immersion liquid cooling device of the present invention in another embodiment.

[0029] Figure 5 It is a schematic diagram of fan assemblies of different sizes in the immersion liquid cooling device of the present invention installed on a flow equalizing plate.

[0030] Figure 6 It is a schematic diagram of a spoiler and a flow equalizing plate in an immersion liquid cooling device of the present invention in one embodiment.

[0031] Figure 7 It is a schematic diagram of a spoiler and a flow equalizing plate in an immersion liquid cooling device of the present invention in another embodiment.

[0032] Figure 8 It is a schematic diagram of a chassis in an immersion liquid cooling device of the present invention in one embodiment.

[0033] Fig. 9 It is a schematic diagram of a chassis in an immersion liquid cooling device of the present invention in another embodiment.

[0034] Explanation of the reference numerals: 100, liquid cooling box; 200, circulating cooling device; 300, heating device; 400, spoiler; 410, fan assembly; 411, intermediate cylinder; 412, fan blades; 413, driving member; 420, circulation space; 430, sleeve; 440, support assembly; 441, support tube; 442, support plate; 443, second support rod; 500, chassis; 510, inlet; 520, outlet; 600, flow equalizing plate; 621, guide hole; 622, mounting hole. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] The liquid cooling heat sink in the prior art belongs to indirect liquid cooling. A layer of thermal conductive silicone grease is required between the liquid cooling heat sink and the chip for heat dissipation. The thermal conductive silicone grease is mainly a mixture of silicone oil and insulating filler, and has a low thermal conductivity. Therefore, the existing liquid cooling heat sink has a limited heat dissipation capacity for the chip.

[0037] In view of the above problems, the embodiments of the present invention provide the following technical solutions to overcome the above problems.

[0038] An embodiment of the present invention provides an immersion liquid cooling device, Figure 1 is a schematic diagram of the immersion liquid cooling device of the present invention, see Figure 1 The immersion liquid cooling device includes: a liquid cooling box 100, a circulating cooling device 200, at least one heating device 300 and a spoiler 400. The liquid cooling box 100 is hollow inside. The circulating cooling device 200 is connected to the liquid cooling box 100 through a pipeline assembly and is used to circulate cooling liquid to the liquid cooling box 100. At least one heating device 300 is arranged in the liquid cooling box 100. The spoiler 400 is arranged in the liquid cooling box 100 corresponding to the heating device 300. The spoiler 400 is used to disturb the cooling liquid so that the cooling liquid flowing through the heating device 300 can circulate quickly to accelerate the heat dissipation of the heating device 300. The heating device 300 can be a chip, a blade server, etc.

[0039] In this embodiment, the coolant is in direct contact with the heating device 300 for heat exchange, and the spoiler 400 is arranged in the liquid cooling box 100 corresponding to the heating device 300. Its main function is to disturb the coolant and increase the flow rate of the coolant in the liquid cooling box 100. The coolant flowing through the heating device 300 can circulate more quickly. In the process of the coolant contacting the heating device 300 and absorbing heat, due to the increase in the flow rate, the coolant can more effectively absorb and take away heat in a shorter time, thereby accelerating the cooling of the heating device 300, solving the problem of slow coolant flow rate in the existing immersion liquid cooling system, and improving the overall heat dissipation efficiency and heat dissipation effect.

[0040] It should be noted that the heating device 300 and the spoiler device 400 can be distributed up and down, left and right, or front and back, as long as the coolant entering from the liquid inlet is first spoiled by the spoiler device 400 and then flows to the heating device 300. The specific distribution relationship between the heating device 300 and the spoiler device 400 can be reasonably arranged according to different actual application scenarios.

[0041] It should be noted that, according to different heating devices 300, fan assemblies 410 with different powers are correspondingly set, and several fan assemblies 410 can work at the same time. Corresponding fan assemblies 410 can also be turned on according to the distribution of the working heating devices 300 to blow the coolant to the heat source area. This not only greatly improves the heat dissipation performance, but also solves the problems of convection and eddy current caused by the slow and uneven flow rate of the coolant in the existing immersion liquid cooling system.

[0042] In one embodiment, Figure 2 This is an exploded view of the flow disturbance device and the flow equalizing plate in the immersion liquid cooling device of the present invention, see Figure 1 and Figure 2The liquid cooling box 100 has a liquid inlet and a liquid outlet. The liquid cooling box is generally made of sheet metal, and the material of the liquid cooling box is mostly stainless steel; the spoiler device 400 includes a plurality of fan assemblies 410 corresponding to the heating device 300 and arranged in the liquid cooling box 100, and the fan assembly 410 is arranged closer to the liquid inlet than the heating device 300. In this embodiment, the liquid inlet and the liquid outlet are used for the input and output of the cooling liquid, respectively, and this cycle repeats itself. The cooling liquid enters the liquid cooling box 100 through the liquid inlet, absorbs the heat of the heating device 300, flows out through the liquid outlet, and then re-enters the box after being cooled by the circulating cooling device 200, and the cycle repeats itself. The fan assembly 410 is arranged close to the liquid inlet, which means that the cooling liquid is quickly disturbed by the fan after entering the box. The flow rate of the coolant is increased by the disturbance of the fan assembly 410, and the coolant quickly passes through the surface of the heating device 300. The accelerated coolant can take away the heat faster, reduce the temperature of the heating device 300, and improve the heat exchange efficiency. In addition, by controlling the speed of the fan, the flow rate of the coolant in different areas of the liquid cooling box 100 can also be controlled, solving the problem of uneven flow rate inside the liquid cooling box 100.

[0043] It should be noted that the liquid inlet and the liquid outlet can be located on the upper and lower sides, left and right sides, or front and back sides of the liquid cooling box 100 respectively. Their specific positional relationship can be flexibly set according to the heating device 300 and the spoiler device 400, and is not limited here.

[0044] In one embodiment, see Figure 1 and Figure 2 The immersion liquid cooling device also includes a flow equalizing plate 600 corresponding to the heating device 300 and arranged in the liquid cooling box 100. The flow equalizing plate 600 is provided with a plurality of flow guide holes 621 arranged at intervals, and a plurality of fan assemblies 410 are arranged at intervals on the flow equalizing plate 600. The flow equalizing plate 600 is usually made of metal (aluminum alloy, steel, etc.). The flow equalizing plate 600 with the flow guide holes 621 can be integrally formed by CNC machining; or sheet metal processing is used, and then holes are opened on the partition. In this embodiment, the flow guide holes 621 on the flow equalizing plate 600 can guide the coolant to flow in a more uniform manner, which helps to reduce the dead zone and eddy current of the coolant during the flow process, and improve the efficiency and effect of heat exchange. By optimizing the flow distribution of the coolant, the flow equalizing plate 600 enables more coolant to contact the heating device 300 more effectively, thereby accelerating the transfer and removal of heat, helping to improve the overall efficiency of the heat dissipation system and reduce the temperature of the heating device 300.

[0045] It should be noted that the specific arrangement of the guide holes 621 and the size, shape and number of the guide holes 621 are not limited herein. Figure 3 FIG. 1 is a schematic diagram of a flow balancing plate in an immersion liquid cooling device of the present invention in an embodiment, see Figure 3 , a plurality of guide holes 621 can be evenly spaced and distributed on the flow equalizing plate 600, Figure 4 FIG. 1 is a schematic diagram of another embodiment of a flow balancing plate in an immersion liquid cooling device of the present invention. Figure 4 , the area corresponding to the high-power consumption heating device 300 on the equalizing plate 600 is provided with a higher density and a larger size of the guide holes 621, so that while achieving the equalizing effect, the high-power consumption area can also be efficiently cooled in cooperation with the fan assembly 410. For example, the larger the power consumption area of ​​the heating device 300, the larger the size of the guide holes 621 in the corresponding area on the equalizing plate 600 and / or the greater the setting density, that is, in the same time, the larger the size of the guide holes 621 on the equalizing plate 600 and / or the greater the setting density, the greater the coolant flow rate in the area, and the more coolant is accelerated by the turbulent flow.

[0046] In a specific embodiment, Figure 5 This is a schematic diagram of fan assemblies of different sizes in the immersion liquid cooling device of the present invention installed on the flow equalizing plate, see Figure 2 and Figure 5 , a plurality of mounting holes 622 are provided through the equalizing plate 600, and the mounting holes 622 are arranged one by one corresponding to the fan assembly 410; the spoiler device 400 also includes a sleeve 430 installed in the mounting hole 622, and a support assembly 440 arranged in the sleeve 430, and the fan assembly 410 is supported in the sleeve 430 of the corresponding mounting hole 622 through the support assembly 440, and a circulation space 420 is formed in the sleeve 430 in addition to the support assembly 440 and the fan assembly 410, so as to circulate the coolant. The materials of the sleeve 430, the support assembly 440, and the fan assembly 410 can be plastic, metal (copper, aluminum alloy) and other materials. Plastic is selected because it has the advantages of low cost, strong stability, and light weight. In this embodiment, the sleeve 430 serves as a connecting bridge between the fan assembly 410 and the equalizing plate 600, which not only provides a mounting position, but also creates conditions for the circulation of the coolant through its internal structure design. In addition to the support assembly 440 and the fan assembly 410, a circulation space 420 is formed in the sleeve 430. The design of the circulation space 420 allows the coolant to flow freely around the fan assembly 410, thereby improving the circulation efficiency of the coolant. The arrangement of the support assembly 440 ensures that the fan assembly 410 is stably supported in the mounting hole 622. This stable support structure not only prevents the fan assembly 410 from shaking or falling off during operation, but also improves the structural stability of the entire device.

[0047] In this embodiment, the spoiler 400 is located below the heating device 300, and the fan assembly 410 of the spoiler 400 is installed on the equalizing plate 600 below the heating device 300. With the equalizing plate 600 and the chassis 500 with uniquely designed openings, the flow of the coolant can be accelerated, and more heat can be taken away in the same time, which greatly improves the heat dissipation capacity. During operation, only part of the fan assembly 410 can be turned on. For example, only the fan assembly 410 below the maximum power device is turned on. The flow rate at the maximum power device is the largest and the heat dissipation capacity is the strongest. The power of the remaining heating devices 300 is small, and the heat dissipation requirements can be met without turning on the fan assembly 410. Therefore, the use of the spoiler 400 can meet the heat dissipation requirements in complex application scenarios.

[0048] It should be noted that the size and number of the fan assembly 410 are key factors affecting the flow rate of the coolant. In order to more reasonably utilize resources and achieve heat dissipation effects, the fan assembly 410 can be installed below the heat generating components according to their power density. Figure 5 The larger the power consumption of the heat-generating device 300 is, the larger the size of the fan assembly 410 in the corresponding area on the current equalizing plate 600 is and / or the greater the setting density is. For example, a larger fan can be used in an area with higher power consumption, and a small fan can be installed in an area with lower power consumption. Even the cooling effect can be achieved without installing a fan, thereby realizing the rational use of resources.

[0049] In one embodiment, see Figure 2 and Figure 5 The support assembly 440 includes a support tube 441 located in the sleeve 430, and a first support rod (not shown in the figure) supported and connected between the support tube 441 and the sleeve 430. The fan assembly 410 includes an intermediate cylinder 411, a plurality of blades 412, and a driving member 413. The plurality of blades 412 are arranged on the outer wall of the intermediate cylinder 411 at intervals along the circumferential direction of the intermediate cylinder 411. The driving member 413 is arranged in the support tube 441, and the driving member 413 is connected to the intermediate cylinder 411 to drive the intermediate cylinder 411 to rotate. A first guide gap is formed between the support tube 441 and the sleeve 430 to circulate the coolant.

[0050] In this embodiment, the driving member 413 drives the intermediate cylinder 411 to rotate, so that the fan blades 412 on the intermediate cylinder 411 rotate, accelerating the flow of the coolant and achieving the purpose of accelerating the cooling. The driving member 413 can be a motor or a rotary cylinder, etc. Using a DC motor, different speeds can be achieved by adjusting the power; the motor uses a DC motor, which has the advantages of being more power-saving, consuming only one-third of the power of an AC motor, and having a wider adjustable speed range, which can cope with more complex heat dissipation requirements.

[0051] In a specific embodiment, see Figure 2 and Figure 5 The support assembly 440 further includes a support plate 442 and a second support rod 443 disposed on the support plate 442. One end of the second support rod 443 away from the support plate 442 is detachably disposed on the sleeve 430. The intermediate tube 411 is located between the support plate 442 and the support tube 441. A second guide gap is formed between the support plate 442 and the second support rod 443 to allow the coolant to flow.

[0052] In this embodiment, a first guide gap and a second guide gap are formed between the support tube 441 and the sleeve 430, and between the support plate 442 and the second support rod 443, respectively. These gaps provide an effective flow path for the coolant, ensuring that the coolant flows smoothly from the mounting hole 622. The intermediate tube 411 is located between the support plate 442 and the support tube 441. The support tube 441 and a plurality of first support rods block one side of the fan assembly 410 to form a first protective frame; the support plate 442 and a plurality of second support rods 443 block the other side of the fan assembly 410 to form a second protective frame, and the fan assembly 410 is protected by the first protective frame and the second protective frame. In the process of the fan blade 412 rotating to accelerate the flow of the coolant, a strong suction force will be generated. The first protective frame and the second protective frame can prevent accidental damage to the fan and the heating device 300. At the same time, it also plays a role in facilitating the installation and fixing of the fan and the driving member 413. The fan blade 412 and the motor can be installed on the flow equalizing plate 600 more conveniently and quickly through the first protective frame and the second protective frame.

[0053] In some specific embodiments, see Figure 2 and Figure 5 The sleeve 430 can be installed in the mounting hole 622 by fasteners, buckles or other methods. The end of the second support rod 443 away from the support plate 442 can be arranged on the sleeve 430 by fasteners, buckles or other detachable methods.

[0054] In some specific embodiments, see Figure 2 and Figure 5 There are several first support rods and the several first support rods are arranged at intervals along the circumferential direction of the support tube 441; and / or there are several second support rods 443 and the several second support rods 443 are arranged at intervals along the circumferential direction of the support plate 442.

[0055] In this embodiment, the first support rods arranged at intervals can reduce the interference with the flow of the coolant, so that the spoiler 400 can play its role more effectively. When the first support rods are arranged in an interval manner along the circumferential direction of the support tube 441, these first support rods work together to form a more balanced and stable support system. This layout can effectively disperse and resist the lateral force from the flow of the coolant. Similar to the first support rods, the interval arrangement of the second support rods 443 along the circumference of the support plate 442 also enhances the stability of the support plate 442. This layout enables the support plate 442 to better resist the vibration and deformation caused by the flow of the coolant. The second support rods 443 arranged at intervals make the force on the support plate 442 more uniform, avoiding structural damage caused by stress concentration. By dispersing stress, the load borne by a single first support rod and a second support rod 443 can also be reduced, thereby extending the service life of the entire support assembly 440. Through a plurality of first support rods and a plurality of second support rods 443, the overall rigidity of the entire spoiler 400 can also be improved.

[0056] In one embodiment, the fan assembly 410 is disposed toward the side of the heating device 300 so that the turbulent coolant can flow through the side of the heating device 300. The angle between the plane where the fan is located and the center line of the heat source device is in the range of 45°-90°, and the plane where the fan is located can be understood as a plane perpendicular to the center line of the fan assembly 410. Figure 6 FIG. 1 is a schematic diagram of a flow disturbance device and a flow equalizing plate in an immersion liquid cooling device of the present invention in an embodiment, as shown in FIG. Figure 6 As shown, the angle between the plane where the fan is located and the center line of the heat source device is 90°. Figure 7 FIG. 1 is a schematic diagram of a flow disturbance device and a flow equalizing plate in an immersion liquid cooling device of the present invention in another embodiment. Figure 7 As shown, the angle between the plane where the fan is located and the center line of the heat source device is 45°.

[0057] In this embodiment, by reasonably setting the installation angle of the fan assembly 410, on the one hand, it helps the coolant to circulate faster after absorbing heat on the surface of the heating element; on the other hand, it can also reduce the impact of the high-speed flowing coolant on the heating element, thereby preventing the heating element from being damaged by external impact.

[0058] In one embodiment, Figure 8 is a schematic diagram of a chassis in an immersion liquid cooling device of the present invention in one embodiment, Fig. 9 FIG. 1 is a schematic diagram of a chassis in an immersion liquid cooling device of the present invention in another embodiment, see Figure 8 and Fig. 9The immersion liquid cooling device also includes a hollow chassis 500 disposed in the liquid cooling box 100, the heating device 300 is disposed in the chassis 500, and at least one inlet 510 is provided on one side of the chassis 500 close to the spoiler 400, and at least one outlet 520 is provided on one side of the chassis 500 away from the spoiler 400. The chassis 500 is generally customized according to the size and shape of the heating device 300 such as a blade server, and the chassis 500 with the inlet 510 and the outlet 520 can be integrally formed by CNC machining; or a hole is first opened on the metal plate, and then welded together using sheet metal, and the material is usually selected from metal materials (stainless steel, aluminum alloy, etc.) and plastic. The heating device 300 is installed in the chassis 500 by fasteners, snaps or other methods.

[0059] It should be noted that the location and arrangement of the inlet 510 and the outlet 520 and the size and shape of the guide hole 621 are not limited here, and can be flexibly designed according to the size, power consumption, and installation location of the heating device 300, and the spoiler device 400 can be used to deliver coolant of different flow rates to the surface of the heating device 300 more quickly, and the coolant can enter the circulating cooling device 200 more quickly after absorbing heat, greatly improving the heat dissipation efficiency. Figure 8 As shown, the inlet 510 and the outlet 520 are in the shape of long strips and the inlet 510 and the outlet 520 are arranged in parallel in multiple numbers, such as Fig. 9 As shown, the inlet port 510 and the outlet port 520 are square in shape and have various sizes.

[0060] In one embodiment, the circulating cooling device 200 includes a cooling box with a hollow interior, a circulating pump and a cooling element arranged in the cooling box, the circulating pump is installed on the pipeline assembly, and the cooling element is used to cool the coolant in the pipeline assembly. The coolant circulates continuously under the action of the circulating pump, can continuously absorb heat from the heating device 300, and cool it down through the cooling element. The cooling element includes at least one of a cooling fan, a compressor, and a condenser. The cooling box is fixedly connected to the liquid cooling box 100, for example, welded as one.

[0061] In a specific embodiment, the circulating cooling device 200 includes a flow sensor and a pressure sensor installed on the pipeline assembly, the flow sensor is used to monitor the flow of the coolant, and the pressure sensor is used to detect the pressure value of the coolant. The cooling element cools down the coolant after absorbing heat, and the pressure sensor and the flow sensor monitor the circulation of the coolant in real time to ensure the efficient operation of the heat dissipation system.

[0062] In a specific embodiment, there are several liquid inlets and several liquid outlets, and the pipeline assembly includes multiple pipes, and both ends of each pipe are respectively connected to the corresponding liquid inlet and the corresponding liquid outlet.

[0063] The specific implementation steps of the immersion liquid cooling device of the present invention include: 1) First, complete the separate procurement and processing of parts, including the spoiler 400, the chassis 500, the liquid cooling box 100, and the circulating cooling device 200; the spoiler 400 includes an inlet and outlet sleeve 430, a support assembly 440, a fan assembly 410 and a flow equalizer 600; the circulating cooling device 200 includes a circulating pump, a cooling part, a flow sensor, a pressure sensor, etc.; the motor can be purchased from a common DC motor on the market; the sleeve 430, the support assembly 440, and the fan assembly 410 are made of plastic and are processed by injection molding; the flow equalizer 600 is made of metal and is machined; the chassis 500, the liquid cooling box and the cooling box are all made of stainless steel and are processed by CNC or sheet metal processing.

[0064] 2) Assemble the sleeve 430, the support assembly 440, and the fan assembly 410, connect the motor to the middle cylinder 411 of the fan assembly 410 by a robot arm or manually, use the clamps and glue to fix the motor and the fan blades 412, and lead the power cord of the motor through the reserved first wire hole 4411 or the second wire hole.

[0065] 3) Use screws to install the sleeve 430 on the flow equalizer 600, and the flow equalizer 600 is installed in the liquid cooling box 100 by screws. The flow equalizer 600 is usually made of metal materials such as stainless steel 304 or aluminum alloy. The fan assembly 410 accelerates the flow of coolant and quickly takes away the heat of the heating device 300, greatly improving the heat dissipation performance.

[0066] 4) The chassis 500 is fixed in the liquid cooling box using screws. An inlet 510, an outlet 520 and screw holes are reserved in the chassis 500. The screw holes and screws are used to install heating elements such as blade servers.

[0067] 5) The circulating pump, cooling fan, condenser and other components in the circulating cooling device 200 are welded in the cooling box, and the flow sensor and the pressure sensor are fixed to the pipeline assembly using a threaded adapter. In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0068] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0070] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the connection between the internal parts of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by those with ordinary skills in the field to which the present invention belongs.

Claims

1. An immersion liquid cooling device, characterized in that: include: Liquid cooling box, hollow inside; A circulating cooling device, connected to the liquid cooling box through a pipeline assembly and used for circulating cooling liquid to the liquid cooling box; At least one heating device is disposed in the liquid cooling box; A spoiler device is arranged in the liquid cooling box corresponding to the heating device, and the spoiler device is used to disturb the coolant so that the coolant flowing through the heating device can circulate quickly to accelerate the heat dissipation of the heating device.

2. The immersion liquid cooling device according to claim 1, characterized in that: The liquid cooling box has a liquid inlet and a liquid outlet; The spoiler device includes a plurality of fan assemblies arranged in the liquid cooling box corresponding to the heating device, and the fan assemblies are arranged closer to the liquid inlet than the heating device.

3. The immersion liquid cooling device according to claim 2, characterized in that: It also includes a flow equalizing plate arranged in the liquid cooling box corresponding to the heating device, and a plurality of flow guide holes arranged at intervals are arranged through the flow equalizing plate, and a plurality of the fan assemblies are arranged at intervals on the flow equalizing plate.

4. The immersion liquid cooling device according to claim 3, characterized in that: The flow equalizing plate is provided with a plurality of mounting holes, and the mounting holes are arranged in a one-to-one correspondence with the fan assemblies; The spoiler device also includes a sleeve installed in the mounting hole and a support assembly arranged in the sleeve. The fan assembly is supported in the sleeve of the corresponding mounting hole through the support assembly. In addition to the support assembly and the fan assembly, a circulation space is formed in the sleeve to circulate the coolant.

5. The immersion liquid cooling device according to claim 4, characterized in that: The support assembly includes a support tube located in the sleeve, and a first support rod supported and connected between the support tube and the sleeve; The fan assembly includes an intermediate cylinder, a plurality of fan blades and a driving member, wherein the plurality of fan blades are arranged on the outer wall of the intermediate cylinder at intervals along the circumferential direction of the intermediate cylinder, and the driving member is arranged in the support tube, and the driving member is connected to the intermediate cylinder to drive the intermediate cylinder to rotate.

6. The immersion liquid cooling device according to claim 5, characterized in that: The support assembly also includes a support plate and a second support rod arranged on the support plate, one end of the second support rod away from the support plate is detachably arranged on the sleeve, and the intermediate tube is located between the support plate and the support tube.

7. The immersion liquid cooling device according to claim 6, characterized in that: There are a plurality of first support rods, and the plurality of first support rods are arranged at intervals along the circumferential direction of the support tube; and / or there are a plurality of second support rods, and the plurality of second support rods are arranged at intervals along the circumferential direction of the support plate.

8. The immersion liquid cooling device according to claim 2, characterized in that: The fan assembly is arranged toward the side of the heating device so that the cooling liquid after turbulence can flow toward the side of the heating device.

9. The immersion liquid cooling device according to any one of claims 1 to 8, characterized in that: It also includes a hollow chassis disposed in the liquid cooling box body, the heating device is disposed in the chassis, at least one inlet is disposed on a side surface of the chassis close to the spoiler device, and at least one outlet is disposed on a side surface of the chassis away from the spoiler device.

10. The immersion liquid cooling device according to any one of claims 1 to 8, characterized in that: The circulating cooling device comprises a cooling box body with a hollow interior, and a circulating pump and a cooling element arranged in the cooling box body. The circulating pump is installed on the pipeline assembly, and the cooling element is used to cool the coolant in the pipeline assembly.

Citation Information

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